JP2010063081A - Rfid antenna and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RFID antenna and a method of manufacturing the same in which costs can be reduced, by electrically connecting an inner substrate area and an outer substrate area over a loop pattern, even on a single-sided printed circuit board, without having to separately provide any jumper. <P>SOLUTION: On a single-sided FPC 10, an opening 21 in a predetermined shape is provided, a fold 23 is formed, and a second bonding pad 19 is positioned at a tip portion of the fold 23. The opening 21 surrounds the second bonding pad 19 in a U shape. The fold 23 is folded so as to have a first bonding pad 18 and the second bonding pad 19 against each other. In such a state, the first and second bonding pads 18 and 19 are electrically bonded to each other by e.g., soldering. Consequently, an inner substrate area and an outer substrate area are electrically connected straddling a loop pattern 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an RFID antenna (RFID) formed on a single-sided printed board such as a single-sided flexible printed board or a single-sided hard printed board, and a method for manufacturing the same.

  In recent years, wireless communication systems using RFID technology have attracted attention. This communication system is generally composed of a data carrier capable of storing various data and a reader / writer that reads and writes (reads / writes) information without contact with the data carrier. A data carrier is called an RFID tag (wireless IC tag) or a non-contact IC card according to its shape, size, etc. (hereinafter collectively referred to as a “non-contact IC card”), and recently a cellular phone. More and more cases are built in. Radio frequency bands used for this non-contact IC card include a band of 135 kHz or less, a 13.56 MHz band, a 2.45 GHz band, and the like. This non-contact IC card has been used for various entry / exit management such as an automatic ticket gate for transportation recently because it is easy for users to handle. In addition, applications to electronic money and article management are also being studied.

These non-contact IC cards and reader / writers generally have a built-in loop antenna (antenna coil), and supply electric power to the non-contact IC card by electromagnetic induction via a magnetic field generated by the reader / writer antenna. Read / write data to / from the card. Here, in order to adjust the resonance frequency of the antenna of the non-contact IC card and the reader / writer, it has been conventionally performed to provide a capacitor in parallel with the antenna coil (see, for example, Patent Document 1 or 2 below).
JP 2003-224415 A JP 2005-259153 A

When a surface mount type chip capacitor is provided in parallel with the antenna coil for resonance frequency adjustment, the inner and outer substrate regions are electrically connected across the loop pattern forming the antenna coil for the convenience of wiring. There is a need to. For this reason, in Patent Document 1, as shown in FIG. 10, by forming a wiring pattern on the back surface of the substrate, the inner substrate region and the outer substrate region are electrically connected across the loop pattern. Yes. Alternatively, as in Patent Document 3 below, a jumper is separately provided to electrically connect the inner substrate region and the outer substrate region across the loop pattern.
JP 2002-358491 A

  It should be noted that electrically connecting the inner substrate region and the outer substrate region across the loop pattern is not limited to the case where a surface mount type chip capacitor is provided for adjusting the resonance frequency, and the loop pattern is formed. This is necessary when both the two contacts must be provided inside or outside the loop pattern for convenience of wiring, such as when the board is inserted into a connector, for example.

  When the wiring pattern is formed on the back surface of the substrate as in Patent Document 1 or 2 in order to electrically connect the inner substrate region and the outer substrate region across the loop pattern, it is necessary to use a double-sided substrate. There is a high cost. Further, when a jumper is separately provided as in Patent Document 3, the number of parts increases and the cost increases.

  The present invention has been made in view of such a situation, and the purpose of the present invention is to cover the inner and outer substrate regions across the loop pattern even for single-sided printed boards such as single-sided flexible printed boards and single-sided rigid printed boards. An object of the present invention is to provide an RFID antenna and a method for manufacturing the same that can reduce the cost by making it possible to electrically connect the substrate region without providing a jumper.

The first aspect of the present invention is an RFID antenna. This RFID antenna is
A single-sided flexible printed board on which a loop pattern, first and second connection terminal portions located on either the inside or the outside of the loop pattern, and first and second bonding pads are formed. ,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. Connected to the terminal portion, the single-sided flexible printed board is provided with a predetermined shape of cut or opening to form a bent piece, and one of the first and second bonding pads is located on the bent piece. The bent piece is bent so that the first bonding pad and the second bonding pad are in contact with each other, and the first and second bonding pads are electrically connected to each other. .

