JP2010059010A - Ceramic junction body for manufacturing semiconductor, and method for manufacturing the same - Google Patents

Abstract

The joint also has the same level of strength as the part itself to be joined, and maintains the joined state and maintains the function as an integral member even when a missing part occurs around the joint. A ceramic joined body that can be suitably used as a semiconductor manufacturing member and a method for manufacturing the same are provided.
A ceramic joined body in which a second ceramic sintered body having the same composition is inserted into a recessed portion of the first ceramic sintered body and joined to the first ceramic sintered body having a recessed portion. When manufacturing, a slurry preparation step in which ceramic particles having the same composition as the ceramic sintered body and having an average particle diameter of 5 nm to 75 nm are dispersed, a slurry applying step to the joint surface, and a first ceramic sintered body A second ceramic sintered body is inserted into the concave portion of the calcined body, and the joining surfaces are matched with each other, and then sintered and joined at 1500 ° C. or more and 2000 ° C. or less.
[Selection figure] None

Description

  The present invention relates to a ceramic joined body for semiconductor production in which another ceramic sintered body is inserted and joined in a recess of the ceramic sintered body and a method for producing the same.

Ceramics are used as various structural members because they have excellent heat resistance, corrosion resistance, wear resistance, high hardness, high strength, etc. In particular, high purity ceramics are used in semiconductor manufacturing. It is also used suitably for a member for use.
However, since many ceramics are hard and brittle, they are difficult to process as compared to metals and resins, and complicated-shaped members are often difficult to manufacture by integral molding. Combining and joining parts to form a member.

As a method for joining ceramic parts, for example, Patent Document 1 describes a method in which a ceramic-based slurry adhesive is used for bonding, followed by firing.
Moreover, when producing a joined body in which other ceramic parts are inserted and integrated into a ceramic part having a hole or a recess, for example, as described in Patent Document 2, firing shrinkage of each part is performed. A method of using so-called shrink fitting, in which the difference in rate is used to join by firing, is known.

JP 2003-128473 A JP-A-6-279131

However, the ceramic slurry adhesive as described in Patent Document 1 has a low purity of ceramic particles contained in the adhesive, and the strength at the joint is 1 compared to the strength of the parts to be joined. About inferior. Moreover, since many impurity components other than a ceramic particle component are contained, it had the subject that it is inferior to the corrosion resistance of a junction part.
Furthermore, when the ceramic joined body joined by the adhesive is used as a member for manufacturing a semiconductor, there is a possibility that the wafer to be processed and the like is contaminated by other impurity components other than the ceramic particle component contained in the adhesive.

Moreover, although the joining method by shrink fitting as described in the above-mentioned Patent Document 2 provides higher joining strength than joining using the adhesive, the part is cracked and missing in the vicinity of the joining part. There may be places.
In shrink fitting, the outer part is only tightened to the inner part due to heat shrinkage and the shape and the fixed state are maintained. Are easily separated.

  The present invention has been made in order to solve the above technical problem, and the joint portion has the same level of strength as the part to be joined itself, and a missing portion occurs around the joint portion. Another object of the present invention is to provide a ceramic joined body that can maintain a joined state, maintain a function as an integral member, and can be suitably used as a semiconductor manufacturing member, and a method for manufacturing the same. .

In the ceramic joined body for manufacturing a semiconductor according to the present invention, the second ceramic sintered body having the same composition is inserted into the concave portion of the first ceramic sintered body in the first ceramic sintered body having the concave portion. The joined portion of the first ceramic sintered body and the second ceramic sintered body is an average composed of the same composition as that of the first and second ceramic sintered bodies. It is characterized by being in close contact with a sintered body of ceramic particles having a particle size of 5 nm to 75 nm.
The ceramic joined body having such a structure has a further improved joining strength in so-called shrink fitting, and has a strength equivalent to that of the parts to be joined even in the shrink fitting joint, and is missing around the joint. Even if a location is generated, the joined state can be maintained and the function as an integral member can be maintained.

  In particular, it is preferable that the ceramic bonded body has an alumina composition from the viewpoint of high purity, bonding characteristics, semiconductor use, and the like.

