JP2010091542A - Probe assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe assembly which facilitates simultaneous inspection of a plurality of chips of LSIs having narrow pitches and multiple pins. <P>SOLUTION: The probe assembly includes: a laminate acquired by laminating a plurality of resin films with probes, each of which is composed of a resin film with a probe having a conductive part comprising the probe on the surface, and has two probe structure sections comprising spring deformation sections, and arranged substantially symmetrically at both ends on one resin film with a probe stretching in the X direction, as a probe assembly unit corresponding to two groups of electrode pads arranged in the Y direction on semiconductor chips; and a laminate acquired by laminating a plurality of resin films with probes, each of which has two probe structure sections comprising spring deformation sections, and arranged substantially symmetrically at both ends on one resin film with a probe stretching in the Y direction, as a probe assembly unit corresponding to two groups of electrode pads arranged in the X direction on the semiconductor chips. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a probe assembly of a prober apparatus used for circuit inspection of a plurality of semiconductor chips formed on a semiconductor wafer in a manufacturing process of an electronic device such as an LSI. In particular, the present invention relates to a probe assembly of a prober device used for a probing test in which a probe is brought into contact with a circuit terminal (pad) arranged on a semiconductor chip while being in a wafer state, and the electrical continuity of the semiconductor chip is collectively measured.

  With the advancement of semiconductor technology, the degree of integration of electronic devices has improved, and the number of circuit terminals (pads) on each semiconductor chip has increased, and along with that, the pad area has been reduced by reducing the pad area and the pad pitch. Miniaturization is progressing.

  On the other hand, even in a probe card used for inspecting a semiconductor circuit by electrically connecting pads on the semiconductor circuit by a probe group (probe), the number of pads on the semiconductor chip is increased, the pad area is reduced, and the pad pitch is reduced. In order to cope with this trend, the density of probe arrays has been increased.

(General configuration of probe card)
Generally, a probe card is a central part of a printed wiring board having a standard rough pitch land or through-hole for connection with an inspection device in the periphery as disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-075503. In order to convert the high-density wiring near the probe assembly into a standard coarse pitch pad or through-hole around the common wiring board, soldering or flexible flat The connection is made through a cable or the like.

(Example of probe with resin film)
Further, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2007-279209, a probe assembly is made of a resin film to which a copper alloy foil is bonded, and the copper alloy foil is etched to probe on the resin film. And a conductive part including the output terminal part, and a plurality of the probes with the resin film are laminated, and the output terminal parts are shifted at a rough pitch when the probes with the resin film are laminated. Each resin film is formed. As a result, it is possible to connect to a printed wiring board with a somewhat rough pitch even in the vicinity of the probe assembly while being compatible with a narrow pitch pad of LSI, which contributes to the improvement of the probing test function.

(Need for simultaneous measurement of multiple chips)
On the other hand, shortening of LSI inspection time is required in accordance with the demand for lower LSI cost. For this reason, a prober device capable of simultaneously measuring a plurality of adjacent LSI chips on the same wafer has been developed, and has already been partially put into practical use mainly in the field of memory LSIs.

(Current state of peripheral array pad type LSI measurement)
As shown in FIG. 7, the electrical measurement method on the wafer of the peripherally arranged pad type LSI is such that the probe assembly 21 in which the machined cantilevers are arranged and fixed so as to correspond to the pads around the LSI to be measured is commonly wired. A probe card is used that is arranged in the approximate center of the substrate 22 and wired from each probe to a common pad 24 arranged around the common wiring substrate 22 via a flexible flat cable 23 or the like.

However, in the cantilever type probe assembly having the above-described configuration, a mounting area for wiring is required in the periphery for one LSI to be measured, and a plurality of adjacent chips arranged in pads on the four sides are provided. It is difficult to measure at the same time.
Japanese Patent Laid-Open No. 2003-075503 JP 2007-279209 A

  The present invention has been made in order to solve the above-mentioned problems. In a prober apparatus using a probe assembly developed in response to a narrow pitch of pads on a semiconductor chip, the advantage of the probe with a resin film is obtained. By applying and efficiently dealing with LSIs that are padded on the four sides with a narrow pitch and multiple terminals, an inexpensive probe assembly that facilitates simultaneous measurement of multiple LSIs is provided, and LSI inspection time is shortened It contributes to the conversion.

