JP2010087002A - Heating component cooling structure - Google Patents

Abstract

An object of the present invention is to provide a heat generating component cooling structure that realizes high cooling efficiency and high assemblability.
A semiconductor cooling structure includes a main body, a large current terminal and a lead that protrude from the main body through insulating members. 2 ... are accommodated inside and cooled. The semiconductor cooling structure 1 supplies a current to the cooling case 10 having the openings 11, 11, 12, 12,... According to the shape of the insulating members 2 a, 2 b of the semiconductor module 2, and the semiconductor module 2. A bus bar 20, a control circuit board 30 that controls the operation of the semiconductor module 2, and cooling paths 40 and 40 for introducing a refrigerant into the cooling case 10 are provided. The semiconductor module 2 includes an opening 11 of the cooling case 10. -It is assembled | attached on the basis of 12 and it has a space | gap between the main-body part of the semiconductor module 2, and the cooling case 10. FIG.
[Selection] Figure 2

Description

  The present invention relates to a heat generating component cooling structure.

A power conversion device such as a DC-DC converter or an inverter includes heat-generating components such as a semiconductor element for power conversion that electrically converts power, a reactor, and a snubber capacitor. In recent years, such power conversion devices are widely known for use in generating a drive current that is applied to an electric motor that is a drive source of an electric vehicle, a hybrid vehicle, or the like. In particular, with the demand for an increase in driving force in such next-generation automobiles, there is a demand for a large current in the power conversion device.
However, heat generation from a semiconductor module including a power semiconductor element such as an IGBT (insulated gate bipolar transistor) that constitutes a power conversion circuit increases due to an increase in current. There is a strong demand for a technique for improving the cooling efficiency of these semiconductor modules so as not to exceed the heat-resistant temperature of such semiconductor modules. In addition, since the heat generation of the reactor, the snubber capacitor, and the like is similarly increased due to the increase in current, a technique for improving the cooling efficiency for such a heat generating component as a whole is required.

Patent Document 1 discloses a power conversion device that improves cooling efficiency by alternately stacking a plurality of semiconductor modules and a plurality of cooling tubes. In this power converter, grease for improving the thermal conductivity is interposed between the semiconductor module and the cooling tube, and it is necessary to compress them when they are stacked. Since the position of the external terminal of the semiconductor module is displaced during compression, a member or the like for preventing a problem caused by the position displacement is required separately, and the assemblability is poor. Furthermore, in the power conversion device as disclosed in Patent Document 1, when the semiconductor module used in the device is changed due to the use of a new semiconductor module or the improvement or development of the form of the semiconductor module, the semiconductor module It is necessary to prepare a new cooling structure according to the form, which is disadvantageous in that it is inferior in versatility.
Moreover, the semiconductor cooling structure in the conventional power conversion device can cool only from a limited surface of the semiconductor module, and it is difficult to realize high cooling efficiency.
JP 2005-143244 A

  It is an object of the present invention to provide a heat generating component cooling structure that realizes high cooling efficiency and high assemblability.

The heat generating component cooling structure according to claim 1 is a heat generating component cooling structure for cooling a heat generating component having a main body portion and an external terminal protruding from the main body portion via an insulating member,
A cooling case that houses the heat generating component and has an opening corresponding to the shape of the insulating member of the heat generating component; and a cooling path that introduces a refrigerant into the cooling case. The case is assembled with the opening of the case as a position reference, and there is a gap between the main body of the heat generating component and the cooling case.

  As described in claim 2, it is preferable that the interface between the external terminal of the heat generating component and the insulating member is disposed outside the cooling case.

  ADVANTAGE OF THE INVENTION According to this invention, the heat-emitting component cooling structure which implement | achieves high cooling efficiency and high assembly | attachment property can be provided.

