JP2010030922A - Imidazole-isocyanuric acid adduct - Google Patents
Imidazole-isocyanuric acid adduct Download PDFInfo
- Publication number
- JP2010030922A JP2010030922A JP2008193041A JP2008193041A JP2010030922A JP 2010030922 A JP2010030922 A JP 2010030922A JP 2008193041 A JP2008193041 A JP 2008193041A JP 2008193041 A JP2008193041 A JP 2008193041A JP 2010030922 A JP2010030922 A JP 2010030922A
- Authority
- JP
- Japan
- Prior art keywords
- imidazole
- isocyanuric acid
- acid adduct
- ica
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ZFSLODLOARCGLH-UHFFFAOYSA-N O=C(NC(N1)=O)NC1=O Chemical compound O=C(NC(N1)=O)NC1=O ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- RUFZNDNBXKOZQV-UHFFFAOYSA-N C1C[n]2c3ccccc3nc2C1 Chemical compound C1C[n]2c3ccccc3nc2C1 RUFZNDNBXKOZQV-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Nitrogen Condensed Heterocyclic Rings (AREA)
- Epoxy Resins (AREA)
Abstract
Description
本発明は新規なイミダゾール−イソシアヌル酸付加物に関するものである。 The present invention relates to a novel imidazole-isocyanuric acid adduct.
機械的強度や電気的絶縁特性に優れ、また接着性、耐水性、耐熱性等が良好であるところから、構造用複合材料、土木建築用材料を始めとして、電気・電子材料分野における絶縁被覆材や接着剤、LSIや発光ダイオード用の封止剤、プリント配線基盤用のインク、塗料、積層板等の原料として種々のタイプのエポキシ樹脂が広く使用されている。 Insulation coating materials in the field of electrical and electronic materials, including structural composite materials and civil engineering materials, because of their excellent mechanical strength and electrical insulation properties, as well as good adhesion, water resistance, heat resistance, etc. Various types of epoxy resins are widely used as raw materials for adhesives, adhesives, sealants for LSIs and light-emitting diodes, inks for printed wiring boards, paints, laminates, and the like.
そして、このようなエポキシ樹脂の硬化剤または硬化促進剤として、脂肪族ポリアミン類、脂肪族ポリアミン類とダイマー酸類との縮重合物であるポリアミドアミン類、芳香族アミン類、酸無水物類、イソシアネ−ト類、ブロックイソシアネート類、二塩基酸ジヒドラジド類、酸末端ポリエステル類、メルカプト末端ポリスルフィド類、イミダゾール類、3フッ化硼素アミンコンプレックス類、ジシアンジアミド、レゾールフェノール樹脂類、アミノ樹脂類等が目的に応じて適宜使い分けされている。 Further, as curing agents or curing accelerators for such epoxy resins, aliphatic polyamines, polyamidoamines that are polycondensation products of aliphatic polyamines and dimer acids, aromatic amines, acid anhydrides, isocyanates, and the like. -Tones, blocked isocyanates, dibasic acid dihydrazides, acid-terminated polyesters, mercapto-terminated polysulfides, imidazoles, boron trifluoride amine complexes, dicyandiamide, resole phenolic resins, amino resins, etc. Are used appropriately.
更に、前記イミダゾール類においても、種類の異なる数多くのイミダゾール化合物が使用されている他、イミダゾール化合物の特性を改質するために、イミダゾール化合物と酢酸、乳酸、サリチル酸、安息香酸、アジピン酸、フタル酸、クエン酸、酒石酸、マレイン酸、トリメリット酸等との塩(例えば特許文献1)とすることや、リン酸との塩(特許文献2)、あるいはイミダゾール化合物とイソシアヌル酸との付加物(特許文献3)とすること等、種々の改質方法が検討されている。 Furthermore, in the imidazoles, many different types of imidazole compounds are used, and in order to modify the properties of imidazole compounds, imidazole compounds and acetic acid, lactic acid, salicylic acid, benzoic acid, adipic acid, phthalic acid , Citric acid, tartaric acid, maleic acid, trimellitic acid salt (for example, Patent Document 1), phosphoric acid salt (Patent Document 2), or an adduct of imidazole compound and isocyanuric acid (patent Various reforming methods have been studied, such as the literature 3).
エポキシ樹脂の硬化剤または硬化促進剤として有用なイミダゾール−イソシアヌル酸付加物を提供することを目的とする。 It is an object to provide an imidazole-isocyanuric acid adduct useful as a curing agent or curing accelerator for epoxy resins.
