JP2010043340A - Electroplating tool and electroplating method - Google Patents
Electroplating tool and electroplating method Download PDFInfo
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Description
本発明は、電解めっき治具とこれを用いためっき方法に関する。 The present invention relates to an electrolytic plating jig and a plating method using the same.
被めっき物に対して電解めっきをする際は、被めっき物の形状、重量などを考慮し、方法や治具を選定する。 When electrolytic plating is performed on an object to be plated, a method and a jig are selected in consideration of the shape and weight of the object to be plated.
例えば、孔を有する被めっき物をめっきするに際しては、孔部分の上下をばね付きフックで支持する方法が一般的である。 For example, when plating an object to be plated having a hole, a method of supporting the upper and lower portions of the hole portion with a hook with a spring is common.
しかしこの方法は、治具と被めっき物の接電部分が接触し固定されるため、その部分はめっき液に触れず、めっき未析出が起こる。 However, in this method, since the electric contact portion of the jig and the object to be plated comes into contact and is fixed, the portion does not touch the plating solution, and the plating is not deposited.
この問題点を解決するために、被めっき物の孔部を1つのフックで引っ掛け、被めっき物を常に揺動させて、被めっき物と治具接触部とを非固定化することで、めっき未析出を抑制する方法がある。 In order to solve this problem, the hole of the object to be plated is hooked with one hook, the object to be plated is constantly swung, and the object to be plated and the jig contact part are not fixed. There is a method of suppressing unprecipitation.
しかしこの方法では、被めっき物が安定しないため、治具が被めっき物をキズ付けやすく、また作業中被めっき物がめっき槽に落下するなどして、治具として不安定であり、当然、品質的にも問題が多い。
他方、接電部分が固定された治具を使用しながらも、作業者がめっき処理中、治具と被めっき物の接触部分を付け替えるなどして、めっき未析出を抑制する方法もある。
しかし、この方法は、治具と被めっき物の接触部分を付け替える数分間は、被めっき物を大気中に晒すことになるため、析出層が酸化されやすく、また、皮膜の厚さの均一性に欠けるなど品質上問題もあり、また手作業で行われるため、作業効率上量産には不向きである。
他方、特許文献１には、めっき処理中に接電部分を移動させ、めっき未析出を抑制する方法が開示されている。
しかし、この方法は、接電部分が被めっき物上を当接して移動し、接電部分の先端が被めっき物を引きずるため、被めっき物の母材そのものにキズが付くばかりでなく、接電部分周辺のめっき被膜も剥がれ落ち、製品不良となることが懸念され、十分なめっき未付着改善効果が得られない。
On the other hand, there is also a method of suppressing plating non-deposition by using a jig in which the contact portion is fixed while an operator changes the contact portion between the jig and the object to be plated during the plating process.
However, this method exposes the object to be air to the atmosphere for several minutes when changing the contact part between the jig and the object to be plated, so that the deposited layer is easily oxidized and the film thickness is uniform. There is also a problem in quality such as lacking, and since it is performed manually, it is not suitable for mass production due to work efficiency.
On the other hand, Patent Document 1 discloses a method of moving a contact portion during plating to suppress unplated plating.
However, in this method, the contact portion moves on the object to be plated, and the tip of the contact portion drags the object to be plated. The plating film around the electric part is also peeled off, and there is a concern that the product may be defective, and a sufficient effect of improving the non-plating adhesion cannot be obtained.
本発明は、上記に掲げた問題点を解消すべく、めっき槽内の被めっき物を落下させることなく、電解めっきにおける治具の接電部でのめっき未付着を改善し、かつ、めっき中の酸化を防ぎ膜質を維持しつつ、量産性、作業性に優れた電解めっき治具とこれを用いためっき方法を提供することを課題とするものである。 In order to solve the above-mentioned problems, the present invention improves the plating non-adherence at the contact portion of the jig in electrolytic plating without dropping the object to be plated in the plating tank, and during plating It is an object of the present invention to provide an electrolytic plating jig excellent in mass productivity and workability and a plating method using the same while preventing oxidation of the film and maintaining the film quality.
