JP2010087148A - Method for manufacturing electronic circuit board - Google Patents

Abstract

An object of the present invention is to provide a method for forming a conductive pattern which has high reliability without being sintered at high temperature, that is, can prevent the occurrence of migration.
A migration preventing solution is applied as an inverted conductive pattern by an inkjet method on a substrate based on image data of an inverted conductive pattern obtained by inverting the conductive pattern of an electronic circuit board. The above-mentioned problem is solved by a method for manufacturing an electronic circuit board, wherein the conductive pattern is formed by applying a metal colloid solution as a conductive pattern by the inkjet method based on pattern image data. .
[Selection] Figure 1

Description

  The present invention relates to a method for manufacturing an electronic circuit board, and more particularly to a method for manufacturing an electronic circuit board for forming wiring of the electronic circuit board.

  Conventionally, a method for forming a pattern of a wiring portion (conductor portion) of an electronic circuit board (printed wiring board) is roughly classified into a subtractive method, a semi-additive method, and an additive method.

  The subtractive method is a method in which an unnecessary portion of a metal layer formed on a base material is removed and a necessary portion is left to form a pattern of a conductor portion (wiring pattern). On the other hand, a semi-additive method and an additive method are used. Is a method of forming a pattern of a conductor portion on a substrate.

In any of the above methods, the pattern of the conductor portion is formed using photolithography technology.
Here, the subtractive method, the semi-additive method, and the additive method will be described with reference to FIGS.
4 to 6 schematically show cross-sectional views of the printed wiring board.

4A to 4F show a method for forming a pattern of a conductor portion to which the subtractive method is applied.
In the subtractive method, first, as shown in FIG. 4A, a copper foil conductor layer 202 is formed on both surfaces of an insulating base material (insulating layer) 200 to form a copper-clad laminate 204, and then As shown in FIG. 4 (b), after forming a through hole (via hole, through hole) 206 in the copper-clad laminate 204, as shown in FIG. 4 (c), by electroless plating or electrolytic plating, A conductive metal layer 208 is formed on the surface of the conductor layer 202 and the inner wall of the through hole 206 to form the through hole 206.
After the through hole 206 is formed, a resist layer 210 is formed on the surface of the conductive metal layer 208 on the conductor layer 202 with a dry film resist (DFR), a liquid resist, or the like. The resist layer 210 is patterned by irradiating with radiation (not shown) and developing.
After the patterning of the resist layer 210, as shown in FIG. 4E, the conductor layer 202 and the conductive metal layer 208 not covered with the resist layer 210 are removed by etching, and then, as shown in FIG. ), The resist layer 210 is removed to form a printed wiring board.

  Next, FIGS. 5A to 5G show a wiring pattern forming method to which the semi-additive method is applied.

In the semi-additive method, first, as shown in FIG. 5B, the through hole 206 is formed in the insulating base material 200 as shown in FIG. 5A, and then as shown in FIG. 5C. In addition, the conductive metal layer 208 is formed on both side surfaces of the insulating substrate 200 and the inner wall of the through hole 206 by electroless plating.
After forming the conductive metal layer 208, a resist layer 210 is formed with a dry film resist (DFR) or a liquid resist, and then the resist layer 210 is irradiated with radiation via a photo tool (not shown), Development is performed to pattern the resist layer 210.
After patterning the resist layer 210, using the conductive metal layer 208 that is not covered with the resist layer 210 as a seed layer, a conductive metal 212 is formed by electrolytic plating as shown in FIG. As shown in FIG. 5 (f), the resist layer 210 is removed. Further, as shown in FIG. 5 (g), the conductive metal layer 208 not covered with the conductive metal 212 is removed, and the printed wiring is removed. Form a plate.

  Next, FIGS. 6A to 6E show a wiring pattern forming method to which the additive method is applied.

In the additive method, first, a through hole 206 is formed in an insulating base material (insulating layer) 200 as shown in FIG. 6A as shown in FIG. 6B, and then a dry film resist (DFR) is formed. ) Or a liquid resist, and, as shown in FIG. 6C, the resist layer 210 is irradiated with radiation through a photo tool (not shown), developed, and patterned. A resist layer 210 is formed.
After forming the resist layer 210, as shown in FIG. 6D, a conductive metal layer 208 is formed on the insulating substrate 200 not covered with the resist layer 210 by an electroless plating method, and through holes are formed. After forming the conductive metal layer 208 on the inner wall 206, the resist layer 210 is finally removed as shown in FIG. 6E to form a printed wiring board.

  However, the method for forming a desired wiring pattern by forming a resist pattern by the photolithography technique as described above requires time for creating a photomask, and for removing unnecessary portions of the wiring metal. In addition to the etching process, a resist exposure and development process for forming a resist pattern is also required. Therefore, it takes time and cost to form a wiring pattern.

Therefore, in recent years, a method for forming a pattern of a wiring portion (conductor portion) of a printed wiring board (electronic circuit board) by using a conductive fine particle dispersed ink method has been proposed.
The conductive fine particle-dispersed ink drawing method forms a wiring pattern by directly patterning a conductive fine particle material on a substrate according to a desired wiring pattern using an ink jet printing method.

Since this conductive fine particle dispersed ink drawing method does not require a mask, the number of manufacturing steps is smaller than a method of forming a resist pattern by photolithography and forming a desired wiring pattern.
However, in order to develop the conductivity of the fine particle material, a long baking process is required at a high temperature, so that the substrate (substrate material) on which the wiring pattern can be formed is limited and the running cost is high. Furthermore, it is inevitable to increase the size of the apparatus for high temperature processing.
In addition, when a wiring pattern is formed of a metal such as silver, aluminum, or copper, a problem due to migration may occur.

Therefore, for example, in Patent Document 1, a metal colloid solution is drawn on a substrate on which a receiving layer is formed, and the metal colloid solution is dried by a low temperature sintering process at room temperature or 100 ° C. or less. A method of forming a wiring is disclosed. The receptor layer used here is composed of a pigment component containing silica fine particles and a binder component, and the metal colloid particles contained in the metal colloid solution reduce the metal compound in the presence of the polymer pigment dispersant. It is disclosed that it is obtained.
The wiring forming method does not require high-temperature treatment or light treatment, and can obtain a conductive coating film at room temperature. Therefore, paper, plastic having low heat resistance, or the like can be used as a substrate. In addition, since the metal colloid solution is applied to the substrate by the ink jet method, an electric circuit can be formed with high accuracy and high speed.

Patent Document 2 discloses a bank corresponding to a wiring pattern in order to solve the problem of disconnection or protrusion (hillock) caused by migration when the wiring pattern is formed of a metal such as silver, aluminum, or copper. Is formed on a substrate, a functional liquid containing silver for forming a wiring pattern is applied to a groove between banks, and a dielectric material is further applied thereon.
Since the above-described wiring forming method deposits droplets in the bank, it is possible to eliminate the waste of the functional liquid containing silver and the dielectric material that form the wiring pattern.

Japanese Patent Laid-Open No. 2004-207558 JP 2004-349640 A

However, when the present inventors tried to form a wiring by the method disclosed in Patent Document 1, this method enables low-temperature sintering and can be applied to a general-purpose resin film having low heat resistance. Although it is an excellent technology in terms, it has been found that when the manufactured electronic circuit board is used under high temperature and high humidity, dendritic migration occurs around the electrode and short-circuits immediately after energization.
Further, as disclosed in Patent Document 1, a metal colloid solution is applied onto a substrate with a receiving layer, and the metal colloid solution is dried at room temperature or low temperature sintering at 100 ° C. or lower for a long time to form a wiring. If formed, moisture may easily remain in the receiving layer, and when this electronic circuit board is used under high temperature and high humidity, dendritic migration occurs around the electrode and short-circuits immediately after the start of energization. I understood that. However, Patent Document 1 neither describes nor suggests the occurrence of migration in the receiving layer.

Here, migration means that if a voltage is applied between the conductors (electrodes) of an electronic circuit board (printed wiring board) that originally has good insulation, and it is placed under high temperature and high humidity, it is electrochemically applied. It means that ions are eluted from the conductor onto or into the insulator, the insulation between the conductors (electrodes) is lowered, and a failure such as insulation deterioration (insulation failure) of the electronic circuit board occurs.
As a phenomenon, the metal of the anode is dissolved and eluted as an ion by an electrochemical reaction, and the metal ion reaches the cathode side, where it enjoys electrons and is reduced and deposited in a dendrite form from the cathode side onto the electrode. This will cause migration.
In addition, as a metal used for a conductor, it is easy to generate | occur | produce migration in order of Ag (silver), Pb (lead), Cu (copper), Sn (tin), and Au (gold). When Ag (silver) is used, the reason why migration is particularly likely to occur is that no non-moving material covering the surface of Ag (silver) is formed, and that it is easily dissolved by the production of silver halide or the like.

  Further, the method disclosed in Patent Document 2 is a photolithography method as a bank forming method. Therefore, even if wiring drawing is performed by an ink jet method, the manufacturing process is not reduced and the cost is increased. There is not much going on. Further, Patent Document 2 regards a problem caused by migration as a disconnection or a protrusion (hillock), and the short circuit problem is unclear.

An object of the present invention is to provide a method for forming a conductive pattern that eliminates the problems based on the conventional technology and has high reliability without sintering at high temperature, that is, can prevent the occurrence of migration. There is.
It is another object of the present invention to provide a method for forming a conductive pattern that can form a high-quality conductive pattern at a low cost with a high conductivity on a wide variety of substrates.

  In order to solve the above-mentioned problems, the present invention provides a reversal conductive pattern obtained by applying an anti-migration solution by an inkjet method based on image data of a reverse conductive pattern obtained by inverting a conductive pattern of an electronic circuit board on a base material. The conductive pattern is formed by applying a metal colloid solution as a conductive pattern by the inkjet method based on the image data of the conductive pattern. Provide a method.

  Moreover, in this invention, it is preferable that the said base material is a base material with a receiving layer in which the porous type receiving layer was formed in the surface.

  In the present invention, the inverted conductive pattern is formed at least from the boundary with the conductive pattern to the outside thereof with a line width capable of providing insulation between the adjacent conductive pattern. It is preferable.

  Moreover, in this invention, after apply | coating the said migration prevention solution, it is preferable to perform the drying process or hardening process of the said migration prevention solution.

  Moreover, in this invention, it is preferable that the said drying process of the said migration prevention solution is a normal temperature standing or 100 degreeC or less heat processing.

  Moreover, in this invention, it is preferable that the said hardening process of the said migration prevention solution is a radiation irradiation process.

  Moreover, in this invention, after apply | coating the said metal colloid solution, it is preferable to perform the dry sintering process of the said metal colloid solution.

  Moreover, in this invention, it is preferable that the said dry sintering process of the said metal colloid solution is normal temperature standing or a heat processing of 100 degrees C or less.

  In the present invention, it is preferable that the migration prevention solution and the metal colloid solution are dried and sintered at room temperature after the migration prevention solution is applied and after the metal colloid prevention solution is applied. .

  In the present invention, after the migration preventing solution is applied, the curing treatment of the migration preventing solution is performed by radiation irradiation treatment, and after the metal colloid solution is applied, the metal colloid solution is dried and sintered. It is preferable to perform at room temperature.

  In the present invention, after the migration preventing solution is applied, the curing treatment of the migration preventing solution is performed by radiation irradiation treatment, and after the metal colloid solution is applied, the metal colloid solution is dried and sintered. The heat treatment is preferably performed at 100 ° C. or lower.

  Moreover, in order to solve the said subject, this invention provides the electronic circuit board produced using the manufacturing method of the said electronic circuit board.

  Moreover, in order to solve the said subject, this invention provides the electromagnetic wave shielding film for PDP produced using the manufacturing method of the said electronic circuit board.

  In the method of manufacturing an electronic circuit board according to the present invention, a receiving layer is provided on a base material, and a conductive pattern can be formed by low-temperature sintering. High and high quality conductive patterns can be formed.

  Below, based on the preferred embodiment shown in an accompanying drawing, the manufacturing method of the electronic circuit board of the present invention is explained in detail.

  FIG. 1 is a diagram conceptually illustrating an embodiment of a method for manufacturing an electronic circuit board according to the present invention.

First, the receiving layer 12 is formed on the surface of the substrate 10. The base material 10 and the receiving layer 12 will be described in detail later.
As a method for forming the receiving layer 12, as shown in FIG. 1A, the receiving layer is formed on both surfaces of the substrate 10. In FIG. 1A, the receiving layers 12 are provided on both surfaces of the base material 10, but the present invention is not limited to this, and only one surface may be applied. A method for forming the receiving layer 12 will be described in more detail later.

