JP2010040569A - Electronic component module - Google Patents

Abstract

A temperature rise of an electronic component mounted on a substrate is suppressed.
An exothermic electronic component 22a is mounted on an upper surface of a circuit board 30, and a low exothermic electronic component 22b on the lower surface of the circuit board 30 is disposed at a position different from a position aligned with the exothermic electronic component 22a. Test points 32 for testing the electronic component 22a and the low heat-generating electronic component 22b are formed in a concentrated manner in regions RAL and RBL including a position matching the heat-generating electronic component 22a on the lower surface of the circuit board 30. Thereby, the heat generated in the heat generating electronic component 22a can be efficiently radiated from the heat sink 40 via the TP wiring 34, the test point 32, and the silicon adhesive 48, and the heat generating electronic component 22a and the low heat generating electronic component can be discharged. The temperature rise of 22b can be suppressed.
[Selection] Figure 3

Description

  The present invention relates to an electronic component module, and in particular, mounts on a substrate at least one exothermic electronic component that generates heat during operation and a plurality of low exothermic electronic components that generate heat during operation smaller than the exothermic electronic product. The present invention also relates to an electronic component module in which a heat radiating member for radiating heat from a heat-generating electronic component is attached to a substrate.

Conventionally, in this type of electronic component module, electronic components are mounted on both sides of a ceramic circuit board, and a thick film resistor covered with an insulating film is formed on the lower surface of the circuit board. There has been proposed a film member in which a base member having relatively high thermal conductivity is bonded to an adhesive (see, for example, Patent Document 1). In this electronic component module, the heat generated in the mounted electronic component is radiated by the base member on the lower surface through the circuit board and the thick film resistor, thereby improving the heat dissipation of the mounted electronic component. Yes.
JP 2008-84978 A

  However, in the above-described electronic component module, the base member is covered with the thick film resistor and the insulating film covering the thick film resistor so that almost the entire surface of the circuit board lower surface where the electronic component is not mounted is covered. The heat dissipation efficiency is lowered, and the temperature of the electronic component is increased.

  The electronic component module of the present invention is mainly intended to suppress the temperature rise of the electronic component mounted on the substrate.

  The electronic component module of the present invention employs the following means in order to achieve the main object described above.

The electronic component module of the present invention is
At least one exothermic electronic component that generates heat during operation and a plurality of low exothermic electronic components that generate heat during operation smaller than the exothermic electronic component are mounted on the substrate, and the substrate from the exothermic electronic component is mounted on the substrate. An electronic component module to which a heat radiating member for radiating heat is attached,
The heat-generating electronic component is disposed on the first surface of the substrate and at least a part of the plurality of low heat-generating electronic components is aligned with the heat-generating electronic component on the second surface of the substrate. Mounting the exothermic electronic component and the plurality of low exothermic electronic components in a position;
The substrate is concentrated in a predetermined range including a position where a plurality of test electrodes used for testing the heat-generating electronic component and the plurality of low heat-generating electronic components are aligned with the heat-generating component on the second surface of the substrate. A plurality of test electrodes and wiring connected to the plurality of test electrodes are formed,
The gist of the invention is that the heat radiating member is attached to the predetermined range so as to conduct heat with the plurality of test electrodes formed in the predetermined range.

  In the electronic module of the present invention, the heat generating electronic component is disposed on the first surface of the substrate, and at least a part of the plurality of low heat generating electronic components is aligned with the heat generating electronic component on the second surface of the substrate. The heat generating electronic component and the plurality of low heat generating electronic components are mounted at different positions, and a plurality of test electrodes used for testing the heat generating electronic component and the plurality of low heat generating electronic components are mounted on the substrate. A plurality of test electrodes and wirings connected to the plurality of test electrodes are formed so as to be concentrated on a predetermined range including a position aligned with a heat-generating part on the surface, and a heat dissipation member is formed in the predetermined range. In addition, a plurality of test electrodes are attached within a predetermined range so as to be able to conduct heat. Since the plurality of test electrodes are formed in a predetermined range including the position where the plurality of test electrodes are aligned with the heat generating component on the second surface of the substrate, the heat generated in the heat generating electronic component is connected to the plurality of test electrodes. Heat can be efficiently radiated from the heat radiating member through the wiring and the plurality of test electrodes, and the temperature rise of the heat-generating electronic component can be suppressed. In addition, since at least a part of the plurality of low heat generating electronic components is arranged at a position different from the position aligned with the heat generating electronic components on the second surface of the substrate, the low heat generating electronic components are generated by the heat generated by the heat generating electronic components. It is possible to suppress the temperature rise. As a result, the temperature rise of the electronic component mounted on the substrate can be suppressed.

