JP2010050264A - Electronic parts module and method for manufacturing the same - Google Patents

Abstract

An electronic component module that can be reduced in size, increased in density, and enhanced in functionality while stably fixing the electronic component, and a method for manufacturing the electronic component module are provided.
An electronic component module 100a includes at least an interposer 102, an IC chip 120 fixed so that the back surface faces the mounting surface of the interposer 102, and a plurality of electronic components 150a, 150b, 150c, and 152. The electronic spacer 150a and the electronic component 152 of the plurality of electronic components 150a, 150b, 150c, and 152 include the IC chip 120 and the conductive spacer 140. It is fixed to crosslink.
[Selection] Figure 3

Description

  The present invention relates to an electronic component module mounted on an electronic device and a method for manufacturing the electronic component module.

  In recent years, in the field of small portable electronic devices, electronic components mounted inside have been reduced in size, increased in functionality, and mounted in high density, and it is necessary to configure the same system with a smaller number of components. Contributes greatly to downsizing. Therefore, in the past, electronic components and IC packages containing electronic components and IC chips were individually mounted on a printed circuit board. However, from the viewpoint of configuring the same system with a smaller number of components, The components are combined, the IC chips are combined, or the electronic component and the IC chip are combined, that is, modularized.

  For example, in order to reduce the size and density of a wiring board, Patent Document 1 describes a wiring board that fixes electronic components so as to be accommodated in recesses formed in the main wiring board. This wiring board is miniaturized by mounting the electronic component on the sub wiring board and fixing the sub wiring board to the main wiring board so that the electronic component is located in the recess. Further, the density is increased by mounting other electronic components on the main wiring board and the sub wiring board.

  Further, for example, Patent Document 2 discloses a semiconductor module obtained by combining an electronic component and an IC chip.

  FIG. 12 is a perspective view showing a configuration of a conventional semiconductor module 900 described in Patent Document 2. As shown in FIG. 13 is a cross-sectional view of the semiconductor module 900 shown in FIG.

  As shown in FIGS. 12 and 13, a conventional semiconductor module 900 embeds an interposer 901, an IC chip 902, a plurality of passive components 903 and 903 ′, and an IC chip 902 and a plurality of passive components 903 and 903 ′. As described above, a system-in-package configuration including the molding material 904 formed on the entire main surface 901a of the interposer 901 is formed.

  The interposer 901 has a rectangular shape in plan view, and wiring (not shown) and IC chip connection electrodes 905 are formed on the main surface 901a. Further, the interposer 901 is electrically connected to the IC chip 902 by the interposer side connection pad portion 906 for mounting the passive component 903 and the connection wiring 916 so as to avoid the IC chip connection electrode 905. Connection pads 907 are formed.

  The back surface 901b of the interposer 901 is formed with electrode portions 908 connected to the interposer-side connection pad portion 906 and the connection pad 907, and is configured by connecting a bump ball or the like on each electrode portion 908. An electrode terminal 909 is provided. The electrode terminal 909 of the interposer 901 functions as an external connection terminal of the semiconductor module 900.

Further, the interposer 901 is provided with an insulating layer 910 that covers the entire main surface 901a so as to expose the IC chip connection electrode 905, the interposer side connection pad portion 906, and the connection pad 907. The insulating layer 910 is made of SiO ₂ or the like with a thickness of about 0.1 μm to 1.0 μm. An IC chip 902 is mounted on the main surface 901a of the interposer 901 having such a configuration.

  The IC chip 902 is flip-chip mounted at the approximate center of the main surface 901a of the interposer 901 with the active surface 902a facing the main surface 901a, and the bonding material 911 interposed between the active surface 902a and the main surface 901a It is fixed to the interposer 901. The IC chip 902 has a rectangular shape in plan view having a long side shorter than the long side of the interposer 901, and is mounted in a direction in which the long side is along the long side of the interposer 901.

  Further, the IC chip 902 is formed of silicon with a predetermined thickness, and an active circuit 902a is formed with an integrated circuit (not shown) composed of a transistor, a memory unit, and other electronic components. A plurality of electrode terminals 912 are formed on the active surface 902a. The electrode terminal 912 is configured by forming gold bumps, solder bumps, or the like at predetermined positions on an electrode (not shown) formed on the active surface 902a, and has a circular shape or a square shape in a sectional view. An integrated circuit is not formed below these electrode terminals 912.

  On the other hand, on the surface (back surface 902b) opposite to the active surface 902a of the IC chip 902, a plurality of IC chip side connection pad portions 913 and inter-pad wirings 914 are formed on the periphery. The inter-pad wiring 914 is formed so as to connect any one of the plurality of IC chip side connection pad portions 913.

  A passive component 903 ′ is mounted on the IC chip side connection pad portion 913 through an adhesive 915 supplied on the IC chip side connection pad portion 913. The passive component 903 ′ mounted on the IC chip 902 is fixed so that each electrode is connected to each electrode of the IC chip side connection pad portion 913. As a result, the passive component 903 ′ is electrically connected to the interposer 901 via the connection wiring 916.

  Around the IC chip 902, a skirt portion 917 formed in a hem-opening shape with an insulating resin material such as silicon is provided over the entire circumference. The skirt 917 has an inclined surface 918 that connects the back surface 902 b of the IC chip 902 and the main surface 901 a of the interposer 901. The inclined surface 918 is formed to start from the edge of the back surface 902b of the IC chip 902, and to contact the main surface 901a of the interposer 901 on the IC chip 902 side with respect to the connection pad 907.

  A plurality of passive components 903 are mounted on the main surface 901a of the interposer 901 via an adhesive 915 supplied onto the interposer-side connection pad portion 906. These passive components 903 are mounted on the periphery of the IC chip 902 so as to be arranged along each side of the interposer 901.

  Here, as the adhesive material 915, lead-free solder, conductive resin, or the like is used, and is supplied onto the interposer-side connection pad portion 906 by any one of a printing method, a dispensing (quantitative discharge), and an inkjet method. . By using such a material, each electrode of the passive component 903 is electrically connected to each interposer-side connection pad 906, and the passive component 903 is mechanically fixed to the interposer 901. become.

