JP2010040882A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact electronic component in which a capacitor is incorporated. <P>SOLUTION: A laminate 14 is formed by laminating a plurality of insulator layers. A coil is incorporated in the laminate 14. External electrodes 22a and 22c are connected to the coil and also provided to the surface of the laminate 14. An insulator 24 is provided on the external electrodes 22a and 22c. External electrodes 20a and 20c form capacitors with the external electrodes 22a and 22c by sandwiching the insulator 24 in-between. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component, and more particularly, to an electronic component including a laminate in which insulator layers are laminated.

  As a conventional electronic component, for example, a multilayer balun transformer described in Patent Document 1 is known. The laminated balun transformer is an element that converts an unbalanced signal into a balanced signal and outputs it, and includes two magnetic substrates, a laminated body, and external electrodes. The laminated body is sandwiched between two magnetic substrates, and is configured by laminating layers made of an insulator such as polyimide. In addition, the laminate includes two transformers. Each transformer is configured by magnetically coupling two coils. The external electrode is formed on the side surface of the magnetic substrate and the laminate, and is connected to the transformer.

  The laminated balun transformer is used, for example, in a tuner of a mobile phone. Specifically, in a cellular phone tuner, the laminated balun transformer converts an unbalanced signal received by an antenna into a balanced signal and outputs it to a subsequent RF (Radio Frequency) transceiver IC (hereinafter referred to as an RF IC). To do.

  By the way, in a tuner of a mobile phone, a low noise amplifier is provided in front of the multilayer balun transformer. A bias voltage for driving is applied to the low noise amplifier. Therefore, a direct current is superimposed on the unbalanced signal output from the low noise amplifier. Therefore, a direct current is also superimposed on the balance signal output from the laminated balun transformer. As described above, when the balance signal on which the direct current is superimposed is input to the RF IC, a problem occurs in the RF IC. Therefore, a capacitor for removing the direct current component of the balance signal is usually provided between the multilayer balun transformer and the RF IC.

However, when a capacitor is provided in addition to the multilayer balun transformer, the number of elements increases, and there is a problem that the tuner of the mobile phone becomes large.
International Publication No. 2006/123485 Pamphlet

  Accordingly, an object of the present invention is to provide a small electronic component having a built-in capacitor for removing a direct current component.

  An electronic component according to an aspect of the present invention includes a base made of an insulating material, an internal electrode built in the base, a first electrode connected to the internal electrode and provided on the surface of the base. 1 external electrode, an insulator provided on the first external electrode, and a second external electrode forming a capacitor by sandwiching the insulator together with the first external electrode, It is characterized by providing.

  According to the present invention, it is possible to provide a small electronic component incorporating a capacitor.

  The configuration of an electronic component according to an embodiment of the present invention will be described below with reference to the drawings.

(First embodiment)
(Configuration of electronic parts)
Hereinafter, the configuration of the electronic component according to the first embodiment of the present invention will be described with reference to the drawings. The electronic component according to this embodiment is a balun transformer having an impedance ratio of 1: 1. The balun transformer is an element that converts an unbalanced signal received by an antenna into a balanced signal and outputs it to a subsequent RF IC in a cellular phone tuner. FIG. 1A is an external perspective view of the electronic component 10a according to the first embodiment. FIG. 1B is an exploded perspective view of the electronic component 10a. FIG. 2 is an exploded perspective view of the main body 12 of the electronic component 10a. FIG. 3 is an equivalent circuit diagram of the electronic component 10a of FIG. Hereinafter, the stacking direction of the electronic component 10a is defined as the z-axis direction, the direction along the long side of the electronic component 10a is defined as the x-axis direction, and the direction along the short side of the electronic component 10a is defined as the y-axis direction. To do. The x axis, the y axis, and the z axis are orthogonal to each other.

  As illustrated in FIGS. 1A and 1B, the electronic component 10 a includes a main body 12, external electrodes 20 a to 20 d, 22 a, 22 c and an insulator 24. The main body 12 has a rectangular parallelepiped shape, and is configured by stacking the magnetic substrate 16, the stacked body 14, and the magnetic substrate 18 so as to be arranged in this order from the positive direction side in the z-axis direction. As illustrated in FIG. 1B, the external electrodes 22 a and 22 c are provided so as to extend in the z-axis direction on the side surface (surface) located on the negative direction side of the main body 12 in the y-axis direction. The external electrodes 22a and 22c are formed so as not to protrude from the side surfaces. Therefore, a gap is provided between the external electrodes 22a and 22c and the ridge lines located at both ends in the z-axis direction.

  As shown in FIG. 1B, the insulator 24 is a resin layer formed on the external electrodes 22a and 22b so as to cover the entire side surface located on the negative side in the y-axis direction. Since the external electrodes 22a and 22c are formed so as not to protrude from the side surfaces, they are covered with the insulator 24.

