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JP2009231048A - Method of manufacturing illuminating device, liquid crystal device, and light guide plate - Google Patents

Method of manufacturing illuminating device, liquid crystal device, and light guide plate Download PDF

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JP2009231048A
JP2009231048A JP2008075086A JP2008075086A JP2009231048A JP 2009231048 A JP2009231048 A JP 2009231048A JP 2008075086 A JP2008075086 A JP 2008075086A JP 2008075086 A JP2008075086 A JP 2008075086A JP 2009231048 A JP2009231048 A JP 2009231048A
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substrate
light
guide plate
light guide
liquid crystal
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Yasunori Onishi
康憲 大西
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Epson Imaging Devices Corp
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Epson Imaging Devices Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light guide plate capable of easily thickening the vicinity of its light-incident face and an illuminating device using the same. <P>SOLUTION: For the illuminating device provided with a light source, and a light guide plate guiding light from the light source, the light guide plate 100 includes a substrate 110' with translucency, and a protrusion 130' with translucency adjacent to an end face of the substrate and jointed to an edge of the surface 110b' of the substrate, an end face 110a' of the substrate and an end face 130a' of the protrusion are arranged in opposition to the light source. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は照明装置、液晶装置及び導光板の製造方法に係り、特に、光を端面より入射させて内部を伝播させつつ、一方の表面より出射する導光板の構造及び製造方法に関する。   The present invention relates to a lighting device, a liquid crystal device, and a method for manufacturing a light guide plate, and more particularly, to a structure and a method for manufacturing a light guide plate that emits light from one surface while allowing light to enter the end surface and propagate through the inside.

一般に、液晶表示体のバックライトなどに用いられる照明装置としては、LED(発光ダイオード)などの光源と、該光源と対向配置される光入射面を備えた導光板とを有するサイドライト型(エッジライト型)の照明装置が用いられている。このタイプの照明装置は厚みを低減できる点で優れているので、携帯電話などの携帯型電子機器に液晶表示体を搭載する場合に多く用いられる。   Generally, as an illumination device used for a backlight of a liquid crystal display or the like, a sidelight type (edge) having a light source such as an LED (light emitting diode) and a light guide plate having a light incident surface arranged to face the light source. Light type) lighting devices are used. Since this type of lighting device is excellent in that the thickness can be reduced, it is often used when a liquid crystal display is mounted on a portable electronic device such as a cellular phone.

近年、電子機器の薄型化が進むことにより、導光板への光の取込効率を確保しつつ、導光板の薄型化を図るために、光源側の光入射部において厚くするとともに光出射部において薄くしてなる導光板が用いられるようになってきている(例えば、以下の特許文献1参照)。通常このような導光板は射出形成によって製造される。   In recent years, as electronic devices have become thinner, in order to reduce the thickness of the light guide plate while ensuring the efficiency of taking light into the light guide plate, Thin light guide plates have been used (for example, see Patent Document 1 below). Usually, such a light guide plate is manufactured by injection molding.

一方、最近では電子機器のライフサイクルが短くなってきていることにより設計変更が頻繁に行われるようになってきているが、このような状況で上記照明装置の導光板を射出形成によって製造する場合には、設計変更の度に射出成形用の金型を作り変える必要があるため、迅速な対応が難しいとともに、金型の作成コストにより製造コストが増大するという問題がある。   On the other hand, recently, design changes are frequently made due to the shortening of the life cycle of electronic devices. In such a situation, the light guide plate of the lighting device is manufactured by injection molding. However, since it is necessary to remake the mold for injection molding every time the design is changed, there is a problem that it is difficult to respond quickly and the manufacturing cost increases due to the cost of creating the mold.

特開2005−339956号公報JP-A-2005-339956

そこで、本発明は上記問題点を解決するものであり、その課題は、簡単に光入射面の近傍を厚くすることのできる導光板及びこれを用いた照明装置を提供することにある。   Therefore, the present invention solves the above-described problems, and an object thereof is to provide a light guide plate that can easily increase the thickness of the vicinity of the light incident surface and an illumination device using the same.

上記問題点を解決するために、本発明の照明装置は、光源、及び該光源からの光を導光する導光板を具備する照明装置であって、前記導光板は、透光性を有する基板と、該基板の端面に隣接して前記基板の表面の縁部上に接合された透光性を有する突起部とを具備し、前記基板の端面と前記突起部の端面とが前記光源に対向するように配置されていることを特徴とする。   In order to solve the above-described problems, an illumination device of the present invention is a lighting device including a light source and a light guide plate that guides light from the light source, and the light guide plate is a light-transmitting substrate. And a light-transmitting protrusion that is bonded onto an edge of the surface of the substrate adjacent to the end surface of the substrate, the end surface of the substrate and the end surface of the protrusion facing the light source It arrange | positions so that it may do.

この発明によれば、透光性を有する基板の表面の縁部上に透光性を有する突起部が形成され、基板の端面と突起部の端面とが光源に対向するように配置されることにより、基板の端面と突起部の端面を光入射面とすることで光の取込効率の向上と薄型化を両立しつつ、基板をベースに製造できるため、設計変更に対する迅速な対応が可能になり、製造コストも低減できる。特により具体的で好ましい構成としては、導光板は、透光性を有する基板の端面に隣接して基板の表面の縁部上に透光性を有する突起部が接合され、前記基板の端面と前記突起部の端面が連続する面形状を構成し、前記突起部は、前記端面側から反対側へ前記基板の表面に向けて傾斜した表面形状を有する。   According to this invention, the light-transmitting protrusion is formed on the edge of the surface of the light-transmitting substrate, and the end surface of the substrate and the end surface of the protrusion are arranged so as to face the light source. This makes it possible to manufacture substrates based on the substrate while achieving both improved light capture efficiency and reduced thickness by using the end surface of the substrate and the end surface of the protrusion as the light incident surface, enabling quick response to design changes. Thus, the manufacturing cost can be reduced. As a particularly more specific and preferred configuration, the light guide plate is adjacent to the end surface of the light-transmitting substrate and has a light-transmitting protrusion on the edge of the surface of the substrate. The projecting portion has a continuous surface shape, and the projecting portion has a surface shape inclined from the end surface side to the opposite side toward the surface of the substrate.

本発明の一の態様においては、前記突起部の少なくとも一つが放射状に傾斜した傾斜面を有する。これによれば、突起部の端面より入射した光が上記傾斜面によって周囲に広がりながら基板内に向かうため、照明光の均一な輝度分布を容易に実現できる。この場合、単一の突起部が設けられて上記傾斜面を有していてもよく、複数の突起部が設けられ、そのうちの少なくとも一つが上記傾斜面を有していてもよい。   In one aspect of the present invention, at least one of the protrusions has an inclined surface that is radially inclined. According to this, the light incident from the end face of the protrusion is directed toward the inside of the substrate while spreading to the periphery by the inclined surface, so that a uniform luminance distribution of the illumination light can be easily realized. In this case, a single protrusion may be provided to have the inclined surface, or a plurality of protrusions may be provided, and at least one of them may have the inclined surface.

本発明の他の態様においては、前記突起部が前記基板の前記端面に沿った幅方向に延長された形状を有する。これによれば、突起部が基板の端面に沿った幅方向に延長された形状を有することにより、基板の端面及び突起部の端面に沿った幅方向に延長された光源を用い、或いは、当該幅方向に配列した複数の光源を用いることが可能になるので、広い光出射面を有する照明装置を実現できる。   In another aspect of the invention, the protrusion has a shape extending in the width direction along the end surface of the substrate. According to this, by using the light source extended in the width direction along the end surface of the substrate and the end surface of the protrusion, the protrusion has a shape extending in the width direction along the end surface of the substrate, or Since a plurality of light sources arranged in the width direction can be used, an illumination device having a wide light exit surface can be realized.