  In the RFID antenna according to the first aspect, the notch or the opening may be provided so as to surround one of the first and second bonding pads in a U shape or a U shape.

  In the RFID antenna according to the first aspect, the first and second preliminary bonding pads are provided on either the inner side or the outer side of the loop pattern so as to be separately located on both sides of the bent position of the bent piece. Preferably, the first and second preliminary bonding pads are electrically connected to each other to form a connection path that does not pass through the bending position.

In the RFID antenna of the first aspect,
The single-sided flexible printed circuit board has first and second positioning holes in the vicinity of the first and second bonding pads so as to have a predetermined positional relationship with each of the first and second bonding pads. Provided in
The bent piece may be bent so that the positions of the first and second positioning holes coincide.

The second aspect of the present invention is also an RFID antenna. This RFID antenna is
A single-sided flexible printed board on which a loop pattern, first and second connection terminal portions located on either the inside or the outside of the loop pattern, and first and second bonding pads are formed. ,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. The one-side flexible printed circuit board connected to the terminal portion has an extension piece partially extending from the outer periphery, and one of the first and second bonding pads is located on the extension piece, and the extension piece is The first bonding pad and the second bonding pad are bent so as to contact each other, and the first and second bonding pads are electrically bonded to each other.

  In the RFID antenna of the second aspect, first and second pre-joining pads are formed outside the loop pattern so as to be located on both sides of the bending position of the extension piece, and the first and second The second preliminary bonding pads may be electrically bonded to each other, and a connection path that does not pass through the bending position may be formed.

In the RFID antenna of the second aspect,
The single-sided flexible printed circuit board has first and second positioning holes in the vicinity of the first and second bonding pads so as to have a predetermined positional relationship with each of the first and second bonding pads. Provided in
The extension piece may be bent so that the positions of the first and second positioning holes coincide.

The third aspect of the present invention is also an RFID antenna. This RFID antenna is
A loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed, and the third and fourth pads are formed. Including a single-sided printed circuit board in which a part including the position of the bonding pad is cut out to be a cut piece;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. Connected to the terminal portion, the third bonding pad and the fourth bonding pad are connected in the cut piece,
The cut piece is positioned such that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other; The first and third bonding pads are electrically bonded to each other, and the second and fourth bonding pads are electrically bonded to each other.

The fourth aspect of the present invention is also an RFID antenna. This RFID antenna is
A single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece connected to the terminal portion and having a cut or opening of a predetermined shape on the single-sided printed board to be cut off is formed, and the third and fourth bonding pads are located on the cut piece. Are connected to each other.

  In the RFID antenna according to the fourth aspect, the distance between the first and second bonding pads and the distance between the third and fourth bonding pads may be substantially equal.

  In the RFID antenna according to the first to fourth aspects, a resonance frequency adjusting capacitor may be provided between the first and second connection terminal portions.

A fifth aspect of the present invention is a method for manufacturing an RFID antenna. This method
Using a single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inside or the outside of the loop pattern, and first to fourth bonding pads are formed, A method of manufacturing an RFID antenna,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece connected to the terminal portion and provided with a cut or opening of a predetermined shape on the single-sided printed circuit board is formed, and the third and fourth bonding pads are located on the cut piece. Connected to each other,
This method
Cutting the cut piece from the single-sided printed circuit board;
The cut piece is disposed so that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other. And electrically bonding the first and third bonding pads to each other and electrically bonding the second and fourth bonding pads to each other.

  It should be noted that any combination of the above-described constituent elements, and those obtained by converting the expression of the present invention between methods and systems are also effective as aspects of the present invention.

  According to the first aspect of the present invention, a single-sided flexible printed circuit board is provided with a predetermined shape of cut or opening to form a bent piece, and the bent piece is used for the first bonding pad and the second bonding. Since the first and second bonding pads are electrically bonded to each other so that the pads are in contact with each other, the inner substrate region straddling the loop pattern even on a single-sided flexible printed circuit board Can be electrically connected to the outer substrate region without providing a separate jumper, and the cost can be reduced.

