JP2010003714A - Component supply device and component-mounting device - Google Patents

Abstract

An object of the present invention is to improve the efficiency of loading a storage tape into a component supply device and to supply components stably.
A first wing portion (20a) and a second wing portion (20b) are provided on a peeling block (11) for peeling a cover tape (8) from a carrier tape (7) of a component tape (2). Since the upper surface of the component storage chamber 9 is covered at the position D before the cover tape 8 is released from the carrier tape 7 by entering the gap between the component 8 and the tape 8, the component 13 does not jump out to the removal position 12. A sufficient gap distance L1 can be secured when the tape is filled and transported.
[Selection] Figure 5

Description

  The present invention relates to a component supply device and a component mounting device.

  In general, in the field of circuit board manufacturing and assembly, in the process of mechanically and / or electrically mounting a component to a circuit board, the component (electronic component or mechanical component) is supplied to the component mounting apparatus. To assemble or assemble. In general, components mounted on the surface of an object to be mounted such as a substrate are supplied in a state of being stored in a component tape.

  The component tape is composed of a carrier tape that is a lower tape provided with a component housing portion for each component, and an upper cover that covers the carrier tape, that is, a cover tape (protective tape). The component tape is supplied in a state where the component is placed in the corresponding component accommodating portion of the carrier tape, the cover tape is attached to the carrier tape, and the component tape is wound around the component reel.

  The cover tape is attached to the carrier tape by, for example, providing an adhesive area on the cover tape or the carrier tape, or by fusing the cover tape to the carrier tape.

  In order to be able to use the component tape, the component reel on which the component tape is wound is supplied to a specific predetermined pick-up position by the component supply device of the component mounting device, where the component is picked up by the pickup head of the component supply device. It is necessary to carry out the work of removing the component from the component tape. Patent Document 1 and Patent Document 2 show a component supply device for this type of component mounting apparatus.

FIG. 7 is a diagram illustrating a configuration of a component supply device described in Patent Document 1 or Patent Document 2. In FIG.
In the conventionally used method as described in these documents, as shown in FIG. 7, a tape guide 70 for guiding a component tape 71 composed of a carrier tape 72 and a cover tape 73 is provided as a component mounting apparatus. The tape guide 70 is provided with an exposing means 78 for exposing the component 74 accommodated in the partitioned component accommodating chamber 75 at the pick-up position 77.

  The exposing means 78 peels and lifts a part 73a of the cover tape 73 from the carrier tape 72, and keeps the non-peeling tape portion 73b that is not peeled off of the cover tape 73 attached to the carrier tape 72. Separating means 78 a for moving the lifted release tape portion 73 a of the tape 73 to the side is provided, and the separating means 78 a further includes a tip end portion 78 b for separating the cover tape 73 from the carrier tape 72. The tip 78b of the separating means 78a protrudes upstream with respect to the feeding direction a of the component tape 71, and the tip 78b is inserted into the gap between the carrier tape 72 and the cover tape 71. Has been placed.

  By the way, the component accommodating chamber 75 on the component tape 71 must have a sufficient space for accommodating the component 74. At the same time, the movement of the component 74 is restricted in the component accommodating chamber 75, and the carrier tape 72 In order to provide as many component storage chambers 75 as possible above, there is a conflicting requirement that the component storage chambers 75 must be as small as possible.

  Therefore, depending on the size (width direction dimension, length direction dimension, thickness) of the component 74 to be accommodated, the size (width direction dimension, length direction dimension, depth) of the component storage chamber 75 can vary. The position of the component storage chamber 75 on the component tape 71 and the distance between the component storage chambers 75 are variously different depending on the position of the adhesive or the welding area, the width of the cover tape 73, and the like. Therefore, the width and thickness of the component tape 71 vary widely. Furthermore, even with the component tape 71 having the same width, the distance from the width direction end of the component storage chamber 74 to the width direction end of the carrier tape 72 may vary depending on the width of the component storage chamber 74.

