JP2009239240A - Printed circuit board and mounting structure of surface-mounted device - Google Patents

Abstract

A printed circuit board in which a connection area between bumps of a land and a semiconductor device is less likely to be lowered even if misalignment occurs, and a mounting structure for a surface mount device having the printed circuit board is provided. I will provide a.
An insulating substrate, a substrate-side land 13 disposed on the surface of the insulating substrate, and a resist 12 disposed on the surface of the insulating substrate and having an opening 21 formed therein, the substrate-side land 13 being an opening. 21 is exposed. Both ends of the substrate-side land 13 are covered with the resist 12 in one direction of the surface of the insulating substrate, and a gap is formed between the substrate-side land 13 and the resist 12 in the other direction of the surface of the insulating substrate.
[Selection] Figure 2A

Description

  The present invention relates to a printed circuit board on which a surface mount device such as a BGA is mounted and a mounting structure of the surface mount device.

  In recent years, along with miniaturization and high functionality of electronic devices, surface mount IC packages having solder electrodes on the bottom surface, for example, BGA (Ball Grid Array) type and LGA (Land Grid Array) type CSP (Chip Size). Many electronic parts are mounted by Package).

  FIG. 13 is a plan view showing a configuration of a connecting portion of a printed circuit board 101a on which a conventional BGA package semiconductor device is mounted. The printed circuit board 101a has an insulating substrate (not shown), and a rectangular land 103 connected to a semiconductor device (not shown) via a bump is arranged on the insulating substrate. A resist 102a having an opening 104a larger than the land 103 is disposed on the insulating substrate so as to expose the land 103. That is, a gap 105a is formed between the land 103 and the resist 102a.

  In the configuration shown in FIG. 13, since the bump enters the gap 105 a, the bonding property between the bump and the land 103 is relatively strong. However, if the positional relationship between the resist 102a and the land 103 is shifted, the land 103 is covered with the resist 102a, and the connection area with the bump is reduced. For this reason, the bonding between the semiconductor device and the insulating substrate becomes weak, and disconnection is likely to occur during a drop impact, for example.

  FIG. 14 is a plan view showing a configuration of a connection portion of a printed circuit board 101b on which a BGA package semiconductor device in another conventional configuration is mounted. The printed circuit board 101b has an insulating substrate (not shown). On the insulating substrate, a land 103 and a resist 102b that covers an end portion of the land 103 and has an opening 104b smaller than the land 103 are arranged. Has been. The land 103 has a central region exposed by the opening 104b, and a region outside the central region is covered with the resist 102b.

  In the configuration shown in FIG. 14, even if the misalignment between the resist 102 b and the land 103 occurs, the land in the region covered with the resist 102 b is exposed by the misalignment as much as the region covered with the resist 102. Thus, the connection area between the land 103 and the bump does not decrease. However, in this configuration, since the bumps are surface-bonded to the lands 103, for example, peeling is likely to occur between the bumps and the lands 103 during a drop impact.

  A configuration of a connection portion of a printed circuit board that solves these problems has been proposed (see, for example, Patent Document 1). FIG. 15 is a plan view showing a configuration of a connection portion of a printed circuit board 101c on which a BGA package semiconductor device for solving this problem is mounted. The printed circuit board 101c has an insulating substrate (not shown). On the insulating substrate, a land 103 and a resist (dot-hatched region in FIG. 15) 102c provided with an elliptical opening 104c are arranged. ing. The land 103 is covered with a resist 102c at four corners. A gap 105c is formed between the side of the land and the resist 102c. That is, the side portion of the land has the configuration shown in FIG. 13, and the four corners of the land have the configuration shown in FIG.

With the configuration illustrated in FIG. 15, in the side portion of the land, the bump enters the gap 105 c, so that the bondability between the bump and the land 103 can be improved. In addition, since the land 103 is covered with the resist 102c at the four corners of the land, the bonding strength between the land 103 and the insulating substrate can be increased. In addition, even if the misalignment between the resist 102c and the land 103 occurs, the reduction of the connection area between the land bumps can be moderated.
JP 2006-24858 A

  However, even in the above-described configuration, the connection area between the land 103 and the bump is reduced due to the positional deviation between the resist 102c and the land 103. Further, when the positional deviation occurs, the corner portion of the land 103 is easily exposed from the resist 102c, and the land 103 is easily peeled off from the insulating substrate.

  The present invention has been made in order to solve the above-described problem. Even if a positional shift occurs, the connection area between the bumps of the lands is hardly reduced, and the electrical connection between the lands and the semiconductor device is stable. It is an object of the present invention to provide a mounting structure for a surface mount device having a substrate and its printed circuit board.