  According to the second aspect of the present invention, the single-sided flexible printed circuit board has the extension piece partially extending from the outer periphery, and the extension piece comes into contact with the first bonding pad and the second bonding pad. Since the first and second bonding pads are electrically connected to each other, even in the case of a single-sided flexible printed circuit board, the inner substrate region and the outer substrate region straddle the loop pattern. Can be electrically connected without providing a separate jumper, and the cost can be reduced.

  According to the third aspect of the present invention, a part of the single-sided printed circuit board is cut into a cut piece, and the third bonding pad and the fourth bonding pad are connected to each other in the cut piece. The cut piece is positioned so that the second bonding pad and the fourth bonding pad are in contact with each other, and the first bonding pad and the third bonding pad are in contact with each other. 3 bonding pads are electrically bonded to each other, and the second and fourth bonding pads are electrically bonded to each other. The substrate region and the outer substrate region can be electrically connected without providing a separate jumper, and the cost can be reduced.

  According to the fourth aspect of the present invention, the single-sided printed board is provided with a cut or opening having a predetermined shape so as to be freely cut, and the third and fourth bonding pads are the cut pieces. Since the cut pieces are cut out and passed between the first and second bonding pads, the board area inside the loop pattern is straddled even if it is a single-sided printed board. Can be electrically connected to the outer substrate region without providing a separate jumper, and the cost can be reduced.

  According to the fifth aspect of the present invention, the third and fourth bonding pads are connected to each other in the cut piece that is provided with a predetermined shape of cut or opening in the single-sided printed board. Therefore, the step of cutting the cut piece from the single-sided printed board, the first bonding pad and the third bonding pad abut, and the second bonding pad and the fourth bonding pad, Arranging the cut pieces so as to contact each other, electrically joining the first and third joining pads to each other, and electrically joining the second and fourth joining pads to each other. Thus, even on a single-sided printed board, it is possible to electrically connect the inner board area and the outer board area across the loop pattern without providing a separate jumper, thereby reducing costs. That.

It is an exemplary schematic perspective view showing the configuration of the RFID antenna according to the first embodiment of the present invention, where (A) is an incomplete state before bending, and (B) is a completed state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 2nd Embodiment of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 3rd Embodiment of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 4th Embodiment of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna based on the 5th Embodiment of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 6th Embodiment of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna based on the 7th Embodiment of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 8th Embodiment of this invention, (A) is the incomplete state before cutting, (B) is the completion state after cutting. The schematic perspective view which shows another example of the formation position of a cut piece regarding the embodiment. The schematic perspective view which shows the structure of the conventional RFID antenna.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

(First embodiment)
1A and 1B are exemplary schematic perspective views showing the configuration of an RFID antenna 100 according to a first embodiment of the present invention. 1A shows an incomplete state before bending, and FIG. 1B shows a completed state after bending.

  The RFID antenna 100 includes a loop pattern 12 forming an antenna main body portion, a first connection terminal portion 14, a second connection terminal portion 16, a first bonding pad 18, and a second bonding terminal. A single-sided FPC 10 (single-sided flexible printed circuit; FPC: Flexible Printed Circuit) on which pads 19 are formed is provided, and a chip capacitor 13 is mounted on the single-sided FPC 10.

  The loop pattern 12 is a conductor pattern made of, for example, copper, a pad (not shown) for mounting the chip capacitor 13 inside the loop pattern 12, first and second connection terminal portions 14 and 16, A second bonding pad 19 (before bending) is formed, and a first bonding pad 18 is formed outside the loop pattern 12. The surface of the single-sided FPC 10 is entirely covered and insulated with a cover film such as polyimide, and the first and second connection terminal portions 14 and 16 and the first and second bonding pads 18 and 19 are formed. Only a portion of the conductor (eg, copper foil) is exposed.

