JP2010092540A - Non contact ic chip module, disk recording medium, method of manufacturing disk recording medium, and information processing apparatus - Google Patents

Abstract

Even when the size and thickness of an IC chip are different, it is not necessary to consider the difference between the IC chips, and the IC chip can always be formed in the same shape, and the IC chip can be attached and detached, and can be easily attached and detached. The present invention provides a disc-shaped recording medium, a disc-shaped recording medium manufacturing method, and an information processing apparatus capable of realizing the conflicting demands of firm fixation.
An optical disc 200A is formed by joining one surface side of a main substrate 230 and one surface side of a dummy substrate 210 to form an inner side wall forming a first center hole of the dummy substrate 210 and an outer peripheral side wall of the IC chip module substrate. A screwed portion 214 and a screwed portion 222 that can be screwed together are formed, and the IC chip module can be attached to and detached from the first center hole portion of the dummy substrate in a screwed relationship.
[Selection] Figure 2

Description

  The present invention relates to a non-contact type IC chip module, a disk-shaped recording medium on which the IC chip module is mounted, a method for manufacturing the disk-shaped recording medium, and an information processing apparatus.

In recent years, optical discs such as CD (Compact Disc) and DVD (Digital Versatile Disc) have been widely used as recording media capable of recording large-capacity data such as video.
Further, as an optical disc, not only a read-only disc called ROM (Read Only Memory) type but also a write-once disc called “Recordable” and a rewritable disc called “ReWritable” are common.

  Since this optical disc can record a very large amount of data at a low cost, recording and distribution of programs and data, as well as distribution of music and video software, and audio data and video such as recording and recording of broadcast contents Widely used for data recording.

On the other hand, non-contact IC (Integrated Circuit) chips that can exchange information without contact with the reader / writer on the terminal side have started connection due to factors such as no physical contact required when communicating with the terminal device The processing time from connection to end of connection can be shortened.
Further, the non-contact type IC has a feature that it has high security by advanced mutual authentication and encryption processing.
For this reason, non-contact type ICs are widely used in applications such as electronic money, transportation tickets, and admission cards.

Then, it is considered that a non-contact type IC chip having such excellent characteristics is mounted on an optical disk substrate.
For example, an IC chip and an antenna for transmitting and receiving the IC chip are integrated into a gap formed between the concave portions when the disc substrates are bonded to each other after the concave portions are formed on the two disc substrates. An arranged optical disc has been proposed (see Patent Document 1).
As a result, it is possible to check the recorded contents of the optical disc without setting the optical disc player and accessing the optical disc.

As a method of mounting an IC chip having a non-contact communication function on an optical disc, a method of attaching an IC chip module to the surface of the disc, a method of incorporating in an disc, a method of fixing by fitting, etc. have been proposed (for example, (See Patent Documents 2 to 5).
JP-A-9-245381 Japanese Patent No. 3882218 JP-A-6-309840 WO 04/015702 JP-A-3-112690

However, when the IC chip module is attached to the disk surface, the thickness of the surface of the optical disk becomes non-uniform.
For this reason, there is a concern that the module may be peeled off from the disk when the disk is attached to or detached from the drive, or that the component parts of the drive interfere with the IC chip module attached on the disk.

  In addition, when an IC chip mounting disk is manufactured by forming an area for mounting an optical disk at the time of injection molding of the disk substrate and mounting an IC chip module in this area, molding is performed according to the size and thickness of the IC chip to be used. Therefore, it is necessary to change the shape of the disk substrate to be complicated.

  Further, when the thickness of the IC chip is large, the thickness of the disk substrate on which the IC chip is mounted becomes thin, so that the injection molding of the disk substrate becomes difficult, and there is a problem that the strength of the substrate at that portion decreases.

Furthermore, when fixed by an adhesive, it cannot be replaced.
In addition, in the case of a fitting type, a high reliability is required for fixing so that the module portion does not separate from the disc when the disc is attached to or detached from the recording / reproducing apparatus, while there is a conflicting factor that the attachment / detachment must be easy. The realization was not easy.

  In addition, when an IC chip module is built in the disk, it is difficult to repair the module non-destructively when a module failure occurs, even if there is no problem with the optically recorded data. The use of the disk may be hindered.

  Furthermore, a disk with an IC chip module mounted inevitably has a higher selling price than a disk without a chip. On the other hand, when a module is added later to a disk on which no IC chip module is mounted, the module part may be separated from the disk.

  In the present invention, even when the size and thickness of the IC chip are different, the disk substrate side to be injection molded does not need to consider the difference of the IC chip, and can always have the same shape, and the IC chip can be attached and detached. An object of the present invention is to provide a disc-shaped recording medium, a method for manufacturing the disc-shaped recording medium, and an information processing apparatus that can realize the conflicting demands of being easy to attach and detach and strong fixing.

