JP2010061958A - Organic electro-luminescence (el) component - Google Patents

Abstract

An electrode of an organic EL element is sufficiently brought into contact with a circuit electrode of a circuit board, and these electrodes are connected to each other. Provided is an organic EL component manufactured using a printing technique, which is prevented from occurring.
In an organic EL component of the present invention, an anode 22 is provided on one surface 21a of a transparent resin substrate 21, and a cathode 23 covers the organic EL layer 24 and one surface 21a of the transparent resin substrate 21. The organic EL layer 24 is a printed layer that covers the anode 22. The light emitting portion 27 of the organic EL element 20 is accommodated in the through hole 31 a of the circuit board 31, and one surface 31 c of the circuit board 31 is formed. The terminal 22a of the anode 22 and the terminal 23a of the cathode 23 are connected to the first electrodes 32a and 33a provided on the surface, respectively, and the surface 31b opposite to the connection surface of the circuit board 31 is bonded to the sealing base material 26. The surface 26a opposite to the surface is the same surface.
[Selection] Figure 1

Description

  The present invention relates to an organic electroluminescent component including an organic electroluminescent element, and more specifically, an organic electroluminescent element formed by electrically connecting an organic electroluminescent element manufactured using a printing technique and a circuit board. It relates to parts.

2. Description of the Related Art Conventionally, in a technical field called printed electronics in which an electronic circuit is produced by diverting a printing technique, a method of forming an electronic circuit, wiring, or electrode by printing using a polymer conductive ink such as silver paste Is adopted.
As an electronic component manufactured by applying this printed electronics, for example, a sheet-like organic electroluminescence (hereinafter referred to as “organic EL”) element may be cited.

FIG. 10 is a schematic cross-sectional view showing an example of a sheet-like organic EL element produced by applying printed electronics.
In the organic EL element 100, an organic EL layer 104 including at least a light-emitting layer is sandwiched between a pair of opposing anodes 102 and a cathode 103 on a transparent substrate 101, and the cathode 103 and the organic EL layer 104 are provided. The sealing substrate 106 is bonded to the cathode 103 through the covering adhesive layer 105 (see, for example, Patent Document 1).
The anode 102 is made of a transparent electrode provided on one surface 101 a of the transparent substrate 101. Further, the cathode 103 is composed of a conductive printing layer provided so as to cover almost the entire area of the organic EL layer 104 and a part of one surface 101 a of the transparent substrate 101.
Further, the organic EL layer 104, the anode 102 and the cathode 103 sandwiching the organic EL layer 104, the adhesive layer 105, and the laminated portion including the sealing substrate 106 form the light emitting portion 107 of the organic EL element 100.

  In the organic EL element 100, the other surface 101b of the transparent substrate 101 is a light emitting surface. And in one area | region 101a of the transparent base material 101, in areas other than the area | region where the light emission part 107 was distribute | arranged, a part of anode 102 and a part of cathode 103, in detail, the terminal of the anode 102 and its vicinity, In addition, the terminal of the cathode 103 and the vicinity thereof are exposed.

In the manufacture of the organic EL element 100, a functional material such as an organic compound forming the organic EL layer 104 or a polymer type conductive ink forming the cathode 103 is laminated and printed on the transparent substrate 101 provided with the anode 102 made of a transparent electrode. In order to pass through the manufacturing process of sticking the sealing substrate 106 last, the back surface (one surface of the transparent substrate 101) of the light emitting surface of the organic EL element 100 (the other surface 101b of the transparent substrate 101). 101a) has an inevitable structure in which the anode 102 and the cathode 103 are exposed.
Further, in order to expose the anode 102 and the cathode 103, a part of the sealing substrate 106 bonded to the cathode 103 through the adhesive layer 105 must be scraped off. Therefore, the cross-sectional shape of the finally obtained organic EL element 100 has a shape in which only the light emitting portion 107 protrudes on one surface 101a of the transparent substrate 101 as shown in FIG.
JP 2007-35514 A

In order to mount the organic EL element 100 as described above on the circuit board, the anode 102 and the cathode 103 of the organic EL element 100 must be connected to the electrodes of the circuit board.
As shown in FIG. 11, when the organic EL element 100 is mounted on the circuit board 120, the electrodes 121 and 122 of the circuit board 120, and the anode 102 and the cathode 103 of the organic EL element 100 are interposed via the conductive adhesive 130. Connected.
However, as described above, in the organic EL element 100, since the light emitting portion 107 protrudes from the one surface 101a of the transparent substrate 101, the thickness of the light emitting portion 107 itself becomes an obstacle, and the electrodes 121, 122, Since the anode 102 and the cathode 103 cannot be sufficiently brought into contact with each other, there is a problem in that connection failure occurs between these electrodes.
Further, even if the transparent substrate 101 is bent and the electrodes 121 and 122 and the anode 102 and the cathode 103 are forcibly brought into contact with each other, a force always acts on the connecting portion of these electrodes in a direction in which the connection is disconnected. For this reason, connection failure will eventually occur.

