JP2010080416A - Memory card socket - Google Patents

Abstract

A memory card socket capable of supporting both a first memory card and a second memory card, which is realized with a simple structure while suppressing an increase in cost.
A memory card socket includes a socket body 3 into which SD memory cards MC1 and MC2 are inserted through a card insertion slot, and a base body 7 that holds contacts C3 and C11. The SD memory cards MC1 and MC2 are provided with a plurality of recesses 110 in which the first and second contact pads are disposed, and the dimensions of the recesses 110 of the SD memory card MC2 are the same as those of the SD memory card MC1. It is set to be larger than the longitudinal dimension of the place 110. On the other hand, the contact C11 protrudes from the held portion 111b held by the base body 7 in the insertion direction of the SD memory cards MC1 and MC2, and is bent in a crank shape between the contact portion 111a and the held portion 111b. A bent portion 111d is provided integrally.
[Selection] Figure 1

Description

  The present invention relates to a memory card such as an SD memory card (registered trademark) or a multimedia card (MMC) or an SDIO card (registered trademark) having the same size and terminal arrangement as the SD memory card. It relates to memory card sockets.

  Conventionally, an SD memory card is provided as a small and large-capacity memory card. Such an SD memory card is installed in a memory card socket provided in a device (hereinafter referred to as a host device) that uses the SD memory card. Installed and used.

  FIG. 13 shows a conventional SD memory card MC1, in which a non-volatile storage element such as a flash memory is housed in a rectangular plate-shaped card body 100. FIG. On one surface of the card body 100, nine contact pads P1 to P9 are arranged side by side in the short width direction on one side in the longitudinal direction. Further, a stepped portion 101 is formed on both side edges along the longitudinal direction of the card body 100, and a notched portion 102 that is inclined obliquely is formed at one corner of the front side portion. Further, on one side edge in the width direction of the card body 100, a locking recess 103 is formed to engage a lock body (not shown) provided on the memory card socket side, and on the opposite side edge, A recess 104 is provided in which the write protect switch 105 is slidably disposed. Insulating ribs 106 are formed between the contact pads P1 to P8.

  The SD memory card MC1 can be used by switching the operation mode, and the functions of the contact pads P1 to P9 can be switched according to the operation mode. In the conventional SD memory card MC1, in a mode in which data can be transferred at high speed, data transfer is performed via four contact pads, and 4-bit data transfer is possible in one clock cycle.

  Such an SD memory card MC1 is used as a storage medium of a video recording device such as a digital camera or a digital video camera, for example. Since the content to be recorded is large, when the large amount of data is recorded in real time or transferred to an external device such as a computer, the conventional SD memory card MC1 cannot be said to have a sufficiently high data transfer speed. It took a relatively long time.

  Therefore, a high-speed SD memory card MC2 having a high data transfer speed has been conventionally provided. FIG. 14 shows a high-speed SD memory card MC2. In this high-speed SD memory card MC2, contact pads P1, P2, P4, P5, P7 to P9 are provided at the same position as the conventional SD memory card MC1. Further, the front and rear direction dimensions of the contact pads P3 and P6 are shortened to shift the front end position to the rear side, and two contact pads P10 and P11 are arranged side by side at the front position of the contact pad P3. Two contact pads P12 and P13 are arranged side by side at the front position.

  The operation mode of such a high-speed SD memory card MC2 can be switched between an SD mode that performs the same operation as that of the conventional SD memory card MC1 and a high-speed mode that enables higher-speed data transfer. The functions of the contact pads P1 to P13 can be switched between the mode and the high-speed mode.

  In the high-speed mode, the contact pads P10 and P11 make a pair to transmit and receive a 1-bit differential data signal, and the contact pads P12 and P13 make a pair and transmit and receive a 1-bit differential data signal. . That is, in the SD mode described above, 4-bit data is transmitted / received using four contact pads, but in the high-speed mode, a pair of contact pads P10 and P11 and a pair of contact pads P12 and P13 are used. 2-bit data is transmitted and received. Here, the number of bits that can be transmitted in one clock cycle is smaller in the high-speed mode than in the SD mode, but the frequency of the operation clock can be set dramatically higher by transmitting / receiving differential data. High-speed data transmission can be realized compared to the mode.

  As described above, the high-speed SD memory card MC2 can transfer data at a higher speed than the conventional SD memory card MC1, but there are already many host devices that use the conventional SD memory card MC1 as a bridge medium. Has been produced. Since these host devices employ memory card sockets (hereinafter referred to as conventional sockets) corresponding to the conventional SD memory card MC1, the high-speed SD memory card MC2 is attached to the conventional socket. Therefore, it is required to enable data transfer.