Next, as shown in FIG. 1B, the migration preventing solution is ejected and applied in a reverse conductive pattern to the receiving layer 10 and the surface of the receiving layer 10 by an inkjet method. As a result, migration resistance can be obtained between desired conductive patterns even under high temperature and high humidity.
Here, if the migration preventing solution is applied by the ink jet method, the metal colloid solution is applied by the ink jet method also in the post-process, so the two steps can be performed in the same apparatus. Accordingly, it is possible to reduce the size of the coating apparatus, and to reduce facilities and processes as compared with the manufacture of an electronic circuit board by photolithography. Further, since the number of steps can be reduced, the entire process time can be shortened, which is preferable from the viewpoint of productivity.
The migration preventing solution is not particularly limited as long as it can be applied, that is, can be ejected by an ink jet method, does not attack the metal colloid solution, can be solidified after application, and has an insulating property.

Therefore, as the migration preventing solution, a solution obtained by dissolving an insulating resin in a solvent may be used, or a thermosetting resin, a photocurable resin, or a resin fine particle dispersion may be used.
From the viewpoint of simplicity of the curing process, the migration prevention solution has at least one functional group and performs ion polymerization or radical polymerization with ions or radicals generated by applying heat to the thermal polymerization initiator. , Monomers and oligomers that form a crosslinked structure by ion polymerization or radical polymerization using ions or radicals generated by irradiating light to the photopolymerization initiator. It is preferable to use a photocurable resin comprising
Examples of the insulating resin include polymer materials such as novolac resin, acrylic resin, polyimide resin, olefin resin, phenol resin, melamine resin, and epoxy resin.

  Moreover, the same effect can be acquired also by the coating using a polysilane type compound as a migration prevention solution. Specifically, polymethylphenylsilane is dissolved in an organic solvent, and the receiving layer 12 is coated and impregnated by an ink jet method, and then irradiated with energy rays such as ultraviolet rays to form silanol, forming a siloxane bond and gelling. Curing and filling the porosity of the receiving layer 12

  Further, as the migration preventing solution, a solution in which a water repellent polymer compound such as a monomer, oligomer, or polymer having a fluorine atom in the molecule is dissolved in a solvent can also be used. Examples of the water-repellent polymer compound include polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer, hexafluoropropylene-tetrafluoroethylene copolymer, polyvinylidene fluoride, and long-chain perfluoroalkyl structure. Examples thereof include ethylene, acrylate, methacrylate, vinyl, urethane, and silicone-based polymer.

As the migration-preventing solution, a solvent-soluble fluororesin is particularly preferable, and commercially available products include Cytop from Asahi Glass Co., Ltd., and INT-340VC from NI Material Co., Ltd. It is desirable to dilute and use it according to the discharge suitability.
Further, as the migration preventing solution, a solvent-soluble cycloolefin resin is also preferable, and as a commercially available product, Arton manufactured by JSR, TOPAS manufactured by Polyplastics, etc. are preferably exemplified.
Further, a solvent-soluble silicone resin can also be preferably used as the migration preventing solution.
Examples of the solvent include cyclohexane and the like.

The reverse conductive pattern to which the migration preventing solution is applied is preferably formed at least from the boundary of the conductive pattern to the outside in a range that provides insulation between the conductive pattern and the adjacent conductive pattern. This is because only the minimum necessary area is applied from the conductive pattern, so that the migration solution need not be applied wastefully.
Normally, in the conductor width / conductor interval width (L / S) dense region of the electronic circuit board, the conductor width (L) and the conductor interval width (S) are equal to each other. Thus, migration resistance can be ensured.
By applying the migration preventing solution to the receiving layer 10 and the surface of the receiving layer 10, the migration preventing treatment part 14 a having a reverse conductive pattern shape can be formed.

Next, a drying process or a curing process is performed on the migration prevention processing unit 14a as necessary depending on the type of the prevention solution. The migration prevention processing unit 14b in FIG. 1C shows the one after the drying process or the curing process.
Examples of the drying process and the curing process include standing at normal temperature, heat drying, UV exposure, and the like. In the case where a migration preventing solution that does not require UV exposure is used, no particular treatment is required. This is because the receiving layer 12 absorbs the migration preventing solution and thus does not affect the application in the next step.

Moreover, it is preferable to use radiation irradiation among the said hardening methods as a hardening process of a migration prevention solution. If radiation irradiation is used as the curing process, the migration prevention solution will immediately cure without bleeding into the metal colloid solution region, and the boundary with the metal colloid solution that forms the conductive pattern will become clearer. This is because it can be made possible.
When the migration preventing solution is a photo-curable resin and uses radiation (especially UV) irradiation, it is preferable to mount a UV irradiation light source on the solution discharge head of the ink jet apparatus. This is because UV irradiation can be performed at the same time that the migration preventing solution is ejected, so that the application in the next step is not affected.
The migration prevention processing unit 14b formed by the above process prevents the extraction of moisture in the receiving layer 12 and prevents the occurrence of migration.

Next, as shown in FIG. 1 (d), a conductive metal portion 16 a is formed on the receiving layer 12.
A method for forming the conductive metal portion 16a is not particularly limited, but the metal colloid solution is formed by discharging and drawing by the ink jet method based on the image data of the conductive pattern.
As the inkjet method, any of a thermal method, a piezo method, and an electrostatic type can be used, and among them, the piezo method is preferable. In the case of the thermal type, it is preferable to use a metal colloid solution containing an aqueous medium. In the case of the electrostatic type, it is necessary to charge the metal colloid particles of the metal colloid solution by coating with a resin.
The conductive metal portion 16a will be described in detail later.

Next, the applied metal colloid solution (conductive metal portion 16a) is subjected to a dry sintering process as necessary. The migration prevention processing part 14b in FIG.1 (e) shows the thing after the dry sintering process of the metal colloid solution (conductive metal part 16a).
The drying method is not particularly limited, and any drying method such as drying at room temperature, drying by heating, and sintering drying may be selected depending on the composition of the metal colloid solution.

Here, if the dry sintering treatment of the metal colloid solution is performed by heat drying at 100 ° C. or less, the resistivity of the wiring (conductive) pattern can be further reduced.
In addition, if both the migration preventing solution and the metal colloid solution are dried by standing at room temperature and drying by heating at 100 ° C. or less, the metal colloid solution has a low temperature of room temperature and 100 ° C. or less. Conductivity can be expressed by drying by sintering. That is, it is possible to achieve both migration resistance and a low-temperature treatment process. In addition, since a low-temperature treatment process is possible, a low-cost base material can be used.

As a specific example of the drying method, when the metal colloid solution has a high solvent boiling point, it takes several hours to dry the solvent, and therefore, forced drying may be performed by a method such as warm air drying or heat transfer drying. As the forced drying, heat transfer drying using a hot plate or drying using a thermostatic bath is preferable to hot air drying from the viewpoint of thermal efficiency. Further, the forced drying temperature is preferably not higher than the heat resistance temperature of the base material with a receiving layer and is as high as possible from the viewpoint of reducing resistance.
By the above method, the electronic circuit board according to the present invention can be manufactured.

  In addition, as shown in FIG.1 (f), you may form the plating coating part 18 by performing a plating process for the purpose of oxidation prevention, electronic component mounting, etc. as shown in FIG.1 (f).

  If necessary, as shown in FIG. 1 (g), the conductive metal portion 16b is treated with a solder resist 20 for the purpose of protecting the conductive pattern, preventing oxidation, and preventing short circuit due to contact with other metal members. May be applied.

  In the said embodiment, although the base material with a receiving layer was utilized, this invention is not limited to this, The base material without a receiving layer can also be utilized.

In the above embodiment, an electronic circuit board is manufactured. However, the present invention is not limited to this, and an electromagnetic wave shielding film for PDP that requires transparency and an electromagnetic wave shielding function (conductive effect) is produced by the wiring forming method of the present invention. You can also.
In addition, it is preferable that the surface resistance value of the electromagnetic wave shielding film for PDP (conductive metal part) formed by the present invention is 10Ω / □ or less, and further, when used as a light-transmitting electromagnetic wave shielding material for PDP. Is 2.5Ω / □ or less, and preferably 1.5Ω / □ or less, more preferably 0.5Ω / □ or less when used for a consumer plasma television using a PDP. .

  Moreover, when using for the electromagnetic wave shielding film for PDP, it is preferable that the line width of an electroconductive metal part is 20 micrometers or less, and it is preferable that a line space | interval is 50 micrometers or more. The conductive metal portion may have a portion whose line width is wider than 20 μm for the purpose of ground connection or the like. Further, from the viewpoint of making the image inconspicuous, the line width of the conductive metal portion is preferably less than 15 μm, more preferably less than 10 μm, and most preferably less than 7 μm.

  Moreover, when used for the electromagnetic wave shielding film for PDP, the conductive metal part preferably has an aperture ratio of 85% or more, more preferably 90% or more, and 95% from the viewpoint of visible light transmittance. The above is most preferable. Further, the “aperture ratio” is a ratio of a portion having no fine line forming the mesh to the whole. For example, the aperture ratio of a square lattice mesh having a line width of 10 μm and a pitch of 200 μm is 90%. In addition, although there is no restriction | limiting of an upper limit in particular regarding the aperture ratio of the metal silver part in this invention, As said aperture ratio, it is preferable that it is 98% or less from the relationship between a surface resistance value and a line width value.

  Moreover, when using for the electromagnetic wave shielding film for PDP, since the viewing angle of a display spreads so that the thickness of an electroconductive metal part is a use as the electromagnetic wave shielding material of a display, it is preferable. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and more preferably 0.1 μm or more. More preferably, it is less than 3 μm.

  Here, materials for forming the base material 10, the receiving layer 12, and the conductive metal portion 16 used in the present invention will be described in detail below.

Although there is no limitation in particular about the base material 10 used for this invention, a plastic film, a plastic plate, a glass plate etc. can be used, As a raw material of a plastic film and a plastic plate, a polyimide (PI), polyethylene is mentioned, for example. Polyesters such as terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene and EVA; vinyl resins such as polyvinyl chloride and polyvinylidene chloride; Uses polyetheretherketone (PEEK), polysulfone (PSF), polyethersulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetylcellulose (TAC), etc. Rukoto can.
The plastic film and plastic plate in the present invention can be used as a single layer, but can also be used as a multilayer film in which two or more layers are combined.
Moreover, what insulated the surface of metal base materials, such as aluminum, can also be used.

  In addition, when using for the electromagnetic wave shielding film for displays, such as PDP (plasma display panel), since transparency is requested | required, it is desirable that the transparency of a base material is high. In this case, the total visible light transmittance of the plastic film or plastic plate is preferably 70 to 100%, more preferably 85 to 100%, and particularly preferably 90 to 100%. Further, as the plastic film and the plastic plate, those colored so as not to interfere with the required transparency can be used.

  The receiving layer 12 used in the present invention is a porous receiving layer containing a cation-modified self-emulsifying polymer, inorganic fine particles, polyvinyl alcohol having a saponification degree of 92 to 98 mol%, a water-soluble aluminum compound, a zirconium compound, and a crosslinking agent. is there.

<Cation-modified self-emulsifying polymer>
The receiving layer 12 of the present invention contains “cation-modified self-emulsifying polymer”. This “cation-modified self-emulsifying polymer” means a highly stable emulsified dispersion that can be naturally stabilized in an aqueous dispersion medium without using an emulsifier or a surfactant, or even if used in a very small amount. Means a molecular compound. Quantitatively, the “cation-modified self-emulsifying polymer” means a polymer substance having stable emulsification and dispersion at a concentration of 0.5% by mass or more with respect to the aqueous dispersion medium at room temperature of 25 ° C. The concentration is preferably 1% by mass or more, and more preferably 3% by mass or more.

  More specifically, the “cation-modified self-emulsifying polymer” of the present invention is, for example, a polyaddition system or polycondensation having a cationic group such as a primary to tertiary amino group or a quaternary ammonium group. Based polymer compounds.