Further, in the method for manufacturing a ceramic joined body for semiconductor production according to the present invention, the second ceramic sintered body having the same composition is added to the first ceramic sintered body having the concave portion. A method for producing a ceramic joined body that is inserted into a recess and joined thereto, wherein a slurry in which ceramic particles having the same composition as the first and second ceramic sintered bodies and having an average particle diameter of 5 nm to 75 nm are dispersed. Alternatively, the slurry or paste is applied to one or both of the step of preparing the paste and the bonding surface of the calcined body or the molded body that is the precursor of the first ceramic sintered body and the second ceramic sintered body. The second ceramic sintered body is inserted into the recess of the calcined body or molded body, which is a precursor of the first ceramic sintered body, and the coating step. , After adjusting the bonding faces, characterized in that it comprises a step of bonding by sintering at 1500 ° C. or higher 2000 ° C. or less.
When the above-described slurry or paste is used for bonding, ceramic particles having the same composition as that of the first and second ceramic sintered bodies are sintered in the inserted joint due to particle growth of the particles during sintering. A bonded body is formed, and a ceramic bonded body having high bonding strength as described above can be obtained.

  The above production method can be suitably applied particularly when the composition is alumina.

The ceramic bonded body according to the present invention has high bonding strength, and can maintain a bonded state and maintain a function as an integral member even when a missing portion is generated around the bonded portion.
Moreover, since the whole ceramic joined body which concerns on this invention consists of the same composition, it can aim at prevention of the impurity contamination with respect to the to-be-processed wafer etc. at the time of using as a member for semiconductor manufacture.
Moreover, according to the manufacturing method which concerns on this invention, the ceramic joined body which concerns on said this invention can be obtained suitably.

Hereinafter, the present invention will be described in detail.
In the ceramic joined body for manufacturing a semiconductor according to the present invention, the second ceramic sintered body having the same composition is inserted into the concave portion of the first ceramic sintered body in the first ceramic sintered body having the concave portion. It is a ceramic joined body joined together.
And the junction part of this joined body is closely_contact | adhered by the sintered compact of the ceramic particle | grains with the average particle diameter of 5 nm or more and 75 nm or less which consists of the same composition as the said 1st and 2nd ceramic sintered compact. Is.
The present invention further improves the bonding strength in the so-called shrink-fit bonding utilizing the thermal shrinkage during sintering.
That is, the joined body according to the present invention has the same level of strength as the parts to be joined even in the shrink-fitted joint, and maintains the joined state even when a missing portion is generated around the joint. And it is a joined body which can maintain the function as an integral member.

It is preferable that the first and second ceramic sintered bodies have the same composition so that the thermal behavior during sintering is the same during bonding.
Furthermore, it is more preferable that the same material manufactured by the same manufacturing method is used.

Since the ceramic joined body according to the present invention is used for semiconductor manufacture, the composition includes alumina (Al ₂ O ₃ ), zinc oxide (ZnO), silica (SiO ₂ ), ceria (CeO ₂ ), and oxidation. Holmium (Ho ₂ O ₃ ), titania (TiO ₂ ), magnesia (MgO), yttria (Y ₂ O ₃ ), zirconia (ZrO ₂ ) and the like are preferable. Among these, high purity (purity 99.9% or more) fine particles can be easily obtained and excellent bonding characteristics can be obtained, which is preferable.
The ceramic joined body according to the present invention is required to have high purity, high corrosion resistance, etc. for semiconductor production, and therefore preferably has a high purity of 99.9% or more.

In addition, the bonding portion does not contain impurities, and the first and second ceramic sintered bodies are integrated with high bonding strength, so that the sintered portion has the same composition as the first and second ceramic sintered bodies. It is preferable that the body is closely attached.
In addition, in order to prevent exfoliation or breakage due to the difference in thermal expansion coefficient between the first and second ceramic sintered bodies and the joint, and to obtain a joined body for manufacturing semiconductors having excellent corrosion resistance, Also in the composition, it is preferable that the purity is 99.9% or more.
Furthermore, it is preferable that the sintered body of the joint portion is made of ceramic particles having an average particle diameter of 5 nm to 75 nm from the viewpoint of obtaining high bonding strength.

In addition, since the joined body according to the present invention is joined by shrink fitting, the shape of each ceramic sintered body to be joined is such that the first ceramic sintered body has a concave portion. It is comprised so that a 2nd ceramic member may be inserted in.
The concave portion may be a hole, and the joined body may be formed by, for example, inserting a columnar body into a tubular body, or inserting a small diameter tubular body into a large diameter tubular body. Also good.
Moreover, the peripheral surface of a junction part is not limited to circular shape, A polygonal shape may be sufficient.
Note that the ceramic joined body according to the present invention is not limited to a joined body of two ceramic sintered bodies, and three or more ceramic sintered bodies having the same composition are joined via joints. It may be what was done.

