JP2010091986A - Optical unit, and imaging unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical unit capable of effectively using an area other than an area through which luminous flux from a subject passes, and achieving miniaturization. <P>SOLUTION: The optical unit 3 includes: an imaging optical part A formed to have image pickup lenses 17a to 19a in a layering direction S of optical components 7, 8 and 17 to 19 in a first area 61 of the optical unit 3 in a plan view where the optical unit 3 is viewed from above; and an illumination optical part B formed to have illumination lenses 18b and 19b in the layering direction S in a second area 62 kept away from the imaging optical part A in the plan view where the optical unit 3 is viewed from above. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optical unit and an imaging unit configured by a laminated body formed by laminating a plurality of optical components.

  Conventionally, an electronic endoscope including an imaging unit provided with a solid-state imaging device such as a CCD or CMOS, a mobile phone with a camera, a digital camera, and the like are well known.

  In general, an imaging unit mainly includes a solid-state imaging device and an optical unit that includes a lens that allows an optical image of a subject to enter a light-receiving unit of the solid-state imaging device.

  Incidentally, in recent years, the optical unit was formed by cutting out the optical unit wafer after forming an optical unit wafer by bonding a plurality of lens wafers constituting optical components such as lenses, apertures, and spacers. An optical component in which a plurality of layers are laminated is well known.

  Also in the imaging unit, an optical unit wafer is formed by bonding a plurality of lens wafers constituting lenses, diaphragms, spacers, etc., and a sensor wafer having a solid-state imaging device is further bonded to the optical unit wafer. It is well known that the imaging unit wafer is formed by cutting out the imaging unit wafer after the imaging unit wafer is formed.

  FIG. 8 is a perspective view showing an outline of the configuration of a conventional imaging unit. For example, in Patent Document 1, as shown in FIG. 8, lenses 22 a to 22 c that are optical components are arranged between the lenses 22 a and 22 b and between the lenses 22 b and 22 c in the optical axis direction. An imaging unit 24 is disclosed that is configured by attaching an imaging element 23 to the bottom surface of an optical unit 22 that is configured by laminating a plurality of layers so as to have an interval.

Also in the optical unit 22 shown in FIG. 8, the optical unit 22 bonds the lens wafer formed with the lens 22a, the lens wafer formed with the lens 22b, and the lens wafer formed with the lens 22c. After the optical unit wafer is formed, it is formed by cutting the optical unit wafer by dicing or the like. The outer shape of the optical unit 22 is often rectangular or polygonal as viewed from above, as shown in FIG. 8, due to processing limitations.
JP 2004-29554 A

  Here, in the optical unit 22 disclosed in Patent Document 1, a region that functions as an optical lens, that is, a region that functions to form an optical image of a subject on the image sensor 23 in the optical unit 22, in other words, The region through which the luminous flux from the subject passes is set to be equal to or smaller than the dimension of the circle C inscribed in the quadrangle that forms the outer shape of the optical unit 22 as shown in FIG.

  Therefore, as described above, the outer shape of the optical unit 22 is formed in a quadrangular shape or the like due to restrictions on the processing method as described above. Therefore, as shown in FIG. The area covered by the oblique line D becomes an optically invalid area, and there is a problem that a useless area is formed in the optical unit 22.

  9 is a partial cross-sectional view showing an outline of the configuration of the insertion portion distal end side in a state where a conventional imaging unit is provided at the distal end of the insertion portion of the endoscope, and FIG. 10 is a view of FIG. 9 viewed from the X direction. As shown in FIGS. 9 and 10, generally, at the distal end 31 of the insertion portion of the endoscope, in addition to the imaging unit 34, an illumination light guide 35 and a treatment instrument are inserted around the imaging unit 34. A channel 36 and the like are provided.

  At this time, as shown in FIG. 10, the external dimensions of the insertion portion distal end 31 of the endoscope depend on the external shape of the imaging unit 34 itself and the external shapes of the illumination light guide 35 and the treatment instrument insertion channel 36. However, even in this case, if the optically invalid region E is formed in the imaging unit 34, the outer shape of the imaging unit 34 becomes large, so that the distal end 31 of the insertion portion of the endoscope is thick. As a result, the diameter of the endoscope patient may become painful.