  Examples of the vinyl polymer that is effective as the polymer include polymers obtained by polymerizing the following vinyl monomers. That is, acrylic acid esters and methacrylic acid esters (the ester group is an alkyl group or aryl group which may have a substituent, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n- Butyl group, sec-butyl group, tert-butyl group, hexyl group, 2-ethylhexyl group, tert-octyl group, 2-chloroethyl group, cyanoethyl group, 2-acetoxyethyl group, tetrahydrofurfuryl group, 5-hydroxypentyl group Cyclohexyl group, benzyl group, hydroxyethyl group, 3-methoxybutyl group, 2- (2-methoxyethoxy) ethyl group, 2,2,2-tetrafluoroethyl group, 1H, 1H, 2H, 2H-perfluorodecyl Group, phenyl group, 2,4,5-tetramethylphenyl group, 4-chlorophenyl group, etc.);

  Vinyl esters, specifically, aliphatic carboxylic acid vinyl esters which may have a substituent (for example, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl isobutyrate, vinyl caproate, vinyl Chloroacetate, etc.), optionally substituted aromatic carboxylic acid vinyl ester (for example, vinyl benzoate, vinyl 4-methylbenzoate, vinyl salicylate, etc.);

  Acrylamides, specifically, acrylamide, N-monosubstituted acrylamide, N-disubstituted acrylamide (the substituent is an alkyl group, aryl group, silyl group which may have a substituent, such as a methyl group, n-propyl group, isopropyl group, n-butyl group, tert-butyl group, tert-octyl group, cyclohexyl group, benzyl group, hydroxymethyl group, alkoxymethyl group, phenyl group, 2,4,5-tetramethylphenyl group , 4-chlorophenyl group, trimethylsilyl, etc.);

  Methacrylamide, specifically, methacrylamide, N-monosubstituted methacrylamide, N-disubstituted methacrylamide (substituents are optionally substituted alkyl, aryl, silyl groups, for example , Methyl group, n-propyl group, isopropyl group, n-butyl group, tert-butyl group, tert-octyl group, cyclohexyl group, benzyl group, hydroxymethyl group, alkoxymethyl group, phenyl group, 2,4,5- Tetramethylphenyl group, 4-chlorophenyl group, trimethylsilyl, etc.);

  Olefins (for example, ethylene, propylene, 1-pentene, vinyl chloride, vinylidene chloride, isoprene, chloroprene, butadiene, etc.), styrenes (for example, styrene, methylstyrene, isopropylstyrene, methoxystyrene, acetoxystyrene, chlorostyrene, etc.) Vinyl ethers (for example, methyl vinyl ether, butyl vinyl ether, hexyl vinyl ether, methoxyethyl vinyl ether, etc.);

  Other vinyl monomers include crotonic acid ester, itaconic acid ester, maleic acid diester, fumaric acid diester, methyl vinyl ketone, phenyl vinyl ketone, methoxyethyl vinyl ketone, N-vinyl oxazolidone, N-vinyl pyrrolidone, methylene malon nitrile, diphenyl Examples include 2-acryloyloxyethyl phosphate, diphenyl-2-methacryloyloxyethyl phosphate, dibutyl-2-acryloyloxyethyl phosphate, dioctyl-2-methacryloyloxyethyl phosphate, and the like.

  Examples of the monomer having a cationic group include monomers having a tertiary amino group such as dialkylaminoethyl methacrylate and dialkylaminoethyl acrylate.

Examples of the polyurethane applicable to the cationically modified self-emulsifying polymer include, for example, polyurethanes synthesized by polyaddition reaction using various combinations of the following diol compounds and diisocyanate compounds.
Specific examples of the diol compound include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 2,3-butanediol, 2,2 -Dimethyl-1,3-propanediol, 1,2-pentanediol, 1,4-pentanediol, 1,5-pentanediol, 2,4-pentanediol, 3,3-dimethyl-1,2-butanediol, 2 -Ethyl-2-methyl-1,3-propanediol, 1,2-hexanediol, 1,5-hexanediol, 1,6-hexanediol, 2,5-hexanediol, 2-methyl-2,4-pentanediol 2,2-diethyl-1,3-propanediol, 2,4-dimethyl-2,4-pentanediol, 1,7-heptane All, 2-methyl-2-propyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2-ethyl-1,3-hexanediol, 1,2-octanediol, 1, 8-octanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,4-cyclohexanedimethanol, hydroquinone, diethylene glycol, triethylene glycol, dipropylene glycol, tripropylene glycol, polyethylene glycol (average molecular weight = 200,300,400,600,1000,1500,4000), polypropylene glycol (average molecular weight = 200,400,1000), polyester polyol, 4,4′-dihydroxy-diphenyl-2,2-propane, 4,4 ′ -Dihydroxyphenyls Luhon etc. are mentioned.

  Examples of the diisocyanate compound include methylene diisocyanate, ethylene diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-xylylene diisocyanate, 1, 5-naphthalene diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, 3,3′-dimethyl-4,4′-diphenylmethane diisocyanate, 3,3′-dimethylbiphenylene diisocyanate, 4,4′-biphenylene diisocyanate, dicyclohexylmethane diisocyanate , Methylenebis (4-cyclohexylisocyanate) and the like.

Examples of the cationic group contained in the polyurethane having a cationic group include cationic groups such as primary to tertiary amines and quaternary ammonium salts. The cationically modified self-emulsifying polymer used in the present invention is preferably a urethane resin having a cationic group such as a tertiary amine and a quaternary ammonium salt.
The cationic group-containing polyurethane can be obtained, for example, by using a product obtained by introducing a cationic group into a diol as described above during the synthesis of polyurethane. In the case of a quaternary ammonium salt, a polyurethane containing a tertiary amino group may be quaternized with a quaternizing agent.

  The diol compound and diisocyanate compound that can be used for the synthesis of the polyurethane may be used alone or in various ways (for example, adjustment of the glass transition temperature (Tg) of the polymer and improvement of solubility, Depending on the compatibility with the colloidal metal solution, the improvement of the stability of the dispersion, etc., two or more of them can be used in an arbitrary ratio.

Furthermore, examples of the polyester applicable to the cation-modified self-emulsifying polymer include polyesters synthesized by polycondensation reaction using various combinations of the following diol compounds and dicarboxylic acid compounds.
Examples of the dicarboxylic acid compound include oxalic acid, malonic acid, succinic acid, glutaric acid, dimethylmalonic acid, adipic acid, pimelic acid, α, α-dimethylsuccinic acid, acetone dicarboxylic acid, sebacic acid, 1,9-nonanedicarboxylic acid. Acid, fumaric acid, maleic acid, itaconic acid, citraconic acid, phthalic acid, isophthalic acid, terephthalic acid, 2-butyl terephthalic acid, tetrachloroterephthalic acid, acetylenedicarboxylic acid, poly (ethylene terephthalate) dicarboxylic acid, 1,2- Examples include cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, ω-poly (ethylene oxide) dicarboxylic acid, and p-xylylene dicarboxylic acid.

  When performing the polycondensation reaction with the diol compound, the dicarboxylic acid compound may be used in the form of an alkyl ester of dicarboxylic acid (for example, dimethyl ester) and an acid chloride of dicarboxylic acid, or may be maleic anhydride, anhydrous You may use in the form of an acid anhydride like succinic acid and phthalic anhydride.

  As the diol compound, the same compounds as the diols exemplified in the polyurethane can be used.

  The polyester having a cationic group can be obtained by synthesis using a dicarboxylic acid compound having a cationic group such as a primary, secondary, tertiary amine or quaternary ammonium salt.

  The diol compounds, dicarboxylic acids, and hydroxycarboxylic ester compounds used in the synthesis of the polyester may be used alone or for various purposes (for example, adjustment of the glass transition temperature (Tg) of the polymer). Or two or more of them can be used in admixture at any ratio depending on the solubility of the metal colloidal solution and the stability of the dispersion.

  The content of the cationic group in the cation-modified self-emulsifying polymer is preferably 0.1 to 5 mmol / g, and more preferably 0.2 to 3 mmol / g. In addition, when there is too little content of the said cationic group, the dispersion stability of a polymer will become small, and when too large, compatibility with a binder will fall.

  As the cation-modified self-emulsifying polymer, a polymer having a cationic group such as a tertiary amino group or a quaternary ammonium base is preferable, and in particular, a urethane resin (polyurethane) having a cationic group as described above. Most preferred.

  When the self-emulsifying polymer is used for the receiving layer 12, the glass transition temperature is particularly important. In order to suppress the bleeding of the conductive pattern over time after the conductive pattern is formed by the inkjet method, it is preferable that the self-emulsifiable polymer has a glass transition temperature of less than 50 ° C. Further, the self-emulsifiable polymer having a glass transition temperature of 30 ° C. or lower is more preferable, and a glass transition temperature of 15 ° C. or lower is most preferable. When the glass transition temperature is 50 ° C. or higher, dimensional stability (curl) may be deteriorated. In addition, although there is no restriction | limiting in particular in the minimum of this glass transition temperature, in normal use, it is about -30 degreeC, and if lower than this, the manufacturability at the time of preparing an aqueous dispersion may fall.

  The mass average molecular weight (Mw) of the self-emulsifying polymer is usually preferably 1000 to 200000, more preferably 2000 to 50000. If the molecular weight is less than 1000, it tends to be difficult to obtain a stable aqueous dispersion. If the molecular weight exceeds 200000, the solubility becomes poor and the liquid viscosity increases, and the average particle size of the aqueous dispersion increases. There is a tendency that it is difficult to control the diameter, in particular, to 0.05 μm or less.

  In the receiving layer 12 of the present invention, the content of the self-emulsifying polymer is preferably from 0.1 to 30% by mass, more preferably from 0.3 to 20% by mass, based on the total solids constituting the receiving layer 12. In particular, 0.5 to 15% by mass is most preferable. When the content is less than 0.1% by mass, the effect of improving bleeding over time tends to be insufficient. On the other hand, when the content exceeds 30% by mass, binder components such as inorganic fine particles and polyvinyl alcohol are used. , The solvent absorbability of the ink (metal colloid solution) into the receiving layer 12 tends to decrease.

Next, a method for preparing an aqueous dispersion of the self-emulsifiable polymer will be described.
The above self-emulsifiable polymer is mixed with an aqueous solvent, an additive is mixed as necessary, and the mixture is finely granulated using a disperser, whereby water having an average particle size of 0.05 μm or less is mixed. A dispersion can be obtained. Dispersers used for obtaining the aqueous dispersion include conventionally known high-speed rotary dispersers, medium stirring dispersers (ball mill, sand mill, bead mill, etc.), ultrasonic dispersers, colloid mill dispersers, high pressure dispersers, and the like. Various dispersers can be used. From the viewpoint of efficiently dispersing the formed fine particles, a medium stirring type disperser, a colloid mill disperser, or a high pressure disperser is preferable.

  The high-pressure disperser (homogenizer) is described in detail in US Pat. No. 4,533,254, JP-A-6-47264, etc., but as a commercially available apparatus, a Gorin homogenizer (APV GAULIN) is used. INC.), A microfluidizer (MICROFLUIDEX INC.), An optimizer (Sugino Machine Co., Ltd.) and the like can be used. In recent years, a high-pressure homogenizer having a mechanism for atomizing in an ultrahigh-pressure jet stream as described in US Pat. No. 5,720,551 is particularly effective for emulsification dispersion of the present invention. DeBEE2000 (BEE INTERNIONAL LTD.) Is an example of an emulsifying apparatus using this ultra-high pressure jet stream.

  Water, an organic solvent, or a mixed solvent thereof can be used as the aqueous solvent in the dispersion step. Examples of the organic solvent that can be used for the dispersion include alcohols such as methanol, ethanol, n-propanol, i-propanol, and methoxypropanol, ketones such as acetone and methyl ethyl ketone, tetrahydrofuran, acetonitrile, ethyl acetate, and toluene. It is done.

  The self-emulsifiable polymer of the present invention can be a naturally stable emulsion dispersion itself, but a small amount of a dispersing agent (surfactant) in order to make the emulsion dispersion more quickly or more stable. May be used. Surfactants used for such purposes include, for example, fatty acid salts, alkyl sulfate esters, alkylbenzene sulfonates, alkyl naphthalene sulfonates, dialkyl sulfosuccinates, alkyl phosphate esters, naphthalene sulfonate formalin condensates. , Anionic surfactants such as polyoxyethylene alkyl sulfates, polyoxyethylene alkyl ethers, polyoxyethylene alkyl allyl ethers, polyoxyethylene fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene Nonionic surfactants such as alkylamines, glycerin fatty acid esters and oxyethyleneoxypropylene block copolymers are preferred. Further, SURFYNOLS (Air Products & Chemicals), which is an acetylene-based polyoxyethylene oxide surfactant, is also preferably used. An amine oxide type amphoteric surfactant such as N, N-dimethyl-N-alkylamine oxide is also preferred. Further, JP-A-59-157,636, pages (37) to (38), Research Disclosure No. Those listed as surfactants described in 308119 (1989) can also be used.

  In order to stabilize immediately after emulsification, a water-soluble polymer can be added in combination with the surfactant. As the water-soluble polymer, polyvinyl alcohol, polyvinyl pyrrolidone, polyethylene oxide, polyacrylic acid, polyacrylamide or a copolymer thereof is preferably used. It is also preferable to use natural water-soluble polymers such as polysaccharides, casein, and gelatin.