本発明の別の態様においては、複数の前記突起部が前記基板の前記端面に沿った幅方向に配列される。これによれば、複数の突起部を幅方向に配列させることで、当該幅方向に複数の光源を配列させる場合に、光源の配置箇所に対応した位置にそれぞれ突起部を設けることで、突起部の形成範囲を低減し製造コストを削減しつつ、光の取込効率を向上させることができる。   In another aspect of the invention, the plurality of protrusions are arranged in the width direction along the end face of the substrate. According to this, by arranging a plurality of projections in the width direction, when arranging a plurality of light sources in the width direction, by providing the projections at positions corresponding to the arrangement positions of the light sources, the projections The light capture efficiency can be improved while reducing the production range and the manufacturing cost.

この場合には、前記突起部が中央部から前記幅方向へ前記基板の表面に向けて傾斜する表面形状を有することが好ましい。これによれば、光の入射位置から斜め幅方向へ入射する光に対応させて各突起部の表面形状を構成できるので、光出射面より出射する光をより均一化できる。特に、突起部の平面形状が円弧状に形成され、前記突起部の中央から円弧状の側縁に向けて半径方向に放射状に傾斜した表面形状を有することが好ましい。   In this case, it is preferable that the protrusion has a surface shape that is inclined from the central portion toward the surface of the substrate in the width direction. According to this, since the surface shape of each protrusion can be configured corresponding to the light incident in the oblique width direction from the light incident position, the light emitted from the light emitting surface can be made more uniform. In particular, it is preferable that the planar shape of the protruding portion is formed in an arc shape and has a surface shape that is radially inclined in the radial direction from the center of the protruding portion toward the arc-shaped side edge.

また、本発明の液晶装置は、上述の照明装置と、駆動領域を備えた液晶パネルとを具備し、前記駆動領域が前記導光板の前記基板が露出した領域に平面的に重なるように前記液晶パネルを配置したことを特徴とする。   In addition, the liquid crystal device of the present invention includes the above-described illumination device and a liquid crystal panel including a drive region, and the liquid crystal device has a planar overlap with the region where the substrate of the light guide plate is exposed. A panel is arranged.

さらに、本発明の導光板の製造方法は、導光板の製造方法において、透光性の基板の表面上に未硬化材料を配置する材料配置工程と、前記未硬化材料を硬化させて積層体を形成する材料硬化工程と、前記基板を前記積層体とともに前記積層体の形成範囲内を通過する線に沿って切断する基板切断工程とを具備することを特徴とする。   Furthermore, the light guide plate manufacturing method of the present invention is a light guide plate manufacturing method in which a material disposing step of disposing an uncured material on a surface of a light-transmitting substrate, and curing the uncured material to form a laminate. It comprises a material curing step to be formed, and a substrate cutting step for cutting the substrate along a line passing through the formation range of the laminate together with the laminate.

この発明によれば、基板上に未硬化材料を配置し硬化させて積層体を形成した後に、基板を積層体とともに積層体の形成範囲内を通過する線に沿って切断することにより、残存した基板の端面と、当該基板の縁部上に残存した積層体の一部としての突起部の端面とが設けられ、これらの端面を光入射面として用いることのできる導光板が形成される。したがって、光の取込効率の向上と薄型化を両立した導光板を低コストで製造できるとともに、設計変更にも迅速に対応できる。特に、残存した基板の端面と突起部の端面とが連続した面形状となるように形成することができるので光の入射分布の均一化を図ることができ、また、積層体の残存した突起部を端面側から反対側へ基板の表面に向けて傾斜した表面形状を有するものとすることができるので、突起部の端面から入射した光の基板への取り込み効率をさらに向上させることができる。   According to the present invention, after the uncured material is placed on the substrate and cured to form a laminate, the substrate is left by cutting along the line passing through the formation range of the laminate together with the laminate. An end face of the substrate and an end face of the protrusion as a part of the laminated body remaining on the edge of the substrate are provided, and a light guide plate that can use these end faces as a light incident surface is formed. Therefore, it is possible to manufacture a light guide plate that achieves both improvement in light capture efficiency and thickness reduction at a low cost, and it is possible to respond quickly to design changes. In particular, since the end face of the remaining substrate and the end face of the protrusion can be formed into a continuous surface shape, the light incident distribution can be made uniform, and the remaining protrusion of the laminate can also be achieved. Can be made to have a surface shape that is inclined from the end surface side to the opposite side toward the surface of the substrate, so that the efficiency of capturing light incident from the end surface of the protruding portion into the substrate can be further improved.

本発明の一の態様においては、前記材料配置工程と前記材料硬化工程との間に、成形型によって前記未硬化材料を成形する材料成形工程をさらに具備する。材料成形工程をさらに設けることで、基板上に形成された積層体の形状を任意に成形できるので、残存した突起部の表面形状を最適化することができるため、導光板の光の取込効率のさらなる向上並びにさらなる薄型化を図ることが可能になる。   In one aspect of the present invention, a material molding step of molding the uncured material with a molding die is further provided between the material arranging step and the material curing step. By further providing a material molding process, the shape of the laminate formed on the substrate can be arbitrarily shaped, so the surface shape of the remaining protrusions can be optimized, and the light capture efficiency of the light guide plate Further improvement and further reduction in thickness can be achieved.

次に、添付図面を参照して本発明に係る導光板の製造方法の実施形態について詳細に説明する。   Next, an embodiment of a light guide plate manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

[第1実施形態]
最初に、図1乃至図5を参照して本発明に係る導光板及びその製造方法の実施形態について説明する。図1(a)は本発明に係る第1実施形態の導光板の製造方法における材料配置工程を模式的に示す概略縦断面図、図1(b)は第1実施形態の材料配置工程の完了後の状態を模式的に示す概略縦断面図、図2は第1実施形態の材料硬化工程を施した後の状態を模式的に示す概略平面図、図3は図2のIII−III′線に沿った断面を示す概略縦断面図、図4は材料切断工程により形成された導光板を示す概略平面図、図5は図4のV−V′線に沿って切断した断面を示す概略縦断面図である。
[First embodiment]
First, an embodiment of a light guide plate and a manufacturing method thereof according to the present invention will be described with reference to FIGS. FIG. 1A is a schematic longitudinal sectional view schematically showing a material arranging step in the light guide plate manufacturing method of the first embodiment according to the present invention, and FIG. 1B is a completion of the material arranging step of the first embodiment. 2 is a schematic longitudinal sectional view schematically showing the subsequent state, FIG. 2 is a schematic plan view schematically showing the state after the material curing step of the first embodiment, and FIG. 3 is a III-III ′ line in FIG. FIG. 4 is a schematic plan view showing a light guide plate formed by a material cutting process, and FIG. 5 is a schematic vertical cross section showing a cross section taken along the line VV ′ of FIG. FIG.

第1実施形態の導光板の製造方法は、平行平板状の透光性の基板110に対して、以下に説明する材料配置工程と、材料硬化工程と、基板切断工程とを順次施す方法である。   The light guide plate manufacturing method of the first embodiment is a method of sequentially performing a material arranging step, a material curing step, and a substrate cutting step, which will be described below, on a parallel plate-shaped translucent substrate 110. .