本発明者は、前記の課題を解決するために鋭意研究を重ねた結果、イミダゾール化合物として、2−フェニル−4−ヒドロキシメチル−5−メチルイミダゾールまたは2,3−ジヒドロ−1H−ピロロ[1,2−a]ベンズイミダゾールと、イソシアヌル酸とを反応させることにより、新規なイミダゾール−イソシアヌル酸付加物が得られることを見出し、本発明を完遂するに至ったものである。
即ち、本願発明は、化学式(I)または化学式(II)で示されるイミダゾール−イソシアヌル酸付加物である。
As a result of intensive studies to solve the above-mentioned problems, the present inventor has obtained 2-phenyl-4-hydroxymethyl-5-methylimidazole or 2,3-dihydro-1H-pyrrolo [1, as an imidazole compound. 2-a] It has been found that a novel imidazole-isocyanuric acid adduct can be obtained by reacting benzimidazole with isocyanuric acid, and the present invention has been accomplished.
That is, the present invention is an imidazole-isocyanuric acid adduct represented by the chemical formula (I) or the chemical formula (II).
エポキシ樹脂の硬化剤または硬化促進剤としての利用が期待される。 Use as a curing agent or curing accelerator for epoxy resins is expected.
以下、本発明について詳細に説明する。
本発明のイミダゾール−イソシアヌル酸付加物は、2−フェニル−4−ヒドロキシメチル−5−メチルイミダゾール(以下、2P4MHZと略記する)または2,3−ジヒドロ−1H−ピロロ[1,2−a]ベンズイミダゾール(以下、TBZと略記する)と、イソシアヌル酸(以下、ICAと略記する)とを溶媒中で反応させることにより合成することができる。
Hereinafter, the present invention will be described in detail.
The imidazole-isocyanuric acid adduct of the present invention includes 2-phenyl-4-hydroxymethyl-5-methylimidazole (hereinafter abbreviated as 2P4MHZ) or 2,3-dihydro-1H-pyrrolo [1,2-a] benz. It can be synthesized by reacting imidazole (hereinafter abbreviated as TBZ) and isocyanuric acid (hereinafter abbreviated as ICA) in a solvent.
2P4MHZまたはTBZとICAは、化学量論的に反応する。即ち、2P4MHZまたはTBZとICAの使用量をモル比で1:1にすればよい。
また、反応温度は任意で構わないが、溶媒に対する原料の溶解量を高めて溶媒の使用量を少なくするため、あるいは溶媒に対する原料の溶解速度を速くするなど、イミダゾール−イソシアヌル酸付加物の合成プロセスの合理化を図るためには、差し支えの無い範囲で反応温度を高くすることが好ましい。
2P4MHZ or TBZ and ICA react stoichiometrically. That is, the amount of 2P4MHZ or TBZ and ICA used may be 1: 1 by molar ratio.
The reaction temperature may be arbitrary, but the process for synthesizing the imidazole-isocyanuric acid adduct is to reduce the amount of the solvent used by increasing the amount of the raw material dissolved in the solvent, or to increase the rate of dissolution of the raw material in the solvent. In order to achieve rationalization, it is preferable to raise the reaction temperature within a safe range.
具体的な合成方法としては、例えば、2P4MHZおよびICAを水に懸濁させたスラリーを調製し、該スラリーを撹拌しながら所定時間加熱し、その後、同スラリー(反応液)を冷却して、析出物(反応生成物)を濾別単離する。反応生成物は、常法に従って、洗浄および乾燥加熱すればよい。 As a specific synthesis method, for example, a slurry in which 2P4MHZ and ICA are suspended in water is prepared, the slurry is heated for a predetermined time while stirring, and then the slurry (reaction solution) is cooled to precipitate. The product (reaction product) is isolated by filtration. What is necessary is just to wash | clean and dry-heat a reaction product according to a conventional method.
前記の反応に使用される溶媒には特に制限はないが、熱時においてICAを溶解させることができるものであればよい。本願発明の実施においては、安価であり且つ廃液処理の容易な水やイソプロピルアルコールが好ましく使用できる。
なお、反応生成物の純度を良好なものとするためには、溶媒の使用量を原料であるイミダゾール化合物とICAの総量に対して、5〜10倍量(重量比)より多くすることが好ましい。
Although there is no restriction | limiting in particular in the solvent used for the said reaction, What is necessary is just a thing which can dissolve ICA at the time of a heat | fever. In the practice of the present invention, water and isopropyl alcohol, which are inexpensive and easy to dispose of, can be preferably used.
In order to improve the purity of the reaction product, it is preferable that the amount of the solvent used is more than 5 to 10 times (weight ratio) with respect to the total amount of the imidazole compound and ICA as raw materials. .
