JP2010068061A - Surface-mounted crystal oscillator - Google Patents
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Abstract
【課題】水晶検査端子に対するプローブ(端子ピン)の電気的接続を確実にし、生産性を高めた表面実装用の発振器を提供する。
【解決手段】少なくとも一主面に凹部を有する平面視矩形状のセラミック容器1と、前記凹部に収容されて金属カバーによって密閉封入される、一主面及び他主面に励振電極8a,8bを有する水晶片3と、前記凹部に収容されたICチップ2と、前記セラミック容器1の外側面に設けられて前記水晶片3の励振電極8a,8bと電気的に接続した水晶検査端子とを備えた表面実装用の水晶発振器において、前記一主面の励振電極8aと電気的に接続した水晶検査端子7a1、7a2は前記容器本体1の二辺の外側面に形成され、前記他主面の励振電極8bと電気的に接続した水晶検査端子7b1、7b2は残りの二辺の外側面に形成された構成とする。
【選択図】図1An oscillator for surface mounting, in which electrical connection of a probe (terminal pin) to a crystal inspection terminal is ensured and productivity is improved, is provided.
A ceramic container 1 having a rectangular shape in plan view having a recess on at least one main surface, and excitation electrodes 8a and 8b accommodated in the recess and hermetically sealed by a metal cover on one main surface and the other main surface. A crystal piece 3, an IC chip 2 accommodated in the recess, and a crystal inspection terminal provided on the outer surface of the ceramic container 1 and electrically connected to the excitation electrodes 8 a and 8 b of the crystal piece 3. In the crystal oscillator for surface mounting, crystal inspection terminals 7a1 and 7a2 electrically connected to the excitation electrode 8a on the one main surface are formed on the outer side surfaces of the two sides of the container body 1, and the excitation on the other main surface is performed. The crystal inspection terminals 7b1 and 7b2 electrically connected to the electrode 8b are formed on the outer surfaces of the remaining two sides.
[Selection] Figure 1
Description
本発明は表面実装用水晶発振器(以下、表面実装発振器とする)を技術分野とし、特に、水晶振動子の振動特性(電気的特性)を検査する水晶検査端子に関する。 The present invention relates to a surface mount crystal oscillator (hereinafter referred to as a surface mount oscillator) in the technical field, and more particularly to a crystal inspection terminal for inspecting vibration characteristics (electrical characteristics) of a crystal resonator.
(発明の背景)
表面実装発振器は小型・軽量であることから、特に携帯型の電子機器に周波数や時間の基準源として内蔵される。このようなものの一つに、セラミック容器にICチップと水晶片とを収容し、セラミック容器の外側面に水晶検査端子を設けて、水晶振動子の振動特性を測定するものがある。
(Background of the Invention)
Since surface-mounted oscillators are small and lightweight, they are built in as a frequency and time reference source, especially in portable electronic devices. As one of such devices, an IC chip and a crystal piece are accommodated in a ceramic container, and a crystal inspection terminal is provided on the outer surface of the ceramic container to measure the vibration characteristics of the crystal resonator.
(従来技術の一例)
第2図は一従来例を説明する図で、同図(a)は表面実装発振器の長辺方向の断面図、同図(b)は短辺方向の側面図、同図(c)は便宜的な平面図である。
(Example of conventional technology)
FIG. 2 is a diagram for explaining a conventional example. FIG. 2A is a cross-sectional view of the surface-mounted oscillator in the long side direction, FIG. 2B is a side view of the short side direction, and FIG. FIG.
表面実装発振器はセラミック容器1にICチップ2と水晶片3とを収容し、金属カバー4を被せて密閉封入する。セラミック容器1は底壁と枠壁からなり、内壁段部を一端部に有する。セラミック容器1の内底面には図示しない回路端子を有し、内壁段部には水晶保持端子5(ab)を有する。回路端子中の水晶端子は水晶保持端子5(ab)と電気的に接続する。 The surface mount oscillator accommodates an IC chip 2 and a crystal piece 3 in a ceramic container 1 and covers a metal cover 4 so as to be hermetically sealed. The ceramic container 1 includes a bottom wall and a frame wall, and has an inner wall step at one end. The ceramic container 1 has a circuit terminal (not shown) on the inner bottom surface and a crystal holding terminal 5 (ab) on the inner wall step. The crystal terminal in the circuit terminal is electrically connected to the crystal holding terminal 5 (ab).
