JP2009301246A - Hologram-integrated ic tag label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily confirm that a proper IC tag label is affixed to a counterfeit label even when the IC tag label is attached to a metal, There is provided a hologram-integrated IC tag label that can reduce the inability to communicate due to the influence of the above.
A hologram sheet having a transparent protective layer as an upper layer, an inlet provided with an IC chip and an antenna coil connected to a base film, a dielectric sheet made of a plastic sheet, and visible light Are sequentially laminated, and are bonded between the hologram sheet, the inlet, the dielectric sheet, and the metal layer, and a pressure-sensitive adhesive is provided below the metal layer. A layer and a release sheet are sequentially laminated.
[Selection] Figure 1

Description

  The present invention relates to a hologram-integrated IC tag label in which an inlet having an IC chip and an antenna connected thereto is laminated on a plastic film.

  An IC tag label having an inlet in which an IC chip and an antenna are connected on a plastic film is attached to an article for information management, and then desired information is written and stored via a reader / writer, and if necessary Since the stored information can be repeatedly read, it can be used in a wide range of fields such as transportation, distribution, sales management, factory process management, merchandise delivery, and baggage handling.

  In addition, as the usage of IC tag labels expands, IC tag labels to be affixed to articles placed outdoors and IC tag labels to be affixed to articles that are highly likely to get wet during transportation or the like are also required.

Prior art of these IC tag labels and IC tag label manufacturing methods include Patent Document 1 and Patent Document 2.
In addition, as IC tag label technology is released and the number of IC tag label manufacturers increases, the risk of fraudulent labels being manufactured and fraudulent acts being carried out by replacing regular IC tag labels with counterfeit labels is increasing. Therefore, it is also known to use a hologram for an IC tag label as a countermeasure against counterfeit labels. (See Patent Documents 3 and 4)

Further, when the IC tag label is attached to a metal and used, there is a problem that communication becomes impossible due to the influence of the metal.
For this reason, it may be possible to eliminate the inability to communicate by laminating a special material layer in the seal, but the material that reduces the influence of metal is usually expensive, so it is also used for cost reasons. There is a problem that it is difficult to do.

JP 2007-26302 A JP 2006-301900 A JP 2006-18475 A JP 2006-139235 A

  Therefore, in the present invention, even when a regular IC tag label is replaced with a counterfeit label, it can be easily confirmed that the IC tag label has been replaced illegally. Further, when the IC tag label is attached to a metal and used. However, the present invention provides a hologram integrated IC tag label that can reduce the inability to communicate due to the influence of metal.

  The hologram integrated IC tag label of the present invention includes a hologram sheet having a transparent protective layer as an upper layer, an inlet provided with an IC chip and an antenna coil connected to a base film, and a dielectric made of a plastic sheet. A body sheet and a metal layer that reflects visible light are sequentially laminated, and are bonded between the hologram sheet, the inlet, the dielectric sheet, and the metal layer. A pressure-sensitive adhesive layer and a release sheet are sequentially laminated on the lower side.

  In the hologram integrated IC tag label of the present invention, the metal layer reflects radio waves having a frequency of 100 kHz to 10 GHz.

  Furthermore, the hologram integrated IC tag label of the present invention is characterized in that the thickness of the derivative is 0.2 mm or more and 10 mm or less.

  Since the hologram-integrated IC tag label of the present invention has a hologram, even when a regular IC tag label is affixed to a counterfeit label, it can be confirmed that it is easily and illegally affixed by visual inspection. Since the dielectric and the metal layer are laminated in the IC tag label, even when the IC tag label is attached to the metal, there is an effect that communication failure can be reduced.

Hereinafter, a hologram integrated IC tag label according to an embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing a state of a hologram-integrated IC tag label 1 according to an embodiment, in which a plurality of IC tag labels are continuously provided on the upper side of a strip-shaped peeling sheet 2 at equal intervals. Has been.
FIG. 2 is a cross-sectional view of the hologram integrated IC tag 1 according to the embodiment.

  The hologram integrated IC tag label 1 includes a hologram sheet 5 having a plastic film 3 as a transparent protective layer bonded to the upper side with an adhesive layer 4, and an IC chip on the base film 7 below the hologram sheet 5. 11 and the inlet 15 to which the antenna 12 is connected are overlapped, and the inlet 15 is bonded by the first hot melt adhesive layer 6 provided on the back surface of the hologram sheet 5. The laminated dielectric sheet 9 is bonded by the second hot melt adhesive layer 8, and the metal layer 13 made of a metallic sheet is stacked on the lower side of the dielectric sheet 9 and bonded by the adhesive layer 10. The release sheet 2 is stuck in a peelable state by an adhesive layer 14 provided on the back surface of the metal layer 13.

In FIG. 2, the first hot melt adhesive layer 6 is shown in a state where the base film 7 and the antenna 12 are separated from each other. However, the adhesive of the first hot melt adhesive layer 6 is Since it is softened and then cured to be in an adhesive state, the transparent plastic film 5 is bonded and integrated with the base film 7 and the antenna 12 by the first hot melt adhesive layer 6.
That is, between the transparent plastic film 5 and the base film 7, the IC chip 11 and the antenna 12 are protected in a sealed state by the first hot melt adhesive layer 6.