  When the self-emulsifying polymer is dispersed in an aqueous medium by the emulsification dispersion method, it is particularly important to control the particle size. In order to increase the metal colloid purity and metal colloid concentration when the conductive pattern is formed by inkjet, it is necessary to reduce the average particle size of the self-emulsifiable polymer in the aqueous dispersion. Specifically, in the receiving layer 12 of the present invention, the volume average particle size of the self-emulsifying polymer is preferably 0.05 μm or less, and the average particle size is more preferably 0.04 μm or less. 0.03 μm or less is more preferable.

<Inorganic fine particles>
The receiving layer 12 according to the present invention contains inorganic fine particles.
Examples of the inorganic fine particles include silica fine particles, colloidal silica, titanium dioxide, barium sulfate, calcium silicate, zeolite, kaolinite, halloysite, mica, talc, calcium carbonate, magnesium carbonate, calcium sulfate, boehmite, pseudoboehmite and the like. be able to. Among these, silica fine particles are preferable.

  Since the silica fine particles have a particularly large specific surface area, the solvent absorbability and retention efficiency of the ink (metal colloid solution) is high, and the refractive index is low. There is an advantage that transparency can be imparted. That the receiving layer 12 is transparent in this way is important when transparency is required, such as an electromagnetic wave shielding film for PDP.

The average primary particle size of the inorganic fine particles is preferably 20 nm or less, more preferably 15 nm or less, and particularly preferably 10 nm or less. When the average primary particle diameter is 20 nm or less, the solvent absorption characteristics of the ink (metal colloid solution) can be effectively improved, and at the same time, the smoothness of the surface of the receiving layer 12 can be improved.
The specific surface area by BET method of the inorganic fine particles 200 meters ² / g or more is preferable, 250 meters ² / g or more and more preferably, 380 m ² / g or more is particularly preferable. When the specific surface area of the inorganic fine particles is 200 or more m ² / g, the transparency of the receiving layer 12 can be kept high.

  The BET method referred to in the present invention is one of powder surface area measurement methods by vapor phase adsorption, and is a method for determining the total surface area, that is, the specific surface area of a 1 g sample from the adsorption isotherm. Usually, nitrogen gas is often used as the adsorbed gas, and the method of measuring the adsorption amount from the change in pressure or volume of the gas to be adsorbed is most often used. The most prominent expression for expressing the isotherm of multimolecular adsorption is the Brunauer, Emmett, and Teller equation, called the BET equation, which is widely used for determining the surface area. The adsorption amount is obtained based on the BET equation, and the surface area is obtained by multiplying the area occupied by one adsorbed molecule on the surface.

  In particular, the silica fine particle has a silanol group on the surface thereof, and the particles are likely to adhere to each other due to the hydrogen bond of the silanol group, and because of the adhesion effect between the particles via the silanol group and the water-soluble resin, When the average primary particle diameter is 20 nm or less, the porosity of the receiving layer 12 is large and a highly transparent structure can be formed, effectively improving the solvent absorption characteristics of the ink (metal colloid solution). be able to.

  Generally, silica fine particles are roughly classified into wet method particles and dry method (gas phase method) particles depending on the production method. In the above wet method, a method is mainly used in which activated silica is produced by acid decomposition of a silicate, and this is appropriately polymerized and agglomerated and precipitated to obtain hydrous silica. On the other hand, the gas phase method is a method by high-temperature gas phase hydrolysis of silicon halide (flame hydrolysis method), a method in which silica sand and coke are heated and reduced by an arc in an electric furnace and oxidized with air. The method of obtaining anhydrous silica by the (arc method) is the mainstream, and the “gas phase method silica” refers to anhydrous silica fine particles obtained by the gas phase method.

Vapor phase method silica is different from the above hydrous silica in the density of silanol groups on the surface, the presence or absence of vacancies, etc., and shows different properties, but is suitable for forming a three-dimensional structure with high porosity. The reason for this is not clear, but in the case of hydrous silica, the density of silanol groups on the surface of the fine particles is as high as 5 to 8 / nm ^2, and the silica fine particles tend to agglomerate closely (aggregate). In the case of the method silica, the density of silanol groups on the surface of the fine particles is as small as ² to 3 / nm ² , so that it becomes sparse soft agglomeration (flocculate), and as a result, it is estimated that the structure has a high porosity. The
In the present invention, vapor phase silica fine particles (anhydrous silica) obtained by the dry method are preferable, and silica fine particles having a density of 2 to 3 silanol groups / nm ² on the surface of the fine particles are more preferable.
The inorganic fine particles most preferably used in the present invention are vapor phase silica having a specific surface area of 200 m ² / g or more by the BET method.

<Polyvinyl alcohol>
The polyvinyl alcohol used in the present invention has a saponification degree of 92 to 98 mol% (hereinafter sometimes referred to as “polyvinyl alcohol of the present invention”). When the saponification degree of polyvinyl alcohol is lower than 92 mol%, the viscosity of the coating liquid (functional liquid containing the receiving layer material) is high and the coating stability is lowered. On the other hand, if it exceeds 98 mol%, the solvent absorbability of the ink (metal colloid solution) is lowered, which is not preferable. More preferably, it is 93-97 mol%.
1500-3600 are preferable and, as for the polymerization degree of the polyvinyl alcohol of this invention, More preferably, it is 2000-3500. If the degree of polymerization is less than 1500, the receiving layer 12 cracks. If it is larger than 4000, the viscosity of the coating liquid (functional liquid containing the receiving layer material) is not preferable.

In this invention, water-soluble resins other than the polyvinyl alcohol of this invention can also be used together with this polyvinyl alcohol. Examples of water-soluble resins that can be used in combination include resins having a hydroxyl group as a hydrophilic structural unit, such as polyvinyl alcohol (PVA) having a saponification degree other than the above range, cation-modified polyvinyl alcohol, anion-modified polyvinyl alcohol, and silanol-modified polyvinyl. Alcohol, polyvinyl acetal, cellulose resin [methyl cellulose (MC), ethyl cellulose (EC), hydroxyethyl cellulose (HEC), carboxymethyl cellulose (CMC), hydroxypropyl cellulose (HPC), etc.], chitins, chitosans, starch; hydrophilic Polyethylene oxide (PEO), polypropylene oxide (PPO), polyethylene glycol (PEG), polyvinyl ether (PVE) A resin having an amide group or amide bond of a hydrophilic, polyacrylamide (PAAM), polyvinyl pyrrolidone (PVP) and the like. In addition, polyacrylic acid salts, maleic acid resins, alginic acid salts, gelatins and the like having a carboxyl group as a dissociable group can also be mentioned.
The ratio of the polyvinyl alcohol of the present invention to the total amount of the polyvinyl alcohol of the present invention and the water-soluble resin when the polyvinyl alcohol of the present invention and the above-described water-soluble resin are used in combination is preferably 1 to 30% by mass, 20 mass% is further more preferable and 6-12 mass% is especially preferable.

  As the content of the polyvinyl alcohol of the present invention, it is possible to prevent a decrease in film strength and cracking during drying due to an insufficient content, and the excessive content causes the voids to be easily blocked by a resin. From the viewpoint of preventing the solvent absorbability of the ink (metal colloid solution) from decreasing due to the decrease in the porosity, the content is preferably 9 to 40% by mass with respect to the total solid mass of the receiving layer 12, 33 mass% is more preferable.

Polyvinyl alcohol has a hydroxyl group in its structural unit, and this hydroxyl group and the silanol group on the surface of the silica fine particle form a hydrogen bond, and it is easy to form a three-dimensional network structure in which the secondary particle of the silica fine particle is a chain unit. To do. It is considered that the receiving layer 12 having a porous structure with a high porosity can be formed by forming such a three-dimensional network structure.
In the ink jet recording medium (substrate with receiving layer), the porous receiving layer 12 obtained as described above rapidly absorbs the solvent of the ink (metal colloid solution) by capillary action, and the ink (metal colloid solution). ) It is possible to form dots with good roundness without bleeding.

<Content ratio of inorganic fine particles and polyvinyl alcohol of the present invention>
Content ratio of inorganic fine particles (preferably silica fine particles; x) and polyvinyl alcohol of the present invention (total amount of the polyvinyl alcohol of the present invention and the water-soluble resin when the water-soluble resin is used in combination) (y) [ The PB ratio (x / y) and the mass of the inorganic fine particles with respect to 1 part by mass of the polyvinyl alcohol of the present invention] have a great influence on the film structure of the receptor layer 12. That is, as the PB ratio increases, the porosity, pore volume, and surface area (per unit mass) increase. Specifically, as the PB ratio (x / y), a decrease in film strength and cracking during drying caused by the PB ratio being too large are prevented, and the PB ratio is too small. From the viewpoint of preventing the voids from being easily blocked by the resin and preventing the solvent absorbability of the ink (metal colloid solution) from decreasing due to a decrease in the porosity, 1.5 / 1 to 10/1 is preferable.

  When passing through the transport system of the ink jet printer, stress may be applied to the ink jet recording medium (base material with a receiving layer), so the receiving layer 12 needs to have sufficient film strength. Further, when the sheet is cut into a sheet shape, the receptor layer 12 needs to have sufficient film strength in order to prevent cracking and peeling of the receptor layer 12. From such a viewpoint, the PB ratio (x / y) is preferably 5/1 or less, and from the viewpoint of ensuring the solvent absorbability of the high-speed ink (metal colloid solution) with an inkjet printer, it is 2/1 or more. Preferably there is.

For example, a coating solution (receiving layer material) in which anhydrous silica fine particles having an average primary particle size of 20 nm or less and the polyvinyl alcohol of the present invention are completely dispersed in an aqueous solution with a PB ratio (x / y) of 2/1 to 5/1. When the receptor layer 12 is dried, a three-dimensional network structure is formed in which the silica fine particle secondary particles are chain units, and the average pore diameter is 30 nm or less. A translucent porous film having a rate of 50% to 80%, a pore specific volume of 0.5 ml / g or more, and a specific surface area of 100 m ² / g or more can be easily formed.

<Crosslinking agent>
The receiving layer 12 according to the present invention contains a crosslinking agent. The receiving layer 12 according to the present invention is preferably a porous layer cured by a crosslinking reaction of the polyvinyl alcohol of the present invention and a water-soluble resin used as necessary by the crosslinking agent.

As the crosslinking agent, a suitable one may be appropriately selected in relation to the polyvinyl alcohol of the present invention contained in the receiving layer 12 and the water-soluble resin used as necessary, and among them, the crosslinking reaction is rapid. boron compounds are preferable in a point, for example, borax, boric acid, borates (eg, _{orthoborate, InBO 3, ScBO 3, YBO} 3, LaBO 3, Mg 3 (BO 3) 2, Co 3 (BO 3 ) ₂ , diborate (eg, Mg ₂ B ₂ O ₅ , Co ₂ B ₂ O ₅ ), metaborate (eg, LiBO ₂ , Ca (BO ₂ ) ₂ , NaBO ₂ , KBO ₂ ), tetraborate salts _{(e.g., Na 2 B 4 O 7 ·} 10H 2 O), pentaborate _{(e.g., KB 5 O 8 · 4H 2} O, Ca 2 B 6 O 11 · 7H 2 O, CsB 5 O 5) , etc. Among them, the crosslinking reaction can be caused promptly. In view of the above, borax, boric acid and borates are preferable, and boric acid or borates are particularly preferable, and it is most preferable to use them in combination with polyvinyl alcohol which is a water-soluble resin.

  In this invention, it is preferable that 0.05-0.50 mass part is contained with respect to 1.0 mass part of polyvinyl alcohol of this invention, and the said crosslinking agent contains 0.08-0.30 mass part. More preferably. When the content of the crosslinking agent is within the above range, the polyvinyl alcohol of the present invention can be effectively crosslinked to prevent cracks and the like.

When gelatin is used as the water-soluble resin, the following compounds other than boron compounds can also be used as a crosslinking agent.
For example, aldehyde compounds such as formaldehyde, glyoxal, and glutaraldehyde; ketone compounds such as diacetyl and cyclopentanedione; bis (2-chloroethylurea) -2-hydroxy-4,6-dichloro-1,3,5- Active halogen compounds such as triazine and 2,4-dichloro-6-S-triazine sodium salt; divinylsulfonic acid, 1,3-vinylsulfonyl-2-propanol, N, N′-ethylenebis (vinylsulfonylacetamide) ), Active vinyl compounds such as 1,3,5-triacryloyl-hexahydro-S-triazine; N-methylol compounds such as dimethylolurea and methyloldimethylhydantoin; melamine resins (for example, methylolmelamine, alkylated methylolmelamine) ;Epoxy resin;

  Isocyanate compounds such as 1,6-hexamethylene diisocyanate; aziridine compounds described in US Pat. Nos. 3,017,280 and 2,983611; carboximide compounds described in US Pat. No. 3,100,704; glycerol triglycidyl Epoxy compounds such as ether; Ethyleneimino compounds such as 1,6-hexamethylene-N, N′-bisethyleneurea; Halogenated carboxaldehyde compounds such as mucochloric acid and mucophenoxycyclolic acid; 2,3-dihydroxy Dioxane-based compounds such as dioxane; titanium-containing aluminum sulfate, chromium alum, potassium alum, metal-containing compounds such as zirconyl acetate, chromium acetate, polyamine compounds such as tetraethylenepentamine, hydrazide compounds such as adipic acid dihydrazide, A low molecule or polymer containing two or more oxazoline groups. Said crosslinking agent may be used individually by 1 type or in combination of 2 or more types.