セラミック容器1の外底面には外周4角部に電源、出力、アース及びスタンバイ端子とした実装端子6を有し、これに対応した回路端子と電気的に接続する。そして、セラミック容器1の対向する一組の外側面例えば長辺方向の両側には水晶検査端子7(ab)を有し、水晶保持端子5(ab)と配線路11によって電気的に接続する。 On the outer bottom surface of the ceramic container 1, there are mounting terminals 6 serving as power supply, output, ground and standby terminals at the four corners of the outer periphery, and they are electrically connected to the corresponding circuit terminals. A pair of opposed outer surfaces of the ceramic container 1, for example, both sides in the long side direction, have crystal inspection terminals 7 (ab) and are electrically connected to the crystal holding terminals 5 (ab) by the wiring paths 11.
水晶検査端子7(ab)はセラミック容器1の最上位層及び最下位層を除いた中間層に窪みを設けて形成される。通常では、例えばセラミックシートの状態で電極貫通孔(スルーホール)を形成し、個々のセラミック容器1に分割することによって水晶検査端子7(ab)が形成される。 The crystal inspection terminal 7 (ab) is formed by providing depressions in the intermediate layer excluding the uppermost layer and the lowermost layer of the ceramic container 1. Usually, for example, an electrode through hole (through hole) is formed in the state of a ceramic sheet, and the crystal inspection terminal 7 (ab) is formed by dividing into individual ceramic containers 1.
ICチップ2は少なくとも発振回路を集積化して回路機能面(一主面)に図示しないIC端子を有する。ICチップ2の一主面はセラミック容器1の内底面にフリップチップボンディングによって固着され、IC端子は回路端子と電気的に接続する。 The IC chip 2 has at least an oscillation circuit integrated and has an IC terminal (not shown) on a circuit function surface (one main surface). One main surface of the IC chip 2 is fixed to the inner bottom surface of the ceramic container 1 by flip chip bonding, and the IC terminal is electrically connected to the circuit terminal.
水晶片3は一主面と他主面との両主面に励振電極8(ab)を有し、一端部両側に引出電極9(ab)を延出する。引出電極9(ab)の延出した水晶片3の一端部両側は、導電性接着剤10によって、水晶保持端子5(ab)に電気的に接続して固着される。金属カバー4はセラミック容器1の開口端面に設けられた金属リング11にシーム溶接によって接合される。 The quartz crystal piece 3 has excitation electrodes 8 (ab) on both principal surfaces of one principal surface and the other principal surface, and extends extraction electrodes 9 (ab) on both sides of one end. Both ends of one end of the crystal piece 3 from which the extraction electrode 9 (ab) extends are electrically connected and fixed to the crystal holding terminal 5 (ab) by the conductive adhesive 10. The metal cover 4 is joined to the metal ring 11 provided on the opening end surface of the ceramic container 1 by seam welding.
このようなもので、セラミック容器1における外側面の水晶検査端子7(ab)に両側からプローブの矢印で示す端子ピン12(ab)を当接(接触)し、DLD(Drive Level Dependency)特性を含む水晶振動子の電気的特性を測定する。そして、水晶振動子単独での例えばクリスタルインピーダンス(CI)等の規格を満足しないものは排除する。
(従来技術の問題点)
しかしながら、上記構成の水晶振動子の測定方法では、表面実装発振器の小型化が進行するほど(例えば2.5×2.0mm以下)、水晶検査端子7(ab)も小さくなって(例えば(0.3×0.6mm)プローブの端子ピンが当接しなくなる。例えば端子ピン12(ab)の位置決精度誤差によって、水晶検査端子7(ab)の形成された窪みに侵入せずに両側面あるいは上下面の外側面に衝突する。これらのことから、表面実装発振器の生産性が低下する問題があった。
(Problems of conventional technology)
However, in the method for measuring a crystal resonator having the above configuration, as the surface-mount oscillator is further miniaturized (for example, 2.5 × 2.0 mm or less), the crystal inspection terminal 7 (ab) is also decreased (for example, (0.3 × 0.6 mm)). ) The terminal pin of the probe does not come in contact, for example, due to the positioning accuracy error of the terminal pin 12 (ab), so that it does not penetrate into the recess where the crystal inspection terminal 7 (ab) is formed, and on both side surfaces or the outer surfaces of the upper and lower surfaces. For these reasons, the productivity of surface mount oscillators has been reduced.
