JP2010034542A - Tape for wafer processing - Google Patents

Abstract

An object of the present invention is to provide a wafer processing tape in which an adhesive layer of a dicing tape does not adhere to the upper surface of a chip and does not contaminate the chip in a dicing process.
A wafer processing tape according to the present invention comprises a dicing tape in which an adhesive layer is laminated on a base material, and a ring-shaped adhesive tape for preventing contamination of a ring frame, and the adhesive layer of the dicing tape. A wafer processing tape having the ring frame contamination prevention adhesive tape laminated thereon, wherein the ring frame contamination prevention adhesive tape has a size that can be fixed to a ring frame, and the dicing tape is a wafer. The ring frame contamination-preventing pressure-sensitive adhesive tape has an inner diameter 0 to 10 mm larger than the diameter of the wafer.
[Selection] Figure 2

Description

  The present invention relates to a wafer processing tape. More specifically, the present invention comprises a dicing tape in which an adhesive layer is laminated on a base material, and a ring-shaped ring frame contamination-preventing pressure-sensitive adhesive tape, and the ring frame contamination on the adhesive layer of the dicing tape. The present invention relates to a wafer processing tape on which a prevention adhesive tape is laminated.

  In the manufacturing process of a semiconductor device, in a dicing process, a wafer on which a predetermined circuit is formed is cut and separated into a plurality of chips using a wafer processing tape. Further, in the die bonding process following the dicing process, the chip and the wiring board are die-bonded.

  The wafer processing tape is composed of a circular dicing tape having a thermosetting adhesive layer on a substrate, and a ring-shaped ring frame contamination-preventing adhesive tape having an adhesive layer on the substrate, A wafer processing tape is known in which a base material for the ring frame contamination preventing adhesive tape is laminated on an adhesive layer of a dicing tape (see Patent Document 1). The adhesive layer of the dicing tape has the capability of fixing the wafer during dicing and capable of die-bonding the chip and the wiring board during die bonding.

  Specifically, in the dicing process using this wafer processing tape, first, a ring frame is affixed on the adhesive layer of the ring frame contamination prevention adhesive tape, and a wafer is affixed on the adhesive layer of the dicing tape. To do. In this way, the wafer is fixed to the ring frame via the wafer processing tape. Next, the wafer is cut and separated into a plurality of chips together with the adhesive layer.

  Subsequently, in the die bonding step, the chip is picked up with the adhesive layer on the back surface, and the chip and the wiring board are die-bonded by the adhesive layer.

  After picking up the chip, the wafer processing tape is peeled off from the ring frame in order to reuse the ring frame. At this time, when the wafer processing tape is used, the adhesive tape for preventing contamination of the ring frame and the ring frame are affixed, so that the wafer processing tape can be easily peeled off without leaving glue on the ring frame. Can do.

JP-A-8-213349

  By the way, in the dicing process, a dicing blade (rotary blade) is usually used, and the adhesive layer around the wafer and the adhesive tape for preventing ring frame contamination may be cut. In such a case, when the wafer processing tape is used, when the dicing is performed, the adhesive layer with cuts around the wafer is turned from the base material, or small pieces of the adhesive layer that have been cut and scattered are scattered. As a result, there is a problem of adhering to the upper surface of the chip.

  In particular, when the tackiness of the adhesive layer constituting the dicing tape of the wafer processing tape is small or the adhesive force is low, the above problem is remarkable.

  Accordingly, an object of the present invention is to provide a wafer processing tape in which the adhesive layer of the dicing tape does not adhere to the upper surface of the chip and does not contaminate the chip in the dicing process.

  The present inventors have found that the above problem can be solved by using an adhesive tape for preventing ring frame contamination having a specific inner diameter.