  In such an electronic component module of the present invention, a part of the plurality of low heat generating electronic components is disposed at a position different from a position where the second surface of the substrate is aligned with the heat generating electronic component, and the plurality of low heat generating electronic components are disposed. The remainder of the heat generating electronic component may be disposed on the first surface of the substrate to mount the plurality of low heat generating electronic components. In this case, a plurality of heat generating electronic components are mounted on the substrate, and the plurality of heat generating electronic components are divided into three regions in which the first surfaces of the substrate are arranged without overlapping each other. Are disposed in two regions on both sides excluding the central region of the three regions, and a part of the plurality of low heat generating electronic components is aligned with the central region of the second surface of the substrate. Arranging and mounting the plurality of heat-generating electronic components and the plurality of low-heat-generating electronic components, and the predetermined range is a region aligned with the two regions on the second surface of the substrate. You can also

  In the electronic component module of the present invention, the heat-generating electronic component is equipped with a power supply IC on which a power supply circuit for supplying power is mounted or a drive circuit for driving a solenoid valve of a hydraulic circuit of an automatic transmission used in an automobile. The low-heat-generating electronic component can be a chip resistor.

  Next, the best mode for carrying out the present invention will be described using examples.

  FIG. 1 is a configuration diagram showing an outline of the configuration of an electronic component module 20 as an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view showing an outline of a cross section taken along line AA of FIG. 3 is an explanatory view showing the outline of the configuration of the main part of the electronic component module 20, and FIG. 4 is an external view showing the outline of the appearance when the circuit board 30 is viewed from the lower surface side. The electronic component module 20 is configured as a part of an electronic control unit for a transmission used for controlling an automatic transmission mounted on an automobile, and includes a power supply IC and an automatic transmission mounted with a power supply circuit for supplying electric power. A driver IC equipped with a drive circuit for driving a solenoid valve of a hydraulic circuit of FIG. 1, an LSI configured as a CPU (not shown), etc., generate a plurality of heat-generating electronic components 22a that generate a relatively large amount of heat during operation, and chip resistors. A circuit board 30 on which a plurality of low heat-generating electronic components 22b that generate less heat than the electronic component 22a is mounted, a heat sink 40 attached to the lower surface of the circuit board 30, and a lid 44 that covers the upper side of the circuit board 30 With. The exothermic electronic component 22a and the low exothermic electronic component 22b are electrically connected to a lead terminal 46 formed of a material having a relatively high electrical conductivity (for example, copper) as necessary, Electric power is supplied from the outside via the lead terminals 46, and signals are exchanged with an external electronic component module (not shown).

  In the electronic component module 20, when the upper surface of the circuit board 30 is divided into three regions RA, RB, and RC arranged without overlapping each other on the upper surface of the circuit board 20, both sides except for the central region RB are provided. The heat generating electronic components 22a are arranged and mounted in the regions RA and RC, and the low heat generating electronic components 22b are arranged and mounted in the other regions. On the lower surface of the circuit board 20, the low heat-generating electronic component 22 b is disposed and mounted only in the region RBL aligned with the central region RB.

  The circuit board 30 is configured as a multilayer ceramic substrate having a high thermal conductivity (for example, a thermal conductivity of 18 W / mK, etc.). As shown in FIG. 4, the heat generating electronic component 22a and the low heat generating electronic component are configured. A plurality of test electrodes (hereinafter referred to as test points) 32 used for the test 22b are concentrated in a region RAL that matches the region RA and a region RBL that matches the region RB, including a position that matches the heat-generating electronic component 22a on the lower surface. A test point wiring (hereinafter referred to as a TP wiring) 34 for electrically connecting each test point 32 and the heat-generating electronic component 22a to be tested or the low heat-generating electronic component 22b, or the heat generated therein. The connection wiring 36 electrically connected to the conductive electronic component 22a and the low heat generating electronic component 22b is formed. The test point 32 is used for conducting a continuity test of an electronic component mounted on the circuit board 30 before the heat sink 40 is attached to the circuit board 30. After the heat sink 40 is attached, the electronic component module is used. 20 is configured as an electrode not used for the operation. The test points 32, the TP wirings 34, and the connection wirings 36 are formed of a material having low electrical resistance and high thermal conductivity (for example, tungsten, copper, etc.). Since the TP wiring 34 passes through the inside of the circuit board 30, the TP wiring 34 can receive heat generated by the connection wiring 36 in the circuit board 30.