  The printed circuit board according to the present invention includes an insulating substrate, a substrate-side land disposed on the surface of the insulating substrate, and a resist disposed on the surface of the insulating substrate and having an opening formed therein. It is exposed from the opening. In order to solve the above problem, the substrate-side land is covered with the resist at one end in one direction of the surface of the insulating substrate, and between the resist in the other direction of the surface of the insulating substrate. It is characterized by a gap.

  The semiconductor device of the present invention includes a semiconductor chip, a semiconductor device-side land disposed on the surface of the semiconductor chip, and a resist disposed on the surface of the semiconductor chip and having an opening formed therein. A land is exposed from the opening. In order to solve the above-mentioned problem, the semiconductor device-side land has both ends covered with the resist in one direction of the semiconductor surface, and a gap between the semiconductor device-side land and the resist in the other direction of the semiconductor surface. Is generated.

  A mounting structure for a surface-mounted device according to the present invention includes the printed board described above, the semiconductor device described above, and solder balls connecting the substrate-side land and the semiconductor device-side land.

  In the printed circuit board according to the present invention, the end of the land is covered with the resist in one direction parallel to the surface of the insulating substrate, and between the land and the resist in the other direction parallel to the surface of the insulating substrate. In this configuration, there is a gap. With this configuration, even if positional deviation occurs, the connection area between the land bumps is unlikely to decrease, and the electrical connection between the land and the semiconductor device is stable, and the mounting structure of the surface mount device having the printed circuit board The body can be provided.

  The mounting structure of the printed circuit board, the semiconductor device, and the surface mounting device of the present invention can take various modes based on the above configuration. That is, in the printed circuit board, the board-side land has a length in one direction longer than the length in the other direction, and the opening has a length in the one direction longer than the length in the other direction. The one direction and the other direction can be made short and short. With this configuration, when one direction and the other direction are orthogonal to each other, if the same board-side land placement space is used, the amount of margin for misalignment can be increased.

  The substrate-side land may have a rectangular shape, the opening may have a rectangular shape, and both end portions in the longitudinal direction of the substrate-side land may be covered with the resist. With this configuration, even if a positional deviation occurs, the connection area between the land bumps does not change. For this reason, the stability of the electrical connection between the printed circuit board and the semiconductor device can be ensured.

  The substrate-side land may have an elliptical shape, the opening may have a rectangular shape, and both ends in the major axis direction of the substrate-side land may be covered with the resist. The substrate-side land may be rectangular, the opening may be elliptical, and both ends in the longitudinal direction of the substrate-side land may be covered with the resist. In these configurations as well, even if a positional deviation occurs, it is possible to suppress a decrease in the connection area between the board-side land and the solder ball. For this reason, the stability of the electrical connection between the printed circuit board and the semiconductor device can be ensured.

  In the semiconductor device, the semiconductor device-side land has a length in one direction longer than the length in the other direction, and the opening has a length in the one direction larger than the length in the other direction. The one direction and the other direction can be orthogonal to each other. With this configuration, by allowing one direction and the other direction to be orthogonal to each other, if the same semiconductor device-side land placement space is used, it is possible to increase the amount of margin for misalignment.

  The semiconductor device side land may be rectangular, the opening may be rectangular, and both end portions in the longitudinal direction of the semiconductor device side land may be covered with the resist. With this configuration, even if a positional deviation occurs, the connection area between the land bumps does not change. For this reason, the stability of the electrical connection between the printed circuit board and the semiconductor device can be ensured.

  The semiconductor device-side land may be elliptical, the opening may be rectangular, and both ends in the major axis direction of the semiconductor device-side land may be covered with the resist. The semiconductor device-side land may have a rectangular shape, the opening may have an elliptical shape, and both ends in the longitudinal direction of the semiconductor device-side land may be covered with the resist. In these configurations as well, even if a positional deviation occurs, it is possible to suppress the amount of reduction in the connection area between the semiconductor device-side lands and the solder balls. For this reason, the stability of the electrical connection between the printed circuit board and the semiconductor device can be ensured.

  Hereinafter, embodiments of the present invention will be described.

(Embodiment 1)
FIG. 1 is a plan view showing a configuration of a mounting structure 1 for a surface-mounted device according to Embodiment 1 of the present invention. A mounting structure 1 for a surface mounting device has a configuration in which a semiconductor device 3 is mounted on a printed circuit board 2. The printed circuit board 2 includes an insulating substrate such as an epoxy resin, wiring (not shown) laid on the insulating substrate, and wiring and a resist disposed on the printed circuit board 2. The wiring is made of copper or the like. A land (not shown in FIG. 1) for connecting to the semiconductor device 3 is formed at the end of the wiring.