  That is, the wafer processing tape according to the present invention comprises a dicing tape in which an adhesive layer is laminated on a base material and a ring-shaped ring frame contamination-preventing pressure-sensitive adhesive tape, on the adhesive layer of the dicing tape. A wafer processing tape on which the ring frame contamination prevention adhesive tape is laminated, wherein the ring frame contamination prevention adhesive tape has a size that can be fixed to the ring frame, and the dicing tape is used for dicing a wafer. The ring frame contamination-preventing pressure-sensitive adhesive tape has a function that can be used for die bonding, and the inside diameter of the ring frame contamination prevention tape is 0 to 10 mm larger than the diameter of the wafer.

  The diameter of the wafer is preferably 100 to 450 mm.

  The wafer-bonded tape for wafer processing according to the present invention comprises a dicing tape in which an adhesive layer is laminated on a base material, and a ring-shaped ring frame contamination-preventing pressure-sensitive adhesive tape. A wafer processing tape in which the entire back surface of the wafer is bonded to a wafer processing tape in which the ring frame contamination prevention adhesive tape is laminated on the adhesive layer, and the ring frame contamination prevention adhesive The tape has a size that can be fixed to the ring frame, the dicing tape has a function that can be used for dicing and bonding of the wafer, and the inner diameter of the adhesive tape for preventing contamination of the ring frame is It is 0-10 mm larger than the diameter.

  According to the wafer processing tape of the present invention, in the dicing step, the adhesive layer of the dicing tape is prevented from adhering to the upper surface of the chip and contaminating the chip.

FIG. 1 is a view for explaining a wafer processing tape according to the present invention. FIG. 2 is a view for explaining a wafer processing tape according to the present invention. FIG. 3 is a diagram illustrating a ring frame. FIG. 4 is a diagram for explaining a conventional wafer processing tape.

  Hereinafter, the present invention will be specifically described.

  1 is a top view of a wafer processing tape according to the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. A wafer processing tape 100 according to the present invention is a wafer processing tape having a pre-cut configuration, a circular dicing tape 106 in which an adhesive layer 104 is laminated on a base material 102, and an adhesive layer on the base material 108. It is composed of an adhesive tape 112 for preventing contamination of a ring-shaped ring frame on which 110 is laminated. The dicing tape 106 and the ring frame contamination-preventing pressure-sensitive adhesive tape 112 are bonded to each other by the adhesive layer 104 and the base material 108. 1 and 2, the positions where the wafer 200 and the ring frame 300 are attached in the dicing process are indicated by dotted lines.

First, the dicing tape 106 constituting the wafer processing tape 100 according to the present invention will be described. The adhesive layer 104 of the dicing tape 106 is detachably laminated on the base material 102 and has a function that can be used for dicing and die bonding of the wafer 200. That is, the adhesive layer 104 can hold the wafer when the wafer 200 is diced. When the chip obtained by dicing is die-bonded, the adhesive layer can adhere the chip to the wiring board or the chip fixed on the wiring board. Specific examples of the dicing tape 106 include dicing tapes described in JP-A-60-35531 and JP-A-2-32181.

  A resin film is used for the base material 102. The surface tension of the substrate 102 is preferably 40 mN / m or less, more preferably 35 mN / m or less. When the surface tension is in the above range, the peelability from the adhesive layer is improved, and the chip can be easily picked up with the adhesive layer on the back surface. As such a base material, a material having a low surface tension may be used originally, or a material having a surface tension lowered by applying a release treatment by applying a silicone resin or the like to the surface may be used.

  Since the adhesive layer 104 has adhesiveness at room temperature or comes to have adhesiveness by heating at about 40 ° C., it can be attached to the wafer during the dicing process. Moreover, since it has thermosetting property, the chip and the wiring board can be firmly bonded and fixed by heat curing in the die bonding step. Specifically, the components constituting the adhesive layer 104 are a thermosetting resin, a binder resin, a curing agent, and a curing accelerator added as necessary. Examples of the thermosetting resin include resins such as epoxy, phenoxy, phenol, resorcinol, urea, melamine, furan, unsaturated polyester, and silicone. Examples of the binder resin include acrylic, polyester, polyvinyl ether, urethane, and polyamide. And other resins.

