JP2009212171A - Mounting method of chip type led - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To allow mounting of a chip type LED for improved durability, with no use of a printed board requiring etching, wherein the wiring is not exposed from a surface when a substrate is viewed from outside, and circuit damage such as dropping of a component and damage on wiring is not caused under an external force. <P>SOLUTION: The substrate 6 is made from a translucent material. A surface of the substrate is joined with an emission surface 1 of the chip type LED, using a transparent adhesive 6. Then, a wiring and connection to an electrode 3 of the chip type LED is done with a conductive paste 8. To reinforce bonding of the chip type LED, an epoxy resin adhesive 9 for potting is mounded. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a chip-type LED mounting method.

  In recent chip-type LEDs, electrodes were originally provided on the bottom and side surfaces as shown in FIG. 1a, but the size has been reduced year by year, and the number of only the bottom surface as shown in FIG. 1b has increased. As shown in FIG. 2, the conventional mounting method of this chip-type LED is such that the surface 1 of the chip LED emits light and the surface of the electrode 3 that is semi-facing are in contact with the substrate surface of the etched printed board 4. It was mounted by soldering.

Furthermore, a technique for easily mounting a chip-type LED with a conductive paste as shown in FIG. 3 has been devised for upholstery. This mounting method imitates a conventional chip LED mounting method and attaches the surface with the electrode 3 of the chip LED and the substrate surface 1 with an adhesive 7, and performs circuit formation and connection with a conductive paste 8. Has been proposed. However, in this method, an adhesive often adheres to the electrode of the chip LED, which may result in poor connection, and it takes time to remove the adhesive from the electrode. In addition, the wiring is exposed on the surface which is the face of the decorative product, which is unsightly in appearance, and the exposure sometimes causes circuit damage such as part dropping or wiring loss.
Patent Publication 2006-261303 2003

  The problem to be solved is that when a chip type LED is mounted using a printed board that is etched, the wiring is exposed to the chip type LED mounting surface.

  The most important aspect of the present invention is that a material that transmits light is used as a substrate, the surface of the substrate and the light emitting surface of the chip-type LED are combined, affixed with a transparent adhesive, and then wiring and connection are performed with a conductive paste. Features.

  The chip-type LED mounting method of the present invention has a good appearance without exposing parts or circuits to the substrate surface, and does not cause circuit damage such as component dropout or wiring loss due to external force, and the durability is remarkably improved. To do. When the chip-type LED is attached, the occurrence of adhesion of the adhesive to the electrode of the chip-type LED is reduced, and there is no need to correct with a design knife. Moreover, since the chip LED electrode comes out on the surface, wiring with a conductive paste is easy, and anyone can easily mount it.

  The purpose of mounting a chip-type LED without impairing the appearance of the mounting surface is to paste the light-emitting surface of the chip-type LED on the substrate side through which light is transmitted with a transparent adhesive, and then use a conductive paste to wire and Realized by connecting.

  As an example, first, as shown in FIG. 4, a transparent adhesive 7 is applied to a desired position of the transparent substrate 6 that transmits light in step A. The transparent substrate 6 may be an acrylic plate, a plastic substrate such as a vinyl chloride plate or a PET plate, a glass plate, or the like. Moreover, even if it is not a plane, it can be used even if it is uneven and a material having a curved surface.

  As the adhesive, an instantaneous adhesive can be used, but it may be whitened after curing, and the transparency may be lowered. Moreover, when glass is used as the substrate material, it is suitable to use an epoxy resin adhesive. Furthermore, in order to reduce the influence of the conductive paste wrapping around and spreading on the back surface of the chip LED, it is necessary to fill the gap between the chip and the substrate, and an epoxy resin adhesive is suitable for the application.

  Thereafter, the transparent substrate and the chip-type LED are aligned, and pasted in step B., and applied to the wiring using the conductive paste and the electrode of the chip-type LED in step C. to complete a series of mountings. When applying conductive paste or forming a circuit, draw with a dispenser filled with a conductive paste in a syringe, or draw with an electronic material filled with a conductive paste in a pen-type container such as the product name “E Jis Pen”. Is also possible.

  Further, in step D., potting can be performed using an epoxy resin adhesive, and mounting reliability can be improved.

  As in the examples, the present invention is highly expected to be used in product development because it can be freely wired for industrial use, such as prototype vehicles and prototypes for interior decoration using chip-type LEDs in electrical products. Is done.

Chip-type LED with bottom and side electrodes Chip-type LED with electrodes on the bottom only Conventional chip-type LED mounting method Chip-type LED mounting method using conductive paste Mounting method of chip type LED according to the present invention (Example)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip-type LED light emission surface 2 Chip-type LED light emission part 3 Chip-type LED electrode 4 Printed board 5 Solder 6 Transparent substrate which transmits light 7 Transparent adhesive 8 Conductive paste 9 Epoxy resin adhesive for potting

Claims (2)

  A mounting method in which a transparent material that transmits light is used as a substrate, regardless of whether it is flat or curved, and the light emitting surface of a chip-type LED is attached to the substrate side to make wiring connections.   2. The mounting method according to claim 1, wherein the wiring and connection according to claim 1 are performed with a conductive paste.