JP2010043229A - Thermally conductive resin composition and resin molding of the composition - Google Patents
Thermally conductive resin composition and resin molding of the composition Download PDFInfo
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Abstract
Description
本発明は、伝熱性樹脂組成物及びその樹脂成形体に関する。さらに詳しくは、本発明は等方的な伝熱性を有し、絶縁性及び靱性に優れ、放熱電子部品等に好適な樹脂組成物、及び該樹脂組成物を成形してなる樹脂成形体に関するものである。 The present invention relates to a heat conductive resin composition and a resin molded body thereof. More specifically, the present invention relates to a resin composition having isotropic heat conductivity, excellent insulation and toughness, suitable for heat dissipation electronic parts, and the like, and a resin molded body formed by molding the resin composition It is.
集積回路の処理速度や実装密度は、年々向上しており、その結果として半導体素子等からの発熱量が増大しつつある。このため、種々の高放熱性電子部品の需要が高まっており、これら高放熱性電子部品に用いる高伝熱性材料の需要も高まっている。また、上記電子部品に加えて、モーターコイル、ハロゲンランプ等においても、高伝熱性材料の需要が高まってきている。 The processing speed and mounting density of integrated circuits are improving year by year, and as a result, the amount of heat generated from semiconductor elements and the like is increasing. For this reason, the demand for various high heat dissipation electronic components is increasing, and the demand for high heat transfer materials used for these high heat dissipation electronic components is also increasing. In addition to the electronic components described above, there is an increasing demand for highly heat-conductive materials in motor coils, halogen lamps, and the like.
高伝熱性材料としては、銅、アルミニウム等の金属が広く知られている。しかし、電子部品の多くは絶縁性材料を用いる必要があり、これら金属を電子部品の材料として用いるには、絶縁被覆等を施す必要があった。 Metals such as copper and aluminum are widely known as high heat transfer materials. However, many electronic components need to use insulating materials, and in order to use these metals as materials for electronic components, it is necessary to provide an insulating coating or the like.
そこで、金属の代わりに、高伝熱性及び絶縁性を有するフィラーを樹脂に添加した樹脂組成物を高伝熱性材料として用いることが試みられている。例えば、特許文献１には、ポリフェニレンスルフィド樹脂及びフッ化カルシウム粒子からなる複合材料が開示されている。また、特許文献２には、ポリアリーレンスルフィド樹脂、リン含有被覆酸化マグネシウム及びアルコキシシラン化合物を含む樹脂組成物が開示されている。また、特許文献３では、ポリアリーレンスルフィド樹脂及び特定のマグネサイトからなる樹脂組成物が開示されている。また、特許文献４では、熱可塑性樹脂と、特定のカップリング剤で被覆した窒化ホウ素粉末からなる樹脂組成物が開示されている。 Therefore, an attempt has been made to use a resin composition in which a filler having high heat transfer properties and insulating properties is added to a resin instead of metal as a high heat transfer material. For example, Patent Document 1 discloses a composite material made of polyphenylene sulfide resin and calcium fluoride particles. Patent Document 2 discloses a resin composition containing a polyarylene sulfide resin, a phosphorus-containing coated magnesium oxide and an alkoxysilane compound. Patent Document 3 discloses a resin composition comprising a polyarylene sulfide resin and a specific magnesite. Patent Document 4 discloses a resin composition comprising a thermoplastic resin and boron nitride powder coated with a specific coupling agent.
しかしながら、特許文献１〜３に記載の高伝熱性材料は、十分な伝熱性を得るために大量のフィラーを添加しており、高伝熱性材料の靱性低下及びコスト増加という欠点を有していた。また特許文献４に記載の高伝熱性材料は、板などを射出成形すると窒化ホウ素粉末が配向し、伝熱性に著しい異方性を生じて厚さ方向の熱伝導率が極端に低くなるという欠点を有していた。 However, the high heat transfer materials described in Patent Documents 1 to 3 have a drawback that a large amount of filler is added to obtain sufficient heat transfer, and the toughness of the high heat transfer material is reduced and the cost is increased. . In addition, the high heat transfer material described in Patent Document 4 has a drawback that when a plate or the like is injection molded, the boron nitride powder is oriented, causing significant anisotropy in the heat transfer property and extremely low thermal conductivity in the thickness direction. Had.
