JP2009239179A - Soldering device and soldering method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a uniform temperature distribution of each object to be soldered in an appropriate soldering condition when a plurality of objects are to be soldered simultaneously, thereby reducing energy consumption for heating. <P>SOLUTION: A plurality of objects 16 are soldered simultaneously by induction heating of a support stage 14 using a high-frequency heating coil 31 while the support stage 14 supporting the objects 16 is held in a floating state. The support stage 14 is held in the floating state by making use of repulsive forces of a first magnet 12 and a second magnet 15. The support stage 14 is heated while its horizontal movement is regulated by a regulation pin 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a soldering apparatus and a soldering method, and more particularly to a soldering apparatus and a soldering method that simultaneously solder a plurality of products to be soldered.

  When simultaneously soldering a plurality of soldering target products, as shown in FIG. 4A, a plurality of soldering target products 41 are supported on a support jig 42, and the support jig 42 is used as a heating source. There is a method of performing soldering by placing on a hot plate 43 and heating the support jig 42 by the hot plate 43 to transmit the heat of the support jig 42 to each soldering target product 41. However, since the surface of the hot plate 43 is not strictly a uniform plane, the entire surface of the hot plate 43 is not in surface contact with the back surface of the support jig 42 and is indicated by an arrow in the figure. Thus, the support jig 42 is locally heated. Further, when performing repeated soldering, the contact point between the support jig 42 and the surface of the hot plate 43 may be different each time, and further, individual differences, thermal expansion, and warpage of the soldering target product 41 to be soldered. Therefore, it is very difficult to perform soldering of a plurality of products to be soldered 41 simultaneously by making the temperature distribution of the support jig 42 uniform.

  In addition to the soldering method using the contact heating method such as the hot plate 43, there is a soldering method using a non-contact heating method in which the support jig 42 is heated by a heating means that does not contact the support jig 42. An example of a soldering method using a non-contact heating method is shown in FIG. In this method, the support jig 42 is placed on the support base 44 having a plurality of pedestals 44a, and the positioning jig 45 positions the support jig 42 with respect to the support base 44 so that the support jig 42 is positioned above the support jig 42. The supporting jig 42 and the plurality of soldering target articles 41 are heated by the arranged heating lamp 46.

Further, as a wafer support device in an exposure apparatus of a semiconductor manufacturing apparatus, a support device that supports a table in a floating state using a magnetic attractive force and a repulsive force (repulsive force) has been proposed (see Patent Document 1). .)
JP-A-10-521

  In the soldering method based on the non-contact heating method as shown in FIG. 4B, the heating energy for heating the support jig 42 that supports the plurality of soldering target articles 41, that is, the supporting jig from the heating lamp 46 is supported. The area density of the input energy supplied to the tool 42 can be made uniform. However, since the heat of the support jig 42 escapes from the portion of the base 44a that supports the support jig 42 to the support base 44, the temperature of the support jig 42 near the base 44a is partially lowered, The temperature distribution of the support jig 42 is not uniform. In other words, it is difficult to make the temperature distribution of the support jig 42 on which the plurality of soldering target articles 41 are placed uniform only by making the area density of the input energy uniform.

  If a plurality of soldering target products 41 are simultaneously soldered in a state where the temperature distribution is not uniform, the soldering target product 41 arranged at a location where the proper soldering temperature is not reached becomes a rejected product. There is a risk that it will end. Further, when the heating temperature is adjusted so that the temperature of the portion in contact with the pedestal 44a becomes an appropriate temperature for soldering, not only is the energy consumed and energy is wasted, but also the portion away from the contact portion with the pedestal 44a There is also a possibility that the reliability of the solder joint portion of the soldering target product 41 disposed in that portion will deteriorate because the temperature of the solder becomes too high.

  On the other hand, although the structure which hold | maintains a table in a non-contact state is indicated by patent document 1, the objective is aiming at positioning of the height and horizontal direction of a table accurately, and several soldering object It is not assumed at all that the table is heated uniformly in order to solder the product 41 at the same time.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to determine the temperature distribution of each soldering object when soldering a plurality of soldering objects simultaneously. It is an object of the present invention to provide a soldering apparatus and a soldering method that can be uniformly applied in a state where soldering can be performed properly and that can suppress energy consumption for heating.

  In order to achieve the above-described object, the invention according to claim 1 includes a support stage that supports a product to be soldered, a levitation mechanism that holds the support stage in a floating state, the support stage in the floating state, and the A non-contact heating means for heating the product to be soldered in a non-contact state.