  An oscillation element 919 such as a crystal resonator is mounted at a position where it does not interfere with the IC chip 902 and the plurality of passive components 903. By forming an oscillation circuit using the oscillation element 919, the oscillation operation of the semiconductor module 900 is stabilized.

In the semiconductor module 900 having such a configuration, not only the IC chip 902 and the passive component 903 arranged in the horizontal direction, but also the passive component 903 ′ is arranged in the vertical direction. By electrically connecting the connection pad portion 913 and the connection pad 907, the thickness of the semiconductor module 900 is prevented from increasing by the loop height as in the case of using wire bonding. Thereby, miniaturization of the semiconductor module 900 is realized.
JP 2006-41238 A (published February 9, 2006) JP 2008-103395 A (published May 1, 2008)

  However, in the semiconductor module 900, when the semiconductor module 900 is seen through from the normal direction of the mounting surface of the interposer 901, the contour portion of the IC chip 902 and the passive component 903 mounted on the contour portion and the interposer 901 are provided. There is a problem that passive components cannot be arranged in a certain area between the two.

  Further, in the semiconductor module 900, the IC chip 902 is mounted on the interposer 901 with the active surface 902a of the IC chip 902 and the main surface 901a of the interposer 901 facing each other, and the passive component 903 ′ is mounted on the back surface 901b of the IC chip 902. is doing. Therefore, when the IC chip 902 and the passive component 903 ′ are electrically connected to each other, they are connected via the interposer 901. Even if the IC chip 902 uses flip chip mounting without using wire bonding. It is hard to say that the electrical resistance value due to the wiring is reduced. Further, the connection wiring 916 extending from the interposer 901 to the IC chip 902 has a large inductance component.

  Further, since the IC chip 902 is limited to the IC chip itself, the versatility as a module is poor. In addition, although the wiring board described in Patent Document 1 has been reduced in size and increased in density, there is a variation in the height of the fixing surface of the electronic component, resulting in poor solder connection or instability. It has the problem of being fixed.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide an electronic component module that can be downsized, densified, and highly functionalized while stably fixing the electronic component. And an electronic component module manufacturing method.

  In order to solve the above problems, an electronic component module of the present invention includes at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components An electronic component module comprising a conductive spacer fixed to the mounting surface of the first interposer, wherein at least one electronic component of the plurality of electronic components is connected to the second interposer. The conductive spacer is fixed so as to crosslink.

  Further, in order to solve the above problems, the method for manufacturing an electronic component module of the present invention includes at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, And a method of manufacturing an electronic component module composed of a plurality of electronic components, the step of fixing a conductive spacer to the mounting surface of the first interposer, and the mounting surface of the first interposer, A step of fixing the second interposer, and a step of fixing at least one electronic component of the plurality of electronic components so as to bridge the second interposer and the conductive spacer. Yes.

  According to said structure, the electron which bridge | crosslinks a 2nd interposer and a conductive spacer by adjusting the height relationship between a 2nd interposer and a conductive spacer by providing a conductive spacer. It becomes possible to fix the parts stably. Therefore, electronic components are mounted in areas where electronic components could not be mounted in the past (that is, the outline of the second interposer and its peripheral area when viewed from the direction perpendicular to the mounting surface of the first interposer). It becomes possible to do.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to include more electronic components, and it will become possible to achieve further high-density and high functionality.

  In order to more stably fix the electronic component that bridges the second interposer and the conductive spacer, the conductive spacer has a height of 75 to 125% of the thickness of the second interposer. It is desirable that

  An electronic component module according to the present invention includes an electronic device including at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components. A component module, wherein the first interposer has a recess on a mounting surface, and the second interposer is fixed so as to be positioned in the recess of the first interposer, and the plurality of electronic components At least one of the electronic components is fixed so as to bridge the first interposer and the second interposer.

  The electronic component module manufacturing method of the present invention includes at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components. The first interposer has a concave portion on a mounting surface, and the second interposer is fixed so as to be positioned in the concave portion of the first interposer. And a step of fixing at least one of the plurality of electronic components so as to bridge the first interposer and the second interposer.

  According to said structure, the 2nd interposer is being fixed so that it may be located in the recessed part of a 1st interposer, and adjusting the height relationship of a 1st interposer and a 2nd interposer Thus, the electronic component that bridges the first interposer and the second interposer can be stably fixed. Therefore, it is possible to mount the electronic component in a region where the electronic component cannot be mounted conventionally.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to include more electronic components, and it will become possible to achieve further high-density and high functionality.

  Furthermore, according to the above configuration, since the second interposer is fixed so as to be positioned in the recess of the first interposer, the overall module thickness can be reduced.

  In order to more stably fix the electronic component that bridges the first interposer and the second interposer, the recess has a depth of 75 to 125% of the thickness of the second interposer. It is desirable that

  An electronic component module according to the present invention includes an electronic device including at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components. A component module, comprising a conductive spacer fixed to the mounting surface of the first interposer, the first interposer having a recess in the mounting surface, and the second interposer being the first interposer The at least one electronic component among the plurality of electronic components is fixed so as to bridge the second interposer and the conductive spacer. It is said.

  The electronic component module manufacturing method of the present invention includes at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components. The first interposer has a recess on a mounting surface, and a conductive spacer is fixed to the mounting surface of the first interposer; and Fixing the second interposer so as to be positioned in the recess of one interposer, and at least one of the plurality of electronic components so as to bridge the second interposer and the conductive spacer And a step of fixing the electronic component.

  According to the above configuration, since the conductive spacer is provided and the second interposer is fixed so as to be positioned in the recess of the first interposer, the second interposer, the conductive spacer, By adjusting the height relationship, it is possible to stably fix the electronic component that bridges the second interposer and the conductive spacer. Therefore, it is possible to mount the electronic component in a region where the electronic component cannot be mounted conventionally.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to include more electronic components, and it will become possible to achieve further high-density and high functionality.

  Furthermore, according to the above configuration, the conductive spacer is provided, and the second interposer is fixed so as to be positioned in the recess of the first interposer. Thus, by providing a recess in the first interposer and adjusting the height with a conductive spacer by an amount that cannot be compensated for by the depth of the recess, the circuit design can be effectively performed while achieving a reduction in thickness. .

  In order to more stably fix the electronic component that bridges the second interposer and the conductive spacer, the sum of the height of the conductive spacer and the depth of the recess is the thickness of the second interposer. It is desirable that it is 75 to 125%.

