JP2010062270A - Device for sticking adhesive tape on substrate - Google Patents

Abstract

When applying an adhesive tape to a substrate with a heated application roller, the heating temperature of the outer peripheral surface of the application roller is made uniform.
An adhesive roller is lowered onto a substrate 15 held by suction on a sticking table 18 to press an adhesive tape 3 onto the substrate 15, and then the sticking roller 8 is moved from a sticking start end portion 32 to a sticking end portion 33. In the adhesive tape sticking device to the substrate 15 in which the adhesive tape 3 is stuck on the substrate 15 by pressing and rolling, the sticking roller 8 is rotatable, and a heater 10 is built in the roller. A rotation driving mechanism 9 for forcibly driving the application roller 8 at its raised position is provided near the adhesive tape application terminal portion 33 of the application table 18 so that the entire outer surface of the application roller 8 can be heated. By forcibly rotating the sticking roller 8 by the rotation drive mechanism 9, the heating temperature of the entire outer peripheral surface of the sticking roller 8 is maintained uniformly.
[Selection] Figure 4

Description

  The present invention relates to an adhesive tape applying device and an attaching method to a substrate. More specifically, when the adhesive tape is applied to a substrate such as a semiconductor wafer, the adhesive tape is applied to the substrate to be applied while pressing and heating the adhesive tape to the substrate while keeping the heating temperature of the entire outer peripheral surface of the application roller uniform. The present invention relates to an apparatus and a pasting method.

  Conventionally, in a semiconductor chip manufacturing process, a protective tape is applied to the pattern forming surface of a wafer on which a pattern is formed, the back surface is ground and thinned, and then a die attach film is applied to the ground surface. Subsequently, the die attach film adhering surface of the wafer is mounted on a dicing tape, and the protective tape is peeled off with a peeling tape or the like, followed by dicing into chips. The semiconductor chip is mounted on a die pad via the die attach film and sealed with a sealing resin to form a semiconductor device.

  As a pattern formation of a wafer, a dry film resist is attached to the wafer surface, and exposure and etching are performed to form a pattern.

  As described above, there are processes in which various adhesive tapes are affixed to wafers in the semiconductor manufacturing process, but the attachment of die attach films and dry film resists to wafers is because of adhesive tapes that generate adhesiveness when heated. It is necessary to paste while heating. In addition, the protective tape may be attached in some cases by softening the adhesive of the protective tape by heating and applying the protective tape so as to bite into the surface pattern to improve adhesion.

  In attaching the die attach film, the wafer is sucked and held on a table (heater unit) with a built-in heater, heated to 100 to 250 ° C., transferred to the attaching table, and then ground on the wafer. A die attach film (adhesive sheet) is applied to the side by pressing with a sticking roller formed of heat-resistant silicone rubber or the like (for example, Patent Document 1).

  In order to prevent die damage due to thermal expansion of the wafer during heating due to thinning of the wafer, the die attach film is heated while heating the sticking roller without heating the sticking table side. Is applied to a wafer by pressing (for example, Patent Document 2).

  The above-mentioned sticking roller has a built-in heater inside a cylindrical metal body and the surface of the metal body is covered with a heat-resistant fluororesin layer, and the roller body is made of a non-metallic material such as plastic or rubber. However, a device incorporating a plurality of heaters along the outer peripheral surface is used.

Japanese Patent Laid-Open No. 10-112494, FIG. 1, FIG. 3, FIG. 7, FIG. Japanese Patent No. 4054251, FIG. 4, FIG.

  By the way, when adhering and heating with a heater unit before adhering a die attach film to a wafer as in Patent Document 1 described above, when transferring and adhering to a sticking table, the built-in heaters of the heater unit are spaced apart. As a result, the heat distribution of the wafer after heating varies, the die attach film cannot be applied uniformly, the thickness of the tape after application varies, and the tape tension varies. There was a problem that the wafer after pasting was warped.