  The present invention uses a resin film to which a metal foil is bonded, etching the metal foil to form a conductive part including a probe on the resin film, and laminating a plurality of the resin films with the probe to form a semiconductor chip In the probe assembly for performing the circuit inspection of the semiconductor chip by bringing the tip of the probe into contact with the electrode pads at once, springs are attached to both ends of the resin film with one probe in the X direction of the XYZ three-dimensional orthogonal coordinate system. A probe assembly corresponding to two Y-direction electrode pad array groups on a semiconductor chip is formed by laminating a plurality of resin films with a probe in which two probe structure portions including a deformation portion are arranged approximately symmetrically. Resin film with a probe in which two probe structure parts including a spring deformed part are arranged approximately symmetrically at both ends on one resin film with a probe A probe assembly and probe assembly to corresponding ones in which a plurality of stacked two X-direction electrode pad array groups on a semiconductor chip. In the XYZ three-dimensional orthogonal coordinate system, the X direction is an arrangement direction of pads arranged on a semiconductor chip, and the Y direction is a direction perpendicular to the resin film surface, that is, a resin film lamination direction. The Z direction is a direction perpendicular to the semiconductor chip surface.

  The length of the vertical probe in the probe structure part of the resin film with X direction probe is made longer than the length of the vertical probe in the probe structure part of the resin film with Y direction probe, and the resin film group with Y direction probe is It is a probe assembly arrange | positioned at the lower part of the said resin film group with an X direction probe except the vertical probe of the resin film with an X direction probe.

  The said resin film with a probe has the said probe structure part in the one end side of a Z direction, and has an output terminal part connected to a test | inspection apparatus in the other end side.

  The output terminal portion is formed on each resin film so that the arrangement positions thereof are shifted at substantially equal pitches when the probes with resin film are laminated.

A part of the conductive part of the resin film with the X direction probe is electrically independent from the conductive part of the probe or output terminal in the same film, and has connection terminals at both ends in the Z direction,
It is a probe assembly in which a lower terminal is connected to a terminal of the resin film with a Y-direction probe and an upper terminal is an output terminal connected to an inspection apparatus.

  The tip of the vertical probe is held by a guide hole and its position is regulated.

  According to the present invention, a set of a plurality of LSI chips each having a pad arrangement of adjacent four sides can be used for a narrow pitch pad by using a resin film with a probe, and efficient wiring can be realized. Therefore, it is possible to simultaneously measure a plurality of chips of an LSI having a pad arrangement of four sides around a narrow pitch and multiple pins.

  Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a schematic structure of a probe assembly according to an embodiment of the present invention.

  In FIG. 1, reference numeral 1 denotes a probe assembly according to the present invention, which is a probe assembly for simultaneously measuring a set of adjacent LSIs to be inspected 10a, 10b, 10c and 10d. 2a is a probe assembly corresponding to the Y-direction pad array groups 102 and 104 in the LSI 10a to be inspected, and 3a is a probe group corresponding to the X-direction pad array groups 101 and 103 in the LSI 10a to be inspected.

  Similarly, 2b and 3b are probe groups corresponding to the Y-direction pad array group and X-direction pad array group in the LSI 10b to be inspected, and 2c and 3c are respectively Y-direction pad array group and X-direction pad array group in the LSI 10c to be inspected. Corresponding probe groups, 2d and 3d are probe groups corresponding to the Y-direction pad array group and the X-direction pad array group in the LSI 10d to be inspected, respectively.

  These probe groups 2a to 2d and 3a to 3d are arranged so as to correspond to the pad arrangement of the LSIs 10a to 10d to be inspected, aligned and fixed by the support bars 41 to 46 and the fixing bases 5a to 5d. The probe assembly 1 is configured by fixing. Further, the probe assembly 1 is attached to a common wiring board (not shown in FIG. 1) by means of attachment screws 6a to 6d provided on the fixing bases 5a to 5d.

  The relationship between the probe assembly 1, the LSI to be inspected 10, and the common wiring board 9 will be described with reference to FIGS.

  2 and 3 show side views in the Y direction and X direction showing the structure of the present invention, respectively, and FIG. 4 shows a front view. In these drawings, the probe groups 2a to 2d and 3a to 3d are arranged to correspond to the pad arrangement of the LSIs to be inspected 10a to 10d, and are arranged in the X direction and the Y direction by the support bars 41 to 46 and the housing 7, respectively. The positions of the probe groups are precisely determined, and the Z-direction positions of the probe groups 2a to 2d and 3a to 3d are precisely determined by the fixing bases 5a to 5d. Further, the probe assembly 1 is attached to the common wiring board 9 by means of attachment screws 6a to 6d provided on the fixing bases 5a to 5d.