本発明は上記事情に鑑みなされたもので、等方的な伝熱性を有し、絶縁性及び靱性に優れ、放熱電子部品等に好適な樹脂組成物、及び該樹脂組成物を成形してなる樹脂成形体を提供することを目的とする。 The present invention has been made in view of the above circumstances, and is a resin composition having isotropic heat transfer, excellent insulation and toughness, and suitable for heat-dissipating electronic components, and the resin composition. It aims at providing the resin molding.
本発明者らは、鋭意研究を重ねた結果、ポリアリーレンスルフィド、水酸化マグネシウム、及び扁平形状の断面を有するガラス繊維を特定の割合で含有する樹脂組成物によって上記課題が解決できることを見出した。本発明はかかる知見に基づいて完成したものである。
すなわち本発明は、
（１） ポリアリーレンスルフィド１００質量部に対して、水酸化マグネシウム８０〜２５０質量部、扁平形状の断面を有するガラス繊維２０〜２００質量部を含有する伝熱性樹脂組成物、
（２） 扁平形状の断面を有するガラス繊維の平均扁平率が２〜２０である上記１に記載の伝熱性樹脂組成物、
（３） 上記１または２に記載の伝熱性樹脂組成物を成形してなる伝熱性樹脂成形体、
（４） 上記３に記載の伝熱性樹脂成形体からなる電子部品
を提供するものである。
As a result of intensive studies, the present inventors have found that the above problem can be solved by a resin composition containing polyarylene sulfide, magnesium hydroxide, and glass fibers having a flat cross section at a specific ratio. The present invention has been completed based on such findings.
That is, the present invention
(1) A heat conductive resin composition containing 80 to 250 parts by mass of magnesium hydroxide and 20 to 200 parts by mass of a glass fiber having a flat cross section with respect to 100 parts by mass of polyarylene sulfide.
(2) The heat conductive resin composition according to 1 above, wherein the average flatness of the glass fiber having a flat cross section is 2 to 20,
(3) a heat conductive resin molded article obtained by molding the heat conductive resin composition according to 1 or 2 above,
(4) The present invention provides an electronic component comprising the heat conductive resin molding as described in 3 above.
本発明によれば、等方的な伝熱性を有し、絶縁性及び靱性に優れ、放熱電子部品等に好適な樹脂組成物、及び該樹脂組成物を成形してなる樹脂成形体が提供される。 According to the present invention, there are provided a resin composition having isotropic heat conductivity, excellent insulating properties and toughness, suitable for heat dissipation electronic components, and the like, and a resin molded body formed by molding the resin composition. The
本発明の伝熱性樹脂組成物は、ポリアリーレンスルフィド、水酸化マグネシウム、および扁平形状の断面を有するガラス繊維を含有する。 The heat transfer resin composition of the present invention contains polyarylene sulfide, magnesium hydroxide, and glass fibers having a flat cross section.
本発明で用いるポリアリーレンスルフィドは、繰り返し単位が下記式（Ｉ） The polyarylene sulfide used in the present invention has a repeating unit represented by the following formula (I)
（式中、Ａｒはアリーレン基を示す。）
で示される重合体である。
上記アリーレン基は、少なくとも一つの芳香環を有する二価の基であり、例えば、各種フェニレン基、各種ジフェニレンスルフォン基、各種ビフェニレン基、各種ジフェニレンエーテル基、各種ジフェニレンカルボニル基、各種ナフタレン基などが挙げられる。なお、上記の各種とは、オルト体、メタ体、パラ体等の位置異性体や、置換基を有する芳香環を含む基を表す。置換基としてはアルキル基が挙げられ、好ましくは炭素数１〜４のアルキル基が挙げられ、特にメチル基が好ましい。アリーレン基の具体例としては、以下のものが挙げられる。
(In the formula, Ar represents an arylene group.)
It is a polymer shown by.
The arylene group is a divalent group having at least one aromatic ring, for example, various phenylene groups, various diphenylene sulfone groups, various biphenylene groups, various diphenylene ether groups, various diphenylene carbonyl groups, various naphthalene groups. Etc. In addition, said various represents the group containing the aromatic ring which has positional isomers, such as an ortho body, a meta body, and a para body, and a substituent. Examples of the substituent include an alkyl group, preferably an alkyl group having 1 to 4 carbon atoms, and particularly preferably a methyl group. Specific examples of the arylene group include the following.
本発明で用いるポリアリーレンスルフィドは、同一の繰返し単位からなるホモポリマーでも、二種以上の異なる繰返し単位からなるコポリマーであってもよい。またポリアリーレンスルフィドは一種を単独で用いてもよく、二種以上を組み合わせて用いてもよい。 The polyarylene sulfide used in the present invention may be a homopolymer composed of the same repeating unit or a copolymer composed of two or more different repeating units. Polyarylene sulfides may be used alone or in combination of two or more.