基板110は、透光性を有するものであれば如何なるものであってもよいが、透明な素材よりなる板状材料で構成されることが好ましい。透明な素材としては、通常、アクリル系樹脂、ポリカーボネート又はポリエステル等の樹脂材料、あるいはガラスや石英等の無機材料を用いることができる。基板110は板状(シート状)に構成されていればよいが、特に、取り扱いが容易となり、また、導光板の厚み寸法も所望の値に設定しやすいことから、均一な厚みを有する平行平板状とすることが製造上好ましい。さらに、割れにくく、しかも、巻取りなどが可能になる点で、基板110を可撓性を有する樹脂材料で構成することが製造上さらに望ましい。また、基板110を図1の左右方向に伸びる長尺材とすることで、さらに効率的な製造が可能になる。   The substrate 110 may be any material as long as it has translucency, but is preferably composed of a plate-like material made of a transparent material. As the transparent material, an acrylic resin, a resin material such as polycarbonate or polyester, or an inorganic material such as glass or quartz can be used. The substrate 110 only needs to be configured in a plate shape (sheet shape). In particular, since the handling becomes easy and the thickness dimension of the light guide plate can be easily set to a desired value, the parallel plate having a uniform thickness is used. It is preferable on manufacture that it is a shape. Furthermore, it is more desirable in manufacturing that the substrate 110 is made of a flexible resin material in that it is difficult to break and can be wound up. Further, by making the substrate 110 a long material extending in the left-right direction in FIG. 1, more efficient manufacturing becomes possible.

材料配置工程においては、図1(a)及び図1(b)に示すように、未硬化材料120を容器(ディスペンサ)Pから導出して基板110の一部表面上に配置する。ここで、未硬化材料120は、半固形状(ゲル状)若しくは液状の材料など、或る程度の流動性を有するものであればよい。たとえば、光硬化性又は熱硬化性の透光性樹脂(アクリル系樹脂、ポリカーボネート又はポリエステル等)の樹脂材料、水ガラスその他のシリケート材料等を用いることができ、基板110と少なくとも光学的に近似する特性を有するものが好ましい。また、耐衝撃性や耐熱性等の観点から見て基板110と同等の弾性率、熱膨張率を備えているものであればさらに好ましい。したがって、未硬化材料120は、後述する硬化後において基板110と略同材質となるものが最も望ましい。   In the material placement step, as shown in FIGS. 1A and 1B, the uncured material 120 is led out from the container (dispenser) P and placed on a partial surface of the substrate 110. Here, the uncured material 120 may be any material having a certain degree of fluidity, such as a semi-solid (gel) or liquid material. For example, a resin material such as a photocurable or thermosetting translucent resin (acrylic resin, polycarbonate, polyester, or the like), water glass, or other silicate material can be used, and at least optically approximates the substrate 110. Those having characteristics are preferred. Further, it is more preferable if it has an elastic modulus and a thermal expansion coefficient equivalent to those of the substrate 110 from the viewpoint of impact resistance and heat resistance. Therefore, the uncured material 120 is most preferably a material that is substantially the same material as the substrate 110 after curing, which will be described later.

上記材料配置工程において配置された未硬化材料120の表面120aは、未硬化材料120の流動性及び/又は表面張力に応じて基板110上で自ら所定の形状になる。図示例の場合、未硬化材料120は凸曲面状の表面120aを有している。また、未硬化材料120の配置範囲は、未硬化材料120の容器Pからの導出位置を移動させることで適宜に設定することができる。本実施形態では、たとえば、図2に示すように未硬化材料120を図1の紙面と直交する方向に延長された形状としている。未硬化材料120が配置された領域では、基板110と未硬化材料120の二層積層構造が形成され、未硬化材料120の配置されていない領域に比べて未硬化材料の厚み分だけ厚く形成される。   The surface 120a of the uncured material 120 disposed in the material disposing step has a predetermined shape on the substrate 110 according to the fluidity and / or surface tension of the uncured material 120. In the illustrated example, the uncured material 120 has a convexly curved surface 120a. Moreover, the arrangement range of the uncured material 120 can be appropriately set by moving the position where the uncured material 120 is led out from the container P. In the present embodiment, for example, as shown in FIG. 2, the uncured material 120 has a shape extended in a direction perpendicular to the paper surface of FIG. In the region where the uncured material 120 is disposed, a two-layer laminated structure of the substrate 110 and the uncured material 120 is formed, and is formed thicker by the thickness of the uncured material than the region where the uncured material 120 is not disposed. The

次に、図2及び図3に示すように、材料硬化工程を行う。この材料硬化工程では、未効果材料120が硬化されて固化された積層体130に転化し、積層体130は基板110に接合される。ここで、当該材料硬化工程は、未硬化材料120の特性に応じて種々の処理態様で実施できる。例えば、未硬化材料が光硬化性樹脂であれば光照射を施し、熱硬化樹脂であれば加熱処理を施す。さらに、揮発性溶媒等を含む未硬化材料120であれば単に静置して乾燥させたり、乾燥を促進するために加熱したりしてもよい。   Next, as shown in FIGS. 2 and 3, a material curing step is performed. In this material curing step, the ineffective material 120 is converted to a cured laminate 130 which is cured and solidified, and the laminate 130 is bonded to the substrate 110. Here, the material curing step can be performed in various processing modes according to the characteristics of the uncured material 120. For example, if the uncured material is a photocurable resin, light irradiation is performed, and if it is a thermosetting resin, heat treatment is performed. Furthermore, the uncured material 120 containing a volatile solvent or the like may be simply left to stand to dry, or may be heated to promote drying.

その後、基板切断工程を行う。この基板切断工程では、基板110を積層体130の形成された範囲を通過する所定の切断線A(図2に一点鎖線で示す)に沿って切断する。なお、切断線Aは図示例のような直線に限定されず、曲線であってもよい。図3において切断位置は一点鎖線Bで示されている。この切断位置Bにて基板110を切断することで、図4及び図5に示す切断面である端面100aが形成される。当該端面100aは残存した基板110′の端面110a′と残存した突起部130′の端面130a′で構成され、当該端面110a′と端面130a′とが相互に連続的に形成されることで、端面100aは一体の連続面形状とされる。また、端面100aの厚みは基板110′の厚みに比べて突起部130′の厚み分だけ厚く構成される。これによって基板110′及び突起部130′よりなる導光板100が構成され、その端面100aは光入射面となる。   Thereafter, a substrate cutting process is performed. In this substrate cutting step, the substrate 110 is cut along a predetermined cutting line A (indicated by a one-dot chain line in FIG. 2) passing through the range where the stacked body 130 is formed. Note that the cutting line A is not limited to a straight line as in the illustrated example, and may be a curved line. In FIG. 3, the cutting position is indicated by a one-dot chain line B. By cutting the substrate 110 at the cutting position B, an end surface 100a which is a cut surface shown in FIGS. 4 and 5 is formed. The end surface 100a is composed of the end surface 110a 'of the remaining substrate 110' and the end surface 130a 'of the remaining protrusion 130', and the end surface 110a 'and the end surface 130a' are continuously formed with each other. 100a is an integral continuous surface shape. Further, the thickness of the end face 100a is configured to be thicker by the thickness of the protrusion 130 'than the thickness of the substrate 110'. Thus, the light guide plate 100 composed of the substrate 110 ′ and the protrusion 130 ′ is formed, and the end surface 100 a becomes a light incident surface.

さらに、基板110′上の突起部130′は端面100aの側(図示左側)から反対側(図示右側)へ基板110の表面110bに向けて傾斜した傾斜面130b′を有する。この傾斜面130b′は、端面100aから入射した光を内面反射させて基板110′内へ戻す機能を有する。そして、端面100aから入射して内部を伝播する光は、最終的に突起部130′の形成されていない基板110′の表面部分(光出射面)から出射される。   Further, the protrusion 130 ′ on the substrate 110 ′ has an inclined surface 130 b ′ inclined toward the surface 110 b of the substrate 110 from the end surface 100 a side (the left side in the drawing) to the opposite side (the right side in the drawing). The inclined surface 130b 'has a function of reflecting the light incident from the end surface 100a into the substrate 110' by internally reflecting the light. Then, the light that is incident from the end face 100a and propagates inside is finally emitted from the surface portion (light emitting surface) of the substrate 110 ′ where the protrusion 130 ′ is not formed.