上記の課題を解決するために、請求項１の発明は、被めっき物を弾性支持可能な導電性を有した支持部材を複数設け、これら複数の支持部材により被めっき物の支持位置を順次切替えてめっき処理を施すことを特徴とする。
請求項２の発明は、前記複数の支持部材にて、被めっき物のそれぞれ異なる箇所を支持することを特徴とする。
請求項３の発明は、前記複数の支持部材によって支持されている被めっき物を、他の複数の支持部材によって支持されるように切替える際、切替え前の支持部材と切替え後の支持部材が、一定の時間被めっき物をともに支持し、その後、切替え前の支持部材が、被めっき物の支持を解除することを特徴とする。
請求項４の発明は、前記支持部材は、導電性を有したフック部を備えたことを特徴とする。
請求項５の発明は、請求項１から４に記載する方法で電解めっきをすることを特徴とする。
In order to solve the above problems, the invention of claim 1 is provided with a plurality of conductive support members capable of elastically supporting an object to be plated, and the support positions of the object to be plated are sequentially switched by the plurality of support members. And plating treatment.
The invention of claim 2 is characterized in that the plurality of support members support different portions of the object to be plated.
In the invention of claim 3, when the object to be plated supported by the plurality of support members is switched to be supported by another plurality of support members, the support member before switching and the support member after switching are: The objects to be plated are supported together for a certain period of time, and thereafter, the supporting member before switching releases the support of the objects to be plated.
The invention of claim 4 is characterized in that the support member includes a hook portion having conductivity.
The invention of claim 5 is characterized in that electrolytic plating is performed by the method described in claims 1 to 4.
本発明の電解めっき治具とこれを用いためっき方法は、治具と被めっき物の接電部分の支持機構を、二段階の切替え構造とすることで、めっき処理中に槽内で接電部を切替えることが可能となり、フックによるキズ付きも少なく、また膜質を維持しつつ、接電部のめっき未付着を防ぎ、外観不良のない、量産性、作業性の優れた効果を有する。 The electrolytic plating jig and the plating method using the same according to the present invention have a two-stage switching structure for the support mechanism for the contact portion of the jig and the object to be plated, so that the contact can be made in the tank during the plating process. It is possible to switch the part, there are few scratches due to the hook, and while maintaining the film quality, the non-adhering of the contact part is prevented, and there is no appearance defect, and the mass productivity and workability are excellent.
以下、本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
図１は本発明の治具１の切替え動作を示す構成図であり、図２は治具１の切替え動作のタイムチャートである。 FIG. 1 is a configuration diagram showing the switching operation of the jig 1 of the present invention, and FIG. 2 is a time chart of the switching operation of the jig 1.
まず、本実施例の治具１の構成について説明する。 First, the configuration of the jig 1 of this embodiment will be described.
図１の（ａ）ないし図１の（ｃ）に示すように、本発明の治具１は、導電性材質からなる支持体３に、被めっき物２を支持する支持部材４ａ、４ｂ、４ｃ、４ｄが設けられている。 As shown in FIGS. 1 (a) to 1 (c), the jig 1 of the present invention has support members 4a, 4b, 4c for supporting an object to be plated 2 on a support 3 made of a conductive material. 4d are provided.
前記支持部材４ａ、４ｂと支持部材４ｃ、４ｄは弾性を有する導電性材質からなり、それらはそれぞれ対をなしている。 The support members 4a and 4b and the support members 4c and 4d are made of a conductive material having elasticity, and they form a pair.
支持部材４ａ、４ｂと支持部材４ｃ、４ｄの端部は、被めっき物を確実に支持するため接電用フック５が形成され、被めっき物２のそれぞれ異なる少なくとも二つの箇所を順次切替て弾性的に支持する。 The end portions of the support members 4a and 4b and the support members 4c and 4d are formed with contact hooks 5 to securely support the object to be plated, and are elastically switched by sequentially switching at least two different portions of the object 2 to be plated. Support.