  The present invention has been made in view of the above circumstances, and can sufficiently contact an electrode terminal of an organic electroluminescence element and a circuit electrode of a circuit board on which the electrode is mounted. An object of the present invention is to provide an organic electroluminescent component manufactured by using a printing technique that prevents a connection failure from occurring due to a force acting in the direction in which the connection is disconnected after the connection is made. .

  In the organic electroluminescent component of the present invention, an organic electroluminescent layer including at least a light emitting layer is sandwiched between a pair of opposed anode and cathode, and the adhesive layer covering the cathode and the organic electroluminescent layer is interposed between the organic electroluminescent component and the cathode. An organic electroluminescent component comprising an organic electroluminescent element having a sealing substrate bonded to a cathode, and a circuit board electrically connected to the organic electroluminescent element, wherein the anode is a transparent resin group Consisting of a transparent electrode provided on one side of the material, the cathode comprising a conductive first printed layer provided so as to cover one side of the organic electroluminescence layer and the transparent resin substrate, The organic electroluminescence layer is a second printed layer provided so as to cover the anode. The light emitting part of the organic electroluminescence element is accommodated in a through hole penetrating the circuit board in the thickness direction, and the anode and the two electrodes provided on one surface of the circuit board Each of the cathodes is connected, and a surface of the circuit board opposite to the connection surface with the organic electroluminescence element and a surface of the sealing substrate opposite to the adhesion surface with the organic electroluminescence element are provided. It is characterized by having the same surface.

  According to the organic electroluminescent component of the present invention, an organic electroluminescent layer including at least a light emitting layer is sandwiched between a pair of opposing anodes and cathodes, and an adhesive layer covering the cathode and the organic electroluminescent layer is interposed therebetween. , An organic electroluminescent component comprising an organic electroluminescent element having a sealing substrate bonded to the cathode, and a circuit board electrically connected to the organic electroluminescent element, wherein the anode is transparent It consists of a transparent electrode provided on one surface of a resin base material, and the cathode is formed from a conductive first printed layer provided so as to cover one surface of the organic electroluminescence layer and the transparent resin base material. The organic electroluminescence layer is a second mark provided so as to cover the anode. The light emitting part of the organic electroluminescence element is accommodated in a through hole made of a layer and penetrating the circuit board in the thickness direction, and the anode is connected to two different electrodes provided on one surface of the circuit board And the cathode are respectively connected, the surface of the circuit board opposite to the connection surface with the organic electroluminescence element, and the surface of the sealing substrate opposite to the adhesion surface with the organic electroluminescence element. Are formed on the same plane, the anode terminal and cathode terminal of the organic EL element can be sufficiently brought into contact with the two electrodes of the circuit board, and after these electrodes are connected to each other, the connection It is possible to prevent the force from acting on the part in the direction of disconnection. Therefore, it is possible to prevent poor connection between the organic EL element and the circuit board.

The best mode of the organic electroluminescent component of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

1A and 1B are schematic views showing an embodiment of the organic electroluminescent component of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA in FIG. FIG. 2 is a schematic bottom view showing one embodiment of the organic electroluminescent component of the present invention.
The organic EL component 10 is generally composed of an organic EL element 20 and a circuit board 31 that are electrically connected to each other.
The organic EL element 20 has an organic EL layer 24 including at least a light emitting layer sandwiched between a pair of an anode 22 and a cathode 23 facing each other on a transparent resin base material 21 having a rectangular shape in plan view. The sealing substrate 26 is bonded to the cathode 23 through an adhesive layer 25 that covers the main part of the cathode 23 and the entire area of the organic EL layer 24.

The anode 22 is provided on one surface 21a of the transparent resin base material 21, and a main portion thereof, that is, a portion for passing an electric current to the organic EL layer 24 is formed of a transparent electrode having a circular shape when viewed in plan. .
The cathode 23 is provided so as to cover almost the entire area of the organic EL layer 24 and a part of the one surface 21 a of the transparent resin base material 21, and is used for flowing a current through the main part, that is, the organic EL layer 24. The portion is made of a conductive first printed layer having a circular shape when viewed in plan.