  In addition, a temperature drop occurs when the wafer is transferred from the heater unit to the sticking table, and even if the sticking table is heated with hot air, the heat distribution of the sticking table and the temperature variation occur in the wafer. There was a problem that the touch film could not be applied uniformly.

  Furthermore, after the wafer is heated by the heater unit, the wafer is transferred to the sticking table and the die attach film is attached, so that a heating process in the heater unit is entered, and there is a problem that time is required for attaching.

  In addition, as in Patent Document 2, the method of embedding a heater in a cylindrical metal body propagates heat to the entire cylindrical metal body, but the outer peripheral surface has a variation in temperature distribution particularly in the vertical direction due to heat convection. Since the upper side of the sticking roller becomes hotter than the lower side due to the rising airflow (for example, a variation of around 10 ° C occurs when heating at 120 ° C), the die attach film should be attached uniformly. There is a problem that can not be.

  In addition, in the method of incorporating a plurality of heaters in a non-metallic material such as plastic or rubber as in Patent Document 2, intervals are provided for the installation of the plurality of heaters. There is a problem that the dispersion of the distribution occurs and the die attach film cannot be applied uniformly.

  In addition, when applying various adhesive tapes, if the outer peripheral length of the application roller is smaller than the application length of the wafer, the temperature of the application roller that has been used once has dropped during the application process. Since the adhesive tape is pressed again, there is a problem that the heat is not uniformly applied to the adhesive tape.

  Accordingly, the invention of claim 1 is a sticking table for adsorbing and holding a substrate on the upper surface thereof, and capable of reciprocating between an adhesive tape sticking start end portion and a sticking terminal end portion of the sticking table, and with respect to the sticking table surface. And a sticking roller supported so as to be able to move up and down. After the sticking roller is lowered onto the substrate held by suction on the sticking table to press the adhesive tape onto the substrate, the sticking roller is moved from the sticking start end. In an adhesive tape application device to a substrate in which the adhesive tape is applied to the substrate by pressing and rolling to the application terminal portion, the application roller is rotatable, and a heater is incorporated in the roller. The entire outer periphery of the sticking roller is configured to be heatable, and the sticking roller is forcibly driven to rotate near the adhesive tape sticking end of the sticking table. The occupied rotational drive mechanism is provided, by forcibly rotating the application roller in the rotary drive mechanism, an adhesive tape applying apparatus to the substrate which is adapted to uniformly hold the heating temperature of the entire area of outer peripheral surface of 該貼 with rollers.

  The invention according to claim 2 is the adhesive tape sticking device according to claim 1, wherein the sticking roller is rotationally driven at the time of waiting for the sticking of the adhesive tape.

  If the adhesive roller is rotated before the adhesive tape is applied to the substrate before or after the adhesive tape is applied as described above, if the adhesive roller is driven to rotate, the time required for the application work will be affected. The temperature on the outer periphery of the sticking roller can be made uniform.

  According to a third aspect of the present invention, the outer peripheral length of the sticking roller is set to be equal to or longer than the sticking length of the adhesive tape to the substrate, and the adhesive tape is attached to the substrate by one rotation of the sticking roller. The apparatus for applying an adhesive tape to a substrate according to claim 1 or 2 as described above.

  If the outer peripheral length of the sticking roller is set to be equal to the length of the adhesive tape attached to the substrate (for example, the diameter of the substrate or more) as described above, the adhesive roller is uniformly bonded to the entire surface with one rotation of the sticking roller. Tape can be attached.

  The application roller is forcibly rotated by the rotation drive mechanism, so that the outer peripheral temperature of the application roller is not affected by convection, etc., and is uniformized and can be pressed at a constant temperature when the adhesive tape is applied. Since the thickness of the tape can be made uniform and attached to the substrate, the tension of the attached adhesive tape becomes uniform and the residual stress can be reduced.

  In addition, since the adhesive tape is applied with a uniform tension and thickness as described above, even when the substrate has a thickness of 100 μm or less, the substrate does not warp due to the residual stress after being attached. The board will not be damaged.