以下、本発明を実施例によって具体的に説明するが、本発明はこれらに限定されるものではない。なお、実施例に使用した原料は次のとおりである。
・2P4MHZ:四国化成工業社製「キュアゾール 2P4MHZ」
・TBZ:四国化成工業社製「キュアゾール TBZ」
・ICA:四国化成工業社製「イソシアヌル酸粉末品」
EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In addition, the raw material used for the Example is as follows.
・ 2P4MHZ: “CURESOL 2P4MHZ” manufactured by Shikoku Kasei Kogyo Co., Ltd.
TBZ: “Curesol TBZ” manufactured by Shikoku Kasei Kogyo Co., Ltd.
・ ICA: “Isocyanuric acid powder product” manufactured by Shikoku Kasei Kogyo Co., Ltd.
〔実施例1〕
2P4MHZを37.6g(0.2モル)と、ICAを25.8g(0.2モル)と、水380gをフラスコに投入し、攪拌しながら12時間加熱還流した。なお、反応液は加熱前後においてスラリー状を呈しており、2P4MHZおよびICAは加熱時に徐々に溶解しながら直ちに反応して、難溶性の生成物が析出していると推測される。次いで、反応液を室温まで冷却後、吸引濾過を行なって単離した固形分を80℃で12時間乾燥させ、白色粉末状の結晶を53.9g(収率85%)得た。
[Example 1]
27.6 g (0.2 mol) of 2P4MHZ, 25.8 g (0.2 mol) of ICA, and 380 g of water were charged into the flask, and the mixture was heated to reflux for 12 hours while stirring. The reaction solution is in a slurry state before and after heating, and 2P4MHZ and ICA react immediately while gradually dissolving at the time of heating, and it is estimated that a hardly soluble product is precipitated. Subsequently, after cooling the reaction liquid to room temperature, the solid content isolated by suction filtration was dried at 80 ° C. for 12 hours to obtain 53.9 g (yield 85%) of white powdery crystals.
得られた結晶の融点は242−247℃であり、原料の融点(2P4MHZ:191−195℃、ICA:融点なし)とは異なる値を示した。
また同結晶の赤外線吸収スペクトルは、図1に示したとおりであり、前記の化学式(I)で示される物質(2P4MHZ・ICA付加物)であるものと同定した。
The melting point of the obtained crystal was 242-247 ° C., which was different from the melting point of the raw material (2P4MHZ: 191-195 ° C., ICA: no melting point).
Further, the infrared absorption spectrum of the crystal was as shown in FIG.
〔実施例2〕
TBZを39.5g(0.25モル)と、ICAを32.4g(0.25モル)と、イソプロピルアルコール600gをフラスコに投入し、攪拌しながら加熱を行なった。反応液中の原料は90℃で完溶し、その状態で10分間保持した後室温まで冷却し、反応生成物を析出させた。次いで、反応液を吸引濾過して単離した固形分を80℃で12時間乾燥させ、白色粉末状の結晶を58.4g(収率81%)得た。
[Example 2]
TBZ (39.5 g, 0.25 mol), ICA (32.4 g, 0.25 mol), and isopropyl alcohol (600 g) were added to the flask and heated with stirring. The raw material in the reaction solution was completely dissolved at 90 ° C., kept in that state for 10 minutes, and then cooled to room temperature to precipitate the reaction product. Subsequently, the solid content isolated by suction filtration of the reaction solution was dried at 80 ° C. for 12 hours to obtain 58.4 g (yield 81%) of white powdery crystals.
得られた結晶の融点は存在しなかったが、175℃での分解を確認した。
また同結晶の赤外線吸収スペクトルは、図2に示したとおりであり、前記の化学式(II)で示される物質(TPZ・ICA付加物)であるものと同定した。
Although the melting point of the obtained crystal did not exist, decomposition at 175 ° C. was confirmed.
The infrared absorption spectrum of the crystal was as shown in FIG. 2 and was identified as a substance (TPZ · ICA adduct) represented by the chemical formula (II).
