JP2010055812A - Manufacturing method of plasma display panel rear substrate and laminating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a PDP rear substrate capable of appropriately arranging dry film resist between rib material layers, and an apparatus for the same. <P>SOLUTION: The method of manufacturing the plasma display panel rear substrate has a laminating process of overlapping a strip-shaped dry film resist 1 on a substrate 2 having rib material layers 3, 3, ..., arrayed in parallel in a manufacturing line width direction while letting them run in the same advancing direction. The dry film resist in one sheet in a width direction is cut along a manufacturing line advancing direction by the laminating process, and the substrate and the dry film resist are overlapped on each other so that a cut line generated by the cutting is arranged along between the rib material layers arrayed in parallel in the manufacturing line width direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a plasma display panel rear substrate manufacturing method and a dry film resist laminating apparatus.

  A plasma display panel (hereinafter sometimes referred to as “PDP”) used in a plasma television or the like has a back substrate as one of its constituent elements. The rear substrate is combined with the front substrate to constitute the main part of the image source of the PDP. As shown in FIG. 7, when the details of the back substrate 100 are enlarged, partition walls (also referred to as “ribs”) provided on the substrate 101 are also referred to as “ribs”. Are provided between the ribs 102, 102,..., And various electrodes 104, 104,... That communicate necessary electric signals. As shown in FIG. 8, the back substrate 100 is provided with a rib group 105 having a predetermined size as a whole and having the above-described detailed configuration, and the rib group 105. Are formed with lead-out electrodes 106, 106,.

  In manufacturing the back substrate 100 as described above, it is necessary to form ribs having a predetermined pattern as can be seen from the above. There are several methods for forming the rib, and the following process can be given as an example. That is, an electrode is first formed on the substrate 101, and a dielectric layer is applied and baked thereon. Thereafter, a rib material is applied and dried to form a rib material layer, and a dry film resist (hereinafter sometimes referred to as “DFR”) is laminated. Then, a mask pattern is formed on the DFR, and the material of the rib material layer corresponding to the mask pattern is removed to obtain a necessary rib pattern.

  In addition, the manufacture of the back substrate 100 is not a single unit as shown in FIG. 8, but a plurality of rib groups 105 and lead electrodes 106, 106,. To be formed. FIG. 9 shows that in manufacturing the back substrate 100 described above, rib material layers 105 ′, 105 ′,... Are juxtaposed on the substrate 101 ′, and lead electrodes 106, from the sides of the rib material layers 105 ′, 105 ′,. It is the figure which showed typically the state which 106, ... extends. The traveling direction of the production line is the direction indicated by the arrow P in FIG. In the example shown in FIG. 9, two sets of rib material layers 105 ′ and 105 ′ and lead electrodes 106, 106,.

  From such a state, DFR is laminated on the rib material layers 105 ′ and 105 ′. Originally, it is efficient to laminate a single DFR in the production line width direction by making the size of the film-like DFR in the production line width direction substantially the same as the size of the substrate 101 ′ in the production line width direction. is there. However, when laminated in this manner, the DFR does not follow the unevenness of the rib material layers 105 ′ and 105 ′ indicated by Q in FIG. In some cases, the substrate 101 ′ was not properly adhered. This is because the rib material layers 105 ′ and 105 ′ have a predetermined height and the DFR is laminated with a relatively high tension. As described above, it is not preferable that the DFR does not properly adhere to the substrate 101 ′ in the portion indicated by Q in FIG. 9 in terms of dry film pattern formation for the purpose of protecting components such as electrodes and various marks.

  Therefore, conventionally, two DFRs are used in the width direction of the production line (so-called double catching), and the end portions of the two DFRs are located between the rib material layers 105 ′ and 105 ′ indicated by Q in FIG. Laminated to be placed. However, in such a case, it is difficult to arrange the two DFRs at the position Q so that the end portions of the two DFRs do not overlap with each other or a large gap is not generated. In addition, since a predetermined tension is applied to the DFR for lamination, it is a complicated process to adjust the tension to the two DFRs in the same manner.