  Therefore, the high-speed SD memory card MC2 is formed in the same external shape and dimensions as the conventional SD memory card MC1 except for the notch 107 provided at the front corner of the card body 100. The notch 107 is provided continuously with the first notch 108 that contacts the front surface of the card body 100 at the same position as the conventional SD memory card MC1 and the second notch 108, and is in contact with the side surface of the card body 100. And a notch 109. The second notch 109 is provided by translating the first notch 108 rearward by a distance d, and a step is provided between the first notch 108 and the second notch 109.

  Thus, in the high-speed SD memory card MC2, the first cutout portion 108 and the second cutout portion 109 having different depths are provided at the front corner of the card body 100, and the card body 100 is inserted into the memory card socket. In the conventional socket, the first notch 108 of the card body 100 collides with the slider of the memory card socket, whereas the memory card socket corresponding to the high-speed SD memory card MC2 (hereinafter referred to as the high-speed compatible type). In this case, the memory card MC2 is inserted to a deeper position when the second notch 109 of the card body 100 abuts the slider. That is, when the memory card is inserted into the conventional socket, the insertion position of the SD memory card MC2 is shallower than when the memory card is inserted into the high-speed compatible socket, and both sockets are arranged inside the socket. The position where the contact contacts the I / O contact surface can be varied.

  Therefore, in the conventional socket, the contacts arranged inside the socket do not come into contact with the contact pads P10 to P13 provided on the front side positions of the contact pads P3 and P6, and there are nine contacts as in the conventional SD memory card MC1. Only the pads P1 to P9 can be brought into contact with the contact on the socket side, and compatibility with the conventional socket can be provided.

  As described above, the high-speed SD memory card MC2 capable of high-speed transmission can be used in both a high-speed compatible socket and a conventional socket, but the conventional SD memory card MC1 is used as a high-speed compatible socket. Even when the card is inserted, it is required to be able to write or read data as in the case of mounting on a conventional socket.

Here, the corresponding contact terminals (contacts) are electrically connected according to the type of the memory card to be inserted, and unnecessary contact terminals are electrically disconnected so as to correspond to a plurality of types of memory cards. A conventional memory card socket is also provided (see, for example, Patent Document 1). By applying this technique and electrically disconnecting the four contacts for the high-speed mode, a conventional SD memory card MC1 can be obtained. A method for supporting a high-speed compatible socket is conceivable.
JP 2004-14499 A (paragraph [0006] -paragraph [0013] and FIGS. 1-7)

  However, in the above-described method, when the conventional SD memory card MC1 is inserted into the high-speed compatible socket, the four contacts for the high-speed mode are arranged in contact with the contact pads P3 and P6, respectively. There is a possibility that the signal transmission characteristic of the SD mode changes and the prescribed transfer speed is not reached.

  The present invention has been made in view of the above-mentioned problems, and an object of the present invention is a memory card socket that can be used for both the first and second memory cards, and can be simplified while suppressing an increase in cost. It is to provide a memory card socket realized with a simple structure.

  The invention of claim 1 is a memory card socket to which at least first and second memory cards are detachably connected, a socket body into which a memory card is inserted through a card insertion slot, and first and second memory cards. A plurality of first contacts that respectively contact a plurality of first contact pads provided in common to both of the two memory cards and a plurality of contacts that respectively contact a plurality of second contact pads provided only on the second memory card. And a base disposed inside the socket body, the first and second memory cards having a plurality of recesses in which the plurality of first and second contact pads are respectively disposed. The front-rear direction dimension of the recess of the second memory card is greater than the front-rear direction dimension of the recess of the first memory card. The plurality of second contacts protrude from the held portion held by the base body toward the insertion direction of the memory card, and the first memory is between the contact portion provided on the front end side and the held portion. A ride-up section is provided which rides on the rear edge of the recess of the first memory card when the card is inserted.

  According to a second aspect of the present invention, the plurality of second contacts are characterized in that rear end portions connected to the substrate are extended to the side intersecting the insertion direction of the memory card.

  According to a third aspect of the present invention, the plurality of second contacts are arranged side by side in a direction crossing the insertion direction of the memory card, and the connecting member that connects the adjacent second contacts in an insulated state is the contact portion and the held portion. It is provided between and.

  The invention according to claim 4 is characterized in that the connecting member is provided with a run-up portion.

