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JP2010165761A - Electronic component cooling structure - Google Patents

Electronic component cooling structure Download PDF

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JP2010165761A
JP2010165761A JP2009005325A JP2009005325A JP2010165761A JP 2010165761 A JP2010165761 A JP 2010165761A JP 2009005325 A JP2009005325 A JP 2009005325A JP 2009005325 A JP2009005325 A JP 2009005325A JP 2010165761 A JP2010165761 A JP 2010165761A
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electronic component
cooling
cooling structure
base portion
electronic components
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Nobuhide Sato
宣秀 佐藤
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Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
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Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the cooling performance, without increasing the size of cooling fins. <P>SOLUTION: A vent hole 6 is formed in a base part 1 equipped with cooling fins 2. As cooling air is led into the adjacent cooling fins 2, equipped with an electronic component 5 through the vent hole 6, the cooling performance of the electronic component 5 is improved without changing the size of the cooling fins 2. Furthermore, the vent hole 6 is formed across electronic components 4 and 5, thereby limiting a transfer of heat between the electronic components 4 and 5. Accordingly, the electronic components 4 and 5, that have different allowable temperatures, can be disposed on the same base part 1. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、半導体装置等の電子部品を冷却する電子部品の冷却構造に関する。特に、電子部品が取り付けられるヒートシンクをファンにより積極的に冷却する電子部品の冷却構造に関する。   The present invention relates to an electronic component cooling structure for cooling an electronic component such as a semiconductor device. In particular, the present invention relates to a cooling structure for an electronic component in which a heat sink to which the electronic component is attached is actively cooled by a fan.

特許文献１〜３に示されるように、半導体等の発熱する電子部品は、複数の放熱フィンを備えたヒートシンクとファン装置とを組み合わせて構成される電子部品冷却構造により冷却されている。   As shown in Patent Documents 1 to 3, an electronic component that generates heat, such as a semiconductor, is cooled by an electronic component cooling structure configured by combining a heat sink and a fan device including a plurality of heat radiation fins.

上記冷却構造の冷却効率を向上させるため、ヒートシンクのベース部に対してファンを斜めに設置する（特許文献３）等により、フィン群を流れる空気の量を増大させている。また、電子部品に冷却風を供給する冷却風吹き出し孔を形成する（特許文献４、５）ことにより、高密度に実装された電子部品を均一かつ十分に冷却している。   In order to improve the cooling efficiency of the cooling structure, the amount of air flowing through the fin group is increased by installing a fan obliquely with respect to the base portion of the heat sink (Patent Document 3). Further, by forming cooling air blowing holes for supplying cooling air to the electronic components (Patent Documents 4 and 5), the electronic components mounted at high density are uniformly and sufficiently cooled.

図３に従来技術における電子部品の冷却構造の例を示す。図３に示した電子部品冷却構造１３は、ファン３を排気側に配置し、複数の電子部品４、５（半導体）を冷却フィン２の風の抜き方向に並べて配置したものである。   FIG. 3 shows an example of a cooling structure for an electronic component in the prior art. In the electronic component cooling structure 13 shown in FIG. 3, the fan 3 is arranged on the exhaust side, and a plurality of electronic components 4 and 5 (semiconductors) are arranged side by side in the air blowing direction of the cooling fin 2.

図３（ａ）は、電子部品の冷却構造をベース部側から見た図（上面図とする）であり、図３（ｂ）は、電子部品の冷却構造を冷却フィンの側面から見た図（側面図とする）である。   3A is a view (top view) of the electronic component cooling structure as viewed from the base side, and FIG. 3B is a view of the electronic component cooling structure as viewed from the side surface of the cooling fin. (Side view).

図３（ａ）に示すように、ベース部１０には、半導体等の電子部品（発熱体）４、５が備えられる。そして、ファン３が駆動することにより、冷却フィン２（図３（ｂ）参照）により熱交換された空気が外部に排出される。したがって、冷却フィン２、ベース部１０、電子部品４、５が冷却される。   As shown in FIG. 3A, the base portion 10 is provided with electronic components (heating elements) 4 and 5 such as semiconductors. When the fan 3 is driven, the air heat-exchanged by the cooling fins 2 (see FIG. 3B) is discharged to the outside. Therefore, the cooling fin 2, the base part 10, and the electronic components 4 and 5 are cooled.