The organic EL layer 24 is provided so as to cover almost the entire area of the anode 22, and is formed of a second printed layer having a circular shape when viewed in plan.
The organic EL layer 24 may be a single layer composed only of a light emitting layer, but includes at least a light emitting layer, and if necessary, a hole injection layer, a hole transport layer, an electron transport layer and / or an electron injection layer. The structure is provided.
The laminated portion including the organic EL layer 24, the anode 22 and the cathode 23 sandwiching the organic EL layer 24, the adhesive layer 25, and the sealing substrate 26 constitutes the light emitting portion 27 of the organic EL element 20.

In the organic EL element 20, the other surface 21b of the transparent resin substrate 21 is a light emitting surface.
Further, on one surface 21a of the transparent resin base material 21, a part of the anode 22 and a part of the cathode 23, in detail, a terminal 22a of the anode 22 and The vicinity and the terminal 23a of the cathode 23 and its vicinity are arranged.

The thickness of the circuit board 31 is substantially equal to the length of the light emitting unit 27 excluding the thickness of the anode 22.
The circuit board 31 is provided with a through hole 31a that penetrates in the thickness direction and has a shape that is substantially the same as the outer shape when the light emitting unit 27 is viewed in plan view.
Furthermore, on one surface 31c of the circuit board 31, a conductive portion (circuit) 32 having a first electrode 32a and a second electrode 32b, and a conductive portion (circuit) 33 having a first electrode 33a and a second electrode 33b, Is provided.

The light emitting portion 27 of the organic EL element 20 is accommodated in the through hole 31a. As a result, the inner surface of the through hole 31 a of the circuit board 31 serves as a guide for the light emitting part 27, and the anode 22 and the cathode 23 of the organic EL element 20 are aligned with respect to the conductive parts (circuits) 32 and 33 of the circuit board 31. Is done. That is, the terminal 22a of the anode 22 of the organic EL element 20 and the first electrode 32a of the conductive portion 32 of the circuit board 31 are close to each other and face the terminal 23a of the cathode 23 of the organic EL element 20 and the circuit board 31. The first electrode 33a of the conductive portion 33 is in close proximity to each other.
Further, the terminal 22 a of the anode 22 and the first electrode 32 a of the conductive portion 32 are connected via the conductive adhesive 40, and the terminal 23 a of the cathode 23 and the first electrode 33 a of the conductive portion 33 are connected to the conductive adhesive 40. Connected through.

  Then, the surface of the circuit board 31 opposite to the connection surface with the organic EL element 20 (the surface opposite to the surface on which the conductive portions 32 and 33 are provided, the outermost surface of the circuit board 31) 31b, A surface (the outermost surface of the sealing substrate 26) 26 a opposite to the adhesive surface of the stopper substrate 26 with the organic EL element 20 forms the same surface.

  Further, as shown in FIG. 2, the transparent resin base material 21 is provided with a notch 21 c from which one part of four corners of the transparent resin base material 21 is removed. In the cutout portion 21c, the second electrode 32b of the conductive portion 32 and the second electrode 33b of the conductive portion 33 are exposed.

  As the transparent resin substrate 21, a light transmissive and flexible material is used. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methacrylic acid ester copolymer Examples thereof include a film, a sheet, or a plate made of a polymer, an ethylene-acrylic acid copolymer, an ethylene-acrylic acid ester copolymer, and a metal cross-linked product thereof.

  As the transparent electrode forming the anode 22, tin-doped indium oxide (ITO), fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), aluminum-doped oxide. Examples thereof include a conductive metal oxide thin film such as zinc (AZO: Aluminum-doped Zinc Oxide) and gallium-doped zinc oxide (GZO).

Polymer-type conductive ink is used as a material for forming the conductive first printed layer forming the cathode 23.
As the polymer-type conductive ink, for example, conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition. A thermosetting type, a photocurable type, a permeation drying type or a solvent volatile type is used.

If a thermosetting resin is used as the resin composition, the polymer-type conductive ink becomes a thermosetting type capable of forming a coating film forming a conductive part at 200 ° C. or less, for example, about 100 to 150 ° C.
The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photo-curing polymer type conductive ink include, for example, a thermoplastic resin alone, or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 fine conductive particles. More than 10% by mass and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), thermoplastic A resin resin or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinkable type or a crosslinked / crosslinked resin. A thermoplastic combination type is preferably used.