(発明の目的)
本発明は水晶検査端子に対するプローブ(端子ピン)の電気的接続を確実にし、生産性を高めた表面実装発振器提供することを目的とする。
(Object of invention)
It is an object of the present invention to provide a surface mount oscillator that ensures electrical connection of a probe (terminal pin) to a crystal inspection terminal and has improved productivity.
本発明は、特許請求の範囲(請求項1)に示したように、少なくとも一主面に凹部を有する平面視矩形状のセラミック容器と、前記凹部に収容されて金属カバーによって密閉封入され、一主面及び他主面に励振電極を有する水晶片と、前記凹部又は他主面に設けられた凹部に収容されたICチップと、前記セラミック容器の外側面に設けられて前記水晶片の励振電極と電気的に接続した水晶検査端子とを備えた表面実装用の水晶発振器において、前記一主面の励振電極と電気的に接続した水晶検査端子は前記容器本体の二辺の外側面に形成され、前記他主面の励振電極と電気的に接続した水晶検査端子は残りの二辺の外側面に形成された構成とする。 According to the present invention, as shown in the claims (Claim 1), the ceramic container having a rectangular shape in a plan view having a concave portion on at least one main surface, and enclosed in the concave portion and hermetically sealed by a metal cover. A crystal piece having excitation electrodes on the main surface and the other main surface, an IC chip accommodated in the recess or the recess provided on the other main surface, and an excitation electrode of the crystal piece provided on the outer surface of the ceramic container And a crystal inspection terminal electrically connected to the crystal inspection terminal for surface mounting, wherein the crystal inspection terminal electrically connected to the excitation electrode of the one main surface is formed on the outer surface of the two sides of the container body. The crystal inspection terminals electrically connected to the excitation electrodes on the other main surface are formed on the outer surfaces of the remaining two sides.
このような構成であれば、水晶片の一主面と他主面の励振電極と電気的に接続する水晶検査端子はそれぞれ二辺の外側面に形成された2個となる。したがって、各二辺の水晶検査端子にプローブの端子ピンを当接することによって、いずれか一方の水晶検査端子が端子ピンと当接すれば励振電極とは電気的に接続する。これにより、水晶検査端子に対する端子ピンの接触確率を高められ、生産性を維持できる。 With such a configuration, there are two crystal inspection terminals that are electrically connected to the excitation electrodes on one main surface and the other main surface of the crystal piece, each formed on the outer surface of the two sides. Therefore, by contacting the terminal pin of the probe to the crystal inspection terminals on each of the two sides, if either one of the crystal inspection terminals contacts the terminal pin, the excitation electrode is electrically connected. Thereby, the contact probability of the terminal pin with respect to the crystal inspection terminal can be increased, and productivity can be maintained.
本発明の請求項2では、請求項1において、前記各二辺の外側面は角部を挟んで隣接する外側面とする。これにより、各励振電極に接続する2個の水晶検査端子の形成される外側面を明確にする。この場合、水晶検査端子に接続する配線パターンを例えば同一平面状で形成できる。 According to a second aspect of the present invention, in the first aspect, the outer surface of each of the two sides is an outer surface adjacent to each other with a corner portion interposed therebetween. This clarifies the outer surface on which two crystal inspection terminals connected to each excitation electrode are formed. In this case, the wiring pattern connected to the crystal inspection terminal can be formed in the same plane, for example.
第1図は本発明の一実施形態を説明する表面実装発振器の便宜的な平面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。 FIG. 1 is a convenient plan view of a surface mount oscillator illustrating an embodiment of the present invention. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
表面実装発振器は、前述したように、セラミック容器1の内底面にICチップ2をフリップチップボンディングによって、引出電極9(ab)の延出した水晶片3の一端部両側を内壁段部の水晶保持端子5(ab)に導電性接着剤10によって固着し、金属カバー4を接合して密閉封入する。セラミック容器1の外底面には実装端子6を有し、水晶保持端子5(ab)に電気的に接続した水晶検査端子7(ab)を外側面に有する。 As described above, the surface-mount oscillator holds the crystal of the inner wall stepped portion on both sides of one end of the crystal piece 3 from which the extraction electrode 9 (ab) extends by flip chip bonding the IC chip 2 to the inner bottom surface of the ceramic container 1. The terminal is fixed to the terminal 5 (ab) with the conductive adhesive 10, and the metal cover 4 is joined and hermetically sealed. The ceramic container 1 has a mounting terminal 6 on the outer bottom surface and a crystal inspection terminal 7 (ab) electrically connected to the crystal holding terminal 5 (ab) on the outer surface.