  In the present invention, the support stage that supports the product to be soldered is heated by the non-contact heating means while being held in a floating state by the floating mechanism, so that heat does not escape from the support stage. That is, the temperature distribution on the support stage does not cause irregularities that hinder soldering. Therefore, by supplying heating energy uniformly to the support stage by non-contact heating means, the temperature distribution of each soldering target product can be made uniform so that soldering can be performed properly, and heating is performed. Energy consumption for can be suppressed.

  According to a second aspect of the present invention, in the first aspect of the present invention, the levitation mechanism includes a first magnet attached to a support portion that supports the support stage, and the first magnet on the support stage. And a second magnet disposed opposite to each other and repelling each other. In the present invention, the support stage is held in a floating state using the repulsive force of the magnet. Since the support stage is levitated using the repulsive force of the magnet, the configuration of the apparatus is simplified, and the support stage can be held in a levitated state even in a vacuum state.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the non-contact heating means includes a heating coil disposed to face the support stage, and a current to the heating coil. Current supply means for supplying the heating stage, and the support stage generates heat upon receiving an electromagnetic induction effect by energization of the heating coil.

  When the lamp method or the electric heater method is adopted as the non-contact heating means, the surface of the support stage which is the heated portion tends to be easily heated near the lamp or the electric heater. In this invention, since the induction heating method is adopted as the non-contact heating means, the support stage itself generates heat uniformly by the electromagnetic induction action, so that it is possible to uniformly heat a plurality of products to be soldered.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects of the present invention, there is provided a regulating means for regulating the movement of the support stage in the floating state in the horizontal direction. If the support stage is simply held in a floating state, when the support stage receives a horizontal force, the support stage may deviate from a predetermined heating position, and heating may not be performed satisfactorily. In the present invention, since the restricting means for restricting the movement of the support stage in the horizontal direction is provided, the support stage can be heated in a state of being regulated at a certain position.

  According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the restricting means is disposed so as to face the third magnet and the third magnet attached to the support stage, and the third magnet. And a fourth magnet repelling each other. In the present invention, the movement of the support stage in the horizontal direction can be regulated in a non-contact state by the repulsive force between the third magnet and the fourth magnet.

  According to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, the support stage includes a plurality of accommodating portions that accommodate the soldering target product. Therefore, in this invention, when the soldering target product is accommodated in the accommodating portion, the positioning is automatically performed, and it is not necessary to provide a positioning portion separately.

  According to the seventh aspect of the present invention, the soldering component holds the support stage supporting the plurality of soldering objects placed on the soldering base via the solder in a floating state, and supports the floating state. The stage is heated by a non-contact heating means to simultaneously solder the plurality of products to be soldered. In this invention, since the support stage that supports the soldering target product is heated by the non-contact heating means while being kept in a floating state, the temperature distribution of each soldering target product can be appropriately soldered. It can be made uniform in a possible state, and energy consumption for heating can be suppressed.

  The invention according to claim 8 is the invention according to claim 7, wherein the support stage is held in a floating state by utilizing a repulsive force of a magnet. Therefore, according to the present invention, the configuration for holding the support stage in the floating state is simplified, and the support stage can be held in the floating state even in a vacuum state.

  The invention according to claim 9 is the invention according to claim 7 or claim 8, wherein the non-contact heating means causes the current to flow through a heating coil disposed to face the support stage. An electromagnetic induction action is caused on the stage to cause the support stage to generate heat. Therefore, in this invention, since the support stage itself generates heat uniformly due to the electromagnetic induction action, it is possible to uniformly heat a plurality of products to be soldered.

  According to the present invention, when soldering a plurality of soldering target products at the same time, the temperature distribution of each soldering target product can be made uniform so that soldering can be performed properly. In addition, energy consumption for heating can be suppressed.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. 1 and 2.
In this embodiment, the heating means employs an induction heating method, and the levitation mechanism that holds the support stage that supports the plurality of soldering objects in a floating state uses the repulsive force of the magnet.

First, the configuration of an apparatus used for soldering will be described.
The soldering apparatus includes a chamber that can be sealed, a support stage that supports an object to be soldered, a levitation mechanism that holds the support stage in a floating state, the support stage in the levitation state, and the solder A non-contact heating means for heating the attachment object in a non-contact state.

