JP2010093482A - Headphone unit and headphone - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a headphone unit and a headphone capable of downsizing a baffle plate or the like and suppressing an increase in size of the entire headphone even when a large-diameter headphone unit is mounted.
A magnetic circuit constituent member, a voice coil 56 disposed in a gap formed by the magnetic circuit constituent member, a diaphragm 54 to which the voice coil 56 is fixed, and a peripheral portion of the diaphragm 54 are fixed. The headphone unit 5 including the unit frame 52 is provided with one or more acoustic passages 52d outside the fixing position of the peripheral edge of the diaphragm 54 of the unit frame 52. By providing the acoustic passage 52d in the unit frame 52, the large headphone unit 5 can be mounted while suppressing the baffle plate 3 and the headphones 1 from being enlarged.
[Selection] Figure 1

Description

  The present invention relates to a headphone unit and a headphone, and in particular, has a feature in the structure of a headphone unit for mounting a large headphone unit without increasing the size of the entire headphone.

  A general headphone includes a headphone unit having a structure similar to that of a dynamic speaker as a main component. In the case of ear-cover type headphones, the headphone unit is generally attached to the baffle plate, an ear pad is attached to the front side of the baffle plate, and a housing that covers the headphone unit is attached to the back side of the baffle plate . Two headphones are connected by a headband as a pair, and when used, the left and right headphones are worn covering the left and right ears of the user.

  In such headphones, sound is heard in the middle of the left and right ears, that is, in the head, and the sound is trapped in the head. .

  As one method for dealing with this problem, in conventional headphones, the space before and after the diaphragm is acoustically connected. As shown in FIG. 4, a passage 87 (hereinafter referred to as “acoustic passage”) that acoustically connects the front and rear of the headphone unit 85 by providing an opening in a baffle plate 83 to which the headphone unit 85 is attached. Is formed. By providing such an acoustic passage 87 in the baffle plate 83, localization within the head is prevented, and improvement in sound quality and frequency response is also performed. An acoustic resistance material made of nonwoven fabric or the like is attached to the acoustic passage 87.

  As a conventional example in which the rear space and the front space are communicated with each other through an acoustic passage made of a sound hole or duct with a baffle plate as a boundary, and the sound hole or duct has an appropriate acoustic resistance, Patent Document 1 or Patent Document There are two.

JP-A-6-113384 Japanese translation of PCT publication No. 2005-50196

  By the way, a headphone unit having a large caliber is generally mounted on a headphone having good sound quality. However, a baffle plate, a housing, and the like are increased in size with an increase in the size of the headphone unit, and the entire headphone tends to be increased in size. On the other hand, in order to improve the portability of the headphones, it is advantageous that the headphones are small. Therefore, even when a large-diameter headphone unit is mounted, it is important to suppress the enlargement of the baffle plate, the housing, and the like as much as possible.

  However, in the conventional headphones, as described above, since the acoustic path is provided in the baffle plate in order to prevent localization in the head and to improve the sound quality and frequency response, there is a space for the acoustic path in the baffle plate. Cannot be omitted. Therefore, there is a problem that even if the baffle plate is reduced in size, it is restricted.

  The present invention has been made in view of the above problems, and even when a large-diameter headphone unit is mounted, the baffle plate and the like can be reduced in size, and therefore, the headphone capable of suppressing the increase in size of the entire headphone. An object is to provide a unit and a headphone equipped with the headphone unit.

  The present invention relates to a magnetic circuit component member, a voice coil disposed in a gap formed by the magnetic circuit component member, a diaphragm to which the voice coil is fixed, and a unit frame to which a peripheral portion of the diaphragm is fixed. The headphone unit having the above-mentioned feature is characterized in that one or two or more acoustic paths are provided outside the unit frame on the outer peripheral position of the periphery of the diaphragm.

  Although it does not specifically limit in this invention, It is preferable that an acoustic resistance material adheres so that the opening part of the said acoustic path may be covered.

  Further, although not particularly limited in the present invention, it is preferable that the acoustic resistance material is formed in a ring shape surrounding the periphery of the diaphragm and is fixed so as to cover all the opening portions of the acoustic passages.

  Further, although not particularly limited in the present invention, it is preferable that a peripheral portion of the diaphragm is fixed with a sealing material, and the sealing material also serves as the acoustic resistance material.

  Further, although not particularly limited in the present invention, it is preferable that a jetty is formed on the outer peripheral edge of the unit frame on the diaphragm fixing side, and an acoustic path is formed on the inner peripheral portion of the jetty.

  The present invention is also a headphone comprising: a baffle plate to which a headphone unit is attached; an earpad attached to the front side of the baffle plate; and a housing attached to the back side of the baffle plate, wherein the headphone unit Is the above headphone unit.

  Although it does not specifically limit in this invention, It is preferable that the said housing has sealed the back side space of the said baffle board.