  In the semiconductor device 3, a resist 16 and a rectangular land 17 for electrical connection with the printed circuit board 2 are formed on the bottom surface of the semiconductor chip 15. The semiconductor device 3 is packaged by, for example, a BGA type or LGA type CSP. Connection terminals provided in the semiconductor device 3 are connected to lands formed on the printed circuit board 2 via solder balls.

  FIG. 2A is a plan view showing a configuration of a region where the rectangular lands 13 are arranged on the printed circuit board 2. The rectangular land 13 is formed in a rectangular shape. A rectangular opening 21 is formed in the resist 12.

  The rectangular land 13 is partially exposed from the opening 21 of the resist 12 as shown in FIG. 2A. The longitudinal direction of the rectangular land 13 and the longitudinal direction of the opening 21 of the resist 12 are orthogonal to each other. Therefore, both ends of the rectangular land 13 are covered with the resist 12 in the longitudinal direction of the rectangular land 13. That is, the four corners of the rectangular land 13 are covered with the resist 12. On the other hand, in the short direction of the rectangular land 13, the rectangular land 13 is exposed from the resist 12, and a gap (clear) 14 is generated between the resist 12 and the rectangular land 13.

  FIG. 2B is a plan view showing a configuration of a region where the rectangular land 17 is arranged in the semiconductor device 3. The rectangular land 17 is formed in a rectangular shape. A rectangular opening 22 is formed in the resist 16.

  A part of the rectangular land 17 is exposed from the opening 22 of the resist 16 as shown in FIG. 2B. The longitudinal direction of the rectangular land 17 and the longitudinal direction of the opening 22 of the resist 16 are orthogonal to each other. Therefore, both ends of the rectangular land 17 are covered with the resist 16 in the longitudinal direction of the rectangular land 17. That is, the four corners of the rectangular land 17 are covered with the resist 16. On the other hand, in the short direction of the rectangular land 17, the rectangular land 17 is exposed from the resist 16, and a gap (clear) 18 is generated between the resist 16 and the rectangular land 17.

  FIG. 3 is an enlarged view showing a part of a cross section taken along the line AA of the mounting structure 1 of the surface mounting device in FIG. FIG. 3 corresponds to a cross section taken along line CC of the rectangular lands 13 and 17 in FIGS. 2A and 2B. A resist 12 and a rectangular land 13 are arranged on the insulating substrate 11. The insulating substrate 11 may be multilayered. When the insulating substrate 11 is multilayered, the rectangular land 13 is connected to, for example, a via (not shown) formed in the insulating substrate 11 and is connected to a wiring in a layer inside the insulating substrate 11. The resist 12 is provided in order to prevent oxidation of the wiring laid on the surface of the insulating substrate 11 and to insulate the wiring from other parts. A solder resist can be used for the resist 12.

  An integrated circuit (not shown) is disposed on the semiconductor chip 15. The rectangular land 17 is connected to the electrode of the integrated circuit. The resist 16 is disposed on the surface of the semiconductor chip 15 so as not to conduct between the rectangular lands 17. The rectangular land 13 and the rectangular land 17 are connected by a solder ball 19.

  In FIG. 3, a gap 14 as shown in FIG. 2A is formed between the rectangular land 13 and the resist 12. For this reason, the solder ball 19 flows into the gap 14 and spreads wet to the side surface of the rectangular land 13. For this reason, the bonding strength between the rectangular land 13 and the solder ball 19 is increased by the anchor effect.

  Similarly, a gap 18 as shown in FIG. 2B is formed between the rectangular land 17 and the resist 16. For this reason, the bonding strength between the rectangular land 17 and the solder ball 19 is increased by the anchor effect.

  FIG. 4 is a cross-sectional view taken along the line BB of the mounting structure 1 of the surface-mounted device in FIG. 4 corresponds to a cross section taken along the line DD of the rectangular lands 13 and 17 in FIGS. 2A and 2B. In FIG. 4, the resist 12 is arranged so as to cover a part of the rectangular land 13 as shown in FIG. 2A. In particular, the resist 12 covers the four corners of the rectangular land 13. For this reason, the bonding strength between the rectangular land 13 and the insulating substrate 11 is increased, and the rectangular land 13 is difficult to peel from the insulating substrate 11.

  Similarly, the resist 16 is disposed so as to cover a part of the rectangular land 17 as shown in FIG. 2B. For this reason, the bonding strength between the rectangular land 17 and the semiconductor chip 15 is increased, and the rectangular land 17 is hardly peeled off from the semiconductor chip 15.

