JP2009239018A - Projection exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a projection exposure apparatus having a shade body which is detached and attached again in a short time as a substrate is replaced and adaptive to a variety of shade regions. <P>SOLUTION: The projection exposure apparatus (100) irradiates a mask with light containing ultraviolet rays to light passing through the mask through a projection optical system, and exposes the substrate coated with negative photoresist. The projection exposure apparatus includes at least two first shade bodies (84) for cutting off the exposure light, and first movement portions (82, 83, and 86) for moving the first shade bodies from outside the substrate toward the center of the substrate, the first shade bodies shielding the entire peripheral part of the substrate from the light when the first shade bodies are moved toward the center of the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a projection exposure apparatus having a light shielding body that shields an edge of a substrate coated with a photoresist when a predetermined pattern is exposed on the surface of a substrate such as silicon.

  Various exposure apparatuses that irradiate ultraviolet rays of a predetermined wavelength in order to expose a predetermined pattern on a semiconductor substrate such as a silicon wafer, a glass substrate for a flat display, or various substrates for electronic circuits (hereinafter referred to as a substrate). It has been proposed. When a photoresist is applied to the substrate, the photoresist may be applied unevenly at the edge of the substrate. For this reason, the photoresist remains without being removed, and the photoresist may cause dust in a later process. Therefore, it is necessary to remove the photoresist on the edge of the substrate in advance.

Especially MEMS (Micro Electro
In the manufacturing of mechanical systems, etc., the level difference of the wafer exceeds several μm and reaches several hundred μm. In such MEMS production, a negative photoresist is widely used due to a large wafer level difference. In order to remove the negative photoresist on the edge of the substrate, there has been proposed an exposure apparatus provided with a light shield so that light does not strike the edge of the substrate. The negative photoresist not exposed to light is removed by development and etching.

  Patent Document 1 proposes an apparatus in which a ring-shaped light shielding body is placed on a substrate and the edges of the substrate are collectively covered. The light shielding body disclosed in Patent Literature 1 has a shape that covers the entire edge of the substrate. Therefore, when replacing the substrate, the substrate table moves the light shield to the standby position of the light shield to remove the light shield, then the substrate table moves to the substrate replacement position and replaces the substrate, and then the substrate again. The table moves to the standby position of the light shielding body, and the light shielding body is placed on the substrate. Accordingly, the moving distance of the substrate table becomes long and it takes time to replace the substrate. Further, the movement of the light shielding body is increased, and the possibility of winding up the garbage is increased. Further, when the substrate size is changed, it is necessary to change the size of the light shielding body, so that the replacement work takes time.

In Patent Document 2, a concave arc shading band or a rectangular shading band is disposed in the vicinity of the wafer periphery so that the peripheral area of the substrate is not exposed. For this reason, a mechanism for moving the concave arc shading zone or the rectangular shading zone around the substrate and a shading position calculation control mechanism are required.
Special table 2005-505147 JP 2005-045160 A

  Since the light-shielding body that covers the entire surface of the substrate as in Patent Document 1 is large, it takes time to replace the substrate, and it takes more time to change the size of the light-shielding body. Was lowering. Further, although the light shielding body in Patent Document 2 is small and easy to handle, the light shielding body control unit needs to obtain the insertion position of the light shielding body in advance according to the pattern drawn on the photomask, and the processing becomes complicated. There was a problem.

  Therefore, the present invention provides a simple light shielding device that can reduce the time required for removing and re-installing the light shielding member due to the replacement of the substrate, eliminates the need for calculating the insertion position of the light shielding member, and supports a variety of light shielding regions. A projection exposure apparatus is provided.

A projection exposure apparatus according to a first aspect is an apparatus that irradiates a mask with a light beam including ultraviolet rays and exposes the light beam that has passed through the mask via a projection optical system onto a substrate coated with a negative photoresist. The projection exposure apparatus includes at least two first light shields for shielding exposure light, and a first moving unit that moves the first light shield from the outside of the substrate toward the center of the substrate. When the light shielding body is moved toward the center of the substrate, the first light shielding body shields the entire periphery of the substrate.
With this configuration, the entire periphery of the substrate can be shielded by moving at least two first light shields toward the center of the substrate.