  As described above, since the form of the component tape 71 is diverse, in the component supply apparatus described in Patent Document 1 or Patent Document 2, the separating means 78a is peeled to the non-peeling tape portion 73b of the cover tape 73. Therefore, it is necessary to adjust the dimension of the separating means 78a in accordance with the form of the component tape 71. Therefore, a plurality of types of tape guides 70 each having separation means 78 having different dimensions must be manufactured corresponding to the size of the component storage chamber 75 on the component tape 71, and the component mounting apparatus is replaced with the actual component tape 71. When using for production using a tape, an appropriate tape guide 70 that exactly matches the component tape 71 must be selected.

  However, producing a plurality of types (various types) of tape guides 70 corresponding to various forms of component tapes 71 is uneconomical in terms of manufacturing costs and storage / management costs. At this time, it is very troublesome to select an appropriate tape guide 70 from various types of tape guides 70, which is uneconomical from the viewpoint of production efficiency.

  Further, when the tape guide 70 corresponding to the component tape 71 is mistaken, there is a problem that the component 74 is not exposed well at the pick-up position 77 and a suction failure occurs. Further, when the adhesive portion remaining on the non-peeling tape portion 73b side is weak, when the cover tape 73 is bent by the separating means 78a, the adhesive portion on the non-peeling tape portion 73b side peels off due to the external force. Then, the cover tape 73 is separated from the carrier tape 72 and sent to the downstream side, and the peeled cover tape 73 in the vicinity of the suction position interferes with picking up the component 74 of the component mounting apparatus and sucks it. There was a problem that a defect occurred.

As another conventional cover tape peeling method, there is a method used in the component supply apparatus described in Patent Document 3.
FIG. 8 is a diagram showing a component supply device described in Patent Document 3, and FIG. 8A is a side view schematically showing a state of a component tape or the like when this component supply device is used. FIG. 8B is a perspective view showing a state when the guard plate (suppressor) used in the component supply device is lifted and separated from the component tape.

  In the method used in the component supply apparatus described in this Patent Document 3, as shown in FIG. 8A, the cover tape 83 is completely peeled off from the carrier tape 82 and lifted, and is moved in the direction of the arrow c. to recover. With this method, each component 84 can be reliably exposed at the lower position of the nozzle (pickup position 87) regardless of the width of the component storage chamber 85 on the component tape 81.

  In this method, in order to collect the peeled cover tape 83, a take-up hub 86 around which the cover tape 83 is wound is provided. In addition, the component tape 81 is pressed from above to bring the component tape 81 downstream (in FIG. 8A). A guard plate (suppressor) 88 is provided for guiding the component tape 83 in the direction of arrow b, and a slit 88c serving as a fulcrum when the cover tape 83 is peeled off is provided in the guard plate 88. ing.

  In the method of completely peeling the cover tape 83 from the carrier tape 82 and lifting it up as described in Patent Document 3, when the cover tape 83 is peeled from the carrier tape 82, the component 84 is accommodated. Since the upper surface of the component housing chamber 85 is exposed, if the cover tape 83 is charged with static electricity at this time, the component 84 adheres to the cover tape 83 peeled off from the carrier tape 82 due to the static electricity. Then, together with the cover tape 83 collected in the direction of the arrow c, the part 84 also moves in the direction of the arrow c.

  In order to prevent this, in the component supply apparatus described in Patent Document 3, as shown in FIG. 8A, when the cover tape 83 is peeled, the downstream plate is disposed downstream of the peeling position. 88b covers the upper surface of the component storage chamber 85 so that the component 84 does not move together with the cover tape 83.

  Further, since the cover tape 83 is peeled to the upper upstream side as the take-up hub 86 rotates, the component tape 81 on the upstream side is prevented so that the carrier tape 84 is not pulled upward by the cover tape 83 and lifted upward. It is necessary to hold down the top surface. Therefore, in the component supply apparatus described in Patent Document 3, as shown in FIG. 8A, the carrier tape 82 is prevented from being lifted by pressing the upper surface of the component tape 81 with the upstream plate 88a. It is out.

  As described above, the upper surface of the component tape 81 is covered by the upstream plate 88a and the downstream plate 88b. However, in order to wind the cover tape 83 upward by the winding hub 86, the part tape 81 is peeled off. The upper part tape 81 needs to be opened at (peeling position), and therefore a slight gap, that is, a slit 88c needs to be provided between the upstream plate 88a and the downstream plate 88b.

