JP2010042569A - Method of manufacturing suspend metal mask, and suspend metal mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that a conventional suspend metal mask has a limit in thinning paste for printing because a mask substrate is formed and therefore the thickness of the mask substrate affects printing. <P>SOLUTION: A method of manufacturing a suspend metal mask includes the processes of: forming a resist pattern film 3 which has a pattern corresponding to the mask pattern on the surface of an electroforming matrix 1; etching a part which is not covered with the resist pattern film 3 to create a recess on the electroforming matrix 1; exfoliating the resist pattern film 3 from the electroforming matrix 1; forming a secondary resist film 6 on the surface of the electroforming matrix 1 where the irregularity is created; polishing the secondary resist film 6 so that a projection of the electroforming matrix 1 is exposed; bringing a conductive mesh screen 8 into close contact with the surfaces of the projection of the electroforming matrix 1 and the polished secondary resist film 6; applying plating thereto from the direction of the mesh screen 8 to form an electrodeposition layer 9, which is united with the mesh screen 8; and exfoliating the united mesh screen 8 and electrodeposition layer 9 from the electroforming matrix 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a suspend metal mask used for screen printing of internal electrodes of chip-shaped electronic components such as multilayer ceramic capacitors, and a suspend metal mask.

Conventionally, in the manufacturing process of multilayer chip capacitors such as multilayer ceramic capacitors and multilayer inductors having a structure in which metal conductor layers and ceramic insulating layers are alternately stacked, internal electrode patterns are formed on ceramic green sheets. Screen printing is used in forming. For example, an internal electrode paste composed of a low resistance metal powder such as Au, Ag, Pd, Cu, Ni, a binder such as an organic resin, and an organic solvent is printed on the green sheet by a screen printing method. Forming.
With recent trend toward smaller and higher density electronic components, monolithic ceramic capacitors are required to have a smaller and larger capacity. To achieve a smaller and larger capacity, a further increase in the number of laminated dielectric layers and one layer are required. Further reduction in the thickness of the corresponding dielectric layer is progressing, and accordingly, it is required to print the internal electrode pattern thinly by a screen printing method.
Therefore, as a prior art of a method for manufacturing a screen printing plate for thinly printing a paste, a process of forming a pattern resist film on the surface of the electroforming mother mold larger than the thickness of the mask substrate, and a pattern resist film of the electroforming mother mold The primary electrodeposition of a discarded electrodeposition layer that is thinner than the thickness of the pattern resist film on the uncovered surface, and the electrodeposition corresponding to the mask substrate after performing a peeling treatment on the surface of the discarded electrodeposition layer The step of secondary electrodeposition of the layer and the electroforming mother mold are placed on the flat jig via the elastic mat, and the outer periphery of the electrodeposition layer and the pattern resist film is provided with a surrounding frame. A step of tightly polymerizing a conductive mesh while applying tension to the mesh, a step of integrally plating the mesh and the electrodeposition layer by plating from the mesh direction, and electrodeposition from the discarded electrodeposition layer Layer Method for manufacturing ultra-thin mesh-integrated metal mask, characterized by comprising a step of separating each shoe (e.g., see Patent Document 1) exists.
JP-A-8-183151 (refer to the claims section, detailed description section, and FIGS. 1 to 6)

  However, since the conventional ultra-thin mesh-integrated metal mask has a secondary electrodeposition layer corresponding to the mask substrate, the total thickness of the mesh-integrated metal mask is not limited to the mesh thickness. The thickness is increased by the thickness of the plating when integrally bonding the substrates and the thickness of the mask substrate. Therefore, there is a limit to thinly printing the paste.

A first invention of the present invention for solving the above-mentioned problems is a method for manufacturing a suspend metal mask as described in claim 1, and is as follows.
A primary resist film having a pattern corresponding to a mask pattern is formed on the surface of the electroforming mother die. Next, a portion of the electroformed mother die that is not covered with the primary resist film is etched to form a recess in the electroformed mother die. Next, the primary resist film is peeled off from the electroforming mother mold. Next, a secondary resist film is formed on the surface of the electroformed mother die having irregularities. Next, the secondary resist film is polished until the convex portions of the electroforming mother mold are exposed. Next, a conductive mesh screen is brought into close contact with the electroformed mother mold convex portion and the polished surface of the secondary resist film. Next, plating is performed from the direction of the mesh screen to form an electrodeposition layer and integrated with the mesh screen. Next, the mesh screen and the electrodeposition layer integrated from the electroforming mother mold are peeled off.