  Since the peeling sheet 2 is detachably adhered by the adhesive layer 14 formed on the back surface of the metal layer 13 made of a metallic sheet, the peeling sheet 2 of the hologram integrated IC tag label 1 is peeled off. After that, the hologram integrated IC tag label 1 can be stuck anywhere by pressing the adhesive layer 14 against a desired article to be stuck.

As shown in FIG. 3, the inlet 15 to which the IC chip 11 and the antenna 12 are connected forms the antenna coil 12 on the base film 7, and the IC chip 11 is attached to both ends 12 a and 12 b of the antenna coil 12. ing.
The end of the antenna coil 12 located outside is connected to the conducting member 14 provided on the back surface of the base film 7, and the other end of the conducting member 14 is connected to the coil connected to the IC chip 11. Has been.

The adhesive used for the first hot melt adhesive layer 6 and the second hot melt adhesive layer 8 is, for example, polyurethane or an ethylene vinyl acetate copolymer.
When the first hot melt adhesive layer 6 and the second hot melt adhesive layer 8 are heated, the adhesive softens and then hardens to become an adhesive state. In the case where the hologram sheet 5 is bonded to the inlet 15 with the first hot melt adhesive layer 6, the antenna coil 12 and the IC chip 11 are waterproofed. .

The metal layer 13 made of a metallic sheet is a metal layer that reflects radio waves having a frequency of 100 kHz to 10 GHz.
Further, the dielectric sheet 9 has a thickness of 0.2 mm to 10 mm.

FIG. 4 shows a cross-sectional view when the hologram-integrated IC tag label 1 is attached to a desired article 16.
When the hologram-integrated IC tag label 1 is affixed to a desired article 16, as shown in FIG. 4, the release sheet 2 that is releasably affixed to the adhesive layer 14 provided on the back surface of the metal layer 13. Then, the pressure-sensitive adhesive layer 14 is pressed against a predetermined portion of the article 16 and pasted.

FIG. 5 shows a perspective view of a state in which the hologram integrated IC tag label 1 from which the peeling sheet 2 has been peeled is attached to the article 16.
As shown in FIG. 5, the hologram integrated IC tag label 1 attached to the article 16 can visually observe the hologram image 17 drawn on the hologram sheet 5 when viewed from the outside.
FIG. 5 shows an image of a snowman as an example of the hologram image 17.

  As described above, the hologram-integrated IC tag label 1 according to the embodiment of the present invention is a hologram-integrated IC tag label having the same hologram image as the real product as a forged label even when the regular IC tag label is replaced with a forged label. Since it is difficult to create a forgery, it is possible to prevent counterfeiting, and it is possible to confirm that it has been easily and illegally pasted from the outside.

  Further, the metal layer 13 provided on the hologram-integrated IC tag label 1 can reduce the possibility of communication failure due to the influence of metal even when the article to which the hologram-integrated IC tag label 1 is attached is made of metal.

It is a hologram integrated IC tag label which concerns on embodiment of this invention, Comprising: It is a top view which shows the state by which the several IC tag label was continuously provided by the upper side of the strip | belt-shaped peeling sheet. It is sectional drawing of the hologram integrated IC tag label which concerns on embodiment of this invention. It is a figure which shows the structure of the inlet of the hologram integrated IC tag label which concerns on embodiment of this invention. It is sectional drawing at the time of making a hologram integrated IC tag label affix on a desired article. The hologram integrated IC tag label is a perspective view of a state in which the hologram integrated IC tag label from which the release sheet has been peeled is attached to an article.

Explanation of symbols

1 IC tag label with integrated hologram
2 Peeling sheet
3 Plastic film
4,10,14 Adhesive layer
5 Hologram sheet
6 First hot melt adhesive layer
7 Base film
8 Second hot melt adhesive layer
9 Dielectric sheet
11 IC chip
12 Antenna coil
12a, 12b Both ends of antenna coil
13 Metal layer
14 Conducting member
15 Inlet
16 articles
17 Hologram image

Claims (3)

A hologram sheet having a transparent protective layer as an upper layer;
An inlet provided on the base film in a state where the IC chip and the antenna coil are connected;
A dielectric sheet made of a plastic sheet;
And a metal layer that reflects visible light are sequentially laminated,
Bonded between each layer of the hologram sheet, the inlet, the dielectric sheet, and the metal layer,
A hologram-integrated IC tag label, wherein a pressure-sensitive adhesive layer and a release sheet are sequentially laminated below the metal layer.   The hologram integrated IC tag label according to claim 1, wherein the metal layer reflects radio waves having a frequency of 100 KHz to 10 GHz. The hologram integrated IC tag label according to claim 1, wherein the dielectric has a thickness of 0.2 mm or more and 10 mm or less.

Images