元の基板110が長尺物である場合、或いは、大判基板である場合には、その後、他の部分も適宜に切断して基板110′の端面100a以外の他の端面を形成し、例えば図4及び図5に示すように平面視矩形状とする。   If the original substrate 110 is a long object or a large substrate, then other portions are appropriately cut to form other end surfaces other than the end surface 100a of the substrate 110 ', for example, FIG. 4 and FIG.

上述のように製造された導光板100は、図4及び図5に示すように、光源141、142、143を端面100aに対向配置させることでサイドライト型の照明装置を構成できる。ここで、図示例の場合、突起部130′は端面100aの幅方向(図4の上下方向)に延長された形状を有し、複数の光源であるLED141、142、143が上記幅方向に所定間隔で配列される。   As shown in FIGS. 4 and 5, the light guide plate 100 manufactured as described above can constitute a sidelight type illumination device by disposing light sources 141, 142, and 143 so as to face the end surface 100 a. Here, in the illustrated example, the protrusion 130 ′ has a shape extending in the width direction (vertical direction in FIG. 4) of the end surface 100 a, and the LEDs 141, 142, and 143 that are a plurality of light sources are predetermined in the width direction. Arranged at intervals.

この第1実施形態においては、未硬化材料120を基板110上に配置し、未硬化材料120を硬化させて積層体130とした後、基板110を積層体130の形成範囲を通過する切断線Aに沿って切断することで、基板110′の端面110a′と突起部130′の端面130a′で構成される切断面である端面100aを備えた導光板100を形成できる。したがって、光の取込効率の向上及び薄型化を両立可能な導光板100を構成できるとともに、導光板100の設計変更の度に金型を作り直す必要がなく、設計変更に迅速に対応でき、しかも製造コストも低減できる。   In the first embodiment, the uncured material 120 is disposed on the substrate 110, and the uncured material 120 is cured to form the laminated body 130, and then the cutting line A passing through the formation range of the laminated body 130. The light guide plate 100 having the end surface 100a, which is a cut surface composed of the end surface 110a 'of the substrate 110' and the end surface 130a 'of the protrusion 130', can be formed. Therefore, the light guide plate 100 that can achieve both improvement in the efficiency of taking in light and reduction in thickness can be configured, and it is not necessary to remake a mold every time the design of the light guide plate 100 is changed. Manufacturing costs can also be reduced.

図示例の場合、突起部130′は基板110′の端面110a′の幅方向に沿って延長した形状とされて同様に延長された端面130a′を有するので、端面100aが幅方向に延長した形状となり、したがって、照明装置を構成する際に、当該延長形状の端面100aに沿って幅方向に複数のLED141,142,143を配列できる。なお、照明装置を構成するに当たっては、複数の光源を幅方向に配列するのではなく、単一の光源(例えば、LEDなどの点状光源、冷陰極管などの延長形状を有する線状光源)を配置してもよい。   In the case of the illustrated example, the protruding portion 130 ′ has a shape extending along the width direction of the end surface 110 a ′ of the substrate 110 ′ and has the end surface 130 a ′ extended in the same manner, so that the end surface 100 a extends in the width direction. Therefore, when configuring the lighting device, a plurality of LEDs 141, 142, and 143 can be arranged in the width direction along the extended end surface 100a. In configuring the lighting device, a plurality of light sources are not arranged in the width direction, but a single light source (for example, a point light source such as an LED or a linear light source having an extended shape such as a cold cathode tube). May be arranged.

[第2実施形態]
次に、図6及び図7を参照して本発明に係る第2実施形態について説明する。図6は第2実施形態の導光板の製造方法における材料配置工程を施した状態を模式的に示す概略平面図、図7は第2実施形態の材料切断工程を施した状態を模式的に示す概略平面図である。なお、本実施形態において第1実施形態と同一部分については同一符号を付しその説明は省略する。
[Second Embodiment]
Next, a second embodiment according to the present invention will be described with reference to FIGS. FIG. 6 is a schematic plan view schematically showing a state in which the material arranging step is performed in the light guide plate manufacturing method of the second embodiment, and FIG. 7 is a view schematically showing a state in which the material cutting step of the second embodiment is performed. It is a schematic plan view. In the present embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

図6に示すように、第2実施形態では、材料配置工程において、複数(図示3つ)の未硬化材料121、122、123を基板110の幅方向(図6の上下方向)に所定間隔を空けて配列させる。   As shown in FIG. 6, in the second embodiment, a plurality of (three in the figure) uncured materials 121, 122, and 123 are placed at predetermined intervals in the width direction of the substrate 110 (vertical direction in FIG. 6). Arrange them to be empty.

その後、材料硬化工程において未硬化材料121、122、123を硬化させて積層体131、132、133に転化させてから、基板切断工程において積層体131、132、133を通過し幅方向に沿って伸びる切断線Aに沿って切断して図7に示す導光板100を製造する。   Thereafter, the uncured materials 121, 122, and 123 are cured in the material curing process and converted into the stacked bodies 131, 132, and 133, and then passed through the stacked bodies 131, 132, and 133 in the width direction in the substrate cutting process. The light guide plate 100 shown in FIG. 7 is manufactured by cutting along the extending cutting line A.

図7に示すように、導光板100は、切断後に残存した突起部131′、132′、133′のそれぞれの形成範囲において厚みが拡大された端面部131a′、132a′、133a′を備えている。各端面部131a′、132a′、133a′は、第1実施形態と同様に相互に連続する基板110′の端面と各突起部131′、132′、133′の端面とによって構成される。そして、これらの端面部131a′、132a′、133a′に対向するように光源であるLED141、142、143をそれぞれ配置することで、サイドライト型の照明装置を構成できる。   As shown in FIG. 7, the light guide plate 100 includes end surface portions 131 a ′, 132 a ′, and 133 a ′ whose thickness is increased in the respective formation ranges of the protruding portions 131 ′, 132 ′, and 133 ′ remaining after cutting. Yes. Each end surface portion 131a ', 132a', 133a 'is constituted by the end surface of the substrate 110' and the end surfaces of the projections 131 ', 132', 133 'that are continuous with each other, as in the first embodiment. Then, by arranging the LEDs 141, 142, and 143, which are light sources, so as to face the end face portions 131a ', 132a', and 133a ', respectively, a sidelight type illumination device can be configured.

突起部131′、132′、133′は、それぞれが第1実施形態と同様に各端面部131a′、132a′、133a′の側(図示左側)から反対側(図示右側)へ基板110′の表面110b′に向けて傾斜した表面131b′、132b′、133b′を備えている。これによって光の入射する部分に対応させて端面部131a′、132a′、133a′を形成できるので、突起部131′、132′、133′の形成量及び形成範囲を低減し、製造コストを削減しつつ光の取込効率を高めることができる。   The protrusions 131 ′, 132 ′, and 133 ′ are formed on the substrate 110 ′ from the end surface portions 131 a ′, 132 a ′, and 133 a ′ (left side in the drawing) to the opposite side (right side in the drawing) as in the first embodiment. Surfaces 131b ', 132b', 133b 'inclined toward the surface 110b' are provided. As a result, the end face portions 131a ′, 132a ′, and 133a ′ can be formed corresponding to the light incident portion, so that the formation amount and formation range of the protrusion portions 131 ′, 132 ′, and 133 ′ are reduced, and the manufacturing cost is reduced. However, it is possible to increase the light capture efficiency.

