JP2010010413A - Multilayer printed wiring board, and multilayer printed wiring board device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board and a multilayer printed wiring board device, capable of integrating component mounting steps in one step. <P>SOLUTION: The multilayer printed wiring board device is provided which bears BGA type electronic parts (BGA parts). A power supply via connected to a power supply layer and a ground via connected to a ground layer are provided in a central area surrounded by a power supply pad and a ground pad connected to BGA components. With this arrangement, a decoupling effect caused by a C component occurs between vias. The decoupling effect caused by a C component also occurs between layers, because the power supply via is connected to the power supply layer and the ground via is connected to the ground layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer printed wiring board on which electronic components are mounted, and a multilayer printed wiring board device on which the electronic components are mounted.

  2. Description of the Related Art Conventionally, a multilayer printed wiring board device on which, for example, a BGA (Ball Grid Array) type semiconductor integrated circuit component (hereinafter abbreviated as “BGA component”) is well known (for example, Patent Document 1, 2).

  As shown in FIGS. 6 and 7, the conventional multilayer printed wiring board device 101 includes a multilayer printed wiring board 102 having a multilayer structure, a BGA component 107, and a decoupling capacitor 108. The BGA component 107 is mounted on the component surface 102A that is the upper surface of the multilayer printed wiring board 102, and the decoupling capacitor 108 is mounted on the solder surface 102B that is the lower surface of the multilayer printed wiring board 102.

  The decoupling capacitor 108 is mounted in the vicinity of the power supply pad 120 connected to the BGA component 107 in order to reduce noise generated when power is supplied to the BGA component 107. More specifically, as shown in FIG. 6, the decoupling capacitor 108 is mounted on the solder surface 102 </ b> B at a position corresponding to the back side (below the BGA component 107).

JP 2004-327993 A JP 2006-324444 A

  However, since the conventional multilayer printed wiring board device 101 needs to mount electronic components on the component surface 102A and the solder surface 102B as described above, the mounting process on the component surface 102A and the solder surface are necessary as the component mounting process. At least two steps of mounting to 102B were necessary.

  Such a configuration in which the electronic component is mounted on the component surface 102A and the solder surface 102B has a problem that the component mounting process is at least two steps, which hinders the shortening of the manufacturing tact and the reduction of the manufacturing cost. . The multilayer printed wiring board device 101 is also required to reduce the number of components in order to achieve weight reduction or size reduction.

  Therefore, an object of the present invention is to provide a multilayer printed wiring board and a multilayer printed wiring board device that can solve the above problems.

  The present invention relates to an electronic device having a structure in which a power source layer composed of a power plane connected to a power source, a ground layer composed of a ground plane connected to the ground, and terminals are formed in a grid pattern so as to surround the central area. The present invention relates to a multilayer printed wiring board having at least one circuit pattern layer composed of circuit patterns on which components are mounted.

  Here, an electronic component having a structure in which terminals are formed in a lattice shape so as to surround a central area is a grid array component in which terminals are formed in a lattice shape. It means nothing.

  A plurality of pads for mounting electronic components are provided in the circuit pattern layer corresponding to the positions of the terminals, and an area of the circuit pattern layer surrounded by the plurality of pads has a power supply connected to the power supply layer. A via and a ground via connected to the ground layer are provided.

  In such a configuration, since a plurality of power supply vias and ground vias are concentrated on the position of the multilayer printed wiring board corresponding to the central part of the electronic component, a capacitance component is provided between the power supply via and the ground via. [Also referred to as “capacitance component”. (Hereinafter abbreviated as “component C”)] occurs. In addition, since the power plane and the ground plane are connected to the power supply and the ground, respectively, a decoupling effect due to the C component also occurs between the power plane and the ground plane.

  Here, the decoupling effect is to generate a capacitor for short-circuiting the AC component between the power supply line and the ground line, and noise generated during the operation of the electronic component is reduced to a high-speed circuit around the electronic component as much as possible. It means that it is confined inside so that it does not flow to external wiring.

  Therefore, in the past, it was necessary to mount a capacitor on the solder surface for the purpose of reducing noise. However, the multilayer printed wiring board of the present invention can reduce noise by the decoupling effect without mounting a capacitor. Is possible. Thereby, since the process of mounting electronic components on the solder surface can be omitted, the manufacturing process can be simplified as a whole, and the number of parts can be reduced.

  In the above-described configuration, the power supply vias and the ground vias may be arranged alternately so as to be adjacent to each other. With this configuration, the decoupling effect due to the C component between the power supply via and the ground via can be further improved.

  In the above-described configuration, it is desirable that all or a part of the power supply via and the ground via is a through hole. When such a through hole is employed, the length of the via can be maximized, so that the decoupling effect due to the C component between the power supply via and the ground via can be further improved.

  The present invention also relates to a multilayer printed wiring board device in which electronic components having a structure in which terminals are formed in a lattice shape so as to surround an area in the center are mounted on a plurality of pads of the multilayer printed wiring board described above. With this configuration, it is possible to provide a multilayer printed wiring board device that exhibits the decoupling effect described above.