  A non-contact type IC chip module according to a first aspect of the present invention includes: a screwed portion formed on a side wall of an outer peripheral portion so as to be screwed into a first center hole formed in a base to be screwed; Formed on the second center hole, the IC chip mounted in the inside and capable of non-contact communication, and the inner wall forming the second center hole, and having a screwed relationship with the first center hole portion of the substrate And an engaged portion to which a part of a jig for attaching and detaching can be engaged.

  Preferably, the engaged portion is formed from an inner wall that forms the second center hole in a radial direction and toward an outer peripheral direction, and at least one part of the jig that can be engaged is formed. Preferably, it is formed by a pair of grooves.

  The disc-shaped recording medium according to the second aspect of the present invention is located on the outer peripheral side and can be disposed in the first center hole on the inner peripheral side of the dummy substrate and the dummy substrate on which the first center hole is formed. An IC chip module substrate in which a second center hole is formed, the outer diameter of the second center hole is substantially the same as the diameter of the first center hole of the dummy substrate, and an IC chip capable of non-contact communication is mounted therein. And a main substrate having a recording layer, wherein one surface side of the main substrate and one surface side of the dummy substrate are joined to form the first center hole of the dummy substrate. The inner side wall and the outer peripheral side wall of the IC chip module are formed with a screwed part and a screwed part that can be screwed together. In the center hole part is detachable with a screwed relationship.

  Preferably, the diameter of the first center hole is larger than the diameters of the second center hole and the third center hole.

  Preferably, the IC chip module substrate is formed on an inner wall forming the second center hole, and a part of a jig for attaching and detaching to the first center hole portion of the substrate in a screwed relationship is provided. It has an engaged part which can be engaged.

  Preferably, the engaged portion is formed from an inner wall that forms the second center hole in a radial direction and toward an outer peripheral direction, and at least one part of the jig that can be engaged is formed. Preferably, it is formed by a pair of grooves.

  Preferably, the thickness of the IC chip module substrate is set smaller than the thickness of the dummy substrate.

  Preferably, the recording layer of the main substrate is formed on the outer peripheral side from the outer peripheral portion of the area where the antenna is formed in the IC chip module substrate.

  A disc-shaped recording medium according to a third aspect of the present invention includes a main substrate including a recording layer and having a first center hole formed on a side surface of the non-formation region of the recording layer, and the above-described first inner side of the main substrate. An IC chip that can be placed in one center hole, has a second center hole, and has an outer peripheral diameter that is substantially the same as the diameter of the first center hole and that can be contactlessly communicated therein. A third center hole having substantially the same diameter as the second center hole, and an inner wall forming the first center hole of the main substrate; A screwed portion and a screwed portion that can be screwed together are formed on the outer peripheral side wall of the IC chip module substrate, and the IC chip module is screwed into the first center hole portion of the main substrate. It is detachable with a relationship.

  According to a fourth aspect of the present invention, there is provided a disc-shaped recording medium manufacturing method comprising: a step of forming a threaded portion on an inner side wall forming a first center hole of a dummy substrate; and a step of forming an outer peripheral side wall of the IC chip module substrate. A step of forming a screwed portion that can be screwed with a screwed portion of the dummy substrate; a step of bonding the dummy substrate to the main substrate including a recording device and having a third center hole; and the IC The IC chip module is mounted on the dummy board by screwing the screwed part of the chip module board onto the screwed part of the dummy board.

  Preferably, the injection molding substrate side thread and the IC chip module side thread are formed so that the data recording direction on the disk-shaped medium is the same as the direction in which the IC chip module is rotated with respect to the disk at the time of screwing. To do.

  An information processing apparatus according to a fifth aspect of the present invention has a communication function between a disk drive device for driving a disk-shaped recording medium and an IC chip module including a non-contact communication function, and is set in the disk drive device. A dummy substrate having a disk-shaped recording medium or a communication device that performs non-contact communication with a disk-shaped recording medium arranged close to the disk-shaped recording medium, the disk-shaped recording medium being located on the outer peripheral side and having a first center hole formed therein And the second center hole is formed, and the outer diameter of the second center hole is substantially the same as the diameter of the first center hole of the dummy substrate. An IC chip module substrate on which an IC chip capable of non-contact communication is mounted, and a main substrate on which a third center hole is formed and having a recording layer, One surface side of the in-substrate and one surface of the dummy substrate are joined, and the inner wall forming the first center hole of the dummy substrate and the outer peripheral side wall of the IC chip module can be screwed together. The IC chip module is detachably attached to the first center hole portion of the dummy substrate in a screwed relationship.

  According to the present invention, the screwed portion of the IC chip module substrate is screwed into the screwed portion of the dummy substrate bonded to the main substrate, and the IC chip module substrate is mounted on the dummy substrate.

According to the present invention, even when the size and thickness of the IC chip are different, the main substrate and the dummy substrate formed by injection molding do not need to consider the difference in the IC chip, and always have the same shape. be able to.
In addition, according to the present invention, it is possible to realize conflicting demands such that the IC chip can be attached and detached, and the attachment and detachment is easy and the adhesion is strong.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a block diagram showing a configuration example of an information processing apparatus corresponding to the disk-shaped recording medium according to the present embodiment.