  The external electrodes 20a and 20c are provided on the side surface of the main body 12 on the negative side in the y-axis direction so as to face the external electrodes 22a and 22c with the insulator 24 interposed therebetween. Since the external electrodes 22a and 22c are covered with the insulator 24, they are insulated from the external electrodes 20a and 20c. Accordingly, a capacitance is formed between the external electrode 20a and the external electrode 22a, and the external electrode 20a, 22a and the insulator 24 constitute the capacitor C1. Further, a capacitance is formed between the external electrode 20c and the external electrode 22c, and the external electrode 20c, 22c and the insulator 24 constitute a capacitor C2.

  The external electrodes 20b and 20d are provided on the side surface of the main body 12 on the positive side in the y-axis direction so as to extend in the z-axis direction.

  As shown in FIG. 2, the magnetic substrates 16 and 18 have a rectangular parallelepiped shape, and sandwich the laminate 14 from the positive side and the negative side in the z-axis direction. The magnetic substrates 16 and 18 are made of a magnetic material such as ferrite.

  As shown in FIG. 2, the laminated body 14 includes a transformer T, and is configured by laminating insulator layers 14a to 14d so as to be arranged in this order from the positive side in the z-axis direction. The insulator layers 14a to 14d are resin layers having a rectangular shape. The transformer T includes coils L1 and L2 that are magnetically coupled to each other. The coils L1 and L2 will be described below.

  As shown in FIG. 2, the coil L1 includes coil electrodes 26a and 26b and via-hole conductors 28a to 28d. The coil electrode 26a includes a coil portion 30a, lead portions 32a and 34a, and a wiring portion 36a, and is provided on the insulator layer 14a. The lead portion 32a is a portion that connects the coil portion 30a and the external electrode 22a. As shown in FIG. 1B, the lead portion 32a is on the positive side in the x-axis direction from the center of the side surface on the negative direction side in the y-axis direction. In FIG. Thereby, the extraction part 32a is connected to the external electrode 22a. The lead-out portion 34a is a portion that connects the coil portion 30a and the external electrode 20b, and as shown in FIG. 1B, the positive side in the x-axis direction from the center of the side surface on the positive side in the y-axis direction. In FIG. Thereby, the extraction part 34a is connected to the external electrode 20b.

  One end of the coil portion 30a is connected to the lead-out portion 32a, and when viewed in plan from the positive side in the z-axis direction, the coil portion 30a is spirally rotated clockwise toward the center (intersection of diagonal lines) of the insulator layer 14a. It is a linear electrode. The wiring portion 36a is connected to the other end of the coil portion 30a and the lead-out portion 34a, and extends in the y-axis direction. The coil part 30a is cut in a region through which the wiring part 36a passes so as not to be short-circuited with the wiring part 36a. Therefore, the coil portion 30a has end portions 38a to 38d on both sides in the x-axis direction of the wiring portion 36a.

  Each of the via-hole conductors 28a to 28d is provided so as to penetrate the insulator layer 14a, and is provided so as to overlap with the end portions 38a to 38d when viewed in plan from the z-axis direction. The via-hole conductors 28a to 28d are formed by embedding the same conductive material as that of the coil electrode 26a in the via hole formed in the insulator layer 14a. Since the via-hole conductors 28a to 28d are formed at the same time as the formation of the coil electrode 26a, the via-hole conductors 28a to 28d are not actually separated from the coil electrode 26a as shown in FIG. It is united with. However, here, in order to facilitate the explanation, the via-hole conductors 28a to 28d and the coil electrode 26a are described separately.

  The coil electrode 26b includes a coil portion 30b and lead portions 32b and 34b, and is provided on the insulator layer 14b. The lead portion 32b is a portion that connects the coil portion 30b and the external electrode 22a. As shown in FIG. 1B, the lead portion 32b is on the positive side in the x-axis direction from the center of the side surface on the negative direction side in the y-axis direction. In FIG. Thereby, the lead-out part 32b is connected to the external electrode 22a. The lead portion 34b is a dummy electrode and is not connected to the coil portion 30b.

  One end of the coil portion 30b is connected to the lead-out portion 32b, and when viewed in plan from the positive side in the z-axis direction, the coil portion 30b rotates in a clockwise direction toward the center (intersection of diagonal lines) of the insulator layer 14b. It is a linear electrode. The coil portion 30b has the same shape as the coil portion 30b so as to overlap the coil portion 30a when viewed in plan from the z-axis direction. However, since the coil electrode 26b does not have a wiring portion, the coil electrode 26b does not have the end portions 38a to 38d like the coil electrode 26a. That is, the coil 30b is provided with wiring even at a position overlapping the wiring 36a when viewed in plan from the z-axis direction, and is not disconnected in the middle.