図１の（ａ）ないし図１の（ｃ）に示すように、支持部材４ａ、４ｂ、４ｃ、４ｄの端部を形成する前記接電用フック５のフックの向きは、被めっき物２の外側面２ａを支持部材４ａ、４ｂにて弾性的に挟持して支持する場合には、フックは互いに向かい合うように設けられている。 As shown in FIG. 1A to FIG. 1C, the direction of the hook of the contact hook 5 that forms the ends of the support members 4a, 4b, 4c, and 4d depends on the object 2 to be plated. When the outer side surface 2a is elastically sandwiched and supported by the support members 4a and 4b, the hooks are provided so as to face each other.
他方、支持部材４ｃ、４ｄにて被めっき物２の孔部内側面２ｂから拡開して弾性的に押さえつけるように支持する場合には、フックは互いに外方向に向けて設けられる。 On the other hand, when supporting by supporting members 4c and 4d so as to expand from the hole inner side surface 2b of the object to be plated 2 and elastically hold it down, the hooks are provided outward.
なお、図示はしないが、前記支持部材４ａ、４ｂと支持部材４ｃ、４ｄは、被めっき物２の接電位置を変更／切替て支持するために、例えば、支持体３に隣接してなる開閉リンク機構と連結されており、当該リンク機構を外部から操作することにより、被めっき物２の支持・解除などの一連の変更／切替等の動作を行うように構成されている。 Although not shown, the support members 4a and 4b and the support members 4c and 4d are, for example, opened and closed adjacent to the support body 3 in order to change / switch the contact position of the workpiece 2 to be supported. It is connected to a link mechanism, and is configured to perform a series of operations such as change / switching such as support / release of the object to be plated 2 by operating the link mechanism from the outside.
本実施例では、１つの被めっき物２に対し、対をなす２つの支持部材（４ａ、４ｂ又は４ｃ、４ｄ）により変更／切替て支持しているが、被めっき物２の形状や重量によっては、支持部材４ａ、４ｂと支持部材４ｃ、４ｄの配置を変更することも、あるいは支持部材自体を増やすことも想定されている。 In this embodiment, one object 2 is supported by changing / switching the two support members (4a, 4b or 4c, 4d) in pairs, depending on the shape and weight of the object 2 to be plated. It is assumed that the arrangement of the support members 4a and 4b and the support members 4c and 4d is changed, or that the support members themselves are increased.
また、接電用フック５も、被めっき物２の形状や性質に応じて、異なる形状を有するフックや、またそれらを複数設けることも可能であり、本実施例で示した形態に限定されるものではない。 In addition, the contact hook 5 can also be provided with a hook having a different shape or a plurality of the hooks depending on the shape and properties of the workpiece 2 and is limited to the form shown in the present embodiment. It is not a thing.
次に、電解めっき方法を図２のタイムチャートに即し説明する。 Next, the electrolytic plating method will be described with reference to the time chart of FIG.
図２の横軸（Ｔ）は時間を示したもので、縦軸は電解めっき処理の通電／解除及び支持部材（４ａ、４ｂ又は４ｃ、４ｄ）の被めっき物２の支持／解除を示したものである。
（１）取付け工程
＜図２：横軸Ｔ1 縦軸４ｃ、４ｄ支持開始＞
以下、横軸、縦軸の記載を省略する。
The horizontal axis (T) in FIG. 2 indicates time, and the vertical axis indicates the energization / release of the electrolytic plating process and the support / release of the workpiece 2 of the support member (4a, 4b or 4c, 4d). Is.
(1) Mounting process <FIG. 2: horizontal axis T 1 vertical axis 4c, 4d support start>
Hereinafter, description of the horizontal axis and the vertical axis is omitted.