  According to the present invention, even when a large-diameter headphone unit is mounted, the baffle plate and the like can be reduced in size, and thus the increase in the size of the entire headphone can be suppressed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In FIG. 1, a headphone 1 includes an ear pad 2, a baffle plate 3, a headphone housing 4, and a headphone unit 5. As shown in FIGS. 1 and 2A, the headphone unit 5 has a unit frame 52 as a base, and includes a magnetic circuit component, a diaphragm 54, and a voice coil 56 as main components. When such a headphone 1 covers the user's pinna E and is worn on the side of the user's face, the side of the user's face, the earpad 2, a part of the baffle plate 3, and a headphone unit. A sealed space is formed by 5.

  The headphone unit 5 is attached to the baffle plate 3 by the unit frame 52 being fitted into the center hole of the baffle plate 3. The unit frame 52 is a disk-shaped part, and has a cylindrical portion 52a at the center, and the inner peripheral side of the cylindrical portion 52a is a through hole.

  The magnetic circuit component includes a yoke 57 formed in a circular dish shape, a disk-shaped magnet 58 fixed to the inner bottom surface of the yoke 57, and a disk fixed to the front end surface of the magnet 58. A pole piece 59 is provided. A cylindrical gap is formed over the entire circumference between the inner peripheral surface of the front end (left end in FIG. 1) of the yoke 57 and the pole piece 59, and this gap passes through the magnetic flux from the magnet 58. There is a gap.

  The outer periphery of the yoke 57 is fitted into the cylindrical portion 52 a of the unit frame 52 and is integrated with the unit frame 52. The diaphragm 54 includes a main dome at the center and a sub dome surrounding the main dome. The outer peripheral edge of the sub dome is fixed to the outer peripheral edge of the unit frame 52. The diaphragm 54 is a thin plate part made of, for example, resin, and the diaphragm 54 itself has an electromagnetic force generated in a voice coil 56 described later with an outer peripheral edge fixed to the unit frame 52 as a fulcrum. It can vibrate in the front-rear direction against elasticity. The front end of the voice coil 56 is fixed to the back side of the diaphragm 54 along the boundary between the main dome and the sub dome. The voice coil 56 is a part formed by winding a thin conductive wire in a cylindrical shape, and is disposed in the magnetic gap, and can move in the front-rear direction together with the diaphragm 54 without touching the yoke 57 and the pole piece 59. ing.

  As apparent from the configuration described above, since the voice coil 56 is disposed in the magnetic gap, when an audio signal is input to the voice coil 56, the current according to the audio signal and the magnetic flux in the magnetic gap are reduced. The voice coil 56 moves in the front-rear direction due to the electromagnetic force. Since the diaphragm 54 vibrates back and forth together with the voice coil 56, sound waves according to the audio signal are emitted from the diaphragm 54.

  When the headphone unit 5 is an ear covering type headphone, the unit frame 52 is fitted and fixed in the hole 31 of the baffle plate 3, and the housing 4 is fixed to the back side of the baffle plate 3. A protector for protecting the diaphragm 54 is disposed in front of the diaphragm 54, but the protector is not shown.

  In the headphone 1 having such a configuration, when a closed space is formed by the unit frame 52 and the diaphragm 54, the air acts as a spring, and the diaphragm 54 vibrates faithfully to the audio signal. I can't do that. Therefore, the communication hole 52b is formed in the unit frame 52, so that a closed space is not formed by the unit frame 52 and the diaphragm 54, and the diaphragm 54 is likely to vibrate. In addition, in order to give an appropriate damping characteristic to the diaphragm 54 to improve the frequency response, an acoustic resistance material 52c is attached to the unit frame 52 and covers the communication hole 52b. As the acoustic resistance material 52c, a material that has an appropriate resistance to air flow, such as a nonwoven fabric, open-cell sponge, glass wool, mesh, or the like is selected. Furthermore, a jetty 52f is provided on the outer peripheral edge of the unit frame 52 on the diaphragm fixing side.

  In addition, in the unit frame 52, an acoustic passage 52d is formed outside of the communication hole 52b on the outer side of the fixing position of the diaphragm 54. By adjusting the position, number, size, and the like of the opening of the acoustic passage 52d, the acoustic properties of the headphones are changed, the sound quality and frequency response are improved, and the localization in the head is improved. In the present embodiment, six acoustic passages 52d having a strip-like cross-sectional shape are formed at equal intervals along the outer peripheral edge of the unit frame 52. However, the present invention is not limited to such an aspect. I can't.

  By using the headphone unit according to the present invention described above, compared to the conventional headphone shown in FIG. 4, even when a large-diameter headphone unit is mounted, the baffle plate and the like can be reduced in size, and thus the entire headphone can be reduced. Increase in size can be suppressed.

  In the conventional headphone 80 shown in FIG. 4, the acoustic passage 87 is provided not on the unit frame of the headphone unit as in the present invention but on the baffle plate 83. In such a configuration, the diameter of the baffle plate 83 is increased so that the ear pad 82 does not block the acoustic path 87, and the acoustic path 87 is formed between the inner periphery of the ear pad 82 and the outer periphery of the headphone unit 85. It is necessary to secure a space for the baffle plate 83, which is an obstacle to downsizing the baffle plate 83.