In the projection exposure apparatus according to the second aspect, the central shape of the first light shield is an arc.
In the projection exposure apparatus according to the third aspect, the central shape of the first light shield is a straight line.
In this way, the shape of the first light shield can be changed according to the region that needs to be shielded from light.

A projection exposure apparatus according to a fourth aspect includes an elevating unit that moves the first light shield in the light irradiation direction.
By providing the elevating part, the first light shield can be moved to a position where there is no hindrance when replacing the substrate. Moreover, it can light-shield firmly by making a 1st light-shielding body adjoin to a board | substrate.

The first light shield of the projection exposure apparatus of the fifth aspect has a thick part and thin parts on both sides thereof, and the thin parts of the adjacent first light shields overlap each other.
With this configuration, even if at least two first light shields are configured to move toward the center of the substrate, no gap is formed between adjacent first light shields, and light can be shielded firmly.

  A projection exposure apparatus according to a sixth aspect includes a substrate table including an adsorption chuck that adsorbs a substrate, and a stage that moves the substrate table in a plane that intersects the irradiation direction of the light beam. The first moving unit is moved in the plane.

A projection exposure apparatus according to a seventh aspect includes at least two second light shields having a shape different from that of the first light shield, and a second moving unit that moves the second light shield from the outside of the substrate toward the center of the substrate. The first light-shielding body and the second light-shielding body are arranged at different positions in the light beam irradiation direction.
With this configuration, it is possible to perform exposure corresponding to each shape even when the substrate size is different, or when the wafer has a notch or when light shielding is performed corresponding to each chip on the wafer.

  By providing the projection exposure apparatus with at least two movable light-shielding bodies, it is possible to realize a light-shielding mechanism with a short time required for attaching and detaching the light-shielding body accompanying the replacement of the substrate. In addition, since the light-shielding member can be easily attached and detached in a short time, the substrate can be exchanged reliably and in a short time. In addition, by providing two sets of light shields, even if the substrate size is different, the same size even for different light shield areas, and even when the same substrate is exposed with different light shield areas, the light shields can be removed. It is possible to realize a light shielding mechanism with a short required time.

<Schematic Configuration of Projection Exposure Apparatus 100>
FIG. 1 is a schematic side view of the projection exposure apparatus 100.
The projection exposure apparatus 100 is roughly divided into a light source 10 that irradiates a light beam in a wavelength region including ultraviolet rays, an illumination optical system 30 that collects the light beam from the light source 10, a mask stage 40 that holds a photomask M, and a projection. An optical system 50 and a substrate stage 60 are provided.

  An illumination optical system 30 for uniformly illuminating the photomask M supported in parallel with the XY plane on the mask stage 40 is provided. The illumination optical system 30 includes a light source 10 made of, for example, a mercury short arc lamp close to a point light source. Since the light source 10 is disposed at the first focal position of the elliptical mirror 11, the illumination light beam emitted from the light source 10 forms a light source image at the second focal position of the elliptical mirror via the dichroic mirror 12. The dichroic mirror 12 does not reflect light outside the predetermined wavelength range. The light source 10 has an optical path taken from the bottom to the top, but the light path may be taken from the top to the bottom. The light source 10 included in the illumination optical system 30 may be an ultraviolet radiation type LED (Light Emitting Diode).

  A shutter 13 is disposed at the second focal position of the elliptical mirror. The exposure light reaching the substrate CB is blocked by the shutter 13. The divergent light from the light source image is converted into a parallel light beam by the collimator lens 31 and enters the wavelength selection unit 15. The wavelength selection unit 15 is configured to be inserted into and removed from the optical path between the light source 10 and the photomask M.

The light beam that has passed through the wavelength selector 15 passes through the fly-eye lens 32 and the condenser lens 33 in order.
The light beam that has passed through the wavelength selector 15 enters the fly-eye lens 32. The fly-eye lens 32 has a large number of positive lens elements arranged vertically and horizontally and densely so that the center axis extends along the optical axis OA. Therefore, the light beam incident on the fly-eye lens 32 is wavefront-divided by a large number of lens elements, and forms a secondary light source comprising the same number of light sources as the number of lens elements on the rear focal plane (ie, in the vicinity of the exit surface). .