  An object of the present invention has been made in view of the above circumstances, and provides an optical unit and an imaging unit that can effectively use a region other than a region through which a light beam from a subject passes and can achieve downsizing. is there.

  In order to achieve the above object, an optical unit according to the present invention is an optical unit composed of a laminated body formed by laminating a plurality of optical components, and in the state where the laminated body is viewed in plan view from above, An imaging optical unit formed in the first region so as to have an imaging lens along the stacking direction of the optical components, and a second that avoids the imaging optical unit in a state where the stacked body is viewed from above. And an illumination optical part formed so as to have an illumination lens along the stacking direction.

  An imaging unit according to the present invention is an imaging unit having an optical unit composed of a laminated body formed by bonding a plurality of optical components, and an imaging device on which the optical unit is mounted. In a state viewed from above, the imaging optical unit formed in the first region of the optical unit so as to have an imaging lens along the stacking direction of the optical components, and the optical unit viewed from above In the second region avoiding the imaging optical unit, an illumination optical unit formed so as to have an illumination lens along the stacking direction, and in the second region of the optical unit, A first recess formed along the stacking direction from the bottom surface, an imaging unit, and a first peripheral circuit unit provided with a light emitting element; The imaging unit is located in the first region with respect to the bottom surface of the optical unit, the first peripheral circuit unit and the light emitting element are located in the second region, and the light emitting element And the imaging element bonded so as to be positioned in the first recess.

  According to the present invention, it is possible to provide an optical unit and an imaging unit that can effectively utilize a region other than a region through which a light beam from a subject passes and can realize downsizing.

Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)
FIG. 1 is a perspective view showing an imaging unit of the present embodiment, and FIG. 2 is a cross-sectional view of the imaging unit along the line II-II in FIG.

  As shown in FIGS. 1 and 2, the imaging unit 1 includes an imaging element 2 and an optical unit 3.

  The optical unit 3 includes a flat plate 17 that is an optical component, a spacer member 8 that is an optical component bonded to the flat plate 17, a flat plate 18 that is an optical component bonded to the spacer member 8, and the flat plate 18. The main part is constituted by the diaphragm 7 which is an optical component bonded on top and the flat plate 19 which is an optical component bonded on the diaphragm 7. That is, the optical unit 3 is formed as a laminated body in which a plurality of optical components 17 to 19, 7, and 8 are bonded together.

  The diaphragm 7 may be provided between the flat plate 17 and the flat plate 18, and the spacer member 8 may be provided between the flat plate 18 and the flat plate 19. Furthermore, a configuration without the spacer member 8 may be used.

  The flat plate 17 is formed of a transparent member, for example, glass, having an imaging lens 17a in a first region 61, for example, a central region in a state where the optical unit 3 is viewed from above.

  Further, the flat plate 18 includes the imaging lens 18a in the first region 61 from a transparent member, for example, glass, and the second region avoiding the first region 61 in a state where the optical unit 3 is viewed from above. 62, for example, in the peripheral region of the first region 61, for example, having four illumination lenses 18b. Note that the second region 62 is a region other than the region through which the light flux from the subject passes in the optical unit 3.

  Further, the flat plate 19 is formed of a transparent member, for example, glass, having an imaging lens 19a in the first region 61 and having, for example, four illumination lenses 19b in the second region 62.

  The imaging lenses 17a to 19a are provided in the first region 61 so as to face each other in the stacking direction S of the optical components 17 to 19, 7, and 8, and the illumination lenses 18b and 19b are also second. The regions 62 are provided so as to face each other in the stacking direction S.

  That is, the optical unit 3 includes the imaging optical unit A including the imaging lenses 17a, 18a, and 19a along the stacking direction S in the first region 61, and in the second region 62, An illumination optical part B having illumination lenses 18b and 19b is formed along the stacking direction S.

  The flat plates 17 to 19 are not limited to glass, and may be formed of a transparent resin or a composite member of transparent resin and glass.