  According to a fifth aspect of the present invention, the run-up portion of the connecting member has a plane in which the arrangement direction of the second contacts is a normal direction between at least adjacent second contacts and is equidistant from both adjacent second contacts. And a card contact portion symmetrical to the right and left.

  The invention according to claim 6 is characterized in that the connecting member is disposed closer to the contact portion than the riding-up portion.

  According to the first aspect of the present invention, when the first memory card is inserted, the corresponding second contact riding portion rides on the rear end edge of each recess provided in the memory card. Since all the second contacts can be separated from the first contact pads, it is possible to prevent deterioration of signal transmission characteristics. In addition, when the second memory card is inserted, the run-up portion of each second contact does not run on the rear edge of the corresponding recess, and each second contact is placed on the corresponding second contact pad. Since they can be brought into contact with each other, it is possible to realize a memory card socket that can accommodate both the first and second memory cards. Furthermore, since it is only necessary to provide a landing portion between the contact portion and the held portion in each second contact, a memory card socket that can accommodate both the first and second memory cards can be reduced in cost. However, there is an effect that it can be realized with a simple structure.

  In the reverse mount type memory card socket, the first and second contacts are arranged on the side opposite to the host substrate with respect to the memory card. According to the invention of claim 2, the rear end of the second contact The memory card inserted into the socket may interfere with the rear end portion even when the rear end portion is bent to the host board side. There is also an effect that a reverse mount type memory card socket can be realized.

  According to the invention of claim 3, by connecting the adjacent second contacts by the connecting member, the two contacts can be brought into contact with and separated from the corresponding contact pads in a synchronized manner. In addition, since the deflection of the tip of each contact due to the card insertion can be suppressed by the connecting member, for example, even when the distance between the contact pads on the memory card side is narrow, the first contact and the adjacent contact pad are inadvertently contacted. There is an effect that can be prevented.

  According to the invention of claim 4, since it is not necessary to provide the climbing portion on the second contact side by providing the climbing portion on the connecting member, the shape of the second contact can be simplified, and as a result, the manufacture There is an effect that it is possible to realize a memory card socket capable of supporting both the first and second memory cards while suppressing costs.

  According to the invention of claim 5, the shape of the card contact portion that contacts the memory card is at least between the adjacent second contacts, the arrangement direction of the second contacts is the normal direction, and both the adjacent second contacts Since it is formed symmetrically with respect to a plane that is equidistant from the contact, the riding-up portion does not tilt obliquely when the memory card is inserted or removed, and the synchronization accuracy between the contacts can be improved. There is an effect.

  According to the sixth aspect of the present invention, since the connecting member is disposed on the distal end side of the second contact with respect to the riding-up portion, there is an effect that the effect of suppressing the deflection of the distal end portion of the second contact by the connecting member is enhanced.

  Embodiments of a memory card socket according to the present invention will be described below with reference to the drawings. The memory card socket according to the present invention is a memory card socket compatible with both the conventional SD memory card and the high-speed SD memory card described above, and is assembled to a video recording device such as a digital camera or a digital video camera. It is used in the state where In the following description, the direction ab in FIG. 2 is the vertical direction, the direction cd is the left-right direction, and the direction ef is the front-back direction unless otherwise specified.

(Embodiment 1)
The memory card socket according to the present embodiment includes a flat rectangular box-shaped socket body 3 including a base shell 1 and a cover shell 2 and a contact block for holding a plurality of contacts C1 to C13 as shown in FIGS. 4 is disposed in the socket body 3 so as to be movable in the front-rear direction along the insertion direction of the SD memory cards MC1 and MC2, and collides with the front end side of the SD memory cards MC1 and MC2 inserted from the card insertion slot 3a. The slider 5 that moves forward together with the SD memory cards MC1 and MC2 in response to the pressing force from the SD memory cards MC1 and MC2, and the biasing spring 14 that constantly biases the slider 5 backward (to the card insertion slot 3a side) The slider 5 is locked at a predetermined position (position shown in FIGS. 4 and 5), and the SD memory cards MC1, MC2 are locked after the locking. Slider 5 subjected to any of the pushing force is provided as main components and a slider locking means to unlock when moving forward. The slider 5, the biasing spring 14 and the slider lock means are well known in the art and will not be described in detail. Here, in the present embodiment, a first memory card is configured by the conventional SD memory card MC1, and a second memory card is configured by the high-speed SD memory card MC2.