図３（ｂ）に示すように、ベース部１０の電子部品４、５が備えられる面の裏側には、複数枚の板状のフィン２が備えられている。フィン２の形状は、冷却効率がよく、ファン３により生じる空気の流れを妨げない形状を適宜選択すればよい（例えば、波型の板や棒状のフィンでもよい）。   As shown in FIG. 3B, a plurality of plate-like fins 2 are provided on the back side of the surface of the base portion 10 on which the electronic components 4 and 5 are provided. The shape of the fin 2 may be appropriately selected as long as it has good cooling efficiency and does not interfere with the air flow generated by the fan 3 (for example, a corrugated plate or a rod-shaped fin).

通常、ヒートシンクのベース部１０上に複数の電子部品４、５を備える場合、熱に弱い電子部品を風下に配置する等電子部品４、５の特性に合わせて、電子部品４、５を配置している（非特許文献１）。   Usually, when a plurality of electronic components 4 and 5 are provided on the base portion 10 of the heat sink, the electronic components 4 and 5 are arranged in accordance with the characteristics of the electronic components 4 and 5 such as arranging electronic components that are vulnerable to heat on the leeward side. (Non-Patent Document 1).

特開２００１−１０２７８７号公報JP 2001-102787 A 特開平１１−３４１８２４号公報JP-A-11-341824 特開２００２−２７１０７２号公報JP 2002-210772 A 特開平５−７０９１号公報JP-A-5-7091 特開平１０−９３２７３号公報Japanese Patent Laid-Open No. 10-93273

伊藤謹司、外２名、「電子機器の熱対策設計」、初版、日刊工業新聞社、昭和５６年１１月２０日、１２６頁、１６５頁Koji Ito, two others, “Thermal design of electronic equipment”, first edition, Nikkan Kogyo Shimbun, November 20, 1981, pages 126, 165

しかしながら、図３に示した電子部品冷却構造１３では、排気側に配置された電子部品５は、吸気側に配置された電子部品４を冷却した空気が供されるので放熱が困難となってしまう。したがって、電子部品４の発熱量が多い場合、電子部品４により熱交換された空気が電子部品５の冷却風とならないよう、遮蔽板を設けて前記空気を電子部品４と隔離して排出する方法が採られる（非特許文献１）。しかし、遮蔽板を設けると、電子部品の実装スペースの増大を招いてしまう。   However, in the electronic component cooling structure 13 shown in FIG. 3, the electronic component 5 disposed on the exhaust side is provided with air that has cooled the electronic component 4 disposed on the intake side, and thus heat dissipation becomes difficult. . Therefore, when the heat generation amount of the electronic component 4 is large, a method is provided in which the air is isolated from the electronic component 4 and discharged so that the air exchanged by the electronic component 4 does not become cooling air for the electronic component 5. (Non-Patent Document 1). However, if the shielding plate is provided, the mounting space for the electronic components is increased.

さらに、電子部品４、５の許容温度が異なる場合、同一フィン２で冷却すると、許容温度の低い電子部品は、ベース部１０からの熱伝導により熱的な影響を受けてしまう。   Furthermore, when the allowable temperatures of the electronic components 4 and 5 are different, if the same fin 2 is used for cooling, the electronic component having a low allowable temperature is thermally affected by heat conduction from the base portion 10.

以上の問題に対して、それぞれの電子部品４、５に独立したヒートシンクを備えなければならず、冷却フィンやファンの個数が増大する要因となっていた。   In order to deal with the above problems, each of the electronic components 4 and 5 must be provided with an independent heat sink, which increases the number of cooling fins and fans.

そこで、本発明は冷却フィンのサイズを大きくすることなく、冷却性能を向上させる電子部品の冷却構造を提供することを目的としている。   SUMMARY OF THE INVENTION An object of the present invention is to provide a cooling structure for an electronic component that improves the cooling performance without increasing the size of the cooling fin.

