JP2010005987A - Non-contact optical writing apparatus and non-contact optical writing system - Google Patents

Abstract

High-quality data recording is performed without degrading the quality of data recording even when the interval with a thermal recording medium changes.
An imaging lens is moved in the same direction S1 as an optical axis direction of a line-shaped laser beam in accordance with a distance between object images between a semiconductor laser array and an object, and the line-shaped laser beam is generated. An image is formed on the thermal recording medium 3.
[Selection] Figure 1

Description

  The present invention relates to a non-contact optical writing device and a non-contact optical writing system for recording and erasing data on a non-contact and rewritable thermal recording medium.

There are thermal writing methods using leuco dye-based and diazo compound-based thermal materials. Further, there is a reversible thermosensitive recording paper that can repeat color development and color erasing at a specific temperature. There is a technique for recording and erasing data without contact with such a rewritable thermal recording medium. For example, Patent Document 1 discloses an information recording medium in which an infrared absorption layer that absorbs infrared rays and generates heat and a thermal recording layer are sequentially laminated on a substrate as a method for developing and erasing a non-contact and reversible thermosensitive material. To do. Of these, the thermosensitive recording layer comprises a thermosensitive coloring layer or a metal thin film layer. This heat-sensitive recording layer is removed by color development, discoloration or melting by the heat of the infrared absorption layer. Patent Document 1 discloses a recording method in which an infrared absorption layer is heated by irradiation with an infrared laser, and the heat-sensitive recording layer is colored, discolored, or melted and removed by this heat.
Japanese Patent No. 3266922

  However, in Patent Document 1, data can be recorded in a non-contact manner on a thermal recording medium by irradiating with an infrared laser. However, when data is recorded on the thermal recording medium, it is emitted from a laser light source. Therefore, it is necessary to focus the infrared laser emitted from the laser light source and form an image on the thermal recording medium. However, the distance between the laser light source and the thermal recording medium is not always kept constant and often changes in most cases.

  For example, as a data recording method, when a thermal recording medium is attached to an object and the object is conveyed by a conveyance mechanism or the like, a laser beam is imaged on the thermal recording medium affixed to the object. The data is recorded. In such a data recording method, since the position of the object placed on the transport mechanism is different for each object, the distance between the laser light source and the thermal recording medium changes for each object. In addition, even when deformation or the like occurs in the portion of the object where the thermal recording medium is attached, the distance between the laser light source and the thermal recording medium changes.

  When the distance between the laser light source and the thermal recording medium changes in this way, the diameter of the laser beam irradiated onto the thermal recording medium changes, and this change changes the amount of energy per unit area on the thermal recording medium. As a result, the quality of data recording on the thermal recording medium is degraded.

  An object of the present invention is to provide a non-contact optical writing apparatus and a non-contact optical writing system that can perform high-quality data recording without degrading the quality of data recording even if the distance from the thermal recording medium changes. There is.

  A non-contact optical writing apparatus according to a main aspect of the present invention is a non-contact optical writing apparatus for recording and erasing data on a rewritable thermosensitive recording medium. And a laser beam emitted from the semiconductor laser array with respect to the thermal recording medium provided to be movable in the same direction as the optical axis direction of each laser beam emitted from the semiconductor laser array. And an imaging lens for imaging.

  A non-contact optical writing system according to a main aspect of the present invention includes a transport mechanism that transports an object on which a rewritable thermal recording medium capable of recording and erasing data, and a plurality of light emitting units each emitting a laser beam. The laser diodes are arranged in a line, and are moved in the same direction as the optical axis direction of each laser beam emitted from the semiconductor laser array. And an imaging lens that forms an image of each laser beam emitted from the semiconductor laser array on a thermal recording medium attached to an object being conveyed by a conveyance mechanism.

  According to the present invention, it is possible to provide a non-contact optical writing apparatus and a non-contact optical writing system that can perform high-quality data recording without degrading the quality of data recording even if the distance from the thermal recording medium changes. .

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
1 to 3 show a configuration diagram of a non-contact optical writing apparatus, FIG. 1 is a side view, FIG. 2 is a front view, and FIG. 3 is an external view. The non-contact optical writing device 1 is configured such that, for example, data relating to the object 2 on the thermal recording medium 3 attached to the object 2 such as a cardboard or a container, for example, an item stored in the object 2 Record data on prices, goods, etc.

  The heat-sensitive recording medium 3 is a rewritable and reversible medium that repeats color development and decoloring by heating control at a specific temperature, and enables heat-sensitive recording and heat-erasing. For example, as shown in FIG. 4, when the melting point of 180 ° C. or higher is applied, the heat-sensitive recording medium 3 is in a state where the dye existing in the print layer and the developer are melted together. It crystallizes while being mixed with the colorant and develops, for example, black. On the other hand, when the thermal recording medium 3 is cooled slowly, the dye and the developer are crystallized. As a result, the heat-sensitive recording medium 3 cannot be maintained in a colored state but is in a decolored state. Furthermore, when the thermal recording medium 3 is heated for a certain time at a temperature not higher than the melting point of the dye and the developer, the dye and the developer are gradually separated and crystallized to be in a decolored state. The temperature of the decoloring region is, for example, about 130 ° C. to 180 ° C.

  The non-contact optical writing device 1 includes a semiconductor laser array 4 and an imaging lens 5. Among these, the semiconductor laser array 4 is formed by arranging a plurality of light emitting points 4a each emitting a laser beam in a line as shown in FIG. 3, for example. The semiconductor laser array 4 outputs a line-shaped laser beam 4b by emitting each laser beam from each light emitting point 4a. This semiconductor laser array 4 has an emission wavelength in the near infrared region, for example, 808 nm, and has a high output of several W. Therefore, the semiconductor laser array 4 is fixed to, for example, a heat sink. This heat radiating plate radiates heat generated by the semiconductor laser array 4 by forced cooling.

