JP2010174096A - Anisotropic conductive adhesive - Google Patents
Anisotropic conductive adhesive Download PDFInfo
- Publication number
- JP2010174096A JP2010174096A JP2009016722A JP2009016722A JP2010174096A JP 2010174096 A JP2010174096 A JP 2010174096A JP 2009016722 A JP2009016722 A JP 2009016722A JP 2009016722 A JP2009016722 A JP 2009016722A JP 2010174096 A JP2010174096 A JP 2010174096A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- gold
- anisotropic conductive
- conductive adhesive
- nickel particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
本発明は、異方性導電接着剤に関する。 The present invention relates to an anisotropic conductive adhesive.
近年、半導体素子などの電子部品を電気的に接続する接着剤として、導電接着剤が広く用いられている。導電接着剤は、樹脂を含む絶縁性の接着剤組成物中に導電粒子を分散させた材料であり、主に電子部品の相対する電極間の電気的接続、および固定（接着）等の目的に使用される。
導電性接着剤は、従来のはんだと同様の接合性質を有する等方性導電接着剤と、接続方向が一方向のみに導通する異方性導電接着剤とに大別される。特に、異方性導電接着剤は、相対する電極間を電気的に接続したり、接着したりすると共に、隣接する電極間を絶縁することも可能であり、近年の電子部品の高集積化や高密度化に対応できる接着剤として好適に使用されている。
In recent years, conductive adhesives have been widely used as adhesives for electrically connecting electronic components such as semiconductor elements. A conductive adhesive is a material in which conductive particles are dispersed in an insulating adhesive composition containing a resin, mainly for the purpose of electrical connection and fixing (adhesion) between opposing electrodes of an electronic component. used.
Conductive adhesives are broadly classified into isotropic conductive adhesives having joint properties similar to those of conventional solders and anisotropic conductive adhesives that are connected in only one direction. In particular, the anisotropic conductive adhesive can electrically connect and bond the opposing electrodes, and can also insulate adjacent electrodes. It is suitably used as an adhesive that can cope with higher density.
異方性導電接着剤を構成する導電粒子としては、通常、ニッケル粒子、金粒子、半田粒子等の金属粒子、金などの金属でメッキされた樹脂粒子（例えば金メッキ樹脂粒子）、金メッキ樹脂粒子の表面を絶縁被覆した粒子などが用いられる（例えば特許文献１、２参照。）。 As the conductive particles constituting the anisotropic conductive adhesive, metal particles such as nickel particles, gold particles and solder particles, resin particles plated with a metal such as gold (for example, gold-plated resin particles), gold-plated resin particles, etc. Particles having an insulating coating on the surface are used (see, for example, Patent Documents 1 and 2).
しかしながら、ニッケル粒子を用いた異方性導電接着剤は、高温高湿環境下における導通信頼性に劣り、安定した導通性が得られにくかった。
また、金粒子や半田粒子は、導通性に優れるものの柔らかい金属であるため圧力によって容易に変形しやすく、かつ一旦変形すると復元しにくい金属粒子である。そのため、金粒子や半田粒子を用いた異方性導電接着剤は、熱圧着で圧力を解放したときに膜厚がわずかに戻る現象が起きると、初期抵抗値が高くなりやすい。そのため、たとえ初期抵抗を低く設定できたとしても、長期の使用により接着部分が膨張収縮を繰り返して変形した場合、その変形に追随できず導通信頼性が低下しやすかった。
However, the anisotropic conductive adhesive using nickel particles is inferior in conduction reliability in a high-temperature and high-humidity environment, and it is difficult to obtain stable conduction.
In addition, gold particles and solder particles are metal particles that are excellent in electrical conductivity but are easily deformed by pressure, and are difficult to restore once deformed. Therefore, an anisotropic conductive adhesive using gold particles or solder particles tends to have a high initial resistance value when a phenomenon occurs in which the film thickness slightly returns when the pressure is released by thermocompression bonding. For this reason, even if the initial resistance can be set low, when the bonded portion repeatedly expands and contracts due to long-term use, the deformation cannot follow the deformation and the conduction reliability tends to be lowered.
一方、金メッキ樹脂粒子や金メッキ樹脂粒子の表面を絶縁被覆した粒子は、弾力性があり復元力を有するものの、金属粒子と同程度の導通抵抗を得るためには接着剤組成物への添加量を増やす必要がありコストが増大しやすかった。また、圧力を加えた場合、金メッキ樹脂粒子や金メッキ樹脂粒子の表面を絶縁被覆した粒子は割れることがあった。 On the other hand, the gold-plated resin particles and the particles coated with the surface of the gold-plated resin particles are elastic and have resilience, but in order to obtain the same conduction resistance as the metal particles, the amount added to the adhesive composition is It was necessary to increase, and the cost was easy to increase. In addition, when pressure is applied, the gold-plated resin particles and the particles with the insulating coating on the surface of the gold-plated resin particles may break.
本発明は上記事情を鑑みてなされたもので、製造コストを抑えつつ、高温高湿環境下においても長期にわたり安定した導通性を発現できる異方性導電接着剤の実現を目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to realize an anisotropic conductive adhesive that can exhibit stable conductivity over a long period of time even in a high-temperature and high-humidity environment while suppressing manufacturing costs.
本発明の異方性導電接着剤は、絶縁性接着剤組成物中に、導電粒子が分散した異方性導電接着剤であって、前記導電粒子は、平均粒子径が３〜１５μｍ、見掛け密度が０．３〜３．０ｇ／ｃｍ３であるニッケル粒子と、該ニッケル粒子より平均粒子径が小さい金粒子とからなり、かつ、当該異方性導電接着剤１００質量％中、１〜２０質量％含まれることを特徴とする。
ここで、前記金粒子は、前記導電粒子１００質量％中、５〜３０質量％含まれることが好ましい。
また、前記ニッケル粒子は、金メッキが施されている金メッキニッケル粒子であることが好ましい。
さらに、前記金メッキニッケル粒子の金の被覆量が、当該金メッキニッケル粒子１００質量％中、３０質量％以下であることが好ましい。
The anisotropic conductive adhesive of the present invention is an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive composition, and the conductive particles have an average particle diameter of 3 to 15 μm and an apparent density. Consisting of nickel particles having an average particle size of 0.3 to 3.0 g / cm 3 and gold particles having an average particle size smaller than that of the nickel particles, and 1 to 20 mass in 100 mass% of the anisotropic conductive adhesive. % Is included.
