JP2010161274A - Heat radiating structure for heating element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiating structure for a heating element in which heat of a heating element such as an LED mounted on a substrate can be effectively radiated even when a heat radiating panel or the like can not be installed on the back of the substrate because of a limitation in installation space or the like. <P>SOLUTION: On a back side of a substrate 1, an electronic component 5 is mounted in such a way as to be protected by a resin case 4 and a surface of the resin case 4 in contact with the substrate 1 and an inner surface 4a of the resin case 4 are coated with heat radiating metal plating P, so that heat generated by an LED 2 can be radiated from the inner surface 4a of the resin case 4, coated with the heat radiating metal plating P, from the substrate 1 via the surface in contact with the resin case 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat dissipation structure for a heating element such as an LED installed on a substrate.

  For example, a display panel of a vehicle air conditioner is provided with an illuminating device on the front side of the panel (for example, an LED (light emitting diode)) that displays an air conditioning mode (e.g., pictograms or symbols) set by a passenger (for example, , See Patent Document 1).

  In such an illuminating device, the LED installed on the substrate is installed so as to be sealed in a space in a case made of a resin material.

JP 2002-299700 A

  As described above, since the LED is hermetically sealed in a space made of a resin material, a heat radiating plate (heat sink) is provided on the back surface of the substrate as a heat radiating measure for preventing temperature rise due to heat generated by the LED.

  However, in a display panel of a vehicle air conditioner, a plurality of electronic components are mounted on the back side of a board on which LEDs for display surface illumination are mounted on the front side, and many other parts are arranged around the board. Therefore, it is difficult to install a heat radiating plate for radiating the heat of the LED on the back surface of the substrate due to restrictions on the installation space in the display panel.

  Therefore, the present invention provides a heat-dissipating structure for a heating element that can effectively dissipate a heat-generating element such as an LED mounted on the board even when a heat sink or the like cannot be installed on the back of the board due to installation space restrictions or the like. The purpose is to provide.

  In order to achieve the above object, the present invention according to claim 1 is a heat dissipation structure of a heat generating element installed on a substrate, and is protected in a resin case on a surface of the substrate opposite to the heat generating element. In this way, an electronic component is mounted, and a heat dissipating metal film is provided on the surface of the resin case in contact with the substrate and on at least one of the inner surface and the outer surface of the resin case, and the heat generated by the heating element Is radiated from the surface of the resin case on which the metal film for heat dissipation is formed through the contact surface with the resin case.

  The present invention according to claim 2 is characterized in that the heating element is installed on the substrate so as to be sealed in a space in the heating element case made of a resin material fixed to the surface of the substrate opposite to the electronic component. It is said.

  The present invention according to claim 3 is characterized in that the resin case is fixed to the substrate by a metal screw member.

  According to the heat dissipation structure of the heat generating element of the present invention, the heat generated by the heat generating element can be dissipated from the surface of the resin case that has been subjected to metal plating for heat dissipation through the contact surface with the resin case. Since a large heat radiating surface can be obtained on the substrate without providing a dedicated heat radiating plate or the like on the substrate, it is possible to effectively radiate the heat generating elements.

1 is a schematic cross-sectional view showing a heat dissipation structure for a heat generating element according to Embodiment 1 of the present invention. The schematic sectional drawing which shows the thermal radiation structure of the heat generating element which concerns on Embodiment 2 of this invention.

Hereinafter, the present invention will be described based on the illustrated embodiments.
<Embodiment 1>
FIG. 1 is a schematic cross-sectional view showing a heat dissipation structure for a heating element according to Embodiment 1 of the present invention.

  As shown in FIG. 1, a plurality of LEDs (heat-generating elements) 2 for display illumination are provided in a display illumination case 3 made of a resin material on the front side (lower side of FIG. 1) of a substrate 1 made of a resin material. It is installed so as to be sealed in the space. A display portion (not shown) for pictograms and the like displayed by the transmitted illumination of the LEDs 3 is formed on the front surface of each LED 2 of the display illumination case 3. The display illumination case 3 is in close contact with the substrate 1 with an adhesive or the like.

  The substrate 1 provided with the LEDs 2 in the display illumination case 3 is installed on, for example, a display panel of a vehicle air conditioner and the surface of the display illumination case 3 corresponding to the air conditioning mode set by the occupant. The display pictogram etc. of (display part) are displayed by the transmitted illumination of LED2.