  The land pull strength of the rectangular land 13 in the printed circuit board 2 configured in this way was measured. When one side of the land is 0.43 mm, the land pull strength is improved by 25% compared to the land 108 having the conventional configuration shown in FIG.

  As described above, the surface mount device mounting structure 1 according to the present embodiment has the gap 14 between the rectangular land 13 and the resist 12 in one direction and the end of the rectangular land 13 in the other direction. The configuration is covered with the resist 12. For this reason, it is possible to increase both the bonding strength between the rectangular land 13 and the solder ball 19 and the bonding strength between the rectangular land 13 and the printed circuit board 2 to such an extent that peeling does not occur.

  Further, a gap 18 is provided between the rectangular land 17 and the resist 16 in one direction, and the end of the rectangular land 17 is covered with the resist 16 in the other direction. For this reason, it is possible to increase both the bonding strength between the rectangular land 17 and the solder ball 19 and the bonding strength between the rectangular land 17 and the semiconductor chip 15 to the extent that peeling does not occur.

  Next, the positional deviation between the rectangular land 13 and the resist 12 will be described. FIG. 5 is a plan view showing the positional relationship when the resist 12 is shifted downward with respect to the rectangular land 13 in the present embodiment. In FIG. 5, the opening 21 in the case shown in FIG. 2A where no positional deviation has occurred is indicated by a two-dot chain line. The misalignment opening 21b is displaced from the opening 21 because the resist 12 is deviated from the rectangular land 13 in the direction below the paper (arrow A). Note that the displacement described here is within a range in which none of the four corners of the rectangular land 13 is exposed by the displacement opening 21b even if the displacement occurs.

  In this case, with respect to the opening 21b, only the size of the gap 14 between the rectangular land 13 and the resist 12 changes with respect to the opening 21, and the exposed area of the rectangular land 13 does not change. The same applies if the resist 12 is displaced upward. That is, even if the resist 12 is displaced in the vertical direction with respect to the rectangular land 13, the contact area between the rectangular land 13 and the solder ball 19 does not change.

  FIG. 6 is a plan view showing the positional relationship when the resist 12 is shifted to the left with respect to the rectangular land 13 in the present embodiment. In FIG. 6, the opening 21 in the case shown in FIG. 2A where no positional deviation has occurred is indicated by a two-dot chain line. The misalignment opening 21c is displaced from the opening 21 because the resist 12 is deviated from the rectangular land 13 in the left direction (arrow B).

  In this case, the area of the rectangular land 13 exposed from the shift opening 21c is represented by a value obtained by multiplying the length a2 of the short side of the shift opening 21c by the length b of the short side of the rectangular land 13. On the other hand, when there is no displacement, the area of the rectangular land 13 exposed from the opening 21 is a value obtained by multiplying the length a1 of the short side of the opening 21 by the length b of the short side of the rectangular land 13. It is represented by The short side length a1 of the opening 21 and the short side length a2 of the shifted opening 21c are equal because the short side length of the opening 21 does not change due to the positional deviation between the rectangular land 13 and the resist 12. .

  Therefore, the area of the rectangular land 13 exposed from the shift opening 21 c is equal to the area of the rectangular land 13 exposed from the opening 21. The same applies when the resist 12 is shifted to the right. That is, even if the resist 12 is displaced in the left-right direction with respect to the rectangular land 13, the contact area between the rectangular land 13 and the solder ball 19 does not change.

  As described above, the contact area between the rectangular land 13 and the solder ball 19 does not change even if the resist 12 is displaced in the vertical direction and the horizontal direction with respect to the rectangular land 13. That is, in the present embodiment, the contact area does not change regardless of the orientation of the resist 12 with respect to the rectangular land 13. For this reason, the rectangular land 13 and the solder ball 19 can be stably joined.

  Even if the positional deviation occurs, since the four corners of the rectangular land 13 are covered with the resist 12 in one direction (left and right direction in the drawing (DD line direction in FIG. 2A)), the rectangular land 13 and the insulating substrate Accordingly, the rectangular land 13 is hardly peeled off from the insulating substrate 11. Further, in the other direction (up and down direction on the paper (CC line direction in FIG. 2A)), a gap 14 is formed between the rectangular land 13 and the resist 12, and therefore the rectangular land 13 and the solder ball 19 are caused by the anchor effect. Bonding strength increases.

  Further, the positional deviation between the rectangular land 17 and the resist 16 is the same as that of the rectangular land 13 and the resist 12, and even if the positional deviation occurs, the contact area between the rectangular land 17 and the solder ball 19 does not change. For this reason, the rectangular land 17 and the solder ball 19 can be stably joined.