A second invention of the present invention for solving the above-mentioned problems is a suspend metal mask as described in claim 2, which is as follows.
A primary resist film having a pattern corresponding to a mask pattern is formed on the surface of the electroforming mother mold, and a concave portion is formed in the electroforming mother mold by etching a portion of the electroforming mother mold that is not covered with the primary resist film. Then, the primary resist film is peeled off from the electroformed mother mold, a secondary resist film is formed on the surface of the uneven electroformed mother mold, and the secondary resist film is exposed until the convex portions of the electroformed mother mold are exposed. A mesh screen having conductivity is adhered to the surface of the polished secondary resist film and the electroformed mother mold convex portion, and plating is formed from the direction of the mesh screen to form an electrodeposition layer. And the electrodeposition layer are integrated, and the mesh screen integrated from the electroforming mold and the electrodeposition layer are peeled to form.

Since the method for manufacturing a suspend metal mask and the suspend metal mask according to the present invention have the configuration as described above, the following effects can be obtained.
(1) A secondary electrodeposition layer is formed in a state in which irregularities are formed on the electroforming mother mold and a conductive mesh screen is in close contact with the convex portions of the electroforming mother mold, and only this secondary electrodeposition layer is formed. Since the mask is formed and the integrated mesh screen and the secondary electrodeposition layer are peeled off from the electroforming mother mold, a suspend metal mask without a mask substrate as in the prior art can be obtained. That is, since the total thickness can be reduced by the thickness of the mask substrate, the paste can be printed thinner.

  A primary resist film having a pattern corresponding to a mask pattern is formed on the surface of the electroforming mother die. Next, a portion of the electroformed mother die that is not covered with the primary resist film is etched to form a recess in the electroformed mother die. Next, the primary resist film is peeled off from the electroforming mother mold. Next, a secondary resist film is formed on the surface of the electroformed mother die having irregularities. Next, the secondary resist film is polished until the convex portions of the electroforming mother mold are exposed. Next, a conductive mesh screen is brought into close contact with the electroformed mother mold convex portion and the polished surface of the secondary resist film. Next, plating is performed from the direction of the mesh screen to form an electrodeposition layer and integrated with the mesh screen. Next, a suspend metal mask manufacturing method and a suspend metal mask comprising a step of peeling a mesh screen integrated from an electroforming mold and an electrodeposition layer.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a process diagram for explaining an embodiment of a method for manufacturing a suspend metal mask that is a feature of the present invention, and FIG. 2 is a process for explaining another embodiment of a method for manufacturing a suspend metal mask that is a feature of the present invention. FIG.

First, an embodiment of a method for manufacturing a suspend metal mask for etching the electroformed mother die 1 will be described with reference to FIG.
As shown in FIG. 1 (a), a pre-treated conductive electroforming mother die 1 is prepared.
The pretreatment referred to here is a treatment for improving the adhesion of the resist to be applied later, and any treatment can be performed as long as the above-mentioned purpose is achieved. For example, physical treatment such as buffing is performed. Chemical treatment such as treatment, hydrochloric acid treatment, or a combination of them is performed. In addition, the adhesion may be further improved by adding a degreasing treatment such as alkali degreasing.
Further, as the conductive electroforming mother die 1, a stainless material such as SUS301 or SUS304 is generally used, but of course, a conductive material other than the stainless material may be used.

As shown in FIG. 1B, a primary resist film 2 is formed on the electroforming mother die 1.
The resist film can be formed by laminating a film-like photoresist such as a dry film resist using an existing laminator, or by using a liquid resist as an existing liquid resist such as a roll coater, spin coater, bar coater or curtain coater. There is a method of forming a liquid resist film on an electroformed mother mold using a coating apparatus, but any method is acceptable as long as a resist film can be formed on the electroformed mother mold. The resist is roughly classified into a negative type resist and a positive type resist, but any type of resist may be used.
Here, for example, a negative type dry film resist is laminated on an electroforming mother mold using a laminator.
The thickness of the primary resist film 2 may be any thickness as long as the pattern resist film can be formed in the next step. This is because the primary resist film 2 is only used for etching the electroformed mother die 1 in a later step.