Here, it is preferable that 5-30 mass% of the gold particles are contained in 100 mass% of the conductive particles.
The nickel particles are preferably gold-plated nickel particles that are gold-plated.
Furthermore, the gold coating amount of the gold-plated nickel particles is preferably 30% by mass or less in 100% by mass of the gold-plated nickel particles.
本発明によれば、製造コストを抑えつつ、高温高湿環境下においても長期にわたり安定した導通性を発現できる異方性導電接着剤が得られる。 ADVANTAGE OF THE INVENTION According to this invention, the anisotropic conductive adhesive which can express the stable electroconductivity over a long period of time also in a high temperature, high humidity environment is obtained, suppressing manufacturing cost.
以下、本発明について詳細に説明する。
本発明の異方性導電接着剤は、絶縁性接着剤組成物中に、導電粒子が分散してなる。
なお、本発明において「導電」とは、異方性導電接着剤を介して表面抵抗が５Ω／□のＩＴＯコートガラス表面と銅回路とを接合部が幅１５０μｍ×長さ２ｍｍとなるように接合させたときの接続抵抗が１０Ω以下となるものをいう。
Hereinafter, the present invention will be described in detail.
The anisotropic conductive adhesive of the present invention is obtained by dispersing conductive particles in an insulating adhesive composition.
In the present invention, “conductive” means that the surface of an ITO coated glass having a surface resistance of 5Ω / □ and a copper circuit are bonded via an anisotropic conductive adhesive so that the bonding portion is 150 μm wide × 2 mm long. The connection resistance when it is made to be 10Ω or less.
＜導電粒子＞
本発明に用いる導電粒子は、特定のニッケル粒子と金粒子とからなり、異方性導電接着剤１００質量％中、１〜２０質量％含まれている。導電粒子の含有量が１質量％以上であれば十分な導電性が得られる。一方、導電粒子の含有量が２０質量％以下であれば、本発明の異方性導電接着剤を用いて例えば電子素子と電極とを接合したときに、隣接する電極同士が導通して短絡するのを抑制できる。導電粒子の含有量は、１〜１０質量％が好ましい。なお、導電粒子の含有量は、硬化した異方性導電接着剤（すなわち固形分換算した異方性導電接着剤）１００質量％中の値である。
<Conductive particles>
The conductive particles used in the present invention are composed of specific nickel particles and gold particles, and are contained in 1 to 20% by mass in 100% by mass of the anisotropic conductive adhesive. If the content of the conductive particles is 1% by mass or more, sufficient conductivity can be obtained. On the other hand, if the content of the conductive particles is 20% by mass or less, for example, when an electronic element and an electrode are bonded using the anisotropic conductive adhesive of the present invention, adjacent electrodes are electrically connected to each other and short-circuited. Can be suppressed. The content of the conductive particles is preferably 1 to 10% by mass. The content of the conductive particles is a value in 100% by mass of the cured anisotropic conductive adhesive (that is, the anisotropic conductive adhesive converted to solid content).
（ニッケル粒子）
ニッケル粒子としては、平均粒子径が３〜１５μｍ、見掛け密度が０．３〜３．０ｇ／ｃｍ３であるニッケル粒子を用いる。
平均粒子径が３μｍ以上であれば、異方性導電接着剤が硬化したときの膜厚を十分に確保できるので、安定した剥離強度の発現が可能となる。一方、ニッケル粒子に含まれる粗大粒子が十分に潰れないと、導通性が不十分になることがあるが、平均粒子径が１５μｍ以下であれば、ニッケル粒子を通常の圧着条件で潰した場合でも粒子径が揃いやすく、安定した導電性の発現が可能となる。
ここで、ニッケル粒子および後述する金粒子の平均粒子径とは、レーザー光散乱法により実測される累積粒度分布の５０％粒子径のことである。
(Nickel particles)
As the nickel particles, nickel particles having an average particle diameter of 3 to 15 μm and an apparent density of 0.3 to 3.0 g / cm 3 are used.
If the average particle diameter is 3 μm or more, a sufficient film thickness can be secured when the anisotropic conductive adhesive is cured, so that stable peel strength can be expressed. On the other hand, if the coarse particles contained in the nickel particles are not sufficiently crushed, the conductivity may be insufficient, but if the average particle diameter is 15 μm or less, even if the nickel particles are crushed under normal pressure bonding conditions The particle diameters are easily uniform and stable conductivity can be expressed.
Here, the average particle diameter of nickel particles and gold particles described later is a 50% particle diameter of a cumulative particle size distribution measured by a laser light scattering method.
ニッケル粒子は、表面が凹凸状で粒子内部に適度な空隙を有するものが好ましい。通常、ニッケル粒子は硬く、球状であるため電子素子や電極との接触点（接触面積）が小さく、接触抵抗が高くなる傾向にある。しかし、内部に多くの空隙を有するニッケル粒子は、通常のニッケル粒子に比べて外部からの圧力によって押し潰されて変形しやすい。従って、内部に多くの空隙を有するニッケル粒子を導電粒子として含有する異方性導電接着剤を用い、圧力を加えて電子素子と電極とを接合したときに、ニッケル粒子が押し潰されて変形することで電子素子や電極との接触面積が増える。その結果、異方性導電接着剤の導通性が向上する。 The nickel particles preferably have an uneven surface and have appropriate voids inside the particles. Usually, since nickel particles are hard and spherical, the contact point (contact area) with an electronic element or an electrode tends to be small, and the contact resistance tends to be high. However, nickel particles having many voids inside are easily crushed and deformed by pressure from the outside as compared with normal nickel particles. Therefore, when an anisotropic conductive adhesive containing nickel particles having a large number of voids as conductive particles is used and pressure is applied to join the electronic element and the electrode, the nickel particles are crushed and deformed. This increases the contact area with the electronic elements and electrodes. As a result, the conductivity of the anisotropic conductive adhesive is improved.