  The base shell 1 is formed, for example, by punching and bending a rectangular stainless steel plate having a very thin thickness, and bending the left and right sides downward to form a side piece 6b (the left side piece is not shown). And the lower side and the front and rear sides are open.

  A plurality of projecting pieces 9 projecting downward are formed at the front and right sides of the base shell 1, and press-fitting grooves (not shown) that open the projecting pieces 9 on the upper surface of the base body 7 of the contact block 4. The contact block 4 is press-fitted and fixed to the lower surface of the base shell 1. A plurality of through holes 11 for releasing the contacts C1 to C13 held by the contact block 4 are formed slightly behind the front end of the base shell 1, and the contacts C10 to C13 are formed behind the through holes 11. A plurality of through holes 113 for releasing the soldering terminals 111c are formed.

  Further, an L-shaped support piece 12 in a side view is projected at the left end of the rear edge of the base shell 1 so as to protrude downward from a position outside the passing position of the SD memory cards MC1 and MC2, and further to the front end of the SD shell. Is formed.

  The cover shell 2 is formed by punching and bending a rectangular stainless steel plate having a very thin thickness, and a bent piece (not shown) protruding upward from the front edge of the cover shell 2. It is bent and formed. The cover shell 2 is formed with a plurality of protruding pieces (not shown) protruding upward at a position slightly closer to the rear end than the bent piece. Thus, the cover shell 2 is placed on the lower side of the base shell 1 with the base 7 of the contact block 4 fixed to the lower surface, and the projecting piece of the cover shell 2 is provided in the base 7 of the contact block 4. The cover shell 2 is attached to the base shell 1 and the contact block 4 by press-fitting into the cover shell 2 (not shown) and welding the contact portion between the peripheral portion of the cover shell 2 and the base shell 1 by a method such as laser welding. Thus, a flat rectangular box-shaped socket body 3 having a card insertion slot 3a opened on the front surface is formed.

  The contact block 4 is disposed along the front side of the base shell 1 and the cover shell 2 as shown in FIGS. 3 to 5 and closes the front surface of the socket body 3, and both the left and right sides of the side portion 7a. It protrudes rearward from the part and is arranged in such a manner as to connect between the side parts 7b and 7c arranged along the side pieces 6b on the left and right sides of the base shell 1 and the substantially middle part in the front-rear direction of the side parts 7b and 7c. And a base 7 made of a frame-shaped resin molded product integrally formed with the side portion 7e. The side portion 7e of the base body 7 connects the portions of the side portions 7b and 7c on the base shell 1 side, and a space through which the SD memory cards MC1 and MC2 pass is provided between the side portion 7e and the cover shell 2. Yes (see FIG. 1).

  Further, the side portion 7a of the base body 9 has nine contact pads P1 to P9 (first contact pads) corresponding to and formed in parallel on the front and back surfaces of the SD memory cards MC1 and MC2, respectively. The contacts C1 to C9 (first contact) are press-fitted and fixed, and the contact side (contact portion) of each contact C1 to C9 is projected to the rear surface side (card insertion port 3a side) of the side portion 7a. Further, the side portion 7e arranged to face the side portion 7a of the base body 7 has a plurality of contact pads P10 to P13 (second contact pads) formed in parallel only on the front back surface of the SD memory card MC2. Four contacts C10 to C13 (second contacts) corresponding to the respective contacts are press-fitted and fixed, and the contact side (contact portion) of each contact C10 to C13 is protruded to the front side of the side portion 7e (memory card insertion direction). ing. That is, in the memory card socket according to the present embodiment, the contacts C1 to C9 and the contacts C10 to C13 are arranged to face each other in the memory card insertion direction (front-rear direction).

  Further, each of the contacts C10 to C13 is folded in a crank shape between a contact portion 111a provided on the distal end side and a held portion 111b held on the side portion 7e of the base body 7 as shown in FIG. A curved portion 111d is integrally provided (only the contact C11 is shown in FIG. 1). The solder terminals 112 of the contacts C1 to C9 project upward from the front surface of the side portion 7a, and the solder terminals 111c of the contacts C10 to C13 project upward from the rear surface of the side portion 7e. Note that the solder terminals 111c of the contacts C10 to C13 are arranged so as to be exposed to the outside from the corresponding through holes 113 as shown in FIGS.