As shown in FIG. 1C, pattern exposure is performed.
The pattern exposure method is not particularly limited. For example, the primary resist film 2 may be irradiated with ultraviolet rays using a light source that generates ultraviolet rays, such as an ultra-high pressure mercury lamp or a metal halide lamp, after a photomask of a material such as glass or film is brought into close contact with the primary resist film 2. A pattern may be directly drawn on the primary resist film 2 without using a photomask by using a direct writing apparatus having a semiconductor laser or an ultrahigh pressure mercury lamp as a light source.
For the mask and drawing pattern for contact exposure, a negative pattern or a positive pattern is selected and used according to the type of photoresist.

  As shown in FIG. 1D, the drawn primary resist film 2 is developed and dried to form a patterned resist film 3.

As shown in FIG. 1E, etching is performed on the electroformed mother mold on which the pattern resist film 3 is formed.
An existing etchant may be used as the etchant. The etching depth is not particularly limited, and it is sufficient that the recess has good dimensional accuracy, can be filled with a liquid resist in the next step, and has a depth enough to prevent the resist from being peeled off during polishing in the next step. For example, etching is performed to a depth of about 10 μm.

  As shown in FIG. 1F, the patterned resist film 3 remaining on the surface of the etched electroformed mother die 1 is stripped using an existing resist stripper or the like.

As shown in FIG. 1G, a secondary resist film 6 is formed on the entire surface of the electroformed mother die 1 from which the pattern resist film 3 has been peeled off.
The resist used at this time may be any resist and resist film-forming method similar to the resist used for the primary resist film 2, but the secondary resist film 6 is formed by applying a resist in the recesses of the electroformed mother die 1. Since the purpose is to fill, a liquid resist can be preferably used rather than a dry film resist.
In addition, when laminating using a dry film resist, it is desirable to use a device such as a vacuum laminator so that air bubbles are not mixed into the recess during lamination.
Here, for example, a negative liquid resist is applied using a bar coater.

As shown in FIG. 1H, the entire surface of the secondary resist film 6 of the electroformed mother die 1 on which the secondary resist film 6 is formed is exposed.
Here, for example, since the pattern is not formed like the primary resist film 2, the entire surface of the secondary resist film 6 may be exposed using a light source that generates ultraviolet rays such as an ultrahigh pressure mercury lamp or a metal halide lamp.

As shown in FIG. 1I, the secondary resist film is polished until the electroformed mother die surface 1 that has not been etched 5 is exposed.
At this time, it is desirable that the secondary resist film is polished to the same height as the surface of the electroformed mother die 1 that has not been etched 5, but if slightly, the surface of the electroformed mother die that has not been etched by the secondary resist film 5 It may be lower than this. When the secondary resist film has the same thickness as the electroformed mother die surface that is not etched 5, the mask portion formed in the subsequent process is formed flush. When the secondary resist film is lower than the electroformed mother die surface not etched 5, the edge portion of the mask and the mesh screen portion of the opening are formed so as to protrude as thin as the secondary resist film.

As shown in FIG. 1 (j), a conductive mesh screen 8 previously stretched on a frame member with an appropriate tension is brought into close contact with the surface of the electroforming mother mold using a jig or the like.
Examples of the conductive mesh screen include a mesh fabric formed by braiding metal fine wires such as stainless steel and tungsten, a surface of the braided mesh fabric subjected to nickel plating, and a synthetic material such as polyester. The surface of a mesh fabric formed by braiding resin fibers is subjected to nickel plating or the like to impart conductivity, or the mesh fabric is directly formed by electroforming nickel or copper.
The conductive mesh screen 8 stretched on the frame material used at this time may be a so-called “directly stretched screen” in which the mesh screen 8 having close conductivity is directly stretched on the frame body with an appropriate tension. Alternatively, a so-called “combination screen” may be used in which the mesh screen 8 having close conductivity is stretched on a frame body with an appropriate tension via a support mesh screen (not shown).
The support mesh screen may be a mesh screen that is not conductive, for example, a mesh screen that is a mesh fabric formed by braiding synthetic resin fibers such as polyester. Of course, it goes without saying that the above-described mesh screen having conductivity may be used.
In addition, the support sheet is a sheet made of synthetic resin or metal, and it goes without saying that the presence or absence of conductivity is not limited.
If a direct screen is used, it becomes a direct suspend metal mask, and if a combination screen is used, it becomes a combination suspend metal mask.
Here, the directly suspended suspend metal mask and the combination suspend metal mask are collectively referred to as a suspend metal mask.