  The heat sink 40 is formed of a material having high thermal conductivity (for example, copper or aluminum), and has a high insulating performance and good thermal conductivity (for example, manufactured by Toray Dow Corning Silicone Co., Ltd., Product name “Toray SE-4400”) 48 is attached to the regions RAL and RBL on the lower surface of the circuit board 30 so as to be able to conduct heat with the test point 32 and the circuit board 30. Heat can be dissipated.

  In the electronic component module 20 of the embodiment thus configured, heat generated in the heat-generating electronic component 22 a is radiated from the heat sink 40 through the TP wiring 34, the test point 32, and the silicon adhesive 48. Since the test points 32 are concentrated on the regions RAL and RBL on the lower surface of the circuit board 30, the heat generated in the heat generating electronic component 22 a can be efficiently radiated from the heat sink 40. Thereby, the temperature rise of the heat-emitting electronic component 22a mounted and the low heat-generating electronic component 22b can be suppressed.

  Further, since the low heat generating electronic component 22b on the lower surface of the circuit board 30 is disposed at a position different from the position aligned with the heat generating electronic component 22a, the low heat generating electronic component 22b is disposed at a position aligned with the heat generating electronic component 22a. The distance between the low heat-generating electronic component 22b and the heat-generating electronic component 22a on the lower surface can be increased as compared with that to be performed. Thereby, it is possible to suppress the heat from the heat-generating electronic component 22a from propagating to the low heat-generating electronic component 22b through the circuit board 30 and increasing the temperature of the low heat-generating electronic component 22b.

  Furthermore, since the heat-generating electronic components 22a are arranged on both sides of the low heat-generating electronic component 22b, it is possible to suppress a local temperature rise at the position where the heat-generating electronic components 22a are arranged. Since the low heat generating electronic components 22b are mounted on both sides of the circuit board 30, the circuit board 30 can be downsized as compared with the case where all the low heat generating electronic components 22b are mounted on one side of the circuit board 30. The electronic component module 20 can be downsized.

  According to the electronic component module 20 of the embodiment described above, the test points 32 are formed in a concentrated manner in the regions RAL and RBL including the position matching the heat generating electronic component 22a on the lower surface of the circuit board 30. Heat generated in the heat-generating electronic component 22a can be dissipated from the heat sink 40 via the TP wiring 34, the test point 32, and the silicon adhesive 48, and the temperature rise of the heat-generating electronic component 22a and the low heat-generating electronic component 22b is suppressed. can do. Further, since the low heat generating electronic component 22b on the lower surface of the circuit board 30 is disposed at a position different from the position aligned with the heat generating electronic component 22a, it is possible to suppress the temperature increase of the low heat generating electronic component 22b. Furthermore, since the heat-generating electronic components 22a are arranged on both sides of the low heat-generating electronic component 22b, it is possible to prevent the circuit board 30 from locally rising in temperature.

  In the electronic component module 20 of the embodiment, the test points 32 are formed to be concentrated in the regions RAL and RBL. However, the exothermic electronic component is positioned at a position narrower than the regions RAL and RBL and aligned with the exothermic electronic component 22a. It is good also as what is concentrated in the area | region of about 22a wide. Even in this case, the heat generated by the heat-generating electronic component 22a can be efficiently radiated by forming the heat sink 40 over the entire regions RAL and RBL.

  In the electronic component module 20 of the embodiment, the exothermic electronic component 22a is formed on both sides except the central region RB when the upper surface of the circuit board 30 is divided into three regions RA, RB, RC arranged without overlapping each other. Although it has been arranged in the areas RA and RC, it may be arranged in one area when the upper surface of the circuit board 30 is divided into two areas.