表面が凹凸状で粒子内部に適度な空隙を有するニッケル粒子として、本発明においては見掛け密度が０．３〜３．０ｇ／ｃｍ３であるニッケル粒子を用いる。
見掛け密度が０．３ｇ／ｃｍ３以上であれば、適度な空隙を有すると共に、適度な硬さをも備えるので、外部から圧力が加わっても割れにくい。一方、見掛け密度が３．０ｇ／ｃｍ３以下であれば十分な空隙を有するので、圧力が加わったときに変形しやすくなり、異方性導電接着剤の導通性を向上できる。ニッケル粒子の見掛け密度は１．５〜２．７ｇ／ｃｍ３が好ましい。
ここで、ニッケル粒子の見掛け密度とは、ニッケル粒子の質量を、空隙を含む体積で割った値のことであり、粒子内部に存在する空隙の割合を示す指標となる。なお、粒子内部に空隙を有するほど粒子表面は凹凸状になる傾向にある。
In the present invention, nickel particles having an apparent density of 0.3 to 3.0 g / cm 3 are used as nickel particles having an uneven surface and having appropriate voids inside the particles.
If the apparent density is 0.3 g / cm 3 or more, it has appropriate voids and appropriate hardness, so that it is difficult to crack even when pressure is applied from the outside. On the other hand, if the apparent density is 3.0 g / cm 3 or less, it has sufficient voids, so that it is easily deformed when pressure is applied, and the conductivity of the anisotropic conductive adhesive can be improved. The apparent density of the nickel particles is preferably 1.5 to 2.7 g / cm 3 .
Here, the apparent density of the nickel particles is a value obtained by dividing the mass of the nickel particles by the volume including the voids, and is an index indicating the ratio of the voids present inside the particles. Note that the particle surface tends to be uneven as the voids are present inside the particle.
このようなニッケル粒子としては、例えば日興リカ社製の「Ｔｙｐｅ１２３」などが好適である。 As such nickel particles, for example, “Type 123” manufactured by Nikko Rica is suitable.
ニッケル粒子としては、金メッキが施されている金メッキニッケル粒子を用いることが好ましい。
ニッケル粒子は、腐食しにくい金属であるものの、高温高湿環境下において抵抗変化率が大きくなる傾向にあるため、ニッケル粒子のみを用いた異方性導電接着剤は導通信頼性に劣り、安定した導通性が得られにくかった。
そこで、本発明においては導電粒子としてニッケル粒子と後述する金粒子を併用することで、高温高湿環境下での異方性導電接着剤の導通性を向上させるが、ニッケル粒子として導通性に優れた金でニッケル粒子をメッキした金メッキニッケル粒子を用いれば、高温高湿環境下での異方性導電接着剤の導通性をより向上させることができる。
As the nickel particles, it is preferable to use gold-plated nickel particles that have been plated with gold.
Although nickel particles are a metal that does not corrode easily, the resistance change rate tends to increase in a high-temperature and high-humidity environment, so anisotropic conductive adhesives using only nickel particles have poor conduction reliability and are stable. It was difficult to obtain conductivity.
Therefore, in the present invention, by using nickel particles and gold particles described later as the conductive particles, the conductivity of the anisotropic conductive adhesive in a high temperature and high humidity environment is improved, but the nickel particles are excellent in conductivity. By using gold-plated nickel particles obtained by plating nickel particles with gold, the conductivity of the anisotropic conductive adhesive in a high-temperature and high-humidity environment can be further improved.
金メッキニッケル粒子は、金の被覆量が金メッキニッケル粒子１００質量％中、３０質量％以下であることが好ましく、より好ましくは５〜２０質量％である。金の被覆量が３０質量％以下であれば、製造コストを抑えつつ、異方性導電接着剤の導通性を向上できる。 The gold-plated nickel particles preferably have a gold coating amount of 30% by mass or less and more preferably 5 to 20% by mass in 100% by mass of the gold-plated nickel particles. When the gold coating amount is 30% by mass or less, the conductivity of the anisotropic conductive adhesive can be improved while suppressing the manufacturing cost.
ニッケル粒子に金メッキを施す方法としては特に制限されないが、電気メッキ法、無電解メッキ法、物理的蒸着法（真空蒸着法、イオンプレーディング法、イオンスパッタリング法等）などが挙げられる。
また、金メッキニッケル粒子としては、例えば福田金属箔粉工業社製の「ＧＮＰ−１０」などが好適である。
The method for applying gold plating to the nickel particles is not particularly limited, and examples thereof include an electroplating method, an electroless plating method, and a physical vapor deposition method (vacuum vapor deposition method, ion plating method, ion sputtering method, etc.).
Further, as the gold-plated nickel particles, for example, “GNP-10” manufactured by Fukuda Metal Foil Powder Industry Co., Ltd. is suitable.
（金粒子）
金粒子は、上述したように柔らかい金属であるため圧力によって容易に変形しやすく、一旦変形すると復元しにくい。そのため、長期の使用により電子部品が変形した場合、その変形に追随できず異方性導電接着剤の導通信頼性が低下しやすかった。
しかし、金粒子を見掛け密度が０．３〜３．０ｇ／ｃｍ３であるニッケル粒子と併用することで、金粒子は表面が凹凸状のニッケル粒子の凹部に侵入する。従って、圧力によって金粒子が変形しても凹部内にて金粒子とニッケル粒子とが接触し続けるので、金粒子の復元力の低さをニッケル粒子で補うことができ、異方性導電接着剤は長期にわたり安定した導通性を発現できる。
(Gold particles)
Since gold particles are soft metal as described above, they are easily deformed by pressure, and are difficult to restore once deformed. Therefore, when an electronic component is deformed due to long-term use, the deformation cannot be followed and the conduction reliability of the anisotropic conductive adhesive is likely to be lowered.
However, when used in combination with nickel particles having an apparent density of 0.3 to 3.0 g / cm 3 , the gold particles penetrate into the concave portions of the nickel particles having an uneven surface. Therefore, even if the gold particles are deformed by the pressure, the gold particles and the nickel particles keep in contact with each other in the recess, so that the low restoring force of the gold particles can be compensated by the nickel particles, and the anisotropic conductive adhesive Can exhibit stable conductivity over a long period of time.
また、ニッケル粒子の凹部に金粒子が侵入することで、ニッケル粒子の電子素子や電極に対する接触面積を十分に確保でき、異方性導電接着剤の導通性を良好に維持できる。特に、高温高湿環境下において異方性導電接着剤を使用する場合であっても、導通性に優れる金粒子と併用することで、異方性導電接着剤の導通性を向上させることができる。 Further, the gold particles intrude into the concave portions of the nickel particles, so that a sufficient contact area of the nickel particles with respect to the electronic elements and electrodes can be secured, and the conductivity of the anisotropic conductive adhesive can be maintained well. In particular, even when an anisotropic conductive adhesive is used in a high-temperature and high-humidity environment, the conductivity of the anisotropic conductive adhesive can be improved by using it together with gold particles having excellent conductivity. .