On the other hand, for example, an invention such as Patent Document 1 is disclosed. In this method, two films are arranged in the production line width direction so that the end portions overlap each other, and the overlapping portions are cut by a cutter before lamination on the substrate so that the end positions of the two sheets are made appropriate. That's it. Moreover, in order to remove the resist applied to the edge portion of the dry film resist before pressure bonding, the invention described in Patent Document 2 is cut into a predetermined position from both ends of the dry film resist with a cutter. The adhesive tape is fed, and the resist at the edge portion where the cut is made is attached to the adhesive tape and wound up.
Japanese Patent Publication No. 61-6791 JP 2004-148484 A

  However, in the invention described in Patent Document 1, it is still necessary to use two DFRs, and there is a complicated problem of adjusting these two DFRs to the same conditions. Further, in the present invention, the overlapping portion of the two DFRs is discarded after cutting, resulting in a waste of material. In addition, the invention described in Patent Document 2 is cutting for removing the end portion and does not solve the above-described problem.

  In view of the above problems, an object of the present invention is to provide a method for manufacturing a PDP rear substrate and an apparatus for the same that can appropriately arrange a dry film resist between rib material layers.

  The present invention will be described. In order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are appended in parentheses, but the present invention is not limited to the illustrated embodiment.

  The invention described in claim 1 is a method of manufacturing a plasma display panel rear substrate, wherein the substrate (2) has rib material layers (3, 3,...) Arranged in parallel in the manufacturing line width direction, The dry film resist (1) has a laminating step of laminating while running in the same traveling direction, and the dry film resist that was one in the width direction is cut along the production line traveling direction by the laminating step, A plasma display panel rear substrate, wherein the substrate and the dry film resist are overlapped so that a cutting line generated by the cutting is arranged between rib material layers arranged in parallel in the production line width direction. The above-mentioned problem is solved by providing the manufacturing method.

  That is, according to this, a dry film resist can be appropriately disposed without overlapping between rib material layers, and a manufacturing method capable of protecting each constituent member of the back substrate can be provided.

  Here, the “rib material layer” refers to a material in which a rib material is laminated on a substrate in a state before the rib pattern is formed on the rear substrate of the plasma display panel. In addition, “production line” relates to laminating a dry film resist including each process of unwinding, transporting, cutting, and laminating the dry film resist among the lines having the respective processes for producing the plasma display panel back substrate. It means a range having a process. The same applies hereinafter.

  The invention according to claim 2 is a lami roll (21), wherein the cutting of the dry film resist (1) in the method for producing a plasma display panel rear substrate according to claim 1 is a roll for laminating the dry film resist on the substrate; , And the guide roll (22) adjacent to the upstream side in the transport direction of the dry film resist of the lami roll.

  By this manufacturing method, it is possible to cut at a position close to the portion where the dry film resist is laminated, and it is possible to minimize the deviation between the end portions due to the cutting.

  The invention according to claim 3 is used in the process of manufacturing the rear substrate of the plasma display panel, and has a substrate (2) having rib material layers (3, 3,. A laminating apparatus (10) for laminating a film resist (1) while traveling in the same traveling direction, a roll (22) for transporting the dry film resist, and a laminar roll (21) for laminating the dry film resist on the substrate And a cutting device (23) that is disposed upstream of the lami roll in the dry film resist conveyance direction and cuts the dry film resist, which is one sheet in the width direction, along the production line advancing direction. A cutting device is provided so that the cutting line of the dry film resist is arranged between the rib material layers arranged in parallel in the production line width direction. To solve the above problems by providing a laminating apparatus according to claim Rukoto.

  That is, according to this, it is possible to provide a laminating apparatus that can appropriately arrange a dry film resist without overlapping between rib material layers and protect each component of the back substrate.

  According to a fourth aspect of the present invention, the cutting device (23) of the laminating apparatus (10) according to the third aspect includes a laminar roll (21) and a roll (22) adjacent to the upstream side of the laminar roll in the dry film resist conveyance direction. ), And between.