As shown in FIG. 1 (k), an electrodeposition layer 9 is formed by plating from the mesh screen direction in a state where the conductive mesh screen 8 is in close contact with the electroforming mother mold 1.
In addition, in order to improve the adhesiveness of plating before plating, it is desirable to perform a pretreatment such as pickling on the mesh screen.
In the prior art, this electrodeposition layer 9 is a plating performed to join and integrate the primary electrodeposition layer serving as a mask substrate and the mesh screen 8 as a secondary electrodeposition layer. A mask substrate is formed by the next electrodeposition layer itself.
That is, since the mask is formed with the electrodeposition layer 9 using the projections of the electroformed mother die 1 as a pattern in close contact with the electroformed mother die 1, the mask portion is different from the conventional manufacturing method in which the mask substrate is attached by plating. A shape that hardly protrudes is obtained.

As shown in FIG. 1 (l), the electroforming mother mold 1 is peeled off.
As described above, it is possible to obtain a suspend metal mask having a shape in which the mask portion patterned only by the electrodeposition layer 9 does not protrude.
In this electrodeposition layer 9 formation step, if a general nickel sulfamate plating bath or a sulfamic acid alloy plating bath containing nickel as a main component is used, the plating grows isotropically. When a mesh screen having a thickness of about 2 μmt is applied, a mask portion having a thickness of about 2 μmt can be obtained.
On the other hand, in this electrodeposition layer 9 forming step, if a plating bath capable of obtaining a high opening rate described in Japanese Patent Application Laid-Open No. 2005-125547 previously filed by the present applicant is used, the electroforming mother mold convex portion side is selectively used. Therefore, for example, when a conductive mesh screen is plated with a thickness of about 1 μmt, the thickness of the mask portion is about 4 μmt, and the total thickness is plated with a conventional plating bath at a high opening rate. Since the total thickness is about 1 μmt thinner than the case and the thickness of the mask portion is about 2 μmt thick, the generation of pinholes in the mask portion is suppressed, and a shape with higher printing durability can be obtained.