  In the electronic component module of the present invention, it is preferable that the second interposer or both the first interposer and the second interposer is an IC chip. As a result, the electrical interconnection between the IC chip and the electronic component fixed on the IC chip can be performed in the shortest time, and loss due to wiring can be reduced.

  In addition, the electronic component module of the present invention preferably includes wiring for electrically connecting the first interposer and the second interposer.

  Furthermore, in the electronic component module of the present invention, the second interposer has a plurality of conductive portions electrically connected to an integrated circuit formed therein on the surface opposite to the back surface. Preferably, the electronic component fixed to the second interposer among the plurality of electronic components is electrically connected to the second interposer by being fixed to any one of the conductive portions. Alternatively, the electronic component fixed to the second interposer among the plurality of electronic components is configured to be electrically connected to each other by being fixed to any one of the conductive portions. It is good.

  According to these configurations, a circuit configuration that minimizes the loss due to wiring becomes possible. In addition, since the distance between the electronic component and the IC chip is shortened, the high frequency characteristics can be improved.

  In the electronic component module of the present invention, it is preferable that the electronic component fixed so as to be cross-linked is a capacitor and is cross-linked at each of both electrodes of the capacitor. Thereby, it is possible to reduce the propagation of noise from the second interposer such as an IC chip. Moreover, it is possible to suppress the influence of noise from the outside of the module from reaching the second interposer such as an IC chip because of the symmetry of the shape.

  In the electronic component module of the present invention, it is preferable that the mounting surface of the first interposer is sealed with resin.

  In the electronic component module of the present invention, it is preferable that the first interposer has a plurality of external connection terminals that can be electrically connected to the outside on a surface opposite to the mounting surface. As a result, the electronic component module can be handled as one system component that can be reflow mounted in the same manner as other electronic components and IC packages.

  As described above, the electronic component module of the present invention includes the conductive spacer fixed to the mounting surface of the first interposer, and at least one of the plurality of electronic components includes the second interposer and the conductive layer. It is the structure currently fixed so that a property spacer may be bridge | crosslinked.

  The method of manufacturing an electronic component module according to the present invention includes a step of fixing a conductive spacer to the mounting surface of the first interposer, and a step of fixing the second interposer to the mounting surface of the first interposer. And fixing at least one electronic component of the plurality of electronic components so as to bridge the second interposer and the conductive spacer.

  Therefore, by adjusting the height relationship between the second interposer and the conductive spacer, the electronic component that bridges the second interposer and the conductive spacer can be stably fixed. Therefore, the electronic component can be mounted in a region where the electronic component cannot be mounted conventionally.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to contain more electronic components, and there exists an effect that it can achieve further high-density and high functionality.

  In the electronic component module of the present invention, the first interposer has a recess in the mounting surface, and the second interposer is fixed so as to be positioned in the recess of the first interposer. At least one electronic component among the components is configured to be fixed so as to bridge the first interposer and the second interposer.

  In the electronic component module manufacturing method of the present invention, the first interposer has a recess in the mounting surface, and the second interposer is fixed so as to be positioned in the recess of the first interposer. And fixing at least one electronic component among a plurality of electronic components so as to bridge the first interposer and the second interposer.

  Therefore, by adjusting the height relationship between the first interposer and the second interposer, the electronic component that bridges the first interposer and the second interposer can be stably fixed. Therefore, the electronic component can be mounted in a region where the electronic component cannot be mounted conventionally.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to contain more electronic components, and there exists an effect that it can achieve further high-density and high functionality.

  Furthermore, since the second interposer is fixed so as to be positioned in the recess of the first interposer, there is also an effect that the thickness of the entire module can be reduced.

  The electronic component module of the present invention further includes a conductive spacer fixed to the mounting surface of the first interposer, the first interposer has a recess in the mounting surface, and the second interposer includes the first interposer. The interposer is fixed so as to be positioned in the recess, and at least one of the plurality of electronic components is fixed so as to bridge the second interposer and the conductive spacer. is there.

  In the electronic component module manufacturing method of the present invention, the first interposer has a recess on the mounting surface, and a conductive spacer is fixed to the mounting surface of the first interposer. Fixing the second interposer so as to be positioned in the recess of the one interposer, and at least one electronic component of the plurality of electronic components so as to bridge the second interposer and the conductive spacer A step of fixing.

  Therefore, by adjusting the height relationship between the second interposer and the conductive spacer, the electronic component that bridges the second interposer and the conductive spacer can be stably fixed. Therefore, the electronic component can be mounted in a region where the electronic component cannot be mounted conventionally.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to contain more electronic components, and there exists an effect that it can achieve further high-density and high functionality.

  Further, since the conductive spacer is provided and the second interposer is fixed so as to be positioned in the concave portion of the first interposer, the concave portion is formed in the first interposer within a range not restricted by the circuit design. By adjusting the height with a conductive spacer by an amount that cannot be compensated for by the depth of the recess, the circuit design can be effectively performed while the thickness is reduced.

[Embodiment 1]
An embodiment of the present invention will be described below with reference to the drawings.

  In the drawings shown below, for the sake of easy understanding, the solid lines and dotted lines in the drawings do not faithfully represent the portions that are actually visible and hidden, and the ratios of the sizes of the figures match the actual objects. I'm not doing it.

(Configuration of electronic component module)
FIG. 1 is an external perspective view showing a configuration example of an electronic component module 100a according to the present embodiment.

  As shown in FIG. 1, the electronic component module 100a of the present embodiment has an external appearance in which one surface of the interposer 102 is sealed with a sealing resin 170, and the other surface of the interposer 102 is an external connection terminal 180. Are formed, and the region excluding the external connection terminal 180 is covered with the solder resist 110 and has a substantially rectangular parallelepiped shape.

  Here, in the following, the mounting configuration of the interposer 102 and the manufacturing method of the electronic component module 100a will be described in detail using the electronic component module 100a shown in FIG. 1, but the electronic component module 100a shown in FIG. It merely shows an example of the electronic component module of the present invention.

  That is, the electronic component module of the present invention is applied to a semiconductor module (semiconductor device) in which an IC chip, an interposer substrate, an electronic component, and the like are built. For example, even if the configuration shown in FIG. Good.