  The spacer member 8 determines an interval in the stacking direction S between the flat plate 17 and the flat plate 18 to an arbitrary dimension, and is formed from a glass plate or a resin sheet.

  The diaphragm member 7 determines the brightness (F number) of light incident on the imaging lenses 17a to 19a and blocks unnecessary light incident on the imaging optical unit A. The diaphragm member 7 is a black resin sheet or metal. It is formed from a plate.

  Further, as shown in FIG. 2, in the second region 62 of the optical unit 3, the first recesses are formed along the stacking direction S from the bottom surface 3 t of the optical unit 3 with respect to the flat plate 17, the spacer member 8, and the flat plate 18. 3h is formed.

  Further, the image pickup element 2 made of, for example, a CMOS type semiconductor element is attached to the bottom surface 3t of the optical unit 3 so as to be integrated with the optical unit 3. Specifically, the imaging device 2 includes an imaging unit 4 and a first peripheral circuit unit 5 on which a light emitting element 9 made of, for example, a white LED is mounted. The imaging unit 4 includes the first region 61. The image pickup device 2 includes the optical unit 3 so that the first peripheral circuit portion 5 and the light emitting element 9 are located in the second region 62 and the light emitting element 9 is located in the first recess 3h. Is attached to the bottom surface 3t.

  In addition, a light shielding member 10 is provided on the peripheral surface of the first recess 3h to prevent the illumination light emitted from the light emitting element 9 from entering the imaging optical unit A. Since the illumination light is not incident on the imaging optical unit A by the light shielding member 10, the imaging unit 4 can acquire a high-quality image.

  The illumination light emitted from the light emitting element 9 is uniformly extended and irradiated toward the subject in the illumination lenses 18b and 19b in the illumination optical part B. The light emitting operation of the light emitting element 9 is controlled in synchronism with the imaging operation of the imaging unit 4 in a control unit (not shown) outside the imaging unit 1.

  In the present embodiment, as shown in FIG. 1, the outer shape of the image sensor 2 and the outer shape of the optical unit 3 are the same shape. A lens wafer having a flat plate 17, a lens wafer having a spacer member 8, a lens wafer having a flat plate 18, a lens wafer having a diaphragm 7, and a lens wafer having a flat plate 19. A plurality of wafers are bonded together to form an optical unit wafer, and a sensor wafer having the imaging device 2 is bonded to the optical unit wafer to form an imaging unit wafer, and then the imaging unit wafer is cut out by, for example, dicing This is because the imaging unit 1 is manufactured.

  In FIG. 1, the outer shape of the imaging unit 1 is shown as a quadrangle, but the outer shape of the imaging unit 1 may be a polygonal shape such as a hexagon.

  In addition, the imaging unit 1 is shown to be cut out after bonding the optical unit wafer and the sensor wafer. However, after the optical unit 3 is separated from the optical unit wafer, the imaging element 2 separated from the sensor wafer is removed. It may be formed by being bonded to the optical unit 3.

  Further, the imaging unit 2 may be formed by bonding the image pickup device 2 to the optical unit wafer, or may be divided to form the imaging unit 1, or the optical unit 3 may be bonded to the sensor wafer and then divided to form the imaging unit 1. It doesn't matter.

  Further, the outer shapes of the optical unit 3 and the image pickup device 2 do not have to coincide with each other, and may be formed in different shapes.

  Thus, in the present embodiment, in the imaging unit 1, the imaging optical unit A is formed in the first region 61 of the optical unit 3, and the illumination optical unit B is formed in the second region 62. Indicated. In addition, the imaging unit 4 is located in the first region 61 and the first peripheral circuit unit 5 and the light emitting element 9 are located in the second region 62.

  According to this, since the area other than the imaging optical unit A can be used as the illumination optical unit B, the illumination function can be combined and enhanced without increasing the size of the imaging unit. Further, when the imaging unit is provided at the distal end of the insertion portion of the endoscope, for example, the distal end portion of the insertion portion can be reduced in size. Further, when the capsule endoscope is provided, the capsule endoscope itself can be reduced in size. Moreover, since the imaging optical part A and the illumination optical part B can be manufactured integrally in the optical unit 3, the assembly and processing costs of the imaging unit 1 are reduced as compared with the conventional case.