上記ポリアリーレンスルフィドは、その物性について特に制限はないが、成形加工性の観点から流動性の高いものが好ましい。例えば３００℃で測定した粘度が好ましくは８０Ｐａ・ｓ以下、より好ましくは４０Ｐａ・ｓ以下である。
またポリアリーレンスルフィドは、本発明の効果を損なわない範囲で、そのポリマー鎖の一部が他のポリマーで置換されていてもよい。かかる他のポリマーとしては、ポリアミド系樹脂、ポリエステル系樹脂、ポリアリーレンエーテル系樹脂、ポリスチレン系樹脂、ポリオレフィン系樹脂、含フッ素系樹脂、ポリオレフィン系エラストマー、ポリアミド系エラストマー、シリコーン系エラストマー等が挙げられる。
The polyarylene sulfide is not particularly limited in terms of its physical properties, but those having high fluidity are preferred from the viewpoint of molding processability. For example, the viscosity measured at 300 ° C. is preferably 80 Pa · s or less, more preferably 40 Pa · s or less.
Further, in the polyarylene sulfide, a part of the polymer chain may be substituted with another polymer as long as the effects of the present invention are not impaired. Examples of such other polymers include polyamide resins, polyester resins, polyarylene ether resins, polystyrene resins, polyolefin resins, fluorine-containing resins, polyolefin elastomers, polyamide elastomers, and silicone elastomers.
本発明のポリアリーレンスルフィドは、例えば特公昭４５−３３６８号公報、特公昭５２−１２２４０号公報等に記載の方法で製造することができる。
尚、本発明のポリアリーレンスルフィドは、空気中で加熱して高分子量化してもよく、また、酸無水物等の化合物を用いて化学修飾してもよい。
The polyarylene sulfide of the present invention can be produced, for example, by the method described in Japanese Patent Publication No. 45-3368 and Japanese Patent Publication No. 52-12240.
In addition, the polyarylene sulfide of the present invention may be heated to increase the molecular weight in air, or may be chemically modified using a compound such as an acid anhydride.
本発明で用いる水酸化マグネシウムは、その純度に関して特に制限はないが、伝熱性の観点から、好ましくは純度９５質量％以上、より好ましくは９８質量％以上である。
また水酸化マグネシウムは、その粒度に関して特に制限はないが、成形加工性および靱性の観点から、好ましくはＢＥＴ法で得られる窒素吸着比表面積が１〜１０ｍ2／ｇ、より好ましくは２〜５ｍ2／ｇである。
The magnesium hydroxide used in the present invention is not particularly limited with respect to its purity, but is preferably 95% by mass or more, more preferably 98% by mass or more from the viewpoint of heat transfer.
The magnesium hydroxide is not particularly limited with respect to its particle size, in terms of moldability and toughness, preferably nitrogen adsorption specific surface area obtained by BET method 1 to 10 m 2 / g, more preferably 2 to 5 m 2 / G.
水酸化マグネシウムは市販品を使用してもよく、市販品としては、例えば「キスマ８」（比表面積２．７ｍ2／ｇ、協和化学工業株式会社製）、「３００」（比表面積７ｍ2／ｇ、神島化学工業株式会社製）、「マグラックスＳＴ」（比表面積３．６ｍ2／ｇ、新鉱工業株式会社製）等が挙げられる。 A commercially available product may be used as magnesium hydroxide. Examples of commercially available products include “Kisuma 8” (specific surface area 2.7 m 2 / g, manufactured by Kyowa Chemical Industry Co., Ltd.), “300” (specific surface area 7 m 2 / g, manufactured by Kamijima Chemical Co., Ltd.), “Maglux ST” (specific surface area 3.6 m 2 / g, manufactured by Shin Mining Co., Ltd.), and the like.