  The information processing apparatus 100 has a reader / writer function capable of reading and writing information of the non-contact type IC chip module 10 mounted on the optical disc 200 and a function of recording and reproducing information on the optical disc 200.

  The information processing apparatus 100 includes a reader / writer unit 310 as a communication device, an optical disk drive unit 320 as a disk drive device, a non-contact communication and disk drive device 300 having a central control unit 330, and a data processing system 400. It is configured.

The reader / writer unit 310 includes a reader / writer control unit 311, an internal communication antenna 312, and an external communication antenna 313.
The reader / writer unit 310 reads information from the IC chip module 10 of the optical disc 200 that is set in the optical disc drive unit 320 or arranged in a non-contact manner or in close contact with the outside of the information processing apparatus 100. Write control is performed.
The reader / writer unit 310 controls reading and writing of information with respect to the IC chip module 10 of the optical disc 200 set in the optical disc drive unit 320 through the internal communication antenna 312.
The reader / writer unit 310 performs reading and writing control of information with respect to the IC chip module 10 of the optical disc 200 that is arranged in a non-contact manner or in close contact with the outside of the information processing apparatus 100 through the external communication antenna 313. .
The reader / writer unit 310 outputs information read from the IC chip module 10 to the central control unit 330 and receives information to be written to the IC chip module from the central control unit 330.

  The disk drive device 320 includes a drive motor 321, a motor drive circuit 322, a signal read / write unit 323, a signal processing unit 324, a recording control circuit 325, a tray drive circuit 326, and a drive control unit 327.

The signal read / write unit 323 includes an optical head and the like, and accesses the optical disc 200, that is, reproduces and writes information according to the control of the drive control unit 327.
The drive control unit 327 controls the motor drive circuit 322, the recording control circuit 325, and the tray drive circuit 236 that drives the disc tray based on the control data of the central control unit 330 and the reproduction data of the signal processing unit 324.

  The data processing system 400 includes a broadcast receiving unit 401, a central processing unit (CPU) 402, a main memory 403, an interface unit 404, an image processing unit 405, a hard disk device unit 406, an external interface unit 407, an image output unit 408, and a network interface. An (I / F) unit 409 and a shared bus 410 are included.

The broadcast receiving unit 401, CPU 402, main memory 403, interface unit 404, image processing unit 405, hard disk device unit 406, external interface 407, image output unit 408, and network interface unit 409 are connected to the shared bus 410. Each can be accessed from the CPU 402 as a memory mapped I / O.
For example, when a television broadcast is received by the broadcast receiving unit 401, an interrupt signal is generated and transmitted to the CPU 402, and the CPU 402 transfers the image to the image output unit 408 by a processing program stored in the main memory 403, and the video is displayed on the television 420 and the like. Is displayed.

Further, the data processing system 400 communicates with the central control unit 330 of the disk drive device 300 through the interface unit 404, and issues a control instruction for a reader / writer function, a disk recording, and a reproduction function.
The data processing system 400 exchanges data of the camcorder 430 connected to, for example, a USB terminal of the external interface unit 407.

The overview of the information processing apparatus 100 according to the present embodiment has been described above.
The configuration of the optical disc according to the present embodiment, the manufacturing method thereof, and the like will be described below.

  The optical disc 200 according to the present embodiment corresponds to an optical disc medium such as a CD, a DVD, an HD-DVD (High Definition Digital Versatile Disc), and a Blu-ray Disc (registered trademark of Sony Corporation) as follows. It has a simple structure.

<First configuration example>
FIGS. 2A-1 to 2D-2 are diagrams illustrating a first configuration example of an optical disk on which a non-contact type IC chip module is mounted.
2A-1 is a simplified cross-sectional view of the dummy substrate, and FIG. 2A-2 is a top view of the dummy substrate.
2B-1 is a simplified cross-sectional view of the main board, and FIG. 2B-2 is a top view of the main board.
2C-1 is a perspective view of the IC chip module, and FIG. 2C-2 is a top view of the IC chip module.
FIG. 2D-1 is a simplified cross-sectional view of the manufactured optical disc 200A, and FIG. 2D-2 is a top view.

  An optical disc 200A in FIG. 2 is a configuration example of a Blu-ray disc with an IC chip module.

This optical disc 200A can be disposed on the outer peripheral side of the dummy substrate 210, the inner peripheral side of the dummy substrate 210, the outer peripheral diameter is substantially the same as the inner peripheral diameter of the dummy substrate 210, and an electric circuit is mounted therein. An IC chip module substrate 220 and a main substrate 230 are included.
In this embodiment, the main substrate 230 and the dummy substrate 210 are set to have substantially the same outer diameter. The outer diameter is set to 120 mm, for example.
One surface side 231 of the main substrate 230 and one surface side 211 of the dummy substrate 210 are bonded together with an adhesive layer 240.
In the main substrate 230, a recording layer 233 is formed on the other surface 232 side irradiated with the laser light from the signal read / write unit 323 in FIG. 1, and a protective layer 234 is formed to protect the recording layer 233. ing.