金粒子としては、ニッケル粒子より平均粒子径が小さい金粒子を用いる。金粒子の平均粒子径がニッケル粒子の平均粒子径よりも大きくなると、金粒子に圧力が加わりやすくなり、容易に変形し、かつ復元しにくくなる。その結果、ニッケル粒子との併用では金粒子の復元力の低さを補うことが困難となり、異方性導電接着剤の導通安定性が低下する。 As the gold particles, gold particles having an average particle size smaller than that of the nickel particles are used. When the average particle size of the gold particles is larger than the average particle size of the nickel particles, pressure is easily applied to the gold particles, and the gold particles are easily deformed and difficult to restore. As a result, in combination with nickel particles, it becomes difficult to compensate for the low restoring force of the gold particles, and the conduction stability of the anisotropic conductive adhesive is lowered.
金粒子の平均粒子径は、ニッケル粒子の平均粒子径の１／１０〜１／２が好ましい。金粒子の平均粒子径がニッケル粒子の平均粒子径の１／１０以上であれば、ニッケル粒子の凹部に侵入した金粒子が基板とニッケル粒子の双方に接触して強固な導電パスが形成され、安定した導電性が得られやすくなる。
なお、金粒子の平均粒子径が小さくなると、同じ量の金粒子を用いた場合に平均粒子径の大きい金粒子に比べて相対的に金粒子の個数が増える。その結果、ニッケル粒子と電子素子等の基板との間に金粒子が存在する確率が高くなり、圧力を加えた際に金粒子を介してニッケル粒子と基板の間に強固な導通パスが形成されやすくなる。従って、ニッケル粒子単体に比べて安定した導通性が得られやすくなる。金粒子の平均粒子径がニッケル粒子の平均粒子径の１／２以下であれば、金粒子の個数を十分に確保できるので、ニッケル粒子と基板との間に金粒子が存在する確率をより高めることができる。従って、金粒子を介してニッケル粒子と基板の間に強固な導通パスが形成され、安定した導通性が得られやすくなる。
The average particle diameter of the gold particles is preferably 1/10 to 1/2 of the average particle diameter of the nickel particles. If the average particle diameter of the gold particles is 1/10 or more of the average particle diameter of the nickel particles, the gold particles that have entered the recesses of the nickel particles contact both the substrate and the nickel particles, and a strong conductive path is formed. It becomes easy to obtain stable conductivity.
When the average particle diameter of the gold particles is reduced, the number of gold particles is relatively increased as compared with gold particles having a large average particle diameter when the same amount of gold particles is used. As a result, there is a high probability that gold particles exist between the nickel particles and the substrate such as an electronic device, and a strong conduction path is formed between the nickel particles and the substrate through the gold particles when pressure is applied. It becomes easy. Therefore, stable conductivity can be easily obtained as compared with the nickel particles alone. If the average particle diameter of the gold particles is ½ or less of the average particle diameter of the nickel particles, the number of gold particles can be sufficiently secured, so that the probability that the gold particles exist between the nickel particles and the substrate is further increased. be able to. Therefore, a strong conduction path is formed between the nickel particles and the substrate via the gold particles, and stable conduction is easily obtained.
金粒子としては、例えば福田金属箔粉工業社製の「ＰＭＰ−Ａｕ−２」などが好適である。 As the gold particles, for example, “PMP-Au-2” manufactured by Fukuda Metal Foil Powder Co., Ltd. is suitable.
金粒子の含有量は、導電粒子１００質量％中、５〜３０質量％が好ましく、１０〜２０質量％がより好ましい。金粒子の含有量が５質量％以上であれば、ニッケル粒子の電子素子や電極に対する接触面積を十分に確保できる。一方、金粒子の含有量が３０質量％を超えても金粒子を併用する効果は頭打ちとなるばかりでなく、製造コストが増大する。従って、金粒子の含有量の上限値は３０質量％以下が好ましい。 The content of the gold particles is preferably 5 to 30% by mass and more preferably 10 to 20% by mass in 100% by mass of the conductive particles. When the content of the gold particles is 5% by mass or more, the contact area of the nickel particles with respect to the electronic element or electrode can be sufficiently ensured. On the other hand, even if the content of the gold particles exceeds 30% by mass, the effect of using the gold particles not only reaches a peak, but also the production cost increases. Accordingly, the upper limit of the gold particle content is preferably 30% by mass or less.
＜絶縁性接着剤組成物＞
絶縁性接着剤組成物としては、異方性導電接着剤に用いられる公知の絶縁性接着剤組成物を用いることができる。絶縁性接着剤組成物に含まれる成分としては、バインダー、硬化剤、反応促進剤などが挙げられる。また、必要に応じて添加剤、溶剤などが含まれていてもよい。
バインダーとしては、絶縁性を有するものであれば特に制限されないが、例えばエポキシ樹脂、ポリエステル樹脂、ポリウレタン樹脂、アクリル樹脂などが挙げられる。
ここで、絶縁性とは、絶縁性接着剤組成物を介して電極同士を接合させたときの絶縁抵抗が１０７Ω以上となるものをいう。
<Insulating adhesive composition>
As an insulating adhesive composition, the well-known insulating adhesive composition used for an anisotropic conductive adhesive can be used. Examples of the component contained in the insulating adhesive composition include a binder, a curing agent, and a reaction accelerator. Moreover, an additive, a solvent, etc. may be contained as needed.
The binder is not particularly limited as long as it has insulating properties, and examples thereof include an epoxy resin, a polyester resin, a polyurethane resin, and an acrylic resin.
Here, the term “insulating” means that the insulation resistance is 10 7 Ω or more when the electrodes are bonded to each other via the insulating adhesive composition.