上記目的を達成する本発明の請求項１に記載の電子部品冷却構造は、電子部品が取り付けられるベース部と、前記電子部品が取り付けられた面の裏面に立設して備えられる複数の冷却フィンとからなるヒートシンクと、前記ヒートシンクにより熱交換された空気を外部へ排出するファンとからなる電子部品冷却構造であって、前記ベース部には、前記空気が排出される方向に複数の電子部品が取り付けられ、前記複数の電子部品間に配置されるように前記ベース部に穴が形成されたことを特徴とする。   The electronic component cooling structure according to claim 1 of the present invention that achieves the above object includes a base portion to which the electronic component is attached and a plurality of cooling fins provided upright on the back surface of the surface to which the electronic component is attached. And a fan for discharging the air heat-exchanged by the heat sink to the outside, wherein the base portion has a plurality of electronic components in a direction in which the air is discharged. A hole is formed in the base portion so as to be attached and disposed between the plurality of electronic components.

また、請求項２に記載の電子部品冷却構造は、電子部品が取り付けられるベース部と、前記電子部品が取り付けられた面の裏面に立設して備えられる複数の冷却フィンとからなるヒートシンクの電子部品冷却構造であって、前記ベース部には、前記ベース部の最外に配置された冷却フィンの内側にスリットが形成されたことを特徴とする。   According to a second aspect of the present invention, there is provided an electronic component cooling structure comprising: a base portion to which an electronic component is attached; and a plurality of cooling fins provided upright on a rear surface of the surface to which the electronic component is attached. The component cooling structure is characterized in that a slit is formed inside the cooling fin disposed on the outermost side of the base portion.

そして、請求項３に記載の電子部品冷却構造は、請求項２に記載の電子部品冷却構造において、前記最外に配置される冷却フィンは板状であり、前記スリットは、該冷却フィンの主面と平行に形成されたことを特徴とする。   The electronic component cooling structure according to claim 3 is the electronic component cooling structure according to claim 2, wherein the outermost cooling fin is plate-shaped, and the slit is a main part of the cooling fin. It is characterized by being formed parallel to the surface.

また、請求項４に記載の電子部品冷却構造は、電子部品が取り付けられるベース部と、前記電子部品が取り付けられた面の裏面に立設して備えられる複数の冷却フィンとからなるヒートシンクの電子部品冷却構造であって、前記ベース部の最外に配置される冷却フィンにスリットが形成されたことを特徴とする。   According to a fourth aspect of the present invention, there is provided an electronic component cooling structure comprising: a base portion to which an electronic component is attached; and a plurality of cooling fins provided upright on a rear surface of the surface to which the electronic component is attached. The component cooling structure is characterized in that a slit is formed in a cooling fin disposed on the outermost side of the base portion.

したがって、以上の発明によれば、冷却フィンのサイズを大きくすることなく、電子部品の冷却能力を向上させることができる。   Therefore, according to the above invention, the cooling capacity of the electronic component can be improved without increasing the size of the cooling fin.

（ａ）本発明の第１の実施形態に係る電子部品冷却構造の上面図、（ｂ）本発明の第１の実施形態に係る電子部品冷却構造の側面図、（ｃ）本発明の第１の実施形態に係る電子部品冷却構造のＡ−Ａ断面図。(A) Top view of the electronic component cooling structure according to the first embodiment of the present invention, (b) Side view of the electronic component cooling structure according to the first embodiment of the present invention, (c) First of the present invention AA sectional drawing of the electronic component cooling structure which concerns on embodiment of this. （ａ）本発明の第２の実施形態に係る電子部品冷却構造の上面図、（ｂ）本発明の第２の実施形態に係る電子部品冷却構造のＢ−Ｂ断面図。(A) Top view of the electronic component cooling structure which concerns on the 2nd Embodiment of this invention, (b) BB sectional drawing of the electronic component cooling structure which concerns on the 2nd Embodiment of this invention. （ａ）従来技術に係る電子部品冷却構造の上面図、（ｂ）従来技術に係る電子部品冷却構造の側面図。(A) Top view of the electronic component cooling structure which concerns on a prior art, (b) Side view of the electronic component cooling structure which concerns on a prior art.