  The adhesive layer 104 may be made of a B-stage (semi-cured) thermosetting adhesive component.

  As a component constituting the adhesive layer 104, an ultraviolet curable component may be further blended. When such an adhesive layer 104 is irradiated with ultraviolet rays, the peelability from the base material 102 is improved, so that a chip having an adhesive layer on the back surface can be easily picked up at the time of picking up.

  The thickness of the adhesive layer 104 is usually 5 to 200 μm, preferably 10 to 100 μm.

  Even if the wafer processing tape of the present invention is composed of a dicing tape with poor tackiness at room temperature or a dicing tape with a small tack, as will be described later, in the dicing process, the adhesive layer of the dicing tape is attached to the upper surface of the chip. The tip is not worn and the chip is not easily contaminated.

Next, the ring frame contamination-preventing pressure-sensitive adhesive tape 112 constituting the wafer processing tape 100 according to the present invention will be described. The adhesive tape 112 for preventing contamination of the ring frame has a ring shape, has a hollow portion (internal opening), and has a size that can be fixed to the ring frame 300 as shown in FIG. Specifically, the inner diameter R ₃₀₀ of the ring frame ₃₀₀ is smaller than the outer diameter of the ring frame contamination preventing adhesive tape 112. In general, R ₃₀₀ is slightly larger than the inner diameter R ₁₁₂ of the ring frame contamination preventing adhesive tape 112. The ring frame 300 is usually a molded body of metal or plastic. As shown in FIG. 3, the ring frame contamination-preventing pressure-sensitive adhesive tape 112 includes a base material 108 and a pressure-sensitive adhesive layer 110, and a ring frame 300 is attached to the pressure-sensitive adhesive layer 110.

The substrate 108 constituting the ring frame contamination-preventing pressure-sensitive adhesive tape 112 is not particularly limited. For example, a polyethylene film, a polypropylene film, an ethylene-vinyl acetate copolymer film, an ethylene- (meth) acrylic acid copolymer film, Examples thereof include polyolefin films such as ethylene- (meth) acrylic acid ester copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films. Among these, in consideration of expandability, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.

  The thickness of the base material 108 is preferably 15 to 200 μm, more preferably 30 to 150 μm, and still more preferably 40 to 100 μm. If the thickness is less than 15 μm, the shape may not be maintained due to deformation when bonded to the dicing tape 106. When the thickness exceeds 200 μm, if the wafer processing tape is rolled for storage or transportation, a trace due to a step may be formed.

  Although it does not restrict | limit especially as an adhesive which forms the adhesive layer 110, For example, it is preferable to consist of an acrylic adhesive, a rubber-type adhesive, or a silicone adhesive. Among these, an acrylic pressure-sensitive adhesive is preferable in consideration of removability from the ring frame. Moreover, the adhesive which forms the adhesive layer 110 may be used independently, or 2 or more types may be mixed and used for it.

  The thickness of the pressure-sensitive adhesive layer 110 is preferably 2 to 20 μm, more preferably 3 to 15 μm, and still more preferably 4 to 10 μm. When it is less than 2 μm, sufficient adhesion may not be exhibited. When the thickness exceeds 20 μm, an adhesive residue may remain on the ring frame when it is peeled from the ring frame, which may contaminate the ring frame.

In the wafer processing tape according to the present invention, the inside diameter R ₁₁₂ of the ring frame pollution adhesive tape 112, 0 to 10 mm larger than the diameter R ₂₀₀ of the wafer to be attached. That is, R ₁₁₂ is equal to R ₂₀₀ or R ₁₁₂ is greater than R ₂₀₀ by a length greater than 0 mm and no greater than 10 mm. R ₁₁₂ is preferably larger than R _{200 by} more than 0 mm and not more than 10 mm. When the difference between R ₁₁₂ and R ₂₀₀ is 0 to 10 mm, as will be described later, in the dicing process, the adhesive layer of the dicing tape does not adhere to the upper surface of the chip, and the chip is hardly contaminated. More preferably, the difference between R ₁₁₂ and R ₂₀₀ is 0 to 5 mm. If the difference exceeds 10 mm, the chip is easily contaminated. If the difference is less than 0 mm, the wafer may be attached to the contamination-preventing adhesive tape. If the difference is less than 1 mm, the wafer is not attached to the contamination-preventing adhesive tape. The accuracy of the sticking device may be required. Accordingly, the inside diameter R ₁₁₂ of the ring frame pollution adhesive tape 112 is more preferably 1~10mm larger than the diameter R ₂₀₀ of the wafer to be attached.