Below, with reference to FIGS. 1-3, the semiconductor cooling structure 1 which is 1st embodiment of the heat-emitting component cooling structure which concerns on this invention is demonstrated. The semiconductor cooling structure 1 houses and cools power semiconductor modules 2, 2... Provided in a power converter such as an inverter or a DC-DC converter.
The semiconductor module 2 is a heat generating component that generates heat in accordance with the state of use. A power semiconductor element (power device such as IGBT, Di, MOS, etc.) is built in the main body, and a plurality of rectangular semiconductor bodies are formed from two opposing surfaces. Of the current supply external terminals (large current terminals) 3 and 3 and a plurality of control signal transmission / reception external terminals (leads) 4 and 4... Project through the insulating members 2a and 2b, respectively. is there.
Further, the insulating members 2 a and 2 b protrude from the main body portion of the semiconductor module 2.

  As shown in FIGS. 1 and 2, the semiconductor cooling structure 1 includes semiconductor modules 2, 2..., A cooling case 10, a bus bar 20, a control circuit board 30, and cooling paths 40 and 40.

The cooling case 10 is a housing that houses the semiconductor modules 2, 2... And is formed by, for example, resin molding. Depending on the form of the external terminals of the semiconductor modules 2 to be accommodated, a plurality of openings 11, 11, 12, 12,... Are provided respectively. The large current terminal 3 side of the semiconductor module 2 protrudes from the opening 11 on the one surface side, and the lead 4 side of the semiconductor module 2 protrudes from the opening 12 on the other surface side.
The protruding portion (insulating member 2a) on the large current terminal 3 side and the protruding portion (insulating member 2b) on the lead 4 side of the semiconductor module 2 are fitted into the opening 11 and the opening 12, respectively. Thereby, opening part 11 * 12 is sealed and the sealing performance in opening part 11 * 12 of the cooling case 10 is ensured.
As shown in FIG. 2, there is a gap between the main body of the semiconductor modules 2, 2... And the cooling case 10, and the entire surface (six surfaces) of the main body faces the space inside the cooling case 10. It is in the state.

A sealing material such as a sealing adhesive, an O-ring, or a molded rubber packing is provided between the openings 11 and 12 and the semiconductor module 2, or the openings 11 and 12 and the semiconductor module 2 are ultrasonically welded. It is also possible to have a configuration in which the openings 11 and 12 of the cooling case 10 are closed and the internal refrigerant is not leaked by sealing by, for example, or a combination thereof.
With such a sealing structure, the sealing property of the cooling case 10 can be secured and the reliability of the semiconductor cooling structure 1 can be improved.

2, the interface between the large current terminals 3 of the semiconductor modules 2, 2... And the insulating member 2a (more precisely, the base end of the large current terminals 3 and the end face of the insulating member 2a And the interface between the lead 4 and the insulating member 2b (more precisely, the interface between the base end portion of the lead 4 and the end surface of the insulating member 2b) are both disposed outside the cooling case 10.
This prevents moisture absorption from the interface between the insulating members 2a and 2b of the semiconductor modules 2 and 2 ..., the large current terminals 3 and 3, the leads 4 and 4 ..., and contamination inside each semiconductor module 2 -It can prevent corrosion and improve the service life. Thereby, the use reliability of semiconductor module 2 itself can be improved.

In addition, the cooling case 10 includes two body members 10a and 10b on the side where the openings 11, 11,... Are formed and the side where the openings 12, 12,. It is configured by bonding with an adhesive or the like.
As shown in FIG. 2, the first main body member 10 a is a plate-shaped member, and the second main body member 10 b is a box-shaped member having one surface opened. A flange-like joint portion facing outward is provided at the opening edge of the second body member 10b, and the body members 10a and 10b are joined to each other at the joint portion. In addition, in this junction part, main body member 10a * 10b is joined via a suitable sealing material, and the sealing performance in the cooling case 10 in the junction part of main body member 10a * 10b is fully ensured.
As shown in FIG. 3, the second body member 10 b is provided with two openings for attaching the cooling paths 40 and 40 to the cooling case 10.