  As shown in FIG. 1A, a support base 11 as a support portion is placed on a support plate 30. The support base 11 is formed in a rectangular shape in plan view, and a plurality of first magnets 12 are attached to the upper part near the periphery. The first magnets 12 are provided at the four corners of the support base 11, respectively. A permanent magnet is used for the first magnet 12, and the first magnet 12 is attached to the support base 11 so that the magnetization direction is the thickness direction (vertical direction) of the support base 11. Further, a regulation pin 13 as a regulation means is fixed to the support base 11 so as to extend in the vertical direction.

  The support stage 14 supported by the support table 11 in a floating state is formed in a rectangular shape in plan view that is slightly smaller than the support table 11. On the lower surface of the support stage 14, a second magnet 15 is attached at a position facing the first magnet 12 provided on the support base 11. The second magnet 15 is placed on the support stage 14 so that the magnetization direction is the thickness direction (vertical direction) of the support stage 14 and the magnetic poles facing the first magnet 12 are the same magnetic pole. It is attached. The first magnet 12 and the second magnet 15 constitute a levitation mechanism that holds the support stage 14 in a levitation state. That is, the levitation mechanism includes a first magnet 12 attached to the support base 11 that supports the support stage 14, and is disposed on the support stage 14 so as to oppose the first magnet 12 and repels the first magnet 12. And a second magnet 15 for mutual contact. The support stage 14 is held in a floating state using the repulsive force of the first magnet 12 and the second magnet 15.

  As shown in FIGS. 1A and 1B, a plurality of accommodating portions 17 that support the soldering target product 16 are formed on the upper surface of the support stage 14. The material of the support stage 14 may be any material that is heated by induction heating, and a ferromagnetic material, carbon, or the like is used. In this embodiment, for example, carbon is used.

  In this embodiment, the soldering target product 16 includes a ceramic substrate 20 as a soldering base and a plurality of semiconductor chips 21 as soldering parts, as shown in FIGS. 2 (a) and 2 (b). . The ceramic substrate 20 is composed of a ceramic plate 24 having a circuit pattern 22 on the front surface and a metal layer 23 on the back surface. The circuit pattern 22 and the metal layer 23 are made of, for example, aluminum or copper. The ceramic plate 24 is made of, for example, aluminum nitride, alumina, silicon nitride, or the like. The semiconductor chip 21 is bonded to a predetermined position on the circuit pattern 22 via solder 25.

  The chamber constitutes a heating device that performs heating in a reducing gas atmosphere. The heating device is configured to perform heating by high-frequency induction heating, and a high-frequency heating coil 31 as a heating coil is disposed above the support stage 14 as shown in FIG. The support plate 30 is configured to be movable up and down by a lifting means (not shown). The support stage 14 is placed on the support plate 30 together with the support base 11 and is disposed at a position where proper heating by the high-frequency heating coil 31 is performed. Heating is performed in the state. The output of the high frequency heating coil 31 is controlled by a high frequency generator 32 as current supply means. The high-frequency heating coil 31 is formed in a pipe shape and is connected to a cooling water tank 33 so that overheating of the high-frequency heating coil 31 itself is suppressed by passing cooling water therein.

Next, a soldering method will be described.
First, the soldering target product 16 is housed in each housing portion 17 of the support stage 14. More specifically, the ceramic substrate 20 is disposed in each accommodating portion 17, and then cream solder is applied as the solder 25 on the circuit pattern 22, and the semiconductor chip 21 is disposed on the solder 25.

  Next, the support stage 14 is placed on the support base 11 in a state where movement in the horizontal direction is restricted by the restriction pin 13. The support stage 14 is held in a floating state from the support base 11 by the repulsive force of the first magnet 12 and the second magnet 15. The support base 11 and the support stage 14 are disposed in a heating device that performs heating in a reducing gas atmosphere.

  When a high-frequency current is passed through the high-frequency heating coil 31 in the state of FIG. 1A, a high-frequency magnetic flux passing through the support stage 14 and the soldering target product 16 is generated around the high-frequency heating coil 31, and the support stage 14 and the like. An eddy current is generated by the passage of magnetic flux, and the support stage 14 generates heat. When the support stage 14 generates heat, the plurality of soldering target products 16 arranged on the support stage 14 are heated. As a result, the solder 25 is melted at a temperature equal to or higher than the melting temperature. After the solder 25 is completely melted, the supply of the high-frequency current to the high-frequency heating coil 31 is stopped. Note that the high-frequency current supply time is set to an appropriate time by a test in advance. The melted solder 25 is solidified by being cooled below the melting temperature, and joins the ceramic substrate 20 and the semiconductor chip 21.