  Light beams from a number of secondary light sources formed on the rear focal plane of the fly-eye lens 32 enter the condenser lens 33. The light flux through the condenser lens 33 illuminates the photomask M on which the pattern is formed in a superimposed manner. The light beam illuminated by the exposure light and transmitted through the photomask M is directed to the projection optical system 50, and then irradiated to the substrate CB that is an exposure target.

  FIG. 2 is a schematic perspective view of the reflective exposure apparatus 100 excluding the illumination optical system 30. The mask stage 40, the reflective projection optical system 50, and the substrate stage 60 are shown in an exploded manner and placed on the substrate stage 60. An exploded view of the shading device 80 is also shown.

  The mask stage 40 has a Y stage 41 for moving the photomask M along the Y-axis direction that is the scanning direction. The Y stage 41 has a long stroke, and a step-and-scan exposure method is possible. The Y stage 41 is driven at high speed and with high accuracy by linear motors 42 arranged on both sides thereof. The Y stage 41 has an Xθ stage 45 that moves in the θ rotation direction with respect to the X axis direction and the Z axis. The Xθ stage 45 is driven by a ball screw and a drive motor. The Xθ stage 45 has a moving mirror 48, and the position coordinate of the photomask M is measured by a laser interferometer using the moving mirror 48 and the position is controlled. Further, the Xθ stage 45 is configured such that the position in the Z-axis direction is variable.

  The projection optical system 50 is a reflection type projection optical system called an Offner type. In addition to the reflecting mirror, the reflecting projection optical system 50 is equipped with a fixed mirror for measurement by a laser interferometer.

  The substrate stage 60 mounts a substrate CB, for example, an electronic circuit substrate, a liquid crystal element glass substrate, or a PDP glass element substrate. The substrate stage 60 has a long stage for moving along the Y-axis direction that is the scanning direction, and the X stage when the Y stage 61 is moved along the X-axis direction that is the scanning orthogonal direction. 65. The position coordinates of the substrate stage 60 are measured and controlled by a laser interferometer (not shown) using a moving mirror (not shown). The substrate stage 60 is also configured to be movable in the Z-axis direction like the mask stage 40. The Y stage 61 and the X stage 65 are respectively driven at high speed and with high accuracy by the linear motor 62 and the linear motor 66 arranged on both sides thereof.

  The substrate table 60 is provided with a vacuum chuck 69 for placing the substrate CB and sucking the substrate CB. The vacuum chuck 69 is made of ceramic, and can hold the substrate CB by suction using a vacuum pump (not shown). In addition to the vacuum chuck, an electrostatic chuck can be used.

  Further, the focus detection device (not shown) detects the in-focus position of the substrate CB, and the substrate table 60 also moves in the Z-axis direction. In this way, the light beam reflected by the Offner reflection type projection optical system 50 enters the substrate CB and forms an image on the substrate CB. That is, a pattern image of the photomask M is formed on the substrate CB, and this image is transferred onto the substrate CB by the photoresist applied on the substrate CB.

  The substrate table 60 includes a light shielding device 80 around the vacuum chuck 69. The light shielding device 80 can shield the peripheral portion of the substrate CB held by suction. By installing the light shielding unit 80 on the substrate stage 60, the light shielding unit 80 can move in the X-axis direction, the Y-axis direction, and the Z-axis direction with respect to the optical axis OA of the projection optical system 50.

  In the reflection type exposure apparatus 100, all members are mounted on the vibration isolation mount 71 in order to improve exposure accuracy. First, on the four anti-vibration mounts 71, a base 72 made of a stone surface plate, alumina ceramic or metal is mounted. A substrate stage 60 is mounted on the base 72. Further, a lens barrel support base 73 is mounted on the base 72 while avoiding the movement range of the substrate stage 60. A reflective projection optical system 50 is mounted on the lens barrel support base 73. A mask stage support 75 is mounted on the lens barrel support 73. A mask stage 40 is mounted on the mask stage support 75.