  Furthermore, since the coil parts 30a and 30b have the same shape and are provided so as to overlap each other, the coil part 30a and the coil part 30b are connected by the via-hole conductors 28a to 28d. As a result, the end 38a and the end 38b are connected by the via-hole conductors 28a and 28b and the coil electrode 30b. Further, the end portion 38c and the end portion 38d are connected by the via-hole conductors 28c and 28d and the coil portion 30b. Therefore, the signal input from the lead-out portion 34a is the wiring portion 36a, the coil portion 30a, the via hole conductor 28d, the coil portion 30b, the via hole conductor 28c, the coil portion 30a, the via hole conductor 28b, the coil portion 30b, the via hole conductor 28a, and the coil portion 30a. In this order, and can reach the drawer portion 32a.

  Further, the coil portion 30a and the coil portion 30b are connected by the via-hole conductors 28a to 28d. Therefore, the coil part 30b is connected in parallel to the coil part 30a between the external electrode 22a and the via-hole conductor 28a and between the via-hole conductor 28b and the via-hole conductor 28c. Therefore, the signal input from the lead-out part 34a can also pass through the wiring part 36a, the coil part 30a, the via-hole conductor 28d, and the coil part 30b in this order to reach the lead-out part 32b. Here, as shown in FIG. 1B, the lead portions 32a and 32b are connected to the external electrode 22a, so that the coil electrodes 26a and 26b and the via-hole conductors 28a to 28d constitute one coil L1. ing.

  As shown in FIG. 2, the coil L2 includes coil electrodes 26c and 26d and via-hole conductors 28e to 28h. The coil electrode 26c includes a coil portion 30c, lead portions 32c and 34c, and a wiring portion 36b, and is provided on the insulator layer 14c. The lead portion 32c is a portion that connects the coil portion 30c and the external electrode 22c. As shown in FIG. 1B, the lead portion 32c is closer to the negative direction side in the x-axis direction than the center of the side surface on the negative direction side in the y-axis direction. In FIG. Thereby, the extraction part 32c is connected to the external electrode 22c. The lead portion 34c is a portion that connects the coil portion 30c and the external electrode 20d, and as shown in FIG. 1B, the lead portion 34c is on the negative side in the x-axis direction from the center of the side surface on the positive side in the y-axis direction. In FIG. Thereby, the lead part 34c is connected to the external electrode 20d.

  One end of the coil portion 30c is connected to the lead-out portion 32c, and spirally rotates clockwise toward the center (intersection of diagonal lines) of the insulator layer 14a when viewed from the positive side in the z-axis direction. It is a linear electrode. The coil portion 30c overlaps with the coil portions 30a and 30b in the z-axis direction and is rotated in the same direction as the coil portions 30a and 30b in order to be magnetically coupled to the coil portions 30a and 30b. The wiring part 36b is connected to the other end of the coil part 30c and the lead part 34c, and extends in the y-axis direction. The coil portion 30c is cut in a region through which the wiring portion 36b passes so as not to be short-circuited with the wiring portion 36b. Therefore, the coil part 30c has end parts 38e to 38h on both sides in the x-axis direction of the wiring part 36b.

  Each of the via-hole conductors 28e to 28h is provided so as to penetrate the insulator layer 14c, and is provided so as to overlap with the end portions 38e to 38h when viewed in plan from the z-axis direction. The via-hole conductors 28e to 28h are formed by embedding the same conductor material as that of the coil electrode 26c in a via hole formed in the insulator layer 14c. Since the via-hole conductors 28e to 28h are formed at the same time as the formation of the coil electrode 26c, actually, the via-hole conductors 28e to 28h are not separated from the coil electrode 26c as shown in FIG. It is united with. However, here, the via-hole conductors 28e to 28h and the coil electrode 26c are separated and described for easy explanation.

  The coil electrode 26d includes a coil portion 30d and lead portions 32d and 34d, and is provided on the insulator layer 14d. The lead-out part 32d is a part that connects the coil part 30d and the external electrode 22c, and as shown in FIG. 1B, the lead-side part 32d is closer to the negative side in the x-axis direction than the center of the side face on the negative side in the y-axis direction. In FIG. Thereby, the lead portion 32d is connected to the external electrode 22c. The lead part 34d is a dummy electrode and is not connected to the coil part 30d.

  One end of the coil portion 30d is connected to the lead-out portion 32d, and when viewed in plan from the positive side in the z-axis direction, the coil portion 30d rotates in a clockwise direction toward the center (intersection of diagonal lines) of the insulator layer 14d. It is a linear electrode. The coil portion 30d overlaps the coil portions 30a and 30b in the z-axis direction and is rotated in the same direction as the coil portions 30a and 30b in order to be magnetically coupled to the coil portions 30a and 30b. However, since the coil electrode 26d does not have a wiring portion, the coil electrode 26d does not have the end portions 38e to 38h like the coil electrode 26c. That is, the coil portion 30d is provided with wiring even at a position overlapping the wiring portion 36b when viewed in plan from the z-axis direction, and is not disconnected in the middle.