  A plurality of (for example, three) chip capacitors 13 are provided in parallel between the first and second connection terminal portions 14 and 16 in order to adjust the resonance frequency of the RFID antenna 100 to, for example, around 13.56 MHz. . If necessary, the resonance frequency can be adjusted afterwards by cutting the wiring patterns at both ends of the predetermined number of chip capacitors 13. One end (inner end portion) of the loop pattern 12 is connected to the first connecting terminal portion 14, and the other end (outer end portion) of the loop pattern 12 is connected to the first bonding pad 18. The bonding pad 19 is connected to the second connection terminal portion 16.

  The single-sided FPC 10 is provided with an opening 21 having a predetermined shape to form a bent piece 23, and the second bonding pad 19 is preferably located at the tip of the bent piece 23. The opening 21 preferably surrounds the second bonding pad 19 in a U shape or a U shape. The bent piece 23 is bent so that the first bonding pad 18 and the second bonding pad 19 come into contact with each other. In this state, the first and second bonding pads 18 and 19 are electrically bonded to each other by, for example, soldering, thermocompression bonding (welding by spot heating), or a conductive adhesive. As a result, the inner substrate region and the outer substrate region are electrically connected across the loop pattern 12.

  Thus, according to the present embodiment, in order to electrically connect the inner substrate region and the outer substrate region across the loop pattern 12, the wiring pattern is formed on the back surface of the substrate as in Patent Document 1 or 2. It is not necessary to form a jumper, and it is not necessary to separately provide a jumper as in Patent Document 3. That is, even in the case of single-sided FPC, it is possible to electrically connect the inner substrate region and the outer substrate region across the loop pattern without separately providing a jumper, thereby reducing the cost.

(Second Embodiment)
2A and 2B are exemplary schematic perspective views showing the configuration of the RFID antenna 200 according to the second embodiment of the present invention. 2A shows an incomplete state before bending, and FIG. 2B shows a completed state after bending. Compared with the RFID antenna 100 of the first embodiment, the RFID antenna 200 of the present embodiment is provided with a notch 22 in the single-sided FPC 10 instead of the opening 21 in order to form the bent piece 23. Are different in other points, and are identical in other points. This embodiment also has the same effect as the first embodiment.

(Third embodiment)
3A and 3B are exemplary schematic perspective views showing the configuration of an RFID antenna 300 according to the third embodiment of the present invention. 3A shows an unfinished state before bending, and FIG. 3B shows a completed state after bending. In the RFID antenna 300 of the present embodiment, in addition to the configuration of the RFID antenna 100 of the first embodiment, a first preliminary bonding pad 38 and a second preliminary bonding pad 39 are bent pieces 23. Are formed on the inner side of the loop pattern 12 (on the pattern connecting the second connection terminal portion 16 and the second bonding pad 19) so as to be divided and positioned on both sides of the first and second bending positions. Two preliminary bonding pads 38 and 39 are electrically bonded to each other. As a result, the first and second bonding pads 18 and 19 and the inner side of the loop pattern 12 (second connection terminal portion 16) are connected via the first and second preliminary bonding pads 38 and 39. (That is, a path connecting both sides of the folding position without passing through the folding position is formed). The second preliminary bonding pad 39 is preferably located at the base of the bent piece 23.

  Although the conductor pattern may be broken at the bent position of the bent piece 23, according to the present embodiment, the first and second bonding pads 18 and 19 and the substrate region inside the loop pattern 12 ( Since the second connection terminal portion 16) is connected via the first and second preliminary bonding pads 38 and 39, even if the conductor pattern is disconnected at the bending position of the single-sided FPC 10, the first Electrical connection between the first and second bonding pads 18 and 19 and the substrate region (second connection terminal portion 16) inside the loop pattern 12 is ensured. Therefore, according to the present embodiment, in addition to the effects of the first embodiment, it is possible to expect a decrease in the defective product occurrence rate. In the second embodiment described above, similar effects can be further achieved by forming the first and second preliminary bonding pads 38 and 39 as in the present embodiment.