<Water-soluble aluminum compound>
The receiving layer 12 according to the present invention contains a water-soluble aluminum compound. The use of a water-soluble aluminum compound can improve the water resistance and aging resistance of the conductive pattern formed. Moreover, the sintering temperature of a conductive pattern can be lowered | hung by using an aluminum hydroxide compound. Although this mechanism is not clear, it is considered that the water-soluble aluminum oxide interacts with the metal colloid particle dispersant, the adsorption equilibrium of the dispersion material to the metal colloid particles is lost, and the dispersant is detached from the particles.
As a water-soluble aluminum compound, for example, as an inorganic salt, aluminum chloride or a hydrate thereof, aluminum sulfate or a hydrate thereof, ammonium alum and the like are known. Furthermore, there is a basic polyaluminum hydroxide compound which is an inorganic aluminum-containing cationic polymer. Among these, a basic polyaluminum hydroxide compound is preferable.

The basic polyaluminum hydroxide compound is represented by the following formula 1, 2 or 3, for example, [Al ₆ (OH) ₁₅ ] ³⁺ , [Al ₈ (OH) ₂₀ ] ⁴⁺ , [ It is a water-soluble polyaluminum hydroxide containing a basic and high-molecular polynuclear condensed ion stably such as Al ₁₃ (OH) ₃₄ ] ⁵⁺ , [Al ₂₁ (OH) ₆₀ ] ³⁺ , and the like.

[Al ₂ (OH) _n Cl _6-n ] _m 5 <m <80, 1 <n <5 Formula 1
[Al (OH) ₃ ] _n AlCl ₃ 1 <n <2 Formula 2
Al _n (OH) _m Cl _(3n-m) 0 <m <3n, 5 <m <8 Formula 3

  These are water treatment agents from Taki Chemical Co., Ltd. under the name of polyaluminum chloride (PAC), from Asada Chemical Co., Ltd. under the name of polyaluminum hydroxide (Paho), and from Riken Green Co., Ltd. It is marketed under the name of Purachem WT by Daimei Chemical Co., Ltd. under the name of Alpha-In 83 and from other manufacturers for the same purpose, and various grades can be easily obtained. In the present invention, these commercially available products can be used as they are, but there are also products having an inappropriately low pH, and in that case, the pH can be appropriately adjusted and used.

  In the receiving layer 12 of the present invention, the content of the water-soluble aluminum compound is preferably from 0.1 to 20% by mass, more preferably from 1 to 15% by mass, and particularly preferably from 2 to 15% by mass of the total solids constituting the receiving layer 12. ˜15% by weight is most preferred. When the content of the water-soluble aluminum compound is in the range of 2 to 15% by mass, the smoothness is improved and the effect of reducing the sintering temperature is obtained.

<Zirconium compound>
The receiving layer 12 according to the present invention contains a zirconium compound. The effect of improving water resistance can be obtained by using a zirconium compound.
The zirconium compound used in the present invention is not particularly limited, and various compounds can be used. For example, zirconyl acetate, zirconium chloride, zirconium oxychloride, zirconium zirconium chloride, zirconium nitrate, basic zirconium carbonate, zirconium hydroxide Zirconium ammonium carbonate, zirconium carbonate / potassium carbonate, zirconium sulfate, zirconium fluoride compound and the like. Zirconyl acetate is particularly preferable.

  In the receiving layer 12 of the present invention, the content of the zirconium compound is preferably 0.05 to 5.0% by mass, more preferably 0.1 to 3.0% by mass, based on the total solid content of the receiving layer 12. Particularly preferred is 0.5 to 2.0% by mass. When the content of the zirconium compound is in the range of 0.5 to 2.0% by mass, the water resistance can be improved without reducing the solvent absorbability of the ink (metal colloid solution).

In the present invention, other water-soluble polyvalent metal compounds other than the water-soluble aluminum compound and zirconium compound described above can be used in combination. Examples of other water-soluble polyvalent metal compounds include water-soluble salts of metals selected from calcium, barium, manganese, copper, cobalt, nickel, iron, zinc, chromium, magnesium, tungsten, and molybdenum.
Specifically, calcium acetate, calcium chloride, calcium formate, calcium sulfate, barium acetate, barium sulfate, barium phosphate, manganese chloride, manganese acetate, manganese formate dihydrate, manganese ammonium sulfate hexahydrate, second chloride Copper, ammonium chloride (II) chloride dihydrate, copper sulfate, cobalt chloride, cobalt thiocyanate, cobalt sulfate, nickel sulfate hexahydrate, nickel chloride hexahydrate, nickel acetate tetrahydrate, nickel ammonium sulfate Hexahydrate, nickel amidosulfate tetrahydrate, ferrous bromide, ferrous chloride, ferric chloride, ferrous sulfate, ferric sulfate, zinc bromide, zinc chloride, zinc nitrate hexahydrate Japanese products, zinc sulfate, chromium acetate, chromium sulfate, magnesium sulfate, magnesium chloride hexahydrate, magnesium citrate nonahydrate, phosphotungstic acid sodium Um, sodium tungsten citrate, 12 tungstophosphoric acid n-hydrate, dodecatungstosilicic acid 26-hydrate, molybdenum chloride, dodecamolybdophosphoric acid n-hydrate.

<Other ingredients>
The receiving layer 12 of the present invention is configured to contain the following components as necessary.
Examples of the ultraviolet absorber include cinnamic acid derivatives, benzophenone derivatives, benzotriazolylphenol derivatives, and the like. For example, α-cyano-phenyl cinnamate butyl, o-benzotriazole phenol, o-benzotriazole-p-chlorophenol, o-benzotriazole-2,4-di-t-butylphenol, o-benzotriazole-2,4 -Di-t-octylphenol etc. are mentioned. A hindered phenol compound can also be used as an ultraviolet absorber, and specifically, a phenol derivative in which one or more of at least 2-position or 6-position is substituted with a branched alkyl group is preferable.

  Moreover, a benzotriazole type ultraviolet absorber, a salicylic acid type ultraviolet absorber, a cyanoacrylate type ultraviolet absorber, an oxalic acid anilide type ultraviolet absorber, etc. can be used. For example, JP-A-47-10537, 58-111942, 58-21284, 59-19945, 59-46646, 59-109055, 63-53544. No. 36, Japanese Patent Publication No. 36-10466, No. 42-26187, No. 48-30492, No. 48-31255, No. 48-41572, No. 48-54965, No. 50-10726. No. 2,719,086, US Pat. No. 3,707,375, US Pat. No. 3,754,919, US Pat. No. 4,220,711, and the like. .

  A fluorescent brightening agent can also be used as an ultraviolet absorber, and examples thereof include a coumarin fluorescent brightening agent. Specifically, it is described in Japanese Patent Publication Nos. 45-4699 and 54-5324.

  Examples of the antioxidant include European Patent Publication No. 223739, Publication No. 309401, Publication No. 309402, Publication No. 310551, Publication No. 310552, Publication No. 4594416, Publication of German Patent No. 3435443, JP-A-54-48535, JP-A-60-107384, JP-A-60-107383, JP-A-60-125470, JP-A-60-125471, JP-A-60-125472, JP-A-60-287485. 60-287486, 60-287487, 60-287488, 61-160287, 61-185483, 61-2111079, 62-146678, 62-146680, 62-146679, 62-282885, JP same 62-262047, JP-same 63-051174, JP-same 63-89877, JP-same 63-88380, JP-same 66-88381, JP-same 63-113536 JP;

  JP-A-63-163351, JP-A-63-203372, JP-A-63-224989, JP-A-63-251282, JP-A-63-267594, JP-A-63-182484, JP-A-1-239282, JP-A-2-262654, JP-A-2-71262, JP-A-3-121449, JP-A-4-29185, JP-A-4-291684, JP-A-5-61166, JP-A-5-119449, 5-188687, 5-188686, 5-110490, 5-110437, 5-170361, JP 48-43295, 48-33212, Examples thereof include those described in U.S. Pat. Nos. 4,814,262 and 4,980,275.

  Specifically, 6-ethoxy-1-phenyl-2,2,4-trimethyl-1,2-dihydroquinoline, 6-ethoxy-1-octyl-2,2,4-trimethyl-1,2-dihydroquinoline 6-ethoxy-1-phenyl-2,2,4-trimethyl-1,2,3,4-tetrahydroquinoline, 6-ethoxy-1-octyl-2,2,4-trimethyl-1,2,3 4, -tetrahydroquinoline, nickel cyclohexane acid, 2,2-bis (4-hydroxyphenyl) propane, 1,1-bis (4-hydroxyphenyl) -2-ethylhexane, 2-methyl-4-methoxy-diphenylamine, Examples include 1-methyl-2-phenylindole.

  These antioxidants may be used alone or in combination of two or more. The antioxidant may be water-solubilized, dispersed, emulsified, or included in microcapsules. As addition amount of antioxidant, 0.01-10 mass% of a receiving layer formation liquid is preferable.

  In the present invention, the receiving layer 12 preferably contains a high boiling point organic solvent for curling prevention. The high-boiling organic solvent is preferably a water-soluble one, and examples of the water-soluble high-boiling organic solvent include ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, glycerin, diethylene glycol monobutyl ether (DEGMBE), and triglyceride. Ethylene glycol monobutyl ether, glycerin monomethyl ether, 1,2,3-butanetriol, 1,2,4-butanetriol, 1,2,4-pentanetriol, 1,2,6-hexanetriol, thiodiglycol, tri Examples include alcohols such as ethanolamine and polyethylene glycol (weight average molecular weight of 400 or less). Diethylene glycol monobutyl ether (DEGMBE) is preferred.

As content in the receiving layer formation liquid of the said high boiling point organic solvent, 0.05-1 mass% is preferable, Most preferably, it is 0.1-0.6 mass%.
Further, for the purpose of enhancing the dispersibility of the inorganic fine particles, various inorganic salts and pH adjusting agents may contain acids, alkalis and the like.
Furthermore, for the purpose of suppressing surface frictional charge and peeling charge, metal oxide fine particles with electronic conductivity are used, various matting agents are used for reducing surface frictional characteristics, and the electrical characteristics as a printed wiring board are impaired. You may include in the range which is not.

Here, the formation method of the receiving layer 12 using the said receiving layer material is demonstrated in detail.
As the method for forming the receiving layer 12 in the present invention, a step of preparing a dispersion by causing inorganic fine particles and a zirconium compound to collide with each other using a high-pressure disperser or by passing through an orifice and dispersing, Adding a cationically modified self-emulsifying polymer to the dispersion, polyvinyl alcohol having a saponification degree of 92 to 98 mol%, and a crosslinking agent to prepare a receptor layer forming liquid; and water-soluble in the receptor layer forming liquid A method including at least a step of forming a receiving layer 12 by applying a coating liquid (functional liquid containing a receiving layer material) obtained by in-line mixing of an aluminum compound on the substrate 10 is exemplified.
Further, as another forming method, a step of preparing a dispersion by dispersing the inorganic fine particles, the zirconium compound, and the cross-linking agent by opposing collision using a high-pressure disperser or passing through an orifice; and Adding a cationically modified self-emulsifying polymer and polyvinyl alcohol having a saponification degree of 92 to 98 mol% to the dispersion to prepare a receiving layer forming solution; and adding a water-soluble aluminum compound to the receiving layer forming solution in-line A method including at least a step of forming a receiving layer 12 by applying a coating liquid (functional liquid containing a receiving layer material) obtained by mixing on the substrate 10 is also exemplified.

  If it is the said formation method, the dispersion liquid obtained by making inorganic fine particles and a zirconium compound or inorganic fine particles, a zirconium compound, and a crosslinking agent collide with each other using a high-pressure disperser or passing through an orifice to disperse is obtained. The inorganic fine particles are excellent in that the particle diameter is fine.