  As a material for forming the second printed layer constituting the organic EL layer 24, a π-conjugated polymer or a dye-containing polymer soluble in an organic solvent is used.

The adhesive forming the adhesive layer 25 is not particularly limited as long as it is an adhesive for sealing that can seal the organic EL layer 24 and block the contact between the organic EL layer 24 and air, but is thermosetting. A mold adhesive, an ultraviolet curable adhesive, an electron beam curable adhesive, or the like is used.
Examples of the thermosetting adhesive include phenol resin, epoxy resin, polyurethane curable resin, urea resin, melamine resin, and acrylic reaction resin.
Examples of the UV curable adhesive include UV curable acrylic resin, UV curable urethane acrylate resin, UV curable polyester acrylate resin, UV curable polyurethane resin, UV curable epoxy acrylate resin, and UV curable imide acrylate resin. It is done.
Electron beam curable adhesives include electron beam curable acrylic resins, electron beam curable urethane acrylate resins, electron beam curable polyester acrylate resins, electron beam curable polyurethane resins, electron beam curable epoxy acrylate resins, and cationic curable resins. Resin etc. are mentioned.

  The sealing substrate 26 is not particularly limited as long as it is in the form of a film, sheet or plate, but the same as the transparent resin substrate 21 or a woven fabric made of inorganic fibers such as glass fibers and alumina fibers. Nonwoven fabrics, mats, papers or combinations thereof, woven fabrics made of organic fibers such as polyester fibers and polyamide fibers, nonwoven fabrics, mats, papers or combinations thereof, or impregnated with resin varnish Examples thereof include a covering member, a glass base material, and various metal base materials formed by molding.

  The circuit board 31 is not particularly limited, but is equipped with an electronic component such as a CPU (Central Processing Unit) for controlling the operation of the organic EL element 20 and a battery for mounting a battery serving as a power source for operating the organic EL element 20. Part, the organic EL element 20 and a conductive part (circuit) for connecting the electronic component and the battery mounting part, conductive parts 32 and 33 for mounting the organic EL element 20, etc. A film-like, sheet-like or plate-like substrate is used.

  As the conductive adhesive 40, ACP (Anisotropic Conductive Paste), NCP (Non Conductive Resin Paste), or the like is used.

  In the organic EL component 10, the anode 22 is provided on one surface 21 a of the transparent resin base material 21, and the cathode 23 is provided so as to cover the organic EL layer 24 and the one surface 21 a of the transparent resin base material 21. The organic EL layer 24 is provided so as to cover the anode 22, and the light emitting portion 27 of the organic EL element 20 is accommodated in the through hole 31 a of the circuit board 31. The terminal 22a of the anode 22 and the terminal 23a of the cathode 23 are connected to the two first electrodes 32a and 33a provided on one surface 31c of the circuit board 31, respectively, and the connection of the circuit board 31 to the organic EL element 20 is performed. Since the surface 31b opposite to the surface and the surface 26a opposite to the bonding surface of the sealing substrate 26 to the organic EL element 20 are the same surface, the terminal of the anode 22 of the organic EL element 20 22a and shade 23, the first electrodes 32a and 33a of the circuit board 31 can be sufficiently brought into contact with each other, and after these electrodes are connected to each other, a force acts on the connecting portion in a direction in which the connection is released. Can be prevented. Therefore, it is possible to prevent poor connection between the organic EL element 20 and the circuit board 31.

  In this embodiment, the organic EL component 10 including the organic EL element 20 provided with the anode 22, the cathode 23, and the organic EL layer 24 having a circular shape in a main part when viewed in plan is illustrated. The organic EL component of the invention is not limited to this. In the organic EL component of the present invention, the planar shape of the organic EL layer can be set to an arbitrary shape, and the planar shape of the main part of the anode and the cathode is adjusted according to the planar shape of the organic EL layer. You can also

  In addition, in the organic EL component of the present invention, in order to facilitate the alignment of the organic EL element and the circuit board, a convex part made of a protrusion or a protrusion is formed on a part of the outer periphery of the light emitting part of the organic EL element. The concave portion (fitting portion) having a shape corresponding to the shape of the convex portion may be provided on the inner surface of the through hole of the circuit board. Or the convex part which consists of protrusion or a protrusion is provided in a part of inner surface of the through-hole of a circuit board, and the recessed part (fitting part) of the shape according to the shape of this convex part on the outer periphery of the light emission part of an organic EL element May be provided.