  With such a laminating apparatus, it is possible to cut at a position close to the portion where the dry film resist is laminated, and it is possible to minimize the deviation between the ends due to the cutting.

  The invention according to claim 5 is characterized in that the cutting device (23) of the laminating apparatus (10) according to claim 3 or 4 is a rotary cutter.

  By using a rotary cutter as the cutting device, it is possible to reduce the frequency of cleaning of the blade as compared with other cutting devices, and to facilitate the management thereof.

  ADVANTAGE OF THE INVENTION According to this invention, when manufacturing a plasma display back substrate, arrangement | positioning of the dry film resist between the rib material layers paralleled in the manufacturing line width direction can be made appropriate. Specifically, the dry film resist does not overlap twice between the rib material layers. Further, the dry film resist follows the unevenness caused by the rib material layer and the lead electrode well between the rib material layers.

  Such an operation and gain of the present invention will be made clear from the best mode for carrying out the invention described below.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings. However, the present invention is not limited to the embodiment.

Here, from the viewpoint of easy understanding, the laminating apparatus will be described first.
FIG. 1 is a diagram schematically showing an outline of a laminating apparatus 10 according to the first embodiment of the present invention. The laminating apparatus 10 includes a film supply unit 11, a guide unit 15, a laminating unit 20, a substrate separating unit 30, an entrance conveyor unit 35, and an exit conveyor unit 40.

The film supply part 11 is a site | part which is provided with the unwinding part 12, and comprises the guide roll 13 as needed. A roll-shaped DFR 1 is disposed in the unwinding portion 12, and the DFR 1 is unwound from here. The DFR 1 disposed in the unwinding unit 12 is one sheet in the production line width direction (back of paper / front side).
As described above, the film supply unit 11 is configured such that each component member used in the unwinding unit 12, the guide roll 13, and the like are used in a normal laminating apparatus, except that the DFR 1 is one sheet in the production line width direction as described above. Similar ones can be used.

  The guide unit 15 is a part that guides the DFR 1 unwound from the film supply unit 11 onto a production line on which the substrate 2 is conveyed. Accordingly, guide rolls 16 and 17 are disposed in the guide portion 15. In addition, for example, various devices for inspecting the state of the DFR 1 are often provided here. Examples of the inspection device include a tension detection shaft (machine).

  The laminating unit 20 includes the DFR 1 on the substrate 2, the rib material layer 3 arranged in parallel on the substrate 2, and the extraction electrodes 4 and 4 (see FIGS. 2 and 3) extending from the outer periphery of the rib material layer 3. This is the part to be laminated. FIG. 2 is a perspective view schematically showing the laminate portion 20, and FIG. 3 is a view of the laminate portion 20 of FIG. 2 viewed from the direction indicated by A in FIG. The laminate unit 20 will be described with reference to FIGS.

The laminating unit 20 includes a lami roll 21, a guide roll 22, a cutting device 23, and a transport roll 26.
The lami roll 21 is a roll arranged so that a part thereof is in contact with the substrate 2 on which the rib material layers 3, 3,... And the extraction electrodes 4, 4,. It is a roll that laminates the DFR1 so that the DFR1 is interposed therebetween. The same lami roll 21 as the lami roll of a normal laminating apparatus can be used. Further, it is preferable that an elastic material such as rubber is wound around the surface of the lami roll 21. Accordingly, the DRF 1 can be strongly adhered to the rib material layers 3 and 3 and the substrate 2 by the elastic force.

  The guide roll 22 is a roll for guiding the DFR 1 to the lami roll 21 and is a normal guide roll.

  The cutting device 23 is a device that is disposed between the guide roll 22 and the lami roll 21 and cuts the DFR 1. More specifically, the cutting device 23 includes a rotary cutter 24 disposed so as to be pressed against the DFR 1 from one surface side of the DFR 1, and a cutter receiver 25 disposed on the other surface side of the DFR 1 and receiving the rotary cutter 24. have. Accordingly, the DFR 1 is cut and separated by the cutting device 23.