  The dimension of the slit 88c is so small that the component 84 cannot pass through the slit 88c so that the component 84 does not move in the direction of the arrow c when the component 84 adheres to the cover tape 83. Although it is necessary, the smaller the slit 88c is, the more difficult it is to perform the operation of passing the cover tape 82 through the slit 88c in advance when filling the tape 81 with the component tape 81.

In the component supply apparatus described in Patent Document 3, as shown in FIG. 8B, in order to facilitate the operation of passing the cover tape 83 through the slit 88c, the opening end of the slit 88c is formed on the side surface of the guard plate 88. A side opening 88d communicating with the portion is opened.
Special Table 2002-533943 JP 2005-503677 gazette JP 2006-156514 A

  In the component supply apparatus described in Patent Document 3, as shown in FIG. 8B, it is attempted to somewhat facilitate the operation of passing the cover tape 83 through the slit 88c by providing a side opening 88d. However, the slit 88c is still set to a size smaller than that of the component 84. Therefore, this operation is very complicated and requires a lot of time and effort, and the small size of the slit 88c deteriorates the work efficiency. It is the cause.

  Further, when the guard plate 88 covers both the upstream side and the downstream side of the slit 88c as shown in FIG. 8A, it is very difficult to pick up the cover tape 83 of the component tape 81 from the small slit 88c. Have difficulty.

  Therefore, when supplying a new component tape 81 when starting the component supply or when the component runs out, the guard plate 88 is once lifted upward and separated from the component tape 81, that is, the guard plate 88 is moved to the position shown in FIG. After the cover tape 83 is passed through the slit 88c after being held in the open state as shown in b), the guard plate 88 is again put on the component tape 81 after passing, and the guard as shown in FIG. The plate 88 must be returned to the closed state.

  That is, in order to replenish the component tape 81, it is necessary to take steps such as opening the card plate 88, passing the cover tape 83 through the slit 88c, and closing the guard plate 88. It was such a work.

  Further, by rotating the winding hub 86, the cover tape 83 is peeled off and returned to the winding hub 86 at the same time, but depending on the type of the cover tape 83 and the winding force of the winding hub 86, A large force may act on the cover tape 83. In this case, the cover tape 83 is torn, so that the winding cannot be continued and the supply of the component 84 is stopped.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide a component supply device that can stably absorb components and can improve the efficiency of loading a component tape.

  In order to achieve the above object, among the component supply device and the component mounting device of the present invention, the component supply device according to claim 1 includes a carrier tape having a plurality of component storage chambers for storing components, A component tape is composed of a first adhesive portion and a cover tape bonded to the carrier tape at a position where the component accommodating chamber is sandwiched, and the cover tape of the component tape is A component supply device that peels from the carrier tape and supplies the components in the component housing chambers, the peeling means for peeling the first adhesive portion and the second adhesive portion, and the peeling means for peeling. A winding means for winding the cover tape, and a return hand for changing the feeding direction of the cover tape peeled off by the peeling means to the feeding direction to the winding means. And the peeling means includes a first peeling portion that peels off the first adhesive portion, a second peeling portion that peels off the second adhesive portion, the first peeling portion, and Between the component housed in the component housing chamber and the cover tape, the second peeling portion is located upstream of the position where the first peeling portion and the second bonding portion peel from each other in the feed direction. And a component pressing portion that covers and covers at least a part of the upper surface of the component storage chamber.

  By configuring in this way, the upper surface of the component storage chamber is covered with the component pressing portion before the cover tape is peeled off, so that there is no possibility that the component jumps out or moves with the peeled cover tape. There is no need to provide an upstream plate, and a gap for passing the cover tape can be made large.

  According to a second aspect of the present invention, there is provided the component supply device according to the first aspect, wherein the component pressing portion is constituted by a tip portion on the upstream side of the contact point between the first peeling portion and the second peeling portion. It is characterized by.

  By configuring the component pressing portion at the upstream end portion of the contact point between the first peeling portion and the second peeling portion, a component having a small width can be used as a contact point between the first peeling portion and the second peeling portion. It can be covered with the tip, and a wide part can be covered with the lower surface of the first peeling part and the second peeling part slightly downstream, so that it can be used for parts tapes and parts of various sizes. be able to.

  The component supply device according to claim 3 is the component supply device according to claim 1 or 2, wherein the return means is provided above the downstream side of the upstream end portion of the peeling means. It is characterized by.