  The inorganic fine particles and the zirconium compound or the inorganic fine particles, the zirconium compound and the crosslinking agent are supplied to a high-pressure disperser in the state of a dispersion liquid (pre-dispersion liquid) containing them. The preliminary mixing (pre-dispersion) can be performed by ordinary propeller stirring, turbine stirring, homomixing stirring, or the like.

As a high-pressure disperser used for preparing the dispersion, a commercially available device called a high-pressure homogenizer can be preferably used.
Representative examples of the high-pressure homogenizer include nanomizer trade names; nanomizer, microfluidics trade names; microfluidizers, and Sugino Machine optimizers.

  The orifice refers to a mechanism that inserts a thin plate (orifice plate) having a fine hole such as a circle into the straight pipe to rapidly narrow the flow path of the straight pipe.

  The high-pressure homogenizer is basically an apparatus that includes a high-pressure generating section that pressurizes raw material slurry and the like, and an opposing collision section or an orifice section. As the high-pressure generating unit, a high-pressure pump generally called a plunger pump is preferably employed. There are various types of high-pressure pumps such as a series type, a double type, and a triple type, and any type can be adopted in the present invention without any particular limitation.

The processing pressure in the case of opposing collision at high pressure is preferably 50 MPa or more, 100 MPa or more, and more preferably 130 MPa or more.
Also, the differential pressure between the inlet side and the outlet side of the orifice when passing through the orifice is 50 MPa or more, preferably 100 MPa or more, more preferably 130 MPa or more, like the processing pressure.

  The collision speed of the pre-dispersion liquid in the case of opposing collision is preferably 50 m / second or more, more preferably 100 m / second or more, and preferably 150 m / second or more as a relative speed.

  Although the linear velocity of the solvent when passing through the orifice depends on the pore diameter of the orifice to be used and cannot be determined unconditionally, it is preferably 50 m / second or more, like the collision velocity at the time of the above-mentioned opposing collision, and preferably 100 m / second. The above is more preferable, and 150 m / sec or more is preferable.

  In any method, since the dispersion efficiency depends on the processing pressure, the higher the processing pressure, the higher the dispersion efficiency. However, if the treatment pressure exceeds 350 MPa, problems are likely to occur in the pressure resistance of the piping of the high-pressure pump and the durability of the apparatus.

  In any of the methods described above, the number of treatments is not particularly limited, and is usually appropriately selected from a range of 1 to several tens of times. Thereby, a dispersion liquid can be obtained.

When preparing this dispersion, various additives can be added.
Examples of additives include various nonionic or cationic surfactants (anionic surfactants are not preferred for forming aggregates), antifoaming agents, nonionic hydrophilic polymers (polyvinyl alcohol, Polyvinyl pyrrolidone, polyethylene oxide, polyacrylamide, various sugars, gelatin, pullulan, etc., nonionic or cationic latex dispersion, water-miscible organic solvent (ethyl acetate, methanol, ethanol, isopropanol, n-propanol, acetone, etc.) ), Inorganic salts, pH adjusters and the like, and these can be used as needed.

  In particular, a water-miscible organic solvent is preferable in that formation of fine lumps when inorganic fine particles (silica) are predispersed is suppressed. The water-miscible organic solvent is used in the dispersion in an amount of 0.1 to 20% by mass, particularly preferably 0.5 to 10% by mass.

  The pH at which the inorganic fine particle (gas phase method silica) dispersion is prepared can vary widely depending on the type of inorganic fine particles (gas phase method silica), various additives, and the like. 8. 2 to 7 is particularly preferable. Two or more kinds of additives can be used in combination for the dispersion.

  In the method for forming the receptor layer 12 in the present invention, a cation-modified self-emulsifying polymer, the polyvinyl alcohol of the present invention, and the like are added to the dispersion obtained by the above-described method to obtain a receptor layer forming liquid. Mixing of the above-mentioned dispersion with the cationically modified self-emulsifying polymer, the polyvinyl alcohol of the present invention, and the like can be performed by ordinary propeller stirring, turbine stirring, homomixing stirring, or the like.

  In the method for forming the receiving layer 12 in the present invention, a preferred in-line mixer used when in-line mixing a water-soluble aluminum compound with the receiving layer forming solution is described in JP-A-2002-85948, etc. It is not limited.

  The method for forming the receiving layer 12 in the present invention was formed by applying a coating liquid (functional liquid containing a receiving layer material) obtained by in-line mixing a water-soluble aluminum compound to a receiving layer forming liquid on a substrate. (1) At the same time as applying the coating liquid (functional liquid containing the receiving layer material) to the receiving layer 12, (2) before the receiving layer 12 is in the middle of drying, and the receiving layer 12 shows reduced-rate drying, In any of the cases, it may further include a step of applying a basic solution having a pH of 7.1 or higher and crosslinking and curing the receptor layer 12.

  Providing the receptor layer 12 crosslinked and cured in this manner is preferable from the viewpoint of solvent absorbability of the ink (metal colloid solution) and prevention of cracking of the film.

  In the method for forming the receiving layer 12 in the present invention, water, an organic solvent, or a mixed solvent thereof can be used as a solvent in each step. Examples of the organic solvent that can be used for this coating include alcohols such as methanol, ethanol, n-propanol, i-propanol, and methoxypropanol, ketones such as acetone and methyl ethyl ketone, tetrahydrofuran, acetonitrile, ethyl acetate, and toluene. It is done.

  The application of the receptor layer forming liquid can be performed by a known coating method such as, for example, an extrusion die coater, an air doctor coater, a bread coater, a rod coater, a knife coater, a squeeze coater, a reverse roll coater, a bar coater, or an ink jet. .

  At the same time as the application of the receiving layer forming liquid, or during the drying of the receiving layer 12 formed by applying the receiving layer forming liquid, and before the receiving layer 12 shows the reduced rate drying, the pH of the receiving layer 12 is increased. 7.1 or more basic solution is applied. That is, after the application of the receiving layer forming solution, it is preferably manufactured by introducing a basic solution having a pH of 7.1 or higher while the receiving layer 12 exhibits a constant rate of drying.

  The basic solution having a pH of 7.1 or higher can contain a crosslinking agent or the like as necessary. A basic solution having a pH of 7.1 or higher can promote dura mater by being used as an alkaline solution, preferably has a pH of 7.5 or higher, and particularly preferably has a pH of 7.9 or higher. When the pH is too close to the acidic side, the crosslinking reaction of the polyvinyl alcohol contained in the receiving layer forming liquid is not sufficiently performed by the cross-linking agent, which may cause bronzing and defects such as cracks in the receiving layer 12. .

  A basic solution having a pH of 7.1 or higher is prepared, for example, in ion-exchanged water by adding a metal compound (for example, 1 to 5%) and a basic compound (for example, 1 to 5%) and, if necessary, paratoluenesulfonic acid ( For example, 0.5 to 3%) can be added and sufficiently stirred. In addition, all "%" of each composition means solid content mass%.

  Here, the phrase “before the receiving layer 12 comes to exhibit a decreasing rate of drying” usually refers to a process for several minutes immediately after application of the coating liquid (functional liquid containing the receiving layer material). The phenomenon of “constant rate drying rate” in which the content of the solvent (dispersion medium) in the applied receiving layer decreases in proportion to time is shown. About the time which shows this "constant rate drying speed", it describes in chemical engineering handbook (pages 707-712, Maruzen Co., Ltd. issue, October 25, 1980), for example.

  As described above, after the application of the receiving layer forming solution, it is dried until the receiving layer 12 exhibits a reduced rate of drying. This drying is generally performed at 40 to 180 ° C. for 0.5 to 10 minutes (preferably 0.5 to 5 minutes). The drying time naturally varies depending on the coating amount, but usually the above range is appropriate.

  As described above, after the application of the receiving layer forming solution, it is dried until the receiving layer 12 exhibits a reduced rate of drying. This drying is generally performed at 40 to 180 ° C. for 0.5 to 10 minutes (preferably 0.5 to 5 minutes). The drying time naturally varies depending on the coating amount, but usually the above range is appropriate.

  Next, the metal colloid solution forming the conductive metal portion 16 (16a, 16b) will be described in detail below.

  The metal colloid solution according to the present invention is not particularly limited as long as the metal colloid solution is stabilized by the presence of the dispersant to form a colloid solution.

  The metal colloid particles contained in the metal colloid solution are preferably obtained by reducing a metal compound in the presence of a polymer dispersant. The colloidal metal particles can maintain the state of the colloidal metal particle solution stably even at a high concentration by the polymer dispersant. The metal concentration in the metal colloidal particles is preferably as high as possible, and is preferably 93% by mass or more, and more preferably 95% by mass or more.

  The metal concentration in the metal colloid particles means the mass% of metal in the solid content of the metal colloid particle solution. The amount of the heated residue heated at 140 ° C. can be determined for the solid content, and the amount of the heated residue heated at 500 ° C. can be determined for the metal amount. Specifically, using TG-DTA, the temperature is raised to 140 ° C. at 10 ° C./min, then maintained at 140 ° C. for 30 minutes, and the solid content is first determined. Thereafter, the temperature is raised again to 500 ° C. at 10 ° C./min, and then the temperature is maintained at 500 ° C. for 30 minutes to determine the amount of metal. The measurement of the metal concentration in this specification is performed using this method unless otherwise specified.

  The metal compound used as the raw material for the metal colloid particles generates metal ions when dissolved in a solvent, and the ions are reduced to deposit metal colloid particles. The metal forming the metal colloidal particles is not particularly limited, but a noble metal or copper is preferable for the purpose of obtaining conductivity. The noble metal is not particularly limited, and examples thereof include gold, silver, ruthenium, rhodium, palladium, osmium, iridium, and platinum. Of these, gold, silver, platinum, and palladium are preferable, and silver is particularly preferable from the viewpoint of excellent conductivity.

  The metal compound is not particularly limited as long as it contains the above-mentioned noble metal or copper. For example, tetrachlorogold (III) acid tetrahydrate (chloroauric acid), silver nitrate, silver acetate, silver perchlorate ( IV), hexachloroplatinic (IV) acid hexahydrate (chloroplatinic acid), potassium chloroplatinate, copper (II) chloride dihydrate, copper acetate (II) monohydrate, copper (II) sulfate, Palladium (II) chloride dihydrate, rhodium trichloride (III) trihydrate and the like can be mentioned. These may be used alone or in combination of two or more.

  The metal compound is preferably used so that the metal molar concentration in the solvent is 0.01 mol / l or more. If it is less than 0.01 mol / l, the resulting metal colloidal particle solution has a metal molar concentration that is too low to be efficient. Preferably it is 0.05 mol / l or more, More preferably, it is 0.1 mol / l or more.

  The solvent is not particularly limited as long as it can dissolve the metal compound, and examples thereof include water and organic solvents. It does not specifically limit as said organic solvent etc., For example, C1-C4 alcohol, such as ethanol and ethylene glycol; Ketones, such as acetone; Esters, such as ethyl acetate, etc. are mentioned. These may be used alone or in combination of two or more. When the solvent is a mixture of water and an organic solvent, the organic solvent is preferably water-soluble, and examples thereof include acetone, methanol, ethanol, ethylene glycol, and the like. From the viewpoint of being suitable for the ultrafiltration treatment performed in the subsequent concentration step, water, alcohol and a mixed solution of water and alcohol are preferable.

  On the other hand, as the polymer dispersing agent, an amphiphilic copolymer having a structure having a solvation portion and a functional group having a high affinity for the surface of the metal colloid particles is introduced into a high molecular weight polymer. It is preferable to use it.

  Such a polymer dispersing agent is usually used as a dispersing agent at the time of producing a paste, and a general number average molecular weight is 1,000 to 1,000,000. When the number average molecular weight is less than 1000, the dispersion stability may not be sufficient. When it exceeds 1,000,000, the viscosity may be too high and handling may be difficult. A more preferable value of the number average molecular weight is 2000 to 500,000, and more preferably 4000 to 500,000.

  The polymer dispersant is not particularly limited as long as it has the above-described properties, and examples thereof include those exemplified in JP-A-11-80647. Various polymer dispersing agents can be used, but commercially available ones can also be used. Examples of commercially available products include Solsperse 20000, Solsperse 24000, Solsperse 26000, Solsperse 27000, Solsperse 28000, Solsperse 41090 (above, manufactured by Avicia), Dispersic 160, Dispersic 161, Dispersic 162, Dispersic 163, Dispersic 166, Dispersic 170, Dispersic 180, Dispersic 181, Dispersic 182, Dispersic-183, Dispersic 184, Dispersic 190, Dispersic 191, Dispersic 192, Dispersic-2000, Dispersic-2001 (or above) , Manufactured by Big Chemie), polymer 100, polymer 120, polymer 150, polymer 00, polymer 401, polymer 402, polymer 403, polymer 450, polymer 451, polymer 452, polymer 453, EFKA-46, EFKA-47, EFKA-48, EFKA-49, EFKA-1502, EFKA-1502, EFKA-4540 , EFKA-4550 (manufactured by EFKA Chemical Co., Ltd.), FLOREN DOPA-158, FLOREN DOPA-22, FLOREN DOPA-17, FLOREN G-700, FLOREN TG-720W, FLOREN-730W, FLOREN-740W, FLOREN-745W, (Above, manufactured by Kyoeisha Chemical Co., Ltd.), Addispar PA111, Addispar PB711, Addispar PB811, Addispar PB821, Addispar PW911 (above, manufactured by Ajinomoto Co., Inc.), Jonkrill 678, Di Nkuriru 679, Joncryl 62 (or more, Johnson Ltd. Polymer Co.), and the like. These may be used alone or in combination of two or more.