  In the multilayer printed wiring board device described above, a capacitor in which one terminal is connected to the power supply plane and the other terminal is connected to the ground plane may be mounted near the outer periphery of the electronic component. With this configuration, the decoupling effect for noise reduction can be further improved.

  According to the present invention, since the process of mounting the capacitor on the solder surface can be omitted, the manufacturing process can be simplified and the number of electronic components mounted on the multilayer printed wiring board can be reduced.

  The best mode of the present invention will be described below with reference to the drawings.

FIG. 1 is a longitudinal side view of a multilayer printed wiring board device, FIG. 2 is a partially cutaway plan view of the multilayer printed wiring board device, and FIG. 3 is an enlarged plan view showing FIG.
As shown in FIG. 1, a multilayer printed wiring board device 1a on which a BGA component 7 as an electronic component is mounted includes a multilayer printed wiring board 2 having a multilayer structure made of an insulating material, and is an upper surface of the multilayer printed wiring board 2. A BGA component 7 is mounted (arranged) on the circuit pattern layer having the component surface 2A. A solder surface 2B is formed on the lower surface of the multilayer printed wiring board 2.

  Here, in the BGA component 7, a plurality of terminals 7a are formed in a square shape in a lattice shape so as to surround an area at the center of the lower surface. The plurality of terminals 7a are a power supply terminal, a ground terminal, and other signal terminals.

  Further, as shown in FIG. 2, each terminal 7a of the BGA component 7 is connected to the circuit pattern layer provided with the component surface 2A of the multilayer printed wiring board 2 (corresponding to each terminal 7a). A ground pad 20B and other pads 20C are formed.

  Here, the power supply pad 20 </ b> A and the ground pad 20 </ b> B are formed in a square shape so as to surround an area in the component surface 2 </ b> A (circuit pattern layer) corresponding to the central area of the BGA component 7. The power pads 20A and the ground pads 20B are alternately arranged along the outer edge of the area on the component surface 2A (circuit pattern layer) corresponding to the central area of the BGA component 7, as shown in FIGS. Has been.

  Thus, the pads 20A, 20B and 20C are arranged corresponding to the arrangement of the terminals 7a of the BGA component 7. When the BGA component 7 is mounted, the power pad 20A is connected to the terminal 7a that is the power terminal of the BGA component 7, and the ground pad 20B is connected to the terminal 7a that is the ground terminal of the BGA component 7. The other pads 20C are connected to other signal terminals of the BGA component 7. As described above, when the pads 20A, 20B, and 20C are electrically connected to the terminals 7a of the BGA component 7, various signals such as data signals and control signals can be input / output to / from the BGA component 7.

  Further, in the multilayer printed wiring board 2, as shown in FIG. 1, a power layer 4A composed of a power plane 4a made of a conductive material, and a ground layer composed of a ground plane 4b arranged below the power plane 4a. 4B. The power plane 4a is connected to a power source, and the ground plane 4b is connected to the ground.

  Between the power supply layer 4 and the ground layer 4B, a signal pattern layer 4C that is electrically connected to the terminals 7a other than the power supply terminal and the ground terminal of the BGA component 7 is disposed. Note that mounting components such as capacitors are not mounted on the solder surface 2B of the multilayer printed wiring board 2.

  As shown in FIG. 2, in the multilayer printed wiring board device 1a of the present invention, the upper surface of the multilayer printed wiring board 2 is exposed without the pads 20A to 20C formed on the component surface 2A (circuit pattern layer). A square area is a central area F. In other words, the central area F is surrounded by the pad 20 with the power pad 20A and the ground pad 20B. In the central area F, the through holes 10 are arranged in a lattice pattern. In other words, the central area F is an area on the component surface 2A (circuit pattern layer) corresponding to the central area where there is no grid-like terminal of the BGA component 7 (electronic component).

  In this central area F, as shown in FIGS. 1 and 3, a power through hole 10A (power via) connected to the power plane 4a and a ground through hole 10B (ground via) connected to the ground plane 4b are formed. The multilayer printed wiring board 2 may penetrate (penetrate) in the thickness direction (stacking direction). In this embodiment, as shown in FIG. 3, through holes 10 are provided in the central area F with 4 × 4 lattice patterns, and power supply through holes 10A and ground through holes 10B are alternately arranged adjacent to each other. Arranged.

  As described above, by arranging the through hole 10 in the central plane area (central area F) where the pads 20A to 20C are not formed on the component surface 2A, the C component is generated between the power supply through hole 10A and the ground through hole 10B. A decoupling effect occurs. Further, since the through hole 10 is connected to the power supply plane 4a or the ground plane 4b, a decoupling effect due to the C component also occurs between the planes 4a and 4b.

  Therefore, in the past, a capacitor was mounted on the solder surface 2B for the purpose of reducing noise, but even if such a capacitor is not mounted, it is possible to reduce noise due to the decoupling effect.

This eliminates the manufacturing process of mounting the capacitor on the solder surface 2B, thereby simplifying the manufacturing process. In addition, the central area F can be effectively used, and the number of components mounted on the multilayer printed wiring board 2 can be reduced.
Since the power supply through holes 10A and the ground through holes 10B arranged in a grid pattern in the central area F are alternately arranged, the decoupling effect due to the C component between the through holes 10 is improved as much as possible. .