<Schematic Configuration of Light Shielding Device 80>
FIG. 3 is an exploded view of the light shielding device 80. The light shield device 80 includes a circular unit base 81, a ring-shaped groove cam 82, a ring-shaped housing 83, a plurality of first light shields 84, and a ring-shaped cover 85.

  The unit base 81 includes a vacuum chuck 69 for fixing the substrate CB, a drive unit 86 for moving the groove cam 82 in the rotation direction, and a lifting cylinder 87 for moving the first light shield 84 up and down.

  A vacuum chuck 69 is disposed at the center of the unit base 81, and a space 81 </ b> S is formed between the outer periphery of the vacuum chuck 69 and the outer periphery of the unit base 81. The first light shield 84 is accommodated in the space 81S. The space 81S includes an elevating cylinder 87 having a cylinder pin 88 that moves up and down. The lifting cylinder 87 is an electric motor or an air cylinder. The drive unit 86 is also an electric motor or an air cylinder.

  The groove cam 82 has a first groove portion 90 and a second groove portion 91 formed at a plurality of locations. The first groove portion 90 of the groove cam 82 is a hole through which the cylinder pin 88 of the elevating cylinder 87 passes, and the hole is formed in a circumferential shape so that even if the groove cam 82 rotates in the circumferential direction, The structure does not interfere. In this embodiment, since the three raising / lowering cylinders 87 are provided, the three 1st groove parts 90 should just be provided. The second groove portion 91 is a groove that connects the vicinity of the outer periphery and the vicinity of the inner periphery of the groove cam 82. A sliding guide pin 94 (FIG. 5) connected to the first light shield 84 is inserted into the second groove portion 91. In the present embodiment, eight second groove portions 91 are provided.

  The housing 83 has a sliding movement guide 93. The sliding movement guide 93 has a through hole, and a guide pin 94 (FIG. 5) is inserted into the through hole. The sliding movement guide 93 is movable in the radial direction from the center of the housing 83, and the sliding movement guide 93 moves in the radial direction in accordance with the movement of the guide pin 94. In this embodiment, eight sliding movement guides 93 are provided, and eight guide pins 94 are similarly used.

  A plurality of first light shields 84 are installed on the entire outer periphery so as to surround the substrate CB, and a plurality of sheets form a ring shape. The first light shield 84 blocks the exposure light on the irradiated substrate CB so that the negative photoresist is not exposed.

  The first light shield 84 receives heat in order to shield the light of the light source 10 incident via the projection optical system 50. Since heat generation may cause deformation of the first light shield 84, the material of the plurality of first light shields 84 is a titanium alloy with a heat-resistant coating, or an Invar alloy made of Fe-36Ni with a low thermal expansion coefficient. Alternatively, Kovar alloy made of Fe29Ni-17Co or ceramic is used. In this embodiment, it consists of the four 1st light-shielding bodies 84, and each is connected to the two sliding movement guides 93 and the guide pin 94 (FIG. 5). The four first light shields 84 are movable in the radial direction from the optical axis OA.

  The first light shield 84 can employ various shapes other than the shape shown in FIG. Details will be described with reference to FIG.

  FIG. 4 is an enlarged perspective view showing the configuration of the drive portion 86 and the groove cam 82 of the unit base 81. In order to facilitate understanding, the unit base 81, the housing 83, and the first light shield 84 are not shown.

  The drive unit 86 includes a shaft motor 95 and an encoder 96. The shaft motor 95 is a motor that moves reciprocally in the linear direction (arrow AR1 direction) with the shaft 95S as a guide. The amount of movement of the shaft motor 95 is measured by the encoder 96, whereby the movement distance is obtained. The shaft motor 95 is connected to the connection pin 98 and moves in the direction of the arrow AR1. Further, the connection pin 98 can move the guide 99 in the arrow AR2 direction orthogonal to the arrow AR1 direction. The connection pin 98 is connected to the groove cam 82. Therefore, the groove cam 82 can move in the circumferential direction (arrow AR3 direction). That is, the connection pin 98 is movable in the two-dimensional direction, so that the vertical movement (arrow AR1 direction) of the shaft motor 95 is converted into the movement of the groove cam 82 in the rotational direction (arrow AR3 direction).