  As described above, it is possible to provide an optical unit and an imaging unit that can effectively use a region other than a region through which a light beam from a subject passes, and can achieve downsizing.

(Second Embodiment)
3 is a cross-sectional view of the imaging unit showing the present embodiment, and FIG. 4 is an enlarged perspective view showing a flat plate in FIG.

  The configuration of the optical unit and the imaging unit of the second embodiment is the same as that of the optical unit and imaging unit of the first embodiment shown in FIGS. In addition, a lens having a rectangular shape in plan view from above and a part of the second region 62 of the optical unit are defined as a third region 63, and a wireless transmission / reception unit is provided in the third region 63. It differs from the provided point.

  Therefore, only these differences will be described, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted.

  As shown in FIG. 3, on the imaging lens 17a of the flat plate 17, a resin lens 6 having a curved surface on the surface of a glass surface is formed in combination with the imaging lens 17a. As shown in FIG. 4, the resin lens 6 is formed in a shape projecting upward from the upper surface formed on the plane of the imaging lens 17 a, and the shape viewed in plan from above is the imaging of the image sensor 2. According to the shape of the part 4, it has a rectangular shape obtained by cutting off four circular directions into a straight line.

  This is because the outer shape of the image pickup unit 4 of the image pickup device 2 is generally a square shape, and therefore the effective outer shape of the resin lens 6 is substantially rectangular corresponding to the shape of the passage region of the light beam reaching the image pickup unit 4. It is because it is preferable to do.

  The resin lens 6 is not limited to the imaging lens 17a, and may be formed on the imaging lens 18a or the imaging lens 19a. Furthermore, the resin lens 6 may be formed on the illumination lens 18b or the illumination lens 19b.

  As shown in FIGS. 3 and 4, a part of the second area 62 of the optical unit 3 is defined as a third area 63, and the wireless transmission / reception unit G is provided in the third area 63. Note that the third region 63 is a region other than the region through which the light flux from the subject passes, like the second region 62.

  Further, in the third region 63 of the optical unit 3, a second recess 3 g is formed along the stacking direction S from the bottom surface 3 t of the optical unit 3 with respect to the flat plate 17, the spacer member 8, and the flat plate 18.

  Further, in the present embodiment, the image sensor 2 is a wireless transmission / reception composed of an image capturing unit 4, a first peripheral circuit unit 5 on which a light emitting element 9 is mounted, a patterned transmission / reception antenna and transmission / reception circuit. The device 11 includes a second peripheral circuit unit 55 on which the wireless transmission / reception device 11 is mounted, and the imaging unit 4 is located in the first region 61, and the first peripheral circuit unit 5 and the light emitting element 9 is located in the second region 62, the light emitting element 9 is located in the first recess 3h, the second peripheral circuit portion 55 and the wireless transceiver 11 are located in the third region 63, The wireless transmission / reception element 11 is attached to the bottom surface 3t of the optical unit 3 so as to be positioned in the second recess 3g.

  The wireless transmission / reception element 11 can wirelessly transmit the output signal of the imaging element 2 to the outside and can control the operation of the imaging element 2 from the outside. Further, the wireless transmission / reception element 11 can also transmit an identification signal unique to the imaging unit 1.

  In addition, since the imaging unit 1 having the above-described configuration includes the wireless transmission / reception element 11, the imaging unit 1 can be applied to, for example, a medical capsule endoscope.

  In the present embodiment, the light emitting element 9 located in the second region 62 is an organic EL composed of a thin film light emitter, and is directly formed in the first peripheral circuit portion 5 of the imaging element 2. . The light emitting element 9 is controlled to emit light in synchronization with the imaging operation of the image sensor 2 by the first peripheral circuit unit 5 of the image sensor 2.

  As described above, in the present embodiment, a part of the second region 62 of the optical unit 3 is defined as the third region 63, and the wireless transmission / reception element 11 is provided in the third region 63.