  FIG. 2 is an external perspective view showing a configuration example of the electronic component module 100b.

  As shown in FIG. 2, the electronic component module 100b is externally coated with one surface of the interposer 102 with a sealing resin 170, and a plurality of external connection terminals 182 are formed on the other surface of the interposer 102b. It has a substantially rectangular parallelepiped shape. The interposer 102b is a multilayer printed circuit board having ceramic as an insulating layer, and the external connection terminals 182 are made of copper with nickel plating on the surface and gold plating thereon, and arranged in a peripheral shape. Has been.

  Next, the mounting configuration of the interposer 102 in the electronic component module 100a will be described in detail.

  FIG. 3 is a top view showing a configuration example of the mounting surface of the interposer 102 in the electronic component module 100a, and a cross-sectional view taken along line AA of the top view. FIG. 7A shows a detailed configuration example of the IC chip 120 and the interposer 102.

  As shown in FIG. 3, the electronic component module 100 a includes an interposer 102 (first interposer), an IC chip 120 (second interposer), a plurality of electronic components 150 a, 150 b, 150 c, 152, and a sealing resin 170. It is configured.

  The interposer 102 is a kind of heat-resistant glass-based epoxy resin laminate (multilayer printed circuit board having glass epoxy as an insulating layer). The interposer 102 has a metal four-layer specification including metal layers 104a, 104b, 104c, and 104d. The metal layers 104a, 104b, 104c, and 104d are patterned in the horizontal direction and are electrically connected by vias.

  In addition, an insulating solder resist 110 is formed on one surface (referred to as a mounting surface) of the interposer 102 so as to partially expose the metal layer 104a. The exposed portion of the metal layer 104a serves as a mounting part fixing part and a conductive connection part, and the mounting part such as the IC chip 120 is fixed and electrically connected.

  Further, a solder resist 110 is formed on a surface (referred to as an external connection surface) opposite to the one surface of the interposer 102 so as to partially expose the metal layer 104d. A plurality of external connection terminals 180 are provided in a portion where the metal layer 104d is exposed. The external connection terminals 180 have a ball shape made of solder, and are arranged in an area array in a matrix shape. The external connection terminal 180 can be electrically connected to the outside.

  The IC chip 120 is formed by forming an integrated circuit on one surface (referred to as an element formation surface) of a base 122 made of silicon. On the element formation surface, an electrode pad 122a and a first insulating layer 124a are formed on at least a portion excluding the electrode pad 122a.

  A metal wiring (not shown) is formed on the first insulating layer 124a. The metal wiring has one end connected to the electrode pad 122a and the other end connected to the component bonding pad 126 (conductive portion) and the wire connection pad 126a (conductive portion). In other words, the component bonding pad 126 and the wire connecting pad 126a are a part of the metal wiring, and are formed of copper (nickel and gold thereon) by the same process.

  Furthermore, a second insulating layer 124b is formed on the first insulating layer 124a at least in a portion excluding the component bonding pad 126 and the wire connecting pad 126a. Since the wire connection pad 126a is a part of the metal wiring, it does not necessarily have to be positioned directly above the electrode pad 122a as shown in FIG.

  A die attach film 128 is formed on the entire surface of the IC chip 120 opposite to the element formation surface (referred to as a back surface). The IC chip 120 is fixed to the interposer 102 by fixing the die attach film 128 to the metal layer 104 a of the interposer 102. Further, the wire connection pad 126a of the IC chip 120 and the metal layer 104a of the interposer 102 are connected by a gold wire 160 (wiring). That is, the end of the gold wire 160 on the first bonding side is bonded to the wire connection pad 126a, and the end of the gold wire 160 on the second bonding side is bonded to the metal layer 104a.

  The electronic components 150a, 150b, and 150c are capacitors or resistors. The number of electronic components 150 a, 150 b, and 150 c is only an example in FIG. 3, and the number and type are suitably determined according to the function of the IC chip 120 and the size of the interposer 102.

  The electronic component 150 a has one pole fixed on the IC chip 120 and the other pole fixed on the interposer 102. Specifically, one pole of the electronic component 150a is fixed to the component bonding pad 126 of the IC chip 120 by solder, and the other pole is fixed to the conductive spacer 140 fixed to the interposer 102 by solder. Has been. In other words, the electronic component 150 a is fixed so as to bridge the IC chip 120 and the conductive spacer 140.

  The electronic component 150 b is one in which both poles are fixed on the IC chip 120. Specifically, both poles of the electronic component 150 b are fixed to the component bonding pads 126 of the IC chip 120 by solder.

  The electronic component 150 c has both poles fixed on the interposer 102. Specifically, both poles of the electronic component 150c are fixed to the metal layer 104a of the interposer 102 by solder.

  The electronic component 152 is a capacitor having a capacity of about 0.1 μF, and both electrodes are fixed so as to bridge the IC chip 120 and the conductive spacer 140 on the interposer 102. In FIG. 1, one electronic component 152 is provided, but the present invention is not limited to this.

  Here, the mounting structure of the electronic component 152 will be described in detail with reference to FIGS. FIG. 4 is an enlarged view showing the mounting structure of the electronic component 152. FIG. 5 is a cross-sectional view of the electronic component 152 shown in FIG. 6 is a cross-sectional view of the electronic component 152 shown in FIG.

  As shown in FIGS. 4 to 6, the electronic component 152 includes a first electrode 152 a and a second electrode 152 b that are surface-mounted. As shown in FIG. 4, the electronic component 152 is configured such that the first electrode 152 a and the second electrode 152 b overlap the interposer 102 and the IC chip 120 when viewed from a direction perpendicular to the mounting surface of the interposer 102. Is arranged.

  On the IC chip 120 side, as shown in FIG. 5, the first electrode 152a is fixed to the component bonding pad 126 with solder 118b, and the second electrode 152b is fixed to another component bonding pad 126 with solder 118b. It is fixed.

  On the interposer 102 side, as shown in FIG. 6, the first electrode 152a is fixed to the conductive spacer 140 fixed to the interposer 102 by the solder 118a by the solder 118b, and the second electrode 152b is soldered to the interposer 102. It is fixed by solder 118b to another conductive spacer 140 fixed by 118a. That is, the electronic component 152 is disposed so as to straddle the conductive spacer 140.