  An air cylinder may be used instead of the shaft motor 95, and a sensor for detecting the start point and the end point may be used instead of the encoder 96. Since the drive unit 86 has a structure for rotating the groove cam 82 in the circumferential direction, the drive unit 86 is not limited to the structure shown in FIG. 4 as long as it has a function of rotating the groove cam 82 in the circumferential direction.

  FIG. 5 is an enlarged perspective view showing a configuration in the vicinity of the groove cam 82 in which the unit base 81 and the housing 83 are omitted for easy understanding. Only one sheet of the first light shield 84 shown in FIG. 5 is drawn. The first light shield 84 has a thick light shield 84C having a large thickness and a thin light shield 84N having a small thickness on both sides thereof. The thin light-shielding portions 84N of the adjacent first light shielding bodies 84 overlap with each other so that a gap, that is, a region that cannot be shielded from light is not generated between the adjacent first light shielding bodies 84. Note that the first light shields 84 may be arranged stepwise in the optical axis direction without providing the thin light shields 84 so that no gap is provided between the adjacent first light shields 84.

  The groove cam 82 moves in the rotation direction (arrow AR3 direction) when the drive unit 86 operates. A plurality of rotation guides 92 (upper rotation guide 92a and lower rotation guide 92b) are installed on the outer periphery of the groove cam 82, and can smoothly rotate about the rotation center of the groove cam 82. The rotation guide 92 is fixed to the unit base 81, and includes an upper rotation guide 92 a that forms a flange above the rotation guide 92 and a lower rotation guide 92 b that forms a flange below the rotation guide 92. Rotation without blurring in the direction can be performed. The movable range of the rotation operation is the range of the shape of the first groove portion 90 and the second groove portion 91.

  The elevating cylinder 87 lifts the housing 83 so that the first light shield 84 placed on the housing 83 is also lifted. A sliding movement guide 93 is installed in the housing 83, and a first light shield 84 is fixed to the sliding movement guide 93 with a fixing screw 93S. A sliding guide pin 94 is provided below the sliding movement guide 93, and the sliding guide pin 94 is inserted into the hole of the second groove portion 91 of the groove cam 82.

  For this reason, the sliding guide pin 94 moves along the hole of the second groove portion 91 so that the sliding movement guide 93 moves in the radial direction (arrow AR4 direction), and the first light shield 84 connected to the sliding movement guide 93 is provided. It moves in the radial direction (arrow AR4 direction). That is, in the light shield device 80, the plurality of first light shields 84 can move in the radial direction (arrow AR4 direction) simultaneously by the operation of the drive unit 86. Even if the plurality of first light shielding bodies 84 move in the radial direction, the thin light shielding portions 84N of the adjacent first light shielding bodies 84 do not interfere with each other. Further, the gap between the adjacent first light shielding bodies 84 is completely shielded from light.

  The cover 85 is connected to the housing 83. The cover 85 is installed without interfering with the operation of the first light shield 84, and conversely, the first light shield 84 and the like to the substrate CB such as the first light shield 84 so that dust does not enter the first light shield 84 and the like. It serves to keep dust out. In a state where the first light shield 84 does not shield the substrate CB, the light shield device 80 is entirely covered with the cover 85 and the housing 83. In the light irradiation range of the light source 10, heat is generated by light irradiation. For this reason, the cover 85 and the housing 83 are also formed of a material with little thermal deformation. The light shielding device 80 may draw air by connecting a pipe of a vacuum pump to the housing 83 to create an air flow to increase the temperature and remove dust.

  With the configuration of the light shielding device 80 described above, the projection exposure apparatus 100 of the present embodiment can form a light shielding band on the entire periphery of the substrate CB with the first light shielding body 84 on the negative photoresist applied to the substrate CB. In addition, it is possible to eliminate the cause of particles such as photoresist residues. The following shows the configuration of the first light shield 84.