  The bus bar 20 is a module that supplies current to the semiconductor modules 2, 2... And is connected to a power supply device (not shown) such as a battery. The bus bar 20 is a flat member obtained by resin-sealing a copper plate. The bus bar 20 is provided with an opening at a position corresponding to the large current terminals 3 and 3 in the semiconductor module 2, and the bus bar 20 and the large current terminals 3 and 3 are connected by inserting the large current terminal into the opening. The semiconductor module 2 can be energized.

  The control circuit board 30 is a module for controlling the operation of the semiconductor modules 2, 2... And is a flat plate member obtained by printing an appropriate electronic circuit on a board having sufficient rigidity. The control circuit board 30 is provided with openings at positions corresponding to the leads 4 in the semiconductor module 2, and the semiconductor module 2 and the control circuit board 30 are electrically connected by inserting the leads into the openings. Connected.

The cooling paths 40 and 40 are paths for supplying cooling water, which is a refrigerant for cooling the semiconductor module 2, into the cooling case 10 and discharging it from the cooling case 10. The cooling paths 40 and 40 are integrally attached to the opening of the second main body member 10b.
In this embodiment, water is used as a cooling refrigerant (for example, combined with engine cooling water of a hybrid car), but any fluid that is generally used as a cooling refrigerant can be substituted.
Further, the cooling paths 40 and 40 may be assembled separately from the cooling case 10.

According to the semiconductor cooling structure 1 configured as described above, the cooling water is introduced into the cooling case 10 through the cooling paths 40 and 40 as shown in FIGS. Cooling water can be directly brought into contact with the entire surface of the main body of 2... And high cooling efficiency can be obtained.
2, the interface between the large current terminals 3 and 3 of the semiconductor module 2 and the insulating member 2 a is disposed outside the cooling case 10, and leads 4, 4... Of the semiconductor module 2. The interface with the insulating member 2 b is disposed outside the cooling case 10. In addition, the high sealing performance of the cooling case 10 can prevent moisture absorption from the interface between the insulating members 2a, 2b of the semiconductor modules 2, 2 ... and the large current terminals 3, 3, leads 4, 4 ... The internal life of each semiconductor module 2 can be prevented and the life can be improved. Thereby, the use reliability of semiconductor module 2 itself can be improved, and the reliability of the semiconductor cooling structure 1 can be improved by extension.

  Hereinafter, a method for assembling the semiconductor cooling structure 1 will be described with reference to FIG.

The semiconductor cooling structure 1 is assembled by the following steps (1) to (5).
(1) The insulating members 2b, 2b,... On the side of the leads 4, 4,. ... insert to the middle part. At this time, the second main body member 10b and the main body of the semiconductor module 2 are inserted to such an extent that there is a gap.
(2) The positions of the openings 11, 11... Of the first main body member 10 a and the insulating members 2 a, 2 a. It fits into the first body member 10a. At this time, the first main body member 10a and the main body portion of the semiconductor module 2 are inserted to such an extent that there is a gap.
(3) The main body members 10a and 10b are joined to each other.
(4) The position of the opening of the bus bar 20 and the position of the large current terminals 3, 3,... Are matched, and the bus bar 20 is connected to the large current terminals 3, 3,. It fixes to the main body member 10a.
In this case, the semiconductor module 2 is positioned in advance with reference to the openings 12, 12... Of the second body member 10 b, and the large current terminals 3, 3. .. Are connected to the bus bar 20 and the large current terminals 3, 3..., The plurality of openings of the bus bar 20 and the plurality of semiconductor modules 2. The large current terminals 3, 3... Can be easily aligned.
(5) The control circuit board 30 is connected to the leads 4, 4... So that the positions of the openings of the control circuit board 30 and the positions of the leads 4. It fixes to the 2nd main body member 10b.
In this case, the semiconductor module 2 is preliminarily positioned with reference to the openings 11, 11... Of the first body member 10 a, and the leads 4, 4. When the control circuit board 30 and the leads 4, 4... Are connected, a plurality of openings in the control circuit board 30 and a plurality of semiconductors are connected. The leads 4 of the module 2 can be easily aligned.