水酸化マグネシウムの含有量は、伝熱性及び靱性の観点から、ポリアリーレンスルフィド１００質量部に対して８０〜２５０質量部の範囲であり、好ましくは１００〜２２０質量部であり、より好ましくは１２０〜１８０質量部である。水酸化マグネシウムの含有量が、ポリアリーレンスルフィド１００質量部に対して８０質量部未満であると、得られる樹脂組成物は伝熱性が低く実用的ではない。また、水酸化マグネシウムの含有量が、ポリアリーレンスルフィド１００質量部に対して２５０質量部を超えると、得られる樹脂組成物は靱性が低く実用的ではない。 The content of magnesium hydroxide is in the range of 80 to 250 parts by mass, preferably 100 to 220 parts by mass, more preferably 120 to 120 parts by mass with respect to 100 parts by mass of polyarylene sulfide from the viewpoint of heat transfer and toughness. 180 parts by mass. When the content of magnesium hydroxide is less than 80 parts by mass with respect to 100 parts by mass of polyarylene sulfide, the resulting resin composition has low heat conductivity and is not practical. Moreover, when content of magnesium hydroxide exceeds 250 mass parts with respect to 100 mass parts of polyarylene sulfides, the resin composition obtained has low toughness and is not practical.
本発明で用いるガラス繊維は、扁平（楕円）形状の断面を有し、平均扁平率が２〜２０であることが好ましく、２〜１２であることがより好ましく、２〜６であることがさらに好ましい。この平均扁平率が２以上であると、樹脂組成物に良好な靭性、流動性及び寸法精度がそなわり、２０以下であれば、樹脂組成物が良好な強度を有する。かかる扁平率は、ガラス繊維の断面の長径（最長径）を短径（最短径）で除することにより求められる。該長径は、好ましくは５〜６０μｍ、より好ましくは１０〜４０μｍである。
「平均扁平率」としているのは、ガラス繊維全てが上記範囲の扁平率である必要は無く、各ガラス繊維の扁平率の平均値が上記範囲内であればよいことによる。このように、断面が扁平形状を有するガラス繊維を用いることにより、断面が円状であるガラス繊維を用いた場合に比べて、樹脂組成物の靭性が顕著に向上すると共に、流動性及び寸法精度も向上する。
なお、上記ガラス繊維の長径（最長径）及び短径（最短径）は、以下に示す方法に従って測定した値である。
＜長径及び短径の測定方法＞
ガラス繊維をエポキシ樹脂で包埋処理した上で研磨し、ガラス繊維の断面を露出させる。次いで、透過型電子顕微鏡などで断面を拡大観察して扁平率を求める。
The glass fiber used in the present invention has a flat (elliptical) cross section, and the average flatness is preferably 2 to 20, more preferably 2 to 12, and further preferably 2 to 6. preferable. When the average flatness is 2 or more, the resin composition has good toughness, fluidity and dimensional accuracy, and when it is 20 or less, the resin composition has good strength. Such flatness is obtained by dividing the long diameter (longest diameter) of the cross section of the glass fiber by the short diameter (shortest diameter). The major axis is preferably 5 to 60 μm, more preferably 10 to 40 μm.
The “average flatness” is because all the glass fibers need not have the flatness in the above range, and the average flatness of each glass fiber may be in the above range. Thus, by using the glass fiber having a flat cross section, the toughness of the resin composition is remarkably improved as compared with the case of using the glass fiber having a circular cross section, and the fluidity and dimensional accuracy are increased. Will also improve.
In addition, the long diameter (longest diameter) and short diameter (shortest diameter) of the said glass fiber are the values measured according to the method shown below.
<Measurement method of major axis and minor axis>
The glass fiber is ground with an epoxy resin and then polished to expose a cross section of the glass fiber. Next, the cross section is enlarged and observed with a transmission electron microscope or the like to obtain the flatness.
本発明で用いるガラス繊維は、その繊維長について特に制限はないが、製造上の利便性の観点から、好ましくは平均繊維長が１〜５ｍｍである。 Although the glass fiber used by this invention does not have a restriction | limiting in particular about the fiber length, From a viewpoint of the convenience on manufacture, Preferably an average fiber length is 1-5 mm.
本発明で用いるガラス繊維は、ポリアリーレンスルフィドとの接着強度の向上等を目的として、従来公知の処理を施してもよい。当該処理としては、例えば、有機化合物による表面のコーティングや多数のガラス繊維を有機化合物で収束する等の処理が挙げられる。 The glass fiber used in the present invention may be subjected to conventionally known treatments for the purpose of improving the adhesive strength with polyarylene sulfide. As the said process, the process of converging the surface coating with an organic compound and many glass fibers with an organic compound is mentioned, for example.