硬化剤としては、上述したバインダーを硬化できるものであれば特に制限されないが、例えばアミン化合物、アミド化合物、イミダゾール化合物、イソシアネート化合物などが挙げられる。
添加剤としては、例えばカップリング剤、チキソトロピック付与剤、キレート剤、防錆剤、分散剤、消泡剤などが挙げられる。
溶剤としては、例えばシクロヘキサノン、エチレングリコールモノブチルアセテート、ジエチレングリコールモノエチルアセテート、ジエチレングリコールモノブチルアセテート、イソホロン、γ−ブチルラクトン、灯油類、合成イソパラフィン系炭化水素などが挙げられる。
Although it will not restrict | limit especially as a hardening | curing agent if the binder mentioned above can be hardened, For example, an amine compound, an amide compound, an imidazole compound, an isocyanate compound etc. are mentioned.
Examples of the additive include a coupling agent, a thixotropic agent, a chelating agent, a rust inhibitor, a dispersant, and an antifoaming agent.
Examples of the solvent include cyclohexanone, ethylene glycol monobutyl acetate, diethylene glycol monoethyl acetate, diethylene glycol monobutyl acetate, isophorone, γ-butyllactone, kerosene, and synthetic isoparaffinic hydrocarbon.
絶縁性接着剤組成物は、上述したバインダーおよび硬化剤と、必要に応じて添加剤や溶剤をプラネタリーミキサーやロールミルなどで均一に混合することにより得られる。
また、本発明の異方性導電接着剤は、絶縁性接着剤組成物に導電粒子を分散させることにより得られる。さらに、必要に応じてメチルセロソルブ等の粘度調整剤により、所望の粘度になるように調整してもよい。異方性導電接着剤の粘度は用途に応じて適宜設定されるが、２３℃における粘度が１００〜５００ｄＰａ・ｓになるように調整するのが好ましい。なお、異方性導電接着剤の粘度は回転式粘度計により測定される値である。
The insulating adhesive composition can be obtained by uniformly mixing the above-described binder and curing agent, and, if necessary, an additive or a solvent with a planetary mixer or a roll mill.
The anisotropic conductive adhesive of the present invention can be obtained by dispersing conductive particles in an insulating adhesive composition. Furthermore, you may adjust so that it may become a desired viscosity with viscosity regulators, such as methyl cellosolve, as needed. The viscosity of the anisotropic conductive adhesive is appropriately set according to the use, but is preferably adjusted so that the viscosity at 23 ° C. is 100 to 500 dPa · s. The viscosity of the anisotropic conductive adhesive is a value measured with a rotary viscometer.
本発明の異方性導電接着剤は、種々の用途に使用できるが、半導体素子などの電子部品の電気的接続用として好適である。具体的には、液晶ディスプレイ（ＬＣＤ）とテープキャリアパッケージ（ＴＣＰ）との接続、ＬＣＤとフレキシブルプリント配線板（ＣＯＦ）との接続、ＴＣＰとプリント回路基板（ＰＣＢ）との接続など、微細な回路同士を電気的に接続するのに適している。 The anisotropic conductive adhesive of the present invention can be used for various applications, but is suitable for electrical connection of electronic components such as semiconductor elements. Specifically, fine circuits such as connection between liquid crystal display (LCD) and tape carrier package (TCP), connection between LCD and flexible printed wiring board (COF), connection between TCP and printed circuit board (PCB), etc. Suitable for electrically connecting each other.
以上説明した本発明の異方性導電接着剤は、特定のニッケル粒子と金粒子とからなる導電粒子が絶縁性接着剤組成物中に分散してなるので、高温高湿環境下においても長期にわたり安定した導通性を発現できる。 In the anisotropic conductive adhesive of the present invention described above, conductive particles composed of specific nickel particles and gold particles are dispersed in an insulating adhesive composition, so that it can be used for a long time even in a high temperature and high humidity environment. Stable continuity can be expressed.
以下、本発明を実施例により具体的に説明するが、本発明はこれらに限定されない。 EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these.
［実施例１］
＜絶縁性接着剤組成物の調製＞
還流冷却器および窒素ガス封入入口を備えた２Ｌのフラスコに、ビスフェノールＡ型エポキシ樹脂（旭チバ社製、「アラルダイトＡＥＲ２５０２」）６２０ｇに、潜在性硬化剤として芳香族ポリアミン（４，４−ジアミノジフェニルスルフォン、東洋インキ製造社製）２２０ｇの混合物と、エチレングリコールメチルエーテル６０ｇ、およびジエチレングリコールモノプチルエーテル１４０ｇの混合溶媒とを仕込み、徐々に温度を上昇させながら６０ｒｐｍの回転速度で撹拌を行い、約１００℃で透明の混合物を得た。さらに混合物について１５０℃×１５分の処理を行って、エポキシ樹脂と潜在性硬化剤とを予備縮合させた反応生成物を得た。該反応生成物の粘度は２５０ｄＰａ・ｓ（２３℃）であり、軟化点は８０℃であった。
ついで、得られた反応生成物７０ｇに対し、反応促進剤としてイミダゾール誘導体（四国化成工業社製、「キュアゾールＣ１７Ｚ」）を８．０ｇ添加し、セラミック製の３本ロールミルにて２回練肉した後、シランカップリング結合剤（日本ユニカー社製、「Ａ−１８７」）を２．８ｇ添加し、粘度２００ｄＰａ・ｓの絶縁性接着剤組成物（固形分８３質量％）を得た。
なお、反応生成物および絶縁性接着剤組成物の粘度は、回転式粘度計（リオン社製、「ＶＩＳＣＯＴＥＳＴＥＲ ＶＴ−０４」）により測定した。
[Example 1]
<Preparation of insulating adhesive composition>
Into a 2 L flask equipped with a reflux condenser and a nitrogen gas inlet, 620 g of a bisphenol A type epoxy resin ("Araldite AER2502" manufactured by Asahi Ciba Co., Ltd.) and an aromatic polyamine (4,4-diaminodiphenyl) as a latent curing agent (Sulphone, manufactured by Toyo Ink Manufacturing Co., Ltd.) A mixture of 220 g, a mixed solvent of ethylene glycol methyl ether 60 g, and diethylene glycol monoptyl ether 140 g was stirred at a rotational speed of 60 rpm while gradually raising the temperature. A clear mixture was obtained at 0C. Further, the mixture was treated at 150 ° C. for 15 minutes to obtain a reaction product obtained by precondensing the epoxy resin and the latent curing agent. The viscosity of the reaction product was 250 dPa · s (23 ° C.), and the softening point was 80 ° C.