<Configuration of the first light shield 84>
The case where the first light shield 84 is applied to the substrate CB coated with a negative photoresist will be described with respect to the shape, configuration and movement of the first light shield 84. As described above, the plurality of first light shields 84 can shield the peripheral portion of the substrate CB coated with the negative photoresist by operating the driving unit 86 and the lifting cylinder 87.

  FIG. 6A is a top view showing the substrate CB and the state in which the four first light shields 84 are in the retracted position. FIG. 6B is a diagram showing the first light shield 84 shielded on the substrate CB. It is the top view which showed the state arrange | positioned in the position.

  In the light shield device 80 of the present embodiment, the first light shield 84 is moved away from the substrate CB as shown in FIG. 6A, and the substrate center (optical axis OA) as shown in FIG. 6B. Move toward As shown in FIG. 6A, the thin light shielding portions 84N of the adjacent first light shielding bodies 84 overlap each other, and there is no gap between the adjacent first light shielding bodies 84. Even when the peripheral portion of the substrate CB is covered as shown in FIG. 6B, there is no gap between the adjacent first light shielding bodies 84. Therefore, the light shielding device 80 can shield the entire peripheral portion of the substrate CB. In addition, although the light shielding body device 80 of the present embodiment linearly moves the plurality of first light shielding bodies 84 simultaneously toward the optical axis OA, it is a mechanism that approaches the optical axis OA while rotating. It doesn't matter.

  FIG. 7 shows a flowchart of the operation of the first light shield 84 in the light shield device 80 of the present embodiment. The right side of the flowchart is a cross-sectional view showing the relationship between the substrate CB and the light shielding unit 80 in each step.

  In step S <b> 1, the elevating cylinder 87 raises the housing 83 and raises the first light shield 84 placed on the housing 83. As shown in the right diagram of step S1, first, a first light shield 84 (shown by a broken line) is disposed below the substrate CB. When the first light shield 84 rises, it rises to the position of the first light shield 84 indicated by a solid line.

  In step S2, the grooved cam 82 is rotated by the operation of the shaft motor 95 of the drive unit 86. As the groove cam 82 rotates about the optical axis OA, the plurality of first light shields 84 simultaneously move toward the substrate center O. As shown in the right diagram of step S2, the first light shield 84 protrudes from between the housing 83 and the cover 85 toward the optical axis OA.

  In step S3, the elevating cylinder 87 lowers the housing 83 to a predetermined position, and lowers the first light shield 84 placed on the housing 83 to a predetermined position. As shown in the right diagram of step S3, the housing 83, the first light shield 84, and the cover 85 are lowered to a position where the first light shield 84 does not contact the substrate CB. This is to prevent the light source 10 from irradiating the substrate CB and the reflected light from entering the lower side of the first light shield 84.

  The lowered position of the first light shield 84 is a position that does not contact the substrate CB, but may be lowered until it contacts the peripheral portion of the substrate CB. In this case, there is also an advantage that even if the substrate CB is warped, the substrate CB can be pressed against the substrate table and reliably adsorbed by the contact.

  The substrate CB that has been subjected to the light shielding process of the first light shield 84 is then moved to an exposure process. When the exposure process is completed, the light shield device 80 moves the first light shield 84 to the retracted position in order to replace the substrate CB. The movement to the retreat position can be performed by processing the flowchart of FIG. 7 in the reverse procedure. That is, the first light shield 84 in the state shown in the right diagram of step S3 is raised by the elevating cylinder 87. Next, the grooved cam 82 is rotated in the reverse direction by the operation of the shaft motor 95 for the first light-shielding body 84 in the state shown in the right diagram of step S2. Next, the first light shield 84 in the state shown in the right diagram of step S <b> 1 can be moved to the retracted position by lowering the elevating cylinder 87.

  As described above, in the light shielding device 80 of the present embodiment, the first light shielding body 84 can be installed and retracted by a very simple operation and a short movement. Installation and evacuation can be handled in a short time, and there is almost no waste lifting.

  As explained abnormally, the height of the first light shield 84 is changed by raising and lowering the lift cylinder 87, and when replacing the substrate CB, the lift cylinder 87 is lowered and placed at the standby position of the first light shield 84, Interference is prevented when replacing the substrate CB.