  By providing the return means above the downstream side of the upstream end portion of the peeling means, it is possible to prevent the carrier tape from being pulled up by the cover tape and rising upward even if there is no upstream plate.

  A component supply apparatus according to a fourth aspect is the component supply apparatus according to any one of the first to third aspects, wherein the cross-sectional shape of the return means is circular.

  By making the cross-sectional shape of the return means circular, the peeled cover tape is not caught on the return means, and the peeled cover tape can be collected smoothly.

  According to a fifth aspect of the present invention, there is provided a component mounting apparatus according to any one of the first to fourth aspects, a component take-out device that takes out a component in a component storage chamber, and a target on which the component is mounted. And a board transfer device for transferring the mounting body to a predetermined position.

  By incorporating the component supply apparatus according to the present invention into the component mounting apparatus, the work efficiency of the entire component mounting apparatus can be improved.

  According to the present invention, there is no need to provide an upstream plate, and the upper portion upstream from the gap for passing the cover tape is opened, so that the operation of loading the component tape into the component supply device is to pass the cover tape through the gap. It can be completed by the procedure, and a large gap for passing the cover tape is prepared, so that it becomes easy to load the component tape into the component supply device, and the working efficiency is improved.

  In addition, when the present invention is used for a component supply device, there is no risk that the component will pop out, move with the peeled cover tape, or the carrier tape may be pulled up by the cover tape and lift upward. Therefore, stable component supply can be realized, and when used in a component mounting apparatus, stable component suction can be realized thanks to stable component supply.

  In addition, since it can handle various types of component tapes and parts, it is not necessary to select an appropriate device from multiple types of devices according to the size of the component tape and components, and the component supply using the present invention By using the apparatus and the component mounting apparatus, it is possible to increase the production efficiency of a product in which the component is mounted on the mounted body.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 and 2 show a component mounting apparatus 100 according to an example of an embodiment of the present invention. FIG. 1 is a perspective view showing an overall outline of a component mounting apparatus 100 according to an embodiment of the present invention. FIG. 2 is an enlarged side view showing the vicinity of a component supply apparatus 106 in the component mounting apparatus 100.

  As shown in FIG. 1, a tape reel 1 around which a component tape 2 (shown in FIG. 2) is wound is installed in the component mounting apparatus 100. As shown in FIG. The component 13 housed inside is taken out, and the component 13 is mounted on the substrate 103 which is a mounted body.

The component mounting apparatus 100 is configured to include a component supply apparatus 106 that supplies the component 13 to the component mounting apparatus 100, and a suction conveyance unit 102.
The suction conveyance unit 102 takes out the component 13 from the component tape 2 and conveys it to the substrate 103. The suction conveyance unit 102 is configured by a general conveyance device, and is movable up and down and left and right, and draws air to adsorb the component 13. The substrate 103 is transferred to a predetermined position by a substrate transfer means (not shown).

  The component supply device 106 is detachably attached to the component mounting device 100 and has a tape reel 1 around which the component tape 2 is wound. The component supply device 106 engages the teeth of the sprocket 3 shown in FIG. 2 with a feed hole 10 provided intermittently in the component tape 2, so that the sprocket 3 as a feed mechanism rotates, thereby the component tape. 2 is sent to the left side of the drawing, that is, in the direction of the arrow 4 (feeding direction) in FIG. While being fed in the direction of the arrow 4, the component tape 2 is guided by the tape guide 5.

The side to which the component tape 2 is sent (the direction of arrow 4, the left side in FIG. 2) is the downstream side, and the side to which the component tape 2 is sent (the reverse direction of the arrow 4, the right side in FIG. 2) is the upstream side. And
FIG. 3 is a perspective view showing a part of the tape guide 5 and part tape 2 as viewed obliquely from above, and FIG. 4 is an enlarged view of the periphery of the peeling block 11 in FIG. .

  As shown in FIGS. 3 and 4, the component tape 2 includes a carrier tape 7 and a cover tape 8. The carrier tape 7 has a component housing chamber 9 for housing the component 13 and a feed hole 10 engaged with the sprocket teeth. Further, since the component storage chamber 9 is usually formed by a hole penetrating the carrier tape 7, the component tape 2 is preferably not shown in order to prevent the component from falling through the carrier tape 7. Has a lower tape.