  In addition, since the sticking roller is rotated during the steps other than the sticking work, the heating temperature of the entire outer peripheral surface of the sticking roller can be maintained uniformly without affecting the sticking work time.

  Furthermore, if the outer peripheral length of the sticking roller is longer than the sticking length of the substrate to be pasted, and if the pasting is completed in one rotation, the sticking roller will adhere when the adhesive tape is pressed. Even if the temperature of the outer peripheral surface of the portion in contact with the tape is lowered, the adhesive tape can be uniformly applied to the substrate without being affected by the temperature.

  Hereinafter, an embodiment of an adhesive tape applying device of the present invention will be described with reference to FIGS. 1 to 6.

  As shown in FIG. 1, in the foreground in the figure, a wafer storage unit 26 that stores a plurality of wafers 15 in a multistage manner on the machine base 12, an alignment unit 59 that detects and positions notches and orientation flats of the wafer 15, and a wafer 15 Are transferred one by one from the wafer storage unit 26 and transferred to the alignment unit 59 and the bonding table 18, and the transfer robot 17 that stores the bonded wafer 16 to which the adhesive tape 3 has been applied to the bonded wafer storage unit 27; A pasted wafer storage unit 27 is provided for stacking and storing the adhesive tape-applied wafers 16 after the adhesive tape 3 has been attached.

  Further, an adhesive tape applying unit 62 is provided on the rear machine base 12 in the figure, and the adhesive tape applying unit 62 includes an adhesive tape supply reel 5 for supplying a wide adhesive tape 3 onto the application table 18, Separator take-up reel 6 that peels and peels separator 4 that protects the adhesive surface of adhesive tape 3 from adhesive tape 3, tape chuck 14 that extends adhesive tape 3 on adhesive table 18, and adhesive supplied on adhesive table 18 An affixing roller 8 for pressing and adhering the tape 3 to the wafer 15 adsorbed and held on the adhering table 18 while heating, and a cutter unit 19 for cutting the adhesive tape 3 affixed to the wafer 15 along the outer shape of the wafer 15. An adhesive tape take-up reel 7 is provided for winding up the cut excess portion of the adhesive tape 3.

  The wafer storage unit 26 is provided with cassettes for storing a plurality of wafers 15 in multiple stages, and the wafers 15 are taken out one by one by the transfer robot 17 by an appropriate lifting mechanism (not shown). Further, the transfer robot 17 is provided with a suction hand at the tip, and sucks the wafer 15 from below, and is configured to freely rotate and extend. The suction hand picks up the wafers 15 one by one from the wafer storage unit 26, transfers the wafers 15 to the alignment unit 59, transfers the wafers 15 after alignment onto the pasting table 18, and the pasted wafers 16. Can be stored in the pasted wafer storage unit 27.

  The alignment unit 59 is provided with a suction table 60 for sucking and holding the wafer 15 transported by the transport robot 17, and the suction table 60 can be rotated by an appropriate mechanism (not shown). Further, an optical sensor 61 is provided in the vicinity of the suction table 60 to detect notches and orientation flats of the wafer 15 by appropriate optical means. The notches and orientation flats of the wafer 15 rotated by the suction table 60 are detected and positioned. It is supposed to be.

  Next, the adhesive tape applying unit 62 will be described with reference to FIGS. In this embodiment, a three-layer dry film resist is used as the adhesive tape 3 as an example. However, the present invention is not limited to this, and a protective tape attached to the pattern forming surface of the wafer 15 or a substrate such as a die attach film attached to the back surface of the wafer 15 Various tapes to be attached to can be preferably used.

  As shown in FIG. 2, the adhesive tape applying unit 62 is provided with an adhesive tape supply reel 5 at the upper right of the machine frame 2, and the adhesive tape 3 is transferred from the wide adhesive tape supply reel 5 to the tension roller 29 via the guide roller 28. After the separator 4 on the surface is peeled off by the peeling roller 30, it is held by the tape chuck 14 through the guide roller 31, and is wound around the adhesive tape take-up reel 7 via the group of guide rollers 28. It has become.