The imaging lens 5 is provided on the optical axis L of the line-shaped laser beam 4b emitted from the semiconductor laser array 4, and the line-shaped laser beam 4b emitted from the semiconductor laser array 4 is placed on the thermal recording medium 3. Form an image. The imaging lens 5 is formed in such a size that the vignetting state is not different between the both end portions and the central portion of the semiconductor laser array 4.
In other words, the length of the imaging lens 5 in the direction corresponding to the line direction K of the semiconductor laser array 14 is longer than the length of the semiconductor laser array 14 in the line direction K, and the aperture is increased. Further, the length of the imaging lens 5 in the direction corresponding to the direction perpendicular to the line direction K of the semiconductor laser array 4, that is, the thickness of the imaging lens 5 is the central portion of the imaging lens 5 as shown in FIG. For example, it is formed in a rectangular parallelepiped shape having a thickness that does not cause vignetting.
The imaging lens 5 has the same distance relationship (distance between object images) between each light emitting point 4a of the semiconductor laser array 4 and the thermal recording medium 3, that is, forms an image with each light emitting point 4a of the semiconductor laser array 4. The first distance A with the lens 5 and the second distance B between the imaging lens 5 and the thermal recording medium 3 are arranged so as to be approximately 1: 1 (A = B). The imaging lens 5 is a semiconductor when, for example, the magnification is “1 ×” and the relationship between the first distance A and the second distance B is approximately 1: 1 (A = B). An optical image of each light emitting point 4 a of the laser array 4 is formed on the thermal recording medium 3.

  Thus, it is ideal to arrange the relationship between the first distance A and the second distance B at approximately 1: 1 (A = B). However, in practice, for example, the distance between the object images between the semiconductor laser array 4 and the object 2 is different due to, for example, a difference in the arrangement position of the object 2 or deformation of a portion of the object 2 where the thermal recording medium 3 is attached. As the distance between the semiconductor laser array 4 and the object 2 changes, the first distance A and the second distance B also change. If the semiconductor laser array 4 is fixed on the fixed block 6, the second distance B changes.

However, the imaging lens 5 is provided so as to be movable in the same direction S1 as the direction of the optical axis L of the linear laser beam 4b emitted from the semiconductor laser array 4 (hereinafter referred to as the optical axis direction). Specifically, a distance sensor 7, a lens drive control unit 8-1 and a lens moving mechanism 8-2 are provided. The distance sensor 7 is provided on the fixed block 6. The distance sensor 7 measures the distance to the thermal recording medium 3 and outputs a distance measurement signal. If the distance sensor 7 is provided at the same position as each light emitting point 4a of the semiconductor laser array 4 on the optical axis L of the line-shaped laser beam 4b, the light emitting point 4a of the semiconductor laser array 4 and the thermal recording. The distance between the object images with the medium 3 is measured.
The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output.

  The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. Move to. The lens moving mechanism 8-2 includes, for example, a motor and a rotation-linear motion conversion mechanism that converts the rotation of the shaft of the motor into the moving direction S1 of the imaging lens 5. The rotation-linear motion conversion mechanism is composed of, for example, a rack and pinion mechanism.

  Specifically, the semiconductor laser array 4 is provided on a fixed block 6 as shown in FIG. 5, for example. The imaging lens 5 is provided on the movable block 10. The fixed block 6 is fixed on the base 11, and the movable block 10 is movable on the base 11 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b emitted from the semiconductor laser array 4. Is provided. As a result, the lens moving mechanism 8-2 converts the rotation of the motor shaft into a movement in the moving direction S1 of the imaging lens 5 by the rotation-linear motion conversion mechanism, and moves the movable block 10 on the base 11 to the imaging lens 5 is moved in the same direction as the moving direction S1. As a result, the imaging lens 5 moves in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b.

  A scanning mechanism 9 is provided for two-dimensionally scanning the linear laser beam 4 b emitted from the semiconductor laser array 4 on the thermal recording medium 3. The scanning mechanism 9 integrally moves the semiconductor laser array 4 and the imaging lens 5 in a direction S2 perpendicular to the line direction K of the semiconductor laser array 4, for example, at a constant speed. In this case, the scanning mechanism 9 integrally performs thermal recording on the semiconductor laser array 4 and the imaging lens 5 while maintaining the object-image distance between each light emitting point 4a of the semiconductor laser array 4 and the thermal recording medium 3. The medium 3 is moved in the direction S2 perpendicular to the line direction K of the semiconductor laser array 4. The scanning mechanism 9 includes, for example, a motor and a rotation-linear motion conversion mechanism that converts the rotation of the shaft of the motor into the vertical direction S2. The rotation-linear motion conversion mechanism is composed of, for example, a rack and pinion mechanism.

Next, the operation of the apparatus configured as described above will be described.
The semiconductor laser array 4 emits each laser beam from each light emitting point 4a and outputs it as a linear laser beam. The imaging lens 5 focuses the linear laser beam 4 b output from the semiconductor laser array 4 and forms an image on the thermal recording medium 3.
At this time, the distance sensor 7 measures the distance to the thermal recording medium 3 and outputs the distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output.
The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. Move to. Thereby, the line-shaped laser beam 4 b forms an image on the thermal recording medium 3.

  Here, assuming that the distance between each light emitting point 4 a of the semiconductor laser array 4 and the thermal recording medium 3 on the object 2 is an initial setting distance, the imaging lens 5 is connected to each light emitting point 4 a of the semiconductor laser array 4. The relationship A: B between the first distance A between the imaging lens 5 and the second distance B between the imaging lens 5 and the thermal recording medium 3 is approximately 1: 1 (A = B). Are arranged as follows. As described above, if the distance between each light emitting point 4a of the semiconductor laser array 4 and the thermal recording medium 3 in the object 2 is the initial setting interval, the imaging lens 5 has a magnification of "1", for example, so that the semiconductor laser array The line-shaped laser beam 4 b output from 4 is condensed by the imaging lens 5 and forms an image on the thermal recording medium 3.

  For example, if the object 2 to which the thermal recording medium 3 is attached is transported in the x direction by a transport mechanism such as a conveyor, the transport mechanism places the object 2 and transports it in the x direction. When 2 reaches a predetermined position intersecting with the optical axis L passing through the semiconductor laser array 4 and the imaging lens 5, the conveyance of the object 2 is temporarily stopped. While the conveyance of the object 2 is temporarily stopped, the scan mechanism 9 maintains the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3 in the same manner as described above. The laser array 4 and the imaging lens 5 are integrally moved at a constant speed, for example, in a direction S2 perpendicular to the line direction of the semiconductor laser array 4. Thereby, the line-shaped laser beam 4b output from the semiconductor laser array 4 is two-dimensionally scanned on the thermal recording medium 3, and data is recorded or erased on the thermal recording medium 3.

  That is, when the linear laser beam 4b is irradiated onto the thermal recording medium 3 and the melting point becomes 180 ° C. or more as shown in FIG. 4, for example, the dye and developer present in the print layer in the thermal recording medium 3 In this state, the dye and the developer are crystallized in a mixed state and are colored, for example, black. As a result, data relating to the object 2, for example, the price of an item stored in the object 2, data relating to the item, etc. are recorded on the thermal recording medium 3. When the thermal recording medium 3 is irradiated with a line-shaped laser beam 4b and the thermal recording medium 3 is heated to, for example, about 130 ° C. to 180 ° C., the dye and the developer are gradually separated and crystallized. And become decolored. Thereby, the data on the thermal recording medium 3 is erased.

  Actually, for example, the distance between the semiconductor laser array 4 and the object 2 may be shortened due to a difference in the arrangement position of the object 2 or deformation of a portion of the object 2 where the thermal recording medium 3 is attached. The above relationship A: B also changes as the distance between the object images between the semiconductor laser array 4 and the object 2 changes, and the object between the semiconductor laser array 4 and the object 2 changes. The imaging position of the imaging lens 5 is determined according to the change in the inter-image distance. Thereby, the magnification by the imaging lens 5 is slightly increased or decreased depending on the distance between the object images between the semiconductor laser array 4 and the object 2.

The distance sensor 7 measures the distance between the semiconductor laser array 4 and the object 2 that changes in accordance with the difference in the arrangement position of the object 2 or the deformation of the portion of the object 2 where the thermal recording medium 3 is attached. Output distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output.
The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. The line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  For example, as shown in FIG. 6, the distance between the object images between the semiconductor laser array 4 and the object 2 is increased, and the first distance A between each light emitting point 4a of the semiconductor laser array 4 and the imaging lens 5 is When the relationship A: B with the second distance B between the imaging lens 5 and the thermal recording medium 3 changes to, for example, the relationship A: B + α, the lens drive control unit 8-1 is output from the distance sensor 7. The distance measurement signal is input, and the imaging lens 5 is moved in the moving direction S11 on the object 2 side based on the measurement result of the distance to the thermal recording medium 3, and a linear laser beam is connected onto the thermal recording medium 3. The movement control signal for imaging is output, and the lens movement mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the movement direction according to the movement control signal. Move to S11, line laser beam Focusing the beam 4b on the thermosensitive recording medium 3.

  On the other hand, as shown in FIG. 7, the distance between the object images between the semiconductor laser array 4 and the object 2 is shortened, and the first distance A between each light emitting point 4 a of the semiconductor laser array 4 and the imaging lens 5. When the relationship A: B with the second distance B between the imaging lens 5 and the thermal recording medium 3 changes to the relationship A: B-β, the lens drive control unit 8-1 moves away from the distance sensor 7. An output distance measurement signal is input, and the imaging lens 5 is moved in the moving direction S12 on the side of the semiconductor laser array 4 on the basis of the measurement result of the distance to the thermal recording medium 3, so that a linear laser beam is produced. The lens movement mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and the imaging lens 5 according to the movement control signal. Is moved in the moving direction S12 to form a line The laser beam 4b is imaged on the thermosensitive recording medium 3.

  However, the scan mechanism 9 integrates the semiconductor laser array 4 and the imaging lens 5 integrally while maintaining the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3, as described above. For example, the semiconductor laser array 4 is moved at a constant speed in the direction S2 perpendicular to the line direction of the semiconductor laser array 4. At this time, the lens drive control unit 8-1 moves to move the imaging lens 5 in the moving direction S11 or S12 on the object 2 side based on the measurement result of the distance to the thermal recording medium 3 by the distance sensor 7. The lens moving mechanism 8-2 outputs a control signal, and moves the imaging lens 5 in the moving direction S11 or S12 in accordance with the movement control signal output from the lens drive control unit 8-1, so that the linear laser beam 4b. Is imaged on the thermal recording medium 3. As a result, the imaging position of the line-shaped laser beam moves in the line direction of the semiconductor laser array 4 following the shape of the object 2 due to deformation or the like of the portion to which the thermal recording medium 3 is attached. A laser beam is scanned two-dimensionally on the thermal recording medium 3. As a result, data is recorded or erased on the thermal recording medium 3.

  As described above, according to the first embodiment, the imaging lens 5 is moved in the same direction as the optical axis direction of the linear laser beam 4b according to the distance between the object images between the semiconductor laser array 4 and the object 2. The line laser beam 4b is imaged on the thermal recording medium 3 by moving to S1. As a result, for example, the distance between the object images of the semiconductor laser array 4 and the object 2 becomes longer due to a difference in the arrangement position of the object 2 or deformation of a portion of the object 2 where the thermal recording medium 3 is attached. Even if it changes relatively, the relationship between the first distance A and the second distance B changes the position of the imaging lens 5 according to the distance between the object images of the semiconductor laser array 4 and the object 2. By arranging to be approximately 1: 1 (A = B), the line-shaped laser beam 4b can be imaged on the thermal recording medium 3 attached to the object 2, and even if the thermal recording on the object 2 is performed. Even if the portion to which the medium 3 is attached is deformed, the imaging position of the line-shaped laser beam 4b can be scanned on the surface of the thermal recording medium 3 following the shape of the deformation. Recording data on the thermal recording medium 3 or Being able to be done at a high quality. In addition, since the data can be recorded or erased in a non-contact manner with respect to the heat-sensitive recording medium 3 attached to the object 2 such as a cardboard or a container, the life of the heat-sensitive recording medium 3 can be extended.

  The scanning mechanism 9 is not limited to moving the semiconductor laser array 4 and the imaging lens 5 integrally in the vertical direction S2 with respect to the line direction K of the semiconductor laser array 4, but also moves the object 2 in the vertical direction S2. The thermal recording medium 3 may be moved in the vertical direction S2 as it is moved.

  The scanning mechanism 9 integrally moves the semiconductor laser array 4 and the imaging lens 5 in the direction S2 perpendicular to the line direction K of the semiconductor laser array 4, and moves the thermal recording medium 3 to the semiconductor laser array 4. The linear laser beam 4b emitted from the semiconductor laser array 4 may be scanned two-dimensionally on the thermal recording medium 3 by moving in the direction S2 perpendicular to the line direction K.

Next, a second embodiment of the present invention will be described with reference to the drawings. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.
8 to 10 are configuration diagrams of the non-contact optical writing apparatus, FIG. 8 is a side view, FIG. 9 is a front view, and FIG. 10 is an external view. A cylindrical lens 20 is disposed between the semiconductor laser array 4 and the imaging lens 5. The cylindrical lens 20 forms an image of each laser beam emitted from each light emitting point 4 a of the semiconductor laser array 4, that is, a linear laser beam 4 b in a direction perpendicular to the line direction K of the semiconductor laser array 4. More specifically, the cylindrical lens 20 is configured such that the line-shaped laser beam 4b output from the semiconductor laser array 4 is arranged in parallel to the line direction K of the semiconductor laser array 4, and the semiconductor laser is within the optical axis direction. An image is formed in a direction perpendicular to the line direction of the array K. The laser beam 4 b imaged by the cylindrical lens 20 has an imaging power with respect to a direction perpendicular to the line direction K of the semiconductor laser array 4.

The pn junction surface formed in the semiconductor laser array 4 is formed in the same direction as the line direction K of the semiconductor laser array 4. Thereby, the line-shaped laser beam 4 b output from the semiconductor laser array 4 is wide in the vertical direction with respect to the pn junction surface formed in the semiconductor laser array 4 and narrow in the line direction K. When the radiation angle of the line-shaped laser beam 4b is wide, the line-shaped laser beam 4b is more easily vignetted by the imaging lens 5 in the peripheral portion rather than the central portion of the line-shaped laser beam 4b.
However, the cylindrical lens 20 forms an image with the semiconductor laser array 4 in order to narrow the radiation direction of the line-shaped laser beam 4b output from the semiconductor laser array 4 and reduce the loss caused by vignetting in the imaging lens 5 as much as possible. It is arranged between the lens 5. The cylindrical lens 20 has power in a direction perpendicular to the line direction K of the semiconductor laser array 4 and has a length in a direction corresponding to the line direction K of the semiconductor laser array 4 in the line direction of the semiconductor laser array 4. It is formed longer than the length of K. The cylindrical lens 20 is fixed on, for example, the fixed block 6 on the optical axis of the semiconductor laser array 4.

Next, the operation of the apparatus configured as described above will be described.
The semiconductor laser array 4 emits each laser beam from each light emitting point 4a and outputs it as a linear laser beam 4b. The cylindrical lens 20 is arranged so that the line-shaped laser beam 4b output from the semiconductor laser array 4 is parallel to the line direction K of the semiconductor laser array 4, and is perpendicular to the line direction of the semiconductor laser array K in the optical axis direction. The image is formed in any direction. The laser beam 4 b imaged by the cylindrical lens 20 has an imaging power with respect to a direction perpendicular to the line direction K of the semiconductor laser array 4. The imaging lens 5 condenses the line-shaped laser beam 4 b formed in the direction perpendicular to the line direction K of the semiconductor laser array 4 by the cylindrical lens 20 and forms an image on the thermal recording medium 3.

  At this time, the distance sensor 7 measures the distance to the thermal recording medium 3 and outputs the distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output. The lens moving mechanism 8-2 moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b in accordance with the movement control signal output from the lens drive control unit 8-1. Thereby, the line-shaped laser beam 4 b forms an image on the thermal recording medium 3.

  Here, assuming that the interval between each light emitting point 4a of the semiconductor laser array 4 and the thermal recording medium 3 in the object 2 is an initial setting interval, the imaging lens 5 is formed of the semiconductor laser array 4 as shown in FIG. The relationship A: B between the first distance A between each light emitting point 4a and the imaging lens 5 and the second distance B between the imaging lens 5 and the thermal recording medium 3 is approximately 1: 1 ( A = B). As a result, the line-shaped laser beam 4 b output from the semiconductor laser array 4 is condensed by the imaging lens 5 and forms an image on the thermal recording medium 3.

  Similarly to the above, the transport mechanism transports the object 2, and when the object 2 reaches a predetermined position where it crosses the optical axis L passing through the semiconductor laser array 4 and the imaging lens 5, the transport of the object 2 is temporarily stopped. In this state, the scan mechanism 9 moves the semiconductor laser array 4 and the imaging lens 5 while maintaining the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3 as described above. For example, the semiconductor laser array 4 is moved at a constant speed in the direction S2 perpendicular to the line direction of the semiconductor laser array 4. Thereby, the line-shaped laser beam 4b output from the semiconductor laser array 4 is two-dimensionally scanned on the thermal recording medium 3, and data is recorded or erased on the thermal recording medium 3.

  Actually, for example, the distance between the semiconductor laser array 4 and the object 2 may be shortened due to a difference in the arrangement position of the object 2 or deformation of a portion of the object 2 where the thermal recording medium 3 is attached. The above relationship A: B also changes as the distance between the object images between the semiconductor laser array 4 and the object 2 changes, and the object between the semiconductor laser array 4 and the object 2 changes. The imaging position of the imaging lens 5 is determined according to the change in the inter-image distance. Thereby, the magnification by the imaging lens 5 is slightly increased or decreased depending on the distance between the object images between the semiconductor laser array 4 and the object 2.

  The distance sensor 7 measures the distance between the semiconductor laser array 4 and the object 2 that changes in accordance with the difference in the arrangement position of the object 2 or the deformation of the portion of the object 2 where the thermal recording medium 3 is attached. Output distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output. The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. The line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  For example, as shown in FIG. 12, the distance between the object images between the semiconductor laser array 4 and the object 2 is increased, and the relationship A: B between the first distance A and the second distance B is, for example, the relationship A: When it changes to B + α, the lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and the imaging lens 5 is located on the object 2 side based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for moving in the movement direction S11 to form an image of the line-shaped laser beam on the thermal recording medium 3 is output, and the lens movement mechanism 8-2 is output from the lens drive control unit 8-1. A movement control signal is input, the imaging lens 5 is moved in the movement direction S11 according to the movement control signal, and the line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  On the other hand, as shown in FIG. 13, the distance between the object images between the semiconductor laser array 4 and the object 2 is shortened, and the relationship A: B between the first distance A and the second distance B is related A: When changed to B-β, the lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7 and moves the imaging lens 5 to the semiconductor laser array based on the measurement result of the distance to the thermal recording medium 3. The lens movement mechanism 8-2 outputs a movement control signal for moving the laser beam in the moving direction S12, which is the fourth side, to form an image of the line-shaped laser beam on the thermal recording medium 3, and the lens driving control unit 8-1. The image forming lens 5 is moved in the moving direction S12 in accordance with the movement control signal, and the line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  However, the scan mechanism 9 integrates the semiconductor laser array 4 and the imaging lens 5 integrally while maintaining the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3, as described above. For example, the semiconductor laser array 4 is moved at a constant speed in the direction S2 perpendicular to the line direction of the semiconductor laser array 4. At this time, the lens drive control unit 8-1 moves to move the imaging lens 5 in the moving direction S11 or S12 on the object 2 side based on the measurement result of the distance to the thermal recording medium 3 by the distance sensor 7. The lens moving mechanism 8-2 outputs a control signal, and moves the imaging lens 5 in the moving direction S11 or S12 in accordance with the movement control signal output from the lens drive control unit 8-1, so that the linear laser beam 4b. Is imaged on the thermal recording medium 3. As a result, the imaging position of the line-shaped laser beam moves in the line direction of the semiconductor laser array 4 following the shape of the object 2 due to deformation or the like of the portion to which the thermal recording medium 3 is attached. A laser beam is scanned two-dimensionally on the thermal recording medium 3. As a result, data is recorded or erased on the thermal recording medium 3.

  Thus, according to the second embodiment, since the cylindrical lens 20 is disposed between the semiconductor laser array 4 and the imaging lens 5, in addition to the effects of the first embodiment, the semiconductor laser Even if the line-shaped laser beam 4b output from the array 4 has a wide radiation angle, that is, wide in the direction perpendicular to the pn junction surface formed in the semiconductor laser array 4 and narrow in the line direction K, the semiconductor laser array By narrowing the radiation direction of the line-shaped laser beam 4b output from 4, the loss due to vignetting in the imaging lens 5 can be reduced as much as possible.

Next, a third embodiment of the present invention will be described with reference to the drawings. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.
14 to 16 show a configuration diagram of the non-contact optical writing apparatus, FIG. 14 is a side view, FIG. 15 is a front view, and FIG. 16 is an external view. A microarray lens 30 as a collimating lens is disposed between the semiconductor laser array 4 and the imaging lens 5. The microarray lens 30 includes a plurality of microlenses 30a arranged in a line. These microlenses 30 a have the same number as each light emitting point 4 a of the semiconductor laser array 4 and are provided at the same pitch as each light emitting point 4 a of the semiconductor laser array 4. The microarray lens 30 is provided so that each microlens 30 a corresponds to each light emitting point 4 a of the semiconductor laser array 4. Thereby, the microarray lens 30 collimates each laser beam output from each light emitting point 4a of the semiconductor laser array 4 into parallel light by each microlens 30a.

The pn junction surface formed in the semiconductor laser array 4 is formed in the same direction as the line direction K of the semiconductor laser array 4 as described above. Thereby, the line-shaped laser beam 4 b output from the semiconductor laser array 4 is wide in the vertical direction with respect to the pn junction surface formed in the semiconductor laser array 4 and narrow in the line direction K. When the radiation angle of the line-shaped laser beam 4b is wide, the line-shaped laser beam 4b is more easily vignetted by the imaging lens 5 in the peripheral portion rather than the central portion of the line-shaped laser beam 4b.
However, the microarray lens 30 forms an image with the semiconductor laser array 4 in order to narrow the radiation direction of the line-shaped laser beam 4b output from the semiconductor laser array 4 and reduce the loss due to vignetting in the imaging lens 5 as much as possible. It is arranged between the lens 5. The microarray lens 30 is fixed on, for example, the fixed block 6 on the optical axis L of the semiconductor laser array 4.

  The imaging lens 5 images each parallel light collimated by the microarray lens 30 on the thermal recording medium 3. Here, since the line-shaped laser beam 4 b incident on the imaging lens 5 from the microarray lens 30 is parallel light, the first distance between each light emitting point 4 a of the semiconductor laser array 4 and the imaging lens 5. Regardless of A, the imaging lens 5 is light of the line-shaped laser beam 4b so that the second distance B between the imaging lens 5 and the thermal recording medium 3 matches the focal length f of the imaging lens 5. It can move in the same direction S1 as the axial direction.

  The imaging lens 5 may be constituted by a microarray lens in which a plurality of microlenses 5a are arranged in a line. These microlenses 5 a have the same number as each light emitting point 4 a of the semiconductor laser array 4 and are provided at the same pitch as each light emitting point 4 a of the semiconductor laser array 4.

Next, the operation of the apparatus configured as described above will be described.
The semiconductor laser array 4 emits each laser beam from each light emitting point 4a and outputs it as a linear laser beam 4a. Each microlens 30a of the microarray lens 30 collimates each laser beam output from each light emitting point 4a of the semiconductor laser array 4 into parallel light. The imaging lens 5 condenses the linear laser beam 4 b collimated by the microarray lens 30 and forms an image on the thermal recording medium 3.

  At this time, the distance sensor 7 measures the distance to the thermal recording medium 3 and outputs the distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output. The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. Move to. Thereby, the line-shaped laser beam 4 b forms an image on the thermal recording medium 3.

  Here, assuming that the distance between each light emitting point 4a of the semiconductor laser array 4 and the thermal recording medium 3 in the object 2 is an initial set distance, the imaging lens 5 has the first distance as shown in FIG. A and the second distance B are arranged in the relationship A: B (= f). As a result, the line-shaped laser beam 4 b output from the semiconductor laser array 4 is condensed by the imaging lens 5 and forms an image on the thermal recording medium 3.

  Similarly to the above, the transport mechanism transports the object 2, and when the object 2 reaches a predetermined position where it crosses the optical axis L passing through the semiconductor laser array 4 and the imaging lens 5, the transport of the object 2 is temporarily stopped. In this state, similarly to the above, the scanning mechanism 9 maintains the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3, and the semiconductor laser array 4, the imaging lens 5, and the microarray. The lens 30 is moved integrally with the lens 30 in the direction S2 perpendicular to the line direction of the semiconductor laser array 4, for example. Thereby, the line-shaped laser beam 4b output from the semiconductor laser array 4 is two-dimensionally scanned on the thermal recording medium 3, and data is recorded or erased on the thermal recording medium 3.

  Actually, for example, the distance between the semiconductor laser array 4 and the object 2 may be shortened due to a difference in the arrangement position of the object 2 or deformation of a portion of the object 2 where the thermal recording medium 3 is attached. The above relationship A: B also changes as the distance between the object images between the semiconductor laser array 4 and the object 2 changes, and the object between the semiconductor laser array 4 and the object 2 changes. The imaging position of the imaging lens 5 is determined according to the change in the inter-image distance. Thereby, the magnification by the imaging lens 5 is slightly increased or decreased depending on the distance between the object images between the semiconductor laser array 4 and the object 2.

  The distance sensor 7 measures the distance between the semiconductor laser array 4 and the object 2 that changes in accordance with the difference in the arrangement position of the object 2 or the deformation of the portion of the object 2 where the thermal recording medium 3 is attached. Output distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output. The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. The line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  For example, as shown in FIG. 18, the distance between the object images between the semiconductor laser array 4 and the object 2 is increased, and the relationship A: B between the first distance A and the second distance B is, for example, the relationship A + γ: When it changes to B (= f), the lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and sets the imaging lens 5 to the object based on the measurement result of the distance to the thermal recording medium 3. The lens movement mechanism 8-2 outputs a movement control signal for causing the line-shaped laser beam to form an image on the thermal recording medium 3 by moving in the movement direction S11 that is the second side, and the lens driving control unit 8-1. The movement control signal output from the head is input, the imaging lens 5 is moved in the movement direction S11 according to the movement control signal, and the line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  On the other hand, as shown in FIG. 19, the distance between the object images between the semiconductor laser array 4 and the object 2 is shortened, and the relationship A: B between the first distance A and the second distance B is the relationship A−. When changing to γ: B (= f), the lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and based on the measurement result of the distance to the thermal recording medium 3, the imaging lens 5 Is moved in the moving direction S12 on the semiconductor laser array 4 side to output a movement control signal for forming an image of the line-shaped laser beam on the thermal recording medium 3, and the lens moving mechanism 8-2 controls lens driving. The movement control signal output from the unit 8-1 is input, the imaging lens 5 is moved in the movement direction S12 according to the movement control signal, and the line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  However, the scan mechanism 9 integrates the semiconductor laser array 4 and the imaging lens 5 integrally while maintaining the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3, as described above. For example, the semiconductor laser array 4 is moved at a constant speed in the direction S2 perpendicular to the line direction of the semiconductor laser array 4. At this time, the lens drive control unit 8-1 moves to move the imaging lens 5 in the moving direction S11 or S12 on the object 2 side based on the measurement result of the distance to the thermal recording medium 3 by the distance sensor 7. The control signal is output, and the lens movement mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the movement direction S11 or S12 according to the movement control signal. The line-shaped laser beam 4b is imaged on the thermal recording medium 3. As a result, the imaging position of the line-shaped laser beam moves in the line direction of the semiconductor laser array 4 following the shape of the object 2 due to deformation or the like of the portion to which the thermal recording medium 3 is attached. A laser beam is scanned two-dimensionally on the thermal recording medium 3. As a result, data is recorded or erased on the thermal recording medium 3.

  Thus, according to the third embodiment, since the microarray lens 30 is arranged between the semiconductor laser array 4 and the imaging lens 5, in addition to the effects of the first embodiment, the semiconductor laser Even if the line-shaped laser beam 4b output from the array 4 has a wide radiation angle, that is, wide in the direction perpendicular to the pn junction surface formed in the semiconductor laser array 4 and narrow in the line direction K, the semiconductor laser array By narrowing the radiation direction of the line-shaped laser beam 4b output from 4, the loss due to vignetting in the imaging lens 5 can be reduced as much as possible.

Next, a fourth embodiment of the present invention will be described with reference to the drawings. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.
FIG. 20 shows a configuration diagram of a non-contact optical writing system to which the non-contact optical writing device 1 is applied. The transport mechanism 40 transports the object 2 such as a cardboard or a container in the direction of arrow S3 at a constant speed, for example. For example, as shown in FIG. 21A, the transport mechanism 40 hangs an endless belt 43 between two rollers 41 and 42, and moves the belt 43 by rotationally driving the roller 41. As a result, the object 2 is placed on the belt 43 and conveyed in the direction of the arrow S3 by the movement of the belt 43. Further, for example, the transport mechanism 40 may arrange a plurality of rollers 44 at regular intervals as shown in FIG. 21B and transport the object 2 on these rollers 44 in the direction of arrow S3. The transport mechanism 40 places the object 2 and transports it in the direction of arrow S3. When the object 2 reaches a predetermined position where it crosses the optical axis L passing through the semiconductor laser array 4 and the imaging lens 5, the transport mechanism 40 transports the object 2. Pause. Further, the transport mechanism 40 may transport the object 2 at a constant speed, for example, in the direction of arrow S3.

  The non-contact optical writing device 1 is provided on the side of the transport mechanism 40. The non-contact optical writing device 1 is stored in the data 2, for example, the price, the object 2 on the thermal recording medium 3 attached to the object 2 conveyed by the conveying mechanism 1. Record data related to goods. Specifically, as in the first to third embodiments, the non-contact optical writing device 1 is provided with a base 11, a fixed block 6 fixed on the base 11, and a movable on the base 11. The movable block 10, the semiconductor laser array 4 provided upright in the z direction on the fixed block 6, and the imaging lens 5 provided upright in the z direction on the movable block 10. .

Next, the operation of the system configured as described above will be described.
The transport mechanism 40 transports the object 2 in the direction of arrow S3, for example, at a constant speed. When the leading side in the transport direction S3 of the object 2 reaches the optical axis L of the semiconductor laser array 4 by transporting the object 2 by the transport mechanism 40, the semiconductor laser array 4 emits each laser beam from each light emitting point 4a. By doing so, it outputs as a line-shaped laser beam 4b. The imaging lens 5 focuses the linear laser beam 4b output from the semiconductor laser array 4 and forms an image on the thermal recording medium 3 attached to the side surface of the object 2 being conveyed.
At this time, the distance sensor 7 measures the distance to the thermal recording medium 3 and outputs the distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output. The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. Move to. Thereby, the line-shaped laser beam 4 b forms an image on the thermal recording medium 3.

  Here, assuming that the interval between each light emitting point 4a of the semiconductor laser array 4 and the thermal recording medium 3 in the object 2 is an initial setting interval, the imaging lens 5 has the same structure as that shown in FIG. The relationship A: B between the first distance A and the second distance B is approximately 1: 1 (A = B). As a result, the line-shaped laser beam 4 b output from the semiconductor laser array 4 is condensed by the imaging lens 5 and forms an image on the thermal recording medium 3.

  Similarly to the above, the transport mechanism transports the object 2, and when the object 2 reaches a predetermined position where it crosses the optical axis L passing through the semiconductor laser array 4 and the imaging lens 5, the transport of the object 2 is temporarily stopped. In this state, the scan mechanism 9 moves the semiconductor laser array 4 and the imaging lens 5 while maintaining the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3 as described above. For example, the semiconductor laser array 4 is moved at a constant speed in the direction S2 perpendicular to the line direction of the semiconductor laser array 4. Thereby, the line-shaped laser beam 4b output from the semiconductor laser array 4 is two-dimensionally scanned on the thermal recording medium 3, and data is recorded or erased on the thermal recording medium 3.

  Actually, for example, the distance between the semiconductor laser array 4 and the object 2 may be shortened due to a difference in the arrangement position of the object 2 or deformation of a portion of the object 2 where the thermal recording medium 3 is attached. The above relationship A: B also changes as the distance between the object images between the semiconductor laser array 4 and the object 2 changes, and the object between the semiconductor laser array 4 and the object 2 changes. The imaging position of the imaging lens 5 is determined according to the change in the inter-image distance. Thereby, the magnification by the imaging lens 5 is slightly increased or decreased depending on the distance between the object images between the semiconductor laser array 4 and the object 2.