  A plurality of electronic components 5 such as ICs are mounted on the back surface of the substrate 1 (upper side in FIG. 1) so as to be protected by the resin case 4. Each resin case 4 is brought into close contact with the substrate 1 with an adhesive or the like, and each resin case 4 is fixed to the substrate 1 with a metal screw member 6. The tip end side of the screw member 6 is screwed into the display lighting case 3.

  In the present embodiment, a heat radiating metal plating (for example, silver plating) P is applied to the contact surface of each resin case 4 with the substrate 1, the inner surface 4a of each resin case 4 and the screw hole 4b.

  According to the heat dissipation structure of the heat generating element in the above-described embodiment, when heat is generated by light emission of the LED 2 that is the heat generating element, the heat is transferred from the substrate 1 to the resin case 4 via the contact surface with the substrate 1. Heat is transferred to and dissipated from the inner surface 4a to which the metal plating P of 4 is applied. A part of heat generated by light emission of the LED 2 is also radiated from the screw member 6 through the substrate 1.

  In this way, by applying the metal plating P for heat dissipation to the inner surface 4a of the resin case 4 with respect to the resin case 4 installed to protect the electronic component 5 to be mounted, a dedicated heat dissipation plate is provided on the substrate 1. Since a large heat radiating surface can be obtained on the substrate 1 without providing, etc., the LED 2 can be effectively radiated.

  Moreover, even if electromagnetic noise is generated from an electronic component 5 such as an IC mounted in the resin case 4 by applying the metal plating P for heat dissipation to the inner surface 4a of the resin case 4, it leaks to the outside of the resin case 4. This can be prevented.

<Embodiment 2>
FIG. 2 is a schematic cross-sectional view showing a heat dissipation structure for a heating element according to Embodiment 2 of the present invention. In addition, the same code | symbol is attached | subjected to the member which has a function similar to the thermal radiation structure of the heat generating element of Embodiment 1 shown in FIG. 1, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 2, in the heat dissipation structure of the heat generating element according to the present embodiment, the metal plating P for heat dissipation is applied to the contact surface of each resin case 4 with the substrate 1, the inner surface 4a and the outer surface 4c of each resin case 4. This is the configuration. Other configurations are the same as those of the first embodiment shown in FIG.

  Thus, in this embodiment, the metal plating P of the resin case 4 is made by applying the metal plating P for heat dissipation to the contact surface of each resin case 4 with the substrate 1, the inner surface 4a and the outer surface 4c of the resin case 4. Since heat can be radiated also from the applied outer surface 4c, the heat radiation of the LED 2 can be performed more effectively.

  Even if electromagnetic noise is generated from the electronic component 5 such as an IC mounted in the resin case 4 by applying the heat dissipating metal plating P to the inner surface 4a and the outer surface 4c of the resin case 4, the resin case 4 It is possible to more effectively prevent leakage to the outside.

  In the first embodiment, the heat dissipating metal plating P is applied to the inner surface 4a of the resin case 4, and in the second embodiment, the heat dissipating metal plating P is applied to the inner surface 4a and the outer surface 4c of the resin case 4. Alternatively, the metal plating P for heat dissipation may be applied to the contact surface between the outer surface 4c of the resin and the substrate 1 of the resin case 4.

  Moreover, in Embodiment 1, 2, although it was the structure which metal-plats as a means to provide the metal film for heat dissipation, you may make it provide a metal film by application | coating, for example, without being limited to this.

1 substrate 2 LED (heating element)
3 Display illumination case 4 Resin case 5 Electronic component 6 Screw member

Claims (3)

A heat dissipation structure for a heating element installed on a substrate,
An electronic component is mounted on the surface of the substrate opposite to the heating element so as to be protected in the resin case, and the surface of the resin case that contacts the substrate, the inner surface and the outer surface of the resin case Provide a metal film for heat dissipation on at least one side,
A heat dissipation structure for a heat generating element, wherein the heat generated by the heat generating element is radiated from a surface of the resin case on which the metal film for heat dissipation is formed through a contact surface with the resin case from the substrate.   The heating element is installed on the substrate so as to be sealed in a space in a heating element case made of a resin material fixed to a surface of the substrate opposite to the electronic component. 2. A heat dissipation structure for a heating element according to 1.   The heat dissipation structure for a heating element according to claim 1, wherein the resin case is fixed to the substrate by a metal screw member.

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