The diameter R ₂₀₀ of the wafer is preferably 100 to 450 mm, specifically,
Diameter _R200 is 100mm, 150mm, 200mm, 300mm, 400mm, 450m
m wafers are used.

  The wafer processing tape 100 of the present invention is used, for example, as follows in the process of manufacturing a semiconductor. First, the ring frame 300 is adhered to the adhesive layer 110 of the adhesive tape 112 for preventing contamination of the ring frame, and the adhesive layer 104 of the dicing tape 106 is heated and pressurized to about 40 ° C. while being pressurized at room temperature. Then, the wafer 200 is adhered. In addition, the sticking conditions of the adhesive layer 110 may be the same as or different from the sticking conditions of the adhesive layer 104. In this way, the wafer 200 is fixed to the ring frame 300 via the wafer processing tape 100 (wafer-attached wafer processing tape).

Next, the wafer 200 is diced (cut and separated) together with the adhesive layer 104 by a dicing blade to obtain chips. At this time, the adhesive layer 104 and the ring frame contamination-preventing pressure-sensitive adhesive tape 112 around the wafer 200 may be cut by the dicing blade and cut. In this case, as in wafer processing tape according to the present invention, when the difference between the diameter R ₂₀₀ of the inner diameter R ₁₁₂ and the wafer 200 of the ring frame pollution adhesive tape 112 is kept to 0 to 10 mm, the adhesive The portion of the agent layer 104 that is cut during dicing is difficult to turn. In addition, the cut-in part is difficult to tear, and it is possible to suppress scattering as a small piece. Therefore, the adhesive layer 104 does not adhere to the upper surface of the chip, and the chip is not easily contaminated. Furthermore, when the difference between R ₁₁₂ and R ₂₀₀ is suppressed to 0 to 10 mm, contamination of the chip can be prevented as described above even when the adhesive layer of the dicing tape has little tack.

  In addition, after dicing, you may perform washing | cleaning and drying as needed. Further, when the adhesive layer 104 contains an ultraviolet curable component, the ultraviolet ray is irradiated before dicing or before chip pickup. This reduces chipping during dicing and improves the releasability when picking up the chip.

  Next, the chip is picked up with the adhesive layer 104 attached to the back surface. Next, this chip is die-bonded on the wiring substrate, and the adhesive layer 104 is heated and cured, thereby firmly bonding and fixing the chip and the wiring substrate.

  The wafer processing tape 100 is peeled off from the ring frame 300 after picking up the chip. The wafer processing tape 100 of the present invention is attached to the ring frame 300 via the adhesive tape 112 for preventing contamination of the ring frame. Therefore, it is difficult for adhesive to remain on the ring frame 300.

  The wafer processing tape 100 according to the present invention shown in FIGS. 1 and 2 is manufactured, for example, as follows. The dicing tape before the predetermined shape and the adhesive tape for preventing ring frame contamination are each produced based on a known coating method. A release film is laminated on the surface of the adhesive layer of the dicing tape and the surface of the adhesive layer of the adhesive tape for preventing ring frame contamination. First, leaving the release film of the adhesive tape for preventing ring frame contamination, the base material and the adhesive layer are punched out to form an opening having a predetermined inner diameter. Next, the release film of the dicing tape is peeled off, and the dicing tape is attached so that the adhesive layer of the dicing tape and the base material surface of the anti-contamination adhesive tape are combined. Further, the dicing tape and the anti-contamination adhesive tape are punched out while leaving the release film of the ring frame anti-contamination adhesive tape to form the outer edge of the wafer processing tape. At this time, the wafer forming tape is punched so that the circle forming the outer edge of the wafer processing tape and the circle of the opening of the ring frame contamination preventing adhesive tape are concentric. Finally, it winds up with the some wafer processing tape affixed on the peeling film, and stores and conveys. Moreover, in the production of the wafer processing tape described above, the processing order and the like may be appropriately changed.