  Further, the component tape 2 accommodates one component 13 for each component accommodating chamber 9 and, as shown in FIG. The component housing chamber 9 is sealed with the cover tape 8 by gluing or welding the first adhesive portion 19a and the second adhesive portion 19b.

The tape guide 5 includes elongated tape guide wall members 14a and 14b facing each other.
When the component tape 2 is guided and sent by the tape guide 5, as shown in FIG. 4, the component tape 2 passes below the peeling block (peeling means) 11, and the peeling block 11 is connected to the first adhesive portion 19a. And the cover tape 8 is peeled from the carrier tape 7 by peeling the 2nd adhesion part 19b. The cover tape 8 completely peeled off from the carrier tape 7 is changed in direction by a return bar (return means) 21 and taken up by a take-up mechanism 22, and the component 13 is continuously exposed at the take-out position 12. The component 13 is taken out by the pickup head (not shown) of the suction conveyance unit 102 at the take-out position 12.

  FIG. 5 is a view showing the vicinity of the peeling block 11, FIG. 5 (a) is a top view of the vicinity of the peeling block 11, and FIG. 5 (b) is a plan view showing the peeling block 11 and its vicinity. In this drawing, the cover tape 8 is partially removed so that the peeling block 11 can be seen well.

  The peeling block 11 has a thin blade-shaped first wing part 20a (first peeling part) and second for peeling the first adhesive part 19a and the second adhesive part 19b of the cover tape 8 from the carrier tape 7, respectively. A wing portion 20b (second peeling portion), and the component 13 is covered by the static electricity charged on the cover tape 8 when the component 13 jumps out of the plurality of component storage chambers 9 to the take-out position 12 due to vibration of conveyance or the like. As shown in FIG. 5 (a), the component pressing portion 18 composed of the upstream tip portion of the contact point between the first wing portion 20a and the second wing portion 20b is provided so as not to adhere to the tape 8. The upper surface of the storage chamber 9 is covered and can be in close contact with the carrier tape 7.

  The first wing portion 20a and the second wing portion 20b are arranged such that the upstream end of the first wing portion 20a and the second wing portion 20b are located at substantially the upper center of the component storage chamber 9 of the component tape. It becomes the shape which spreads in the width direction as going to. The first wing portion 20a and the second wing portion 20b may have a mirror-symmetric shape, but may have an asymmetric shape as shown in FIG.

  Further, the component pressing portion 18 formed at the front end portion of the contact point between the first wing portion 20a and the second wing portion 20b on the upstream side in the feed direction, as shown in FIG. On the other hand, it is thinner on the upstream side and thicker toward the downstream side.

  Since it is thin on the upstream side, the component pressing portion 18 formed of the tip portion enters the gap between the carrier tape 7 and the cover tape 8 as the component tape 2 is sent to the downstream side, and the first Before the cover tape 8 is peeled off from the carrier tape 7 by the wing portion 20a and the second wing portion 20b, at the position D in the drawing, that is, the first wing portion 20a and the second wing portion 20b are the first adhesive portions. 19a and the second adhesive portion 19b are moved upstream of the position in the feed direction from the position where the second adhesive portion 19b is peeled between the component 13 accommodated in the component accommodating chamber 9 and the cover tape 8, and the upper surface of the component accommodating chamber 9 is Can be covered.

Thereby, the component 13 does not jump out even when the cover tape 8 is peeled off, and is reliably conveyed to the take-out position 12.
Further, since the component pressing portion 18 becomes thicker toward the downstream side, after the tip portion enters the gap between the carrier tape 7 and the cover tape 8, the tape is further sent downstream. Then, as shown in FIG. 5B, the center portion of the cover tape 8 runs over the first wing portion 20a and the second wing portion 20b.

  Then, the component tape 2 is sent further downstream from this state, and the first adhesive portion 19a and the second adhesive portion 19 are moved to the thin blade-shaped first wing portion 20a and the second wing portion 20b, respectively. When close to each other, the adhesive portions 19a and 19b are generated by the center portion of the cover tape 8 running upward, the force to push and spread from the center portion to the width direction end portion, and the thin blade-shaped wing portion. As the component tape 2 is sent downstream, the adhesive portions 19a and 19b are naturally peeled off as the parts 20a and 20b receive the force of entering the lower portions of the adhesive portions 19a and 19b. The tape 8 is completely peeled off from the carrier tape 7.