本発明は、電子部品が備えられるベース部に穴又はスリットを形成することにより、ヒートシンクを大きくすることなく冷却効率を向上させるものである。   The present invention improves the cooling efficiency without increasing the heat sink by forming a hole or a slit in a base part provided with an electronic component.

本発明の第１実施形態に係る電子部品冷却構造について、図１を参照して詳細に説明する。図１（ａ）は、本発明の第１実施形態に係る電子部品冷却構造の上面図、図１（ｂ）は、本発明の第１実施形態に係る電子部品冷却構造の側面図、及び図１（ｃ）は、本発明の第１実施形態に係る電子部品冷却構造のＡ−Ａ断面図である。   The electronic component cooling structure according to the first embodiment of the present invention will be described in detail with reference to FIG. 1A is a top view of the electronic component cooling structure according to the first embodiment of the present invention, FIG. 1B is a side view of the electronic component cooling structure according to the first embodiment of the present invention, and FIG. 1 (c) is an AA cross-sectional view of the electronic component cooling structure according to the first embodiment of the present invention.

図１（ａ）に示すように、本発明の第１実施形態に係る電子部品冷却構造１１は、冷却される電子部品４、５が備えられるベース部１とこのベース部１に備えられる冷却フィン２、及び冷却フィン２で熱交換された空気を排出するためのファン３より構成される（ベース部１と冷却フィン２をあわせたものをヒートシンクとする）。また、吸気側には、図示省略の防塵フィルタが備えられる。   As shown in FIG. 1A, an electronic component cooling structure 11 according to a first embodiment of the present invention includes a base portion 1 provided with electronic components 4 and 5 to be cooled and cooling fins provided on the base portion 1. 2 and a fan 3 for discharging the air heat-exchanged by the cooling fins 2 (the heat sink is a combination of the base portion 1 and the cooling fins 2). Further, a dustproof filter (not shown) is provided on the intake side.

通常の電子機器に使用される防塵フィルタは、粒径の大きい塵埃は除去することができるが粒径の小さいものは通過してしまう。そこで、フィルタの目を細かくすると、塵埃の捕集率は向上するが、通気抵抗が大きくなるので電子部品冷却構造１１にはファン３が備えられている。   A dustproof filter used in a normal electronic device can remove dust having a large particle diameter, but passes a small particle having a small particle diameter. Therefore, if the filter is made finer, the dust collection rate is improved, but the ventilation resistance is increased. Therefore, the electronic component cooling structure 11 is provided with the fan 3.

図１（ｂ）に示すように、電子部品４、５は、ファン３により生じる冷却風の向きの方向に並んで備えられる。そして、ファン３が駆動することにより、冷却フィン２により熱交換された空気が外部に排出される。したがって、冷却フィン２、ベース部１、電子部品４、５が冷却される。   As shown in FIG. 1B, the electronic components 4 and 5 are provided side by side in the direction of the cooling air generated by the fan 3. When the fan 3 is driven, the air heat-exchanged by the cooling fin 2 is discharged to the outside. Therefore, the cooling fin 2, the base part 1, and the electronic components 4 and 5 are cooled.

図１（ｃ）に示すように、ベース部１の電子部品４、５が備えられる面の裏側には、複数枚の板状のフィン２が備えられている。フィン２の形状は、冷却効率がよく、ファン３により生じる空気の流れを妨げない形状を適宜選択すればよい（例えば、波型の板や棒状のフィンでもよい）。   As shown in FIG. 1C, a plurality of plate-like fins 2 are provided on the back side of the surface of the base portion 1 on which the electronic components 4 and 5 are provided. The shape of the fin 2 may be appropriately selected as long as it has good cooling efficiency and does not interfere with the air flow generated by the fan 3 (for example, a corrugated plate or a rod-shaped fin).

