JP2010091349A - Vertical probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vertical probe card capable of restraining a probe in a rotational direction with a simple structure without providing a rectangular guide hole.
A probe card comprising a probe having a rectangular cross-section and provided with a protruding portion on a side surface, a main board to which the upper end of the probe is connected, and a guide plate for holding the probe, the guide card The plate is composed of an upper guide plate and a lower guide plate that are arranged in parallel vertically at a predetermined interval with a spacer, and the lower guide plate has a first circular guide hole into which the probe is inserted. The upper guide plate is provided with a second circular guide hole for inserting the probe, and a slit disposed above or below the second circular guide hole, and the protrusion of the probe. The portion is in contact with the upper surface of the first circular guide hole.
[Selection] Figure 1

Description

  The present invention relates to a vertical probe card, and more particularly to improvement of a guide plate for guiding a vertical probe.

  As a probe mounted on a probe card used for measuring electrical characteristics of a semiconductor such as an LSI chip, a cantilever-shaped probe, a vertical probe, or the like is used.

The vertical probe card generally uses a structure that holds the vertical probe using two guide plates. The above-mentioned vertical probe has been manufactured using a MEMS (Micro Electro Mechanical Systems) technique as the number of pins of the probe card has been increased.

  The cross section of the probe formed using the MEMS technology is a rectangular cross section because of the manufacturing method. On the other hand, a circular hole is used as a guide hole into which the probe provided on the guide plate is inserted.

  Thus, when a probe having a rectangular cross section is inserted into a circular guide hole and the probe is held by the guide plate, the lateral movement of the probe is limited by the guide hole, but the rectangular probe is inserted into the circular hole. When inserted, the probe cannot be constrained in the rotational direction.

  If the probe is not constrained in the rotation direction, the tip of the probe rotates during semiconductor inspection, and sufficient scrubbing cannot be performed during overdrive, making it impossible to perform inspection accurately There is.

  In order to constrain the probe in the rotational direction, it is conceivable to make the guide hole rectangular. However, it is more difficult to provide a rectangular guide hole than to provide a circular guide hole, and the cost increases. is there.

  In order to solve such a problem, an object of the present invention is to provide a vertical probe card capable of restraining the probe in the rotational direction with a simple structure.

  The vertical probe card according to the present invention includes a probe having a rectangular cross section and a protrusion provided on a side surface, a main board to which an upper end of the probe is connected, and a guide plate for holding the probe. The plate is composed of an upper guide plate and a lower guide plate that are arranged in parallel vertically at a predetermined interval with a spacer, and the lower guide plate has a first circular guide hole into which the probe is inserted. The upper guide plate is provided with a second circular guide hole for inserting the probe, and a slit disposed above or below the second circular guide hole, and the protrusion of the probe. The portion is in contact with the upper surface of the first circular guide hole.

  The upper guide plate is a two-layered guide plate composed of a first guide plate and a second guide plate, and the second circular guide hole is provided in the first guide plate, The second guide plate is composed of a plurality of substrates, and the plurality of substrates are arranged in parallel at a predetermined interval to form the slit.

  Further, the probe is held by the guide plate while being bent in a predetermined direction.

  The vertical probe card according to the present invention includes a probe having a rectangular cross section and a protrusion provided on a side surface, a main board to which an upper end of the probe is connected, and a guide plate for holding the probe. The plate is composed of an upper guide plate and a lower guide plate that are arranged in parallel vertically at a predetermined interval with a spacer, and the lower guide plate has a first circular guide hole into which the probe is inserted. The upper guide plate is provided with a second circular guide hole for inserting the probe, and a slit disposed above or below the second circular guide hole, and the protrusion of the probe. Since the portion is in contact with the upper surface of the first circular guide hole, the movement of the probe in the rotational direction can be restricted, and the movement of the probe during the inspection can be controlled in a predetermined direction.

  Further, since the probe is held by the guide plate in a state of being bent in a predetermined direction, the vertical probe can be buckled and deformed in a predetermined direction during overdrive. It can be performed.