  According to this, since the area other than the imaging optical unit A of the optical unit 3 can be used not only as the illumination optical unit B but also as the wireless transmission / reception unit G, a small imaging unit having not only an illumination function but also a wireless function can be obtained. Since it is realizable, a highly functional imaging unit is realizable.

  In the present embodiment, since the resin lens 6 having a rectangular shape when viewed from above is integrally formed with the imaging lens 17a on the imaging lens 17a, the imaging unit is enlarged. Therefore, the lighting function and / or the wireless function can be combined to be highly functional. Further, when the imaging unit is provided at the distal end of the insertion portion of the endoscope, for example, the distal end portion of the insertion portion can be reduced in size. Further, when the capsule endoscope is provided, the capsule endoscope itself can be reduced in size. Other effects are the same as those of the first embodiment described above.

(Third embodiment)
FIG. 5 is a cross-sectional view of the imaging unit showing the present embodiment.
The configuration of the optical unit and the imaging unit of the third embodiment is such that the imaging lens 18a of the flat plate 18 is compared to the optical unit and the imaging unit of the second embodiment shown in FIGS. The difference is that it is composed of a Fresnel lens and the point that the imaging lens 17a of the flat plate 17 is composed of an aspherical lens.

  Therefore, only these differences will be described, the same reference numerals are given to the same components as those in the second embodiment, and the description thereof will be omitted.

  As shown in FIG. 5, in the present embodiment, the imaging lens 18 a is composed of a Fresnel lens 59. The Fresnel lens 59 is formed by molding a transparent resin, and the lens is formed thinner than a normal convex lens. The imaging lens 18a is not limited to the Fresnel lens, and may be a diffractive lens.

  Further, the imaging lens 17 a is composed of an aspheric lens 56. Since the aspherical lens 56 is formed by molding glass at a high temperature, a lens shape having a complicated shape can be obtained as compared with a normal convex lens.

  The illumination lenses 18b and 19b may also be composed of a Fresnel lens 59, a diffractive lens, or an aspherical lens 56.

  A wireless transmission / reception unit G is provided in the third region 63 of the optical unit 3. In the third region 63 of the optical unit 3, a second recess 3 m is formed along the stacking direction S from the bottom surface 3 t of the optical unit 3 with respect to the flat plate 17, the spacer member 8, and the flat plate 18.

  Further, in the present embodiment, the imaging device 2 includes an imaging unit 4, a first peripheral circuit unit 5 on which a light emitting element 9 made of, for example, a white LED is mounted, a coiled transmission / reception antenna and a transmission / reception circuit. And a second peripheral circuit unit 55 on which the wireless transmitter / receiver element 51 is mounted, and the imaging unit 4 is located in the first region 61 and the first peripheral The circuit portion 5 and the light emitting element 9 are located in the second region 62, the light emitting element 9 is located in the first recess 3h, and the second peripheral circuit portion 55 and the wireless transmitting / receiving element 51 are in the third region. The wireless transmitting / receiving element 51 is attached to the bottom surface 3t of the optical unit 3 so as to be positioned in the second recess 3m.

  The wireless transmission / reception element 51 can wirelessly transmit the output signal of the imaging element 2 to the outside and can control the operation of the imaging element 2 from the outside. It is also possible to transmit an identification signal unique to the imaging unit 1.

  In this embodiment, as in the second embodiment, the wireless transmission / reception element 51 transmits the signal output from the second peripheral circuit unit 55 of the image sensor 2 to the outside, and transmits the signal from the outside. Received and transmitted to the second peripheral circuit section 55.

  In addition, since the imaging unit 1 having the above-described configuration includes the wireless transmission / reception element 51, the imaging unit 1 can be applied to, for example, a medical capsule endoscope.

  As described above, in the present embodiment, the imaging lens 18 a is configured from the Fresnel lens 59, and the imaging lens 17 a is configured from the aspheric lens 56.

  According to this, since the optical path length in the imaging optical unit A can be made shorter than that in the second embodiment described above, the imaging unit 1 can be further reduced in size and the performance of the imaging optical unit A. Can be further improved. Other effects are the same as those of the second embodiment described above.