上記ガラス繊維の含有量は、靱性及び流動性の観点から、ポリアリーレンスルフィド１００質量部に対して２０〜２００質量部の範囲であり、好ましくは４０〜１５０質量部であり、より好ましくは６０〜１２０質量部である。上記ガラス繊維の含有量が、ポリアリーレンスルフィド１００質量部に対して２０質量部未満であると、得られる樹脂組成物は靱性が低く実用的ではない。また、上記ガラス繊維の含有量が、ポリアリーレンスルフィド１００質量部に対して２００質量部を超えると、得られる樹脂組成物は流動性が低く実用的ではない。 Content of the said glass fiber is a range of 20-200 mass parts with respect to 100 mass parts of polyarylene sulfide from a viewpoint of toughness and fluidity, Preferably it is 40-150 mass parts, More preferably, it is 60- 120 parts by mass. When the content of the glass fiber is less than 20 parts by mass relative to 100 parts by mass of polyarylene sulfide, the resulting resin composition has low toughness and is not practical. Moreover, when content of the said glass fiber exceeds 200 mass parts with respect to 100 mass parts of polyarylene sulfides, the obtained resin composition has low fluidity and is not practical.
本発明の伝熱性樹脂組成物は、本発明の効果を損なわない範囲で、従来公知の強化材や配合剤を含有してもよい。
強化材としては、上記扁平形状の断面を有するガラス繊維を除く繊維状フィラーが挙げられ、例えば、ガラス繊維、チタン酸カリウムウィスカー、ホウ酸アルミニウムウィスカー、アラミド繊維、酸化アルミニウム繊維、炭素繊維、銅繊維等が挙げられる。
配合剤としては、例えば離型剤、可塑剤、難燃剤、酸化防止剤、金属不活性化剤、相容化剤等が挙げられる。
The heat-transfer resin composition of the present invention may contain a conventionally known reinforcing material and compounding agent as long as the effects of the present invention are not impaired.
Examples of the reinforcing material include fibrous fillers excluding glass fibers having a flat cross section, such as glass fibers, potassium titanate whiskers, aluminum borate whiskers, aramid fibers, aluminum oxide fibers, carbon fibers, and copper fibers. Etc.
As a compounding agent, a mold release agent, a plasticizer, a flame retardant, antioxidant, a metal deactivator, a compatibilizer, etc. are mentioned, for example.
本発明の伝熱性樹脂組成物は、公知の溶融混練法によって製造でき、例えばポリアリーレンスルフィド及び水酸化マグネシウムを所定の割合でドライブレンドした後、市販の二軸混練押出機にトップフィードし、扁平形状の断面を有するガラス繊維をサイドフィードする方法が挙げられる。 The heat transfer resin composition of the present invention can be produced by a known melt-kneading method. For example, after polyarylene sulfide and magnesium hydroxide are dry-blended at a predetermined ratio, the mixture is top-fed to a commercially available twin-screw kneading extruder, and is flattened. The method of side-feeding the glass fiber which has a shape cross section is mentioned.
本発明の伝熱性樹脂組成物は、等方的な伝熱性を有し、絶縁性及び靱性に優れ、放熱性を必要とする電子部品に好適に用いられる。
上記電子部品の具体例としては、基板封止材、コイル封止材、基板ケース、電池ケース、抵抗素子ケース、ＨＩＤランプの電子バラストケース、コイルボビン、ヒートシンク、ソレノイド、モーターファン、イオン発生デバイスの誘電体、ランプリフレクター、ランプソケット、ランプホルダー、ＬＥＤパッケージ、ＬＥＤスペーサー、ＬＥＤソケット、ＬＥＤ台座コネクタ及びＬＥＤ素子フレーム等が挙げられる。
The heat transfer resin composition of the present invention has isotropic heat transfer, is excellent in insulation and toughness, and is suitably used for electronic parts that require heat dissipation.
Specific examples of the electronic components include a substrate sealing material, a coil sealing material, a substrate case, a battery case, a resistance element case, an electronic ballast case for a HID lamp, a coil bobbin, a heat sink, a solenoid, a motor fan, and a dielectric for an ion generating device. Examples include a body, a lamp reflector, a lamp socket, a lamp holder, an LED package, an LED spacer, an LED socket, an LED base connector, and an LED element frame.
次に、本発明を実施例により更に詳細に説明するが、本発明はこれらの例によって何ら限定されるものではない。 EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples.