Next, 8.0 g of an imidazole derivative (manufactured by Shikoku Kasei Kogyo Co., Ltd., “Curazole C17Z”) was added to 70 g of the obtained reaction product, and the mixture was kneaded twice with a ceramic three-roll mill. Thereafter, 2.8 g of a silane coupling binder (manufactured by Nippon Unicar Co., Ltd., “A-187”) was added to obtain an insulating adhesive composition having a viscosity of 200 dPa · s (solid content: 83 mass%).
The viscosity of the reaction product and the insulating adhesive composition was measured with a rotary viscometer (manufactured by Rion, “VISCOTESTER VT-04”).
＜異方性導電接着剤の製造＞
先に得られた絶縁性接着剤組成物１１８．７ｇ（固形分として９９ｇ）に、ニッケル粒子Ａ（日興リカ社製、「Ｔｙｐｅ１２３」、平均粒子径：４．０μｍ、見掛け密度：２．１１ｇ／ｃｍ３）０．９５ｇと、金粒子（福田金属箔粉工業社製、「ＰＭＰ−Ａｕ−２」、平均粒子径：１．２６μｍ）０．０５ｇを添加し、セラミック製の３本ロールミルにて１回の分散を行った後、６０ｒｐｍの回転速度で３０分間撹拌混合した。ついで、メチルセロソルブで粘度が１３０〜２００ｄＰａ・ｓ（２３℃）になるように調整し、異方性導電接着剤を得た。
なお、異方性導電接着剤の粘度は、回転式粘度計（リオン社製、「ＶＩＳＣＯＴＥＳＴＥＲ ＶＴ−０４」）により測定した。
<Manufacture of anisotropic conductive adhesive>
To 118.7 g of the insulating adhesive composition obtained previously (99 g as solid content), nickel particles A (manufactured by Nikko Rica, “Type 123”, average particle size: 4.0 μm, apparent density: 2.11 g / cm 3 ) 0.95 g and 0.05 g of gold particles (manufactured by Fukuda Metal Foil Powder Industry Co., Ltd., “PMP-Au-2”, average particle size: 1.26 μm) are added, and a ceramic three roll mill is used. After dispersion once, the mixture was stirred and mixed at a rotation speed of 60 rpm for 30 minutes. Subsequently, the viscosity was adjusted to 130 to 200 dPa · s (23 ° C.) with methyl cellosolve to obtain an anisotropic conductive adhesive.
The viscosity of the anisotropic conductive adhesive was measured with a rotary viscometer (manufactured by Rion, “VISCOTESTER VT-04”).
＜評価＞
（評価用試験片の作製）
厚さ５０μｍのポリイミドフィルムに、３００μｍピッチで１８μｍ錫メッキ銅配線を備えたフレキシブルプリント基板（ＦＰＣ）上に、異方性導電接着剤を乾燥膜厚が１５μｍ程度になるように塗布し、７０℃×４０分の条件で、恒温乾燥炉内で乾燥させた。ついで、表面抵抗５Ω／□のＩＴＯコートガラスに対し、１×１０ｍｍの圧着ツールを使用し、最高到達温度１７０℃、圧着時間３０秒、圧力３ＭＰａで、異方性導電接着剤を介してＦＰＣとコートガラスとを熱圧着し、評価用試験片とした。なお、圧着装置として、熱圧着機（日本アビオニクス社製、「パルスヒートＮＡ−６２Ｄ」）を使用した。
<Evaluation>
(Preparation of test specimen for evaluation)
An anisotropic conductive adhesive is applied to a polyimide film having a thickness of 50 μm on a flexible printed circuit board (FPC) having 18 μm tin-plated copper wiring at a pitch of 300 μm so that the dry film thickness is about 15 μm, and 70 ° C. * It dried in the constant temperature drying furnace on the conditions for 40 minutes. Next, an ITO coated glass with a surface resistance of 5Ω / □ is used with a 1 × 10 mm crimping tool, with a maximum temperature of 170 ° C., a crimping time of 30 seconds, and a pressure of 3 MPa. The coated glass was thermocompression bonded to obtain a test piece for evaluation. A thermocompression bonding machine (manufactured by Nippon Avionics Co., Ltd., “Pulse Heat NA-62D”) was used as the crimping apparatus.
（抵抗値の測定）
評価用試験片の隣接する錫メッキ銅配線間の抵抗値を、デジタルマルチメーター（アドバンスト社製、「Ｒ６５８１Ｄ」）を用いて測定した。これを初期抵抗値（Ｘ）とする。
ついで、評価用試験片を高温高湿環境下（温度６５℃、湿度９５％ＲＨに保持した高湿恒温槽内）に１０００時間放置して曝露処理を行った。曝露処理後の評価用試験片の抵抗値を初期抵抗値（Ｘ）と同様にして測定した。これを曝露処理後の抵抗値（Ｙ）とする。
初期抵抗値（Ｘ）および曝露処理後の抵抗値（Ｙ）の結果より、抵抗値の増加率（Ｙ／Ｘ）を求め、以下に示す評価基準にて耐高温高湿性を評価した。結果を表１に示す。なお、○および△を合格とする。
○：抵抗値の増加率が２．０以下。
△：抵抗値の増加率が２．０超、２．５以下。
×：抵抗値の増加率が２．５超。
(Measurement of resistance value)
The resistance value between adjacent tin-plated copper wirings of the test specimen for evaluation was measured using a digital multimeter (manufactured by Advanced Corp., “R6581D”). This is the initial resistance value (X).
Subsequently, the test piece for evaluation was left to stand for 1000 hours in a high-temperature and high-humidity environment (in a high-humidity thermostatic chamber maintained at a temperature of 65 ° C. and a humidity of 95% RH) to perform exposure treatment. The resistance value of the test specimen for evaluation after the exposure treatment was measured in the same manner as the initial resistance value (X). This is the resistance value (Y) after the exposure treatment.
From the results of the initial resistance value (X) and the resistance value (Y) after the exposure treatment, the increase rate (Y / X) of the resistance value was determined, and the high temperature and high humidity resistance was evaluated according to the following evaluation criteria. The results are shown in Table 1. In addition, ○ and Δ are acceptable.
○: Increase rate of resistance value is 2.0 or less.
(Triangle | delta): The increase rate of resistance value is more than 2.0 and 2.5 or less.
X: The increase rate of the resistance value exceeds 2.5.