図１（ａ）に示すように、ベース部１には、電子部品４、５を隔てるように通気孔６が形成されている。図１（ｂ）に示すように、電子部品４、５間に、通気孔６を形成することにより、冷却フィン２に通気孔６を通して冷却風が供給される。したがって、電子部品５の冷却効率が向上する。   As shown in FIG. 1A, the base portion 1 is formed with a vent hole 6 so as to separate the electronic components 4 and 5. As shown in FIG. 1B, the cooling air is supplied to the cooling fins 2 through the ventilation holes 6 by forming the ventilation holes 6 between the electronic components 4 and 5. Therefore, the cooling efficiency of the electronic component 5 is improved.

さらに、通気孔６が形成されることにより、電子部品４、５間での熱の移動が制限される。したがって、許容温度が異なる電子部品を同一の冷却フィンで冷却することが可能となり、冷却フィン２及び冷却ファン３の個数を減らすことができる。   Furthermore, the formation of the air holes 6 restricts the movement of heat between the electronic components 4 and 5. Therefore, electronic components having different allowable temperatures can be cooled with the same cooling fin, and the number of cooling fins 2 and cooling fans 3 can be reduced.

通気孔６の形状は、図１（ａ）に示すような矩形に限らず任意の形状を選択すればよい。また、通気孔６を複数個形成してもよい。特に、図１（ｂ）に示すように、空気が排出される方向に傾斜するよう通気孔６をベース部１に形成すると、流通する冷却風を妨げず冷却効率が向上する。   The shape of the vent hole 6 is not limited to a rectangle as shown in FIG. A plurality of vent holes 6 may be formed. In particular, as shown in FIG. 1B, when the vent hole 6 is formed in the base portion 1 so as to be inclined in the direction in which air is discharged, the cooling efficiency is improved without disturbing the cooling air flowing.

以上のように、本発明の第１実施形態に係る電子部品冷却構造によれば、ベース部１に通気孔６を形成するだけなので、材料費がそのままで、穴をあける加工費のみで冷却性能を向上させることができる。   As described above, according to the electronic component cooling structure according to the first embodiment of the present invention, since the vent hole 6 is only formed in the base portion 1, the material cost is kept as it is, and the cooling performance is made only by the processing cost for making the hole. Can be improved.

本発明の第２実施形態に係る電子部品冷却構造について、図２を参照して詳細に説明する。図２（ａ）は、本発明の第２実施形態に係る電子部品冷却構造の上面図、図２（ｂ）は、本発明の第２実施形態に係る電子部品冷却構造のＢ−Ｂ断面図である。   The electronic component cooling structure according to the second embodiment of the present invention will be described in detail with reference to FIG. FIG. 2A is a top view of an electronic component cooling structure according to the second embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along line BB of the electronic component cooling structure according to the second embodiment of the present invention. It is.

図２（ａ）に示すように、本発明の第２実施形態に係る電子部品冷却構造１２は、冷却される電子部品４、５が備えられるベース部７とこのベース部７に備えられる冷却フィン２ａ、２ｂ、及び冷却フィン２ａ、２ｂで熱交換された空気を排出するためのファン３より構成される（ベース部７と冷却フィン２ａ、２ｂをあわせたものをヒートシンクとする）。また、吸気側には、図示省略の防塵フィルタが備えられる。   As shown in FIG. 2A, the electronic component cooling structure 12 according to the second embodiment of the present invention includes a base portion 7 provided with electronic components 4 and 5 to be cooled and cooling fins provided on the base portion 7. 2a and 2b and the fan 3 for discharging the air heat-exchanged by the cooling fins 2a and 2b (the heat sink is a combination of the base portion 7 and the cooling fins 2a and 2b). Further, a dustproof filter (not shown) is provided on the intake side.