(Fourth embodiment)
4A and 4B are exemplary schematic perspective views showing the configuration of an RFID antenna 400 according to the fourth embodiment of the present invention. 4A shows an unfinished state before bending, and FIG. 4B shows a completed state after bending. Compared to the RFID antenna 100 of the first embodiment, the RFID antenna 400 of the present embodiment has a single-sided FPC 10 that partially extends from the outer periphery with a predetermined width instead of the bent piece 23 (projects). The first joining pad 18 is preferably located at the distal end of the extension piece 41 so that the first joining pad 18 and the second joining pad 19 come into contact with each other. The difference is that the extension piece 41 is bent, and the other points coincide. This embodiment also has the same effect as the first embodiment. In the case of the present embodiment, the cost of the extension piece 41 is disadvantageous compared to the first embodiment, but the area of the loop pattern 12 can be increased, so that performance is improved. Then it becomes advantageous.

(Fifth embodiment)
5A and 5B are exemplary schematic perspective views showing the configuration of an RFID antenna 500 according to the fifth embodiment of the present invention. 5A shows an incomplete state before bending, and FIG. 5B shows a completed state after bending. The RFID antenna 500 according to the present embodiment includes a first preliminary bonding pad 58 and a second preliminary bonding pad 59 in addition to the configuration of the RFID antenna 400 according to the fourth embodiment. The first and second preliminary bonding pads 58 and 59 are electrically connected to each other, and are formed outside the loop pattern 12 so as to be separately located on both sides of the bending position. As a result, the first and second bonding pads 18 and 19 are connected to the substrate region outside the loop pattern 12 via the first and second preliminary bonding pads 58 and 59 (that is, the bending position). A path that connects both sides of the folding position without passing through is formed). The first preliminary bonding pad 58 is preferably located at the base of the extension piece 41.

  According to the present embodiment, the same effects as in the fourth embodiment can be obtained, and the first and second bonding pads 18 and 19 and the outside of the loop pattern 12 can be obtained in the same manner as in the third embodiment. Are connected to each other through the first and second preliminary bonding pads 58 and 59, so that even if the conductor pattern is disconnected at the bending position of the single-sided FPC 10, the first and second bonding regions are used. Electrical connection between the pads 18 and 19 and the substrate region outside the loop pattern 12 is ensured, and a reduction in the defective product generation rate can be expected.

(Sixth embodiment)
FIGS. 6A and 6B are exemplary schematic perspective views showing the configuration of an RFID antenna 600 according to the sixth embodiment of the present invention. 6A shows an unfinished state before folding, and FIG. 6B shows a completed state after bending. In addition to the configuration of the RFID antenna 200 of the second embodiment, the RFID antenna 600 of the present embodiment has a predetermined positional relationship with each of the first and second bonding pads 18 and 19. First and second positioning holes 61 and 62 (through holes) are provided in the vicinity of the first and second bonding pads 18 and 19, respectively, and the positions of the first and second positioning holes 61 and 62 coincide with each other. The bent piece 23 is bent so as to.

  According to the present embodiment, in addition to the effects of the second embodiment, the first and second positioning holes 61 and 62 are provided, so that the bent piece 23 is folded and the first and second positioning holes are bent. Positioning when the bonding pads 18 and 19 are bonded can be surely and easily performed, for example, by inserting a pin or visually, and it is easy to improve reliability. In the first embodiment described above, the same effect can be further achieved by forming the first and second positioning holes 61 and 62 as in the present embodiment.

(Seventh embodiment)
FIGS. 7A and 7B are exemplary schematic perspective views showing the configuration of the RFID antenna 700 according to the seventh embodiment of the present invention. 7A shows an incomplete state before folding, and FIG. 7B shows a completed state after bending. In addition to the configuration of the RFID antenna 400 of the fourth embodiment, the RFID antenna 700 of the present embodiment has a predetermined positional relationship with each of the first and second bonding pads 18 and 19. First and second positioning holes 71 and 72 (through holes) are provided in the vicinity of the first and second bonding pads 18 and 19, respectively, and the positions of the first and second positioning holes 71 and 72 coincide with each other. Thus, the extension piece 41 is bent.

  According to the present embodiment, in addition to the effects of the fourth embodiment, the first and second positioning holes 71 and 72 are provided as in the sixth embodiment, so that the extension piece 41 is Positioning when the first and second bonding pads 18 and 19 are bent and bonded can be surely and easily performed, for example, by inserting a pin or visually, and the reliability can be easily improved.