  Even if the positional deviation occurs, since the four corners of the rectangular land 17 are covered with the resist 16 in the direction of the line DD in FIG. 2B, the bonding strength between the rectangular land 17 and the semiconductor chip 15 is increased. The land 17 is difficult to peel from the semiconductor chip 15. Further, in the CC line direction in FIG. 2B, a gap 18 is generated between the rectangular land 17 and the resist 16, so that the bonding strength between the rectangular land 17 and the solder ball 19 is increased by the anchor effect.

(Embodiment 2)
FIG. 7A is a plan view showing a configuration of a region where the elliptical lands 31 on the insulating substrate are arranged in the mounting structure of the surface-mounted device according to Embodiment 2 of the present invention. FIG. 7B is a plan view showing a configuration of a region where the elliptical lands 32 on the semiconductor chip are arranged in the surface-mounted device mounting structure according to Embodiment 2 of the present invention. In the present embodiment, the rectangular land 13 in the first embodiment is replaced with an elliptical elliptical land 31, and the rectangular land 17 is replaced with an elliptical land 32. Other configurations are the same as those in the first embodiment. In the present embodiment, the same constituent elements as those of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 7A, the elliptical land 31 has an elliptical shape so that the major axis direction (FF line direction) is perpendicular to the longitudinal direction of the opening 21 (EE line direction). Has been placed. The cross section of the mounting structure of the surface mounting device in the EE line direction has the same configuration as that of FIG. 3 (the rectangular land 13 is replaced by the elliptical land 31), and the gap 14 is formed between the elliptical land 31 and the resist 12. Has occurred. For this reason, the bonding strength between the elliptical land 31 and the solder ball 19 is increased by the anchor effect.

  Further, the cross section of the mounting structure of the surface mounting device in the FF line direction is a configuration in which the elliptical land 31 is covered with the resist 12 as in FIG. 4 (the rectangular land 13 is replaced with the elliptical land 31). For this reason, the bonding strength between the elliptical land 31 and the insulating substrate 11 is increased, and the elliptical land 31 is difficult to peel from the insulating substrate 11.

  As shown in FIG. 7B, the elliptical land 32 has an elliptical shape so that the major axis direction (FF line direction) is perpendicular to the longitudinal direction of the opening 22 (EE line direction). Has been placed. The cross section of the mounting structure of the surface mounting device in the EE line direction has the same configuration as that of FIG. 3 (the rectangular land 17 is replaced with the elliptical land 32), and the gap 18 is formed between the elliptical land 32 and the resist 16. Has occurred. For this reason, the bonding strength between the elliptical land 32 and the solder ball 19 is increased by the anchor effect.

  Further, the cross section of the mounting structure of the surface mounting device in the FF line direction is a configuration in which the elliptical land 32 is covered with the resist 16 as in FIG. 4 (the rectangular land 17 is replaced with the elliptical land 32). For this reason, the bonding strength between the elliptical land 32 and the semiconductor chip 15 is increased, and the elliptical land 32 is hardly peeled off from the semiconductor chip 15.

  As described above, the surface mount device mounting structure according to the present embodiment has the gap 14 between the elliptical land 31 and the resist 12 in one direction, and the major axis direction of the elliptical land 31 in the other direction. The end portion is covered with the resist 12. For this reason, it is possible to increase both the bonding strength between the elliptical land 31 and the solder ball 19 and the bonding strength between the elliptical land 31 and the insulating substrate 11 to the extent that peeling does not occur.

  Further, in the surface mounting device mounting structure according to the present embodiment, the gap 18 is provided between the elliptical land 32 and the resist 16 in one direction, and the end of the major land direction of the elliptical land 32 is in the other direction. The configuration is covered with the resist 16. For this reason, it is possible to increase both the bonding strength between the elliptical land 32 and the solder ball 19 and the bonding strength between the elliptical land 32 and the semiconductor chip 15 to the extent that peeling does not occur.

  FIG. 8 is a plan view showing the positional relationship when the resist 12 is shifted downward with respect to the elliptical land 31 in the present embodiment. In FIG. 8, the opening 21 in the case shown in FIG. 7A in which no positional deviation has occurred is indicated by a two-dot chain line. The displacement opening 21d is located so as to be displaced from the opening 21 because the resist 12 is displaced in the direction below the paper (arrow C) with respect to the elliptical land 31.