  Hereinafter, a modification of the present embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view showing a configuration of a modified example of the imaging unit of the present embodiment.

  In the present embodiment, in the illumination optical part B, it is indicated that the light emitting element 9 is located in the second recess 3h.

  Not only this but as shown in FIG. 6, in the illumination optical part B, the light guide 12 may be arrange | positioned instead of the light emitting element 9. FIG. The light guide 12 is provided with a lamp (not shown) on the base end side, and transmits light emitted as the lamp emits light to the imaging unit 1 as illumination light. The transmitted illumination light is extended and irradiated toward the subject by the illumination optical unit B.

  In this configuration, as shown in FIG. 6, the image pickup device 2 is formed to have an outer shape smaller than the optical unit 3 so as to avoid the light guide 12, but for inserting the light guide 12 into the image pickup device 2. The image pickup device 2 is arranged at a position where the tip of the light guide 12 faces the illumination optical unit B by forming through holes (not shown) or chamfering the four corners of the image pickup device 2.

  In the present embodiment, the wireless transmitting / receiving element 51 is provided in the third region 63. However, the present invention is not limited to this, and an acceleration sensor, a magnetic sensor, a GPS sensor, a motor, or the like is provided in the third region 63. An actuator such as a piezoelectric element may be disposed. Further, the above is the same in the second embodiment described above.

  Moreover, the optical unit or the imaging unit shown in the first to third embodiments described above is provided, for example, in an endoscope. FIG. 7 is a perspective view showing an endoscope apparatus including an endoscope provided with an optical unit or an imaging unit.

  As shown in FIG. 7, the endoscope apparatus 101 includes an endoscope 102 and a peripheral device 100. The endoscope 102 is mainly composed of an operation unit 103, an insertion unit 104, and a universal cord 105.

  The peripheral device 100 includes a light source device 121, a video processor 122, a connection cable 123, a keyboard 124, and a monitor 125 that are arranged on a base 126. Further, the endoscope 102 and the peripheral device 100 having such a configuration are connected to each other by a connector 119.

  The insertion portion 104 of the endoscope 102 includes a distal end portion 106, a bending portion 107, and a flexible tube portion 108.

  An objective lens 111 is disposed on the side surface of the distal end portion 106. In addition, the above-described imaging unit 1 is built in the distal end portion 106.

  A connector 119 is provided at the distal end of the universal cord 105 of the endoscope 102, and the connector 119 is connected to the light source device 121 of the peripheral device 100. The connector 119 is provided with a light guide base (not shown) that constitutes an end of a light guide (not shown), an electrical contact portion to which an end of an imaging cable (not shown) is connected, and the like.

  The imaging cable is inserted from the imaging device 2 in the distal end portion 106 to the above-described electrical contact portion in the connector 119 via the insertion portion 104, the operation portion 103, and the universal cord 105. The electric signal of the image picked up in (1) is transmitted to the video processor 122.

  As described above, if the optical unit or the imaging unit shown in the first to third embodiments is provided in the distal end portion of the insertion portion of the endoscope, the distal end portion can be further reduced in diameter. .

  Furthermore, the optical unit or the imaging unit shown in the first to third embodiments described above may be provided in a medical capsule endoscope, not limited to an endoscope, Needless to say, it may be applied to a digital camera.

