JP2010040320A - 電線用絶縁塗料及びそれを用いた絶縁電線 - Google Patents
電線用絶縁塗料及びそれを用いた絶縁電線 Download PDFInfo
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- JP2010040320A JP2010040320A JP2008201752A JP2008201752A JP2010040320A JP 2010040320 A JP2010040320 A JP 2010040320A JP 2008201752 A JP2008201752 A JP 2008201752A JP 2008201752 A JP2008201752 A JP 2008201752A JP 2010040320 A JP2010040320 A JP 2010040320A
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- 238000000576 coating method Methods 0.000 title abstract description 27
- 239000011248 coating agent Substances 0.000 title abstract description 26
- 238000009413 insulation Methods 0.000 title abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 23
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 23
- 229920001721 polyimide Polymers 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000009719 polyimide resin Substances 0.000 claims abstract description 10
- 239000003973 paint Substances 0.000 claims description 67
- 239000004020 conductor Substances 0.000 claims description 32
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 5
- 230000000052 comparative effect Effects 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 210000003298 dental enamel Anatomy 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920003055 poly(ester-imide) Polymers 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- OWFXTUSFOMXVRD-UHFFFAOYSA-N 3-(disilanylsilyl)propan-1-amine Chemical compound NCCC[SiH2][SiH2][SiH3] OWFXTUSFOMXVRD-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- -1 phenol compound Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
- Paints Or Removers (AREA)
Abstract
【解決手段】ポリイミド樹脂またはポリアミドイミド樹脂からなる樹脂塗料中に、フェニルトリアルコキシシランと純水とが分散されて成る電線用絶縁塗料であって、前記フェニルトリアルコキシシランが前記樹脂塗料の樹脂分100重量部に対して3〜100重量部含有されているものである。
【選択図】なし
Description
樹脂塗料としては、ポリイミド樹脂、ポリアミドイミド樹脂、ポリエステルイミド樹脂など工業的に用いられている樹脂塗料ならよく、例えばポリアミドイミドエナメル線用樹脂塗料、ポリイミドエナメル線用樹脂塗料等がある。
絶縁電線は、樹脂塗料中へ、フェニルトリアルコキシシラン、純水を分散させて成り、フェニルトリアルコキシシランが樹脂塗料の樹脂分100重量部に対して3〜100重量部含有されている電線用絶縁塗料を、導線上に直接又は他の絶縁物層を介して塗布焼付して成るものである。
フェニルトリエトキシシラン5.0g、純水1.1gを、固形分濃度20mass%のポリアミドイミド塗料100gに混合撹拌し電線用絶縁塗料を得た。丸形状の銅導体の周りに、電線用絶縁塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
フェニルトリエトキシシラン5.0g、純水1.1gを、固形分濃度20mass%のポリイミド塗料100gに混合撹拌し電線用絶縁塗料を得た。丸形状の銅導体の周りに、電線用絶縁塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
フェニルトリメトキシシラン5.0g、純水1.1gを、固形分濃度20mass%のポリアミドイミド塗料100gに混合撹拌し電線用絶縁塗料を得た。丸形状の銅導体の周りに、電線用絶縁塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
フェニルトリメトキシシラン5.0g、純水1.1gを、固形分濃度20mass%のポリイミド塗料100gに混合撹拌し電線用絶縁塗料を得た。丸形状の銅導体の周りに、電線用絶縁塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
フェニルトリエトキシシラン0.6g、純水0.02gを、固形分濃度20mass%のポリアミドイミド塗料100gに混合撹拌し電線用絶縁塗料を得た。丸形状の銅導体の周りに、電線用絶縁塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
フェニルトリエトキシシラン20g、純水0.02gを、固形分濃度20mass%のポリアミドイミド塗料100gに混合撹拌し電線用絶縁塗料を得た。丸形状の銅導体の周りに、電線用絶縁塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
丸形状の銅導体の周りに、ポリアミドイミド塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
丸形状の銅導体の周りに、ポリイミド塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