As described above, when assembling the semiconductor cooling structure 1, the openings 11, 11..., 12, 12... Of the cooling case 10 serve as a reference for the assembling positions of the semiconductor modules 2, 2. The semiconductor modules 2... Can be assembled with high accuracy. As a result, the assembly | attachment property of the semiconductor cooling structure 1 can be improved.
Further, by providing in advance the position reference of the bus bar 20 and the control circuit board 30 with respect to the first main body member 10a and the second main body member 10b, respectively, the large current terminals 3, 3. Positioning and positioning of the leads 4, 4... And the control circuit board 30 can be performed with high accuracy, and a plurality of semiconductor modules 2. Can be made easier.
In the above assembling method, the joining method of the main body members 10a and 10b, the fixing method of the bus bar 20, the fixing method of the control circuit board 30, etc. are not particularly limited. It is possible to appropriately select from general joining methods such as using a fixing method, fixing method, and the like.

  Below, with reference to FIGS. 5-7, the semiconductor cooling structure 51 which is 2nd embodiment of the heat-emitting component cooling structure which concerns on this invention is demonstrated. Since the main configuration of the semiconductor cooling structure 51 is substantially the same as that of the semiconductor cooling structure 1 of the first embodiment, the description will be made paying attention to different points.

The semiconductor cooling structure 51 cools the semiconductor modules 52.
As shown in FIG. 5, the semiconductor module 52 includes a power semiconductor element in the main body, and a plurality of large current terminals 53 and 53 and a plurality of leads 54 and 54. In addition to the structure protruding through the insulating members 52a and 52b, the body portion has a through hole 55. The through-hole 55 is provided through two opposite surfaces (two surfaces on the left and right in the drawing) on which the insulating members 52a and 52b protrude (two surfaces on the upper and lower surfaces in the drawing). (Refrigerant) can pass through.

  The semiconductor modules 52, 52... Are accommodated in a cooling case 56. The cooling case 56 is a housing having an opening similar to that of the cooling case 10, and has an opening corresponding to the semiconductor module 52. The cooling case 56 is obtained by joining the two main body members 56 a and 56 b to each other in the same manner as the cooling case 10.

  As shown in FIG. 6, the cooling case 56 is provided with rectifying members 57, 57, 58, 58,... For improving the cooling efficiency of the semiconductor modules 52, 52,.

The first rectifying members 57 and 57 are plate-like members that form flow paths that guide the cooling water introduced into the cooling case 56 toward the semiconductor modules 52, 52.
In the present embodiment, the two first rectifying members 57 and 57 are provided in the vicinity of the semiconductor module 52 and 52 in the place farthest from the cooling water supply side or the discharge side. As long as it can be guided to the modules 52, 52.

The second rectifying member 58 is a plate-like member that forms a flow path that passes through the through holes 55 and 55 of the semiconductor modules 52 and 52 adjacent to each other.
The second rectifying member 58 includes rectifying plates 58a and 58a provided on the inner side surface of the first main body member 56a and rectifying plates 58b and 58b provided on the inner side surface of the second main body member 56b. The rectifying plates 58a and 58a and the rectifying plates 58b and 58b are provided in the state of being spaced apart from each other by the same distance as the through hole 55. As a result, as shown in FIG. 7, the cooling water that has passed through the through hole 55 of the semiconductor module 52 passes through the second rectifying member 58 and further passes through the through hole 55 of the adjacent downstream semiconductor module 52. .

According to the semiconductor cooling structure 51 configured as described above, the cooling water (refrigerant) can be brought into direct contact with the entire surface of the main body of the semiconductor modules 52. In addition to this, as shown in FIGS. 6 and 7, the cooling water introduced into the cooling case 56 is efficiently guided to the semiconductor modules 52, 52. The cooling water introduced into the through-hole 55 of the semiconductor module 52 is efficiently guided into the through-hole 55 of the downstream semiconductor module 52 by the second rectifying members 58, 58. Therefore, higher cooling efficiency can be obtained.
Moreover, even when there is a change in the form of the semiconductor modules 52, 52,... To be cooled as in this embodiment, the semiconductor cooling structure 51 having substantially the same configuration as that of the semiconductor cooling structure 1 according to the first embodiment is used. be able to. In this way, even when there is a change in the semiconductor module to be cooled, it is not necessary to change the overall form of the cooling structure, so that a cooling structure with excellent versatility can be provided.
In addition, since the semiconductor cooling structure 51 can be assembled by the same assembling method as the semiconductor cooling structure 1 of the first embodiment, the semiconductor modules 52, 52. High assemblability of the cooling structure 51 can be realized.