図１の（ａ）に示すように、被めっき物２は、めっき処理前、支持部材４ｃ、４ｄを被めっき物２の孔部内に挿入し、支持部材４ｃ、４ｄを外方向に拡開しながら孔部内側面２ｂを接電用フック５で押さえ弾性的に支持される。
（２）浸漬工程
＜図２：Ｔ2 めっき処理通電開始＞
支持部材４ｃ、４ｄに支持された被めっき物２は、槽内の処理液中に浸漬される。
As shown in FIG. 1 (a), the object to be plated 2 has the support members 4c and 4d inserted into the holes of the object to be plated 2 before the plating process, and the support members 4c and 4d are expanded outward. However, the inner surface 2b of the hole is pressed and elastically supported by the contact hook 5.
(2) immersing step <Figure 2: T 2 plating energization start>
The to-be-plated object 2 supported by the supporting members 4c and 4d is immersed in the processing liquid in a tank.
めっき処理槽の中では、被めっき物２は支持部材４ｃ、４ｄに支持された状態で通電され、電気処理が開始され、図１には図示されていない陽極と被めっき物２との間で、めっき液を通して電解反応が行われ、被めっき物２の表面にめっき層が形成される。
（３）切替え工程
（ｉ）＜図２：Ｔ3 支持部材（４ａ、４ｂ）支持開始＞
図１の（ｂ）に示すように、めっき処理半ばで、図示されない開閉リンク機構を操作して、被めっき物２は槽内処理液中に浸漬された状態で支持部材４ｃ、４ｄによって支持されつつ、支持部材４ａ、４ｂへの切替えが開始される。
In the plating treatment tank, the object to be plated 2 is energized while being supported by the support members 4c and 4d, and the electric treatment is started, and between the anode and the object 2 to be plated not shown in FIG. Then, an electrolytic reaction is performed through the plating solution, and a plating layer is formed on the surface of the object to be plated 2.
(3) Switching step (i) <Figure 2: T 3 support members (4a, 4b) supporting start>
As shown in FIG. 1B, in the middle of the plating process, an opening / closing link mechanism (not shown) is operated, and the object to be plated 2 is supported by the support members 4c and 4d in a state of being immersed in the treatment liquid in the tank. Meanwhile, switching to the support members 4a and 4b is started.
開閉リンク機構の操作により、被めっき物２の孔部内側面２ｂを支持している支持部材４ｃ、４ｄは、その支持している状態を保ちながら、支持部材４ａ、４ｂが内方向へ閉じて、被めっき物２の外側面２ａの安定箇所を接電用フック５にて弾性的に挟持して支持する。
（ｉｉ）＜図２：Ｔ3−Ｔ4 支持部材（４ｃ、４ｄ）（４ａ、４ｂ）支持＞
この段階では、被めっき物２は、槽内処理液中に浸漬された状態で支持部材４ｃ、４ｄと支持部材４ａ、４ｂにより支持されている。
（ｉｉｉ）＜図２：Ｔ4 支持部材（４ｃ、４ｄ）解除＞
その後、開閉リンク機構を操作して、支持部材４ｃ、４ｄは、被めっき物２の支持を解除し、被めっき物２は、支持部材４ａ、４ｂのみによって支持され、支持部材４ｃ、４ｄから支持部材４ａ、４ｂへの接電部の切替えが完了する。
By operating the opening / closing link mechanism, the supporting members 4c and 4d supporting the hole inner surface 2b of the workpiece 2 are closed inward while maintaining the supporting state. The stable portion of the outer surface 2a of the workpiece 2 is elastically sandwiched and supported by the contact hook 5.
(Ii) <Figure 2: T 3 -T 4 supporting members (4c, 4d) (4a, 4b) supporting>
At this stage, the object to be plated 2 is supported by the support members 4c and 4d and the support members 4a and 4b in a state of being immersed in the in-vessel treatment liquid.
(Iii) <Figure 2: T 4 support member (4c, 4d) released>
Thereafter, by operating the opening / closing link mechanism, the support members 4c and 4d release the support of the object to be plated 2, and the object to be plated 2 is supported only by the support members 4a and 4b and supported by the support members 4c and 4d. The switching of the contact portion to the members 4a and 4b is completed.