また、上記第1実施形態とは異なり、当該表面131b′、132b′、133b′は、中央から幅方向(図示上下方向)へも表面110b′に向けて傾斜した面形状を備えている。特に図示例の場合、突起部131′、132′、133′は端面部131a′、132a′、133a′の反対側に円弧状の周縁を有し、当該周縁に向けて中央から放射状に傾斜する円錐状の表面形状を備える。これによって、光源から入射した光を均一に周囲に分散させることが可能となり、基板110′の表面110b′の光出射面より出射される照明光をより均一化することができる。   Unlike the first embodiment, the surfaces 131b ', 132b', 133b 'have a surface shape inclined from the center toward the surface 110b' in the width direction (the vertical direction in the figure). Particularly in the illustrated example, the protrusions 131 ′, 132 ′, 133 ′ have an arcuate periphery on the opposite side of the end surface portions 131 a ′, 132 a ′, 133 a ′, and are inclined radially from the center toward the periphery. It has a conical surface shape. As a result, the light incident from the light source can be uniformly dispersed in the periphery, and the illumination light emitted from the light exit surface of the surface 110b ′ of the substrate 110 ′ can be made more uniform.

[第3実施形態]
次に、図8を参照して本発明に係る第3実施形態について説明する。この実施形態でも、上記と同様の部分には同一符号を付し、それらの説明は省略する。
[Third Embodiment]
Next, a third embodiment according to the present invention will be described with reference to FIG. Also in this embodiment, the same parts as those described above are denoted by the same reference numerals, and description thereof will be omitted.

本実施形態では、図8(a)及び(b)に示すように上記各実施形態と同様に材料配置工程を実施し、基板110の表面上に未硬化材料120を配置する。しかし、本実施形態では、その後、図8(c)に示すように、成形型Qを用いて未硬化材料120を成形する材料成形工程を実施する。図示例では先の実施形態と同様の凸曲面状の表面を有するように未硬化材料120を成形している。そして、成形型Qにより成形された表面形状のまま未硬化材料120に対して材料硬化工程を実施する。ここで、成形型Qは未硬化材料120全体に限らず少なくとも一部の表面形状のみを成形するものでもよい。この材料成形工体は、必要に応じて周知の各種のインプリント技術を用いて容易に行うことができる。   In this embodiment, as shown in FIGS. 8A and 8B, the material placement step is performed in the same manner as in the above embodiments, and the uncured material 120 is placed on the surface of the substrate 110. However, in the present embodiment, thereafter, as shown in FIG. 8C, a material forming step of forming the uncured material 120 using the forming die Q is performed. In the illustrated example, the uncured material 120 is molded so as to have a convex curved surface similar to the previous embodiment. And a material hardening process is implemented with respect to the uncured material 120 with the surface shape shape | molded by the shaping | molding die Q. FIG. Here, the molding die Q is not limited to the entire uncured material 120, but may be one that molds at least a part of the surface shape. This material molding body can be easily performed using various known imprint techniques as required.

ここで、未硬化材料120が成形型Qによる成形時の形状を自ら保持できる程度のものであれば、成形型Qを取り外した後に上記と同様の材料硬化工程を実施する。また、未硬化材料120が上記成形時の形状を保持できないもの(例えば流動性の高いもの)である場合には、成形型Qによる成形状態を維持したまま材料硬化工程を実施すればよい。当該材料硬化工程を実施することで、図8(d)に示すように、成形された形状の表面130aを備えた積層体130が形成される。   Here, if the uncured material 120 is of a level that can hold the shape at the time of molding with the molding die Q, the material curing step similar to the above is performed after the molding die Q is removed. Further, when the uncured material 120 is a material that cannot retain the shape at the time of molding (for example, a material having high fluidity), the material curing process may be performed while the molding state of the molding die Q is maintained. By performing the material curing step, as shown in FIG. 8D, a laminated body 130 having a molded surface 130a is formed.

なお、その後、前述の各実施形態と同様に基板切断工程を実施することで導光板を製造することができる。   Thereafter, the light guide plate can be manufactured by performing the substrate cutting step in the same manner as in each of the above-described embodiments.

本実施形態では、成形型Qを用いて未硬化材料120の少なくとも一部を成形することから、積層体130の形状、特に表面130aの形状を任意の形状とすることができるため、先の実施形態と同様にして形成した突起部130′の厚み、突起部130′の傾斜面130b′の傾斜面形状などを適宜に設定でき、より光学的に高性能の導光板を製造することが可能になる。例えば、導光板あるいは照明装置としての光取込効率の向上、面内輝度の均一化などを図ることができる。   In the present embodiment, since at least a part of the uncured material 120 is molded using the molding die Q, the shape of the laminate 130, particularly the shape of the surface 130a, can be any shape. The thickness of the protruding portion 130 ′ formed in the same manner as the shape, the inclined surface shape of the inclined surface 130 b ′ of the protruding portion 130 ′, etc. can be set as appropriate, and a more optically high performance light guide plate can be manufactured. Become. For example, it is possible to improve the light capturing efficiency as a light guide plate or a lighting device and to make the in-plane luminance uniform.

[第4実施形態]
次に、図9を参照して本発明に係る第4実施形態について説明する。この実施形態でも、上記と同様の部分には同一符号を付し、それらの説明は省略する。
[Fourth Embodiment]
Next, a fourth embodiment according to the present invention will be described with reference to FIG. Also in this embodiment, the same parts as those described above are denoted by the same reference numerals, and description thereof will be omitted.

本実施形態では、図9(a)に示すように、未硬化材料120を第3実施形態と同様に成形型Rによって成形するが、成形型Rは内部に略平坦な若しくは傾斜角が相対的に小さい底部Raと、傾斜した若しくは傾斜角が相対的に大きい内側面部Rbとを有する溝状の成形面を有し、この成形面で成形した後に硬化させてなる積層体130は、図9(b)に示すように、光の入射方向となる長さ方向(図示左右方向)に、上記底部Raにより成形された略平坦な若しくは傾斜角が相対的に小さい頂部130cと、上記内側面部Rbにより成形された傾斜した若しくは傾斜角が相対的に大きい傾斜面部130dとが隣接して形成される。そして、このような表面形状を有する積層体130において、上記頂部130cを通過する切断位置Bで基板110を切断することにより、頂部130cで規定される厚みを有し、表面に傾斜面部130d全体を含む突起部を残存させることができる。したがって、切断位置Bが長さ方向に多少ずれた場合でも突起部の厚みを一定とすることができ、かつ、光のガイド面となる傾斜面部130dを高精度に形成できる。   In this embodiment, as shown in FIG. 9A, the uncured material 120 is molded by the molding die R as in the third embodiment, but the molding die R has a substantially flat or relatively inclined angle inside. A laminated body 130 having a groove-shaped molding surface having a small bottom portion Ra and an inner surface portion Rb that is inclined or has a relatively large inclination angle, and is cured after being molded on this molding surface is shown in FIG. As shown in b), in the length direction (the left-right direction in the figure) which is the incident direction of light, the top portion 130c formed by the bottom portion Ra and having a relatively small inclination angle and the inner side surface portion Rb. The formed inclined surface portion 130d that is inclined or has a relatively large inclination angle is formed adjacently. In the laminated body 130 having such a surface shape, the substrate 110 is cut at the cutting position B passing through the top portion 130c, thereby having a thickness defined by the top portion 130c, and the entire inclined surface portion 130d on the surface. The protrusion part containing can be left. Therefore, even when the cutting position B is slightly shifted in the length direction, the thickness of the protruding portion can be made constant, and the inclined surface portion 130d serving as the light guide surface can be formed with high accuracy.

なお、上記成形型Rでは、上記内側面部Rbとは底部Raを挟んだ反対側に逆向きに傾斜した内側面部Rcをさらに設けている。これにより、未硬化樹脂120の流動性に拘わらず、未硬化樹脂120を変形し易くすることができるので、成形を容易に行うことが可能になる。   The molding die R further includes an inner side surface portion Rc inclined in the opposite direction on the opposite side to the inner side surface portion Rb across the bottom portion Ra. Thereby, irrespective of the fluidity of the uncured resin 120, the uncured resin 120 can be easily deformed, so that molding can be easily performed.