  In this case, the displacement opening 21d only changes the size of the gap 14 between the elliptical land 31 and the resist 12 with respect to the opening 21, and the exposed area of the elliptical land 31 does not change. The same applies if the resist 12 is displaced upward. That is, even if the resist 12 is displaced in the vertical direction with respect to the elliptical land 31, the contact area between the elliptical land 31 and the solder ball 19 does not change.

  FIG. 9 is a plan view showing the positional relationship when the resist 12 is shifted to the left with respect to the elliptical land 31 in the present embodiment. In FIG. 9, the opening 21 in the case shown in FIG. 7A where no positional deviation has occurred is indicated by a two-dot chain line. The displacement opening 21e is displaced from the opening 21 because the positional relationship between the resist 12 and the elliptical land 31 is displaced in the left direction (arrow D). Note that the positional deviation described here is within a range in which the end portion in the major axis direction of the elliptical elliptical land 31 is not exposed by the deviation opening 21e even if the positional deviation occurs.

  In FIG. 9, an area that is exposed at the opening 21 of the elliptical land 31 but is covered with the resist 12 at the shift opening 21 e is referred to as a first area 33. The area covered with the resist 12 at the opening 21 of the elliptical land 31 but exposed at the offset opening 21 e is referred to as a second area 34.

  In this case, in the elliptical land 31 exposed from the shift opening 21 e, the first region 33 is covered with the resist 12 and the second region 34 is exposed from the resist 12 compared to the case where the elliptical land 31 is exposed by the opening 21. ing. The first region 33 and the second region 34 have a small difference in area as long as the end of the elliptical land 31 in the major axis direction is covered with the resist 12. Therefore, the area of the elliptical land 31 exposed by the offset opening 21e is substantially the same as the area of the elliptical land 31 exposed by the opening 21. The same applies when the resist 12 is shifted to the right. That is, even if the resist 12 is displaced in the left-right direction with respect to the elliptical land 31, the contact area between the elliptical land 31 and the solder ball 19 hardly changes.

  As described above, the contact area between the elliptical land 31 and the solder ball 19 hardly changes even if the resist 12 is displaced in the vertical direction and the horizontal direction with respect to the elliptical land 31. That is, in the present embodiment, the contact area hardly changes regardless of the orientation of the resist 12 with respect to the elliptical land 31. For this reason, the elliptical land 31 and the solder ball 19 can be stably joined.

  Even if the positional deviation occurs, the end of the elliptical land 31 in the long axis direction is covered with the resist 12 in one direction (the left-right direction on the paper (the FF line direction in FIG. 7A)). The bonding strength between 31 and the insulating substrate 11 is increased, and the elliptical land 31 is difficult to peel off. Further, in the other direction (the vertical direction on the paper surface (the EE line direction in FIG. 7A)), the gap 14 is generated between the elliptical land 31 and the resist 12, and therefore the elliptical land 31 and the solder ball 19 are caused by the anchor effect. Bonding strength increases.

  Further, the positional deviation between the elliptical land 32 and the resist 16 is the same as that of the elliptical land 31 and the resist 12, and even if the positional deviation occurs, the contact area between the elliptical land 32 and the solder ball 19 hardly changes. . For this reason, the elliptical land 32 and the solder ball 19 can be stably joined.

  Even if the positional deviation occurs, the end of the elliptical land 32 in the long axis direction is covered with the resist 16 in one direction (the left-right direction in the drawing (the FF line direction in FIG. 7B)). The bonding strength between the semiconductor chip 15 and the semiconductor chip 15 is increased, and the elliptical land 32 is difficult to peel off. Further, in the other direction (the vertical direction of the drawing (the EE line direction in FIG. 7B)), a gap 18 is generated between the elliptical land 32 and the resist 16, and therefore the elliptical land 32 and the solder ball 19 are caused by the anchor effect. Bonding strength increases.

  In the present embodiment, the example in which the shape of the elliptic lands 31 and 32 is an ellipse and the shape of the openings 21 and 22 of the resists 12 and 16 is a rectangle. It is rectangular and the shape of the openings 21 and 22 of the resists 12 and 16 may be elliptical.

  In Embodiments 1 and 2, the present invention is not limited to the configuration in which the resist opening has a rectangular shape, and may be an elliptical shape or a square shape. The land shape may be a rectangle or an ellipse. That is, if the land has a configuration in which a gap is formed between the land and the resist in one direction with respect to the opening of the resist and the end of the land is covered with the resist in the other direction. Good. Such a configuration has the above effects.

  In the first and second embodiments, the case where the longitudinal direction (major axis direction) and the short direction (minor axis direction) are orthogonal to each other has been described as an example. However, it is preferable that they are orthogonal to each other from the standpoint of the amount of misalignment with the resist and the shape of the contact area between the land and the solder ball.