As can be seen from FIG. 2, the cutting device 23 is arranged at a position that divides the DFR 1 into two in the production line width direction along the transport direction of the belt-shaped DFR 1. The cutting line is indicated by B in FIG. Here, the cutting device 23 is further arranged so that the cutting line B is provided along (D) between the rib material layers 3a and 3b adjacent in the manufacturing line width direction. Further, it is preferable that the cutting line B is disposed between the extraction electrodes 4a, 4a,... Extending from the rib material layers 3a, 3b and the extraction electrodes 4b, 4b,.
Thereby, it arrange | positions so that the edge parts of DFR1 may be attached together between rib material layer 3a, 3b or between extraction electrode 4a, 4a, ... and extraction electrode 4b, 4b, ..., and edge parts overlap. This can be prevented. Further, since the cut end is a free end, the DFR 1 can be disposed following the unevenness of the rib material layer 3 and the extraction electrode 4 disposed on the substrate 2 well.

The position of the cutting device 23 in the DFR1 transport direction (for example, the distance indicated by E in FIG. 3) is not particularly limited, and can be set as appropriate in consideration of the positional relationship with other elements in the device. Therefore, it may be arranged between the guide roll 22 and the lami roll 21 as shown in the present embodiment, or may be arranged on the upstream side of the guide roll 22 like the cutting device 23 ′ shown in FIG. Good.
However, since it is difficult for the positions of the cut ends to be displaced by laminating as soon as possible after cutting, in this embodiment, as shown in FIG. The example arrange | positioned between the guide roll 22 and the lami roll 21 was shown.

  Moreover, although what used the rotary cutter was illustrated as the cutting device 23 in this embodiment, as long as DFR1 can be cut | disconnected appropriately as mentioned above, what kind of cutting device may be used. For example, a normal straight blade type cutter may be used. In the present embodiment, as a result of studying a device for cutting DFR 1 more appropriately in the production line, the knowledge that it is a rotary cutter is obtained as a preferable one, and this is shown. The rotary cutter presses the blade against the DFR 1 and cuts it, so that it is difficult to have cutting residue, and the frequency of maintenance such as cleaning can be reduced as compared with other cutting devices (for example, a straight blade type cutter).

  The substrate separating unit 30 is a part that cuts the straddled portion of the DFR 1 laminated across the single-wafer substrates 2, 2,. That is, a plurality of substrates 2, 2,... Are continuously flowed on the production line, and the DFR 1 is in a state of straddling between the substrates 2, 2,. Therefore, in the substrate separating unit 30, the DFR 1 laminated between the substrates 2 and 2 is cut by the cutting device 34 and separated into the substrates 2 and 2.

  The entrance conveyor unit 35 and the exit conveyor unit 40 are parts that carry in and out the substrate 2 having predetermined elements to and from the laminating apparatus 10. Therefore, here, transport rolls 36, 36,..., 41, 41,.

FIG. 5 is a view schematically showing an outline of a laminating apparatus 60 according to the second embodiment. In FIG. 5, the same code | symbol is used about the same member (part) as the laminating apparatus 10 which concerns on 1st embodiment. Since the above description can be used in common for the same reference numerals, the description is omitted here.
The laminating device 60 is different in that the cutting device 23 arranged in the laminating unit 20 in the laminating device 10 is not in the laminating unit 70 and the cutting device 66 is arranged in the guide unit 65.

  Thus, in the laminating apparatus of the present invention, the cutting device is not particularly limited as long as it is disposed between the unwinding portion 12 and the lami roll 21. However, as described above, by laminating as soon as possible after cutting, it is difficult for the positions of the cut ends to be displaced, so the cutting device is preferably arranged at a position close to the lami roll 21.

  As described above, in the laminating apparatuses 10 and 60 in the first embodiment and the second embodiment, all are the film supply unit 11, the guide unit 15 (65), the laminating unit 20 (70), the substrate separating unit 30, and the entrance conveyor unit 35. , And the outlet conveyor section 40, but is not necessarily limited thereto. On the other hand, the site | part which has a further function may be added, and these site | parts may be provided as another apparatus besides the lamination apparatus. If the laminating unit and the cutting device are provided at least, and the cutting device is disposed on the upstream side of the lami roll in the DFR conveying direction, the laminating device of the present invention can be obtained.