  Below, with reference to FIG.8 and FIG.9, the semiconductor cooling structure 61 which is 3rd embodiment of the heat-emitting component cooling structure which concerns on this invention is demonstrated. Since the main configuration of the semiconductor cooling structure 61 is substantially the same as that of the semiconductor cooling structure 1 of the first embodiment, the description will be made paying attention to different points.

The semiconductor cooling structure 61 cools the semiconductor modules 62.
As shown in FIG. 8, the semiconductor module 62 incorporates a power semiconductor element in the main body, and includes a plurality of large current terminals 63, 63 and a plurality of leads 64, 64, from two opposing surfaces of the rectangular main body. In addition to the structure protruding through the insulating members 62a and 62b, the insulating member 62b protrudes laterally from the main body. In other words, the semiconductor module 62 has a structure in which the outer shell of the insulating member 62b is larger than the outer shell of the main body when viewed from the lead 64 side (in the top view in the drawing).

  The semiconductor module 62 is housed in the cooling case 66. The cooling case 66 is a housing having openings 67, 67, 68, 68, etc. corresponding to the semiconductor modules 62, 62, etc., and is formed by integral molding such as resin molding. .., 68, 68... Are formed in shapes corresponding to the insulating members 62a, 62b of the semiconductor module 62, respectively.

According to the semiconductor cooling structure 61 configured as described above, as shown in FIG. 8, it is possible to cool the cooling water by directly contacting the surface (five sides) of the semiconductor modules 62, 62. High cooling efficiency can be obtained. In this case, the remaining one surface of the main body of the semiconductor modules 62, 62... Is naturally cooled outside the cooling case 66.
In addition, the cooling case 66 does not need to be divided and can contribute to the reduction of the number of parts.
The semiconductor module 62 is not limited to the structure of the present embodiment, and a semiconductor module having a through hole may be employed in the same manner as the semiconductor module 52 having the through hole 55. According to this, the cooling efficiency of the semiconductor module 62 can be further improved.

  Hereinafter, a method for assembling the semiconductor cooling structure 61 will be described with reference to FIG. Note that description will be made focusing on differences from the method of assembling the semiconductor cooling structure 1.

The method for assembling the semiconductor cooling structure 61 is characterized by a method for housing the semiconductor module 62 in the cooling case 66 as described below.
That is, the insulating member 62a of the semiconductor module 62 is inserted into the openings 67, 67... Of the cooling case 66, and the insulating member 62b of the semiconductor module 62 is inserted into the openings 68, 68. At this time, the insulating member 62b completely closes the opening 67 and is inserted to such an extent that there is a gap between the insulating member 62a and the cooling case 66, whereby the semiconductor modules 62, 62. It is stored in.

As described above, when the semiconductor cooling structure 61 is assembled, the semiconductor module 62 can be assembled to the cooling case 66 in one direction from the opening 68 side, so that higher assemblability can be realized.
Further, the semiconductor cooling structure 61 is particularly effective when emphasizing the assemblability rather than the cooling performance, for example, when the heat generation degree of the semiconductor modules 62, 62... Is relatively low.

  Below, with reference to FIG. 10, the semiconductor cooling structure 71 which is 4th embodiment of the heat-emitting component cooling structure which concerns on this invention is demonstrated. Since the main configuration of the semiconductor cooling structure 71 is substantially the same as that of the semiconductor cooling structure 1 of the first embodiment, the description will be made paying attention to different points.