Next, with reference to FIGS. 3-9, the manufacturing method of the organic electroluminescent component of this embodiment is demonstrated.
First, as shown in FIG. 3, a conductive metal oxide such as ITO, FTO, or ATO is deposited on one surface 21a of the transparent resin base material 21 by sputtering or the like, and the conductive metal oxide thin film is formed. An anode 22 having a predetermined shape is formed.

Next, as shown in FIG. 4, the organic EL layer 24 having a predetermined shape is formed so as to cover almost the entire area of the anode 22 by a printing method using a π-conjugated polymer or a dye-containing polymer soluble in an organic solvent. Two printed layers are formed.
In this step, an inkjet method, a screen printing method, or the like is used as the printing method.

Next, as shown in FIG. 5, the cathode 23 is formed so as to cover almost the entire area of the organic EL layer 24 and a part of one surface 21 a of the transparent resin substrate 21 by a printing method using a polymer type conductive ink. A first printed layer having a predetermined shape is formed.
In this step, gravure printing, flexographic printing, die coating, spray coating, screen printing, and the like are used as printing methods.

  Next, as shown in FIG. 6, a sealing adhesive is applied so as to cover the main part of the cathode 23 and the entire area of the organic EL layer 24, thereby forming an adhesive layer 25 made of this sealing adhesive.

  Next, as shown in FIG. 7, the sealing substrate 26 is bonded to the cathode 23 through the adhesive layer 25 to obtain the organic EL element 20.

Next, as shown in FIG. 8, the light emitting portion 27 of the organic EL element 20 is accommodated in the through hole 31 a of the circuit board 31, and the terminal 22 a of the anode 22 is connected to the circuit board 31 via the conductive adhesive 40. The first electrode 32 a of the conductive part 32 is connected, and the terminal 23 a of the cathode 23 and the first electrode 33 a of the conductive part 33 of the circuit board 31 are connected via the conductive adhesive 40.
In this process, the organic amount of the circuit board 31 is adjusted by adjusting the coating amount of the conductive adhesive 40 interposed between the terminal 22a and the first electrode 32a and between the terminal 23a and the first electrode 33a. The surface 31b opposite to the connection surface with the EL element 20 and the surface 26a opposite to the adhesion surface of the sealing substrate 26 to the organic EL element 20 are made the same surface.

  Through the above steps, the organic EL component 10 shown in FIG. 9 is obtained.

It is the schematic which shows one Embodiment of the organic electroluminescent component of this invention, (a) is a top view, (b) is sectional drawing which follows the AA line of (a). It is a schematic bottom view which shows one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows the manufacturing method of one Embodiment of the organic electroluminescent component of this invention. It is a schematic sectional drawing which shows an example of the sheet-like organic EL element produced by applying printed electronics. It is a schematic sectional drawing which shows the state which mounted the sheet-like organic EL element produced by applying printed electronics to the circuit board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Organic EL component, 20 ... Organic EL element, 21 ... Transparent resin base material, 22 ... Anode, 23 ... Cathode, 24 ... Organic EL layer, 25 ... Adhesion Layer, 26... Sealing substrate, 27... Light emitting part, 31... Circuit board, 32, 33 .. conductive part (circuit), 40.

Claims (1)

An organic electroluminescent layer including at least a light emitting layer is sandwiched between a pair of opposing anode and cathode, and a sealing substrate is bonded to the cathode via an adhesive layer covering the cathode and the organic electroluminescent layer. An organic electroluminescent component comprising: an organic electroluminescent element comprising: a circuit board electrically connected to the organic electroluminescent element;
The anode consists of a transparent electrode provided on one surface of a transparent resin base material,
The cathode comprises a conductive first printed layer provided to cover one surface of the organic electroluminescence layer and the transparent resin substrate,
The organic electroluminescence layer is composed of a second printed layer provided so as to cover the anode,
The light emitting part of the organic electroluminescence element is accommodated in a through-hole penetrating the circuit board in the thickness direction, and the anode and the cathode are connected to two different electrodes provided on one surface of the circuit board. Each connected
The surface of the circuit board opposite to the connection surface with the organic electroluminescence element and the surface of the sealing substrate opposite to the adhesion surface with the organic electroluminescence element are the same surface. An organic electroluminescence component characterized by that.

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