<Shape of the first light shield>
FIG. 8 is a modification regarding the shape of the first light shield 84. The shape of the first light shield 84 of the present embodiment can take various shapes as shown below. In FIG. 8, the thin light-shielding portion 84N is not drawn.

  The first light shield 84-1 shown in FIG. 8A is formed in a shape in which one side of the triangle is arcuate. In FIG. 6A, the first light shield 84 has a ring shape that is divided into four parts. However, the shape may be any shape as long as it is easy to manufacture, and it is not divided into four parts. It may be a divided shape.

  Moreover, the 1st light shielding body 84-2 or the 1st light shielding body 84-3 shown in FIG.8 (b) or FIG.8 (c) is a light shielding body in case the board | substrate CB has orientation flat OF and notch NT. A shape corresponding to the position of the orientation flat OF or the notch NT is created in one of the four first light shields 84 to correspond to the light shielding region.

  A first light shielding body 84-4 shown in FIG. 8D shows a light shielding body when the shape of the light shielding region is formed in accordance with the arrangement state of the semiconductor chips exposed on the substrate CB. The first light shield 84-4 shown in FIG. 8D is prepared in a shape corresponding to the exposure area of the substrate CB, so that unnecessary exposure areas can be eliminated as much as possible.

<Combination of first light shield and second light shield>
FIG. 9 shows another light shielding device 80 ′ having two sets of a first light shielding body 84 and a second light shielding body 89. Another light shielding device 80 ′ includes a first light shielding body 84 and a second light shielding body 89 corresponding to the shapes of substrates CB having different diameter sizes, for example, an 8-inch semiconductor wafer and a 12-inch semiconductor wafer. It has.

  The housing 83 ′ is configured in two layers, and the first light shield 84 and the second light shield 89 are installed therein. Further, groove cams 82a and 82b for moving the first light shielding body 84 and the second light shielding body 89 in the optical axis direction are prepared, and a drive unit 86 (not shown in FIG. 9) is also prepared. The first light-shielding body 84 and the second light-shielding body 89 shield the periphery of the substrate CB by performing the processing shown in the flowchart described in FIG.

  That is, the first light shield 84 and the second light shield 89 can raise the housing 83 by the lifting cylinder 87. In the case of a 12-inch semiconductor wafer, the grooved cam 82a can be rotated to move the first light shield 84 toward the optical axis OA. In the case of an 8-inch semiconductor wafer, the groove cam 82b is rotated to move the second light shield 89 having a long moving distance toward the optical axis OA. Next, the first light shielding body 84 and the second light shielding body 89 are lowered to a position close to the substrate CB by the lifting cylinder 87. Then, exposure is performed on a 12-inch semiconductor wafer or an 8-inch semiconductor wafer.

  As described above, by preparing a plurality of types of light shielding parts for each size of the substrate CB, it is possible to reduce the work of attaching and replacing the light shielding parts in a series of exposure steps, and the projection exposure apparatus 100 is efficient. It can be operated.

  In the above-described embodiment, the description has been made on the assumption that the first light-shielding body and the second light-shielding body have different diameter sizes. However, the present invention is not limited to this, and the first light shielding body and the second light shielding body can also be used for the substrate CB having the same diameter size and different light shielding regions. For example, the first light shielding body 84-3 shown in FIG. 8C and the first light shielding body 84-4 shown in FIG. 8D are accommodated in the housing 83 ′ having a two-layer structure shown in FIG. . And with the change of the pattern shape accompanying the change of the photomask M, the 1st light shielding body 84-3 and the 1st light shielding body 84-4 can be switched. As a result, the replacement of the light shielding body accompanying the change of the photomask M can be omitted, and the dust can be prevented from being rolled up when the light shielding body is replaced.