  Thereafter, after the inside of the heating device is returned to the same atmosphere as the atmosphere, the soldering target product 16 that has been soldered together with the support stage 14 is taken out from the heating device, and the soldering target product 16 is taken out from the accommodating portion 17. Soldering is complete.

  Since the support stage 14 that supports the plurality of soldering target products 16 is heated by the non-contact heating unit while being held in a floating state, the heat generated by the energy supplied from the non-contact heating unit is difficult to escape. The restriction pin 13 that restricts the movement of the support stage 14 in the horizontal direction and the support stage 14 are only partly in line contact, so the heat that escapes to the support base 11 through the restriction pin 13 is not generated. It is slight. For this reason, the temperature distribution on the support stage 14 does not cause unevenness that hinders soldering. Therefore, by uniformly supplying the heating energy to the support stage 14 by the non-contact heating means, the temperature distribution of each soldering target product 16 can be made uniform so that soldering can be performed properly.

According to this embodiment, the following effects can be obtained.
(1) With the support stage 14 supporting the plurality of soldering target products 16 held in a floating state, the support stage 14 is heated by non-contact heating means, and the soldering of the plurality of soldering target products 16 is performed simultaneously. Do. Therefore, by uniformly supplying the heating energy to the support stage 14 by the non-contact heating means, the temperature distribution of each soldering target product 16 can be made uniform so that soldering can be performed properly, In addition, energy required for heating can be suppressed.

  (2) The non-contact heating means performs heating by induction heating. When non-contact heating is performed with a lamp or an electric heater, the surface of the heated portion is likely to be warmed near the lamp or the electric heater. However, since the non-contact heating means performs heating by induction heating, the heated portion is not heated from the surface but also from the inside, and thus the whole is easily heated uniformly.

  (3) The support stage 14 is heated in a state where movement in the horizontal direction is regulated by the regulation means (regulation pin 13). Therefore, the non-contact heating means may be arranged at a position corresponding to the place to be heated, and the configuration is simplified.

  (4) The support stage 14 is held in a levitation state using the repulsive force of the first magnet 12 and the second magnet 15. Therefore, the structure is simplified and the support stage 14 is levitated even in a vacuum state, compared to a method of jetting compressed gas or an ultrasonic levitation method in which an object is levitated by sound pressure generated by ultrasonically vibrating a diaphragm. Can be kept in a state.

  (5) The material of the support stage 14 is heated by induction heating, and a material such as carbon, for example, is used which has the same amount of power used and a small amount of heat generated by induction heating compared to the ferromagnetic material. Therefore, it becomes easy to uniformly heat the entire support stage 14.

  (6) The support stage 14 includes a plurality of accommodating portions 17 that accommodate the soldering target product 16. Therefore, when the product 16 to be soldered is accommodated in the accommodating portion 17, the positioning is automatically performed, and it is not necessary to provide a positioning portion separately.

The embodiment is not limited to the above, and may be embodied as follows, for example.
○ The restricting means for restricting the horizontal movement of the support stage 14 in the floating state is not limited to the means for restricting the support stage 14 in contact with the support stage 14 like the restriction pin 13, but may be configured to restrict the movement in a non-contact state. Good. For example, as shown in FIG. 3A, the third magnet 18 is fixed to the side surface of the support stage 14, and the support base 11 is connected to the fourth magnet 18 via a mounting piece 19 at a position facing the third magnet 18. The magnet 19a is provided. In this configuration, since the support stage 14 is levitated completely in a non-contact state, the amount of heat escaping from the support stage 14 is reduced, and the temperature distribution is more uniform.

  As a method of restricting the movement of the support stage 14 using a magnet, the fixed state of the first magnet 12 and the second magnet 15 for levitating the support stage 14 provided on the support base 11 and the support stage 14 is It may be modified so that the first magnet 12 and the second magnet 15 also serve as a restricting means. Specifically, for example, as shown in FIG. 3B, the first magnet 12 and the second magnet 15 are fixed in an obliquely arranged state, and the first magnet 12 and the second magnet 15 are fixed. The repulsive force is set to act so as to urge the support stage 14 upward and horizontally. In this case, movement restriction can be performed in a state where the support stage 14 is levitated and in a non-contact state without increasing the number of magnets.

  ○ Non-contact heating means is not limited to the method using induction heating, for example, non-contact heating is performed by a method of heating by irradiating light or infrared rays with a lamp or a method of heating using an electric heater. You may do it.