［実施例２〜４、比較例１〜６］
ニッケル粒子の種類と添加量、および金粒子の添加量を表１、２に示す値に変更した以外は、実施例１と同様にして異方性導電接着剤を製造し、評価を行った。結果を表１、２に示す。
なお、ニッケル粒子としては、以下のものを使用した。
・金メッキニッケル粒子：福田金属箔粉工業社製、「ＧＮＰ−１０」、平均粒子径：１１．９μｍ、見掛け密度：２．７０ｇ／ｃｍ３、金の被覆量：１０質量％。
・ニッケル粒子Ｂ：日興リカ社製、「Ｔｙｐｅ４ＳＰ−２０ＭＩＣＲＯＮ」、平均粒子径：８．２μｍ、見掛け密度：３．５８ｇ／ｃｍ３。
[Examples 2 to 4, Comparative Examples 1 to 6]
An anisotropic conductive adhesive was produced and evaluated in the same manner as in Example 1 except that the kind and amount of nickel particles and the amount of gold particles were changed to the values shown in Tables 1 and 2. The results are shown in Tables 1 and 2.
The following nickel particles were used.
Gold-plated nickel particles: “GNP-10” manufactured by Fukuda Metal Foil Co., Ltd., average particle diameter: 11.9 μm, apparent density: 2.70 g / cm 3 , gold coating amount: 10% by mass.
Nickel particles B: “Type 4SP-20MICRON” manufactured by Nikko Rica Co., Ltd., average particle diameter: 8.2 μm, apparent density: 3.58 g / cm 3 .
表１から明らかなように、特定のニッケル粒子と金粒子とからなる導電粒子を用いた各実施例の異方性導電接着剤は、耐高温高湿性に優れていた。
一方、表２から明らかなように、導電粒子として金粒子を用いなかった比較例１、２の異方性導電接着剤は、耐高温高湿性が各実施例の異方性導電接着剤に比べて劣っており、高温高湿環境下における導通信頼性に劣り、安定した導通性が得られにくかった。
導電粒子の含有量が２５質量％と多かった比較例３の異方性導電接着剤は、隣接電極間で短絡を生じたため曝露処理を行わず、曝露処理後の抵抗値を測定しなかった。
見掛け密度が３．５８ｇ／ｃｍ３と大きいニッケル粒子を用いた比較例４、５の異方性導電接着剤は、ニッケル粒子が十分な空隙を有していなかったため、圧力が加わったときに押し潰されにくかった。そのため、基板との接触面積が増えず、異方性導電接着剤の導通性が十分なものではなかった。そのため、初期の段階において抵抗値（初期抵抗値）が各実施例や他の比較例に比べて高かった。また、抵抗値の増加率も各実施例や他の比較例に比べて著しく高く、耐高温高湿性に劣っており、安定した導通性が得られにくかった。
導電粒子としてニッケル粒子を用いなかった比較例６の異方性導電接着剤は、圧力によって金粒子が変形しやすく、かつ復元しないため初期抵抗値が高く、また、曝露処理後の抵抗値の増加が大きかった。
As is apparent from Table 1, the anisotropic conductive adhesive of each Example using conductive particles composed of specific nickel particles and gold particles was excellent in high temperature and high humidity resistance.
On the other hand, as is clear from Table 2, the anisotropic conductive adhesives of Comparative Examples 1 and 2 that did not use gold particles as the conductive particles had higher resistance to high temperature and high humidity than the anisotropic conductive adhesives of the respective examples. It was inferior, had poor conduction reliability in a high-temperature and high-humidity environment, and stable conduction was difficult to obtain.
The anisotropic conductive adhesive of Comparative Example 3 in which the content of the conductive particles was as large as 25% by mass did not perform the exposure treatment because a short circuit occurred between adjacent electrodes, and did not measure the resistance value after the exposure treatment.
The anisotropic conductive adhesives of Comparative Examples 4 and 5 using nickel particles having a large apparent density of 3.58 g / cm 3 were pressed when pressure was applied because the nickel particles did not have sufficient voids. It was hard to be crushed. Therefore, the contact area with the substrate does not increase, and the conductivity of the anisotropic conductive adhesive is not sufficient. For this reason, the resistance value (initial resistance value) was higher in the initial stage than in each of the examples and other comparative examples. Moreover, the increase rate of the resistance value was remarkably high as compared with each example and other comparative examples, and the resistance to high temperature and high humidity was inferior, and it was difficult to obtain stable conductivity.
The anisotropic conductive adhesive of Comparative Example 6 that did not use nickel particles as the conductive particles has a high initial resistance value because the gold particles are easily deformed by pressure and does not recover, and the resistance value increases after the exposure treatment. Was big.