フェニルトリエトキシシラン0.1g、純水0.02gを、固形分濃度20mass%のポリアミドイミド塗料100gに混合撹拌し電線用絶縁塗料を得た。丸形状の銅導体の周りに、電線用絶縁塗料を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設け、絶縁電線を作製した。
フェニルトリエトキシシラン25.0g、純水6.7gを、固形分濃度20mass%のポリアミドイミド塗料100gに混合撹拌したがゲル化が発生し、好適なエナメル線用塗料を得ることはできなかった。
フェニルトリエトキシシラン30.0g、純水6.7gを、固形分濃度20mass%のポリアミドイミド塗料100gに混合撹拌したがゲル化が発生し、好適なエナメル線用塗料を得ることはできなかった。
Claims (4)
- ポリイミド樹脂またはポリアミドイミド樹脂からなる樹脂塗料中に、フェニルトリアルコキシシランと純水とが分散されて成る電線用絶縁塗料であって、前記フェニルトリアルコキシシランが前記樹脂塗料の樹脂分100重量部に対して3〜100重量部含有されていることを特徴とする電線用絶縁塗料。
- 前記フェニルトリアルコキシシランは、フェニルトリエトキシシラン、もしくはフェニルトリメトキシシランからなる請求項1に記載の電線用絶縁塗料。
- 請求項1又は2に記載の電線用絶縁塗料を、導体上に直接又は他の絶縁層を介して塗布、焼付して形成された絶縁皮膜を有することを特徴とする絶縁電線。
- 前記絶縁皮膜は、前記導体上に形成されたシランカップリング剤からなる皮膜上に形成されている請求項3に記載の絶縁電線。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008201752A JP5243880B2 (ja) | 2008-08-05 | 2008-08-05 | 絶縁電線 |
| US12/534,932 US8258403B2 (en) | 2008-08-05 | 2009-08-04 | Insulation coating for electric wires and electric insulated wire using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008201752A JP5243880B2 (ja) | 2008-08-05 | 2008-08-05 | 絶縁電線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010040320A true JP2010040320A (ja) | 2010-02-18 |
| JP5243880B2 JP5243880B2 (ja) | 2013-07-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008201752A Active JP5243880B2 (ja) | 2008-08-05 | 2008-08-05 | 絶縁電線 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8258403B2 (ja) |
| JP (1) | JP5243880B2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011132393A (ja) * | 2009-12-25 | 2011-07-07 | Hitachi Cable Ltd | 絶縁被膜塗料および絶縁電線 |
| CN111584147A (zh) * | 2020-04-22 | 2020-08-25 | 国网山东省电力公司电力科学研究院 | 抑制直流输电线路电晕放电和积污方法及电介质覆膜极导线 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102782773B (zh) * | 2010-10-01 | 2015-12-02 | 古河电气工业株式会社 | 绝缘电线 |
| JP2012144700A (ja) * | 2010-12-25 | 2012-08-02 | Nitto Denko Corp | 平角電線用被覆材、平角電線用被覆材で被覆された平角電線、およびそれを用いた電気機器 |
| JP2013131423A (ja) * | 2011-12-22 | 2013-07-04 | Hitachi Cable Ltd | 絶縁電線及びコイル |
| US10199138B2 (en) | 2014-02-05 | 2019-02-05 | Essex Group, Inc. | Insulated winding wire |
| US9324476B2 (en) * | 2014-02-05 | 2016-04-26 | Essex Group, Inc. | Insulated winding wire |
| WO2015130681A1 (en) | 2014-02-25 | 2015-09-03 | Essex Group, Inc. | Insulated winding wire |
| AU2015300890A1 (en) | 2014-08-07 | 2017-03-16 | Henkel Ag & Co. Kgaa | High temperature insulated aluminum conductor |
| CN108039803A (zh) * | 2017-12-20 | 2018-05-15 | 苏州巨峰电气绝缘系统股份有限公司 | 一种水性环保型防晕带及其制备方法 |
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| JP2011132393A (ja) * | 2009-12-25 | 2011-07-07 | Hitachi Cable Ltd | 絶縁被膜塗料および絶縁電線 |
| CN111584147A (zh) * | 2020-04-22 | 2020-08-25 | 国网山东省电力公司电力科学研究院 | 抑制直流输电线路电晕放电和积污方法及电介质覆膜极导线 |
| CN111584147B (zh) * | 2020-04-22 | 2022-03-11 | 国网山东省电力公司电力科学研究院 | 抑制直流输电线路电晕放电和积污的方法及电介质覆膜极导线 |
Also Published As
| Publication number | Publication date |
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| US20100032184A1 (en) | 2010-02-11 |
| JP5243880B2 (ja) | 2013-07-24 |
| US8258403B2 (en) | 2012-09-04 |
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