The dummy substrate 210 has a first center hole 212 formed therein, the IC chip module substrate 220 has a second center hole 221 formed therein, and the main substrate 230 has a third center hole 235 formed therein.
In the present embodiment, the outer diameter of the IC chip module substrate 220 is set to be substantially the same as the diameter of the first center hole 212 of the dummy substrate 210. These diameters are set to 35 mm, for example.

  The inner wall 213 forming the first center hole 212 of the dummy substrate 210 and the outer peripheral side wall 222 of the IC chip module are formed with a screwed portion 214 and a screwed portion 222 that can be screwed together. The IC chip module substrate 220 can be attached to and detached from the first center hole portion of the dummy substrate 210 in a screwed relationship.

FIG. 3 schematically shows a screwing relationship between the screwing portion 214 of the dummy substrate 210 and the screwed portion 222 of the IC chip module substrate 220.
As shown in FIG. 3, the threaded portion 214 and the threaded portion 222 are formed with screw threads and thread grooves that can be screwed together.
3A shows a state before screwing, and FIG. 3B shows a state after screwing.

The diameter of the first center hole 212 of the dummy substrate 210 is larger than the diameters of the second center hole 221 of the IC chip module substrate 220 and the third center hole 235 of the main substrate 230.
In the present embodiment, the diameters of the second center hole 221 of the IC chip module substrate 220 and the third center hole 235 of the main substrate 230 are set to be substantially the same. These diameters are set to 15 mm, for example.

In the present embodiment, the recording layer 233 of the main substrate 230 is formed on the outer peripheral side from the outer peripheral portion in the radial direction of the antenna formation region in the IC chip module substrate 220.
As a result, the optical disc apparatus 100 can read and write information without being affected by an electromagnetic wave or the like induced in the vicinity of the recording film formed of a conductive material when accessing the IC chip module 10. .

In the present embodiment, the dummy substrate 210 and the IC chip module substrate 220 are set to have substantially the same thickness. Their thickness is set to 0.52 mm, for example.
Thereby, the optical disc 200A can realize a flat outer peripheral surface without unevenness.
The thickness of the main board 230 is set to 0.65 mm, for example.
The thickness of the adhesive layer 240 is about 0.03 mm.
Therefore, the total thickness of the optical disc 200A is set to about 1.2 mm.

Note that the thickness of the IC chip module substrate 220 may be set slightly smaller than the thickness of the dummy substrate 210.
Since a large number of replaceable IC chip module substrates 220 are manufactured, it is difficult to completely avoid the occurrence of a slight error even if the thickness is sufficiently controlled.
Even when the screwed portion 222 of the IC chip module substrate 220 is firmly screwed to the screwed portion 214 of the dummy substrate 210, a part of the IC chip module substrate 220 can slightly protrude from the surface of the dummy substrate 210. There is sex.
Therefore, by setting the thickness of the IC chip module substrate 220 slightly smaller than the thickness of the dummy substrate 210 as described above, the screwing relationship can be adjusted in accordance with this error. As a result, it is possible to easily avoid that a part of the IC chip module substrate 220 slightly protrudes from the surface of the dummy substrate 210.

Next, a method for manufacturing the optical disc 200A of FIG. 2 will be described.
FIGS. 4A to 4E and FIGS. 5A and 5B are views for explaining a method of manufacturing the optical disc 200A of FIG.

First, as shown in FIG. 4A, an ultraviolet curable resin is dropped onto one surface side 231 of the main substrate 230 through the nozzle 250. The main substrate 230 is formed with a reflective layer, a recording layer 233, and a protective layer 234 after injection molding by a separate process.
Next, as shown in FIG. 4B, the dropped ultraviolet curable resin is applied by spin coating.
Next, as shown in FIGS. 4C and 5A, in vacuum, the positions of the main substrate and the dummy substrate are regulated by the outer diameters of the main substrate and the dummy substrate, and bonded together, and fixed by irradiating with ultraviolet rays. .
Here, it is also possible to employ the following method.
That is, the IC chip module substrate 220 is screwed to the dummy substrate halfway in advance, and the position is regulated by the center holes 235 and 221. Then, after the main substrate 230 and the IC chip module substrate 220 are bonded together, the resin may be cured and then completely screwed.
Next, as shown in FIGS. 4D and 5B, the screwed portion 222 of the IC chip module substrate 220 is screwed to the screwed portion 214 of the dummy substrate 210 bonded to the main substrate 230. Then, the IC chip module substrate 220 is mounted on the dummy substrate 210.
Thereby, as shown in FIG. 4E, the manufacture of the optical disc 200A is completed.

In this way, the IC chip module substrate 220 screwed to the dummy substrate 210 can be removed by reverse rotation, and further replaced with another IC chip module substrate.
In this case, it is desirable to use a dedicated jig to firmly screw with good operability or to easily release the screwed state.

  FIG. 6 is a diagram for explaining a configuration example in which a screw is engaged and a screwed state is released using a jig.