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008193041A JP5227105B2 (en) | 2008-07-28 | 2008-07-28 | Imidazole-isocyanuric acid adduct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008193041A JP5227105B2 (en) | 2008-07-28 | 2008-07-28 | Imidazole-isocyanuric acid adduct |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010030922A true JP2010030922A (en) | 2010-02-12 |
| JP5227105B2 JP5227105B2 (en) | 2013-07-03 |
Family
ID=41735872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008193041A Expired - Fee Related JP5227105B2 (en) | 2008-07-28 | 2008-07-28 | Imidazole-isocyanuric acid adduct |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5227105B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019212591A1 (en) * | 2019-08-22 | 2021-02-25 | Tesa Se | Process for sheathing elongated material, in particular lines |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53116391A (en) * | 1977-03-18 | 1978-10-11 | Shikoku Kasei Kougiyou Kk | Novel imidazoleisocyanuric adduct synthesizing method thereof polyepoxy hardening method containing same as main component polyepoxy hardening method using same as hardening improver and method of pur |
| JPS61218578A (en) * | 1985-03-22 | 1986-09-29 | Shikoku Chem Corp | Novel imidazoline-isocyanuric acid adduct, synthesis of said adduct, and curing of polyepoxy resin containing said adduct as essential component |
| JPS61235426A (en) * | 1985-04-11 | 1986-10-20 | Shikoku Chem Corp | Curing of polyepoxy resin |
| JP2009203311A (en) * | 2008-02-27 | 2009-09-10 | Shikoku Chem Corp | Thermosetting resin composition |
| JP2010095645A (en) * | 2008-10-17 | 2010-04-30 | Hitachi Chem Co Ltd | Epoxy resin composition having low coefficient of thermal expansion |
-
2008
- 2008-07-28 JP JP2008193041A patent/JP5227105B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53116391A (en) * | 1977-03-18 | 1978-10-11 | Shikoku Kasei Kougiyou Kk | Novel imidazoleisocyanuric adduct synthesizing method thereof polyepoxy hardening method containing same as main component polyepoxy hardening method using same as hardening improver and method of pur |
| JPS61218578A (en) * | 1985-03-22 | 1986-09-29 | Shikoku Chem Corp | Novel imidazoline-isocyanuric acid adduct, synthesis of said adduct, and curing of polyepoxy resin containing said adduct as essential component |
| JPS61235426A (en) * | 1985-04-11 | 1986-10-20 | Shikoku Chem Corp | Curing of polyepoxy resin |
| JP2009203311A (en) * | 2008-02-27 | 2009-09-10 | Shikoku Chem Corp | Thermosetting resin composition |
| JP2010095645A (en) * | 2008-10-17 | 2010-04-30 | Hitachi Chem Co Ltd | Epoxy resin composition having low coefficient of thermal expansion |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5227105B2 (en) | 2013-07-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101438863B1 (en) | Catalyst for curing epoxides | |
| CN104212394B (en) | A kind of room temperature curing epoxy resin adhesive and preparation method thereof | |
| TW201004924A (en) | Bismaleamic acid, bismaleimide and cured product thereof | |
| US20150175740A1 (en) | Processing-friendly dianhydride hardener for epoxy resin systems based on 5,5'-carbonylbis(isobenzofuran-1,3-dione) | |
| US20150175738A1 (en) | Processing-friendly dianhydride hardener for epoxy resin systems based on 5,5'-oxybis(isobenzofuran-1,3-dione) | |
| JP5227105B2 (en) | Imidazole-isocyanuric acid adduct | |
| CN100335482C (en) | Method for converting perylen-3,4:9,10-tetracarboxylic acid diimides into a form suitable for use as a fluorescent dye | |
| WO2003048170A1 (en) | Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same | |
| JPH09143250A (en) | One pack type epoxy resin composition | |
| JPH06100662A (en) | Curing agent for epoxy resin and curing accelerator for epoxy resin | |
| JP2008201719A (en) | Method for producing tetracarboxylic acid and acid dianhydride | |
| CN102432833A (en) | Phosphorus-containing epoxy resin | |
| CN106187855B (en) | A method of 2- (hetero) aryl indole class compound is prepared using deep eutectic solvent | |
| JP4181797B2 (en) | Novel ester compound having isocyanuric acid ring and epoxy resin composition using the compound | |
| KR102049646B1 (en) | Production method for inclusion compound | |
| JP2008074726A (en) | 2-methylimidazole double salt and method for curing epoxy resin | |
| JP5445166B2 (en) | Curing agent, curable resin composition, adhesive for semiconductor and method for controlling curing reaction | |
| JP2004010901A (en) | 2-phenylimidazole dihydrogen phosphate as accelerator for acid anhydride curing agent in one-pack epoxy composition | |
| JP5445165B2 (en) | Curing agent, curable resin composition and semiconductor adhesive | |
| WO2016117298A1 (en) | Crystalline polymorphism of inclusion compound, curable composition containing same, and cured product | |
| CN104370966B (en) | A kind of metallo-organic compound and preparation method thereof | |
| JP5549239B2 (en) | Curing agent, curable resin composition, adhesive for semiconductor and method for controlling curing reaction | |
| CN106867366B (en) | High-efficiency flame-retardant epoxy resin coating | |
| JP2000254513A (en) | Production of latent catalyst | |
| JP2006124545A (en) | Method for producing aromatic polyamide resin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110107 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130128 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130311 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130315 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5227105 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160322 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |