JP2010005739A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cut an object to be cut to a desired depth by fixing the edge of a cutter with a simple configuration. <P>SOLUTION: A cutting device 1 includes a placing table 3 placing the object to be cut, regulating parts 15, 17 in which an insertion port for inserting the edge of the cutter and a cutter insertion part 13 having a smaller opening than the insertion port are formed, fixing the edge to be projected from the opening when inserting the cutter into the insertion part 13 and pressing against the opening, and regulating the length of the edge projected to make a cut in the object to be cut placed on the placing table 3 to a desired depth by the edge of the cutter projected from the opening, and a slide rail 21 slidably guiding a slide block 10 parallel to the placing table 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cutting device, and more particularly, to a cutting device that cuts an object to be cut at a predetermined depth.

As a release paper cutting tool such as an adhesive sheet with release paper, for example, there is one described in Patent Document 1. In the tool described in Patent Document 1, a guide plate is provided on a disc-shaped cutter in a direction perpendicular to the cutter body from the front and front end of the cutter body, and the guide plate is inserted between the release paper and the adhesive sheet, and peeled off. It cuts only paper.
In addition, there are cutting devices as described in Patent Documents 2 to 5.
JP 2003-340174 A Japanese Patent Laid-Open No. 10-156060 JP 2000-94379 A JP 2003-126572 A JP 11-319336 A

  When the release paper is peeled off by the tool described in Patent Document 1, a part of the adhesive is peeled off from the sheet because the part is inserted into the pressure-sensitive adhesive between the release paper and the sheet, and the adhesive strength of the sheet is reduced. The sheet may be peeled off from the surface to be pasted.

According to the present invention, a mounting table for mounting an object to be cut;
An insertion opening for inserting a cutter blade edge and an insertion portion having an opening smaller than the insertion opening are formed, and when the cutter is inserted into the insertion portion and pressed against the opening, the blade edge is removed from the opening. The length by which the cutting edge protrudes so that the cutting object fixed by protruding and placed on the mounting table is cut at a predetermined depth by the cutting edge of the cutter protruding from the opening. Regulatory means to regulate
There is provided a cutting device comprising: guide means for guiding the restricting means so as to be slidable parallel to the mounting table.

  Thereby, the cutting edge of the cutter can be fixed at a desired depth by fixing the cutting edge of the cutter with a simple configuration. For example, it is possible to make cuts only in a desired layer of a sheet formed by laminating a plurality of sheets, for example, the first layer.

  ADVANTAGE OF THE INVENTION According to this invention, the cutting edge of a cutter can be cut | disconnected by desired depth by fixing the blade edge | tip of a cutter with simple structure.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is an external view of a cutting device according to the present embodiment. The cutting apparatus 1 according to the present embodiment includes a mounting table 3 on which an object to be cut is placed, an insertion port 18 (FIG. 8) into which a cutting edge of a cutter 5 (FIG. 8) is inserted, and an opening 19 (FIG. 8) smaller than the insertion port 18. 8) is formed, and when the cutter is inserted into the insertion portion 13 and pressed against the opening 19, the cutting edge is protruded from the opening 19 and fixed to the mounting table 3. A restricting portion (slide block 10, restricting portion first) that regulates the length at which the cutting edge protrudes so that the placed object is cut at a predetermined depth by the cutting edge of the cutter 5 protruding from the opening 19. 1 part 15, a restriction part second part 17), and a guide part (slide rail 21, slide bush 11) that guides the slide block 10 so as to be slidable parallel to the mounting table 3.

  In this embodiment, the material to be cut can be a pressure-sensitive adhesive sheet with release paper, and the restriction parts (the restriction part first part 15 and the restriction part second part 17) cut only the release sheet of the pressure-sensitive adhesive sheet. The adhesive sheet with release paper can be regulated to have a cut at a predetermined depth.

  Furthermore, in this embodiment, the adhesive sheet with release paper of the object to be cut is a backing film that is attached to protect the back surface of the semiconductor wafer on the suction surface that adsorbs the back surface of the semiconductor wafer when transporting the semiconductor wafer. The backing film is attached so that the release paper can be peeled off via the adhesive layer.

  The backing film is adsorbed on the top ring 55 of the wafer transfer unit 51 for transferring the wafer 53 as shown in FIG. 2 in the wafer transfer and processing of a chemical mechanical polishing (CMP) apparatus during the manufacture of the semiconductor device. Affixed to the surface to protect the back surface 53a of the wafer 53, and is periodically replaced. The wafer 53 is transported and processed by adsorbing the back surface 53a of the wafer 53 to the backing film 61 attached to the top ring 55.

  FIG. 3 is a cross-sectional view of the backing film 61. The backing film 61 is a layered circular film in which a release paper 65 is attached to one surface via an adhesive 63 on one surface. The backing film 61 of the present embodiment has a thickness including the release paper 65 of 0.8 mm, and the release paper 65 has a thickness of 0.2 mm.

  The adhesive force of the adhesive 63 of the backing film 61 is strong, and it is not easy to peel off the release paper 65 when the backing film 61 is replaced.

  When the release paper 65 of the backing film 61 is peeled off without using the cutting device 1 of the present embodiment, as shown in FIG. 4A, the tool 71 having a flat pointed tip is used as the release paper 65 and the backing film 61. And the release paper 65 is peeled off from the backing film 61 as shown in FIG. However, when the release paper 65 is peeled off using the tool 71 as described above, a part 67 of the adhesive 63 may be peeled off as shown in FIG. Therefore, when the backing film 61 is affixed to the top ring 55, the portion 67 from which the adhesive 63 of the backing film 61 has been peeled off is likely to peel off from the surface of the top ring 55 as shown in FIG. When the backing film 61 is peeled off, the wafer 53 cannot be adsorbed, so that the conveyance failure of the wafer 53 and the dropping of the wafer 53 occur due to the vacuum pressure drop.

  The cutting device 1 according to the embodiment of the present invention makes it possible, for example, to cut only the release paper 65 of the backing film 61 and peel the release paper 65 from the backing film 61 without removing the adhesive 63.

  Fig.1 (a) is a top view of the cutting device 1 of this embodiment, FIG.1 (b) is the front view. The cutting apparatus 1 according to the present embodiment includes a mounting table 3 on which an object to be cut is mounted, a slide block 10, and two slide rails 21 that guide the slide block 10 to be slidable in parallel with the mounting table 3. And a rail support portion 23 that supports the two slide rails 21 in parallel at both ends of the mounting table 3.

  The slide block 10 is provided with bearings such as two slide bushes 11 so as to be slidable parallel to the mounting table 3 on the two slide rails 21.

  In the present embodiment, the mounting table 3 has a length in the short side direction, for example, approximately the diameter of the backing film 61 that is the object to be cut, and a length in the longitudinal direction that the slide block 10 is the object to be cut. The length is preferably movable to the outside on both sides of the backing film 61.

  Further, the slide block 10 includes a height adjusting screw 31, and adjusts the position in the height direction of the restricting portion composed of the restricting portion first part 15 and the restricting portion second part 17, so that the restricting portion second part 17 is attached. It can be fixed in place.

  Thus, in this embodiment, the adjustment part (height adjustment screw 31) which adjusts the distance of the to-be-cut object mounted on the mounting base 3, and the blade edge | tip of a cutter can be further provided.

  FIG. 5 is an assembly diagram of the restriction part first part 15 and the restriction part second part 17 constituting the restriction part of the cutting device 1 of the present embodiment. The restriction part first component 15 is provided with screw holes 35 of fixing screws 33 at both ends. The restriction part second component 17 is formed with an insertion port 18 for inserting the cutting edge of the cutter and a recess 20 having an opening 19 smaller than the insertion port 18 on one surface 17a, and a screw hole 37 of the fixing screw 33. It is provided at both ends. The insertion port 18 has a size and a shape into which the cutter blade can be inserted.

  In the present embodiment, the cutter is not limited to this. For example, the cutter is a commercially available hand-held cutter 5 shown in FIG. 10 and has a thin blade 7.

  Returning to FIG. 5, the slide block 10 is formed with a concave portion 10 a that is coupled to the restriction portion second component 17 and accommodates the movable movable portion 12 having a rectangular parallelepiped shape below the front side. The height adjustment screw 31 is attached to the movable portion 12 that passes through the screw hole at the top of the slide block 10 and is accommodated below the recess 10a.

  The restriction part first part 15 and the restriction part second part 17 are screwed into the screw holes (not shown) provided at both ends of the movable part 12 with fixing screws 33, so that the concave part of the restriction part second part 17 is secured. The cutter insertion part 13 is formed by 20 and one surface 15a of the restriction part first part 15 facing the restriction part second part 17.

  Although not particularly limited, for example, as shown in FIG. 6, the restriction part second component 17 is a rectangular parallelepiped having a length in the longitudinal direction of 20 mm, a length in the short direction of 5 mm, and a height of 4 mm. A concave portion 20 is provided in one side surface 17 a of the second component 17. The recess 20 has a trapezoidal shape of 10 mm on the insertion port 18 side and 3.5 mm on the opening 19 side, a height of 4 mm, and a depth of 0.7 mm. The shape of the recess 20 is not limited to a trapezoid, but the trapezoidal slope of the recess 20 is preferably formed so as to coincide with the angle or shape of the cutter blade edge. The depth of the concave portion 20 is deeper than the thickness of the cutter blade edge, and when the cutter blade edge is inserted into the cutter insertion portion 13 formed by one surface of the concave portion 20 and the regulating portion first part 15, the cutter It is preferable to have such a depth that the blade edge is not rattled.

  Moreover, the cross-sectional shape of the cutter insertion part 13 in the cutter insertion direction is not limited to a trapezoid. For example, when a cutter having a rotary disk-shaped blade is used, the cutter insertion part 13 in the cutter insertion direction The cross-sectional shape may be a semicircular shape. What is necessary is just to determine the width | variety of the opening part 19 so that a circular blade edge may protrude from the opening part 19 of the cutter insertion part 13 by a fixed amount.

  When the blade 7 of the cutter 5 is inserted into the cutter insertion part 13 as shown in FIG. 8A, when the cutter 5 is pressed against the opening 19 of the cutter insertion part 13 as shown in FIG. 8B. The blade 7 can be fixed by protruding from the opening 19 by a certain amount N. In the present embodiment, the blade 7 of the cutter 5 can protrude from the opening 19 of the cutter insertion part 13 by about 2 mm, for example.

  Thus, the protrusion amount of the blade 7 from the opening 19 is set to a constant amount N, and for example, the blade 7 is pierced only into the release paper 65 of the backing film 61 as shown in FIG. As will be described later, it is preferable to set the position of the slide block 10 in the height direction in consideration of the thickness of the backing film 61 placed on the placing table 3 and the thickness of the release paper 65.

  As shown in FIG. 5, the height adjusting screw 31 is attached to the rectangular parallelepiped movable portion 12 accommodated below the recess 10 a of the slide block 10, and as shown in FIG. 10, the movable portion 12. The height adjusting screw 31 can be adjusted to the distance from the upper surface of the mounting table 3 of the restriction part second component 17 fixed to the fixing part 33. In this embodiment, the distance H from the upper surface of the mounting table 3 of the blade 7 of the cutter 5 can be adjusted with the height adjusting screw 31 within a range of 2 mm or less, for example.

  As shown in FIG. 7, if the inclination angle B of the concave portion 20 of the restricting part second component 17 and the angle A of the cutter blade 7 are the same, a large blade 7 as shown in FIG. Even in the small blade 7 as in b), the length of the blade 7 protruding from the opening 19 is constant depending on the width C of the insertion port 18 or the width of the opening 19.

Operation | movement of the cutting device 1 of this embodiment comprised in this way is demonstrated.
As shown in FIG. 9, the backing sheet 61 of the backing film 61 is placed on the mounting table 3 of the cutting device 1 with the release paper 65 facing upward. In the cutting apparatus 1 according to the present embodiment, the slide block 10 having the cutter insertion portion 13 into which the cutter 5 is inserted slides the moving range M from the position L1 on one end side of the slide rail 21 to the position L2 on the other end side. It can be moved. The moving range M is preferably wider than the cutting width of the object to be cut, and in this embodiment, the moving range M is movable within a range larger than the diameter of the backing film 61.

  As shown in FIG. 12, the release paper 65 of the backing film 61 is simply pulled from one side of the slide rail 21 to the other while inserting the blade 7 of the cutter 5 into the cutter insertion portion 13 of the slide block 10 and pressing it. You can only cut into

  Then, as shown in FIG. 13, the release paper 65 with the notch K (FIG. 13 (a)), and the backing film 61 is lightly bent so as to pop out the release paper 65 side (FIG. 13 (b)). The release paper 65 can be easily peeled off from the backing film 61 (FIG. 13C) and removed (FIG. 13D).

  As described above, according to the cutting device 1 of the present embodiment, the cutting edge of the cutter can be fixed with a simple configuration, and the object to be cut can be cut at a desired depth. For example, it is possible to make cuts only in a desired layer of a sheet formed by laminating a plurality of sheets, for example, the first layer. Therefore, for example, a cut can be made only in the release paper of the sheet with the release paper, and the release paper can be peeled off from the sheet simply by bending the cut outward. At this time, the adhesive layer of the sheet is not partially peeled off, and the adhesive strength of the sheet is not impaired.

  In the backing film 61 of this embodiment, the release paper 65 can be peeled off without peeling off the adhesive 63 of the backing film 61, and the backing film 61 can be attached to the top ring 55. It is possible to prevent abnormal conveyance or dropping of the wafer 53 due to the decrease.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

It is an external view of the cutting device in embodiment of this invention. It is a figure explaining the conveyance part of the semiconductor wafer of CMP apparatus. It is sectional drawing of the backing film used with the conveyance part of FIG. It is a figure for demonstrating peeling of an adhesive when the peeling paper of a backing film is peeled using a tool. It is an assembly drawing of the control part of the cutting device of FIG. It is an external view of the 2nd component of the control part of FIG. It is a figure explaining the relationship between the shape and magnitude | size of the blade edge | tip of a cutter, and the protrusion amount from the opening part of a blade edge | tip. It is a figure explaining the length of the blade edge which protrudes, when the blade edge of a cutter is inserted in the cutter insertion part. It is a figure for demonstrating the movement range of the slide block of FIG. It is a figure for demonstrating the adjustment by the adjustment part of the cutting device of this embodiment. It is a figure for demonstrating the protrusion amount of the blade edge | tip of the cutter which cuts into the release paper of a backing film using the cutting device of FIG. It is a figure for demonstrating the cutter movement operation | movement of the cutting device of FIG. It is a figure for demonstrating the cutting | disconnection operation | movement of the release paper of a backing film using the cutting device of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cutting device 3 Mounting base 5 Cutter 7 Blade 10 Slide block 10a Recess 11 Slide bush 12 Movable part 13 Cutter insertion part 15 Restriction part 1st part 17 Restriction part 2nd part 18 Insertion port 19 Opening 20 Recess 21 Slide rail 23 Rail Support part 31 Height adjustment screw 33 Fixing screw 35 Screw hole 37 Screw hole 51 Wafer transfer part 53 Wafer 55 Top ring 61 Backing film 63 Adhesive 65 Release paper

Claims (6)

A mounting table for mounting the workpiece;
An insertion opening for inserting a cutter blade edge and an insertion portion having an opening smaller than the insertion opening are formed, and when the cutter is inserted into the insertion portion and pressed against the opening, the blade edge is removed from the opening. The length by which the cutting edge protrudes so that the cutting object fixed by protruding and placed on the mounting table is cut at a predetermined depth by the cutting edge of the cutter protruding from the opening. Regulatory means to regulate
A cutting device comprising: guide means for guiding the restricting means so as to be slidable parallel to the mounting table. The cutting device according to claim 1, wherein
The object to be cut is an adhesive sheet with release paper,
The said control means is a cutting device which controls so that cutting may enter into the said adhesive sheet with a release paper by the said predetermined depth so that only the release paper of the said adhesive sheet may be cut | disconnected. The cutting device according to claim 2, wherein
The pressure-sensitive adhesive sheet with release paper is a backing film that is attached to an adsorption surface that adsorbs the back surface of the semiconductor wafer during transportation of the semiconductor wafer to protect the back surface of the semiconductor wafer,
The backing film is a cutting device to which the release paper is detachably attached via an adhesive layer. The cutting device according to any one of claims 1 to 3,
The said insertion part is a cutting device which has a shape similar to the shape of the said blade edge | tip of the said cutter. The cutting device according to any one of claims 1 to 4,
A cutting apparatus in which the cutter is a commercially available cutter. The cutting device according to any one of claims 1 to 5,
A cutting apparatus further comprising adjusting means for adjusting a distance between the workpiece to be placed on the mounting table and the cutting edge of the cutter.

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