  The distance sensor 7 measures the distance between the semiconductor laser array 4 and the object 2 that changes in accordance with the difference in the arrangement position of the object 2 or the deformation of the portion of the object 2 where the thermal recording medium 3 is attached. Output distance measurement signal. The lens drive control unit 8-1 receives the distance measurement signal output from the distance sensor 7, and moves the imaging lens 5 to the optical axis of the line-shaped laser beam 4b based on the measurement result of the distance to the thermal recording medium 3. A movement control signal for causing the line-shaped laser beam 4b to form an image on the thermal recording medium 3 by moving in the same direction S1 as the direction is output. The lens moving mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the same direction S1 as the optical axis direction of the line-shaped laser beam 4b according to the movement control signal. The line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  For example, as shown in FIG. 6 above, the object image distance between the semiconductor laser array 4 and the object 2 is increased, and the relationship A: B between the first distance A and the second distance B is For example, when the relationship A: B + α is changed, the lens drive control unit 8-1 inputs the distance measurement signal output from the distance sensor 7, and the imaging lens 5 is moved to the object based on the measurement result of the distance to the thermal recording medium 3. The lens movement mechanism 8-2 outputs a movement control signal for causing the line-shaped laser beam to form an image on the thermal recording medium 3 by moving in the movement direction S11 that is the second side, and the lens driving control unit 8-1. The movement control signal output from the head is input, the imaging lens 5 is moved in the movement direction S11 according to the movement control signal, and the line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  On the other hand, as shown in FIG. 7, the object-image distance between the semiconductor laser array 4 and the object 2 is shortened, and the relationship A: B between the first distance A and the second distance B is satisfied. Changes to relationship A: B-β, the lens drive controller 8-1 receives the distance measurement signal output from the distance sensor 7, and the imaging lens 5 based on the measurement result of the distance to the thermal recording medium 3. Is moved in the moving direction S12 on the semiconductor laser array 4 side to output a movement control signal for forming an image of the line-shaped laser beam on the thermal recording medium 3, and the lens moving mechanism 8-2 controls lens driving. The movement control signal output from the unit 8-1 is input, the imaging lens 5 is moved in the movement direction S12 according to the movement control signal, and the line-shaped laser beam 4b is imaged on the thermal recording medium 3.

  However, the scan mechanism 9 integrates the semiconductor laser array 4 and the imaging lens 5 integrally while maintaining the distance between the object images between the light emitting points 4a of the semiconductor laser array 4 and the thermal recording medium 3, as described above. For example, the semiconductor laser array 4 is moved at a constant speed in the direction S2 perpendicular to the line direction of the semiconductor laser array 4. At this time, the lens drive control unit 8-1 moves to move the imaging lens 5 in the moving direction S11 or S12 on the object 2 side based on the measurement result of the distance to the thermal recording medium 3 by the distance sensor 7. The control signal is output, and the lens movement mechanism 8-2 receives the movement control signal output from the lens drive control unit 8-1, and moves the imaging lens 5 in the movement direction S11 or S12 according to the movement control signal. The line-shaped laser beam 4b is imaged on the thermal recording medium 3. As a result, the imaging position of the line-shaped laser beam moves in the line direction of the semiconductor laser array 4 following the shape of the object 2 due to deformation or the like of the portion to which the thermal recording medium 3 is attached. A laser beam is scanned two-dimensionally on the thermal recording medium 3. As a result, data is recorded or erased on the thermal recording medium 3.

  As described above, according to the fourth embodiment, the object 2 such as a cardboard or a container is conveyed in the direction of the arrow S3, for example, at a constant speed by the conveying mechanism 40, and non-contact optical writing is performed on the side of the conveying mechanism 40. The apparatus 1 is provided, and a line-shaped laser beam 4b is imaged on the thermal recording medium 3 attached to the object 2 conveyed by the conveyance mechanism 1.

  Thereby, for example, the difference between the placement position of the object 2 placed on the transport mechanism 40, the deformation of the part of the object 2 where the thermal recording medium 3 is attached, etc. Even if the distance between the object images changes relatively, the line-shaped laser beam 4b can be formed on the thermal recording medium 3 attached to the object 2, and the thermal recording medium 3 on the object 2 can be imaged. Even if the pasted portion is deformed, the image forming lens 5 is moved in accordance with the shape of the deformed portion, so that a line shape is formed on the thermosensitive recording medium 3 pasted on the object 2. The laser beam 4b can be imaged, and data can be recorded or erased on the thermal recording medium 3 with high quality. In addition, since the data can be recorded or erased in a non-contact manner with respect to the heat-sensitive recording medium 3 attached to the object 2 such as a cardboard or a container, the life of the heat-sensitive recording medium 3 can be extended.

  In the fourth embodiment, the non-contact optical writing device 1 is provided on the side of the transport mechanism 40. However, the present invention is not limited to this, and the non-contact optical writing device 1 is, for example, as shown in FIG. You may provide above the conveyance mechanism 40. FIG. FIG. 22 shows only the semiconductor laser array 4 and the imaging lens 5 because the illustration is complicated. In this case, the object 2 is transported at a constant speed in the transport direction S3 by the transport mechanism 40, and the line-shaped laser beam 4b is perpendicular to the transport direction S3 in which the object 2 is transported from above the object 2. Irradiated in the (z direction). As a result, the line-shaped laser beam 4b is two-dimensionally scanned on the thermal recording medium 3 as the object 2 is conveyed, and data is recorded or erased on the entire surface of the thermal recording medium 3.

Further, the non-contact optical writing device 1 may be provided on the lower side of the transport mechanism 40 as shown in FIG. FIG. 23 also shows only the semiconductor laser array 4 and the imaging lens 5 because the illustration is complicated. In this case, the transport mechanism 40 arranges a plurality of rollers 44 at regular intervals as shown in FIG. 21B, for example, and transports the object 2 on these rollers 44 in the direction of arrow S3. The non-contact optical writing device 1 irradiates the thermal recording medium 3 with a linear laser beam through the rollers 44.
However, the object 2 is conveyed at a constant speed in the conveyance direction S3 by the conveyance mechanism 40, and the line-shaped laser beam 4b is conveyed between the rollers 44 from the lower side of the object 2 in the conveyance direction S3. Is irradiated in a direction perpendicular to (z direction). As a result, the line-shaped laser beam 4b is two-dimensionally scanned on the thermal recording medium 3 as the object 2 is conveyed, and data is recorded or erased on the entire surface of the thermal recording medium 3.