  Furthermore, since the coil parts 30c and 30d have the same shape and are provided so as to overlap each other, the coil part 30c and the coil part 30d are connected by the via-hole conductors 28e to 28h. As a result, the end portions 38e and 38f and the end portions 38g and 38h are connected by the via-hole conductors 28e to 28h and the coil portion 30d. Therefore, the signals input from the lead-out part 34c are the wiring part 36b, the coil part 30c, the via hole conductor 28h, the coil part 30d, the via hole conductor 28g, the coil part 30c, the via hole conductor 28f, the coil part 30d, the via hole conductor 28e, and the coil part 30c. In this order, and can reach the drawer 32c.

  Further, the coil part 30c and the coil part 30d are connected by the via-hole conductors 28e to 28h. Therefore, the coil part 30d is connected in parallel to the coil part 30c between the external electrode 22c and the via-hole conductor 28e and between the via-hole conductor 28f and the via-hole conductor 28g. Therefore, the signal input from the lead portion 34c can also pass through the wiring portion 36b, the coil portion 30c, the via-hole conductor 28h, and the coil portion 30d in this order and reach the lead portion 32d. Here, since the lead portions 32c and 32d are connected to the external electrode 22c, as shown in FIG. 1B, the coil electrodes 26c and 26d and the via-hole conductors 28e to 28h constitute one coil L2. ing.

  In the electronic component 10a configured as described above, as shown in FIG. 3, the capacitor C1 and the coil L1 are connected in series between the external electrode 20a and the external electrode 20b. A capacitor C2 and a coil L2 are connected in series between the external electrode 20c and the external electrode 20d. In addition, since the coil portions 30a to 30d are aligned in the z-axis direction and are rotated in the same direction, the coil L1 and the coil L2 are magnetically coupled. As a result, the coils L1 and L2 constitute a transformer T.

  In the electronic component 10a, the coil L1 and the coil L2 have the same structure, and the capacitor C1 and the capacitor C2 have the same structure. Therefore, the impedance between the external electrode 20b and the external electrode 20d is equal to the impedance between the external electrode 20a and the external electrode 20c. Therefore, the electronic component 10a has an impedance ratio of 1: 1.

  In the electronic component 10a configured as described above, as shown in FIG. 3, the external electrode 20d is grounded, the external electrode 20b is an input terminal (unbalanced terminal), and the external electrodes 20a and 20c are output terminals (balanced terminals). Thus, it can be used as a balun transformer. When an unbalance signal is input via the external electrode 20b, a balance signal is generated by electromagnetic induction between the coil L1 and the coil L2. The balance signal is output from the external electrodes 20a and 20c.

(effect)
According to the electronic component 10a, a small balun transformer having capacitors C1 and C2 can be obtained. More specifically, in the electronic component 10a, the external electrodes 20a to 20d, 22a, 22c and the insulator 24 constitute capacitors C1, C2. Therefore, the capacitors C1 and C2 are built in the electronic component 10a. As a result, the electronic component 10a can be reduced in size as compared with the case where the electronic component and the capacitor are provided separately.

  In addition, according to the electronic component 10a, the capacitors C1 and C2 can be incorporated without changing the characteristics of the transformer T. For example, in the electronic component 10a, when it is desired to provide the capacitors C1 and C2 in the electronic component 10a, it is conceivable to provide the capacitors C1 and C2 in the multilayer body 14. In this case, the characteristics of the transformer T change greatly as described below. More specifically, the laminated body 14 is sandwiched between the magnetic substrates 16 and 18 in order to obtain high conversion efficiency in the transformer T. As a result, the magnetic flux generated by the coils L1 and L2 passes through the laminate 14 and the magnetic substrates 16 and 18. Since the magnetic substrates 16 and 18 have a relatively high magnetic permeability, the inductance values of the coils L1 and L2 are also relatively high. Therefore, the conversion efficiency of the transformer T is also relatively high.

  However, when the electrodes of the capacitors C1 and C2 are provided in the multilayer body 14, the magnetic flux toward the magnetic substrates 16 and 18 is blocked by the electrodes of the capacitors C1 and C2. As a result, the magnetic flux generated by the coils L1 and L2 passes through the laminated body 14 without passing through the magnetic substrates 16 and 18 almost. Since the magnetic permeability of the laminate 14 is lower than the magnetic permeability of the magnetic substrates 16 and 18, the inductance values of the coils L1 and L2 are also relatively low. Therefore, the conversion efficiency of the transformer T is also relatively low. Therefore, when the capacitors C1 and C2 are provided in the multilayer body 14, there is a problem that the characteristics of the transformer T greatly deviate from the desired characteristics.

  On the other hand, in the electronic component 10a, the external electrodes 20a to 20d, 22a, and 22c constituting the capacitors C1 and C2 are provided on the side surface of the main body 12. Therefore, the external electrodes 20a to 20d, 22a, and 22c are not positioned between the multilayer body 14 and the magnetic substrates 16 and 18, so that the magnetic flux toward the magnetic substrates 16 and 18 is not blocked. Therefore, in the electronic component 10a, the deviation in the characteristics of the transformer T due to the presence of the capacitors C1 and C2 is smaller than when the capacitors C1 and C2 are provided in the multilayer body 14. Therefore, according to the electronic component 10a, the capacitors C1 and C2 can be incorporated without substantially changing the characteristics of the transformer T.