後述するように、樹脂組成物を調製し、性能評価を行った。なお、樹脂組成物中の各成分の含有量は以下の方法によって求めた。
〔含有量の測定〕
樹脂組成物を坩堝に入れ、６００℃の炉で６時間燃焼し、燃焼残渣の希塩酸可溶分、不溶分それぞれの重量から、水酸化マグネシウムおよびガラス繊維等の含有量を求めた。なお、水酸化マグネシウムについては、燃焼中に酸化マグネシウムに脱水変性することを考慮して、含有量を求めた。
As described later, a resin composition was prepared and performance evaluation was performed. In addition, content of each component in a resin composition was calculated | required with the following method.
[Measurement of content]
The resin composition was placed in a crucible and burned in a furnace at 600 ° C. for 6 hours, and the contents of magnesium hydroxide, glass fiber, and the like were determined from the weights of the diluted hydrochloric acid soluble and insoluble components of the combustion residue. The content of magnesium hydroxide was determined in consideration of dehydration and modification to magnesium oxide during combustion.
樹脂組成物の性能評価は、下記の方法に従って行った。 The performance evaluation of the resin composition was performed according to the following method.
（１）シャルピー衝撃強さ
樹脂組成物のペレットを用いて試験片を調製し、ＩＳＯ １７９−１に準拠してシャルピー衝撃強さを測定した。
（２）熱伝導率
樹脂組成物のペレットを用いて、６０ｍｍ角で厚さ２ｍｍの平板を射出成形し、ＴＰＡ−５０１（京都電子工業株式会社製）を用いて熱伝導率を測定した。測定条件はセンサー直径を２０ｍｍ、測定モードを“Ｓｌａｂ Ｓｈｅｅｔｓ”とした。
（３）厚さ方向の熱伝導率
樹脂組成物のペレットを用いて、６０ｍｍ角で厚さ２ｍｍの平板を射出成形し、中央部から直径２０ｍｍの円板を切り出した。これをＴＰＡ−５０１（京都電子工業株式会社製）を用いて、センサー直径を２０ｍｍ、測定モードを“Ｓｌａｂ Ｓｈｅｅｔｓ”としてプローブ温度の時間変化を測定した。プローブの加熱開始後３秒から６秒までのプローブ温度データを１次関数で最小自乗フィットし、得られた傾き（単位：Ｋ）でプローブ加熱電力（単位：Ｗ）を割った商を熱伝導率［単位：Ｗ／（Ｋｍ）］とした。
（４）体積抵抗率
樹脂組成物ペレットを用いて試験片を調製し、ＩＥＣ６００９３に準拠して体積抵抗率を測定した。
(1) Charpy impact strength A test piece was prepared using pellets of the resin composition, and Charpy impact strength was measured in accordance with ISO 179-1.
(2) Thermal conductivity A 60 mm square flat plate having a thickness of 2 mm was injection molded using the resin composition pellets, and the thermal conductivity was measured using TPA-501 (manufactured by Kyoto Electronics Industry Co., Ltd.). The measurement conditions were a sensor diameter of 20 mm and a measurement mode of “Slab Sheets”.
(3) Thermal conductivity in the thickness direction Using a pellet of the resin composition, a 60 mm square flat plate with a thickness of 2 mm was injection-molded, and a disk with a diameter of 20 mm was cut out from the center. Using TPA-501 (manufactured by Kyoto Electronics Co., Ltd.), the change in probe temperature with time was measured with a sensor diameter of 20 mm and a measurement mode of “Slab Sheets”. The probe temperature data from 3 to 6 seconds after the start of probe heating is fit to the least squares with a linear function, and the quotient obtained by dividing the probe heating power (unit: W) by the obtained slope (unit: K) is the heat conduction. The rate was [unit: W / (Km)].
(4) Volume resistivity The test piece was prepared using the resin composition pellet, and the volume resistivity was measured based on IEC60093.
樹脂組成物の調製で用いた各成分を以下に示す。
Ａ：Ｈ−１Ｇ（ポリフェニレンスルフィド、３００℃における粘度１０Ｐａ・ｓ、大日本インキ化学工業株式会社製）
Ｂ１：キスマ８（水酸化マグネシウム、ＢＥＴ法による比表面積２．７ｍ2／ｇ、協和化学工業株式会社製）
Ｂ２：３００（水酸化マグネシウム、ＢＥＴ法による比表面積７ｍ2／ｇ、神島化学工業株式会社製）
Ｂ３：マグラックスＳＴ（水酸化マグネシウム、ＢＥＴ法による比表面積３．６ｍ2／ｇ、新鉱工業株式会社製）
Ｃ：ＣＳＧ ３ＰＡ−８３０（扁平形状の断面を有するガラス繊維、平均扁平率４，日東紡株式会社製）
Ｄ：０３ＪＡＦＴ５９１（ガラス繊維、平均扁平率１、オーウェンス・コーニング社製）
Ｅ：＃５００（酸化マグネシウム粉、タテホ化学工業株式会社製）
Ｆ：ＳＣ２０Ｈ（シリカ粉、株式会社マイクロン製）
Ｇ：ＧＰ（窒化ホウ素粉、電気化学工業株式会社製）
Ｈ：ＳＷ（タルク粉、日本タルク株式会社製）
Each component used for preparation of the resin composition is shown below.