Next, another embodiment of a method for manufacturing a suspend metal mask for etching 5 the electroformed mother die 1 will be described with reference to FIG.
FIG. 2 is performed by removing the step of stripping the primary resist film 2 of the electroformed mother die 1 subjected to the etching 5 of FIG. 1 (f) described above.
That is, as shown in FIG. 2A, a pretreated conductive electroforming mother die 1 is prepared.
Note that the pretreatment referred to here is a treatment for improving the adhesion of a resist to be applied later.
As shown in FIG. 2B, a primary resist film 2 is formed on the electroformed mother die 1.
As shown in FIG. 2C, the pattern is exposed.
As shown in FIG. 2D, the drawn primary resist film 2 is developed and dried to form a patterned resist film 3.
As shown in FIG. 2E, etching 5 is performed on the electroformed mother die 1 on which the pattern resist film 3 is formed.
As shown in FIG. 2F, a secondary resist film 6 is formed on the surface of the pattern resist film 3 and the concave surface of the electroformed mother die 1 that has been subjected to the etching 5 treatment.
Here, since the purpose of the secondary resist film 6 is to fill the concave portion of the electroformed mother die 1 with a resist, a liquid resist can be used more favorably than a dry film resist. In addition, when laminating using a dry film resist, it is desirable to use a device such as a vacuum laminator so that bubbles are not mixed into the recesses during laminating.
As shown in FIG. 2G, the entire surface of the secondary resist film 6 formed on the electroformed mother die 1 is exposed.
As shown in FIG. 2H, the pattern resist film 3 and the secondary resist film 6 are polished until the surface of the electroformed mother die 1 that has not been etched 5 is exposed.
At this time, it is desirable that the pattern resist film 3 and the secondary resist film 6 are polished to the same height as the surface of the electroformed mother die 1 not etched 5. It may be lower than one surface of the electroforming mother die that has not been formed. When the secondary resist film 6 has the same thickness as the electroformed mother die 1 that has not been etched 5, the mask portion formed in the subsequent process is formed flush. When the secondary resist film 6 is lower than the surface of the electroformed mother die 1 not etched 5, the edge portion of the mask and the mesh screen portion of the opening are formed so as to protrude as thin as the secondary resist film 6 It is.
As shown in FIG. 2 (i), a conductive mesh screen 8 previously stretched on a frame member with an appropriate tension is brought into close contact with the surface of the electroforming mother mold using a jig or the like.
Examples of the conductive mesh screen include a mesh fabric formed by braiding metal fine wires such as stainless steel and tungsten, a surface of the braided mesh fabric subjected to nickel plating, and a synthetic material such as polyester. The surface of a mesh fabric formed by braiding resin fibers is subjected to nickel plating or the like to impart conductivity, or the mesh fabric is directly formed by electroforming nickel or copper.
The conductive mesh screen 8 stretched on the frame material used at this time may be a so-called “directly stretched screen” in which the mesh screen 8 having close conductivity is directly stretched on the frame body with an appropriate tension. Alternatively, a so-called “combination screen” may be used in which the conductive mesh screen 8 that is in close contact is stretched on a frame body with an appropriate tension via a support mesh screen, a support sheet-like material (not shown), or the like.
The support mesh screen may or may not be conductive. For example, a mesh screen that is a mesh fabric formed by braiding synthetic resin fibers such as polyester may be used as a mesh screen that does not have conductivity, and of course, the above-described mesh screen having conductivity may be used. It goes without saying that it is good.
Further, the support sheet-like material is a sheet-like material made of a synthetic resin or a metal, and it goes without saying that these materials may or may not be conductive.
If a straight screen is used, it becomes a direct suspension metal mask, and if a combination screen is used, it becomes a direct suspension metal mask.
Here, the directly suspended suspend metal mask and the combination suspend metal mask are collectively referred to as a suspend metal mask.
As shown in FIG. 2 (j), the electrodeposition layer 9 is formed by plating from the mesh screen direction in a state where the conductive mesh screen 8 is in close contact with the electroforming mother mold 1.
In addition, in order to improve the adhesiveness of plating before plating, it is desirable to perform a pretreatment such as pickling on the mesh screen.
In the prior art, this electrodeposition layer 9 is a plating performed to join and integrate the primary electrodeposition layer serving as a mask substrate and the mesh screen 8 as a secondary electrodeposition layer. A mask substrate is formed by the next electrodeposition layer itself.
That is, since the mask is formed with the electrodeposition layer 9 using the projections of the electroformed mother die 1 as a pattern in close contact with the electroformed mother die 1, the mask portion is different from the conventional manufacturing method in which the mask substrate is attached by plating. It is possible to obtain a shape that hardly protrudes.
As shown in FIG. 2 (k), the electroforming mother mold 1 is peeled off.
As described above, the suspended metal mask 10 having a shape in which the mask portion patterned only by the electrodeposition layer 9 hardly protrudes can be obtained.
In this electrodeposition layer forming step, if a general nickel sulfamate plating bath or a sulfamic acid alloy plating bath containing nickel as a main component is used, the plating grows isotropically. When the mesh screen is plated with a thickness of about 2 μmt, a shape with a mask portion thickness of about 2 μmt can be obtained.
On the other hand, in this electrodeposition layer 9 formation step, if a plating bath capable of obtaining a high opening rate described in Japanese Patent Application Laid-Open No. 2005-125547 previously filed by the present applicant is used, the electrodeposition layer 9 is selectively formed on the primary electrodeposition layer forming side. Therefore, for example, when a conductive mesh screen is plated with a thickness of about 1 μmt, the thickness of the mask portion is about 4 μmt, and the total thickness is plated with a conventional plating bath at a high opening rate. Since the total thickness is about 1 μmt thinner than the case and the thickness of the mask portion is about 2 μmt thick, the generation of pinholes in the mask portion is suppressed, and a shape with higher printing durability can be obtained.
The suspend metal mask is manufactured through the above steps.

  It can also be used in the screen printing field where thin film printing is required.