The perspective view which shows the imaging unit of 1st Embodiment. Sectional drawing of the imaging unit which follows the II-II line | wire in FIG. Sectional drawing of the imaging unit which shows 2nd Embodiment. The perspective view which expands and shows the flat plate in FIG. Sectional drawing of the imaging unit which shows 3rd Embodiment. Sectional drawing which shows the structure of the modification of the imaging unit of 3rd Embodiment. The perspective view which shows the endoscope apparatus which comprises the endoscope provided with the optical unit or the imaging unit. The perspective view which shows the outline of a structure of the conventional imaging unit. The fragmentary sectional view which shows the outline of the structure by the side of the insertion part in the state which provided the conventional imaging unit in the front-end | tip of the insertion part of an endoscope. The top view which looked at FIG. 9 from the X direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Imaging unit 2 ... Imaging element 3 ... Optical unit (laminated body)
3g ... 2nd recessed part 3h ... 1st recessed part 3m ... 2nd recessed part 3t ... Bottom of optical unit 4 ... Imaging part 5 ... 1st peripheral circuit part 7 ... Diaphragm (optical component)
8. Spacer member (optical component)
DESCRIPTION OF SYMBOLS 9 ... Light emitting element 10 ... Light-shielding member 17 ... Flat plate (optical component)
17a ... Imaging lens 18 ... Flat plate (optical component)
18a ... Imaging lens 18b ... Illumination lens 19 ... Flat plate (optical component)
DESCRIPTION OF SYMBOLS 19a ... Imaging lens 19b ... Illumination lens 55 ... 2nd peripheral circuit part 59 ... Fresnel lens 61 ... 1st area | region 62 ... 2nd area | region 63 ... 3rd area | region A ... Imaging optical part B ... Illumination optical part G: Wireless transmission / reception unit S: Stack direction

Claims (10)

In an optical unit composed of a laminate formed by laminating a plurality of optical components,
In a state where the laminate is viewed from above, an imaging optical unit formed in the first region of the laminate so as to have an imaging lens along the lamination direction of the optical component;
In a state where the stacked body is viewed from above, an illumination optical unit formed to have an illumination lens along the stacking direction in the second region avoiding the imaging optical unit;
An optical unit comprising: The imaging lens and the illumination lens are composed of a plurality of lenses,
2. The optical unit according to claim 1, wherein a Fresnel lens or a diffractive lens is used in at least one of at least a part of the imaging lens and at least a part of the illumination lens. The imaging lens is composed of a plurality of lenses,
The optical unit according to claim 1, wherein at least a part of the imaging lens has a rectangular outer shape when viewed from above.   The wireless transmission / reception unit is further provided in a third region constituting a part of the second region in a state where the stacked body is viewed from above. The imaging unit according to claim 1. In an imaging unit having an optical unit composed of a laminate formed by laminating a plurality of optical components, and an imaging device on which the optical unit is mounted,
In a state where the optical unit is viewed from above, an imaging optical unit formed in the first region of the optical unit so as to have an imaging lens along the stacking direction of the optical components;
In a state where the optical unit is viewed in plan from above, an illumination optical unit formed so as to have an illumination lens along the stacking direction in a second region avoiding the imaging optical unit;
A first recess formed in the second region of the optical unit along the stacking direction from the bottom surface of the optical unit;
The imaging unit and a first peripheral circuit unit provided with a light emitting element, the imaging unit is located in the first region with respect to the bottom surface of the optical unit, and the first peripheral circuit And the imaging element bonded so that the light emitting element is positioned in the second region and the light emitting element is positioned in the first recess,
An imaging unit comprising:   The imaging unit according to claim 5, wherein a light shielding member is provided on a peripheral surface of the first recess.   The wireless transmission / reception unit is further provided in a third region that constitutes a part of the second region in a state where the optical unit is viewed from above. Imaging unit. A second recess formed in the third region of the optical unit along the stacking direction from the bottom surface of the optical unit;
The imaging unit includes a first peripheral circuit unit provided with the light emitting element and a second peripheral circuit unit provided with a wireless transmission / reception element, and the imaging unit is disposed on the bottom surface of the optical unit. The first peripheral circuit portion and the light emitting element are located in the second region, the light emitting element is located in the first recess, and the second peripheral circuit portion is located in the first region. The imaging element bonded so that the circuit unit and the wireless transceiver element are located in the third region and the wireless transceiver element is located in the second recess;
The imaging unit according to claim 7, further comprising: The imaging lens and the illumination lens are composed of a plurality of lenses,
9. The Fresnel lens or the diffractive lens is used in at least one of at least a part of the imaging lens and at least a part of the illumination lens. Imaging unit. The imaging lens and the illumination lens are composed of a plurality of lenses,
9. At least one of the imaging lens and at least a part of the illumination lens has a rectangular outer shape when viewed from above in a plan view. The imaging unit according to any one of the above.

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