A: H-1G (polyphenylene sulfide, viscosity at 300 ° C., 10 Pa · s, manufactured by Dainippon Ink & Chemicals, Inc.)
B1: Kisuma 8 (magnesium hydroxide, specific surface area 2.7 m 2 / g by BET method, manufactured by Kyowa Chemical Industry Co., Ltd.)
B2: 300 (magnesium hydroxide, specific surface area by BET method 7 m 2 / g, manufactured by Kamishima Chemical Co., Ltd.)
B3: McGrax ST (magnesium hydroxide, specific surface area 3.6 m 2 / g according to BET method, manufactured by Shin Mining Co., Ltd.)
C: CSG 3PA-830 (glass fiber having a flat cross section, average flatness 4, manufactured by Nittobo Co., Ltd.)
D: 03JAFT591 (glass fiber, average flatness ratio 1, manufactured by Owens Corning)
E: # 500 (magnesium oxide powder, manufactured by Tateho Chemical Industry Co., Ltd.)
F: SC20H (silica powder, manufactured by Micron Corporation)
G: GP (boron nitride powder, manufactured by Denki Kagaku Kogyo Co., Ltd.)
H: SW (talc powder, manufactured by Nippon Talc Co., Ltd.)
実施例１
上記Ａ及びＢ１を、質量比が１００：１４０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量のＣをサイドフィーダーに投入した。トップフィーダー投入物を７．２ｋｇ／ｈｒのフィード速度で供給し、サイドフィーダー投入物を２．４ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。ダイスから出た組成物のストランドを水冷し、ペレット状にカットした。
得られた組成物は、成分の凝集等は見られず良好であった。得られた組成物を分析した結果、成分Ａ１００質量部に対し成分Ｂ１は１４０質量部、成分Ｃは８０質量部であった。
得られた組成物の性能評価結果を第１表に示す。
Example 1
A and B1 were weighed so that the mass ratio was 100: 140. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of C was charged into a side feeder. The top feeder charge was fed at a feed rate of 7.2 kg / hr, and the side feeder charge was fed at a feed rate of 2.4 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets.
The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, Component B1 was 140 parts by mass and Component C was 80 parts by mass with respect to 100 parts by mass of Component A.
The performance evaluation results of the obtained composition are shown in Table 1.
実施例２〜７
第１表に示す含有量になるように配合量を変えた他は、実施例１と同様にして組成物を調製し、性能を評価した。結果を第１表に示す。
Examples 2-7
A composition was prepared in the same manner as in Example 1 except that the blending amount was changed so that the content shown in Table 1 was obtained, and the performance was evaluated. The results are shown in Table 1.
比較例１〜７
第２表に示す含有量になるように配合量、供給量を変えた他は、実施例１と同様にして組成物を調製し、性能を評価した。結果を第２表に示す。
Comparative Examples 1-7
A composition was prepared in the same manner as in Example 1 except that the blending amount and the supply amount were changed so that the content shown in Table 2 was obtained, and the performance was evaluated. The results are shown in Table 2.
比較例８
上記Ａ１及びＢ１を、質量比が１００：６０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量のＣをサイドフィーダーに投入した。トップフィーダー投入物を４．８ｋｇ／ｈｒのフィード速度で供給し、サイドフィーダー投入物を２．４ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。ダイスから出た組成物のストランドを水冷し、ペレット状にカットした。
得られた組成物は、成分の凝集等は見られず良好であった。得られた組成物を分析した結果、成分Ａ１００質量部に対し成分Ｂ１は６０質量部、成分Ｃは８０質量部であった。
得られた組成物の性能評価結果を第３表に示す。
Comparative Example 8
The A1 and B1 were weighed so that the mass ratio was 100: 60. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of C was charged into a side feeder. The top feeder charge was fed at a feed rate of 4.8 kg / hr, and the side feeder charge was fed at a feed rate of 2.4 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. The strand of the composition coming out of the die was cooled with water and cut into pellets.