  The slider 5 is made of a synthetic resin molded product, and protrudes to the right from the strip-shaped side part 5a that moves in the front-rear direction along the left edge of the SD memory cards MC1 and MC2, and the front end part (front end part) of the side part 5a. Thus, the cutout portion 102 of the card body 100 and the side portion 5b that contacts the first cutout portion 108 are integrally formed. Thus, when the conventional SD memory card MC1 is inserted into the memory card socket, the notch 102 of the SD memory card MC1 collides with the inclined surface of the side portion 5b, and the high-speed SD memory card MC2 is inserted. In this case, the first cutout portion 108 of the SD memory card MC2 collides with the inclined surface of the side portion 5b, and the slider 5 moves forward by receiving the pressing force from the SD memory cards MC1 and MC2. Become.

  Here, on one surface (back surface) of the card body 100 of the SD memory cards MC1 and MC2, eight recesses 110 are arranged on one side in the longitudinal direction (upper side in FIGS. 13 and 14) and are arranged in the short width direction. The contact pads P1 to P13 described above are disposed on the bottom surface of each recess 110 (however, the contact pads P10 to P13 are disposed only on the SD memory card MC2). The front-rear direction (vertical direction in FIG. 14) dimension L2 of each recess 110 provided in the high-speed SD memory card MC2 is larger than the front-rear direction dimension L1 of each recess 110 provided in the conventional SD memory card MC1. Large dimensions are set (L2> L1).

  Next, the contact operation when the SD memory cards MC1 and MC2 are inserted into the memory card socket of this embodiment will be described. First, when the high-speed SD memory card MC2 is inserted, the longitudinal dimension L2 of the recess 110 is set larger than the longitudinal dimension L1 of the recess 110 of the conventional SD memory card MC1 as described above. 1 (a), the bent portions 111d of the contacts C10 to C13 do not run over the rear ends of the corresponding recesses 110, and the contact portions 111a of the contacts C10 to C13 correspond to each other. The contact pads P10 to P13 to be contacted (only the contact C11 is shown in FIG. 1A). At this time, the contact portions of the contacts C1 to C9 are also in contact with the corresponding contact pads P1 to P9 (see FIG. 4).

  On the other hand, when the conventional SD memory card MC1 is inserted, as shown in FIG. 1B, the bent portions 111d of the contacts C10 to C13 ride on the rear end portions of the corresponding recesses 110, respectively. The contact portions 111a of the contacts C10 to C13 are arranged so as not to contact the contact pads P3 and P6, respectively (only the contact C11 is shown in FIG. 1B). At this time, the contact portions of the contacts C1 to C9 are in contact with the corresponding contact pads P1 to P9 (see FIG. 5). In the state in which the SD memory cards MC1 and MC2 are inserted up to a predetermined position, the leading end portions (front end portions) of both memory cards are configured to be at the same position. Here, in this embodiment, the riding-up part is comprised by the bending part 111d of each contact C10-C13.

  Thus, according to the present embodiment, when the conventional SD memory card MC1 is inserted, the corresponding contacts C10 to C13 are respectively connected to the rear end edges of the recesses 110 provided in the SD memory card MC1. Since all the contacts C10 to C13 can be separated from the contact pads P3 and P6 by riding on the bent portion 111d, it is possible to prevent deterioration of signal transmission characteristics. Further, when the high-speed SD memory card MC2 is inserted, the bent portions 111d of the contacts C10 to C13 do not ride on the rear edge of the corresponding recess 110, and the contact portions of the contacts C10 to C13 Since 111a can be brought into contact with the corresponding contact pads P10 to P13, it is possible to realize a memory card socket compatible with both conventional and high-speed SD memory cards MC1 and MC2. Further, in each of the contacts C10 to C13, it is only necessary to provide a bent portion 111d between the contact portion 111a and the held portion 111b, so that it is possible to accommodate both conventional and high-speed SD memory cards MC1 and MC2. The card socket can be realized with a simple structure while suppressing an increase in cost.

  In the present embodiment, the solder terminals 111c of the contacts C10 to C13 constituting the second contact are extended in the insertion direction of the SD memory cards MC1 and MC2, but for example, the insertion direction of the SD memory cards MC1 and MC2 Similarly, a memory card socket that can accommodate both SD memory cards MC1 and MC2 can be realized.

(Embodiment 2)
A second embodiment of the memory card socket according to the present invention will be described with reference to FIGS. In the first embodiment, the soldering terminals 111c (rear ends) of the contacts C10 to C13 are extended in the insertion direction of the SD memory cards MC1 and MC2, but in the present embodiment, the soldering terminals 111c are connected to the SD memory. It extends to the side intersecting with the insertion direction of the cards MC1 and MC2. Since the other configuration is the same as that of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

  The memory card socket according to the present invention is used by being mounted on, for example, a host substrate (not shown). As a mounting method on the host substrate, the above-described base shell 1 side is opposed to the substrate surface. There are a standard mounting method to be mounted and a reverse mounting method in which the cover shell 2 side is mounted to face the substrate surface. The memory card socket described in the first embodiment is a standard mount type socket. In this embodiment, a reverse mount type socket will be described.