  The conductive spacer 140 is a substantially rectangular parallelepiped plate having a predetermined height (thickness), and is made of a copper-based alloy or an iron-based alloy whose outermost surface is gold-plated. The conductive spacer 140 is fixed to the metal layer 104a of the interposer 102 with solder. In other words, the conductive spacer 140 is provided so as to electrically connect the electrode of the electronic component fixed so as to bridge the interposer 102 and the IC chip 120 and the metal layer 104a of the interposer 102.

  The sealing resin 170 is a substantially rectangular parallelepiped along the outer edge of the interposer 102 on the mounting surface of the interposer 102 so as to seal the IC chip 120, the plurality of electronic components 150 a, 150 b, 150 c, 152 and the gold wire 160. It is formed in the shape. As the sealing resin 170, for example, a thermosetting resin such as an epoxy resin is used, but is not limited thereto.

  As described above, the electronic component module 100a includes the electronic component 150b fixed to the element formation surface of the IC chip 120 in the configuration in which the IC chip 120 is fixed so that the back surface faces the mounting surface of the interposer 102. In addition to the electronic component 150c fixed to the mounting surface of the interposer 102, the electronic component 150a and the electronic component 152 fixed to bridge the IC chip 120 and the conductive spacer 140 are configured.

  That is, by providing the conductive spacer 140, the electronic component 150a and the electronic component 152 can be stably fixed by adjusting the height relationship between the IC chip 120 and the conductive spacer 140. It becomes. As a result, in the conventional semiconductor module 900 shown in FIG. 12, electronic components can be mounted on the outline of the IC chip 902 and its peripheral region when viewed from the direction perpendicular to the mounting surface of the interposer 901. However, in the electronic component module 100a, it is possible to mount electronic components in these conventional electronic component non-mountable areas.

  Therefore, the module size can be further reduced if the same parts as in the prior art are configured. Or if it is comprised with the same module size as before, it will become possible to contain (incorporate) more electronic components, and it will become possible to achieve further higher density and higher functionality.

  In the electronic component module 100a, the height of the conductive spacer 140 is desirably 75 to 125% of the thickness of the IC chip 120. As a result, the electronic component 150a and the electronic component 152 can be more stably fixed.

  Further, since the electrical interconnection between the IC chip 120 and the electronic components 150a, 150b, and 152 can be performed in the shortest time, loss due to wiring can be reduced. Further, the interposer 102 and the IC chip 120 are electrically connected with a gold wire 160 at the shortest distance, or the IC chip 120 and each electronic component are formed on the IC chip 120 with metal wiring and component bonding pads. By being electrically interconnected at 126, a circuit configuration that minimizes wiring losses is possible. In addition, since the distance between the electronic component and the IC chip is shortened, the high frequency characteristics can be improved.

  Although not shown, the component bonding pad 126 and the wire connection pad 126a are a part of the metal wiring, so that the IC chip 120, the electronic component 150a, the electronic component 150b, and the electronic component 152 are on the IC chip 120. Are electrically connected to each other through the metal wiring. Thereby, it is possible to minimize the loss due to the wiring.

  In addition, the electronic component 152 is fixed so as to be bridged at each of both poles of the capacitor. In particular, this contributes to suppression of propagation of operation noise generated by the operation of the IC chip 120 to the outside of the module. In addition, the symmetry of the shape can suppress the influence of noise from outside the module on the IC chip 120. In order to achieve the effect of reducing the propagation of noise from the IC chip 120, the first electrode 152a is connected to the power source of the IC chip 120, and the second electrode 152b is the ground terminal of the IC chip 120. It is desirable to be connected to.

  In addition, since the external connection terminal 180 is provided on the external connection surface side of the interposer 102, the electronic component module 100a is handled as one system component that can be reflow-mounted in the same manner as other electronic components and IC packages. It becomes possible. Note that the present invention is not limited to the configuration in which the external connection terminal 180 is provided, and even if the external connection terminal 180 is not provided, it can function as the electronic component module of the present invention.

(IC chip manufacturing method)
Next, a method for manufacturing the IC chip 120 will be described.

  First, a semiconductor wafer having electrode pads 122a provided for electric signal input / output and power supply and having an IC (integrated circuit) formed thereon is prepared. An insulating thin film such as an oxide film or a nitride film having a thickness of about 0.5 μm formed by an IC element / circuit section or a CVD method is formed on the upper surface layer of the semiconductor wafer.

  Subsequently, a photosensitive insulating material is applied to the entire upper surface of the semiconductor wafer with a spinner, and a predetermined pattern is exposed with an exposure machine. As the photosensitive insulator, polyimide, benzocyclobutene (BCB), or polybenzoxazole (PBO), which is a kind of organic material, is used. Note that this photosensitive insulating material becomes the first insulating layer 124a.

  Subsequently, the first insulating layer 124a is formed by patterning the photosensitive insulating material with or without exposure by chemical etching. Specifically, the photosensitive insulator on the electrode pad 122a, on the dicing line, and in the vicinity thereof is removed. When a non-photosensitive insulating material is used as the first insulating layer 124a, the non-photosensitive insulating material is applied to the entire upper surface of the semiconductor wafer with a spinner, and further a photosensitive resist is applied thereon with a spinner. . Then, the photosensitive resist is exposed in a predetermined pattern with an exposure machine, and the photosensitive resist is patterned by the presence or absence of photosensitivity by etching. Then, the portion where the photosensitive resist is removed, that is, the portion where the non-photosensitive insulating material is exposed is removed by chemical etching, and the first resist layer 124a is formed by chemically removing the photosensitive resist. Is possible.

  Subsequently, a thin metal film such as copper / titanium (Cu / Ti), copper / chromium (Cu / Cr), or copper / titanium tungsten (Cu / TiW) is formed on the entire upper surface of the semiconductor wafer by sputtering. .1 to 0.3 μm. Ti and Cr are barrier layers that prevent interdiffusion between aluminum (Al), which is a surface layer of the electrode pad 122a, and copper of a metal wiring to be formed later, and copper sputtered thereon is It becomes a seed layer when copper for metal wiring is formed by electrolytic plating. Then, a photosensitive resist is applied to the entire upper surface of the semiconductor wafer with a spinner, a predetermined pattern is exposed with an exposure machine, and then patterned by chemical etching.