In this case, the IC chip module substrate 220A is formed on the inner wall that forms the second center hole 221 and is engaged with a part of a jig for screwing in and out of the first center hole portion of the substrate in a screwed relationship. A possible engaged portion 223 is formed.
The engaged portion 223 is formed in a radial direction and an outer circumferential direction from an inner wall forming the second center hole 221. The engaged portion 223 has at least one, preferably a pair of grooves with which a part of the jig can be engaged, and two grooves 233-1 and 233-2 that are shifted by 180 degrees in FIG. It is formed by.

The jig 500 includes grippers 510 and 520 having one end connected and having elasticity extending toward the other end, bent portions 511 and 512 in which the other ends of the grippers 510 and 520 are bent outward, Protrusions 512 and 522 formed at the outer tips of the parts 511 and 512.
The jig 500 is inserted into the center hole 221 of the IC chip module substrate 220 with the tips 510 and 520 being narrowed in the state where the grippers 510 and 520 are narrowed. Is inserted (engaged) into the engaged portions 223-1 and 223-2.
In this state, by applying a rotational force to the jig 500 in a predetermined direction, the IC chip module substrate 220 is attached to the dummy substrate 210, or the IC chip module substrate 220 screwed to the dummy substrate 210 is reversely rotated and removed. Can be easily implemented.
Therefore, by adopting this configuration, it can be easily replaced with another IC chip module substrate.

  FIG. 7 is a diagram schematically showing the free exchange of the IC chip module.

In this example, two IC chip module substrates are shown.
The communication frequency of the IC chip mounted on the first IC chip module substrate 220-1 is 13.56 MHz.
The communication frequency of the IC chip mounted on the second IC chip module substrate 220-2 is 2.45 GHz.
In this way, it is possible to replace the IC chip to be mounted with one that conforms to various standards while keeping the optically described information as it is.

Here, an example of a method of forming the screw portion 214 of the dummy substrate 210 will be described.
8A and 8B are views for explaining an example of a method for forming the screwing portion 214 of the dummy substrate 210. FIG.

In this example, a heater is built in the thread support 600, a φ120 mm substrate is formed by injection molding, and a 35 mm center hole is punched out.
Thereafter, by keeping the thread shape 610 at a temperature equal to or higher than the glass transition temperature of the resin constituting the substrate, the thread is transferred and formed on the inner peripheral wall surface of the dummy substrate.

Next, an example of a method for forming the IC chip module substrate 220 with the screwed portion will be described.
FIGS. 9A and 9B are views for explaining a first example of a method for forming an IC chip module substrate 220 with a threaded portion.

The substrate 700 on which the IC chip 10 is mounted and the substrate 710 formed with the basic unit of the screw groove on the outer periphery are opposed to each other, and the spacers 720 and 730 are stacked therebetween in the module formation by stacking the spacer modules.
By providing alignment markers between spacers, misalignment in stacking can be prevented, and the alignment marker functions as a groove for mounting a jig when the module is detached from the disk after stacking.
As indicated by X in FIG. 9A, a part of the center hole diameter of the substrate located inside the module is partially made larger than that of the substrate located at the outermost part.
Then, as indicated by Y in FIG. 9B, alignment is performed when each substrate is laminated, and after lamination, the IC chip module substrate 220 is fitted with a jig used when the IC chip module substrate 220 is attached to and detached from the disk. It becomes a groove.
It arrange | positions so that the screw groove of the board | substrate outer periphery laminated | stacked according to a marker may continue, and it adheres with an adhesive agent.

FIGS. 10A to 10D are plan views of the substrates 710 and 700 and the spacers 720 and 730 in FIG. 9 for describing a method for forming continuous screw grooves.
10A is a plan view of the substrate 710, FIG. 10B is a plan view of the spacer 720, FIG. 10C is a plan view of the spacer 730, and FIG. 10D is a plan view of the substrate 700.
9 is a cross-sectional view taken along broken line C in FIG.

An antenna pattern 7001 is formed in a ring shape on the substrate 700, and an IC chip 7002 and an additional component 7003 such as a capacitor are arranged so as to face each other at approximately 180 degrees.
In this example, the height of the IC chip 7002 is higher than that of the additional component 7003. As shown in FIG. 9B, when each substrate and the spacer are brought into close contact, the top of the IC chip 7002 is only the spacer 730. Instead, it reaches the spacer 720. On the other hand, the top of the additional component 7003 reaches the spacer 730 and does not reach the spacer 720.
Accordingly, the spacers 730 and 720 are formed with receiving holes 7301 and 7201 for inserting and storing the IC chip 7002, respectively.
In addition, the spacer 730 is formed with an accommodation hole 7302 for inserting and accommodating the additional component 7003.
In the spacers 730 and 720, engaged portions 7303, 7304, 7202, and 7303 with respect to the jig 500 are formed so as to spatially overlap each other.