  In the present embodiment, as shown in FIGS. 7 to 9, the solder terminals 111c (rear ends) of the contacts C10 to C13 (second contact) are laterally intersected with the insertion direction of the SD memory cards MC1 and MC2 (contacts). C10 and C11 extend to the left side, and contacts C12 and C13 extend to the right side. And by extending the soldering terminal 111c to the side in this way, a reverse mount type memory card socket is realized as shown in FIGS. That is, in the case where the soldering terminals 111c of the contacts C10 to C13 are extended in the insertion direction of the SD memory cards MC1 and MC2 as in the first embodiment, the soldering terminals 111c are bent to the host substrate side so as to correspond to the reverse mount type. In this case, the SD memory cards MC1 and MC2 inserted in the socket interfere with each other. However, as in the present embodiment, the soldering terminal 111c is extended to the side intersecting the insertion direction of the SD memory cards MC1 and MC2. Thus, even when the soldering terminal 111c is bent to the host substrate side, the SD memory cards MC1 and MC2 inserted into the socket do not interfere with each other, and reverse mounting is performed as shown in FIGS. 6 (a) and 6 (b). A type of memory card socket can be realized.

  Next, the contact operation when the SD memory cards MC1 and MC2 are inserted into the memory card socket of this embodiment will be described. First, when the high-speed SD memory card MC2 is inserted, as shown in FIG. 6A, the bent portions 111d of the contacts C10 to C13 do not run over the rear end portions of the corresponding recesses 110, respectively. The contact portions 111a of the contacts C10 to C13 are in contact with the corresponding contact pads P10 to P13 (only the contact C11 is shown in FIG. 6A). At this time, the contact portions of the contacts C1 to C9 are also in contact with the corresponding contact pads P1 to P9 (see FIG. 8).

  On the other hand, when the conventional SD memory card MC1 is inserted, the bent portions 111d of the contacts C10 to C13 run on the rear end portions of the corresponding recesses 110 as shown in FIG. The contact portions 111a of the contacts C10 to C13 are arranged so as not to contact the contact pads (only the contact C11 is shown in FIG. 6B). At this time, the contact portions of the contacts C1 to C9 are in contact with the corresponding contact pads P1 to P9 (see FIG. 9).

  In the first and second embodiments, the side portion 7e that holds the contacts C10 to C13 constituting the second contact is formed integrally with the side portions 7a, 7b, and 7c, but may be separate. In the first and second embodiments, the contacts C1 to C13 are press-fitted and fixed to the side portions 7a and 7e, respectively. However, for example, the contacts C11 to C13 may be simultaneously formed together with the side portions 7a and 7e.

(Embodiment 3)
A third embodiment of the memory card socket according to the present invention will be described with reference to FIGS. In the first and second embodiments, the riding portion (folded portion 111d) is bent between the contact portion 111a and the held portion 111b of the contacts C10 to C13 constituting the second contact. In the embodiment, a connecting member 114 that connects adjacent contacts C10 and C11 (or contacts C12 and C13) is provided, and each connecting member 114 is provided with a riding portion. Since the other configuration is the same as that of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

  In this embodiment, as shown in FIG. 10A, the contacts C10 to C13 are arranged in the left-right direction at a predetermined interval, and the adjacent contacts C10 and C11 (or contacts C12 and C13) are respectively connected to the connecting member 114. Are connected together. In addition, a plurality of substantially T-shaped through holes 115 are formed slightly behind the front end of the base shell 1 to allow the connecting members 114 and the corresponding contacts C10 and C11 (or contacts C12 and C13) to escape. A plurality of through holes 113 are formed behind the holes 115 to allow the soldering terminals 111c of the contacts C10 to C13 to escape.

  The connecting member 114 is, for example, a synthetic resin molded product, and includes a horizontally long substantially rectangular parallelepiped connecting portion 114a and a projecting portion 114b protruding upward from the upper surface of the connecting portion 114a as shown in FIG. It is integrally formed. Each connecting member 114 is simultaneously formed together with the above contacts, for example, with corresponding contacts C10 and C11 (or contacts C12 and C13) penetrating through the connecting portion 114a.