BRIEF DESCRIPTION OF THE DRAWINGS It is process drawing which shows one Example of the manufacturing method of the suspend metal mask obtained by etching the electrocasting mother die of this invention, (a) is a front sectional view which shows the electroformed electroforming mother die which carried out surface treatment, ( (b) is a front sectional view showing a state where a primary resist film is formed on the electroformed mother mold of (a), (c) is a front sectional view showing a state where a pattern is exposed on the primary resist film, and (d) is a front sectional view showing a state where the pattern is exposed to the primary resist film. FIG. 6E is a front sectional view showing a state in which the drawn resist is developed and a pattern resist film is formed, FIG. 5E is a front sectional view showing a state in which the electroformed mother die on which the pattern resist film is formed is etched, and FIG. Front sectional view showing a state where the pattern resist film is peeled off from the mother die, (g) is a front sectional view showing a state where the secondary resist film is formed on the electroformed mother die which has been peeled off and etched. (H) shows a state where the entire surface of the secondary resist film is exposed. Sectional drawing, (i) is a front sectional view showing a state in which a secondary resist film is polished until an unetched electroformed mother die surface is exposed, and (j) is a conductive mesh screen with an electroformed mother die. (K) is a front sectional view showing a state in which an electrodeposition layer is formed in a state where a conductive mesh screen is in close contact with an electroforming mother mold, and (l) is an electroforming. It is a front sectional view showing a state where the suspend metal mask is peeled off from the mother die. It is process drawing which shows the other Example of the manufacturing method of the suspend metal mask obtained by etching the electroforming mother mold of this invention, (a) is a front sectional view which shows the electroformed electroforming mother mold which carried out surface treatment, (B) is a front sectional view showing a state in which a primary resist film is formed on the electroformed mother mold of (a), (c) is a front sectional view showing a state in which a pattern is exposed on the primary resist film, (d) Is a front sectional view showing a state in which the drawn resist is developed and a pattern resist film is formed, (e) is a front sectional view showing a state in which the electroformed mother die on which the pattern resist film is formed is etched, and (f) is a pattern A front sectional view showing a state in which a secondary resist film is further formed on the electroforming mold in a state where a resist film is formed, (g) is a front sectional view showing a state in which the entire surface of the secondary resist film is exposed, and (h) Etching the secondary resist film and pattern resist film FIG. 2 is a front sectional view showing a state where the electroformed mother mold surface is polished until it is exposed; FIG. 1 (i) is a front sectional view showing a state in which a conductive mesh screen is in close contact with the electroformed mother mold; FIG. 5 is a front sectional view showing a state in which an electrodeposited layer is formed in a state where a mesh screen having a property is in close contact with the electroformed mother mold, and (k) is a front sectional view showing a state in which the suspend metal mask is peeled from the electroformed mother mold is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 .... Electroforming mother mold 2 .... Primary resist film 3 .... Pattern resist film 4 .... Resist development 5 .... Electroforming mother die etching 6 .... Secondary Resist film 7 ... Secondary resist polished surface 8 ... Mesh screen 9 ... Electrodeposition layer 10 ... Stripped suspend metal mask

Claims (2)

A primary resist film having a pattern corresponding to a mask pattern is formed on the surface of the electroforming mother die. Next, a portion of the electroformed mother die that is not covered with the primary resist film is etched to form a recess in the electroformed mother die. Next, the primary resist film is peeled off from the electroforming mother mold. Next, a secondary resist film is formed on the surface of the electroformed mother die having irregularities. Next, the secondary resist film is polished until the convex portions of the electroforming mother mold are exposed. Next, a mesh screen having conductivity is brought into close contact with the electroformed mother mold convex portion and the surface of the polished secondary resist film. Next, plating is performed from the direction of the mesh screen to form an electrodeposition layer and integrated with the mesh screen. Next, a method for manufacturing a suspend metal mask, comprising: a step of peeling the mesh screen integrated from the electroforming mold and the electrodeposition layer. A primary resist film having a pattern corresponding to a mask pattern is formed on the surface of the electroforming mother mold, and a concave portion is formed in the electroforming mother mold by etching a portion of the electroforming mother mold that is not covered with the primary resist film. Then, the primary resist film is peeled off from the electroformed mother mold, a secondary resist film is formed on the surface of the uneven electroformed mother mold, and the secondary resist film is exposed until the convex portions of the electroformed mother mold are exposed. A mesh screen having conductivity is adhered to the surface of the polished secondary resist film and the electroformed mother mold convex portion, and plating is formed from the direction of the mesh screen to form an electrodeposition layer. Suspended metal mask characterized in that the electrodeposition layer and the electrodeposition layer are integrated, and the mesh screen integrated from the electroforming mold and the electrodeposition layer are peeled off.

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