  The cover tape 8 completely peeled off from the carrier tape 7 in this way is changed in the feeding direction to the direction opposite to the feeding direction of the component tape 2 by the return bar 21 which is a return means, and is transferred to the winding hub 22 connected to the winding mechanism. It is wound up.

  Here, in the cover tape 8 in FIG. 5 (b), the hatched portion indicates the center portion, and the hatched portion indicates the width direction end portion (the lower surface thereof). . As described above, since the central portion rides above the component pressing portion 18, the cover tape 8 is temporarily in a state where the central portion is raised, but this raised state near the return bar 21 is canceled, and the central portion and The width direction end portion overlaps when observed from a side view.

  The force that the take-up hub 22 winds the cover tape 8 also acts as a force that peels the cover tape 8 from the carrier tape 7, but as described above, in the present invention, the force that feeds the component tape 2 to the downstream side is also covered. Since it acts on the tape 8, it is not necessary to wind up with a force as large as that in the prior art. Therefore, the possibility that the cover tape 8 is torn due to a large force acting on the cover tape 8 can be reduced.

  At this time, the angle θ formed by the tangent line between the tip 18 of the peeling block 11 and the cylindrical surface of the return bar 21 and the upper surface of the carrier tape 7 as viewed from the direction perpendicular to the paper surface of FIG. The winding force of the take-up hub 22 by the take-up mechanism 22 can be increased within a range in which the first adhesive portion 19a and the second adhesive portion 19b do not peel off, and this angle can be set to about 17 °. it can.

  As a result, when the tape tape 5 is filled with the component tape 2, the vertical distance L1 and the horizontal distance L2 of the gap passing through the predetermined position where the cover tape 8 is peeled can be increased. It is possible to make the size about 5 mm.

  In the prior art described in Patent Document 3, the gap of the slit 88c is 0.1 to 0.2 mm. Compared with this, the component supply device according to the present invention makes it easy to attach the component tape to the component supply device. Is clear.

  Further, the force with which the take-up hub 22 takes up the cover tape 8 acts in a direction in which the carrier tape 7 is pulled upward at the position where the cover tape 8 is peeled off from the carrier tape 7, as shown in FIG. In addition, since the return bar 21 is provided above the downstream side of the tip of the peeling block 11, the tip is already above the carrier tape 7 at a position where a force acts in the direction of pulling the carrier tape 7 upward. Therefore, the carrier tape 7 is not actually pulled upward.

  Here, the return bar 21 as a return means has a cross-sectional shape when viewed from the length direction of the return bar 21 (parallel to the paper surface of FIG. 5B) so that the peeled cover tape 8 is not caught. The cross-sectional shape on the plane) is preferably circular, that is, a cylindrical shape, a columnar shape, a rugby ball shape, or the like.

  In the prior art, as shown in FIG. 8B, the attachment of the component tape 81 to the component supply device 80 is performed by separating the guard plate 88 from the component tape 81 and further removing the cover tape 83 from the carrier tape 82. However, in the present invention, the tip of the component tape 2 from which the cover tape 8 has been peeled off is brought closer to the tape guide 5 in the present invention. When the first portion where the carrier tape 7 and the cover tape 8 are bonded approaches the tape guide 5, the cover tape 8 is passed through the gap L 1 between the peeling block 11 and the return bar 21.

  At this time, since there is no upstream plate and the upper upstream side of the carrier tape 7 running surface of the tape guide 5 is opened, there is no need to separate the peeling block 11 from the component tape 2, and FIG. In the prior art shown in FIG. 2, the component tape 81 is inserted while being pushed into a tape guide (not shown), so that the insertion may not be performed smoothly due to buckling or the like. However, in the present invention, the cover tape 8 is passed after passing through the gap L1. By pulling the tape 8, the carrier tape 7 can be easily guided to the downstream side without being forced into the tape guide 5.