この実施形態での水晶検査端子7(ab)は、それぞれ、容器本体1の2辺の外側面に7(a1、a2)及び7(b1、b2)として形成され、いずれも水晶保持端子7(ab)に接続する。ここでは、一端部両側の水晶保持端子7(ab)のうちの一方7a(図の下側)は一端側の短辺及び下辺側の長辺となる外側面の水晶検査端子7(a1、7a)に配線路11によって電気的に接続する。 The crystal inspection terminals 7 (ab) in this embodiment are formed as 7 (a 1, a 2) and 7 (b 1, b 2) on the outer side surfaces of the two sides of the container body 1, respectively. ab). Here, one of the crystal holding terminals 7 (ab) on both sides of the one end portion 7a (the lower side in the figure) is a crystal inspection terminal 7 (a1, 7a on the outer side which is a short side on one end side and a long side on the lower side. Are electrically connected to each other by a wiring path 11.
また、一端部両側の水晶保持端子7(ab)のうちの他方7b(図の上側)は他端側の短辺及び上辺側の長辺となる外側面の水晶検査端子7(a1、a2)に配線路11によって電気的に接続する。各配線路11は例えば同一平面となる積層面を経て、水晶検査端子7(a1、a2)に接続する。要するに、水晶検査端子7(a1、a2)及び7(b1、b2)は一組の対角部の角部を挟んだ二辺の外側面の形成される。 The other of the crystal holding terminals 7 (ab) on both sides of the one end portion 7b (upper side in the figure) is a crystal inspection terminal 7 (a1, a2) on the outer side which is the short side on the other end side and the long side on the upper side. Are electrically connected to each other by a wiring path 11. Each wiring path 11 is connected to the crystal inspection terminal 7 (a1, a2) through, for example, a laminated surface that is the same plane. In short, the crystal inspection terminals 7 (a 1, a 2) and 7 (b 1, b 2) are formed on the outer sides of the two sides sandwiching the corners of a pair of diagonal parts.
そして、水晶検査端子7(a1、a2)には一方の同極となるプローブの端子ピン12(a1、a2)が当接し、水晶検査端子7(b1、b2)には他方の同極となる同端子ピン12(b1、b2)が電気的に接続して、水晶振動子の例えばDLD特性を含む電気的特性を検査する。 Then, the terminal pins 12 (a1, a2) of one of the probes having the same polarity are in contact with the crystal inspection terminals 7 (a1, a2), and the other polarity of the crystal inspection terminals 7 (b1, b2). The terminal pins 12 (b1, b2) are electrically connected to inspect the electrical characteristics including, for example, the DLD characteristics of the crystal resonator.
このような構成であれば、各二辺の外側面に水晶検査端子7(a1、a2)及び7(b1、b2)を形成するので、これに当接する端子ピン12(a1、a2)及び12(b1、b2)の各一方が当接すれば、水晶振動子の電気的特性を測定できる。したがって、従来例に比較して、プローブの端子ピン12(a1、a2)及び7(b1、b2)が水晶検査端子7(a1、a2)及び7(b1、b2)に当接する確率が高められる。これにより、表面実装発振器の生産性を高められる。 In such a configuration, since the crystal inspection terminals 7 (a1, a2) and 7 (b1, b2) are formed on the outer side surfaces of the two sides, the terminal pins 12 (a1, a2) and 12 abutting on the terminals are formed. If one of (b1, b2) contacts, the electrical characteristics of the crystal resonator can be measured. Therefore, the probability that the terminal pins 12 (a1, a2) and 7 (b1, b2) of the probe come into contact with the crystal inspection terminals 7 (a1, a2) and 7 (b1, b2) is increased as compared with the conventional example. . Thereby, the productivity of the surface mount oscillator can be increased.