  On the other hand, an output terminal 204, 214, 224, 234 provided on an arbitrary resin film with a probe that constitutes a probe group described later is brought into contact with a pad 91 provided on the common wiring board 9, thereby being electrically connected to the inspection apparatus. Is possible.

  5 and 6 are partial perspective views showing the probe connection structure. The connection relationship from the probe structure and the LIS pad to the common wiring board will be described in detail with reference to FIG.

  In FIG. 5A, 3a- (1) to 3a- (n) are resin films with a probe constituting the probe group 3a, and 2a- (1) to 2a- (m) are probes constituting the probe group 2a. It is a resin film.

  The resin films 2a- (1) to 2a- (m) with a probe include a metal foil (for example, beryllium copper) such as a copper foil on a resin film 200 (for example, a polyimide resin). The conductive portions 201, 211, 221, and 231 are formed by etching the copper foil. The conductive part 201 has a spring deforming part 202 and a vertical probe 203, and performs probing by connecting to one Y-direction pad array group 102- (1) to 102- (m) of the LSI 10a to be inspected. In addition, an output terminal 204 is provided at the other end, and an electrical inspection can be performed by connecting to the pad 91 of the common wiring board 9.

  Similarly, the conductive portion 211 at the other end of the resin films with probes 2a- (1) to 2a- (m) has a spring deformed portion 212 and a vertical probe 213, and the other Y-direction pad array group 104- of the LSI 10a to be inspected. (1) Probing is performed by connecting to 104- (m). In addition, an output terminal 214 is provided at the other end, and an electrical inspection can be performed by connecting to the pad 91 of the common wiring board 9.

  The conductive portions 221 and 231 are formed electrically independent from the conductive portions 201 and 211 and have connection terminals 223 and 233 and output terminals 224 and 234, and will be described later with a resin film with a probe 3a- (1)- Connected to the connection terminal 304 or 314 of 3a- (n), the inspection signals from the probes of the resin films with probes 3a- (1) to 3a- (n) are transmitted and routed to the common wiring board 9. Furthermore, a dummy portion 240 may be provided at a place where the conductive portion is not required for the purpose of reinforcing the strength.

  The resin films 3a- (1) to 3a- (n) with a probe are obtained by bonding a copper foil (for example, beryllium copper) on a resin film 300 (for example, a polyimide resin), and etching the copper foil to conduct the conductive portion 301. 311 are formed. The conductive portion 301 has a spring deformable portion 302 and a vertical probe 303, and performs probing by connecting to one X-direction pad array group 101- (1) to 101- (n) of the LSI 10a to be inspected. In addition, the other end has a connection terminal 304 and is connected to the pad 91 of the common wiring board 9 via the conductive portions 221 or 231 of the resin films with probes 2a- (1) to 2a- (m). Electrical inspection is possible.

  Similarly, the conductive portion 311 at the other end of the resin films with probes 3a- (1) to 3a- (n) has a spring deformed portion 312 and a vertical probe 313, and the other X-direction pad array group 103- of the LSI 10a to be inspected. (1) Probing is performed by connecting to 103- (n). Further, the other end has a connection terminal 314, and is connected to the pad 91 of the common wiring board 9 via the conductive portions 221 or 231 of the resin films with probes 2a- (1) to 2a- (m). Electrical inspection is possible. Further, a dummy portion 340 may be provided at a place where the conductive portion is not required for the purpose of reinforcing the strength.

  The connection between the resin films with probes 3a- (1) to 3a- (n) and the resin films with probes 2a- (1) to 2a- (m) is as shown in FIG. And it is possible to obtain a stable connection by performing etching processing so as to have a recess in 304 and fitting them together.

  Each of the resin films with a probe has notches 205, 215 and 305, 315 for allowing the support rods 41 to 46 to pass therethrough.

  The above-described resin films with probes are arranged and fixed at predetermined intervals as shown in FIG. 1 using support bars 41 to 46 and fixing bases 5a to 5d so as to correspond to LSI pads.

  FIG. 6 shows a schematic structure in which the resin films with probes 2a- (1) to 2a- (m) and the resin films with probes 3a- (1) to 3a- (n) are laminated (in the figure, five sheets are shown). Show. As shown in FIG. 6, by setting the pitch of the output terminals 204, 214, 224, 234 and the connection terminals 304, 314 by periodically shifting their positions, the resin film with a probe 2a- (1) ~ 2a- (m) and probe-attached resin films 3a- (1) ~ 3a- (n), and probe-attached resin films 2a- (1) ~ 2a- (m) and common wiring board 9 Making it easy.