Further, in the non-contact optical writing apparatus 1 applied to the non-contact optical writing system, a cylindrical lens 20 is disposed between the semiconductor laser array 4 and the imaging lens 5 as in the second embodiment. However, as in the third embodiment, the microarray lens 30 may be disposed between the semiconductor laser array 4 and the imaging lens 5.
Thereby, in the non-contact optical writing system, the line-shaped laser beam 4b output from the semiconductor laser array 4 has a wide radiation angle, that is, wide in the direction perpendicular to the pn junction surface formed in the semiconductor laser array 4, Even if the line direction is narrow, the radiation direction of the line-shaped laser beam 4b output from the semiconductor laser array 4 can be narrowed to reduce loss due to vignetting in the imaging lens 5 as much as possible.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

1 is a side configuration diagram showing a first embodiment of a non-contact optical writing device according to the present invention. FIG. The front block diagram of the same apparatus. The external appearance block diagram which shows the semiconductor laser array and imaging lens in the apparatus. The figure which shows the recording / erasing characteristic of the thermal recording medium which records and erases data with the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The side surface block diagram which shows 2nd Embodiment of the non-contact optical writing apparatus which concerns on this invention. The front block diagram of the same apparatus. The external appearance block diagram which shows the semiconductor laser array, cylindrical lens, and imaging lens in the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The side surface block diagram which shows 3rd Embodiment of the non-contact optical writing apparatus which concerns on this invention. The front block diagram of the same apparatus. The external appearance block diagram which shows the semiconductor laser array in the same apparatus, a micro lens, and an imaging lens. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The figure which shows the movement of the imaging lens according to the distance between the object images between the semiconductor laser array and the object in the same apparatus. The block diagram which shows 4th Embodiment of the non-contact optical writing system to which the non-contact optical writing device based on this invention is applied. The block diagram which shows the specific example of the conveyance mechanism in the same system. The figure which shows the non-contact optical writing apparatus provided above the conveyance mechanism in the same system. The figure which shows the non-contact optical writing apparatus provided under the conveyance mechanism in the same system.

Explanation of symbols

  1: non-contact optical writing device, 2: object, 3: thermal recording medium, 4: semiconductor laser array, 4a: light emitting point 4a, 5: imaging lens, 6: fixed block, 7: distance sensor, 8-1: Lens drive control unit, 8-2: lens moving mechanism, 9: scanning mechanism, 20: cylindrical lens, 30: microarray lens, 40: transport mechanism, 41, 42: roller, 43: belt, 44: roller.

Claims (14)

In a non-contact optical writing device for recording and erasing data on a rewritable thermal recording medium,
A semiconductor laser array in which a plurality of light emitting points each emitting a laser beam are arranged in a line;
The laser beam emitted from the semiconductor laser array is provided so as to be movable in the same direction as the optical axis direction of the laser beam, and the laser beam emitted from the semiconductor laser array is imaged on the thermal recording medium. An image lens,
A non-contact optical writing device comprising: A distance sensor for measuring the distance to the thermal recording medium;
A lens drive control unit for moving the imaging lens in the same direction as the optical axis direction of each laser beam based on the measurement result of the distance by the distance sensor and imaging each laser beam on the thermal recording medium When,
The non-contact optical writing apparatus according to claim 1, comprising:   2. The non-contact optical writing according to claim 1, wherein the imaging lens has a length corresponding to at least a line direction of the semiconductor laser array longer than a length of the semiconductor laser array in the line direction. apparatus.   The imaging lens forms an image of each laser beam on the thermal recording medium by equalizing a distance relationship between each light emitting point of the semiconductor laser array and the thermal recording medium. Item 2. The non-contact optical writing device according to Item 1.   2. The non-contact optical writing apparatus according to claim 1, further comprising an adjustment mechanism for moving the imaging lens in the same direction as the optical axis direction of each laser beam.   The thermal recording is performed by moving one or both of the semiconductor laser array and the thermal recording medium and moving the laser beams output from the semiconductor laser array in a direction perpendicular to the arrangement direction of the laser beams. 2. The non-contact optical writing apparatus according to claim 1, further comprising a moving mechanism that irradiates the medium and records and erases the data on the thermal recording medium.   The laser beam is arranged between the semiconductor laser array and the imaging lens, and the laser beams outputted from the semiconductor laser array are arranged in parallel to the line direction of the semiconductor laser array, and the semiconductor laser is within the optical axis direction. 2. The non-contact optical writing apparatus according to claim 1, further comprising a cylindrical lens having imaging power in a direction perpendicular to the line direction of the array.   8. The non-contact optical writing apparatus according to claim 7, wherein the cylindrical lens is formed so that at least a length corresponding to the line direction of the semiconductor laser array is longer than a length of the semiconductor laser array in the line direction. .   2. The non-collimating lens according to claim 1, further comprising a collimating lens that is disposed between the semiconductor laser array and the imaging lens and collimates the laser beams output from the semiconductor laser array into parallel light. Contact light writing device.   10. The non-contact optical writing apparatus according to claim 9, wherein the collimating lens comprises a plurality of microlenses that collimate the laser beams output from the semiconductor laser array into parallel lights.   10. The non-contact optical writing apparatus according to claim 9, wherein the imaging lens is composed of a plurality of microlenses for imaging the parallel lights collimated by the collimating lens on the thermal recording medium. A transport mechanism for transporting an object to which a rewritable thermal recording medium capable of recording and erasing data is attached;
A plurality of light emitting points each emitting a laser beam arranged in a line, and a semiconductor laser array provided in a direction perpendicular to the direction of transport of the object by the transport mechanism;
The semiconductor laser with respect to the thermosensitive recording medium provided to be movable in the same direction as the optical axis direction of each laser beam emitted from the semiconductor laser array and attached to the object being transported by the transport mechanism An imaging lens for imaging each laser beam emitted from the array;
A non-contact optical writing system comprising:   13. The non-contact optical writing according to claim 12, wherein the semiconductor laser array is provided on at least one direction of an upper side, a lower side, or a side side with respect to the object being transported by the transport mechanism. system. A distance sensor for measuring the distance to the thermal recording medium;
A lens drive control unit for moving the imaging lens in the same direction as the optical axis direction of each laser beam based on the measurement result of the distance by the distance sensor and imaging each laser beam on the thermal recording medium When,
The contactless optical writing system according to claim 12, comprising:

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