Specifically, the ceramic joined body can be obtained by the following manufacturing method according to the present invention.
The method for producing a ceramic joined body according to the present invention comprises a step of preparing a slurry or paste in which ceramic particles having an average particle diameter of 5 nm to 75 nm and having the same composition as the first and second ceramic sintered bodies are dispersed. Applying the slurry or paste to one or both of a calcined body or a molded body that is a precursor of the first ceramic sintered body and a joint surface of the second ceramic sintered body; After inserting the second ceramic sintered body into the concave portion of the calcined body or molded body, which is a precursor of the ceramic sintered body 1, and matching the joint surfaces, the temperature is 1500 ° C. or higher and 2000 ° C. or lower. And a step of sintering and joining.
When the above-described slurry or paste is used for bonding, ceramic particles having the same composition as that of the first and second ceramic sintered bodies are sintered in the inserted joint due to particle growth of the particles during sintering. A bonded body is formed, and a ceramic joined body as described above can be obtained.

Hereinafter, the said manufacturing method is demonstrated in order of each process.
First, first and second ceramic sintered bodies having the same composition are produced by a known method.
Next, ceramic particles having the same composition as the first and second ceramic sintered bodies and having an average particle size of 5 nm to 75 nm are dispersed in a dispersion medium and mixed to prepare a slurry or paste.
The dispersion medium is appropriately selected in consideration of the dispersibility according to the material of the ceramic particles, the viscosity of the slurry or paste, and the like, but it is preferably a liquid that does not produce a residual component after the sintering treatment. In general, pure water, alcohol or the like is used.

Next, the prepared slurry or paste is applied to one or both of the bonding surface between the calcined body or the molded body, which is a precursor of the first ceramic sintered body, and the second ceramic sintered body.
About the 1st ceramic sintered compact which has a recessed part, since it joins by shrinkage | fitting by shrinkage | contraction at the time of sintering, in the state of the calcined body and the molded object which are not fully sintered, 2nd ceramic sintered The body is inserted into the recess.
The application of the slurry or paste is performed using, for example, a brush. The application may be performed on only one or both of the bonding surfaces of the first and second ceramic sintered bodies to be bonded.

Finally, the second ceramic sintered body is inserted into the recess of the calcined body or the molded body, which is a precursor of the first ceramic sintered body, and the joining surfaces to which the slurry or paste is applied are bonded to each other. After combining, sintering is performed at 1500 ° C. or more and 2000 ° C. or less and bonding is performed.
Thereby, a bonded body with high bonding strength can be obtained by the effects of both the bonding force by shrink fitting and the bonding force by the sintered body of the ceramic particles in the slurry or paste.
When the treatment temperature is less than 1500 ° C., the grain growth of the ceramic particles in the slurry or paste does not proceed sufficiently, and sufficient joint strength cannot be obtained at the joint.
On the other hand, even if the treatment temperature exceeds 2000 ° C., it is not possible to improve the bonding strength corresponding to the temperature.

  The manufacturing method can be applied to various ceramic joined bodies, and is particularly suitable for producing an alumina ceramic joined body.

Moreover, since the manufacturing method which concerns on this invention aims at the improvement of the joining strength by shrink fitting, when inserting and joining the tubular bodies from which a diameter differs, it can exhibit the outstanding effect. Since the obtained tubular joined body is excellent in airtightness, it can be suitably used as a gas pipe or the like.
In this case, it is preferable that the gap between the fitting portions of each tubular body is small. However, in order to obtain high airtightness, it is preferable to have a margin that the applied slurry or paste does not peel off.
As a result, even if there is a missing portion in the bonded ceramic sintered body around the bonded portion, there is a sintered body of slurry or paste applied to the bonded surface. However, without being easily separated, the joined state can be maintained, the function as an integral member can be maintained, and the joined body can be used continuously.

EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not restrict | limited by the following Example.
[Test 1]
An alumina sintered body pipe A having an outer diameter of 12 mm, a wall thickness of 2 mm, and a length of 120 mm, and an alumina calcined body pipe B having an inner diameter of 12.2 mm, a wall thickness of 1 mm, and a length of 120 mm calcined at 900 ° C. were prepared. . After applying slurry in which alumina particles were dispersed to the joint portion of the pipe A, about 10 mm was inserted into the hole of the pipe B and sintered at 1800 ° C. in the atmosphere.
The average particle size of the alumina particles of the slurry was changed as shown in Table 1, and the airtightness of the joint was evaluated for each of the obtained joined bodies.

Further, a load was locally applied to the joint portion of the pipe B into which the pipe A was inserted, and a crack was generated, and a missing portion was intentionally generated at about 1/4 of the outer periphery of the pipe B.
A tensile test for evaluating the strength with which the pipe is pulled out was performed on the joined body in which the missing portion was generated.
These results are summarized in Table 1.
In Comparative Example 4, bonding was performed without applying the slurry.

As shown in Table 1, all of the bonded bodies had good airtightness, but the bonding strength when a missing portion was generated in the bonded portion was that the average particle diameter of the alumina particles of the applied slurry was 100 nm. In the above (Comparative Examples 1 to 3), the pipe of the joined body was pulled out at about 400 N, which was about the same as the case where no slurry was applied (Comparative Example 4).
On the other hand, when a slurry of alumina particles having an average particle size of 5 nm or more and 75 nm or less was applied to the joint, the joint strength of the pipe was sufficient even when the joint was missing.

[Test 2]
Sintering temperature was changed as shown in Table 2, and other than that was performed in the same manner as in Example 2 to produce a joined body, and each evaluation was performed.
These results are summarized in Table 2.

As shown in Table 2, when the sintering temperature was 1500 ° C. or higher (Examples 2 to 7), the tensile strength was high, and the effect of slurry application was recognized.
On the other hand, when the sintering temperature was less than 1500 ° C. (Comparative Examples 5 to 7), sufficient bonding strength was not obtained, and the effect of slurry application was not recognized.

[Test 3]
The inner diameter of the pipe B was changed as shown in Table 2, and a joined body was produced in the same manner as in Example 2 except that, and each evaluation was performed.
These results are summarized in Table 3.

As shown in Table 3, when the outer diameter of the pipe A is 12 mm and the inner diameter of the pipe B is less than 1.05 times (samples 1 to 4), the applied slurry is rubbed and peeled when inserted. A sufficient bonding strength was not obtained.
On the other hand, if a certain amount of clearance (the inner diameter of pipe B is 1.05 times or more than the outer diameter of pipe A) can be secured at the joint between both pipes, the slurry will not peel off and perform its function sufficiently. Was recognized. However, when the inner diameter of the pipe B exceeded 1.21 times the outer diameter of the pipe A (sample 9), the shrinkage due to the sintering of the pipe B became insufficient, and the pipe B was not joined.
In this test, higher joint strength was obtained when the inner diameter of the pipe B was 1.05 times or more and 1.13 times or less of the outer diameter of the pipe A.

Claims (4)

A ceramic joined body in which a second ceramic sintered body having the same composition is inserted into and joined to the concave portion of the first ceramic sintered body to the first ceramic sintered body having a concave portion,
The joint between the first ceramic sintered body and the second ceramic sintered body is formed by firing ceramic particles having the same composition as the first and second ceramic sintered bodies and having an average particle size of 5 nm to 75 nm. A ceramic joined body for manufacturing a semiconductor, characterized in that the bonded body is in close contact.   2. The ceramic joined body for manufacturing a semiconductor according to claim 1, wherein the composition is alumina. A method of manufacturing a ceramic joined body in which a second ceramic sintered body having the same composition is inserted into a concave portion of the first ceramic sintered body and joined to the first ceramic sintered body having a concave portion. And
Preparing a slurry or paste in which ceramic particles having an average particle size of 5 nm or more and 75 nm or less and having the same composition as the first and second ceramic sintered bodies are dispersed;
Applying the slurry or paste to one or both of the calcined body or molded body, which is a precursor of the first ceramic sintered body, and the joint surface of the second ceramic sintered body;
The second ceramic sintered body is inserted into the recessed portion of the calcined body or the molded body that is the precursor of the first ceramic sintered body, and after joining the joining surfaces, 1500 ° C. or more and 2000 ° C. A method for producing a ceramic joined body for semiconductor production, comprising: sintering and joining in the following.   4. The method for producing a ceramic joined body for semiconductor production according to claim 3, wherein the composition is alumina.