Claims (4)
前記導電粒子は、平均粒子径が３〜１５μｍ、見掛け密度が０．３〜３．０ｇ／ｃｍ３であるニッケル粒子と、該ニッケル粒子より平均粒子径が小さい金粒子とからなり、かつ、当該異方性導電接着剤１００質量％中、１〜２０質量％含まれることを特徴とする異方性導電接着剤。 An anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive composition,
The conductive particles are composed of nickel particles having an average particle diameter of 3 to 15 μm and an apparent density of 0.3 to 3.0 g / cm 3 , and gold particles having an average particle diameter smaller than the nickel particles, and 1 to 20 mass% is contained in 100 mass% of anisotropic conductive adhesives, The anisotropic conductive adhesive characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009016722A JP2010174096A (en) | 2009-01-28 | 2009-01-28 | Anisotropic conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009016722A JP2010174096A (en) | 2009-01-28 | 2009-01-28 | Anisotropic conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2010174096A true JP2010174096A (en) | 2010-08-12 |
Family
ID=42705378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009016722A Pending JP2010174096A (en) | 2009-01-28 | 2009-01-28 | Anisotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010174096A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014212311A (en) * | 2013-04-02 | 2014-11-13 | 国立大学法人大阪大学 | Anisotropic conductive film and anisotropic conductive connector |
| WO2023243621A1 (en) * | 2022-06-14 | 2023-12-21 | 株式会社スリーボンド | Electrically conductive resin composition and cured product thereof |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03110711A (en) * | 1989-09-22 | 1991-05-10 | Fuji Kobunshi Kogyo Kk | Anisotropic conductive adhesive composition |
| JPH04323290A (en) * | 1991-02-25 | 1992-11-12 | Fuji Kobunshi Kogyo Kk | Anisotropic electrically conductive adhesive composition |
| JPH11339558A (en) * | 1998-05-26 | 1999-12-10 | Sekisui Chem Co Ltd | Anisotropic conductive adhesive and conductive connection structure |
| JP2000207942A (en) * | 1999-01-11 | 2000-07-28 | Toshiba Chem Corp | Aerotropic conductive adhesive |
| JP2000251536A (en) * | 1999-03-04 | 2000-09-14 | Toshiba Chem Corp | Anisotropic conductive adhesive |
| JP2001143529A (en) * | 1999-11-12 | 2001-05-25 | Nippon Handa Kk | Conductive bonding agent by blending cream solder and bonding method using the same |
| JP2001262078A (en) * | 2000-03-17 | 2001-09-26 | Sony Chem Corp | Connecting material |
| JP2002332464A (en) * | 2001-05-08 | 2002-11-22 | Ricoh Co Ltd | Conductive adhesive and joining method |
| JP2003045229A (en) * | 2001-07-27 | 2003-02-14 | Toppan Forms Co Ltd | Conductive adhesive and method of mounting IC chip using the same |
| JP2004010828A (en) * | 2002-06-10 | 2004-01-15 | Ricoh Co Ltd | Conductive adhesives and electronic components |
| JP2006096784A (en) * | 2004-09-28 | 2006-04-13 | Asian Shield:Kk | Resin composition for electronic parts |
| JP2006274108A (en) * | 2005-03-30 | 2006-10-12 | Sony Chemical & Information Device Corp | Thermosetting anisotropic conductive adhesive |
| JP2007077382A (en) * | 2005-08-18 | 2007-03-29 | Hitachi Chem Co Ltd | Adhesive material composition and circuit terminal connected structure and method for connecting circuit terminal |
| JP2008169389A (en) * | 2007-12-17 | 2008-07-24 | Hitachi Chem Co Ltd | Circuit connecting material and method of manufacturing circuit board |
-
2009
- 2009-01-28 JP JP2009016722A patent/JP2010174096A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03110711A (en) * | 1989-09-22 | 1991-05-10 | Fuji Kobunshi Kogyo Kk | Anisotropic conductive adhesive composition |
| JPH04323290A (en) * | 1991-02-25 | 1992-11-12 | Fuji Kobunshi Kogyo Kk | Anisotropic electrically conductive adhesive composition |
| JPH11339558A (en) * | 1998-05-26 | 1999-12-10 | Sekisui Chem Co Ltd | Anisotropic conductive adhesive and conductive connection structure |
| JP2000207942A (en) * | 1999-01-11 | 2000-07-28 | Toshiba Chem Corp | Aerotropic conductive adhesive |
| JP2000251536A (en) * | 1999-03-04 | 2000-09-14 | Toshiba Chem Corp | Anisotropic conductive adhesive |
| JP2001143529A (en) * | 1999-11-12 | 2001-05-25 | Nippon Handa Kk | Conductive bonding agent by blending cream solder and bonding method using the same |
| JP2001262078A (en) * | 2000-03-17 | 2001-09-26 | Sony Chem Corp | Connecting material |
| JP2002332464A (en) * | 2001-05-08 | 2002-11-22 | Ricoh Co Ltd | Conductive adhesive and joining method |
| JP2003045229A (en) * | 2001-07-27 | 2003-02-14 | Toppan Forms Co Ltd | Conductive adhesive and method of mounting IC chip using the same |
| JP2004010828A (en) * | 2002-06-10 | 2004-01-15 | Ricoh Co Ltd | Conductive adhesives and electronic components |
| JP2006096784A (en) * | 2004-09-28 | 2006-04-13 | Asian Shield:Kk | Resin composition for electronic parts |
| JP2006274108A (en) * | 2005-03-30 | 2006-10-12 | Sony Chemical & Information Device Corp | Thermosetting anisotropic conductive adhesive |
| JP2007077382A (en) * | 2005-08-18 | 2007-03-29 | Hitachi Chem Co Ltd | Adhesive material composition and circuit terminal connected structure and method for connecting circuit terminal |
| JP2008169389A (en) * | 2007-12-17 | 2008-07-24 | Hitachi Chem Co Ltd | Circuit connecting material and method of manufacturing circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014212311A (en) * | 2013-04-02 | 2014-11-13 | 国立大学法人大阪大学 | Anisotropic conductive film and anisotropic conductive connector |
| WO2023243621A1 (en) * | 2022-06-14 | 2023-12-21 | 株式会社スリーボンド | Electrically conductive resin composition and cured product thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5151902B2 (en) | Anisotropic conductive film | |
| TWI556266B (en) | Anisotropic conductive film and semiconductor device using same | |
| CN102120920B (en) | Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same | |
| KR101278991B1 (en) | Anisotropic conductive adhesive | |
| JP4814277B2 (en) | Bonded body, method for manufacturing the bonded body, and anisotropic conductive film used for the bonded body | |
| JP5488059B2 (en) | Conductive paste | |
| KR20070089766A (en) | Adhesive for circuit connection | |
| JP6203783B2 (en) | Conductive adhesive and method for manufacturing electronic substrate | |
| JP4998732B2 (en) | Anisotropic conductive adhesive | |
| JPH07157720A (en) | Anisotropic conductive film | |
| KR102066206B1 (en) | Conductive adhesive composition and isotropic conductive film formed with the same | |
| KR20070105972A (en) | Insulation-coated electroconductive particles | |
| JP2008094908A (en) | Adhesive for electrode connection | |
| JP2010174096A (en) | Anisotropic conductive adhesive | |
| JPH07173448A (en) | Anisotropically conductive film | |
| JP3513636B2 (en) | Composite conductive powder, conductive paste, electric circuit and method for producing electric circuit | |
| JP4867805B2 (en) | Adhesive for electrode connection | |
| JP2007056209A (en) | Adhesive for circuit connection | |
| JP2014031465A (en) | Circuit connecting material | |
| JP2680412B2 (en) | Anisotropic conductive film | |
| JP3480754B2 (en) | Method for producing anisotropic conductive film | |
| JP2010282990A (en) | Connection method, connection structure, and electronic device | |
| JP2009004603A (en) | Substrate manufacturing method | |
| JPH07252460A (en) | adhesive | |
| JP2004220916A (en) | Adhesive composition for circuit connection, and circuit terminal connection method and circuit terminal connection structure using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111013 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130415 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20130528 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20131015 |