  The tension roller 29 is provided on the tension arm, and the tension of the adhesive tape 3 is appropriately maintained by controlling the tension fluctuation caused by the fed adhesive tape 3 by an appropriate mechanism so that the tension arm is kept horizontal. It is like that.

  The separator 4 peeled off by the peeling roller 30 is wound around the separator take-up reel 6 while adjusting the tension by the tension roller 35 via the guide roller 63 group.

  A cutter unit 19 that cuts the adhesive tape 3 affixed to the wafer 15 along the outer peripheral direction of the wafer 15 is provided at the center of the machine frame 2. The cutter unit 19 is provided with a cutter 20, and the cutter 20 can be rotated by a motor 21. Also, the cutter unit 19 is slidably fitted with a rail 23 provided in the vertical direction of the machine frame 2 by a slider 25 provided on the back surface of the support plate 22, so that the lift cylinder 24 It is designed to move up and down.

  Next, the sticking roller 8 will be described with reference to FIGS. The sticking roller 8 includes a roll-shaped metal body that is slightly longer than the width of the adhesive tape 3, an elastic body 13 such as heat-resistant silicone rubber or fluororubber provided on the outer periphery of the metal body, and an inside of the metal body. It is composed of a cartridge-like heater 10 having a length equal to or greater than the outer diameter of the built-in wafer 15, and roller shafts 64, 64 projecting from both side surfaces of the metal body are rotatable to the support frame 46 via bearings. It is pivotally supported. If the heater 10 is set to a length equal to or larger than the diameter of the wafer 15, the entire portion used for attaching the application roller 8 is uniformly heated when the adhesive tape 3 is applied to the wafer 15. In terms of surface. Furthermore, it is more preferable to use the heater 10 having a length equal to or greater than the width of the adhesive tape 3 in terms of uniformly applying heat to the entire adhesive tape 3.

  A heat-resistant rubber ring 11 is fitted on one end of the roller shaft 64 so as to rotate integrally with the sticking roller 8, and the other end side of the roller shaft 64 is built in the sticking roller 8. A heater wire connected to the heater 10 is drawn out through an appropriate member (slip ring or the like) so as to be separated from the rotation of the sticking roller 8 and connected to a control circuit (not shown).

  The outer peripheral length of the sticking roller 8 is preferably set to be equal to or longer than the length of the adhesive tape 3 attached to the wafer 15 to be attached (for example, the diameter of the wafer 15). For example, the outer diameter of the sticking roller 8 is set to 80 mm. If it does in this way, it can stick by one rotation of the sticking roller 8 at the time of sticking, and can stick the adhesive tape 3 uniformly, without being influenced by the temperature fall of the part once used for sticking. it can.

  The support frame 46 is connected to a support frame 44 provided above through a cylinder 47 and a guide 45 so as to be movable up and down. By applying the cylinder 47, the sticking roller 8 is attached from the back side of the adhesive tape 3 to the sticking table 18. It presses against the wafer 15 held by suction.

  In addition, sliders 43 are provided on both sides of the support frame 44 and are fitted to the rails 41 and 41 laid on both the machine frames 2 and 2, and are attached to the support frame 44 along the rails 41 and 41. The roller 8 is horizontally movable.

  As shown in FIGS. 1 and 4, one end of the support frame 44 is connected to a belt 40, and this belt 40 is stretched over a drive pulley 38 and a driven pulley 39, and a motor connected to the drive pulley 38. By driving 37, the sticking roller 8 moves horizontally along the rails 41, 41 integrally with the support frame 44 via the belt 40.

  Further, a guide roller 31 is provided in front of the sticking roller 8 so as to be positioned lower than the lowermost end of the sticking roller 8, and the guide roller 31 is supported in a vertically downward manner from both side surfaces of the support frame 44. It is pivotally supported by a plate and can move horizontally with the application roller 8 via a support frame 44.