  The wafer processing tape according to the present invention may be composed of a circular dicing tape in which an adhesive layer is laminated on a base material and a ring frame contamination-preventing adhesive tape that is a ring-shaped double-sided adhesive tape. Good. The double-sided pressure-sensitive adhesive tape comprises a core, a laminating pressure-sensitive adhesive layer formed on one surface thereof, and a fixing pressure-sensitive adhesive layer formed on the other surface. The laminating pressure-sensitive adhesive layer is laminated with the adhesive layer of the dicing tape, and the fixing pressure-sensitive adhesive layer is attached to the ring frame in the dicing process.

  Examples of the core material of the double-sided pressure-sensitive adhesive tape include the same materials as those of the base material 108. Among these, in consideration of expandability, a polyolene film and a plasticized polyvinyl chloride film are preferable.

  The thickness of the core material is usually 15 to 200 μm, preferably 30 to 150 μm, more preferably 40 to 100 μm. When the thickness is less than 15 μm, the shape may not be retained when the double-sided pressure-sensitive adhesive tape is bonded to a dicing tape. When the thickness exceeds 200 μm, if a wafer processing tape manufactured for storage or transportation is rolled, a trace due to a step may be formed.

  The laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive tape may be a layer made of the same pressure-sensitive adhesive or a layer made of different pressure-sensitive adhesives. The adhesive force between the fixing pressure-sensitive adhesive layer and the ring frame is appropriately selected so as to be smaller than the adhesive force between the adhesive layer and the laminating pressure-sensitive adhesive layer. Examples of such adhesives include acrylic adhesives, rubber adhesives, and silicone adhesives. Among these, an acrylic pressure-sensitive adhesive is preferable in consideration of removability from the ring frame. The pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more. The same applies to the adhesive layer for lamination.

  The thickness of the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer is the same as the thickness of the pressure-sensitive adhesive layer 110.

  Even with the wafer processing tape using the double-sided adhesive tape as the ring frame contamination prevention adhesive tape, as described above, in the dicing process, the adhesive layer of the dicing tape does not adhere to the upper surface of the chip, Not easily contaminated.

  EXAMPLES Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not limited to these Examples.

[Example]
<Production of adhesive tape>
For preparation of the pressure-sensitive adhesive layer, an aromatic polyisocyanate (Nippon Polyurethane Industry Co., Ltd.) was used for 100 parts of an acrylic pressure-sensitive adhesive (acrylic copolymer based on butyl acrylate, manufactured by Soken Chemical Co., Ltd., SK Dyne 1811L). A pressure-sensitive adhesive solution containing 3 parts of Coronate L) and 50 parts of toluene was used.

The above adhesive solution was treated with a silicone-treated release film (Lintec Corporation, SP-
PET3811 (S)) and dried in an oven at 100 ° C. for 1 minute to obtain an adhesive layer. The pressure-sensitive adhesive layer was bonded to a base film (50 μm PVC, manufactured by Okamoto Co., Ltd., PVC50 OSGP42B) and transferred onto the base film to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer thickness of 10 μm.

  In addition, the said adhesive tape comprises the adhesive tape for ring frame contamination prevention in the tape for wafer processing.

<Preparation of adhesive tape>
The components used for preparing the adhesive layer of the adhesive tape are as follows.