  A multilayer printed wiring board device 1b according to the second embodiment will be described with reference to FIGS. 4 is a longitudinal side view of the multilayer printed wiring board device, and FIG. 5 is a partial plan view of the multilayer printed wiring board device. In addition, about the matter which is common in the multilayer printed wiring board apparatus 1a which concerns on the above-mentioned Example 1, the same code | symbol is attached | subjected and description is abbreviate | omitted or abbreviate | omitted.

  As shown in FIGS. 4 and 5, in the multilayer printed wiring board device 1b, vias provided in the central area F are interlayer vias (IVH) 10C and 10D connecting specific layers. Specifically, the power supply interlayer via 10C (power supply via) is connected to the power supply plane 4a, and the ground interlayer via 10D (ground via) is connected to the ground plane 4b.

  In the multilayer printed wiring board device 1b, the capacitor 30 is mounted outside the formation area of the pads 20A to 20C on the component surface 2A, that is, near the outer periphery of the BGA component 7. Here, one terminal (not shown) of the capacitor 30 is connected to the power plane 4a, and the other terminal (not shown) is connected to the ground plane 4b.

  Since the multilayer printed wiring board device 1b does not have to mount a decoupling capacitor for reducing noise on the solder surface 2B, a capacitor 30 can be newly mounted at a position far from the power supply pad 20A on the component surface 2A. . With this configuration, all the mounting components mounted on the multilayer printed wiring board device 1b can be mounted only on the component surface 2A, so that the component mounting process can be performed in one step. When the decoupling effect by only the via is weak, the capacitor 30 can be disposed to improve the decoupling effect.

  The above-described embodiments have been illustrated for the purpose of explanation, and the present invention is not limited thereto, and can be recognized by those skilled in the art from the description of the claims, the specification, and the drawings. Modifications, deletions, and additions are possible without departing from the technical idea of the present invention.

  For example, the multilayer printed wiring board 2 only needs to include at least one power source layer 4A, a ground layer 4B, and a circuit pattern layer 4C. However, the multilayer printed wiring board 2 is not limited to the above-described embodiment, and is set to a plurality of layers. Also good.

  Further, the vias arranged in the central area F may be all through holes or part thereof may be through holes. In the description given so far, the component surface 2A of the multilayer printed wiring board device 1a, 1b according to the present invention has been described as the upper surface and the solder surface 2B as the lower surface. It is not limited.

  In the above-described embodiments, the BGA component is used as the electronic component. However, the present invention is not limited to this, and the electronic component has a structure in which terminals are formed in a lattice shape so as to surround the central area. As long as it has. For example, the electronic component is a grid array component such as a PGA (Pin Grid Array) in which terminals are formed in a lattice shape so as to surround a central area.

It is a vertical side view of the multilayer printed wiring board device according to the first embodiment. 1 is a partially cutaway plan view of a multilayer printed wiring board device according to Embodiment 1. FIG. FIG. 3 is an enlarged plan view illustrating the multilayer printed wiring board device according to the first embodiment, which is an enlarged view of FIG. 2. It is a vertical side view of the multilayer printed wiring board device according to the second embodiment. 6 is a partial plan view of a multilayer printed wiring board device according to Example 2. FIG. It is a side view of the conventional multilayer printed wiring board apparatus. It is a partially cutaway plan view of a conventional multilayer printed wiring board device.

Explanation of symbols

1a, 1b Multilayer printed wiring board device 2A Component side (board surface)
4a Power plane 4A Power layer 4b Ground plane 4B Ground layer 4c Circuit pattern 4C Circuit pattern layer 7 BGA component (electronic component)
10A Power through hole (power via)
10B Ground through hole (Grand via)
10C Power supply interlayer via 10C (Power supply via)
10D Ground interlayer via 10D (Ground via)
20A Power supply pad 20B Ground pad 30 Capacitor F Central area

Claims (5)

A power layer consisting of power planes connected to the power source,
A ground layer consisting of a ground plane connected to the ground;
A multilayer printed wiring board having at least one circuit pattern layer comprising a circuit pattern on which an electronic component having a structure in which terminals are formed in a lattice shape so as to surround an area in the center part,
A plurality of pads for mounting the electronic component is provided in the circuit pattern layer corresponding to the position of the terminal,
The area of the circuit pattern layer surrounded by the plurality of pads includes a power supply via connected to the power supply layer and a ground via connected to the ground layer.   The multilayer printed wiring board according to claim 1, wherein the power supply via and the ground via are alternately arranged so as to be adjacent to each other.   The multilayer printed wiring board according to claim 1, wherein all or part of the power supply via and the ground via are through holes.   The multilayer which mounted the electronic component which has the structure where the terminal was formed in the grid | lattice form so that the area of a center part might be enclosed in these pads of the multilayer printed wiring board as described in any one of Claims 1-3 Printed circuit board equipment   The multilayer printed wiring board device according to claim 4, wherein a capacitor having one terminal connected to the power supply plane and the other terminal connected to the ground plane is mounted near the outer periphery of the electronic component.

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