[第5実施形態]
次に、図10を参照して本発明に係る第5実施形態について説明する。この実施形態でも、上記と同様の部分には同一符号を付し、それらの説明は省略する。
[Fifth Embodiment]
Next, a fifth embodiment according to the present invention will be described with reference to FIG. Also in this embodiment, the same parts as those described above are denoted by the same reference numerals, and description thereof will be omitted.

本実施形態では、図10(a)に示すように、成形型Sに傾斜した内側面部Saを有する溝状の成形面を設け、この内側面部Saによって、図10(b)に示すように、積層体130に傾斜した傾斜面部130eを形成している。また、上記内側面部Saに隣接して逆に傾斜した内側面部Sbを設け、この内側面部Sbによって、積層体130に逆向きに傾斜した傾斜面部130fを形成している。これによって、積層体130は上記長さ方向(図示左右方向)に見て高さが常に変化する形状とされる。   In the present embodiment, as shown in FIG. 10 (a), the molding die S is provided with a groove-shaped molding surface having an inclined inner surface portion Sa, and by this inner surface portion Sa, as shown in FIG. 10 (b), An inclined surface portion 130e is formed in the laminated body 130. In addition, an inner side surface portion Sb that is reversely inclined is provided adjacent to the inner side surface portion Sa, and an inclined surface portion 130f that is inclined in the reverse direction is formed on the stacked body 130 by the inner side surface portion Sb. As a result, the stacked body 130 has a shape in which the height always changes when viewed in the length direction (the left-right direction in the drawing).

本実施形態では、上記積層体130の切断位置Bを長さ方向に移動させることで、残存する突起部の形状を容易に変えることが可能になる。すなわち、同一の成形型Sを用いて積層体130を同一形状で形成しても、設計変更に応じて切断位置Bを長さ方向に調整することで、突起部130′の高さ(端面100aの厚み)を調整できるとともに、突起部130′の長さ方向の範囲をも調整できる。   In the present embodiment, it is possible to easily change the shape of the remaining protrusions by moving the cutting position B of the laminate 130 in the length direction. That is, even if the laminated body 130 is formed in the same shape using the same mold S, the height (end surface 100a) of the protrusion 130 'is adjusted by adjusting the cutting position B in the length direction according to the design change. The thickness of the protrusion 130 'can be adjusted.

[第6実施形態]
次に、図11を参照して本発明に係る第5実施形態について説明する。この実施形態でも、上記と同様の部分には同一符号を付し、それらの説明は省略する。
[Sixth Embodiment]
Next, a fifth embodiment according to the present invention will be described with reference to FIG. Also in this embodiment, the same parts as those described above are denoted by the same reference numerals, and description thereof will be omitted.

本実施形態では、図11(a)に示すように、未硬化材料120を容器P′から液滴Tとして吐出し、これを基板110の表面上に滴下する。そして、当該液滴Tを複数回滴下することで、図11(b)に示すように、所定量の未硬化樹脂120を配置し、上述と同様の材料硬化工程により積層体130を形成する。この後の工程は上記の各実施形態と同様に実施できる。   In this embodiment, as shown in FIG. 11A, the uncured material 120 is discharged from the container P ′ as a droplet T, and this is dropped onto the surface of the substrate 110. And by dripping the said droplet T several times, as shown in FIG.11 (b), predetermined amount uncured resin 120 is arrange | positioned and the laminated body 130 is formed by the material hardening process similar to the above. The subsequent steps can be performed in the same manner as in the above embodiments.

本実施形態では、複数の液滴Tを基板110上に着弾させることで、未硬化樹脂120の配置する位置及び範囲を定めることができるとともに、未硬化樹脂120の配置する量も精度よく設定できる。この場合、上記容器P′としてはプリンタ等に用いられるインクジェットヘッドを用いることができる。これによって液滴Tの吐出量をさらに正確に設定することができる。   In this embodiment, the position and range where the uncured resin 120 is disposed can be determined by landing a plurality of droplets T on the substrate 110, and the amount of the uncured resin 120 can be accurately set. . In this case, an ink jet head used for a printer or the like can be used as the container P ′. As a result, the discharge amount of the droplet T can be set more accurately.

上記液滴Tを複数回滴下させて所定量の未硬化樹脂120を基板110上に配置する場合、既に滴下された個々の液滴を基板110上で硬化させながら、更に液滴Tを滴下させていくことで、上記のような成形型を用いなくても、液滴Tの滴下位置、滴下密度、硬化速度に対する滴下速度の比等を調整することで、図11(b)に示すように各液滴Tに相当する積層材料を積み上げていく態様で、適宜の形状の積層体130を形成することが可能になる。   When a predetermined amount of the uncured resin 120 is disposed on the substrate 110 by dropping the droplet T a plurality of times, the droplet T is further dropped while curing each dropped droplet on the substrate 110. As shown in FIG. 11B, by adjusting the dropping position of the droplet T, the dropping density, the ratio of the dropping rate to the curing rate, and the like without using a molding die as described above. It is possible to form a laminated body 130 having an appropriate shape in a manner in which laminated materials corresponding to the respective droplets T are stacked.

なお、上述の各実施形態では、基板上に未硬化材料を配置してから硬化させることで突起部を形成しているが、例えば、予め形成した積層体若しくは突起部を基板上に配置すること(さらには接着したり溶着したりすること)で形成しても構わない。   In each of the above-described embodiments, the protrusion is formed by placing an uncured material on the substrate and then curing it. For example, a previously formed laminate or protrusion is placed on the substrate. (Further, it may be bonded or welded).

また、上述の各実施形態では、突起部に基板の表面に向けて傾斜した傾斜面を設けているが、突起部の傾斜面、或いは、任意の形状の表面上に反射層、反射板等の反射部材を配置することで、基板内への光の取り込み効率を高めることができる。   Further, in each of the above-described embodiments, the protrusion is provided with an inclined surface that is inclined toward the surface of the substrate. However, a reflective layer, a reflective plate, or the like is provided on the inclined surface of the protrusion or an arbitrarily shaped surface. By arranging the reflecting member, it is possible to increase the efficiency of taking light into the substrate.

[液晶装置]
次に、上記各実施形態の導光板100を備えた照明装置10及びこれを含む液晶装置1の構成について説明する。
[Liquid Crystal Device]
Next, the structure of the illuminating device 10 provided with the light-guide plate 100 of each said embodiment and the liquid crystal device 1 containing this is demonstrated.

照明装置10は、光源であるLED141と、上記基板110′及びこれに接合された突起部130′よりなる導光板100と、導光板100の好ましくは図示のように凹凸状の散乱構造(当該構造はたとえば特許文献2と同様の方法で形成できる。)が設けられた底面の下方に配置された反射シート145と、導光板100の表面に形成された光出射面である表面部100b(基板110′の表面110b′のうち、突起部130′が接合されずに露出した表面部分)上に配置された1又は複数枚の光学シート(光拡散板や集光板など)146と、を有している。そして、導光板100の光入射面となる端面100aは、対向するLED141の光放出面の高さ以上の厚みを備えている。   The illuminating device 10 includes an LED 141 as a light source, a light guide plate 100 including the substrate 110 ′ and a protrusion 130 ′ bonded thereto, and an uneven scattering structure of the light guide plate 100, preferably as shown in FIG. Can be formed, for example, by the same method as in Patent Document 2.) A reflection sheet 145 disposed below the bottom surface provided with a surface, and a surface portion 100b (substrate 110) which is a light emitting surface formed on the surface of the light guide plate 100. And one or a plurality of optical sheets (light diffusing plate, light condensing plate, etc.) 146 disposed on the surface 110b 'of the surface of ′ and exposed on the surface of the protruding portion 130 ′ that are not joined. Yes. And the end surface 100a used as the light-incidence surface of the light-guide plate 100 is equipped with the thickness more than the height of the light emission surface of LED141 which opposes.