  1, 2, and 4, the sticking roller 8 can reciprocate between the adhesive tape sticking start end portion 32 and the sticking end portion 33, and in the vicinity of the sticking end portion 33. A rotating roller 34 is provided.

  The rotating roller 34 is connected to a motor 36 and is rotatable. The motor 36 is fixed to a support frame 42 extending below the machine frame 2 on the front side of the machine base 12 as shown in FIG. Thus, the rotation drive mechanism 9 is configured. The motor 36 and the rotating roller 34 may be provided so as to be movable up and down as appropriate.

  The rotating roller 34 comes into contact with and engages with the rubber ring 11 provided at one end of the roller shaft 64 of the applying roller 8 when the applying roller 8 is positioned on the rotating roller 34 in the raised position. When the ring 11 and the rotating roller 34 are engaged, the motor 36 is driven to rotate the rotating roller 34, and this rotational force is transmitted to the rubber ring 11 to rotate the sticking roller 8. Note that the rotation of the rotating roller 34 may be continuously rotated, or for power saving, the rotation may be detected by a sensor or the like only when engaged with the rubber ring 11 and rotated.

  Next, the detail of the sticking table 18 is demonstrated based on FIG.2 and FIG.3.

  The affixing table 18 is composed of a circular inner peripheral table 50 on which the wafer 15 is placed and adsorbed and held, and a rectangular outer peripheral table 51 provided on the outer periphery thereof, in which a portion of the inner peripheral table 50 is cut out. The inner peripheral table 50 has two rails 54 extending in the vertical direction and fixed to a support plate 53.

  In addition, two support plates are extended in the vertical direction of the outer peripheral table 51, and a slider 55 is provided below the support plate. The slider 55 is slidably fitted to the rail 54. Are combined.

  Two cylinders 52 are connected to the lower side of the outer peripheral table 51, and the outer peripheral table 51 can move up and down with respect to the inner peripheral table 50 along the rail 54 by operating the cylinder 52. It has become.

  A base plate 48 is provided on the machine base 12 in parallel with the machine base 12 at an interval. The base plate 48 is provided with an opening in the sticking table 18 and two openings are provided at the opening end. A slider 49 is provided so as to face each other.

  A rail 56 extends in the vertical direction of the support plate 53 and is slidably fitted to the slider 49. A cylinder 57 provided on the machine base 12 is connected to the support plate 53. Has been.

  The support plate 53 can be moved up and down with respect to the machine base 12 along the rail 56 by driving the cylinder 57, and by moving the support plate 53 up and down, the support plate 53 is integrated with the support plate 53. The peripheral table 50 and the outer peripheral table 51 move up and down. That is, the pasting table 18 can be moved up and down with respect to the machine base 12 and can be moved up and down independently with respect to the inner peripheral table 50 of the outer peripheral table 51.

  The above is the configuration of the adhesive tape applying device of the present invention. Next, the adhesive tape attaching operation will be described with reference to FIGS. 5 and 6. In the present embodiment, the adhesive tape 3 is composed of a protective film 66, a dry film resist 67, and a separator 4.

  As shown by the two-dot chain line in FIG. 5A, the sticking roller 8 is positioned at the right side of the sticking terminal portion 33 at the ascending position, and is heated by the heater 10 (for example, 100 ° C.). Further, the rubber ring 11 is engaged with the rotating roller 34, and the rotating roller 34 is rotated by driving the motor 36, and the sticking roller 8 is forcibly driven to rotate so that the heating temperature in the entire outer peripheral surface is uniform. Is retained.

  Further, the wafer 15 positioned by the alignment unit 59 is conveyed onto the inner peripheral table 50 and is sucked and held. At this time, the upper surface of the wafer 15 and the upper surface of the outer peripheral table 51 are matched by moving the outer peripheral table 51 up and down by the cylinder 52.