被めっき物２の電気処理は、支持部材４ｃ、４ｄから支持部材４ａ、４ｂへ接電部の切替え中も行われるため、被めっき物２が治具１から離れることなく安定しためっき処理が可能となる。
（４）取外し工程
（ｉ）＜図２：Ｔ5 めっき処理解除＞
図１の（ｃ）に示めすように、支持部材４ａ、４ｂにて支持され、電気処理されている被めっき物２は、所定の時間が経過した後、通電が解除され電気処理は終了する。
（ｉｉ）＜図２：Ｔ6 支持部材（４ａ、４ｂ）解除＞
通電が解除された後、支持部材４ａ、４ｂは、被めっき物２の支持を解除して、一連のめっき処理は終了する。
このように、治具１の支持機構を、二段階の切替え可動構造（支持部材４ｃ、４ｄから支持部材４ａ、４ｂへの切替え）にすることで、以下のような効果がある。
１）めっき処理中槽内で接電部を切替えることが可能となり、析出層が酸化されることがなく量産性、作業性に優れためっき処理が可能となる。
２）接電部の切替えにおいて接電用フック５の先端が被めっき物２を引きずることがないため、被めっき物２に対するキズを必要最小限度に抑え、安定した膜質を確保することができる。
３）支持部材（４ｃ、４ｄ）（４ａ、４ｂ）を順次切替えて被めっき物を支持するため、めっきの未付着を防ぎ、外観不良のない品質上優れためっき処理が可能となる。
Since the electroplating of the object to be plated 2 is performed even while the contact portion is switched from the support members 4c and 4d to the support members 4a and 4b, the plating object 2 can be stably plated without leaving the jig 1. It becomes.
(4) removing step (i) <Figure 2: T 5 plating released>
As shown in FIG. 1 (c), the plated object 2 supported by the supporting members 4a and 4b and subjected to the electrical processing is de-energized after a predetermined time and the electrical processing is completed. .
(Ii) <Figure 2: T 6 support members (4a, 4b) released>
After the energization is released, the support members 4a and 4b release the support of the workpiece 2 and the series of plating processes is completed.
As described above, the support mechanism of the jig 1 has a two-stage switching movable structure (switching from the support members 4c and 4d to the support members 4a and 4b), thereby providing the following effects.
1) It is possible to switch the contact portion in the tank during the plating process, and the plating process is excellent in mass productivity and workability without oxidizing the deposited layer.
2) Since the tip of the contact hook 5 does not drag the object to be plated 2 in switching the contact part, scratches on the object to be plated 2 can be minimized and stable film quality can be ensured.
3) Since the support members (4c, 4d) (4a, 4b) are sequentially switched to support the object to be plated, plating non-adherence is prevented, and an excellent plating process with no appearance defect is possible.
１ 治具
２ 被めっき物
２ａ 被めっき物の外側面
２ｂ 被めっき物の孔部の内側面
３ 支持体
４ａ、４ｂ、４ｃ、４ｄ 支持部材
５ 接電用フック
DESCRIPTION OF SYMBOLS 1 Jig 2 To-be-plated object 2a To-be-plated object outer surface 2b To-be-plated object inner surface 3 Support body 4a, 4b, 4c, 4d Support member 5 Contacting hook
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| JP2021021126A (en) * | 2019-07-30 | 2021-02-18 | 三共株式会社 | Plating jig, and plating method |
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| JP2008038240A (en) * | 2006-08-07 | 2008-02-21 | Taiyo Yuden Co Ltd | Method of plating chip-shaped electronic component |
| JP2010270381A (en) * | 2009-05-25 | 2010-12-02 | Kida Seiko Kk | Holder for plating cylindrical and sac-like workpiece |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021021126A (en) * | 2019-07-30 | 2021-02-18 | 三共株式会社 | Plating jig, and plating method |
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