(A) Acrylic copolymer: Acrylic copolymer based on butyl acrylate (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., N-2359-6)
(B) -1 Epoxy resin: acrylic rubber fine particle dispersed bisphenol A type liquid epoxy resin (manufactured by Nippon Shokubai Co., Ltd., BPA328)
(B) -2 Epoxy resin: o-cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.,
Epicoat 104 S)
(B) -3 Epoxy resin: Dicyclopentadiene type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON HP-7200HH)
(C) Thermosetting agent: Dicyandiamide curing agent (Adeka Hardener 3636AS, manufactured by Asahi Denka Co., Ltd.)
(D) Curing accelerator: Imidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., Curesol 2PHZ)
(E) Coupling agent: Silane coupling agent (Mitsubishi Chemical Co., Ltd., MKC silicate MSEP2)
(F) Inorganic filler: Silica filler (manufactured by Admatechs, Admafine SC2050)
(G) Energy ray-curable component: dicyclopentadiene skeleton-containing acrylate (manufactured by Nippon Kayaku Co., Ltd., Kayrad R684)
(H) Photopolymerization initiator: Irgacure 184 (manufactured by Ciba Specialty Chemicals)
First, an adhesive composition 1 having the composition shown in Table 1 was prepared. In addition, the numerical value of a table | surface shows the weight part of solid content conversion. The adhesive composition 1 was applied to a silicone-treated release film (SP-PET 381031 manufactured by Lintec Corporation) to a thickness of 30 μm and dried in an oven at 100 ° C. for 1 minute to obtain an adhesive layer It was. Next, the adhesive layer was bonded to a substrate (polyethylene film, thickness 100 μm, surface tension 33 mN / m) and transferred onto the substrate to obtain an adhesive tape 1.

  Also, an adhesive composition 2 having the composition shown in Table 1 was prepared, and an adhesive tape 2 was obtained in the same manner as described above.

  In addition, the said adhesive tape comprises a dicing tape in the tape for wafer processing.

[Example 1]
The pressure-sensitive adhesive tape was die-cut to an inner diameter of 155 mm and laminated on the substrate side of the die-cut pressure-sensitive adhesive tape while peeling the release film of the adhesive tape 1. The laminated tape was punched to an outer diameter of 220 mm so as to be concentric with the punched circle. Before sticking on a wafer, the peeling film of the adhesive tape was peeled off. In this way, a tape 100 for wafer processing that was precut as shown in FIGS. 1 and 2 and was used with a wafer having a diameter of 150 mm was produced (see Table 2).

[Example 2]
A precut wafer processing tape 100 was produced in the same manner as in Example 1 except that the adhesive tape 2 was used (see Table 2).

[Example 3]
A pre-cut wafer processing tape 100 was produced in the same manner as in Example 1 except that the pressure-sensitive adhesive tape was punched to an inner diameter of 152 mm (see Table 2).

[Example 4]
A precut wafer processing tape 100 was produced in the same manner as in Example 1 except that the pressure-sensitive adhesive tape was die-cut to an inner diameter of 158 mm (see Table 2).

[Example 5]
The pressure-sensitive adhesive tape was die-cut to an inner diameter of 306 mm and laminated on the substrate side of the die-cut pressure-sensitive adhesive tape while peeling the release film of the adhesive tape 1. The laminated tape was punched to an outer diameter of 390 mm so as to be concentric with the punched circle. Before sticking on a wafer, the peeling film of the adhesive tape was peeled off. In this way, a tape 100 for wafer processing that was precut as shown in FIGS. 1 and 2 and was used with a wafer having a diameter of 300 mm was produced (see Table 2).

[Comparative Example 1]
The pressure-sensitive adhesive tape was die-cut to an inner diameter of 165 mm and laminated on the substrate side of the die-cut pressure-sensitive adhesive tape while peeling the release film of the adhesive tape 1. The laminated tape was punched to an outer diameter of 220 mm so as to be concentric with the punched circle. Before sticking on a wafer, the peeling film of the adhesive tape was peeled off. In this manner, a wafer processing tape 400 that was precut as shown in FIG. 4 and was used with a wafer having a diameter of 150 mm was produced (see Table 2).