  Subsequently, while the adhesive tape 3 from which the separator 4 has been peeled off by the peeling roller 30 is chucked by the tape chuck 14, the tape chuck 14 and the sticking roller 8 move to the sticking start end 32 side of the solid line position, whereby the adhesive tape 3 is removed. It is pulled out on the pasting table 18. At this time, the rotation roller 34 detects that the rubber ring 11 of the sticking roller 8 is not engaged by a sensor (not shown) and stops the rotation.

  As shown in FIG. 5B, the sticking roller 8 is lowered to the sticking start end 32 by the action of the cylinder 47 so as to coincide with the upper surface position of the adhesive tape 3, and the sticking table 18 is moved to the sticking height of the cylinder 57. Raises by action. If the rising end of the sticking table 18 at this time is set to be an appropriate amount higher than the adhesive surface of the adhesive tape 3, the adhesive tape 3 is stuck on the wafer 15 with a certain pressing amount of the sticking roller 8. Can be attached.

  Although not shown, the height of the inner peripheral table 50 is adjusted so that the upper surface of the wafer 15 protrudes from the upper surface of the outer peripheral table 51, and the rising end of the sticking table 18 is more appropriately than the adhesive surface of the adhesive tape 3. If the amount is set to be high, the pressing force of the sticking roller 8 is increased, and the adhesive tape 3 can be stuck to the unevenness of the uneven wafer 15.

  As shown in FIG. 5C, the sticking roller 8 presses and rolls from the sticking start end portion 32 to the sticking end portion 33 while heating the adhesive tape 3 to the wafer 15, and sticks the adhesive tape 3 to the wafer 15.

  As shown in FIG. 6 (d), the sticking roller 8 is separated upward from the sticking table 18 by the action of the cylinder 47, moves horizontally, and moves onto the rotating roller 34 on the right side of the sticking end portion 33. At this time, since the guide roller 31 positioned in front of the application roller 8 guides the adhesive tape 3, the application roller 8 is separated from the adhesive tape 3. Further, the rubber ring 11 attached to the roller shaft 64 of the sticking roller 8 is in contact with and engaged with the rotating roller 34.

  Next, as shown in FIG. 6E, the cutter unit 19 is lowered by the action of the cylinder 24, and the cutter 20 is rotated by the motor 21 to cut the adhesive tape 3 along the outer periphery of the wafer 15. Further, it is detected that the rubber ring 11 of the sticking roller 8 is engaged with the rotating roller 34, and the rotating roller 34 is rotated by driving the motor 36 of the rotation driving mechanism 9, whereby the sticking roller 8 causes the rubber ring 11 to move. Start rotating through.

  As shown in FIG. 6 (f), the affixing table 18 is lowered, and the excess adhesive tape 3 comes into close contact with the affixing table 18 and descends together with the affixing table 18. The sticking roller 8 is continuously rotated by the rotation of the rotating roller 34 in a heated state.

  As shown in FIG. 6G, the tape chuck 14 is opened and the roller of the tape chuck 14 moves horizontally on the sticking table 18 in the direction of the arrow, so that the excess adhesive tape 3 is peeled off from the sticking table 18.

  The above process is repeated, and the adhesive tape 3 is continuously attached to the plurality of wafers 15.

  Further, as described above, the sticking roller 8 is rotated by the rotation drive mechanism 9 while being heated while the sticking operation is not performed, and the heating temperature of the outer peripheral surface is made uniform in preparation for the next sticking operation. .

  The affixed wafer 16 that has been affixed is peeled off from the protective film 66 and subjected to exposure, etching, or the like.

  The number of rotations of the sticking roller 8 is not particularly limited because it depends on the material and diameter of the sticking roller 8 to be used, but it is preferably 2 to 5 rpm. Insufficient heat diffusion makes it difficult to make the temperature distribution of the sticking roller 8 uniform, and when the speed is high, the cooling effect tends to be lower than the sticking temperature.