The obtained composition was good with no aggregation of components or the like. As a result of analyzing the obtained composition, Component B1 was 60 parts by mass and Component C was 80 parts by mass with respect to 100 parts by mass of Component A.
The performance evaluation results of the obtained composition are shown in Table 3.
比較例９
上記Ａ及びＢ１を、質量比が１００：１４０となるようにそれぞれ量りとった。この原料をドライブレンドし、二軸混練押出機ＴＥＭ３７ＢＳ（東芝機械株式会社製）のトップフィーダーに投入し、また適量のＣをサイドフィーダーに投入した。トップフィーダー投入物を７．２ｋｇ／ｈｒのフィード速度で供給し、サイドフィーダー投入物を７．５ｋｇ／ｈｒのフィード速度で供給し、混練した。尚、混練の際にバレルとダイスの設定温度は３２０℃とした。しかし、供給物がバレル内に詰まり、樹脂組成物を得ることができなかった。このため、実施例１で行なった性能評価が実施できなかった。
Comparative Example 9
A and B1 were weighed so that the mass ratio was 100: 140. This raw material was dry blended and charged into a top feeder of a twin screw kneading extruder TEM37BS (manufactured by Toshiba Machine Co., Ltd.), and an appropriate amount of C was charged into a side feeder. The top feeder charge was fed at a feed rate of 7.2 kg / hr, and the side feeder charge was fed at a feed rate of 7.5 kg / hr and kneaded. The kneading temperature was set to 320 ° C. for the barrel and the die. However, the supply was clogged in the barrel, and a resin composition could not be obtained. For this reason, the performance evaluation performed in Example 1 could not be implemented.
比較例１０〜１５
第３表に示す含有量になるように配合量を変えた他は、実施例１と同様にして組成物を調製し、性能を評価した。結果を第３表に示す。
Comparative Examples 10-15
A composition was prepared in the same manner as in Example 1 except that the blending amount was changed so that the content shown in Table 3 was obtained, and the performance was evaluated. The results are shown in Table 3.
本発明の伝熱性樹脂組成物及びその樹脂成形体は、等方的な伝熱性を有し、絶縁性及び靱性に優れ、放熱電子部品等に好適に用いられる。 The heat transfer resin composition and the resin molded body thereof according to the present invention have isotropic heat transfer, are excellent in insulation and toughness, and are suitably used for heat dissipation electronic components and the like.
Claims (4)
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| JP2012036386A (en) * | 2010-07-16 | 2012-02-23 | Toray Ind Inc | Heat radiation member for motor cooling |
| JP2014145006A (en) * | 2013-01-28 | 2014-08-14 | Tosoh Corp | High-strength polyarylenesulfide-based composition |
| WO2015122942A1 (en) * | 2014-02-11 | 2015-08-20 | Ticona Llc | Molded part for use in a portable electronic device |
| JP2016535147A (en) * | 2013-08-22 | 2016-11-10 | 東レ株式会社 | Polyphenylene sulfide resin composition, molded product thereof and method for producing the molded product |
| JPWO2020196273A1 (en) * | 2019-03-27 | 2020-10-01 | ||
| US11118053B2 (en) | 2018-03-09 | 2021-09-14 | Ticona Llc | Polyaryletherketone/polyarylene sulfide composition |
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| JP2014145006A (en) * | 2013-01-28 | 2014-08-14 | Tosoh Corp | High-strength polyarylenesulfide-based composition |
| JP2016535147A (en) * | 2013-08-22 | 2016-11-10 | 東レ株式会社 | Polyphenylene sulfide resin composition, molded product thereof and method for producing the molded product |
| WO2015122942A1 (en) * | 2014-02-11 | 2015-08-20 | Ticona Llc | Molded part for use in a portable electronic device |
| US11118053B2 (en) | 2018-03-09 | 2021-09-14 | Ticona Llc | Polyaryletherketone/polyarylene sulfide composition |
| JPWO2020196273A1 (en) * | 2019-03-27 | 2020-10-01 | ||
| WO2020196273A1 (en) * | 2019-03-27 | 2020-10-01 | 東レ株式会社 | Polyphenylene sulfide resin composition and molded article |
| KR20210148112A (en) * | 2019-03-27 | 2021-12-07 | 도레이 카부시키가이샤 | Polyphenylene sulfide resin composition and molded article |
| JP7501359B2 (en) | 2019-03-27 | 2024-06-18 | 東レ株式会社 | Polyphenylene sulfide resin composition and molded article |
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