1 is a schematic side view of a projection exposure apparatus 100. FIG. 1 is a schematic perspective view of a reflective exposure apparatus 100 excluding an illumination optical system 30. FIG. 3 is an exploded perspective view of the light shielding device 80. FIG. FIG. 6 is an enlarged perspective view showing the configuration of a drive unit 86 and a groove cam 82. FIG. 6 is an enlarged perspective view showing a configuration in the vicinity of a groove cam 82. (A) is the top view which showed the state which has the board | substrate CB and the four 1st light-shielding bodies 84 in a retracted position. (B) is a top view showing a state in which the first light shield 84 is arranged at a predetermined position on the substrate CB. The flowchart of operation | movement of the 1st light-shielding body 84 in the light-shielding body apparatus 80 of this embodiment is shown. (A) is the figure which showed the 1st light-shielding body 84 of a shape where the base of a triangle became circular arc shape. (B) is the figure which showed the 1st light-shielding body 84 in case there exists an orientation flat. (C) is the figure which showed the 1st light-shielding body 84 in case there exists a notch. (D) is the figure which showed the 1st light-shielding body 84 at the time of forming the shape of a light-shielding area intricately. It is a side view of light-shielding-body apparatus 80 'at the time of providing two sets of light-shielding body parts, the 1st light shielding body 84 and the 2nd light shielding body 89.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Light source 11 ... Elliptical mirror 12 ... Dichroic mirror 13 ... Shutter 15 ... Wavelength selection part 30 ... Illumination optical system 31 ... Collimating lens, 32 ... Fly eye lens, 33 ... Condenser lens 40 ... Mask stage 41 ... Y stage, 42 ... Linear motor, 45 ... Xθ stage 48 ... Moving mirror 50 ... Projection optical system 60 ... Substrate stage, 61 ... Y stage, 62 ... Linear motor 65 ... X stage, 66 ... Linear motor 69 ... Vacuum chuck 71 ... Anti-vibration mount, 72 ... Base, 73 ... Lens barrel support base 75 ... Mask stage support base 80, 80 '... Shading device 81 ... Unit base 82 (82a, 82b) ... Groove cam 83, 83' ... Housing 84 (84-1, 84) -2, 84-3, 84-4) ... 1st shielding Light body 85 ... Cover 86 ... Drive part 87 ... Elevating cylinder 88 ... Cylinder pin 89 ... Second light shield 90 ... First groove part, 91 ... Second groove part 92 ... Rotating guide (92a ... Upper rotating guide, 92b ... Lower rotating guide )
93 ... Movement guide 94 ... Sliding guide pin 95 ... Shaft motor 95S ... Shaft 96 ... Encoder 98 ... Connection pin 99 ... Guide 100 ... Projection exposure apparatus CB ... Substrate OA ... Optical axis OF ... Orientation flat, NT ... Notch M ... Photomask

Claims (7)

In a projection exposure apparatus that irradiates a light beam including ultraviolet rays onto a mask and exposes a light beam that has passed through the mask through a projection optical system onto a substrate coated with a negative photoresist,
At least two first light shields for shielding the exposure light;
A first moving unit that moves the first light shield from the outside of the substrate toward the center of the substrate;
The projection exposure apparatus characterized in that when the first light shield is moved toward the center of the substrate, the first light shield shields the entire peripheral portion of the substrate. The projection exposure apparatus according to claim 1, wherein the shape of the center side of the first light shield is an arc. The projection exposure apparatus according to claim 1, wherein the shape of the first light shielding body on the center side is a straight line. 4. The projection exposure apparatus according to claim 1, further comprising an elevating unit configured to move the first light shielding body in the irradiation direction of the light beam. The said 1st light-shielding body has a thick part and the thin part of the both sides, The thin part of the adjacent 1st light-shielding body mutually overlaps, The any one of Claims 1-4 characterized by the above-mentioned. The projection exposure apparatus according to item. A substrate table provided with a suction chuck for sucking the substrate;
A stage that moves the substrate table in a plane that intersects the irradiation direction of the light beam, and the stage moves the first light shield and the first moving unit in the plane. The projection exposure apparatus according to any one of claims 1 to 5. At least two second light shields different in shape from the first light shield;
A second moving unit that moves the second light shield from the outside of the substrate toward the center of the substrate,
The projection exposure according to any one of claims 1 to 6, wherein the first light shielding body and the second light shielding body are arranged at different positions in the irradiation direction of the light beam. apparatus.