  Subsequently, a plurality of pins are applied near the outer periphery of the semiconductor wafer, brought into contact with a metal thin film formed by sputtering, and copper (later metal wiring) is grown by electrolytic plating. At this time, control is performed so that copper grows in a portion where the photosensitive resist does not exist and the thickness of the copper becomes 5 to 15 μm. Further, nickel is grown by 3-5 μm by electrolytic plating, and gold is grown by 0.3-1 μm by electrolytic plating. Nickel serves as a barrier metal for preventing mutual diffusion between copper and gold, and gold serves as a surface to which a bonding wire is bonded. Nickel and gold can be formed not by electrolytic plating but by electroless plating. In the case of electroless electroplating, it is also possible to remove the metal thin film portion and form the metal wiring in the next step.

  Subsequently, the photosensitive resist is chemically peeled, and the exposed metal thin film portion formed by sputtering is completely removed. As a result, metal wiring, component bonding pads 126, and wire connection pads 126a are formed.

  Subsequently, a photosensitive insulating material is applied to the entire upper surface of the semiconductor wafer with a spinner, a predetermined pattern is exposed with an exposure machine, and then chemically patterned by etching. Specifically, the component bonding pads 126, the wire connection pads 126a, and the photosensitive insulator on the dicing line are removed. Similar to the photosensitive insulating material used for the first insulating layer 124a, polyimide, benzocyclobutene (BCB), or polybenzoxazole (PBO), which is a kind of organic material, is used as the photosensitive insulator. This photosensitive insulating material becomes the second insulating layer 124b. In the case where a non-photosensitive insulating material is used as the second insulating layer 124b, it can be formed by a method similar to the method for forming the first insulating layer 124a described above.

  Subsequently, the back surface of the semiconductor wafer (the surface opposite to the surface on which the elements are formed) is polished with a predetermined thickness, and the die attach film 128 is attached to the entire surface.

  Finally, by cutting the dicing line portion with a blade, the semiconductor wafer is separated into individual IC chips 120 from the wafer state. Thereby, as shown to Fig.7 (a), the IC chip 120 can be produced.

An example of specific dimensions of the created IC chip 120 is as follows.
Base 122: Vertical 2.5 × Horizontal 2.5 × Thickness 0.1mm
First insulating layer 124a, second insulating layer 124b: thickness 0.01 mm
Metal wiring (including component bonding pads 126): 0.013 mm (approximately total thickness of copper and nickel)
Die attach film 128: Thickness 0.025mm
(Electronic component module manufacturing method)
Next, a method for manufacturing the electronic component module 100a will be described in detail.

  7A to 7C, 8D to 8G, and 9H to 9J are cross-sectional views illustrating the manufacturing process of the electronic component module 100a.

  First, as shown in FIG. 7A, an interposer 102 and an IC chip 120 are prepared. At this time, the IC chip 120 is separated by the manufacturing method described above, but the interposer 102 is in a state before cutting. The cutting part 116 of the interposer 102 indicates a part to be cut, and is finally divided into modules by cutting the cutting part 116.

  Subsequently, as illustrated in FIG. 7B, a solder paste 118 a is printed on a predetermined portion of the metal layer 104 a of the interposer 102. At this time, the solder paste 118a is printed on the metal layer 104a that fixes the electronic component 150c and the conductive spacer 140. The solder paste 118a is printed by a printing machine using a steel plate mask and a squeegee.

  Subsequently, as shown in FIG. 7C, a conductive spacer 140 is placed on the solder paste 118a and fixed. Specifically, the conductive spacer 140 is placed on the printed solder paste 118a by a component mounting machine (for example, a component mounter). Thereafter, the solder paste 118a is melted and solidified by a reflow device, and the conductive spacer 140 is fixed. Although not shown, the electronic component 150 c is also fixed at a predetermined position by parallel processing with the conductive spacer 140.

  Subsequently, as illustrated in FIG. 8D, the IC chip 120 is fixed to a predetermined portion of the metal layer 104 a on the interposer 102. Specifically, the IC chip 120 is thermocompression bonded to a predetermined portion of the metal layer 104a on the interposer 102 using a die bonder. Since the die attach film 128 is formed on the back side of the IC chip 120, the IC chip 120 is placed on the interposer 102 via the die attach film 128 by placing the interposer 102 on a stage with a heater (about 200 ° C.). Fixed to.

  Subsequently, as shown in FIG. 8E, a solder paste 118b is printed on the component bonding pads 126 of the IC chip 120 and the conductive spacers 140. The solder paste 118b is printed by a printing machine using a steel plate mask and a squeegee.

  Subsequently, as shown in FIG. 8F, the electronic component 150a, the electronic component 150b, and the electronic component 152 (not shown) are placed and fixed on the solder paste 118b. Specifically, the electronic component 150a, the electronic component 150b, and the electronic component 152 are placed on the printed solder paste 118b by a component mounting machine. Thereafter, the solder is melted and solidified by a reflow furnace to fix the electronic component 150a, the electronic component 150b, and the electronic component 152.

  Subsequently, as shown in FIG. 8G, the IC chip 120 and the interposer 102 are connected by the gold wire 160. Specifically, the wire connection pad 126a of the IC chip 120 and the metal layer 104a of the interposer 102 are connected by the gold wire 160 using a wire bonder.

  Subsequently, as illustrated in FIG. 9H, the mounting surface of the interposer 102 to which the electronic component 150 a, the electronic component 150 b, the electronic component 150 c, and the electronic component 152 are fixed is sealed with a sealing resin 170. That is, all the portions above the mounting surface of the interposer 102 formed in the process shown in FIGS. 7B to 8G are sealed with the sealing resin 170 by molding.

  Subsequently, as shown in FIG. 9I, the external connection terminal 180 is formed on the surface of the interposer 102 opposite to the side on which the sealing resin 170 is formed. Specifically, a predetermined portion of the surface of the interposer 102 not sealed with the sealing resin 170 (a part of the metal layer 104d) with the surface of the interposer 102 sealed with the sealing resin 170 facing down. The external connection terminal 180 is formed by printing a solder paste on the substrate and then melting and solidifying the solder in a reflow furnace. A solder ball may be mounted instead of printing the solder paste.