  As shown in FIG. 6, the component pressing portion may be constituted by a protruding portion 30 protruding downstream from the first wing portion 20 a and the second wing portion 20 b, but in this configuration, the width of the protruding portion is determined. However, the upper surface of the large-sized component 13 (the component storage chamber 9 for storing the component 13) cannot be sufficiently covered. In order to prevent the component 13 from popping out, it is sufficient to cover at least a part of the upper surface of the component storage chamber 9, but in order to send the component 13 to the downstream side more reliably, the upper surface is sufficiently covered. It is desirable.

  On the other hand, if the component pressing portion 18 is configured by the tip portion on the upstream side of the contact point between the first wing portion 20a and the second wing portion 20b, the small-sized component 13 is formed at a portion having a small tip width. And the at least part of the upper surface of the large-sized component 13 (and the component storage chamber 9) can be covered with a wider portion on the downstream side, and the wing portions 20a and 20b become wider toward the downstream side. Therefore, the upper surface of the component storage chamber 9 can be sufficiently covered as the component tape is sent to the downstream side. Therefore, since it is possible to deal with various types of component tapes with the same configuration, it is better to configure the component pressing portion 18 at the tip portion upstream of the contact point between the first wing portion 20a and the second wing portion 20b. preferable.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

  The component supply device and the component mounting device according to the present invention are suitable for manufacturing a product in a form in which an electronic component or a mechanical component supplied in a state of being stored in a component tape is mounted on a mounted body such as a printed board.

The perspective view which shows the outline of the whole component mounting apparatus which concerns on an example of embodiment of this invention. Schematic side view showing the vicinity of a component supply device in the same component mounting device. The perspective view which shows a mode when a tape guide and a part of component tape are seen from the upward diagonal direction among the component supply apparatuses. The perspective view which expanded the circumference of a peeling block among the parts supply device It is a figure which shows the vicinity of the peeling block, (a) is a top view in the vicinity of the peeling block, (b) is a side view in the vicinity of the peeling block. The schematic diagram of the component holding | suppressing part in the component supply apparatus which concerns on another example of embodiment of this invention. The perspective view which shows the structure of the components supply apparatus in a prior art It is a figure which shows the structure of the component supply apparatus in a prior art, (a) is a side view which shows typically the mode of component tapes, etc. when this component supply apparatus is used, (b) is this component supply apparatus. The perspective view which shows a mode when the guard plate used is lifted and separated from the component tape

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tape reel 2 Component tape 3 Sprocket 4 Conveyance direction arrow 5 Tape guide 7 Carrier tape 8 Cover tape 9 Component accommodation chamber 10 Feeding hole 11 Peeling block 12 Extraction position 13 Components 14a and 14b Tape guide wall member 18 Component pressing part 19a 1st Adhering portion 19b Second adhering portion 20a First wing portion 20b Second wing portion 21 Return bar 100 Component mounting device 102 Adsorption / conveying portion 103 Substrate 106 Component supply device

Claims (5)

A carrier tape having a plurality of component storage chambers for storing components, and a cover bonded to the carrier tape at a first adhesive portion and a second adhesive portion provided at positions sandwiching the plurality of component storage chambers A component supply device configured to supply a component in each component storage chamber by separating the cover tape of the component tape from the carrier tape;
Peeling means for peeling the first adhesive portion and the second adhesive portion;
A winding means for winding the cover tape peeled off by the peeling means;
Return means for changing the direction of feeding the cover tape peeled off by the peeling means to the direction of feeding to the winding means;
Is provided,
The peeling means includes
A first peeling portion for peeling the first adhesive portion;
A second peeling portion for peeling the second adhesive portion;
Components housed in the component housing chamber at locations upstream of the first peeling portion and the second peeling portion in the feed direction from positions where the first and second adhesive portions are peeled off, respectively. And a component pressing part that covers at least a part of the upper surface of the component storage chamber,
A component supply device comprising: The parts holding part is
The component supply device according to claim 1, wherein the component supply device is configured by a tip portion on an upstream side of a contact point between the first peeling portion and the second peeling portion. Return means
The component supply apparatus according to claim 1, wherein the component supply apparatus is provided above a downstream side of an upstream end portion of the peeling unit.   The component supply device according to any one of claims 1 to 3, wherein the return means has a circular cross-sectional shape. 5. The component supply device according to claim 1, a component take-out device for taking out a component in a component storage chamber, and substrate conveyance for conveying a mounted body on which the component is mounted to a predetermined position. And a component mounting apparatus.

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