Hereinafter, the vertical probe card 1 of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic sectional view of a vertical probe card 1 of the present invention.

  As shown in FIG. 1, the vertical probe card 1 of the present invention includes a vertical probe 3, a main board 2, a guide plate 4 that holds the probe 3, and a reinforcing board 10 that reinforces the main board 2.

  The probe 3 is formed by using the MEMS technology, and the cross section thereof has, for example, a three-layered rectangular shape in which an Au layer 19 is sandwiched between NiCo layers 18 as shown in the cross-sectional view of FIG. The probe 3 is provided with a protrusion 16 for preventing the fall. If the protrusion 16 is broken, the probe 3 with the protrusion 16 bent is pulled out from the lower side of FIG. 1 with the guide plate 4 and the main board 2 assembled. 3 can also be inserted.

  The guide plate 4 is made of an insulating material and is held at a predetermined interval from the main substrate 2 by a folder 11 fixed to the main substrate 2 together with the reinforcing plate 10 using bolts 15. The guide plate 4 is composed of an upper guide plate 5 and a lower guide plate 6 which are arranged in parallel vertically at a predetermined interval via a spacer 9. The lower guide plate 6 is provided with a circular first circular guide hole 14 into which the probe 3 is inserted.

  The upper guide plate 5 has a two-layer structure including a first guide plate 8 and a second guide plate 7. The first guide plate 8 is provided with a circular second circular guide hole 12 into which the probe is inserted. As shown in FIG. 3A, the second guide plate 7 is composed of a plurality of substrates, the substrates are arranged in parallel with each other at a predetermined interval, and a slit 13 is provided between the adjacent substrates. Then, as shown in FIGS. 3B and 3C, the slits 13 provided between the substrates are on the circular second circular guide holes 12 of the second guide plate 7. Place the substrate so that it is positioned.

  The width of the slit 13 is set such that the probe 3 can be inserted and does not rotate. In the present embodiment, the first guide plate 8 is disposed below, and the second guide plate 7 is disposed thereon, so that the slit 13 is formed on the second circular guide hole 12. The second guide plate 7 is disposed below, the first guide plate 8 is disposed thereon, and the second guide plate 8 is disposed below the second circular guide hole 12. The structure which arrange | positions the slit 13 is also possible, and the upper and lower sides of the 2nd circular guide hole 12 and the slit 13 are not specifically limited. In addition, a single guide plate is used as the upper guide plate, and a circular second circular guide hole 12 is formed from one side of the single guide plate, and the circular second circular guide hole 12 is formed from the opposite side. It is also possible to process slits at overlapping positions. In this case, the slits only have to be provided individually at positions overlapping with the guide holes 12, and may not be continuous as shown in FIG.

  The structure for holding the probe 3 by the guide plate 4 will be described in detail. As shown in FIG. 2, the probe 3 has a tip protruding from the first circular guide hole 14 of the lower guide plate 6 and an upper side protruding from the slit 13 of the upper guide plate 5. In this state, it is held by the guide plate 4. At this time, the protrusion 16 provided on the probe 3 is hooked on the lower guide plate 6, thereby restricting the downward movement of the probe 3 and preventing it from dropping from the guide plate 4. ing.

  The end of the probe 3 protruding from the upper guide plate 5 is in contact with a terminal 17 provided on the main board 2, and the probe 3 is electrically connected to the main board 2. Yes. In this way, the probe 3 is held by the guide plate 4 and is electrically connected to the main board 2.

And the probe card 1 of this invention provided the rectangular guide hole in the upper side guide plate 5 by arrange | positioning the said slit 13 on the said circular 2nd circular guide hole 12 as mentioned above. The same structure is obtained. When the probe 3 having a rectangular cross section is inserted into the combination of the circular second circular guide hole 12 and the slit 13, the probe 3 is constrained in the rotational direction by the slit 13. . Thus, the probe card 1 of the present invention can obtain the same effect as that provided with the rectangular guide hole with a simpler structure.