  The electronic component 10a can be suitably used as a balun transformer for a tuner such as a mobile phone. More specifically, the balance signal input to the RF IC connected to the subsequent stage of the balun transformer must be in a state where the DC component is removed. Therefore, in the multilayer balun transformer described in Patent Document 1, it is necessary to provide a capacitor for removing the DC component of the balance signal between the multilayer balun transformer and the RF IC.

  On the other hand, in the electronic component 10a, the capacitors C1 and C2 are connected in series between the coils L1 and L2 and the external electrodes 20a and 20c. When the capacitors C1 and C2 are connected in series, only the AC component of the balance signal is allowed to pass, and the DC component of the balance signal is not allowed to pass. Therefore, when the balance signal that has passed through the transformer T passes through the capacitors C1 and C2, only the DC component is removed. As a result, the balance signal from which the DC component is removed is input to the RF IC. That is, when the electronic component 10a is used for a balun transformer of a tuner such as a mobile phone, it is not necessary to newly provide a capacitor, and thus is suitable for a balun transformer of a tuner such as a mobile phone.

  In the electronic component 10a, the capacitors C1 and C2 are provided between the external electrode 20a and the coil L1 and between the external electrode 20c and the coil L2, respectively. Thereby, the external electrodes 20a and 20c constituting the capacitors C1 and C2 constitute an output terminal of the electronic component 10a. Thus, when the capacitors C1 and C2 are provided only on the output terminal (external electrodes 20a and 20c) side, the conversion efficiency of the electronic component 10a is higher than when the capacitor is provided on the grounded external electrode 20d side. Get higher. However, the place where the capacitors C1 and C2 are provided is not limited to this. The capacitor may be provided between the external electrode 20b and the coil L1 and between the external electrode 20d and the coil L2. Thus, by providing four capacitors, the directionality of the electronic component 10a can be eliminated. More specifically, when only the capacitors C1 and C2 are provided as in the electronic component 10a, the external electrodes 20a and 20c must be used as output terminals. That is, in the electronic component 10a, it is necessary to mount in consideration of the direction of the electronic component 10a at the time of mounting.

  On the other hand, in an electronic component including four capacitors, the capacitors are between the external electrode 20a and the coil L1, between the external electrode 20b and the coil L1, between the external electrode 20c and the coil L2, and externally. It is provided between each of the electrode 20d and the coil L2. Therefore, any of the external electrodes 20a to 20d can be used as an output terminal. As a result, with the four electronic components, there is no need to be aware of the directionality of the electronic components during mounting.

(simulation)
The inventor of the present application conducted a computer simulation described below with reference to the drawings in order to make the above-described effect produced by the electronic component 10a clearer. More specifically, external electrodes 22a and 22c and an insulator 24 are provided in the electronic component 10a model (hereinafter referred to as a first model) shown in FIGS. 1 and 2, and in the electronic component 10a shown in FIGS. An unmodeled model (hereinafter referred to as a second model) was produced. Then, the insertion loss characteristics and the common mode rejection ratio (CMRR) characteristics of the first model and the second model were examined. FIG. 4 is a graph showing the simulation results. FIG. 4A is a graph showing the relationship between frequency and insertion loss. The vertical axis represents insertion loss, and the horizontal axis represents frequency. FIG. 4B is a graph showing the relationship between the frequency and the in-phase signal rejection ratio. The vertical axis represents the in-phase signal rejection ratio, and the horizontal axis represents the frequency.

  4A and 4B show that the characteristics of the first sample and the characteristics of the second sample are close to each other. Therefore, it can be seen that in the electronic component 10a, the characteristics of the transformer T hardly change even if the capacitors C1 and C2 are provided. In addition, when the electronic component 10a is used as a balun transformer of a cellular phone tuner or a terrestrial digital tuner, the signal frequency is 470 MHz to 780 MHz or 470 MHz to 870 MHz. 4A and 4B, the characteristics of the first sample and the second sample are almost the same at these frequencies. Therefore, it can be seen that the electronic component 10a can be suitably used as a balun transformer of a cellular phone tuner.

(Second Embodiment)
The configuration of the electronic component according to the second embodiment of the present invention will be described below with reference to the drawings. The electronic component according to the present embodiment is a balun transformer having an impedance ratio of 1: 4. FIG. 5A is an external perspective view of the electronic component 10b according to the second embodiment. FIG. 5B is an exploded perspective view of the electronic component 10b. FIG. 6 is an exploded perspective view of the main body 112 of the electronic component 10b. FIG. 7 is an equivalent circuit diagram of the electronic component 10b of FIG. Hereinafter, the stacking direction of the electronic component 10b is defined as the z-axis direction, the direction along the long side of the electronic component 10b is defined as the x-axis direction, and the direction along the short side of the electronic component 10b is defined as the y-axis direction. To do. The x axis, the y axis, and the z axis are orthogonal to each other.