  The rotation time is not particularly limited because it depends on the material and diameter of the sticking roller 8 to be used, but it is preferably rotated for about 30 to 40 seconds, considering the time required for each sticking of the wafer 15. The sticking roller 8 may be rotated while waiting.

  Further, in the present embodiment, the rotation drive mechanism 9 is provided on the right side of the sticking terminal portion 33. However, the rotation driving mechanism 9 is not limited to this, and the operation of the sticking roller 8 and the cutter unit 19 is not limited thereto. It can be provided at an appropriate position as long as it does not interfere.

  The adhesive tape 3 is not limited to the dry film resist described above, but can be used as long as it is affixed to substrates of various sizes and shapes while being heated (for example, die attach film, protective tape, dicing tape).

It is a top view of the adhesive tape sticking apparatus of this invention. It is an AA direction arrow line view of FIG. It is a BB direction arrow line view of FIG. It is principal part expansion explanatory drawing of the adhesive tape sticking apparatus of this invention. (A) thru | or (c) It is explanatory drawing showing the sticking operation | movement of the adhesive tape of this invention. (D) thru | or (g) It is explanatory drawing showing the sticking operation | movement of the adhesive tape of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive tape sticking apparatus 2 Machine frame 3 Adhesive tape 4 Separator 5 Adhesive tape supply reel 6 Separator take-up reel 7 Adhesive tape take-up reel 8 Adhesive roller 9 Rotation drive mechanism 10 Heating heater 11 Rubber ring 12 Machine base 13 Elastic body 14 Tape Chuck 15 Wafer (Substrate)
16 Attached wafer 17 Transfer robot 18 Attaching table 19 Cutter unit 20 Cutter 21 Motor 22 Support plate 23 Rail 24 Lifting cylinder 25 Slider 26 Wafer storage part 27 Attached wafer storage part 28 Guide roller 29 Tension roller 30 Peeling roller 31 Guide roller 32 Application start end 33 Application end 34 Rotation roller 35 Tension roller 36 Motor 37 Motor 38 Drive pulley 39 Drive pulley 40 Belt 41 Rail 42 Support frame 43 Slider 44 Support frame 45 Guide 46 Support frame 47 Cylinder 48 Base plate 49 Slider 50 Inner circumference Table 51 Peripheral table 52 Cylinder 53 Support plate 54 Rail 55 Slider 56 Rail 57 Cylinder 58 Support frame 59 Alignment unit 60 Suction table 61 Optical sensor 62 Adhesive tape affixed Knit 63 guide roller 64 roller shaft 65 Rail 66 protective film 67 a dry film resist

Claims (3)

A sticking table for adsorbing and holding the substrate on its upper surface, and a sticking roller supported so as to be able to reciprocate between an adhesive tape sticking start end part and a sticking terminal end part of the sticking table and to be movable up and down with respect to the sticking table surface; And lowering the sticking roller onto the substrate held by suction on the sticking table to press the adhesive tape onto the substrate, and then pressing and rolling the sticking roller from the sticking start end portion to the sticking end portion. In the adhesive tape affixing device to the substrate in which the adhesive tape is affixed on the substrate by
The sticking roller is configured to be rotatable, and a heater is incorporated therein so that the entire outer peripheral portion of the sticking roller can be heated. Provided a rotation drive mechanism for forcibly rotating the sticking roller, and forcibly rotating the sticking roller with the rotation drive mechanism, so that the heating temperature of the entire outer peripheral surface of the sticking roller can be maintained uniformly. A device for applying an adhesive tape to a substrate.   The adhesive tape sticking apparatus according to claim 1, wherein the sticking roller is rotationally driven when the adhesive tape is put on standby.   The outer peripheral length of the affixing roller is set to be equal to or longer than the affixing length of the adhesive tape to the substrate, and the adhesive tape is affixed to the substrate by one rotation of the affixing roller. Item 3. An apparatus for applying an adhesive tape to a substrate according to item 1 or 2.

Images