LED141から放出された光は端面100aより導光板100の内部に入射し、突起部130′内に入射した光は傾斜面130b′で全反射された後に導光板100の基板110′の内部に入射する。そして、当該光は図示右方向に伝播しながら、底面上の上記散乱構造や反射シート145によって徐々に表面部100bから出射し、光学シート146を通過して図示上方を照明する。   The light emitted from the LED 141 enters the light guide plate 100 from the end surface 100a, and the light incident on the protrusion 130 'is totally reflected by the inclined surface 130b' and then enters the substrate 110 'of the light guide plate 100. To do. Then, while propagating in the right direction in the figure, the light is gradually emitted from the surface portion 100b by the scattering structure and the reflection sheet 145 on the bottom surface, passes through the optical sheet 146, and illuminates the upper part in the figure.

液晶装置1においては、上記照明装置10の上方に液晶パネル20が配置される。液晶パネル20は、ガラス等よりなる透明基板21と22をシール材23を介して貼り合わせ、その間に液晶24を封入してなるものであり、透明基板21,22の外面には必要に応じて偏光板25,26が配置される。透明基板21,22の内面には図示しない透明電極がそれぞれ形成され、これらの透明電極の対向する領域内に配置される液晶が画素を構成する。透明基板21には適宜FPC、ドライバIC等の電子部品27が実装される。   In the liquid crystal device 1, a liquid crystal panel 20 is disposed above the lighting device 10. The liquid crystal panel 20 is formed by laminating transparent substrates 21 and 22 made of glass or the like through a sealing material 23, and enclosing a liquid crystal 24 therebetween, and on the outer surfaces of the transparent substrates 21 and 22 as necessary. Polarizing plates 25 and 26 are arranged. Transparent electrodes (not shown) are formed on the inner surfaces of the transparent substrates 21 and 22, respectively, and the liquid crystal disposed in the area where these transparent electrodes are opposed constitutes a pixel. An electronic component 27 such as an FPC or a driver IC is appropriately mounted on the transparent substrate 21.

液晶パネル20の表示領域(駆動領域)Gは上記画素が配列されて所望の画像を表示できる領域であり、当該表示領域Gは、上記照明装置10内の導光板100の表面部100b内に収まるように平面的に位置決めされる。特に、液晶パネル20の照明装置10側の透明基板21の全体が上記表面部100b上に配置されるように構成すると、液晶装置1の全体の厚みをさらに低減できる。   The display area (driving area) G of the liquid crystal panel 20 is an area where the pixels are arranged and a desired image can be displayed. The display area G fits within the surface portion 100 b of the light guide plate 100 in the illumination device 10. So that it is planarly positioned. In particular, when the entire transparent substrate 21 on the lighting device 10 side of the liquid crystal panel 20 is arranged on the surface portion 100b, the entire thickness of the liquid crystal device 1 can be further reduced.

[電子機器]
最後に、上記各実施形態の液晶装置1を搭載した電子機器について説明する。図13は、本発明に係る電子機器の一実施形態である携帯電話機を示している。ここに示す携帯電話機200は、複数の操作ボタン、送話口などを備えた操作部201と、受話口などを備えた表示部202とを有し、表示部202の内部に上記の液晶装置1が組み込まれてなる。そして表示部202の表面(内面)上において液晶装置1の表示領域Gを視認することができるようになっている。この場合、携帯電話機200の内部には、上記液晶装置1を制御する後述する表示制御回路が設けられる。この表示制御回路は、液晶パネル20を駆動する公知の駆動回路に対して所定の制御信号を送り、液晶装置1の表示態様を決定する。
[Electronics]
Finally, an electronic apparatus equipped with the liquid crystal device 1 of each of the above embodiments will be described. FIG. 13 shows a mobile phone which is an embodiment of an electronic apparatus according to the present invention. A cellular phone 200 shown here includes an operation unit 201 having a plurality of operation buttons, a mouthpiece, and the like, and a display unit 202 having a mouthpiece and the like, and the liquid crystal device 1 described above is provided inside the display unit 202. Will be incorporated. The display area G of the liquid crystal device 1 can be viewed on the surface (inner surface) of the display unit 202. In this case, a display control circuit to be described later for controlling the liquid crystal device 1 is provided in the mobile phone 200. The display control circuit sends a predetermined control signal to a known drive circuit that drives the liquid crystal panel 20 to determine the display mode of the liquid crystal device 1.

図14は電子機器における液晶装置1に対する制御系(表示制御系)の全体構成を示す概略構成図である。ここに示す電子機器(上記携帯電話機200)は、表示情報出力源291と、表示情報処理回路292と、電源回路293と、タイミングジェネレータ294と、照明装置10への電力供給を行う光源制御回路295とを含む表示制御回路290を有する。また、液晶装置1には、上述の構成を有する液晶表示体である液晶パネル20と、この液晶パネル20を駆動する駆動回路29と、液晶パネル20を照明する照明装置10とが設けられている。   FIG. 14 is a schematic configuration diagram showing an overall configuration of a control system (display control system) for the liquid crystal device 1 in an electronic apparatus. The electronic device shown here (the mobile phone 200) includes a display information output source 291, a display information processing circuit 292, a power supply circuit 293, a timing generator 294, and a light source control circuit 295 that supplies power to the lighting device 10. A display control circuit 290 including Further, the liquid crystal device 1 is provided with a liquid crystal panel 20 that is a liquid crystal display body having the above-described configuration, a drive circuit 29 that drives the liquid crystal panel 20, and an illumination device 10 that illuminates the liquid crystal panel 20. .

表示情報出力源291は、ROM(Read Only Memory)やRAM(Random Access Memory)等からなるメモリと、磁気記録ディスクや光記録ディスク等からなるストレージユニットと、デジタル画像信号を同調出力する同調回路とを備え、タイミングジェネレータ294によって生成された各種のクロック信号に基づいて、所定フォーマットの画像信号等の形で表示情報を表示情報処理回路292に供給するように構成されている。   The display information output source 291 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. The display information is supplied to the display information processing circuit 292 in the form of an image signal or the like of a predetermined format based on various clock signals generated by the timing generator 294.

表示情報処理回路292は、シリアル−パラレル変換回路、増幅・反転回路、ローテーション回路、ガンマ補正回路、クランプ回路等の周知の各種回路を備え、入力した表示情報の処理を実行して、その画像情報をクロック信号CLKと共に駆動回路29へ供給する。駆動回路29は、走査線駆動回路、信号線駆動回路及び検査回路を含む。また、電源回路293は、上述の各構成要素にそれぞれ所定の電圧を供給する。   The display information processing circuit 292 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to obtain image information. Are supplied to the drive circuit 29 together with the clock signal CLK. The drive circuit 29 includes a scanning line drive circuit, a signal line drive circuit, and an inspection circuit. The power supply circuit 293 supplies a predetermined voltage to each of the above-described components.

光源制御回路295は、電源回路293から供給される電圧に基づいて照明装置10の光源に電力を供給し、所定の制御信号に基づいて光源の点灯の有無及びその輝度等を制御するようになっている。   The light source control circuit 295 supplies power to the light source of the lighting device 10 based on the voltage supplied from the power supply circuit 293, and controls whether or not the light source is turned on and its brightness based on a predetermined control signal. ing.

また、本発明に係る電子機器としては、図13に示す携帯電話機の他に、液晶テレビ、カーナビゲーション装置、電子手帳、電卓、ワークステーション、テレビ電話、POS端末機などが挙げられる。そして、これらの各種電子機器の表示部として本発明に係る液晶装置を用いることができる。ただし、本発明は液晶装置1の小型化・薄型化・省電力化を妨げないという特徴を有するため、特に、携帯電話、電子時計、携帯型情報端末などといった携帯型電子機器に用いる場合に有効である。   In addition to the mobile phone shown in FIG. 13, examples of the electronic apparatus according to the present invention include a liquid crystal television, a car navigation device, an electronic notebook, a calculator, a workstation, a videophone, and a POS terminal. The liquid crystal device according to the present invention can be used as a display portion of these various electronic devices. However, the present invention has a feature that does not hinder downsizing, thinning, and power saving of the liquid crystal device 1, and is particularly effective when used in portable electronic devices such as a mobile phone, an electronic watch, and a portable information terminal. It is.