[Comparative Example 2]
A pre-cut wafer processing tape 400 was produced in the same manner as in Comparative Example 1 except that the adhesive tape 2 was used (see Table 2).

<Dicing aptitude evaluation>
With respect to the wafer processing tapes produced in the examples and comparative examples, dicing suitability was evaluated as follows. First, a ring frame (inner diameter of 195 mm in Examples 1 to 4, Comparative Examples 1 and 2 and inner diameter of 350 mm in Example 5) corresponding to the wafer size as an adhesive layer (an adhesive tape for preventing contamination of the ring frame) of the wafer processing tape. ) And a wafer (Examples 1 to 4 and Comparative Examples 1 and 2 having a thickness of 350 μm and a diameter of 150 mm, and Example 5 having a thickness of 350 μm and a diameter of 300 mm) to the adhesive layer (dicing tape) of the wafer processing tape. And irradiated with ultraviolet rays (product name: RAD2000, manufactured by Lintec Corporation). Next, dicing was performed to a chip size of 5 mm × 5 mm using a dicing apparatus (DFD651, manufactured by DISCO Corporation). The amount of cut during dicing was such that the substrate was cut by 20 μm. In addition, the adhesive layer around the wafer was also cut. After the dicing, the adhesive layer with the notches around the wafer was checked by visual inspection for turning or scattering.

  The evaluation results are shown in Table 3.

As can be seen from Table 3, in the tape for wafer processing (Examples 1 to 5) in which the difference between the ring inner diameter R ₁₁₂ of the ring frame contamination prevention pressure-sensitive adhesive tape and the wafer diameter R ₂₀₀ is 10 mm or less (Examples 1 to 5), The layers were not scattered or turned over, and the chip was not contaminated.

However, in the wafer processing tape (Comparative Examples 1 and 2) in which the difference between the ring inner diameter R _{112 of} the ring frame contamination prevention adhesive tape and the wafer diameter R ₂₀₀ is 10 mm or more (Comparative Examples 1 and 2), the adhesive layer is scattered and turned up during dicing. And the chip was contaminated.

Although the dicing tape used in the examples were those tack is small, due to the difference between R ₁₁₂ and R ₂₀₀ and 10mm or less, it could prevent contamination of the chip as described above.

DESCRIPTION OF SYMBOLS 100: Wafer processing tape which concerns on this invention 102: Base material 104: Adhesive layer 106: Dicing tape 108: Base material 110: Adhesive layer 112: Adhesive tape for ring frame contamination prevention 200: Wafer 300: Ring frame 400: Conventional tape for wafer processing

Claims (3)

A dicing tape in which an adhesive layer is laminated on a base material and a ring-shaped adhesive tape for preventing contamination of a ring frame, and the adhesive tape for preventing contamination of a ring frame is laminated on the adhesive layer of the dicing tape. Wafer processing tape,
The ring frame contamination prevention adhesive tape has a size that can be fixed to the ring frame,
The dicing tape has a function usable for wafer dicing and die bonding,
The wafer processing tape, wherein an inner diameter of the ring frame contamination-preventing pressure-sensitive adhesive tape is 0 to 10 mm larger than a diameter of the wafer.   The wafer processing tape according to claim 1, wherein the wafer has a diameter of 100 to 450 mm. A dicing tape in which an adhesive layer is laminated on a base material and a ring-shaped adhesive tape for preventing contamination of a ring frame, and the adhesive tape for preventing contamination of a ring frame is laminated on the adhesive layer of the dicing tape. Wafer-attached wafer processing tape in which the entire back surface of the wafer is attached to the wafer processing tape,
The ring frame contamination prevention adhesive tape has a size that can be fixed to the ring frame,
The dicing tape has a function usable for wafer dicing and die bonding,
A wafer-bonded wafer processing tape, wherein an inner diameter of the ring frame contamination-preventing pressure-sensitive adhesive tape is 0 to 10 mm larger than a diameter of the wafer.

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