また、この例では、水晶検査端子7(a1、a2)及び7(b1、b2)は角部を挟んだ両外側面に形成されるので、配線路11を同一平面上に形成して配線できて製造を容易にする。水晶検査端子7(a1、a2)及び7(b1、b2)を対向する外側面に形成した場合は各配線路11同士が交差するので、同一平面上での配線は困難になる。但し、ビアホール等によって多層面を使用すれば可能になるので、本発明ではこれらを排除しない。 Further, in this example, since the crystal inspection terminals 7 (a1, a2) and 7 (b1, b2) are formed on both outer surfaces sandwiching the corner portions, the wiring path 11 can be formed on the same plane and wired. Making it easier to manufacture. When the crystal inspection terminals 7 (a1, a2) and 7 (b1, b2) are formed on the opposite outer surfaces, the wiring paths 11 intersect with each other, so that wiring on the same plane becomes difficult. However, since it becomes possible if a multilayer surface is used by a via hole etc., these are not excluded in this invention.
(他の事項)
上記実施形態では表面実装発振器は一主面に凹部を有するセラミック容器としたが、両主面に凹部を有して一主面の凹部には水晶片3を、他主面の凹部にはICチップ2を収容して構成した場合でも同様に適用できる。また、水晶片3は一端部両側に引出電極9(ab)を延出したが水晶片3の両端部に延出して同部を保持(固着)した場合でも同様である。
(Other matters)
In the above embodiment, the surface mount oscillator is a ceramic container having a concave portion on one main surface, but has a concave portion on both main surfaces, a crystal piece 3 in the concave portion on one main surface, and an IC in the concave portion on the other main surface. The same applies to the case where the chip 2 is accommodated. Further, the crystal piece 3 has the extraction electrode 9 (ab) extended on both sides of one end portion, but the same applies to the case where the crystal piece 3 extends to both end portions of the crystal piece 3 and holds (fixes) the same portion.
1 セラミック容器、2 ICチップ、3 水晶片、4 金属カバー、5 水晶保持端子、6 実装端子、7 水晶検査端子、8 励振電極、9 引出電極、10 導電性接着剤、11 金属リング、12 端子ピン。 DESCRIPTION OF SYMBOLS 1 Ceramic container, 2 IC chip, 3 Crystal piece, 4 Metal cover, 5 Crystal holding terminal, 6 Mounting terminal, 7 Crystal inspection terminal, 8 Excitation electrode, 9 Lead electrode, 10 Conductive adhesive, 11 Metal ring, 12 Terminal pin.
Claims (2)
前記凹部に収容されて金属カバーによって密閉封入され、一主面及び他主面に励振電極を有する水晶片と、
前記凹部又は他主面に設けられた凹部に収容されたICチップと、
前記セラミック容器の外側面に設けられて前記水晶片の励振電極と電気的に接続した水晶検査端子とを備えた表面実装用の水晶発振器において、
前記一主面の励振電極と電気的に接続した水晶検査端子は前記容器本体の二辺の外側面に形成され、
前記他主面の励振電極と電気的に接続した水晶検査端子は残りの二辺の外側面に形成された表面実装用の水晶発振器。 A rectangular ceramic container in a plan view having a recess on at least one main surface;
A crystal piece housed in the recess and hermetically sealed by a metal cover, and having excitation electrodes on one main surface and the other main surface;
An IC chip accommodated in the recess or the recess provided in the other main surface;
In a crystal oscillator for surface mounting comprising a crystal inspection terminal provided on the outer surface of the ceramic container and electrically connected to the excitation electrode of the crystal piece,
The crystal inspection terminal electrically connected to the excitation electrode of the one main surface is formed on the outer side surfaces of the two sides of the container body,
A crystal oscillator for surface mounting, wherein the crystal inspection terminals electrically connected to the excitation electrodes on the other main surface are formed on the outer surfaces of the remaining two sides.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104104358A (en) * | 2013-04-12 | 2014-10-15 | 精工爱普生株式会社 | Circuit substrate, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object |
| JP2015053536A (en) * | 2013-09-05 | 2015-03-19 | 日本電波工業株式会社 | Electronic components and electronic component packages |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104104358A (en) * | 2013-04-12 | 2014-10-15 | 精工爱普生株式会社 | Circuit substrate, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object |
| US9363895B2 (en) | 2013-04-12 | 2016-06-07 | Seiko Epson Corporation | Circuit substrate, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object |
| CN104104358B (en) * | 2013-04-12 | 2018-12-28 | 精工爱普生株式会社 | Circuit substrate, electronic device and its manufacturing method, electronic equipment and moving body |
| JP2015053536A (en) * | 2013-09-05 | 2015-03-19 | 日本電波工業株式会社 | Electronic components and electronic component packages |
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