  In addition, since the laminating apparatuses 10 and 60 in the first embodiment and the second embodiment are apparatuses based on the premise that the two rib material layers 3 and 3 are arranged in the production line width direction, the DFR 1 is set to the production line width. It suffices to cut into two in the direction, and it is sufficient to have one cutting device. However, for example, when three rib material layers are arranged in the production line width direction, it is necessary to cut the DFR into three pieces in the line width direction, so two cutting devices are arranged. Thus, it is possible to change the number of cutting devices provided according to the number of rib material layers arranged in the production line width direction. Even in such a case, the laminating apparatus of the present invention can be obtained.

  In the above-described embodiment, the example in which the extraction electrode is extracted from the rib material layer in the production line width direction has been described, but the extraction electrode is not limited thereto, and is extracted before and after the production line in the traveling direction. Also good.

  Next, the manufacturing method of the PDP back substrate of this invention is demonstrated. For ease of understanding, an example in which the manufacturing method is performed by the laminating apparatus 10 will be described here. Accordingly, the reference numerals used in FIGS. 1 to 3 are used. However, it is not necessarily performed by the apparatus, and the manufacturing method of the present invention can be performed using any other apparatus.

  The PDP back substrate manufacturing method S10 according to one embodiment of the present invention includes an unwinding step S11, a conveying step S12, a cutting step S13, and a laminating step S14. Hereinafter, each step will be described. The “production line” in the present embodiment refers to the unwinding step S11, the conveying step S12, the cutting step S13, and the laminate, which are steps relating to the dry film resist among the lines having the respective steps for manufacturing the PDP back substrate. It means a production line consisting of step S14.

  The unwinding step S11 is a step of unwinding the DFR1 from the DFR1 on the roll disposed in the unwinding unit 12. The DFR 1 arranged here is one in the production line width direction.

  The transporting process S12 is a process of transporting the DFR1 unwound in the unwinding process S11 to the laminating unit 20.

  The cutting step S13 is a step of cutting the DFR along the production line traveling direction before the DRF 1 is laminated on the rib material layers 3 and 3 in the laminating step S14 disposed after the cutting step S13. At this time, the end portion generated by the cutting is disposed on the substrate 2 between rib material layers arranged in parallel in the production line width direction. More preferably, it is arranged between the extraction electrodes extending from the rib material layer.

  Thereby, it arrange | positions so that the edge parts of DFR1 may match | combine between rib material layer 3a, 3b parallel to a manufacturing line width direction, or between extraction electrodes 4a, 4b, and it prevents that edge parts overlap. be able to. Further, since the cut end portion is a free end, it is possible to appropriately follow the unevenness of the rib material layer 3 and the extraction electrode 4 disposed on the substrate 2 and appropriately dispose the DFR 1.

  The laminating step S14 is a step of laminating the DFR 1 cut in the cutting step S13 on the substrate 2, the rib material layers 3, 3,..., The lead electrodes 4, 4,.

  According to the method for manufacturing the PDP rear substrate, it is possible to appropriately arrange the DFR between the rib material layer and the extraction electrode arranged in parallel in the manufacturing line width direction. FIG. 6 is a view of the end of the DFR between the rib material layers of FIG. 2 as viewed from the direction indicated by C in FIG. Here, the extraction electrode is omitted because it is very thin. The end portions of the DFR cut in this way do not overlap and are in close contact with the upper surfaces of the rib material layers 3 and 3 and the substrate 2. The adhesion force can be increased by the elastic force of the elastic material wound on the roll surface of the lami roll 21 described above. As described above, since the DFR 1 is in close contact with the substrate between the ribs, the DFR 1 is difficult to be peeled off when the DFR 1 is exposed and developed and blasted.