The first magnet 12 fixed to the support base 11 is not limited to a permanent magnet, and an electromagnet may be provided.
○ Means for holding the support stage in a floating state is not limited to means utilizing the repulsive force of the magnet. For example, ultrasonic levitation, that is, a method of levitation of an object with sound pressure generated by ultrasonically vibrating a diaphragm may be used.

The solder 25 used for soldering is not limited to cream solder, and plate-shaped (sheet-shaped) solder may be used.
○ The support stage 14 is not limited to carbon.

  The support stage 14 is not limited to the configuration in which the soldering target product 16 is supported in a state of being accommodated in the accommodating portion 17. For example, a configuration in which the upper surface of the support stage 14 is configured as a planar portion that supports a plurality of soldering target products 16, and a positioning convex portion is formed on the planar portion corresponding to each soldering target product 16, A positioning jig separate from the support stage 14 may be placed on the flat surface to position the soldering target product 16.

  The product 16 to be soldered is not limited to the combination of the ceramic substrate 20 and the semiconductor chip 21. For example, a combination of an insulating substrate in which a metal circuit (circuit pattern 22) is formed on a metal plate via an insulating resin layer and the semiconductor chip 21 may be used.

  The semiconductor chip 21 to be soldered to the ceramic substrate 20 or the insulating substrate is not limited to the same thing, and different types of semiconductor chips 21 may be mixed. Different types of semiconductor chips 21 may have different shapes and heights as well as different areas.

  The product 16 to be soldered is not limited to the ceramic substrate 20 or the insulating substrate and the semiconductor chip 21. For example, when the ceramic substrate 20 on which the semiconductor chip 21 is mounted is soldered to a metal base, a printed wiring board and a surface mount component It may be a combination.

  ○ The soldering apparatus is not limited to a configuration including a chamber that can be sealed. The structure which solders in air | atmosphere may be sufficient.

(A) is a schematic diagram which shows the relationship between the support stand in one embodiment, a support stage, and a non-contact heating means, (b) is a schematic perspective view of a support stage. (A) is a schematic perspective view of the product to be soldered, and (b) is a schematic cross-sectional view. (A), (b) is a schematic cross section of the support stand and support stage of another embodiment. (A), (b) is a schematic cross section of a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 12 ... 1st magnet, 13 ... Control pin as control means, 14 ... Support stage, 15 ... 2nd magnet, 16 ... Soldering object, 17 ... Storage part, 18 ... 3rd magnet as control means , 19a, a fourth magnet as a regulating means, 20 a ceramic substrate as a soldering base, 21 a semiconductor chip as a soldering part, 25 a solder, 31 a heating coil constituting non-contact heating means High frequency heating coil, 32... High frequency generator as current supply means.

Claims (9)

A support stage that supports the product to be soldered;
A levitation mechanism for holding the support stage in a levitation state;
A soldering apparatus comprising: the support stage in the floating state; and a non-contact heating unit configured to heat the soldering target product in a non-contact state. The levitation mechanism includes a first magnet attached to a support portion that supports the support stage;
The soldering apparatus according to claim 1, further comprising: a second magnet disposed on the support stage so as to face the first magnet and repelling the first magnet. The non-contact heating means includes a heating coil disposed to face the support stage, and a current supply means for supplying a current to the heating coil.
The soldering apparatus according to claim 1, wherein the support stage generates heat by receiving an electromagnetic induction effect caused by energization of the heating coil.   The soldering apparatus as described in any one of Claims 1-3 provided with the control means which controls the movement to the horizontal direction of the said support stage of the said floating state.   The said restriction | limiting means is equipped with the 4th magnet which is arrange | positioned facing the 3rd magnet attached to the said support stage, and opposes the said 3rd magnet, and repels mutually with the said 3rd magnet. The soldering apparatus as described.   The soldering apparatus according to any one of claims 1 to 5, wherein the support stage includes a plurality of accommodating portions that accommodate the soldering target product.   A soldering component holds a support stage that supports a plurality of soldering objects placed on a soldering base via solder, and the support stage in the floating state is heated by a non-contact heating means. And soldering the plurality of products to be soldered simultaneously.   The soldering method according to claim 7, wherein the support stage is held in a floating state using a repulsive force of a magnet.   The said non-contact heating means raise | generates the electromagnetic induction effect | action to the said support stage by sending an electric current through the coil for heating arrange | positioned facing the said support stage, and makes the said support stage generate | occur | produce a heat | fever. Soldering method as described in 4.

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