As shown by X in FIG. 9A and FIGS. 10A to 10C, a part of the center hole diameter of the substrate located inside the module is partially larger than that of the substrate located at the outermost part. Enlarge.
The substrate 710 and the spacers 720 and 730 are basically the same shape, and screw grooves are formed on the side surfaces.
By laminating these components by a predetermined angle and joining them with an ultraviolet curable resin or the like, it is possible to form continuous screw grooves.

  Next, a second configuration example of the optical disc will be described.

<Second configuration example>
FIGS. 11A-1 to 11C-2 are diagrams illustrating a second configuration example of an optical disc on which a non-contact type IC chip module is mounted.
FIG. 11A-1 is a simplified cross-sectional view of the main board, and FIG. 11A-2 is a top view of the main board.
FIG. 11B-1 is a perspective view of the IC chip module, and FIG. 11B-2 is a top view of the IC chip module.
FIG. 11C-1 is a simplified cross-sectional view of the manufactured optical disc 200B, and FIG. 11C-2 is a top view.

An optical disc 200B in FIG. 11 is a configuration example of a Blu-ray disc with an IC chip module.
In the following description, parts having the same configuration and function as those in FIG.

In this optical disc 200B, the first center hole 212 and the third center hole 235 are formed in the main substrate itself without providing the dummy substrate 210 located on the outer peripheral side.
A threaded portion 214 is formed on the inner wall of the main board 230B that forms the first center hole 212.
Further, similarly to FIG. 6, the IC chip module substrate 220B is formed with an engaged portion 223 so that a jig can be used.

Next, a method for manufacturing the optical disc 200B of FIG. 11 will be described.
12A to 12C are views for explaining a method of manufacturing the optical disc 200B of FIG.

First, as shown in FIG. 12A, the substrate 230B on which the threaded portion 214 is formed is injection-molded to form the recording layer, the reflective layer, and the protective layer 234.
Next, as shown in FIG. 12B, the screwed portion 222 of the IC chip module substrate 220 is screwed to the screwed portion 214 of the main substrate 230, and the IC chip module substrate 220 is attached to the dummy substrate 210. Installing.
Thereby, as shown in FIG. 12C, the manufacture of the optical disc 200B is completed.

  FIG. 13 is a diagram schematically showing the free exchange of the IC chip module in the case of the second configuration example.

  In the example of FIG. 13, a dummy module 220-11 without an IC chip, a communication standard A IC chip mounting module 220-12, a communication standard B IC chip mounting module 220-13, and a communication standard C IC chip mounting module. 220-14 is exchangeable.

In this way, by replacing with modules having different functions, an IC chip module-mounted disk-shaped recording medium having different functions can be realized.
The user can purchase a disk in which the dummy module mounting disk 220-11 without an IC chip is mounted, and replace it with an additionally purchased function module as necessary.

In addition, the injection molding substrate side thread and the IC chip module side thread are respectively formed so that the data recording direction on the disk-shaped medium is the same as the direction in which the IC chip module 200 is rotated with respect to the disk during screwing. There is a need.
Here, the relationship between the screwing direction of the IC chip module substrate 220 and the recording direction of the disk data will be described.

FIGS. 14A and 14B are diagrams for explaining the relationship between the screwing direction of the IC chip module substrate 220 and the recording direction of the disk data.
FIG. 14A shows a case where the disk data rotates counterclockwise with respect to the pickup during optical recording and reproduction.
FIG. 14B shows a case where the disk data rotates counterclockwise with respect to the pickup during optical recording and reproduction.

In the example of FIG. 14A, when the rotation direction of the optical disc 200 is clockwise with respect to the optical head (pickup) included in the signal read / write unit 323 of FIG. 1, the data recording direction is defined counterclockwise. The
In this case, the rotation direction of the IC chip module 220 relative to the optical disc 200 during screwing is counterclockwise.

In the example of FIG. 14B, when the rotation direction of the optical disc 200 is counterclockwise with respect to the optical head (pickup) included in the signal read / write unit 323 of FIG. 1, the data recording direction is defined clockwise. The
The rotation direction of the IC chip module 220 relative to the optical disc 200 during screwing is clockwise.

  As a result, when performing optical recording / reproduction in the drive, it is possible to prevent the IC chip mounting module from loosening from the disk even when a force is applied in the direction to fix the module to the spindle with a chucking plate or the like. It becomes.

As described above, in the present embodiment, the dummy substrate 210 of the optical disc 200B and the main substrate 230B of the 200B are configured not to overlap with the IC chip module substrate 220 in the radial direction of the disc. The inner peripheral diameters of the dummy substrate 210 and the main substrate 230B positioned on the outer peripheral side and the outer peripheral diameter of the IC chip module substrate 220 positioned on the inner peripheral side are set to be approximately the same.
By combining these two substrates, the dummy substrate 210 facing the main substrate 230 holding the recording layer is formed, and the screwing portion 214 is formed. Alternatively, the screwing portion 214 is formed on the main substrate without the dummy substrate.
Then, by screwing the screwed portion 222 of the IC chip module substrate 220 to the screwed portion 214, an IC chip-mounted disk-shaped recording medium that satisfies the disk shape standard can be easily formed.
The combined outer peripheral substrate on the dummy substrate 210 side can be easily manufactured by injection molding in the same manner as a normal optical disk.
Further, it is possible to form a module that satisfies a desired thickness and has a flat surface.