  Finally, as shown in FIG. 9 (j), the cutting part 116 is cut with a dicer blade to be separated into individual electronic component modules 100a. Thereby, the electronic component module 100a can be completed.

An example of specific dimensions of each component related to the created electronic component module 100a is as follows.
Electronic component module 102 (excluding external connection terminals): 4 × 4 × 0.9 mm
Interposer 102: 4 x vertical 4 x 0.3 mm thick
External connection terminal 180 pitch: 0.5 mm
Terminal diameter / height of external connection terminal 180: 0.3 mm / 0.15 mm
Gold wire 160: diameter 0.025 mm
Electronic component 150a, electronic component 150b, electronic component 150c: length 0.6 × width 0.3 × thickness 0.3 mm (common name 0603) and length 0.4 × width 0.2 × thickness 0.2 mm (common name 0402)
Electronic component 152: length 1.0 × width 0.5 × thickness 0.3 mm (common name: 1005)
Conductive spacer 140: length 0.2 × width 0.35 × thickness 0.12 mm (for 0603) and length 0.23 × width 0.33 × thickness 0.12 mm (for electronic component 152)
In the electronic component module 100a described above, the IC chip 120 is mounted on the interposer 102. However, the present invention is not limited to the IC chip 120, and may be another interposer substrate. Although one IC chip 120 is mounted on the interposer 102, the present invention can be applied to a structure in which at least one IC chip or interposer substrate is mounted on the base interposer 102. For example, a plurality of IC chips 120 may be mounted on the interposer 102, or an interposer substrate may be mounted on the interposer 102, and the IC chip 120 may be mounted on the interposer substrate. Further, the IC chip may be mounted on the IC chip.

  The electronic components 150a, 150b, and 150c are capacitors or resistors, but are not limited thereto. For example, inductors, LPF (Low Pass Filter), SAW (Surface Acoustic Wave) filters, LNA (Low Noise) are used. An electronic component (passive component) such as an amplifier) or a crystal oscillator.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to the drawings. Configurations other than those described in the present embodiment are the same as those in the first embodiment. For convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are given the same reference numerals, and explanation thereof is omitted.

  FIG. 10 is a top view illustrating a configuration example of the mounting surface of the interposer 102 in the electronic component module 200, and a cross-sectional view taken along the line DD of the top view.

  The electronic component module 200 of the present embodiment has the same external configuration as the electronic component module 100a of the first embodiment, but the configuration of the mounting surface of the interposer 102 is different.

  As shown in FIG. 10, the interposer 102 has a recess 112 on the mounting surface. The recess 112 is sized to contain at least the IC chip 120 and is formed with a predetermined depth. The predetermined depth is preferably a depth corresponding to the thickness of the IC chip 120.

  Further, the IC chip 120 is fixed so as to be positioned in the recess 112. Thereby, the electronic component 150 a and the electronic component 152 are fixed so as to straddle the interposer 102 and the IC chip 120.

  Therefore, in the electronic component module 200, the IC chip 120 is fixed so as to be positioned in the recess 112, and the height relationship between the interposer 102 and the IC chip 120 is adjusted, so that the electronic component 150a and the electronic component are adjusted. It becomes possible to fix 152 stably. Therefore, similarly to the electronic component module 100a, in the electronic component module 200, it is possible to mount an electronic component in a conventional electronic component non-mountable area.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to include more electronic components, and it will become possible to achieve further high-density and high functionality.

  Further, in the electronic component module 200, since the IC chip 120 is fixed so as to be positioned in the recess 112, the overall thickness of the module is approximately equal to the thickness of the IC chip 120 with respect to the electronic component module 100a. It can be made smaller.

  Furthermore, in the electronic component module 200, the depth of the recess 112 is preferably 75 to 125% of the thickness of the IC chip 120. As a result, the electronic component 150a and the electronic component 152 can be more stably fixed.

  The method for manufacturing the electronic component module 200 is basically the same as the method for manufacturing the electronic component module 100a described above, except that the conductive spacer 140 described with reference to FIG. 7C is fixed. is there. In the manufacture of the electronic component module 200, the IC chip 120 is fixed so as to be positioned in the recess 112 of the interposer 102 in the step shown in FIG.

[Embodiment 3]
The following will describe another embodiment of the present invention with reference to the drawings. Configurations other than those described in the present embodiment are the same as those in the first and second embodiments. For convenience of explanation, members having the same functions as those shown in the drawings of Embodiments 1 and 2 are given the same reference numerals, and explanation thereof is omitted.

  FIG. 11 is a top view showing a configuration example of the mounting surface of the interposer 102 in the electronic component module 300, and a cross-sectional view taken along line EE of the top view.

  The electronic component module 300 of the present embodiment has the same external configuration as the electronic component module 100a of the first embodiment and the electronic component module 200 of the second embodiment, but the configuration of the mounting surface of the interposer 102 Is different. That is, the electronic component module 300 incorporates both elements of the electronic component module 100a and the electronic component module 200.

  That is, as shown in FIG. 11, in the electronic component module 300, the conductive spacer 140 is fixed to the metal layer 104a of the interposer 102, and the interposer 102 has a recess 112 on the mounting surface. Further, the IC chip 120 is fixed so as to be positioned in the recess 112. Thereby, the electronic component 150 a and the electronic component 152 are fixed so as to straddle the conductive spacer 140 and the IC chip 120.

  Therefore, by adjusting the height relationship between the IC chip 120 and the conductive spacer 140 by providing the conductive spacer 140 and fixing the IC chip 120 so as to be positioned in the recess 112, The electronic component 150a and the electronic component 152 can be stably fixed. Therefore, like the electronic component module 100a, in the electronic component module 300, it is possible to mount an electronic component in a conventional electronic component non-mountable area.

  Therefore, the module size can be further reduced if the same parts as the conventional one are configured. Or if it is a case where it comprises by the same module size as before, it will become possible to include more electronic components, and it will become possible to achieve further high-density and high functionality.

  In addition, in the electronic component module 200 shown in FIG. 10, while the thickness is reduced, a part of the interposer 102 is deleted by providing the concave portion 112, so that there may be a restriction in circuit design. .