  The amount of the polymer dispersant used is preferably 10% by mass or less based on the total amount of the metal and the polymer dispersant in the metal compound. When it exceeds 10 mass%, when performing an ultrafiltration process later, there exists a possibility that the metal concentration in solid content in a solution cannot be raised to a desired density | concentration. More preferably, it is 8 mass% or less, More preferably, it is 7 mass% or less.

  The reduction of the metal compound can be performed using a reducing compound. The reducing compound is preferably an amine. For example, when an amine is added to a solution of the metal compound and the polymer dispersant and stirred and mixed, the metal ions are reduced to a metal at around room temperature. If the amine is used, it is not necessary to use a reducing agent having high risk and harmfulness, and it is about 5 to 100 ° C., preferably about 20 to 80 ° C. without using heating or a special light irradiation device. The metal compound can be reduced at the reaction temperature of

  The amine is not particularly limited and, for example, those exemplified in JP-A No. 11-80647 can be used. Propylamine, butylamine, hexylamine, diethylamine, dipropylamine, dimethylethylamine, diethylmethyl Amine, triethylamine, ethylenediamine, N, N, N ′, N′-tetramethylethylenediamine, 1,3-diaminopropane, N, N, N ′, N′-tetramethyl-1,3-diaminopropane, triethylenetetramine Aliphatic amines such as tetraethylenepentamine; alicyclic amines such as piperidine, N-methylpiperidine, piperazine, N, N′-dimethylpiperazine, pyrrolidine, N-methylpyrrolidine, morpholine; aniline, N-methylaniline, N, N-dimethylaniline Aromatic amines such as toluidine, anisidine, phenetidine; benzylamine, N-methylbenzylamine, N, N-dimethylbenzylamine, phenethylamine, xylylenediamine, N, N, N ′, N′-tetramethylxylylenediamine, etc. And aralkylamine. Examples of the amine include methylaminoethanol, dimethylaminoethanol, triethanolamine, ethanolamine, diethanolamine, methyldiethanolamine, propanolamine, 2- (3-aminopropylamino) ethanol, butanolamine, hexanolamine, dimethylamino. Mention may also be made of alkanolamines such as propanol. These may be used alone or in combination of two or more. Of these, alkanolamine is preferable, and dimethylaminoethanol is more preferable.

  In addition to the above amines, alkali metal borohydride salts such as sodium borohydride known as reducing agents, hydrazine compounds, citric acid, tartaric acid, ascorbic acid, formic acid, formaldehyde, nitrite, sulfoxylate derivatives, etc. Can be used. Citric acid, tartaric acid, and ascorbic acid are preferable because they are easily available. These can be used alone or in combination with the above amines, but when combining an amine with citric acid, tartaric acid, and ascorbic acid, each of citric acid, tartaric acid, and ascorbic acid should be in the form of a salt. preferable. In addition, citric acid or a sulfoxylate derivative can be used in combination with iron (II) ions to improve reducibility.

  The amount of the reducing compound added is preferably equal to or greater than the amount necessary for reducing the metal in the metal compound. If the amount is less than this amount, reduction may be insufficient. Moreover, although an upper limit in particular is not prescribed | regulated, it is preferable that it is 30 times or less of the quantity required in order to reduce | restore the metal in the said metal compound, and it is more preferable that it is 10 times or less. In addition to the method of chemically reducing by adding these reducing compounds, it is also possible to use a method of irradiating light using a high-pressure mercury lamp.

  The method for adding the reducing compound is not particularly limited, and can be performed, for example, after the addition of the polymer dispersant. In this case, for example, the polymer dispersant is first dissolved in a solvent, Reduction can be promoted by adding the remaining reducing compound or metal compound to a solution obtained by dissolving either the reducing compound or metal compound. As another method for adding the reducing compound, the polymer dispersant and the reducing compound may be mixed in advance, and the mixture may be added to the metal compound solution.

  By the reduction, a solution containing metal colloid particles having an average particle diameter of about 5 nm to 100 nm is obtained. This solution contains the metal colloid particles and the polymer dispersant described above. In the present invention, the metal colloid particle solution is defined as a state in which metal fine particles are dispersed in a solvent and are visible as a solution. The metal concentration of the metal colloid particle solution obtained in the above production process can be determined by measuring with TG-DTA or the like as described above, but if not measured, it is calculated from the blending amount used for the preparation. The value to be used can also be used.

  Next, an ultrafiltration treatment can be performed on the solution after the reduction. In the metal colloid particle solution after the reduction, in addition to the metal colloid particles and the polymer dispersant, impurities such as chloride ions derived from the raw material and salts and amines generated by the reduction are contained. Since these impurities may adversely affect the stability of the metal colloid solution, it is desirable to remove them. This removal means includes electrodialysis, centrifugation, ultrafiltration, etc. In particular, ultrafiltration can be concentrated by removing a part of the polymer dispersant simultaneously with the removal of the above impurities. The concentration can be increased.

  The solid content of the metal colloid particles and the polymer dispersant contained in the metal colloid solution before the ultrafiltration treatment is preferably 0.05 to 50% on a mass basis. If the solid content is less than 0.05%, the metal molar concentration is too low to perform efficient ultrafiltration, and if it exceeds 50%, it may be difficult to remove impurities.

  In the ultrafiltration, a substance to be separated usually has a diameter of 1 nm to 5 μm. By targeting the diameter, a part of the polymer dispersant can be removed together with the impurities, and the metal concentration of the resulting metal colloid particles can be increased. When the diameter is less than 1 nm, unnecessary components such as impurities may not be eliminated without passing through the filtration membrane. When the diameter exceeds 5 μm, many of the metal colloidal particles pass through the filtration membrane and have a high concentration. Metal colloidal particles may not be obtained.

  The filtration membrane for ultrafiltration is not particularly limited, but usually, for example, a resin made of a resin such as polyacrylonitrile, vinyl chloride / acrylonitrile copolymer, polysulfone, polyimide, polyamide or the like is used. Of these, polyacrylonitrile and polysulfone are preferable, and polyacrylonitrile is more preferable. The ultrafiltration filtration membrane is preferably a filtration membrane that can be back-washed from the viewpoint of efficiently washing the filtration membrane that is usually performed after the ultrafiltration.

  As the membrane for the ultrafiltration, those having a fractional molecular weight of 3000 to 80000 are preferable. If the molecular weight cut-off is less than 3000, unnecessary polymer dispersants and the like are not easily removed. is there. A more preferable value of the molecular weight cut-off is 10,000 to 60,000. The molecular weight cut off generally means the molecular weight of a polymer that passes through the pores of the ultrafiltration membrane and is excluded to the outside when the polymer solution is passed through the ultrafiltration membrane. Used to evaluate pore size. The larger the molecular weight cut off, the larger the pore size of the filtration membrane.

  The form of the ultrafiltration filtration module is not particularly limited, and examples thereof include a hollow fiber type module (also called a capillary module), a spiral module, a tubular module, a plate type module, and the like depending on the form of the filtration membrane. Is also preferably used in the present invention. Among these, the hollow fiber type module is preferable from the viewpoint of efficiency and the filtration area is large and the form is compact. In addition, when the amount of the metal colloid particle solution to be treated is large, it is preferable to use one having a large number of ultrafiltration membranes to be used.

  The ultrafiltration method is not particularly limited, and a metal colloid particle solution obtained by reducing the metal compound is passed through an ultrafiltration membrane by a conventionally known method. This eliminates the filtrate containing the impurities and polymer dispersant described above. The ultrafiltration is usually repeated until the miscellaneous ions in the filtrate are removed to a desired concentration or less. At that time, it is preferable to add the same amount of solvent as the amount of filtrate removed in order to keep the concentration of the colloidal metal particle solution to be treated constant. As the solvent added at this time, it is possible to replace the solvent of the metal colloid particle solution by using a different kind of solvent from that used at the time of reduction.

  The ultrafiltration can be performed by a normal operation, for example, a so-called batch system. This batch method is a method of adding the metal colloid particle solution to be treated as the ultrafiltration progresses. The ultrafiltration may be further performed to increase the solid content concentration after the miscellaneous ions are removed to a desired concentration or less.

  The metal colloid particle solution thus obtained is adjusted to a form suitable for the ink jet system to become a metal colloid solution. Usually, water-soluble resins such as glycerin, maltitol, carboxymethylcellulose, ethylene glycol, surfactants, pH adjusters for the purpose of adjusting viscosity, improving dispersibility, improving permeability to the receiving layer 12 or preventing drying of the nozzle Chelating agents, binders, surface tension modifiers, plasticizers, etc. can be added. Furthermore, if necessary, a fungicide, an antiseptic, a moisturizer, an evaporation accelerator, an antifoaming agent, an antioxidant, a light stabilizer, a deterioration inhibitor, an oxygen absorber, a rust inhibitor and the like can be added. .

The metal content in the metal colloid solution can be set to 2 to 50% by weight, the content of the components used for the above adjustment can be set to 0.3 to 30% by weight, and the viscosity can be set to 3 to 30 centipoise.
Although the example of the liquid colloid solution has been described with respect to the metal colloid solution, the present invention is not limited to this, and a metal colloid solution produced by a so-called gas phase method may be used. For example, what is marketed by the name of NPS-J from Harima Kasei Co., Ltd. can be used suitably.

The present invention is basically as described above.
The wiring forming method of the present invention has been described in detail above, but the present invention is not limited to these, and it goes without saying that various improvements and modifications may be made without departing from the spirit of the present invention.

Hereinafter, the present invention will be described in more detail with reference to specific examples of the present invention.
In addition, materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the present invention is not construed as being limited to the specific examples shown below.

Electronic circuit boards were produced by the methods described below and their respective evaluations were performed.
Example 1
First, a migration prevention solution (Cytop CTX-100 manufactured by Asahi Glass Co., Ltd.) is diluted with a solvent (CT-Solv. 100 manufactured by Asahi Glass Co., Ltd.) to a concentration of 3%, and the diluted solution is piezo-type. Filled in the head of an ink jet recording apparatus (DMP-2831 manufactured by Fuji Film Co., Ltd.) and based on the image data of the reverse conductive pattern, the ink jet dedicated paper (made by Fuji Film Co., Ltd. “ Painted and drawn on the painting “)”.
Next, silver colloidal ink (Sumitomo Electric Industries, Ltd. AGIN-W4A) is filled in the head of a piezo-type ink jet recording apparatus (DMP-2831 manufactured by Fuji Film Co., Ltd.), and image data of a conductive (wiring) pattern is obtained. In this case, the electronic circuit board of Example 1 is obtained by discharging and drawing on a special ink jet paper (“Image” manufactured by Fuji Film Co., Ltd.), which is a base material with a receiving layer, and allowing it to stand at room temperature for 7 days to dry. Produced.
The conductive pattern was formed so as to be a comb-teeth pattern having a conductor width / conductor interval width (L / S) of 100 μm / 100 μm.
(Comparative example)
The head of a piezo-type ink jet recording apparatus (DMP-2831 manufactured by Fuji Film Co., Ltd.) is filled with silver colloid ink (AGIN-W4A manufactured by Sumitomo Electric Industries, Ltd.), and the image data of the conductive (wiring) pattern is obtained. Based on the ink jet paper (Fuji Film Co., Ltd. “Image”), which is a base material with a receiving layer, it is drawn and drawn, and left to dry at room temperature for 7 days, without migration prevention treatment. The electronic circuit board of the comparative example was produced.
The conductive pattern (drawing pattern) was formed to be a comb-teeth pattern having a conductor width / conductor interval width (L / S) of 100 μm / 100 μm.
(Reference example)
The head of a piezo-type ink jet recording apparatus (DMP-2831 manufactured by Fuji Film Co., Ltd.) was filled with silver colloid ink (Harima Kasei Co., Ltd. NPS-J), and based on the image data of the conductive (wiring) pattern. Then, it was drawn by drawing on a Kapton film (“EN” manufactured by Toray DuPont Co., Ltd.), which is a substrate without a receiving layer, and sintered at 220 ° C. for 1 hour to produce a reference electronic circuit board. .
The conductive pattern (drawing pattern) was formed to be a comb-teeth pattern having a conductor width / conductor interval width (L / S) of 100 μm / 100 μm.
The outline of the method for forming each electronic circuit board is shown in Table 1.