  Further, when setting the probe 3, by adjusting the interval between the main board 2 and the guide plate 4, or by adjusting the interval between the upper guide plate 5 and the lower guide plate 6, As shown in FIG. 5A, the probe 3 is bent in a predetermined direction in advance. When the probe 3 is formed by MEMS, if a mask pattern in which the linear portion of the probe 3 is formed in an arc shape is formed, the probe 3 can be easily bent in a direction perpendicular to the stacking direction.

  Thus, when the semiconductor is inspected in a state where the probe 3 is bent in a predetermined direction in advance, the tip of the probe 3 comes into contact with the electrode 21 provided on the semiconductor wafer 20 to be inspected, When the overdrive is further performed, as shown in FIG. 5B, the probe 3 is further bent in the direction where it was initially bent as indicated by an arrow, and at the same time, the tip of the probe 3 is indicated by an arrow. Scrub in the direction shown. Thus, by bending the probe 3 in a predetermined direction in advance, the direction of buckling deformation during overdrive can be made constant.

Conventionally, since the probe 3 is not restricted in the rotational direction, even if the probe 3 is bent in advance, the probe 3 rotates and the tip thereof is scrubbed in a direction different from the predetermined direction. was there. However, in the probe card 1 of the present invention, as described above, the probe 3 is restrained in the rotational direction, so that it can be scrubbed in a certain direction as shown in FIG. .

  FIG. 6 shows another embodiment of the vertical probe 3. In the present embodiment, a noble metal considering contact is used for the contact 23 with the substrate and the contact 24 with the electrode. Further, the projecting portion 16 has a rectangular shape, is projected from the arm portion 22 of the probe 3 and is in contact with the lower guide plate 6. When such a shape is used, the arm portion 22 is thinner than the protruding portion 16, and therefore, it is easier to bend than a probe having the same shape as the arm portion and the protruding portion as shown in FIG.

Schematic sectional view of a vertical probe card of the present invention Enlarged view of FIG. (A) is a perspective view before the 1st guide plate and the 2nd guide plate are piled up, (b) is a perspective view of the state where the 1st guide plate and the 2nd guide plate were piled up (C) is a top view of the state which accumulated the 1st guide plate and the 2nd guide plate Cross section of the probe (A) is sectional drawing of the state which bent the probe previously, (b) is sectional drawing at the time of a test | inspection It is a schematic sectional drawing of the probe card using the probe of different embodiment, (a) is a schematic sectional drawing of the state before setting a board | substrate, (b) is the outline of the state which set the board | substrate and bent the probe. Cross section

Explanation of symbols

1 vertical probe card 2 main board 3 probe 4 guide plate 5 upper guide plate 6 lower guide plate 7 first guide plate 8 second guide plate 9 spacer 10 reinforcing plate 11 folder 12 second circular guide hole 13 Slit 14 First circular guide hole 15 Bolt 16 Projection 17 Terminal 18 NiCo layer 19 Au layer 20 Semiconductor wafer 21 Electrode 22 Arm 23 Contact 24 Contact

Claims (3)

A probe having a rectangular cross section, provided with a protrusion on a side surface, a main board to which the upper end of the probe is connected, and a guide plate for holding the probe;
The guide plate is composed of an upper guide plate and a lower guide plate arranged in parallel vertically at a predetermined interval by providing a spacer,
The lower guide plate is provided with a first circular guide hole for inserting the probe,
The upper guide plate is provided with a second circular guide hole into which the probe is inserted, and a slit disposed above or below the second circular guide hole, and the protruding portion of the probe is provided in the first guide plate. A vertical probe card which is in contact with the upper surface of one circular guide hole.   The upper guide plate is a two-layered guide plate composed of a first guide plate and a second guide plate, and the first guide plate is provided with the second circular guide hole. 2. The vertical probe card according to claim 1, wherein the second guide plate includes a plurality of substrates, and the plurality of substrates are arranged in parallel at a predetermined interval to form the slit.   The vertical probe card according to claim 1 or 2, wherein the probe is held by the guide plate in a state of being bent in a predetermined direction.

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