The semiconductor cooling structure 71 cools the semiconductor modules 72.
As shown in FIG. 10, the semiconductor module 72 incorporates a power semiconductor element in the main body, and includes a plurality of large current terminals 73 and 73, a driving circuit, a protection circuit, a temperature detection circuit, and the like from one surface of the rectangular main body. In addition to the structure in which the second body portion containing the circuit unique to the element protrudes in one direction via the insulating member 72a and the plurality of leads 74, 74,... Protrudes from the second body portion, the insulating member 72a is the body. It has a structure that protrudes from the side. Further, the base ends of the leads 74, 74... Are projected from the tip ends of the large current terminals 73, 73.

The semiconductor module 72 is accommodated in the cooling case 76. This cooling case 76 is a housing having openings 77, 77... Corresponding to the semiconductor modules 72, 72... And is formed by integral molding such as resin molding. The openings 77, 77... Are formed in a shape corresponding to the insulating member 72a.
Further, the semiconductor module 72 has a gap between the main body portion and the cooling case 76 in a state of being housed in the cooling case 76.

According to the semiconductor cooling structure 71 configured as described above, as shown in FIG. 10, water that is a coolant can be cooled by directly contacting the surface (five sides) of the semiconductor modules 72, 72. It becomes possible and high cooling efficiency can be obtained. In this case, the remaining one surface of the main body of the semiconductor modules 72, 72... Is naturally cooled outside the cooling case 76.
In addition, the cooling case 76 does not need to be divided and can contribute to the reduction of the number of parts.
The semiconductor module 72 is not limited to the structure of the present embodiment, and a semiconductor module having a through hole may be employed in the same manner as the semiconductor module 52 having the through hole 55. According to this, the cooling efficiency of the semiconductor module 72 can be further improved.

  The assembling method of the semiconductor cooling structure 71 is essentially the same as the assembling method of the semiconductor cooling structure 61 of the third embodiment, and the semiconductor modules 72, 72. -Since it is assembled from one side, high assembly can be achieved.

  Below, with reference to FIG. 11, the semiconductor cooling structure 81 which is 5th embodiment of the heat-emitting component cooling structure of this invention is demonstrated. Since the main configuration of the semiconductor cooling structure 81 is substantially the same as that of the semiconductor cooling structure 1 of the first embodiment, the description will be made paying attention to different points.

As shown in FIG. 11, the semiconductor cooling structure 81 cools the semiconductor modules 82, 82... And the reactor 83.
The semiconductor module 82 has a structure in which a power semiconductor element is built in a main body portion, and a plurality of external terminals protrude from two opposing surfaces of the rectangular main body portion through insulating members. The reactor 83 is a passive element and is a rectangular member.
As shown in FIG. 11, the semiconductor modules 82, 82... Are arranged in an inclined state along the natural flow path of the cooling water (in the drawing, a substantially “C” shape in a top view).
In addition, the arrangement position, arrangement angle, etc. of the semiconductor modules 82, 82... Are not limited, and it is possible to appropriately select an arrangement optimal for cooling water flow resistance, cooling efficiency, control circuit board artwork, and the like. is there.

The semiconductor modules 82, 82... And the reactor 83 are accommodated in a cooling case 86. As shown in FIG. 11, the cooling case 86 has an opening at a position / shape corresponding to the semiconductor modules 82, 82... And the cooling water is optimal for the vicinity of the semiconductor modules 82. A partition member 87 and a rectifying member 88 for guiding to the center.
The partition member 87 is a plate-like member for dividing the cooling water into the semiconductor modules 82, 82... Side and the reactor 83 side, and is provided from the cooling water supply side to the discharge side.
The rectifying member 88 is a plate-like member that forms a flow path between the semiconductor modules 82 and 82, and is provided between the semiconductor module 82 and the semiconductor module 82 adjacent thereto.