  In the first embodiment, the case where the position of the gap 14 with respect to the rectangular land 13 on the printed circuit board and the position of the gap 18 with respect to the rectangular land 17 on the semiconductor device side are in the same direction has been described. However, the present invention is not limited to this example, and can be configured to be located in different directions. FIG. 10 is a plan view showing a configuration of a region where the rectangular land 17b of the semiconductor device 3b is arranged. The configuration of the region where the land of the printed circuit board 2 mounted on the semiconductor device 3b is arranged is the configuration shown in FIG. 2A.

  FIG. 11 is a cross-sectional view taken along the line C-C of the mounting structure 1b of the surface mount device in which the semiconductor device 3b is mounted on the printed circuit board 2. FIG. 12 is a DD cross-sectional view of the mounting structure 1b of the surface mounting device in which the semiconductor device 3b is mounted on the printed circuit board 2. As shown in FIG. 11, in the CC direction of the mounting structure 1b of the surface mounting device, no gap 18 is formed between the rectangular land 17b on the semiconductor device side and the resist 16b, and the rectangular shape on the printed circuit board side. A gap 14 is generated between the land 13 and the resist 12. On the other hand, as shown in FIG. 12, in the DD direction of the mounting structure 1b of the surface mounting device, a gap 18b is generated between the rectangular land 17b on the semiconductor device side and the resist 16b. There is no gap between the rectangular land 13 and the resist 12.

  As shown in FIG. 4, when the rectangular lands 13 and 17 are partially covered with the resists 12 and 16, for example, when the resist 12 is displaced to the right and the resist 16 is displaced to the left, The exposed positions of 13 and 17 are shifted. For this reason, the solder ball 19 is distorted.

  On the other hand, in the mounting structure 1b of the surface mount device, as shown in FIGS. 11 and 12, gaps 14 and 18b are provided in the displacement direction in the vicinity of one of the rectangular lands 13 and 17b. For this reason, the exposed positions of the rectangular lands 13 and 17b on the side where the gaps 14 and 18b are provided do not change. Therefore, the relative displacement between the exposed positions of the rectangular lands 13 and 17b on the printed circuit board side and the semiconductor device side is small. For this reason, the distortion of the solder ball 19 is reduced, and the rectangular lands 13 and 17 b are stably joined by the solder ball 19.

  Also in the surface mounting device mounting structure 1b, as shown in FIG. 10, a gap 18b is provided between the rectangular land 17b and the resist 16b in one direction, and the end of the rectangular land 17b is the resist in the other direction. It is the structure covered with 16b. For this reason, both the bonding strength between the rectangular land 17b and the solder ball 19 and the bonding strength between the rectangular land 17b and the semiconductor chip 15b can be increased to such an extent that no peeling occurs.

  That is, even if the longitudinal direction of the rectangular land 17b and the longitudinal direction of the rectangular land 13 coincide or are orthogonal to each other, the bonding strength between the rectangular lands 13 and 17b by the solder balls 19 is high.

  The relative displacement of the exposed positions of the lands is the same in the elliptical land 31 on the printed circuit board side and the elliptical land 32 on the semiconductor device side in the second embodiment. Further, the bonding strength of the solder ball 19 to the land is the same as that in the case where the major axis direction coincides even if the major axis direction of the elliptical land 31 and the major axis direction of the elliptical land 32 are orthogonal to each other. It has a degree of strength.

  In the first and second embodiments, the configuration in which the printed circuit board side and the semiconductor device side lands are both covered with a resist in one direction and a gap is formed between the land and the resist in the other direction has been described. . However, the present invention only needs to have a configuration in which at least one of the lands on the printed circuit board side and the semiconductor device side is covered with a resist in one direction and a gap is formed between the land and the resist in the other direction.

  If either one of the lands has such a configuration, the bonding strength between the land and the semiconductor chip or the insulating substrate can be ensured on the side of such a configuration. That is, at the joint between the land and the solder ball provided on the semiconductor chip or the insulating substrate, the solder ball spreads to the side surface of the land and the joint strength can be ensured. Therefore, stable bonding strength between the semiconductor device and the printed board can be ensured.

  The mounting structure of the surface mounting device of the present invention has an effect of increasing the connection strength between the semiconductor device and the land of the printed circuit board, and can be used as the mounting structure of the semiconductor device of the BGA package.