  On the other hand, in the electronic component module 300, since the conductive spacer 140 is provided and the IC chip 120 is fixed so as to be positioned in the recess 112, the interposer 102 is not limited by the circuit design. By providing the concave portion 112 and adjusting (correcting) the height by the conductive spacer 140 by an amount that cannot be compensated for by the depth of the concave portion 112, the electronic component 150a and the electronic component 152 are correctly attached and the thickness is reduced. Thus, it is possible to effectively perform circuit design.

  Furthermore, in the electronic component module 300, the total of the height of the conductive spacer 140 and the depth of the recess 112 is preferably 75 to 125% of the thickness of the IC chip 120. As a result, the electronic component 150a and the electronic component 152 can be more stably fixed.

  The manufacturing method of the electronic component module 300 is basically the same as the manufacturing method of the electronic component module 100a described above. In the manufacture of the electronic component module 300, the IC chip 120 is fixed so as to be positioned in the recess 112 of the interposer 102 in the step shown in FIG.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be suitably used not only in the field related to an electronic component module having a built-in passive component, but also suitably used in the field related to a method for manufacturing an electronic component module, and further includes an electronic component module. The present invention can be widely used in the fields of electronic devices such as mobile phones, liquid crystal televisions, and computers.

It is an external appearance perspective view which shows one Embodiment of the electronic component module in this invention. It is an external appearance perspective view which shows other embodiment of the electronic component module in this invention. FIG. 2 is a top view showing a configuration example of a mounting surface of an interposer in the electronic component module shown in FIG. 1, and a cross-sectional view taken along line AA of the top view. It is an enlarged view which shows the mounting structure of the electronic component currently fixed to the mounting surface of the said interposer. FIG. 5 is a cross-sectional view of the electronic component shown in FIG. 4 taken along line BB. It is CC sectional view taken on the line of the electronic component shown in FIG. (A)-(c) is sectional drawing which shows the manufacturing process of the electronic component module shown in FIG. (D)-(g) is sectional drawing which shows the manufacturing process of the electronic component module shown in FIG. (H)-(j) is sectional drawing which shows the manufacture process of the electronic component module shown in FIG. FIG. 4 is a top view showing another configuration of the mounting surface of the interposer in the electronic component module shown in FIG. 1 and a cross-sectional view taken along the line DD of the top view. FIG. 6 is a top view showing still another configuration of the mounting surface of the interposer in the electronic component module shown in FIG. 1 and a cross-sectional view taken along line EE of the top view. It is a perspective view which shows the structure of the conventional semiconductor module. It is the FF sectional view taken on the line of the conventional semiconductor module shown in FIG.

Explanation of symbols

100a, 100b, 200, 300 Electronic component module 102, 102b Interposer (first interposer)
104a, 104b, 104c, 104d Metal layer 112 Recessed portion 120 IC chip (second interposer)
122a Electrode pad 126 Component bonding pad (conductive portion)
126a Wire connection pad (conductive part)
140 Conductive spacer 150a, 150b, 150c Electronic component 152 Electronic component 152a First electrode 152b Second electrode 160 Gold wire (wiring)
170 Sealing resin 180, 182 External connection terminal

Claims (17)

An electronic component module comprising at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components,
A conductive spacer fixed on the mounting surface of the first interposer;
At least one electronic component among the plurality of electronic components is fixed so as to bridge the second interposer and the conductive spacer. An electronic component module comprising at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components,
The first interposer has a recess in the mounting surface, and the second interposer is fixed so as to be positioned in the recess of the first interposer,
At least one electronic component among the plurality of electronic components is fixed so as to bridge the first interposer and the second interposer. An electronic component module comprising at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components,
A conductive spacer fixed on the mounting surface of the first interposer;
The first interposer has a recess in the mounting surface, and the second interposer is fixed so as to be positioned in the recess of the first interposer,
At least one electronic component among the plurality of electronic components is fixed so as to bridge the second interposer and the conductive spacer.   The electronic component module according to claim 1, wherein the conductive spacer has a height of 75 to 125% of a thickness of the second interposer.   The electronic component module according to claim 2, wherein the recess has a depth of 75 to 125% of a thickness of the second interposer.   4. The electronic component module according to claim 3, wherein the total of the height of the conductive spacer and the depth of the recess is 75 to 125% of the thickness of the second interposer.   The electronic component module according to claim 1, wherein the second interposer or both the first interposer and the second interposer is an IC chip.   The electronic component module according to claim 1, further comprising a wiring for electrically connecting the first interposer and the second interposer.   8. The second interposer has a plurality of conductive portions electrically connected to an integrated circuit formed therein on the surface opposite to the back surface. Electronic component module.   Of the plurality of electronic components, an electronic component fixed to the second interposer is electrically connected to the second interposer by being fixed to any one of the conductive portions. The electronic component module according to claim 9.   The electronic component fixed to the second interposer among the plurality of electronic components is fixed to any one of the conductive parts, so that the electronic components are electrically connected to each other. The electronic component module according to claim 9.   The electronic component module according to any one of claims 1 to 11, wherein the electronic component fixed so as to be cross-linked is a capacitor and is cross-linked at each of both electrodes of the capacitor.   The electronic component module according to claim 1, wherein a mounting surface of the first interposer is sealed with a resin.   The first interposer includes a plurality of external connection terminals that can be electrically connected to the outside on a surface opposite to the mounting surface. The electronic component module described in 1. A method for producing an electronic component module comprising at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components,
Fixing a conductive spacer on the mounting surface of the first interposer;
Fixing the second interposer to the mounting surface of the first interposer;
And a step of fixing at least one electronic component among the plurality of electronic components so as to bridge the second interposer and the conductive spacer. A method for producing an electronic component module comprising at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components,
The first interposer has a recess on the mounting surface,
Fixing the second interposer so as to be located in the recess of the first interposer;
And a step of fixing at least one electronic component among the plurality of electronic components so as to bridge the first interposer and the second interposer. A method for producing an electronic component module comprising at least a first interposer, a second interposer fixed so that the back surface faces the mounting surface of the first interposer, and a plurality of electronic components,
The first interposer has a recess on the mounting surface,
Fixing a conductive spacer on the mounting surface of the first interposer;
Fixing the second interposer so as to be located in the recess of the first interposer;
And a step of fixing at least one electronic component among the plurality of electronic components so as to bridge the second interposer and the conductive spacer.

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