  In the electronic component module 20 of the embodiment, the low heat generating electronic components 22 b are mounted on both surfaces of the circuit board 30, but may be mounted only on the lower surface of the circuit board 30.

  In the electronic component module 20 of the embodiment, the heat sink 40 is formed as an integral member, but the first member attached to the region RAL on the lower surface of the circuit board 30 and the second member attached to the region RBL. It is good also as what is comprised from two members.

  In the electronic component module 20 of the embodiment, the upper side of the circuit board 30 is covered with the lid 44. However, the circuit board 30 may be exposed without being covered with the lid 44, and the circuit board 30 is sealed with resin. It is good also as what to do.

  In the embodiment, the present invention is applied to an electronic component module used as a part of an electronic control unit for a transmission, but there are various types such as a part used as a part of an electronic control unit for an engine for performing various controls of the engine. It may be applied to anything.

  The best mode for carrying out the present invention has been described with reference to the embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made without departing from the gist of the present invention. Of course, it can be implemented in the form.

  The present invention can be used in the manufacturing industry of electronic component modules.

It is a block diagram which shows the outline of a structure of the electronic component module 20 as one Example of this invention. It is a cross-sectional schematic diagram which shows the outline of the cross section in the AA line of FIG. 2 is an explanatory diagram showing an outline of a configuration of a main part of an electronic component module 20. FIG. It is an external view which shows the outline of an external appearance when the circuit board 30 is seen from the lower surface side.

Explanation of symbols

  20 electronic component module, 22a exothermic electronic component, 22b low exothermic electronic component, 30 circuit board, 32 test electrode (test point), 34 test wiring (TP wiring), 36 connection wiring, 40 heat sink, 44 lid, 46 Lead terminal, 48 Silicon adhesive, RA, RAL, RB, RBL, RC, RCL area.

Claims (5)

At least one exothermic electronic component that generates heat during operation and a plurality of low exothermic electronic components that generate heat during operation smaller than the exothermic electronic component are mounted on the substrate, and the substrate from the exothermic electronic component is mounted on the substrate. An electronic component module to which a heat radiating member for radiating heat is attached,
The heat-generating electronic component is disposed on the first surface of the substrate and at least a part of the plurality of low heat-generating electronic components is aligned with the heat-generating electronic component on the second surface of the substrate. Mounting the exothermic electronic component and the plurality of low exothermic electronic components in a position;
The substrate is concentrated in a predetermined range including a position where a plurality of test electrodes used for testing the heat-generating electronic component and the plurality of low heat-generating electronic components are aligned with the heat-generating component on the second surface of the substrate. A plurality of test electrodes and wiring connected to the plurality of test electrodes are formed,
The heat dissipation member is an electronic component module that is attached to the predetermined range so as to be capable of conducting heat with the plurality of test electrodes formed in the predetermined range.   A part of the plurality of low heat generation electronic components is disposed at a position different from a position where the second surface of the substrate is aligned with the heat generation electronic component, and the remaining portions of the plurality of low heat generation electronic components are disposed on the substrate. The electronic component module according to claim 1, wherein the plurality of low heat-generating electronic components are mounted on the first surface of the electronic component module. The electronic component module according to claim 2,
A plurality of exothermic electronic components are mounted on the substrate,
When the plurality of heat-generating electronic components are divided into three regions in which the first surface of the substrate is arranged without overlapping each other, the three heat-generating electronic components are arranged in two regions on both sides except the central region. A part of the plurality of low heat generation electronic components is disposed in a region aligned with the central region of the second surface of the substrate, and the plurality of heat generation electronic components and the plurality of low heat generation electronic components are arranged. Implement,
The said predetermined range is an area | region matched with the area | region of the said 2 both sides of the 2nd surface of the said board | substrate.   The heat-generating electronic component is a power supply IC on which a power supply circuit for supplying power is mounted or a driver IC on which a drive circuit for driving a solenoid valve of a hydraulic circuit of an automatic transmission used in an automobile is mounted. 3. The electronic component module according to claim 1.   The electronic component module according to claim 1, wherein the low heat generating electronic component is a chip resistor.

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