  The difference between the electronic component 10b and the electronic component 10a is that the impedance ratio is different. Therefore, hereinafter, the electronic component 10b will be described focusing on the difference. In the configuration of the electronic component 10b, the same reference numerals used for the electronic component 10a are given “1” for the same components as those of the electronic component 10a.

  The electronic component 10b is obtained by providing capacitors C11 and C13 to the multilayer balun transformer described in Patent Document 1. More specifically, the electronic component 10b includes a main body 112, external electrodes 120a to 120f, 122a, 122e, and an insulator 124 as shown in FIGS. 5 (a) and 5 (b). The main body 112 and the external electrodes 120a to 120f, 122a and 122e and the insulator 124 are basically the same as the main body 12 and the external electrodes 20a to 20d, 22a and 22c and the insulator 24. Description is omitted. The external electrodes 120a and 122a and the insulator 124 constitute a capacitor C11. The external electrodes 120e and 122e and the insulator 124 constitute a capacitor C13.

  As illustrated in FIG. 7, the electronic component 10b includes coils L11 to L14 and capacitors C11 and C13. The coil L11 includes coil electrodes 126a and 126b and a via-hole conductor 128 as shown in FIG. The coil L12 includes coil electrodes 126c and 126d and a via-hole conductor 128. The coil L13 includes coil electrodes 126e and 126f and a via hole conductor 128. The coil L14 includes coil electrodes 126g and 126h and a via-hole conductor 128.

  The coil L11 is connected between the external electrode 120c and the external electrode 120f. The coil L12 is connected between the external electrode 122a and the external electrode 120b. The coil L13 is connected between the external electrode 122e and the external electrode 120f. The coil L14 is connected between the external electrode 120c and the external electrode 120b.

  Further, the coil L11 and the coil L12 are magnetically coupled to constitute a transformer T1. The coil L13 and the coil L14 are magnetically coupled to constitute a transformer T2.

  The electronic component 10b having the above configuration is configured such that the external electrodes 120c and 120f are grounded, the external electrode 120b is an input terminal (unbalanced terminal), and the external electrodes 120a and 120e are output terminals (balanced terminals). It can be used as a balun transformer as shown in FIG. When an unbalance signal is input via the external electrode 120b, a balance signal is generated by electromagnetic induction between the coil L12 and the coil L11 and electromagnetic induction between the coil L13 and the coil L14. The balance signal is output from the external electrodes 120a and 120e.

  In the electronic component 10b, the coils L11 to L14 have the same structure. Therefore, the impedance between the external electrode 120b and the external electrode 120f and the impedance between the external electrode 120a and the external electrode 120e are 1 to 4. Therefore, the electronic component 10b constitutes a balun transformer having an impedance ratio of 1: 4.

  According to the electronic component 10b, the element can be miniaturized in the same manner as the electronic component 10a. Moreover, the electronic component 10b can incorporate the capacitors C11 and C13 without greatly changing the characteristics of the transformer T, similarly to the electronic component 10a. Moreover, the electronic component 10b can be used suitably for a balun transformer like the electronic component 10a.

(Other embodiments)
The electronic components 10a and 10b according to the embodiment of the present invention are balun transformers, but are not limited to balun transformers, and may be, for example, common mode choke coils. FIG. 8A is an external perspective view of an electronic component 10c according to another embodiment. FIG. 8B is an exploded perspective view of the electronic component 10c. FIG. 9 is an exploded perspective view of the multilayer body 212 of the electronic component 10c. Hereinafter, the stacking direction of the electronic component 10c is defined as the z-axis direction, the direction along the long side of the electronic component 10c is defined as the x-axis direction, and the direction along the short side of the electronic component 10c is defined as the y-axis direction. To do. The x axis, the y axis, and the z axis are orthogonal to each other. In the configuration of the electronic component 10c, the same reference numerals used in the electronic component 10a are given “2” for the same components as those of the electronic component 10a.

  As shown in FIG. 8, in the electronic component 10c, the external electrodes 220a and 222a and the insulator 224 constitute a capacitor C21. The external electrodes 220c and 222c and the insulator 224 constitute a capacitor C22.

  As shown in FIG. 9, the coil L21 includes a coil electrode 226a, a lead electrode 232a, and via-hole conductors 228a and 228b, and is connected between the external electrode 222a and the external electrode 220b. The coil L22 includes a coil electrode 226b, a lead electrode 232b, and a via hole conductor 228c, and is connected between the external electrode 222c and the external electrode 220d. Furthermore, the coil L21 and the coil L22 are magnetically coupled to constitute a transformer T3. With the above configuration, the electronic component 10c forms a common mode choke coil. The circuit configuration of the common mode choke coil is the same as that of the balun transformer described with reference to FIG.