The top view which shows the structure of the mounting structure of the surface mount device which concerns on Embodiment 1 of this invention The top view which shows the structure of the area | region where the land on the insulated substrate which concerns on Embodiment 1 is arrange | positioned FIG. 3 is a plan view showing a configuration of a region where lands on the semiconductor chip according to the first embodiment are arranged; AA sectional view of the mounting structure of the surface mount device in FIG. BB sectional view of the mounting structure of the surface mounting device in FIG. In Embodiment 1, the top view which shows the positional relationship when a resist has shifted | deviated below with respect to the land In this Embodiment 1, the top view which shows the positional relationship when a resist has shifted | deviated to the left with respect to the land. The top view which shows the structure of the area | region where the land on the insulated substrate which concerns on Embodiment 2 of this invention is arrange | positioned The top view which shows the structure of the area | region where the land on the semiconductor chip concerning Embodiment 2 of this invention is arrange | positioned In this Embodiment 2, the top view which shows the positional relationship when a resist has shifted | deviated below with respect to the land. The top view which shows the positional relationship when the resist has shifted | deviated to the left with respect to the land in this Embodiment 2. FIG. The top view which shows the structure of the area | region where the rectangular land in the semiconductor device of another structure in this Embodiment 1 is arrange | positioned. CC sectional drawing of the mounting structure of the surface mounting device of another structure in this Embodiment 1. FIG. DD sectional view of a mounting structure of a surface mounting device having another configuration according to the first embodiment The top view which shows the structure of the connection part of the printed circuit board which mounts the semiconductor device of the conventional BGA package The top view which shows the structure of the connection part of the printed circuit board which mounts the semiconductor device of a BGA package in another conventional structure The top view which shows the structure of the connection part of the printed circuit board which mounts the semiconductor device of the BGA package in another conventional structure

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1b Surface mount device mounting structure 2 Printed circuit board 3, 3b Semiconductor device 11 Insulating substrate 12, 16, 16b Resistant 13, 17, 17b Rectangular land 14, 18, 18b Gap 15, 15b Semiconductor chip 19 Solder ball 21, 22, 22b Openings 21b, 21c, 21d, 21e Displacement openings 31, 32 Elliptical land 33 First region 34 Second region

Claims (11)

An insulating substrate;
A substrate-side land disposed on the surface of the insulating substrate;
A resist disposed on the surface of the insulating substrate and having an opening formed therein;
In the printed circuit board in which the board-side land is exposed from the opening,
The board-side land is
In one direction of the surface of the insulating substrate, both ends are covered with the resist,
A printed board having a gap with the resist in another direction on the surface of the insulating substrate. The substrate-side land has a length in one direction longer than a length in the other direction,
The opening has a length in one direction shorter than a length in the other direction,
The printed circuit board according to claim 1, wherein the one direction and the other direction are orthogonal to each other. The substrate-side land is rectangular,
The opening is rectangular,
The printed circuit board according to claim 2, wherein both end portions in the longitudinal direction of the substrate-side land are covered with the resist. The substrate-side land has an elliptical shape,
The opening is rectangular,
The printed circuit board according to claim 2, wherein both ends of the board-side land in the major axis direction are covered with the resist. The substrate-side land is rectangular,
The opening is oval;
The printed circuit board according to claim 2, wherein both end portions in the longitudinal direction of the substrate-side land are covered with the resist. A semiconductor chip;
A semiconductor device-side land disposed on the surface of the semiconductor chip;
A resist disposed on the surface of the semiconductor chip and having an opening formed therein;
The semiconductor device-side land is a semiconductor device exposed from the opening,
The semiconductor device side land is
In one direction of the surface of the semiconductor, both ends are covered with the resist,
2. A semiconductor device according to claim 1, wherein a gap is formed between the semiconductor surface and the resist in another direction. The land on the semiconductor device side has a length in the one direction longer than a length in the other direction,
The opening has a length in one direction shorter than a length in the other direction,
The semiconductor device according to claim 6, wherein the one direction and the other direction are orthogonal to each other. The semiconductor device side land is rectangular,
The opening is rectangular,
The semiconductor device according to claim 7, wherein both ends in the longitudinal direction of the land on the semiconductor device side are covered with the resist. The semiconductor device side land is elliptical,
The opening is rectangular,
The semiconductor device according to claim 7, wherein both ends in the major axis direction of the semiconductor device side land are covered with the resist. The semiconductor device side land is rectangular,
The opening is oval;
The semiconductor device according to claim 7, wherein both ends in the longitudinal direction of the land on the semiconductor device side are covered with the resist. The printed circuit board according to any one of claims 1 to 5,
A semiconductor device according to any one of claims 6 to 10,
A mounting structure for a surface-mounted device, comprising: a solder ball connecting the substrate-side land and the semiconductor device-side land.

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