(Eighth embodiment)
FIGS. 8A and 8B are exemplary schematic perspective views showing the configuration of an RFID antenna 800 according to the eighth embodiment of the present invention. 8A shows an incomplete state before cutting, and FIG. 8B shows a completed state after cutting.

  Compared with the RFID antenna 100 of the first embodiment, the RFID antenna 800 of the present embodiment is provided with an opening 85 having a predetermined shape as shown in FIG. The point where the cut piece 81 is formed, the point where the third and fourth bonding pads 83 and 84 are formed on the cut piece 81 (on the single-sided FPC 10) and are connected to each other, and FIG. The difference is that the first and second bonding pads 18 and 19 are connected to each other by the cut piece 81 cut out as in B), and the other points coincide. The distance between the first and second bonding pads 18 and 19 and the distance between the third and fourth bonding pads 83 and 84 are preferably substantially equal.

  As shown in FIG. 8A, the opening 85 has a shape surrounding the third and fourth bonding pads 83 and 84 except for the thin connecting portion 87. Instead of the opening 85, a narrow cut may be provided. Moreover, the formation position of the cut piece 81 is arbitrary, and for example, it may be formed as shown in FIG. By cutting the connecting portion 87, the cut piece 81 can be easily cut with a cutter, for example. As shown in FIG. 5B, the cut piece 81 cut out is in contact with the first bonding pad 18 and the third bonding pad 83, and the second bonding pad 19 and the fourth bonding pad. It arrange | positions so that the pad 84 may contact | abut. In this state, the first and third bonding pads 18 and 83 are electrically bonded to each other, and the second and fourth bonding pads 19 and 84 are electrically bonded to each other. This embodiment also has the same effect as the first embodiment.

  In the present embodiment, a single-sided hard printed board may be used instead of the single-sided FPC 10. As the single-sided rigid printed board, for example, a glass epoxy board (material: FR4 or the like) is suitable. A single-sided hard printed board cannot be bent like a single-sided FPC, but in this embodiment, the board does not need to be bent, and thus a single-sided hard printed board can be used. That is, the technique of the present embodiment can be widely applied when a single-sided printed board such as a single-sided FPC or a single-sided hard printed board is used.

  The present invention has been described above by taking the embodiment as an example. However, it will be understood by those skilled in the art that various modifications can be made to each component of the embodiment within the scope of the claims. Hereinafter, modifications will be described.

  In any embodiment, the chip capacitor 13, the first and second connection terminal portions 14 and 16, and the second bonding pad 19 are provided inside the loop pattern 12, and the outside of the loop pattern 12. In the modification, the chip capacitor 13, the first and second connection terminal portions 14, 16, and the first connection pads 18 are formed outside the loop pattern 12. Two bonding pads 19 may be provided, and the first bonding pad 18 may be formed inside the loop pattern 12.

  In any of the embodiments, the case where the chip capacitor 13 is provided for adjusting the resonance frequency has been described. However, it is not necessary to provide the chip capacitor 13 if the adjustment of the resonance frequency is unnecessary. Even in this case, the present embodiment is effective as long as it is necessary to electrically connect the inner substrate region and the outer substrate region across the loop pattern 12.

  In the first embodiment, the opening 21 is provided so as to surround the second bonding pad 19 in a U-shape or U-shape, and the bent piece 23 is formed. However, in the modification, the first bonding pad is used. A bent piece may be formed by providing an opening so as to surround 18 in a U-shape or U-shape. That is, whether the bent piece is configured to be bent from the inner side to the outer side of the loop pattern 12 or to be bent from the outer side to the inner side is appropriately determined depending on design convenience or the like. The same can be said for the second, third, and sixth embodiments.

  In the configuration in which the first and second positioning holes 61 and 62 are provided as in the sixth embodiment, the first and second preliminary bonding pads 38 and 39 are further provided as in the third embodiment. It is also possible to provide it. Similarly, the technique of the fifth embodiment can be applied to the seventh embodiment. Furthermore, the technique of providing the positioning holes 61 and 62 as in the sixth embodiment can be applied to the eighth embodiment.