  On the other hand, in the headphones 1 according to the embodiment of the present application, the acoustic passage 52 d is provided in the unit frame 52 of the headphone unit 5. Therefore, it is not necessary to secure a space for the acoustic path in the baffle plate 3, and the hole 31 into which the headphone unit 5 is fitted can be secured wider than the conventional headphones 82. Thereby, the large-diameter headphone unit 5 can be mounted while reducing the size of the baffle plate 3.

In the headphone 1 according to the illustrated embodiment, the wall surface defining the hole 31 of the baffle plate 3 is divided into two stages of a small diameter part 31a and a large diameter part 31b. When the headphone unit 5 is fitted into the hole 31 of the baffle plate 3, the side surface of the peripheral portion of the unit frame 52 contacts the large diameter portion 31b, and the jetty 52f contacts the side surface of the small diameter portion 31a. It will be in contact.
In such a fitting state, the jetty 52f is in a state where the unit frame 52 is floated with respect to the small-diameter portion 31a, and even if the small-diameter portion 31a extends to the lower part of the ear pad 2, the opening portion of the acoustic passage 52d However, the small diameter portion 31a is not blocked.

  Therefore, the small diameter portion 31a can be enlarged within a range in which a space capable of fixing the ear pad 2 to the surface of the baffle plate 3 can be secured. Further, the large-diameter portion 31b can be enlarged while being advanced to the lower portion of the ear pad 2 within a range where there is no problem in the strength of the baffle plate 3. As described above, since the large-diameter portion 31b into which the headphone unit 5 is fitted can be provided large without being restricted by the fixing position of the earpad 2, the large-diameter headphone while reducing the size of the baffle plate 3. The unit 5 can be mounted.

  In the illustrated embodiment, the acoustic resistance material is not attached to the acoustic passage 52d. However, the present invention is not limited to such a configuration, and the acoustic resistance material may be attached.

  As shown in FIGS. 3A to 3C, also in this embodiment, six acoustic passages 52 d having a strip-shaped cross section are formed along the outer peripheral edge of the unit frame 52. A single ring-shaped acoustic resistance material 52e is attached to the unit frame 52 so as to surround the periphery of the diaphragm and cover all of the six acoustic paths 52d. By using such an acoustic resistance material, it is possible to adjust the acoustic characteristics of the headphones 1 by an easy assembly operation using a small number of acoustic resistance materials.

  In this embodiment, a ring-shaped acoustic resistance material that covers all acoustic paths is attached. However, the present invention is not limited to this, and various forms may be used for the method of attaching the acoustic resistance material. it can.

  For example, a separate acoustic resistance material may be attached to each of the acoustic paths. By doing in this way, the effect on sound can be adjusted for each of the acoustic paths, and finer adjustment of acoustic properties becomes possible.

  Moreover, while fixing the peripheral part of a diaphragm with a sealing material, you may make it this sealing material also serve as the said acoustic resistance material. By doing so, it is possible to adjust the acoustic properties of the headphones without increasing the number of components while ensuring the fixation of the diaphragm.

It is a longitudinal cross-sectional view which shows the example of the headphones which mount the headphone unit which concerns on this invention. The Example of the headphone unit which concerns on this invention is shown, (a) is a longitudinal cross-sectional view, (b) is a rear view, (c) is a front view. FIG. 4 shows another embodiment of the headphone unit according to the present invention, in which (a) is a longitudinal sectional view, (b) is a rear view, and (c) is a front view. It is a longitudinal cross-sectional view which shows the example of the headphones which mount the conventional headphone unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Headphone 2 Ear pad 3 Baffle board 4 Headphone housing 5 Headphone unit 52 Unit frame 52d Acoustic path 52e Acoustic resistance material 54 Diaphragm 56 Voice coil 57 Yoke 58 Magnet 59 Pole piece

Claims (7)

Headphone including a magnetic circuit constituent member, a voice coil disposed in a gap formed by the magnetic circuit constituent member, a diaphragm to which the voice coil is fixed, and a unit frame to which a peripheral portion of the diaphragm is fixed A unit,
A headphone unit comprising one or more acoustic passages on the outer side of the unit frame on the outer peripheral position of the periphery of the diaphragm.   The headphone unit according to claim 1, wherein an acoustic resistance material is fixed so as to cover an opening portion of the acoustic passage.   The headphone unit according to claim 2, wherein the acoustic resistance material is formed in a ring shape surrounding a peripheral portion of the diaphragm, and is fixed so as to cover all the opening portions of the acoustic path.   The headphone unit according to claim 2 or 3, wherein a peripheral portion of the diaphragm is fixed with a sealing material, and the sealing material also serves as the acoustic resistance material.   The headphone unit according to any one of claims 1 to 4, wherein a jetty is formed at an outer peripheral edge of the unit frame on the diaphragm fixing side, and an acoustic path is formed at an inner peripheral portion of the jetty.   A headphone comprising: a baffle plate to which a headphone unit is attached; an earpad attached to the front side of the baffle plate; and a housing attached to the back side of the baffle plate, wherein the headphone unit is claimed in claims 1 to A headphone that is the headphone unit according to claim 5.   The headphone according to claim 6, wherein the housing seals a back side space of the baffle plate.

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