Inkjet (IJ) paper: Fujifilm Co., Ltd. inkjet paper “Image”
Polyimide (PI) film: Kapton film “EN” manufactured by Toray DuPont Co., Ltd.
Metal colloid solution A: “AGIN-W4A” manufactured by Sumitomo Electric Industries, Ltd.
Metal colloid solution B: “NPS-J” manufactured by Harima Kasei Co., Ltd.
Migration prevention solution: “Cytop” diluted solution by Asahi Glass Co., Ltd.

[Resistivity measurement and migration resistance evaluation]
Each electronic circuit board produced by the above method was measured with a stylus type step / surface shape measuring instrument (Dektak III manufactured by ULVAC, Inc.), and with a low resistivity meter (Lorester GP manufactured by Mitsubishi Chemical Corporation). The sheet resistance was measured, and the volume resistivity was calculated using the measured film thickness value. The volume resistivity depends on the wiring application to be used, but can be sufficiently used for any application as long as it is a value equal to or lower than −5. The results are shown in Table 2.

The migration resistance evaluation was evaluated by the following method.
As shown in FIG. 2, each manufactured electronic circuit board 30 is set in a constant temperature and humidity chamber (LHU-113 manufactured by Tabai Espec), an external power supply 34 is connected in parallel to the electronic circuit board 30, and a resistor 36: 100 KΩ was connected in series. Next, the switch 40 was operated, and the potential difference between both sides of the 100 KΩ resistor 36 was measured by the digital multimeter 38 and monitored on the PC 42. The measurement conditions were the above-mentioned constant temperature and humidity chamber 32: temperature 60 ° C., humidity 90% RH, and the applied voltage was 25V. As a criterion, it was determined that a failure occurred when the insulation resistance value was less than 1 MΩ.
The results are shown in Table 3 and FIG.

From the results of Table 2, it was confirmed that in Example 1 and Comparative Example in which wiring was formed using a base material having a receiving layer, low resistance, that is, high conductivity was obtained even if low-temperature sintering was performed. It was done.
Therefore, it was found that the electronic circuit board according to the present example has substantially the same conductivity as that of the electronic circuit board of the reference example that has been conventionally used without performing high-temperature sintering.

Moreover, as the result of Table 3 and FIG. 3 showed, the electronic circuit board of Example 1 which apply | coated the migration prevention solution did not generate | occur | produce the insulation resistance fall for 400 hours or more.
On the other hand, the electronic circuit board of the comparative example to which the migration preventing solution was not applied reached the environmental condition of 60 ° C. and 90% RH, and was short-circuited immediately after the start of energization. Further, as shown in FIG. 3A, dendritic migration occurred in the receiving layer from the cathode side (−) to the anode side (+).
In addition, in the case of the electronic circuit board of the reference example that has no receiving layer and is not coated with the migration preventing solution that has been conventionally used, dendritic migration occurred after 400 hours. Further, as shown in FIG. 3B, dendritic migration occurred on the surface of the base material from the cathode side (-) to the anode side (+).
Therefore, it can be seen that the electronic circuit board according to Example 1 has a migration resistance equal to or higher than that of the electronic circuit board of the reference example conventionally used.

(Example 2)
<Preparation of receiving layer forming liquid>
In accordance with the following “silica dispersion” composition, 7.5% boric acid solution and dimethyldiallylammonium chloride polymer (manufactured by Daiichi Kogyo Seiyaku Co., Ltd., Disperse, Charol DC902P (51.5% solution)) are mixed in ion-exchanged water. Silica fine particles (AEROSIL300SF75 manufactured by Nippon Aerosil Co., Ltd.) were mixed with the obtained liquid, and a slurry in which zirconyl acetate (Zircosol ZA-30 (50% solution) manufactured by Daiichi Rare Element) was further added was produced by Sugino Machine Co., Ltd. A silica dispersion having a median diameter (average particle diameter) of 120 nm was prepared by dispersing at 170 MPa with Iser.
In accordance with the composition of the following receptor layer forming solution in the silica dispersion, ion-exchanged water, 7.5% boric acid solution, dimethylamine / epichlorohydrin / polyalkylene polyamine polycondensate (SC-505 (50% solution) manufactured by Hymo Co., Ltd.) ), A polyvinyl alcohol solution, and cation-modified polyurethane (Superflex 650-5 (25% liquid) manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) were sequentially added and mixed to prepare a receiving layer forming solution.

[Composition of silica dispersion]
(1) Gas phase method silica fine particles 15.0 parts (2) Ion exchange water 78.5 parts (3) 7.5% boric acid solution (crosslinking agent) 4.4 parts (4) Dimethyldiallylammonium chloride polymer 1 .31 parts (5) 0.81 part of zirconyl acetate

[Composition of receiving layer forming solution]
(1) Silica dispersion 59.5 parts (2) Ion-exchanged water 12.2 parts (3) Dimethylamine / epichlorohydrin / polyalkylene polyamine polycondensate (50% solution) 0.1 part (4) Polyvinyl alcohol dissolution below Liquid 26.0 parts (5) Cation-modified polyurethane 2.2 parts

[Polyvinyl alcohol solution composition]
(1) 6.96 parts of polyvinyl alcohol (“JM-33” manufactured by Nihon Acetate / Poval) Saponification degree 94.3 mol%, polymerization degree 3300)
(2) Polyoxyethylene lauryl ether 0.23 parts (surfactant Emulgen 109P manufactured by Kao Corporation)
(3) Diethylene glycol monobutyl ether 2.12 parts (Kyowa Hakko Co., Ltd. Buticenol 20P)
(4) Ion exchange water 90.69 parts

<Preparation of substrate with receptor layer>
On the quartz glass substrate, the receptive layer forming solution, 183 g / m ² , PAC 1 solution prepared with the following composition was in-line blended so as to have a coating amount of 11.4 g / m ² , and then an extrusion die coater. Application was performed. Then, it was dried with a hot air drier at 80 ° C. (wind speed 3 to 8 m / sec) until the solid content concentration of the receiving layer became 20%. This receiving layer showed constant drying during this time. And before declining drying, it was immersed in a basic solution (pH = 7.8) having the following composition for 3 seconds to deposit 13 g / m ² on the receiving layer, and further at 65 ° C. for 10 minutes. Dried (curing process). This produced the base material with a receiving layer in which the receiving layer with a dry film thickness of 32 micrometers was provided.

[Composition of PAC1 solution]
(1) Polyaluminum chloride aqueous solution having a basicity of 83% (Alfine 83, manufactured by Daimei Chemical Industry Co., Ltd.): 20 parts

[Composition of basic solution]
(1) Boric acid 0.65 part (2) Ammonium zirconium carbonate (28% aqueous solution) 0.33 part (Zircosol AC-7, manufactured by Daiichi Elemental Chemical Co., Ltd.)
(3) Ammonium carbonate (first grade) 3.5 parts (manufactured by Kanto Chemical Co., Inc.)
(4) Ion-exchanged water 63.3 parts (5) Polyoxyethylene lauryl ether (2% aqueous solution) 30.0 parts (surfactant Emulgen 109P manufactured by Kao Corporation)

Next, the migration prevention solution (Cytop CTX-100 manufactured by Asahi Glass Co., Ltd.) was diluted with a solvent (CT-Solv. 100 manufactured by Asahi Glass Co., Ltd.) to a concentration of 3%, and the diluted solution was piezo-type. The ink was filled in the head of an ink jet recording apparatus (DMP-2831 manufactured by Fuji Film Co., Ltd.) and drawn on the substrate with a receiving layer prepared by the above method based on the image data of the reverse conductive pattern. The migration preventing solution was allowed to stand at room temperature or dried at 100 ° C. for 1 hour to be cured.
Next, silver colloidal ink (Harima Kasei Co., Ltd. NPS-J) is filled into the head of a piezo-type ink jet recording apparatus (DMP-2831 manufactured by Fuji Film Co., Ltd.), and the image data of the conductive (wiring) pattern is obtained. Accordingly, the electronic circuit board of Example 2 was produced by discharging and drawing on a substrate with a receiving layer coated with the migration preventing solution and drying at 100 ° C. by heating.
The conductive pattern was formed so as to be a comb-teeth pattern having a conductor width / conductor interval width (L / S) of 100 μm / 100 μm.

[Resistivity measurement and migration resistance evaluation]
The electronic circuit board produced by the above method was measured and evaluated by the same method as described above for resistivity measurement and migration resistance evaluation.
As a result of the resistivity measurement, the film thickness was 2.4 μm, the sheet resistance was 2.4E-1 Ω / □, and the volume resistivity was 5.8E-5 Ω · cm.
In the migration resistance evaluation, the insulation resistance did not decrease for 400 hours or longer, and no migration occurred.

It is a figure which shows one Example of the wiring formation method which concerns on this invention. It is the figure which represented typically the migration-proof test apparatus in a present Example. It is a photograph of the electronic circuit board which shows the result of the migration resistance test in a present Example. It is the figure which represented typically the formation method of the wiring pattern which applied the subtractive method. It is the figure which represented typically the formation method of the wiring pattern which applied the semi-additive method. It is the figure which represented typically the formation method of the wiring pattern which applied the additive method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Base material 12 Receiving layer 14 Migration prevention process part 14a Migration prevention process part (before drying process or hardening process)
14b Migration prevention processing section (after drying or curing)
16 Conductive metal part 16a Conductive metal part (before dry sintering process)
16b Conductive metal part (after dry sintering)
18 Plating Cover 20 Solder Resist 30 Electronic Circuit Board 32 Constant Temperature and Humidity Tank 34 External Power Supply 36 Resistance 38 Digital Multimeter 40 Switch 42 PC
200 Insulating Substrate 202 Conductor Layer 204 Copper Laminated Laminate Plate 206 Through Hole 208 Conductive Metal Layer 210 Resist Layer 212 Conductive Metal

Claims (13)

  Based on the image data of the reverse conductive pattern obtained by inverting the conductive pattern of the electronic circuit board on the base material, after applying the migration prevention solution as the reverse conductive pattern by the ink jet method, the image data of the conductive pattern The method for producing an electronic circuit board is characterized in that the conductive pattern is formed by applying a metal colloid solution as a conductive pattern by the inkjet method based on the above.   2. The method for manufacturing an electronic circuit board according to claim 1, wherein the substrate is a substrate with a receiving layer having a porous receiving layer formed on the surface thereof.   The inverted conductive pattern is formed at least from the boundary with the conductive pattern to the outside thereof with a line width capable of providing insulation between the adjacent conductive pattern. The manufacturing method of the electronic circuit board of Claim 1 or Claim 2.   The method of manufacturing an electronic circuit board according to claim 1, wherein after the migration preventing solution is applied, a drying process or a curing process of the migration preventing solution is performed.   The method for manufacturing an electronic circuit board according to claim 4, wherein the drying treatment of the migration preventing solution is performed at room temperature or a heat treatment at 100 ° C. or less.   The method for manufacturing an electronic circuit board according to claim 4, wherein the curing treatment of the migration preventing solution is a radiation irradiation treatment.   The method for producing an electronic circuit board according to claim 1, wherein after the metal colloid solution is applied, a dry sintering process is performed on the metal colloid solution.   8. The method of manufacturing an electronic circuit board according to claim 7, wherein the dry sintering treatment of the metal colloid solution is a normal temperature treatment or a heat treatment at 100 [deg.] C. or less.   The dry migration treatment of the migration prevention solution and the metal colloid solution is performed at room temperature after the migration prevention solution is applied and after the metal colloid prevention solution is applied. The manufacturing method of the electronic circuit board in any one of.   After applying the migration preventing solution, the curing treatment of the migration preventing solution is performed by radiation irradiation treatment, and after applying the metal colloid solution, the metal colloid solution is dried and sintered at room temperature. The manufacturing method of the electronic circuit board in any one of Claims 1-3.   After applying the migration preventing solution, the curing treatment of the migration preventing solution is performed by radiation irradiation treatment, and after applying the metal colloid solution, the metal colloid solution is dried and sintered by a heat treatment of 100 ° C. or less. The method for manufacturing an electronic circuit board according to claim 1, wherein the electronic circuit board is manufactured.   The electronic circuit board produced using the manufacturing method of the electronic circuit board in any one of Claims 1-11.   The electromagnetic wave shielding film for PDP produced using the manufacturing method of the electronic circuit board in any one of Claims 1-11.