  Further, as shown in FIG. 10B, the protruding portion 114b of the connecting member 114 has an inclined surface 114c inclined obliquely forward and an abutting surface 114d extending forward from the front edge of the inclined surface 114c. When the SD memory card MC1 is inserted into the memory card socket, the inclined surface 114c first comes into contact with the rear edge of the corresponding recess 110 of the SD memory card MC1, and the SD memory card MC1 is moved to a predetermined position. In the inserted state, the contact surface 114d contacts the rear end edge. The inclined surface 114c and the contact surface 114d described above have the normal direction as the arrangement direction of the contacts C10 to C13 between the adjacent contacts C10 and C11 (or the contacts C12 and C13), and both the adjacent contacts C10 and C11. It is formed in a symmetrical shape with respect to a plane equidistant from the contacts C10 and C11 (or contacts C12 and C13). Here, in the present embodiment, a riding-up portion is constituted by the above-mentioned protruding portion 114b, and a card contact portion is constituted by the inclined surface 114c and the abutting surface 114d provided in the protruding portion 114b.

  Next, the contact operation when the SD memory cards MC1 and MC2 are inserted into the memory card socket of this embodiment will be described. First, in a state where the SD memory card MC1 (or SD memory card MC2) is not inserted into the memory card socket of the present embodiment, the contacts C10 to C13 constituting the second contact are as shown in FIG. It is kept horizontal (only contact C10 is shown in FIG. 11A). When the high-speed SD memory card MC2 is inserted from this state, as shown in FIG. 11 (b), the protrusion 114b of the connecting member 114 provided on each pair of contacts C10, C11 (or contacts C12, C13). Does not ride on the rear edge of the corresponding recess 110, the contact portions 111a of the respective contacts C10 to C13 elastically contact the corresponding contact pads P10 to P13 (only the contact C10 is shown in FIG. 11B). At this time, each set of contacts C10 and C11 (or contacts C12 and C13) is integrally connected by the connecting member 114, and therefore contacts the corresponding contact pads substantially simultaneously. At this time, the contact portions of the contacts C1 to C9 are also in contact with the corresponding contact pads P1 to P9 (see FIGS. 12A and 12B).

  On the other hand, when the conventional SD memory card MC1 is inserted, the inclined surface 114c of the projecting portion 114b of each connecting member 114 first comes into contact with the rear end edge of the corresponding recess 110, and then the SD memory card MC1 is set in a predetermined manner. By inserting it to the position, as shown in FIG. 11C, the contact surface 114d of the projecting portion 114b rides on the rear edge. At this time, when the contact surface 114d rides on the rear end edge, the corresponding contacts C10, C11 (or contacts C12, C13) are urged upward (downward in FIG. 11C), and each contact C10 To C13 are arranged so as not to contact the contact pads (only the contact C10 is shown in FIG. 11C). At this time, the contact portions of the contacts C1 to C9 are in contact with the corresponding contact pads P1 to P9.

  Thus, according to the present embodiment, the adjacent contacts C10, C11 (or contacts C12, C13) are integrally connected by the connecting member 114, so that both the contacts C10, C11 (or contacts C12, C13) are connected. Can be contacted and separated from the corresponding contact pads P10 and P11 (or contact pads P12 and P13) in a synchronized manner. Further, since the deflection of the tip of each of the contacts C10 to C13 due to card insertion can be suppressed by the connecting member 114, for example, even when the contact pad spacing on the SD memory card MC1 (or SD memory card MC2) side is narrow. It is possible to prevent contact C3, C6 (first contact) and the adjacent contact pads from being accidentally contacted.

  Further, by providing the protrusion 114b (climbing part) on the connecting member 114, it is not necessary to provide the riding part on the contact C10, C11 (or contact C12, C13) side, so the shapes of the contacts C10 to C13 are simplified. As a result, it is possible to realize a memory card socket that can accommodate both the SD memory cards MC1 and MC2 while suppressing the manufacturing cost. Further, in the present embodiment, the shape of the card contact portion that contacts the memory card (in this embodiment, the inclined surface 114c and the contact surface 114d) is formed between the adjacent contacts C10 and C11 (or contacts C12 and C13). Since the arrangement direction of the contacts C10 to C13 is a normal direction and is formed symmetrically with respect to a plane equidistant from both adjacent contacts C10 and C11 (or contacts C12 and C13), for example, SD When the memory card MC1 is inserted or removed, the protrusion 114b does not tilt obliquely, and the synchronization accuracy between the contacts C10 and C11 (or contacts C12 and C13) can be improved.