Further, the user can freely attach and detach the IC chip module to and from the disk owned by the user as needed.
The user can use the individual optical disks and the IC chip modules in a one-to-one relationship, and at the same time, the user can replace an IC module mounted on a certain disk with another disk. Become.

The non-contact type IC chip module 10 provided in the optical disc 200 includes a modulation / demodulation circuit, a control circuit, a nonvolatile storage medium, and the like for signals transmitted to and received from the reader / writer control unit 311.
Here, as an example, the non-contact type IC chip module 10 communicates with the reader / writer control unit 311 using electromagnetic waves.
This non-contact type IC chip module 10 does not have a battery, and obtains operating power by electromagnetic induction from electromagnetic waves supplied from the reader / writer control unit 311 side.

  FIG. 15 is a diagram illustrating a configuration example of the non-contact type IC chip module 10.

The non-contact type IC chip module 10 includes an antenna coil 11, a tuning circuit 12, and an IC chip 13.
A spiral antenna coil 11 for transmitting / receiving electromagnetic waves to / from the reader / writer control unit 311 side is connected to an IC chip 13 via a tuning circuit 12.
The tuning circuit 12 has a function of adjusting impedance matching with respect to the communication frequency in the same manner as the tuning circuit of the reader / writer control unit 311.

According to this embodiment described above, the following effects can be obtained.
Even when the IC chip module 220 used in an RFID (Radio Frequency Identification) module or the like has a different size and thickness, the following advantages can be obtained.
By making the RFID module outer shape the same, regardless of the difference in the IC chip, it is not necessary to consider the difference in the IC chip, and the substrates other than the RFID module substrate can always have the same shape. For this reason, it becomes easy to manufacture a disc-shaped recording medium having the same optical recording area and different IC chips mounted thereon.
Since each substrate formed by injection molding is formed with a nearly uniform thickness, the bonding process is easier than when bonding substrates that are easy to mold and have a high strength surface that is not flat or substrates with different thicknesses. It becomes easy.

And, as a method of fixing the disk, a screw groove that fits the two substrates to be combined with each other is formed, and the IC chip module substrate is screwed into the center hole portion of the outer peripheral substrate as a screw to realize strong fixing To do.
Further, the center hole of the IC chip module substrate also serves as a part of the center hole of the disk, and a part that allows easy mounting of a jig for easily removing and attaching the module to the center hole portion of the module is provided. By providing, the conflicting requirements of ease of attachment and detachment and strong fixation are realized.
That is, the user can freely attach and detach the RFID module or the like to and from the disk owned by the user as needed.
This allows the user to link individual optical disks and RFID modules one-on-one, and at the same time, replace the RFID module mounted on one disk with another disk for use. It becomes possible.

It is a block part which shows the structural example of the information processing apparatus corresponding to the disk-shaped recording medium which concerns on this embodiment. It is a figure which shows the 1st structural example of the optical disk with which a non-contact-type IC chip module is mounted. It is a figure which shows typically the screwing relationship of the screwing part of a dummy board | substrate, and the to-be-screwed part of an IC chip module board | substrate. FIG. 3 is a first diagram for explaining a method of manufacturing the optical disc of FIG. FIG. 3 is a second view for explaining the method of manufacturing the optical disc in FIG. 2. It is a figure for demonstrating the structural example which cancels | releases a screwing state and a screwing state using a jig | tool. It is a figure which shows typically the free exchange of an IC chip module. It is a figure for demonstrating an example of the formation method in the screwing part of a dummy board | substrate. It is a figure for demonstrating an example of the formation method of the IC chip module board | substrate with a to-be-threaded part. It is a top view of the board | substrate of FIG. 9, and a spacer, Comprising: It is a figure for demonstrating the formation method of a continuous thread groove. It is a figure which shows the 2nd structural example of the optical disk with which a non-contact-type IC chip module is mounted. It is a figure for demonstrating the manufacturing method of the optical disk of FIG. It is a figure which shows typically free exchange of the IC chip module in the case of a 2nd structural example. It is a figure for demonstrating the relationship between the screwing direction of an IC chip module board | substrate, and the recording direction of disk data. It is a figure which shows the structural example of a non-contact-type IC chip module.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100 ... Information processing apparatus, 200, 200A, 200B ... Optical disc, 210 ... Dummy substrate, 214 ... Screwed part, 220 ... IC chip module board, 222 ... Screwed part , 230, 230A, 230B... Main board, 300... Non-contact communication and disk drive device, 310... Reader / writer unit as communication device, 320.