図２（ａ）に示すように、本発明の第２実施形態に係る電子部品冷却構造１２は、最外に配置される冷却フィン２ａより内側のベース部７にスリット９が形成されている。スリット９は、フィン２ａ、２ｂと平行に配置されるように形成されている。したがって、ベース部７からフィン２ａへの熱移送が低減され、フィン２ａから周囲に配置される電子部品８（例えば、電解コンデンサ）への熱放射を少なくすることができる。   As shown in FIG. 2A, in the electronic component cooling structure 12 according to the second embodiment of the present invention, the slit 9 is formed in the base portion 7 inside the cooling fin 2a arranged at the outermost position. The slit 9 is formed so as to be arranged in parallel with the fins 2a and 2b. Therefore, heat transfer from the base portion 7 to the fins 2a is reduced, and heat radiation from the fins 2a to the electronic component 8 (for example, an electrolytic capacitor) disposed around can be reduced.

ゆえに、冷却フィン２ａの周囲に熱に弱い電子部品８を配置できるとともに、熱に弱い電子部品を熱放射から防護するための熱遮蔽板等を削減することができる。よって、発熱量の多い電子部品（図２（ａ）では、電子部品４又は５）の近くに、熱に弱い電子部品（図２（ａ）では、電子部品８）を配置することが可能となり、電子部品の配置スペースを小さくすることができる。   Therefore, the heat-sensitive electronic component 8 can be disposed around the cooling fin 2a, and a heat shielding plate or the like for protecting the heat-sensitive electronic component from heat radiation can be reduced. Therefore, an electronic component that is weak against heat (electronic component 8 in FIG. 2A) can be placed near an electronic component that generates a large amount of heat (electronic component 4 or 5 in FIG. 2A). The space for arranging the electronic components can be reduced.

なお、電子部品４、５の冷却は、冷却フィン２ｂで行われるため冷却能力が損なわれることはない。そして、フィン２ａ、２ｂの形状は、冷却効率がよく、ファン３により生じる空気の流れを妨げない形状を適宜選択すればよい（例えば、波型の板や棒状のフィンでもよい）。   In addition, since cooling of the electronic components 4 and 5 is performed by the cooling fin 2b, a cooling capability is not impaired. And the shape of the fins 2a and 2b should just select suitably the shape which has good cooling efficiency and does not prevent the air flow produced by the fan 3 (for example, a corrugated board and a rod-shaped fin may be sufficient).

また、スリット９は、冷却フィン２ａに形成してもよい。これにより、ベース部７からフィン２ａへの熱移送が低減され、フィン２ａから周囲に配置される電子部品８（例えば、電解コンデンサ）への熱放射を少なくすることができる。   Moreover, you may form the slit 9 in the cooling fin 2a. Thereby, the heat transfer from the base part 7 to the fin 2a is reduced, and the heat radiation from the fin 2a to the electronic component 8 (for example, electrolytic capacitor) arrange | positioned around can be decreased.

以上のように、本発明の第１及び第２実施形態に係る電子部品冷却構造によれば、電子部品を配置するスペースを小さくすることができる。なお、本発明に係る電子部品冷却構造は、ファン、防塵フィルタ等の配置場所、ベース部に形成される通気孔及びスリットの形状、ベース部に備えられる電子部品の種類や数等は適宜設定可能である。   As described above, according to the electronic component cooling structure according to the first and second embodiments of the present invention, the space for arranging the electronic components can be reduced. In the electronic component cooling structure according to the present invention, the location of the fan, dustproof filter, etc., the shape of the air holes and slits formed in the base portion, and the type and number of electronic components provided in the base portion can be set as appropriate. It is.

特に、本発明に係る電子部品冷却構造は、完全な防塵を必要とする電子機器（密閉構造をとる電子機器）等、筐体や支持枠に冷却風吹き出し孔を形成することができない場合の電子機器における電子部品の冷却特性向上に有効である。   In particular, the electronic component cooling structure according to the present invention is an electronic device in which a cooling air blowing hole cannot be formed in a housing or a support frame, such as an electronic device that requires complete dust prevention (an electronic device having a sealed structure). This is effective for improving the cooling characteristics of electronic components in equipment.