  As described above, according to the present invention, a set of a plurality of LSI chips having a pad array of four adjacent sides can be used for a narrow pitch pad by using a resin film with a probe, and the efficiency can be improved. Since good wiring is possible, it is possible to simultaneously measure a plurality of chips of an LSI having a pad arrangement of four sides around a narrow pitch and multiple pins.

It is a perspective view which shows the schematic structure in this invention. It is a Y direction side view showing the structure in the present invention. It is a X direction side view which shows the structure in this invention. It is a front view which shows the structure in this invention. (A) It is a fragmentary perspective view which shows the probe connection structure in this invention. (B) It is a fragmentary perspective view which shows the probe connection part detail in Fig.5 (a). It is a fragmentary perspective view which shows the probe assembly structure in this invention. It is a figure which shows the example of the conventional prober apparatus.

Explanation of symbols

1 Probe assembly 2a, 2b, 2c, 2d Probe 200 corresponding to Y direction electrode pad array group Resin film 201, 211, 221, 231 Conductive portion 202, 212 Spring deformed portion 203, 213 Vertical probe 204, 214, 224, 234 Output terminal 205, 215 Notch 223, 233 Connection terminal 240 Dummy part 3a, 3b, 3c, 3d Probe 300 corresponding to X direction electrode pad arrangement group Resin film 301, 311 Conductive part 302, 312 Spring deformation part 303, 313 Vertical probe 304, 314 Connection terminal 305, 315 Notch 340 Dummy part 41-46 Probe assembly support bar 5a, 5b, 5c, 5d Fixing base 6a, 6b, 6c, 6d Mounting screw 7 Housing 8 Guide plate 81, 82 Guide hole 9 Common wiring board 91 Pad 10 Inspection target Flops 10a, 10b, 10c, 10d adjacent the inspection chip 101 and 103 X-direction electrode pad array groups 102, 104 Y-direction electrode pad array group 21 probe assembly 22 common wiring board 23 flexible flat cable 24 common pad 25 to be inspected LSI
26 wafers

Claims (6)

Using a resin film to which a conductive metal foil is bonded, etching the metal foil to form a conductive part including a probe on the resin film, and laminating a plurality of the resin films with probes to form a semiconductor chip. In the probe assembly for performing the circuit inspection of the semiconductor chip by bringing the tip of the probe into contact with the electrode pad at once,
Two probe structure parts including spring deformed parts are arranged approximately symmetrically at both ends on one resin film with a probe (hereinafter, resin film with an X direction probe) long in the X direction on an XZ orthogonal plane, A probe assembly corresponding to two Y-direction electrode pad array groups on a semiconductor chip is formed by laminating a plurality of resin films with attached,
Two probe structure parts including spring deformed parts are arranged approximately symmetrically at both ends on one resin film with a probe (hereinafter, resin film with a Y direction probe) long in the Y direction on a YZ orthogonal plane, A probe assembly comprising a plurality of laminated resin films laminated as a probe assembly corresponding to two X-direction electrode pad array groups on a semiconductor chip. The length of the vertical probe in the probe structure part of the resin film with X direction probe is made longer than the length of the vertical probe in the probe structure part of the resin film with Y direction probe, and the resin film group with Y direction probe is 2. The probe assembly according to claim 1, wherein the probe assembly is disposed below the resin film group with the X direction probe except the vertical probe of the resin film with the X direction probe.   3. The probe according to claim 1, wherein the resin film with a probe has the probe structure part on one end side in the Z direction and an output terminal part connected to an inspection device on the other end side. Assembly.   4. The probe assembly according to claim 3, wherein the output terminal portion is formed on each resin film such that when the probes with a resin film are laminated, the arrangement positions thereof are shifted at substantially equal pitches.   Part of the conductive part of the resin film with the X direction probe is electrically independent from the probe or the conductive part of the output terminal in the same film, and has connection terminals at both ends in the Z direction, and the lower terminal is the terminal 3. The probe assembly according to claim 2, wherein the probe assembly is connected to a connection terminal of a resin film with a Y-direction probe, and an upper terminal serves as an output terminal connected to an inspection apparatus. 6. The probe assembly according to claim 1, wherein a tip end portion of the vertical probe is held by a guide hole and a position thereof is regulated.

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