  In such an electronic component 10c as well, as with the electronic components 10a and 10b, the element can be reduced in size. Moreover, the electronic component 10c can incorporate the capacitors C21 and C22 without greatly changing the characteristics of the transformer T, similarly to the electronic component 10a.

  In addition to the balun transformer and the common mode choke coil, the electronic components 10a to 10c have, for example, a directional coupler (electronic component 10d) having a circuit configuration as shown in FIG. 10 or a circuit configuration as shown in FIG. It is also possible to apply to the distributor (electronic component 10e) which has.

  Furthermore, although the electronic components 10a to 10e include a transformer in which a plurality of coils are magnetically coupled, it is not always necessary to include a transformer. In the electronic components 10a to 10e, a coil that is not magnetically coupled may be provided. In this case, the electronic components 10a to 10e incorporate a noise filter including a coil and a capacitor.

  Also in the electronic components 10b to 10e, capacitors may be provided on the input terminal side in addition to the output terminal side.

  In the electronic components 10a to 10e, a capacitor is configured by a pair of external electrodes and an insulator provided therebetween, but the configuration of the capacitor is not limited thereto. For example, a further external electrode may be inserted between a pair of capacitors.

  In the electronic components 10a to 10e, it is preferable to adjust the frequency component of the signal passing through the capacitor by adjusting the thickness of the insulator or adjusting the shape of the external electrode.

  The stacked bodies 14, 114, and 214 are configured by stacking insulating layers. However, a substrate made of an insulating material may be used instead of the stacked bodies 14, 114, and 214.

(Method for manufacturing electronic parts)
A method for manufacturing the electronic components 10a to 10e configured as described above will be described below with reference to the drawings. Below, the manufacturing method of the electronic component 10a is demonstrated as an example of the manufacturing method of the electronic components 10a-10e. Moreover, since the electronic components 10b to 10e can be manufactured by the same manufacturing method as the electronic component 10a, the description thereof is omitted. In the following description, a case where the electronic component 10a is manufactured as a single product will be described. However, in the case of mass production, a mother board having a plurality of electronic components 10a is used for efficient production. 12 to 18 are external perspective views showing the manufacturing procedure of the electronic component 10a.

First, a magnetic substrate 18 made of a ferromagnetic ferrite is prepared. Next, as shown in FIG. 12, a polyimide resin, epoxy resin, acrylic resin, cyclic olefin resin, glass resin or SiO ₂ such as benzocyclobutene resins, glass ceramics, etc. layer insulating layer 14d of the magnetic Formed on the substrate 18 by thin film forming means. As the thin film forming means, for example, a method such as photolithography or printing is employed. In photolithography, a photosensitive resin film is formed on the entire surface of the magnetic substrate 18 by, for example, a spin method, a dip method, a spray method, a transfer method, etc., and then exposed and developed to obtain a predetermined insulator layer 14d. In other photolithography, an insulating resin film is formed on the entire surface of the magnetic substrate 18 by the spin method or the like, and then a photosensitive resist film is applied to the surface of the insulating resin film, and is exposed and developed. Next, the portion of the insulating resin film exposed from the photosensitive resist film is etched to remove an unnecessary portion of the insulating resin film, and then the photosensitive resist film is peeled off. Alternatively, the insulator film obtained by the spin method or the like is drilled with a laser beam and cut. Thus, the insulator layer 14d is formed on the surface of the magnetic substrate 18.

  Next, as shown in FIG. 12, a coil electrode 26d made of Ag, Pd, Cu, Al, or an alloy thereof is formed on the insulator layer 14d by thin film forming means such as photolithography. More specifically, after a metal film is formed on the entire surface of the insulator layer 14d by plating, vapor deposition, sputtering, or the like, a photosensitive resist film is applied to the surface of the metal film, exposed, and developed. Next, the portion of the metal film exposed from the photosensitive resist film is etched to remove an unnecessary portion of the metal film, and then the photosensitive resist film is peeled off. Thus, the coil electrode 26d is formed on the insulator layer 14d.

  Next, as shown in FIG. 13, an insulator layer 14c is formed by thin film forming means. At this time, via holes 28′e to 28′h penetrating the insulator layer 14c are formed at positions where the via hole conductors 28e to 28h are to be formed. Next, as shown in FIG. 14, the coil electrode 26c and the via-hole conductors 28e to 28h are formed on the insulator layer 14c by thin film forming means such as photolithography. Thereby, the coil electrode 26c and the coil electrode 26d are connected by the via-hole conductors 28e to 28h.

  Next, as shown in FIG. 15, the insulator layer 14b is formed by a thin film forming means. Next, as shown in FIG. 16, the coil electrode 26b is formed on the insulator layer 14b by thin film forming means such as photolithography.