１、７、１０…ベース部
４、５，８…電子部品
２、２ａ、２ｂ…冷却フィン
６…通風孔（穴）
９…スリット DESCRIPTION OF SYMBOLS 1, 7, 10 ... Base part 4, 5, 8 ... Electronic component 2, 2a, 2b ... Cooling fin 6 ... Ventilation hole (hole)
9 ... Slit

Claims (4)

電子部品が取り付けられるベース部と、前記電子部品が取り付けられた面の裏面に立設して備えられる複数の冷却フィンとからなるヒートシンクと、
前記ヒートシンクにより熱変換された空気を外部へ排出するファンとからなる電子部品冷却構造であって、
前記ベース部には、前記空気が排出される方向に複数の電子部品が取り付けられ、
前記複数の電子部品間に配置されるように、前記ベース部に穴が形成された
ことを特徴とする電子部品冷却構造。 A heat sink comprising a base portion to which electronic components are attached, and a plurality of cooling fins provided upright on the back surface of the surface to which the electronic components are attached;
An electronic component cooling structure comprising a fan for discharging the air thermally converted by the heat sink to the outside,
A plurality of electronic components are attached to the base portion in the direction in which the air is discharged,
An electronic component cooling structure, wherein a hole is formed in the base portion so as to be disposed between the plurality of electronic components. 電子部品が取り付けられるベース部と、前記電子部品が取り付けられた面の裏面に立設して備えられる複数の冷却フィンとからなるヒートシンクの電子部品冷却構造であって、
前記ベース部には、前記ベース部の最外に配置される冷却フィンの内側にスリットが形成された
ことを特徴とする電子部品冷却構造。 A heat sink electronic component cooling structure comprising a base portion to which an electronic component is attached and a plurality of cooling fins provided upright on the back surface of the surface to which the electronic component is attached,
The electronic part cooling structure according to claim 1, wherein a slit is formed inside the cooling fin disposed on the outermost side of the base part. 前記最外に配置される冷却フィンは板状であり、
前記スリットは、該冷却フィンの主面と平行に形成された
ことを特徴とする請求項２に記載の電子部品冷却構造。 The outermost cooling fin is plate-shaped,
The electronic component cooling structure according to claim 2, wherein the slit is formed in parallel with a main surface of the cooling fin. 電子部品が取り付けられるベース部と、前記電子部品が取り付けられた面の裏面に立設して備えられる複数の冷却フィンとからなるヒートシンクの電子部品冷却構造であって、
前記ベース部の最外に配置される冷却フィンにスリットが形成された
ことを特徴とする電子部品冷却構造。 A heat sink electronic component cooling structure comprising a base portion to which an electronic component is attached and a plurality of cooling fins provided upright on the back surface of the surface to which the electronic component is attached,
A cooling structure for an electronic component, wherein a slit is formed in a cooling fin disposed on the outermost side of the base portion.
JP2009005325A 2009-01-14 2009-01-14 Electronic component cooling structure Pending JP2010165761A (en)

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JP2013093364A (en) * 2011-10-24 2013-05-16 Fuji Electric Co Ltd Forced air cooling heat sink
JP2013165155A (en) * 2012-02-10 2013-08-22 Stanley Electric Co Ltd Heat sink and lighting device including the same
JP2014038924A (en) * 2012-08-14 2014-02-27 Fuji Electric Co Ltd Forced air-cooling type heat sink
JP2019057656A (en) * 2017-09-22 2019-04-11 ダイヤモンド電機株式会社 Electronic equipment with air cooling mechanism

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JPH03153095A (en) * 1989-11-10 1991-07-01 Hitachi Ltd Heat dissipation structure of electronic equipment
JPH11238986A (en) * 1998-02-20 1999-08-31 Mitsubishi Electric Corp Heating component cooling device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093364A (en) * 2011-10-24 2013-05-16 Fuji Electric Co Ltd Forced air cooling heat sink
JP2013165155A (en) * 2012-02-10 2013-08-22 Stanley Electric Co Ltd Heat sink and lighting device including the same
JP2014038924A (en) * 2012-08-14 2014-02-27 Fuji Electric Co Ltd Forced air-cooling type heat sink
JP2019057656A (en) * 2017-09-22 2019-04-11 ダイヤモンド電機株式会社 Electronic equipment with air cooling mechanism

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