第1実施形態の導光板の製造時における材料配置工程時の様子を示す断面図(a)及び同実施形態の導光板の製造時における材料硬化工程前の様子を示す断面図(b)。Sectional drawing (a) which shows the mode at the time of the material arrangement | positioning process at the time of manufacture of the light-guide plate of 1st Embodiment, and sectional drawing (b) which shows the mode before the material hardening process at the time of manufacture of the light-guide plate of the embodiment. 同実施形態の導光板の製造時における材料硬化工程後の様子を示す平面図。The top view which shows the mode after the material hardening process at the time of manufacture of the light-guide plate of the embodiment. 同実施形態の導光板の製造時における材料硬化工程後の様子を示す断面図。Sectional drawing which shows the mode after the material hardening process at the time of manufacture of the light-guide plate of the embodiment. 同実施形態の導光板の製造時における基板切断工程後の様子を示す平面図。The top view which shows the mode after the board | substrate cutting process at the time of manufacture of the light-guide plate of the embodiment. 同実施形態の導光板の製造時における基板切断工程後の様子を示す断面図。Sectional drawing which shows the mode after the board | substrate cutting process at the time of manufacture of the light-guide plate of the embodiment. 第2実施形態の材料配置工程及び材料硬化工程時の様子を示す平面図。The top view which shows the mode at the time of the material arrangement | positioning process and material hardening process of 2nd Embodiment. 第2実施形態の基板切断工程後の様子を示す平面図。The top view which shows the mode after the board | substrate cutting process of 2nd Embodiment. 第3実施形態の材料配置工程から材料硬化工程までを示す断面図(a)乃至(d)。Sectional drawing (a) thru | or (d) which shows from the material arrangement | positioning process of 3rd Embodiment to a material hardening process. 第4実施形態の材料成形工程時及び材料硬化工程後の様子を示す断面図(a)及び(b)。Sectional drawing (a) and (b) which show the mode at the time of the material formation process of 4th Embodiment, and after a material hardening process. 第5実施形態の材料成形工程時及び材料硬化工程後の様子を示す断面図(a)及び(b)。Sectional drawing (a) and (b) which show the mode at the time of the material shaping | molding process of 5th Embodiment, and after a material hardening process. 第6実施形態の材料配置工程時の様子を示す断面図(a)及び(b)。Sectional drawing (a) and (b) which show the mode at the time of the material arrangement | positioning process of 6th Embodiment. 照明装置及び液晶パネルを含む液晶装置の概略構成断面図。1 is a schematic cross-sectional view of a liquid crystal device including an illumination device and a liquid crystal panel. 電子機器の外観を示す概略斜視図。The schematic perspective view which shows the external appearance of an electronic device. 電子機器の表示制御系の概略構成図。The schematic block diagram of the display control system of an electronic device.

符号の説明Explanation of symbols

1…液晶装置、10…照明装置、20…液晶パネル、100…導光板、100a…端面、100b…表面、110、110′…基板、110a′…端面、110b′…表面、120…未硬化材料、130…積層体、130′…突起部、130a′…端面、130b′…表面 DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 10 ... Illuminating device, 20 ... Liquid crystal panel, 100 ... Light guide plate, 100a ... End surface, 100b ... Surface, 110, 110 '... Substrate, 110a' ... End surface, 110b '... Surface, 120 ... Uncured material , 130 ... Laminate, 130 '... Projection, 130a' ... End face, 130b '... Surface

Claims (7)

光源、及び該光源からの光を導光する導光板を具備する照明装置であって、
前記導光板は、透光性を有する基板と、該基板の端面に隣接して前記基板の表面の縁部上に接合された透光性を有する突起部とを具備し、
前記基板の端面と前記突起部の端面とが前記光源に対向するように配置されていることを特徴とする照明装置。
A lighting device comprising a light source and a light guide plate that guides light from the light source,
The light guide plate includes a substrate having translucency, and a projecting portion having translucency bonded to an edge of the surface of the substrate adjacent to an end surface of the substrate,
An illuminating device, wherein an end face of the substrate and an end face of the protrusion are arranged to face the light source.
前記突起部の少なくとも一つが放射状に傾斜した傾斜面を有することを特徴とする請求項1に記載の照明装置。   The lighting device according to claim 1, wherein at least one of the protrusions has an inclined surface that is radially inclined. 請求項1又は2に記載の照明装置と、前記照明装置の前記導光板に平面的に重なる表示領域を備えた液晶パネルとを具備し、前記光源から出射された光は、導光板を介して前記液晶パネルに入射されることを特徴とする液晶装置。   3. A lighting device according to claim 1, and a liquid crystal panel including a display area that overlaps the light guide plate of the lighting device in a plane, and the light emitted from the light source is transmitted through the light guide plate. A liquid crystal device incident on the liquid crystal panel. 請求項3に記載の液晶装置を表示部として具備することを特徴とする電子機器。   An electronic apparatus comprising the liquid crystal device according to claim 3 as a display portion. 透光性を有する基板と、該基板の端面に隣接して前記基板の表面の縁部上に接合された透光性を有する突起部とを具備し、
前記基板の端面と前記突起部の端面とで光を入射する入射面を構成することを特徴とする導光板。
A translucent substrate; and a translucent protrusion bonded to an edge of the surface of the substrate adjacent to an end surface of the substrate;
The light guide plate according to claim 1, wherein the end surface of the substrate and the end surface of the protrusion constitute an incident surface on which light is incident.
導光板の製造方法において、
透光性の基板の表面上に未硬化材料を配置する材料配置工程と、前記未硬化材料を硬化させて積層体を形成する材料硬化工程と、前記基板を前記積層体とともに前記積層体の形成範囲内を通過する線に沿って切断する基板切断工程とを具備することを特徴とする導光板の製造方法。
In the method of manufacturing the light guide plate,
A material disposing step of disposing an uncured material on a surface of a light-transmitting substrate; a material curing step of curing the uncured material to form a laminate; and forming the laminate together with the substrate and the laminate And a substrate cutting step of cutting along a line passing through the range.
前記材料配置工程と前記材料硬化工程との間に、成形型によって前記未硬化材料を成形する材料成形工程をさらに具備することを特徴とする請求項6に記載の導光板の製造方法。   The light guide plate manufacturing method according to claim 6, further comprising a material forming step of forming the uncured material with a forming die between the material arranging step and the material curing step.
JP2008075086A 2008-03-24 2008-03-24 Method of manufacturing illuminating device, liquid crystal device, and light guide plate Pending JP2009231048A (en)

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KR101043000B1 (en) 2011-01-11 2011-06-21 주식회사 우리옵토 Method for producing a thin light guide film having a lens in the light-receiving portion and the thin light guide film
JP2013098120A (en) * 2011-11-04 2013-05-20 Konica Minolta Advanced Layers Inc Light guide, light source device, and method for manufacturing light guide

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* Cited by examiner, † Cited by third party
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JP2010123569A (en) * 2008-11-17 2010-06-03 Samsung Electronics Co Ltd Backlight assembly using flexible light guide film and liquid crystal display module including the same
KR101043000B1 (en) 2011-01-11 2011-06-21 주식회사 우리옵토 Method for producing a thin light guide film having a lens in the light-receiving portion and the thin light guide film
JP2013098120A (en) * 2011-11-04 2013-05-20 Konica Minolta Advanced Layers Inc Light guide, light source device, and method for manufacturing light guide

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