  In the present embodiment, the riding-up portion is provided integrally with the connecting member 114. However, for example, as in Embodiments 1 and 2, the riding-up portion is provided on each contact C10 to C13 side, and the connecting member 114 is connected to the above-described riding portion. May also be arranged on the tip side (contact point 111a side) of each of the contacts C10 to C13. In this case, the deflection of the tip of each contact C10, C11 (or contacts C12, C13) by the connecting member 114 is possible. The suppression effect can be enhanced.

  In the present embodiment, the card contact portion is configured by the inclined surface 114c and the contact surface 114d. However, the shape of the card contact portion is not limited to the present embodiment, and at least the adjacent second contact. As long as the arrangement direction of the second contacts is a normal direction and the shape is bilaterally symmetrical with respect to a plane equidistant from both adjacent second contacts, other shapes may be used.

(A) (b) is explanatory drawing explaining operation | movement of the contact at the time of inserting a memory card in the memory card socket of Embodiment 1. FIG. It is an external appearance perspective view same as the above. It is a front view of the state which removed the base shell and the cover shell from the same as the above. It is a state figure which shows the state which inserted the high-speed type | mold SD memory card in the same as the above. It is a state figure which shows the state which inserted the conventional SD memory card into the same as the above. (A) (b) is explanatory drawing explaining operation | movement of the contact at the time of inserting a memory card in the memory card socket of Embodiment 2. FIG. It is a top view of the state which removed the base shell and the cover shell from the same as the above. It is a state figure which shows the state which inserted the high-speed type | mold SD memory card in the same as the above. It is a state figure which shows the state which inserted the conventional SD memory card into the same as the above. (A) is a perspective view in a state where a cover shell is removed from the memory card socket of Embodiment 3, and (b) is a detailed view of the main part of the same. (A)-(c) is explanatory drawing explaining operation | movement of the contact at the time of inserting a memory card into the same as the above. (A) (b) is a state figure which shows the state which inserted the high-speed type | mold SD memory card in the same as the above. The conventional SD memory card used for Embodiment 1-3 is shown, (a) is the top view seen from the back side, (b) is sectional drawing seen from the left side. The high-speed type | mold SD memory card used for Embodiment 1-3 is shown, (a) is the top view seen from the back side, (b) is sectional drawing seen from the left side.

Explanation of symbols

3 Socket body 3a Card insertion slot 7 Base 110 Recess 111a Contact part 111b Held part 111d Bent part (riding part)
C1-C9 contact (first contact)
C10 to C13 contact (second contact)
MC1 SD memory card (first memory card)
MC2 SD memory card (second memory card)
P1 to P9 Contact pad (first contact pad)
P10 to P13 Contact pad (second contact pad)

Claims (6)

  A memory card socket to which at least first and second memory cards are detachably connected, a socket main body into which a memory card is inserted through a card insertion slot, and both the first and second memory cards A plurality of first contacts that respectively contact a plurality of first contact pads provided in common, and a plurality of second contacts that respectively contact a plurality of second contact pads provided only on the second memory card. And a base disposed inside the socket body, wherein the first and second memory cards have a plurality of recesses in which the plurality of first and second contact pads are respectively disposed on the front side. And the longitudinal dimension of the recess of the second memory card is greater than the longitudinal dimension of the recess of the first memory card. Each of the plurality of second contacts protrudes from the held portion held by the base body toward the insertion direction of the memory card, and between the contact portion provided on the front end side and the held portion. A memory card socket, wherein a ride-up portion is provided which rides on a rear end edge of the recess of the first memory card when the first memory card is inserted.   2. The memory card socket according to claim 1, wherein rear ends of the plurality of second contacts are connected to a side of the memory card so as to intersect a direction in which the memory card is inserted.   The plurality of second contacts are arranged side by side in a direction intersecting with the insertion direction of the memory card, and a connecting member that connects adjacent second contacts in an insulated state is between the contact portion and the held portion. The memory card socket according to claim 1, wherein the memory card socket is provided.   4. The memory card socket according to claim 3, wherein the climbing portion is provided on the connecting member.   The connection member has a running portion that is at least between the adjacent second contacts, the arrangement direction of the second contacts being a normal direction, and symmetrical with respect to a plane that is equidistant from both adjacent second contacts. 5. The memory card socket according to claim 4, further comprising a card contact portion.   4. The memory card socket according to claim 3, wherein the connecting member is disposed closer to the contact portion than the ride-up portion.

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