Claims (14)

A threaded portion formed on the side wall of the outer peripheral portion so as to be able to be screwed into a first center hole formed in the base body to be screwed;
The second center hall,
An IC chip capable of contactless communication mounted inside;
An engaged portion formed on an inner wall that forms the second center hole, and engageable with a part of a jig for attaching to and detaching from the first center hole portion of the substrate in a screwed relationship; A non-contact type IC chip module having a disk shape. The engaged portion is
2. The non-contact groove according to claim 1, wherein the second center hole is formed from an inner wall in a radial direction toward an outer peripheral direction, and is formed by at least one groove in which a part of the jig can be engaged. Contact IC chip module. The radial direction and the outer peripheral direction are formed from the inner side wall which forms the said 2nd center hole, and a part of said jig | tool is formed by the at least 1 pair of groove | channel which can be engaged. Non-contact IC chip module. A dummy substrate located on the outer peripheral side and having a first center hole formed thereon;
The second center hole can be disposed in the first center hole on the inner peripheral side of the dummy substrate, and the outer diameter of the second center hole is substantially the same as the diameter of the first center hole of the dummy substrate. An IC chip module substrate on which an IC chip capable of contact communication is mounted;
A main substrate having a third center hole and having a recording layer;
One side of the main board and one side of the dummy board are joined,
A screwed portion and a screwed portion that can be screwed to each other are formed on the inner side wall forming the first center hole of the dummy substrate and the outer side wall of the IC chip module substrate,
The disk-shaped recording medium, wherein the IC chip module substrate is detachably attached to the first center hole portion of the dummy substrate in a screwed relationship. The disk-shaped recording medium according to claim 4, wherein the diameter of the first center hole is larger than the diameters of the second center hole and the third center hole. The IC chip module substrate is
An engagement portion formed on an inner side wall forming the second center hole and capable of being engaged with a part of a jig for attaching and detaching the first center hole portion of the substrate in a screwed relationship. Item 6. The disk-shaped recording medium according to Item 4 or 5. The engaged portion is
The disk according to claim 6, wherein the disk is formed from an inner wall forming the second center hole in a radial direction and toward an outer peripheral direction, and is formed by at least one groove into which a part of the jig can be engaged. Recording medium. The engaged portion is
The inner wall forming the second center hole is formed in a radial direction and an outer peripheral direction, and a part of the jig is formed by at least one pair of grooves that can be engaged. Disc-shaped recording medium. The disc-shaped recording medium according to any one of claims 4 to 8, wherein a thickness of the IC chip module substrate is set to be thinner than a thickness of the dummy substrate. The recording layer of the main substrate is
The disk-shaped recording medium according to any one of claims 4 to 9, wherein the disk-shaped recording medium is formed on an outer peripheral side from an outer peripheral portion of an area in the IC chip module substrate where an antenna is formed. A main substrate including a recording layer and having a first center hole formed on a side surface of the non-formation region of the recording layer;
Arranged in the first center hole on the inner peripheral side of the main substrate, a second center hole is formed, the outer diameter of the first center hole is substantially the same as the diameter of the first center hole, and non-contact communication is possible. An IC chip module substrate having an IC chip mounted therein,
Further, a third center hole having substantially the same diameter as the second center hole is formed in the main substrate,
A screwed portion and a screwed portion that can be screwed to each other are formed on the inner side wall forming the first center hole of the main substrate and the outer side wall of the IC chip module substrate,
The IC chip module is a disc-shaped recording medium that can be attached to and detached from the first center hole portion of the main substrate in a screwed relationship. Forming a threaded portion on the inner wall forming the first center hole of the dummy substrate;
Forming a screwed portion that can be screwed with a screwed portion of the dummy substrate on an outer peripheral side wall of the IC chip module substrate;
Bonding the dummy substrate and the main substrate including a recording device and having a third center hole formed thereon;
A manufacturing method of a disk-shaped recording medium, wherein a screwed portion of the IC chip module substrate is screwed to a screwed portion of the dummy substrate, and the IC chip module is mounted on the dummy substrate. 13. The injection molded substrate side thread and the IC chip module side thread are respectively formed so that the data recording direction on the disk-shaped medium is the same as the direction in which the IC chip module is rotated with respect to the disk during screwing. The manufacturing method of the disc-shaped recording medium of description. A disk drive device for driving a disk-shaped recording medium;
A communication device having a communication function with an IC chip module including a non-contact communication function, and performing a non-contact communication with a disk-shaped recording medium set in the disk drive device or a disk-shaped recording medium disposed in the vicinity ,
The disc-shaped recording medium is
A dummy substrate located on the outer peripheral side and having a first center hole formed thereon;
The second center hole can be disposed in the first center hole on the inner peripheral side of the dummy substrate, and the outer diameter of the second center hole is substantially the same as the diameter of the first center hole of the dummy substrate. An IC chip module substrate on which an IC chip capable of contact communication is mounted;
A main substrate having a third center hole and having a recording layer;
One side of the main board and one side of the dummy board are joined,
A screwed portion and a screwed portion that can be screwed to each other are formed on the inner side wall forming the first center hole of the dummy substrate and the outer side wall of the IC chip module substrate,
The IC chip module can be attached to and detached from the first center hole portion of the dummy substrate in a screwed relationship.

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