  Next, as shown in FIG. 17, the insulator layer 14a is formed by a thin film forming means. At this time, via holes 28′a to 28′d penetrating the insulator layer 14a are formed at positions where the via hole conductors 28a to 28d are to be formed. Next, as shown in FIG. 18, the coil electrode 26a and the via-hole conductors 28a to 28d are formed on the insulator layer 14a by thin film forming means such as photolithography. Thereby, the coil electrode 26a and the coil electrode 26b are connected by the via-hole conductors 28a to 28d.

  Next, as shown in FIG. 2, after the magnetic substrate 16 is placed on the insulator layer 14a, it is set in a vacuum hot press machine and thermocompression bonded in a vacuum. Thereby, the main body 12 in which the magnetic substrates 16 and 18 and the insulator layers 14a to 14d are integrated is obtained.

Next, the main body 12 is placed in a box having an opening in a portion where the external electrodes 22a and 22c are to be formed. Then, for example, vapor deposition, sputtering, electroless plating, or the like is performed on the main body 12 to form the external electrodes 22a and 22c made of Ag, Pd, Cu, Al, or an alloy thereof. Further, the main body 12 is taken out from the box, and a resin such as polyimide resin, epoxy resin, acrylic resin, cyclic olefin resin, benzocyclobutene resin, or glass such as SiO _{2 is} provided on the negative side surface of the main body 12 in the negative direction. Then, an insulator 24 made of glass ceramic or the like is attached.

  Next, the main body 12 is put in a box having an opening in a portion where the external electrodes 20a to 20d are to be formed. Then, for example, vapor deposition, sputtering, electroless plating, or the like is performed on the main body 12 to form the external electrodes 22a and 22c made of Ag, Pd, Cu, Al, or an alloy thereof. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.

FIG. 1A is an external perspective view of the electronic component according to the first embodiment. FIG. 1B is an exploded perspective view of the electronic component. It is a disassembled perspective view of the main body of the electronic component of FIG. FIG. 2 is an equivalent circuit diagram of the electronic component of FIG. 1. FIG. 4A is a graph showing the relationship between frequency and insertion loss. FIG. 4B is a graph showing the relationship between the frequency and the in-phase signal rejection ratio. FIG. 5A is an external perspective view of an electronic component according to the second embodiment. FIG. 5B is an exploded perspective view of the electronic component. It is a disassembled perspective view of the main body of the electronic component of FIG. FIG. 6 is an equivalent circuit diagram of the electronic component of FIG. 5. FIG. 8A is an external perspective view of an electronic component according to another embodiment. FIG. 8B is an exploded perspective view of the electronic component. It is a disassembled perspective view of the laminated body of the electronic component of FIG. It is an equivalent circuit diagram of an electronic component. It is an equivalent circuit diagram of an electronic component. It is an external appearance perspective view which shows the manufacture procedure of an electronic component. It is an external appearance perspective view which shows the manufacture procedure of an electronic component. It is an external appearance perspective view which shows the manufacture procedure of an electronic component. It is an external appearance perspective view which shows the manufacture procedure of an electronic component. It is an external appearance perspective view which shows the manufacture procedure of an electronic component. It is an external appearance perspective view which shows the manufacture procedure of an electronic component. It is an external appearance perspective view which shows the manufacture procedure of an electronic component.

Explanation of symbols

C1, C2, C11, C13, C21, C22, C41, C42 Capacitors L1, L2, L11 to L14, L21, L22, L32, L33, L41, L42 Coil T, T1, T2 Transformers 10a to 10e Electronic parts 12, 112 , 212 Main body 14, 114, 214 Laminate 14a-14d Insulator layer 16, 18 Magnetic substrate 20a-20d, 22a, 22c, 120a-120f, 122a, 122e, 220a-220d, 222a, 222c External electrodes 24, 124 , 224 Insulator 26a-26d, 126a-126h, 226a, 226b Coil electrode 28a-28h, 128, 228a-228c Via-hole conductor

Claims (6)

A substrate made of an insulating material;
An internal electrode built in the substrate;
A first external electrode connected to the internal electrode and provided on the surface of the substrate;
An insulator provided on the first external electrode;
A second external electrode forming a capacitor by sandwiching the insulator together with the first external electrode;
Providing
Electronic parts characterized by The internal electrode constitutes a coil;
The electronic component according to claim 1. A plurality of the internal electrodes are provided and constitute a transformer composed of a plurality of the magnetically coupled coils;
The electronic component according to claim 2. The transformer is a balun transformer;
The electronic component according to claim 3. The first external electrode and the second external electrode constitute an output terminal of the balun transformer;
The electronic component according to claim 4. The base is a laminated body constituted by laminating a plurality of insulator layers,
By sandwiching the base from above and below in the stacking direction, two magnetic substrates constituting the main body together with the base are
In addition,
The first external electrode and the second external electrode are provided on a surface of the main body;
The electronic component according to any one of claims 2 to 5, wherein

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