  Here, the thickness of the rib material layer is usually in the range of 100 μm to 400 μm in the state after drying, and preferably in the range of 200 μm to 300 μm. The thickness of the rib material layer after drying is usually about 2/3 after firing. On the other hand, the film thickness of DFR is 10 μm to 70 μm.

  Further, as a method of cutting and laminating a single DFR in the manufacturing line width direction, it is possible to cut the DFR after lamination. However, this may damage the substrate during cutting. And by cutting the DFR before the laminating step as in the present invention, the tension in the DFR width direction can be eliminated at the cut end of the DFR before laminating. It is possible to improve the followability with respect to the substrate and to improve the adhesion to the substrate.

  Although the present invention has been described in connection with the most practical and preferred embodiments at the present time, the present invention is not limited to the embodiments disclosed herein, The present invention can be changed as appropriate without departing from the scope or spirit of the invention that can be read from the claims and the entire specification, and a dry film laminating method, a laminating apparatus, and a manufacturing method of a PDP back substrate accompanied with such changes are also disclosed in the present invention. Should be understood as being included in the scope.

It is the schematic of the laminating apparatus of this invention which concerns on 1st embodiment. It is a perspective view for demonstrating the laminating part of the laminating apparatus shown in FIG. It is the figure which looked at the perspective view shown in FIG. 2 from the direction of the arrow shown by A in FIG. It is a figure for demonstrating the example by which the cutting device is arrange | positioned at the upper part of the guide roll of a lamination part. It is the schematic of the lamination apparatus of this invention which concerns on 2nd embodiment. It is a figure for demonstrating the scene where DRF was laminated appropriately. It is a figure for demonstrating the structure of a back substrate. It is a perspective view which shows typically the whole back substrate. It is a figure for demonstrating manufacture of a back substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Dry film resist 2 Board | substrate 3 Rib material layer 10 Laminating apparatus 11 Film supply part 12 Unwinding part 13 Guide roll 15 Guide part 16 Guide roll 17 Guide roll 20 Laminating part 21 Lami roll 22 Guide roll 23 Cutting apparatus 24 Rotary cutter 25 Cutter receiver 26 Transport Roll 30 Substrate Separating Section 31, 32 Nip Roll 33 Transport Roll 34 Cutting Device 35 Inlet Conveyor Section 36 Transport Roll 40 Outlet Conveyor Section 41 Transport Roll

Claims (5)

A method of manufacturing a plasma display panel rear substrate,
A laminating step of stacking a substrate having a rib material layer arranged in parallel in the production line width direction and a belt-like dry film resist while traveling in the same traveling direction,
The dry film resist that was one sheet in the width direction is cut along the production line traveling direction by the laminating step,
The substrate and the dry film resist are overlapped so that a cutting line generated by the cutting is disposed between the rib material layers arranged in parallel in the manufacturing line width direction. Manufacturing method of plasma display panel rear substrate.   The cutting of the dry film resist is performed between a lami roll which is a roll for laminating the dry film resist on the substrate, and a guide roll adjacent to the upstream side of the lami roll in the transport direction of the dry film resist. The method of manufacturing a rear substrate for a plasma display panel according to claim 1. A laminating apparatus that is used in the process of manufacturing a plasma display panel rear substrate, and superimposes a substrate having a rib material layer arranged in parallel in the production line width direction and a belt-like dry film resist while traveling in the same traveling direction,
A roll for conveying the dry film resist;
Lami roll for laminating the dry film resist on the substrate,
A cutting device that is disposed on the upstream side in the transport direction of the dry film resist from the lami roll, and cuts the dry film resist that was one sheet in the width direction along the production line traveling direction;
The laminating apparatus, wherein the cutting device is provided so that cutting lines of the cut dry film resist are arranged between the rib material layers arranged in parallel in the production line width direction.   The laminating apparatus according to claim 3, wherein the cutting device is disposed between the lami roll and a roll adjacent to the lami roll on the upstream side in the dry film resist conveyance direction.   The laminating apparatus according to claim 3 or 4, wherein the cutting device is a rotary cutter.

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