According to the semiconductor cooling structure 81 configured as described above, as shown in FIG. 11, the partition member 87 allows the cooling water introduced into the cooling case 86 to be efficiently transferred to the semiconductor modules 82, 82. Since it can be divided into the reactor 83 side, high cooling efficiency can be obtained even when an irregularly shaped heat generating component is housed in the same cooling structure in addition to the semiconductor module. In addition, the rectifying member 88 can efficiently guide the cooling water introduced into the cooling case 86 to the semiconductor modules 82, 82. be able to.
In addition, although detailed description about the assembly method of the semiconductor cooling structure 81 is abbreviate | omitted, the assembly method similar to the above-mentioned embodiment can be employ | adopted, and high assembly property is ensured.
Further, the semiconductor module 82 is not limited to the structure of the present embodiment, and a semiconductor module having a through hole may be employed in the same manner as the semiconductor module 52 having the through hole 55. According to this, the cooling efficiency of the semiconductor module 82 can be further improved.

Further, according to the heat generating component cooling structure according to the present invention, a cooling structure that does not depend on heat conduction can be provided, so that a thermal resistance reducing member such as grease is not necessary, and the cooling case is formed and processed with a resin material or the like. It can be manufactured with good material and mass productivity. Thereby, the shape, size, etc. of the opening according to the present invention can be easily changed, and the cooling structure of the heat generating components such as the reactor and the snubber condenser that need to be cooled can be easily shared. In the first embodiment to the fifth embodiment, the cooling structure for cooling only the semiconductor module or the combination of the semiconductor module and the reactor is shown as the heat generating component to be cooled. However, the present invention is not limited to this, and only a reactor, only a snubber capacitor, or a combination of these with a semiconductor module may be used, and widely includes semiconductor components, electronic components, and the like that generate heat according to usage conditions.
In addition, since it is possible to provide a semiconductor module and a flow regulating member for forming a cooling water flow path in a free layout, the resistance of the refrigerant, the cooling efficiency, the artwork of the control circuit board, etc. It is possible to easily realize the optimal semiconductor module arrangement according to the requirements.
Further, the semiconductor module to be cooled by the heat generating component cooling structure according to the present invention is not limited to one type of semiconductor module as shown in the first embodiment to the fifth embodiment. Therefore, it is possible to provide a heat generating component cooling structure that is excellent in versatility, and to provide a heat generating component cooling structure that can follow improvement and development of semiconductor modules.

It is a figure which shows 1st embodiment of the heat-emitting component cooling structure which concerns on this invention. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is an exploded view which shows the assembly | attachment method of 1st embodiment of a heat-emitting component cooling structure. It is a figure which shows the semiconductor module which is the cooling object of 2nd embodiment of the heat-emitting component cooling structure which concerns on this invention. It is sectional drawing which shows 2nd embodiment of a heat-emitting component cooling structure. It is sectional drawing which shows 2nd embodiment of a heat-emitting component cooling structure. It is sectional drawing which shows 3rd embodiment of the heat-emitting component cooling structure which concerns on this invention. It is an exploded view which shows the assembly | attachment method of 3rd embodiment of a heat-emitting component cooling structure. It is sectional drawing which shows 4th embodiment of the heat-emitting component cooling structure which concerns on this invention. It is sectional drawing which shows 5th embodiment of the heat-emitting component cooling structure which concerns on this invention.

Explanation of symbols

1 Semiconductor cooling structure (heating component cooling structure)
2 Semiconductor module (heat generating component)
3 Large current terminal (external terminal)
4 Lead (external terminal)
DESCRIPTION OF SYMBOLS 10 Cooling case 11 Opening part 12 Opening part 20 Bus bar 30 Control circuit board 40 Cooling path

Claims (2)

A heat generating component cooling structure for cooling a heat generating component having a main body portion and an external terminal protruding from the main body portion through an insulating member,
A cooling case that houses the heat generating component and has an opening according to the shape of the insulating member of the heat generating component;
A cooling path for introducing a refrigerant into the cooling case,
The heat generating component cooling structure, wherein the heat generating component is assembled with the opening of the cooling case as a position reference, and a gap is provided between the main body of the heat generating component and the cooling case.   The heat generating component cooling structure according to claim 1, wherein an interface between the external terminal of the heat generating component and the insulating member is disposed outside the cooling case.

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