10 single-sided FPC
12 Loop Pattern 13 Chip Capacitor 14 First Connection Terminal Portion 16 Second Connection Terminal Portion 18 First Bonding Pad 19 Second Bonding Pad 21 Opening 22 Cut 23 Bending Piece 41 Extension Piece 81 Cut Piece 83 Third bonding pad 84 Fourth bonding pad 85 Opening 87 Connecting portion 100, 200,..., 800 RFID antenna

Claims (12)

A single-sided flexible printed board on which a loop pattern, first and second connection terminal portions located on either the inside or the outside of the loop pattern, and first and second bonding pads are formed. ,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. Connected to the terminal portion, the single-sided flexible printed board is provided with a predetermined shape of cut or opening to form a bent piece, and one of the first and second bonding pads is located on the bent piece. The bent piece is bent so that the first bonding pad and the second bonding pad are in contact with each other, and the first and second bonding pads are electrically connected to each other. RFID antenna.   2. The RFID antenna according to claim 1, wherein the cut or the opening is provided so as to surround one of the first and second bonding pads in a U-shape or a U-shape. Antenna.   3. The RFID antenna according to claim 1, wherein the first and second preliminary bonding pads are arranged either on the inner side or the outer side of the loop pattern so as to be separately located on both sides of the bent position of the bent piece. An RFID antenna formed on one side, wherein the first and second preliminary bonding pads are electrically bonded to each other, and a connection path that does not pass through the bending position is formed. The RFID antenna according to any one of claims 1 to 3,
The single-sided flexible printed circuit board has first and second positioning holes in the vicinity of the first and second bonding pads so as to have a predetermined positional relationship with each of the first and second bonding pads. Provided in
The RFID antenna, wherein the bent piece is bent so that the positions of the first and second positioning holes coincide. A single-sided flexible printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first and second bonding pads are formed. ,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. The one-sided flexible printed circuit board connected to the terminal portion has an extension piece partially extending from the outer periphery, and one of the first and second bonding pads is located on the extension piece, and the extension piece is An RFID antenna, wherein the first bonding pad and the second bonding pad are bent so as to contact each other, and the first and second bonding pads are electrically bonded to each other.   6. The RFID antenna according to claim 5, wherein first and second preliminary bonding pads are formed outside the loop pattern so as to be separately located on both sides of a bending position of the extension piece. And an RFID antenna, wherein the second preliminary bonding pads are electrically bonded to each other, and a connection path that does not pass through the bending position is formed. The RFID antenna according to claim 5 or 6,
The single-sided flexible printed circuit board has first and second positioning holes in the vicinity of the first and second bonding pads so as to have a predetermined positional relationship with each of the first and second bonding pads. Provided in
The RFID antenna, wherein the extension piece is bent so that the positions of the first and second positioning holes coincide. A loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed, and the third and fourth pads are formed. Including a single-sided printed circuit board in which a part including the position of the bonding pad is cut out to be a cut piece;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. Connected to the terminal portion, the third bonding pad and the fourth bonding pad are connected in the cut piece,
The cut piece is positioned such that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other; An RFID antenna, wherein the first and third bonding pads are electrically bonded to each other, and the second and fourth bonding pads are electrically bonded to each other. A single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece connected to the terminal portion and having a cut or opening of a predetermined shape on the single-sided printed board to be cut off is formed, and the third and fourth bonding pads are located on the cut piece. RFID antennas connected to each other.   10. The RFID antenna according to claim 9, wherein a distance between the first and second bonding pads is substantially equal to a distance between the third and fourth bonding pads.   11. The RFID antenna according to claim 1, wherein a capacitor for adjusting a resonance frequency is provided between the first and second connection terminal portions. Using a single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inside or the outside of the loop pattern, and first to fourth bonding pads are formed, A method of manufacturing an RFID antenna,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece connected to the terminal portion and having a cut or opening of a predetermined shape on the single-sided printed board to be cut off is formed, and the third and fourth bonding pads are located on the cut piece. Connected to each other,
This method
Cutting the cut piece from the single-sided printed circuit board;
The cut piece is disposed so that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other. And a step of electrically bonding the first and third bonding pads to each other and electrically bonding the second and fourth bonding pads to each other. .

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