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JP2009205888A - Negative electrode for lithium secondary battery and its manufacturing method - Google Patents

Negative electrode for lithium secondary battery and its manufacturing method Download PDF

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JP2009205888A
JP2009205888A JP2008045578A JP2008045578A JP2009205888A JP 2009205888 A JP2009205888 A JP 2009205888A JP 2008045578 A JP2008045578 A JP 2008045578A JP 2008045578 A JP2008045578 A JP 2008045578A JP 2009205888 A JP2009205888 A JP 2009205888A
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active material
negative electrode
secondary battery
lithium secondary
copper
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Hironori Imamura
裕典 今村
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Nippon Mining Holdings Inc
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Nippon Mining and Metals Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a negative electrode for a lithium secondary battery having excellent cycle characteristics, and to provide its manufacturing method. <P>SOLUTION: The thin film negative electrode has an alloy thin-film active material layer of Sn alloyed with Li and a metal not alloyed with Li formed on one side or both sides of a copper or a copper alloy foil substrate. The half-value width of the maximum peak in X-ray diffraction method of the negative electrode active material using Cukα beam is 0.2-0.55° at 2θ. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明はリチウム二次電池用負極、特には、銅又は銅合金箔上の片面もしくは両面にLiと合金化するSnとLiと合金化しない金属との合金薄膜活物質を形成してなるリチウム二次電池用負極及びその製造方法に関する。   The present invention relates to a negative electrode for a lithium secondary battery, particularly a lithium secondary battery formed by forming an alloy thin film active material of Sn alloyed with Li and a metal not alloyed with Li on one surface or both surfaces of copper or a copper alloy foil. The present invention relates to a negative electrode for a secondary battery and a method for producing the same.

リチウム二次電池はより高性能を目指して研究開発が活発に行われており、その電極材料は様々なものが提案されている。金属リチウムを負極として用いると、高容量の電池を得ることが出来るが、充電時にリチウムがデンドライト状に析出し、内部短絡を起こすという問題がある。また、充電の際にリチウムと合金化する、SiやSnなどの単体を用いた負極材が高容量の負極材として報告されているが、これらの合金系負極は充放電に伴い電極活物質である合金自体が微粉化することで集電特性が悪化し、低いサイクル特性しか得られない。そこで、合金負極自体の微粉化を抑制するために、Co、Ni、Cu、Ag等のリチウムと合金化しない金属とSi、Snなどのリチウムと合金化する金属の金属間化合物を形成することにより、充放電時の微粉化を抑えた負極が検討されており(例えば、特許文献3、4参照)、さらに、高容量の負極活物質であるSnおよびSiとリチウムと合金化しない金属を合金化させた活物質を微細結晶構造および非晶質構造とすることで微粉化を抑制し、サイクル特性を改善することが行われている。
特開2002−198091号公報 特開2002−373647号公報 特開平10−223221号公報 特開2001−143761号公報 特開2001−256968号公報
Lithium secondary batteries have been actively researched and developed for higher performance, and various electrode materials have been proposed. When metallic lithium is used as the negative electrode, a high-capacity battery can be obtained, but there is a problem in that lithium precipitates in a dendrite state during charging and causes an internal short circuit. In addition, negative electrode materials using simple substances such as Si and Sn, which are alloyed with lithium during charging, have been reported as high capacity negative electrode materials. When an alloy itself is pulverized, current collection characteristics deteriorate, and only low cycle characteristics can be obtained. Therefore, in order to suppress pulverization of the alloy negative electrode itself, by forming an intermetallic compound of a metal that does not alloy with lithium such as Co, Ni, Cu, and Ag and a metal that alloy with lithium such as Si and Sn. In addition, negative electrodes with reduced pulverization during charging / discharging have been studied (see, for example, Patent Documents 3 and 4), and Sn and Si, which are high capacity negative electrode active materials, are alloyed with metals that do not alloy with lithium. By making the active material into a fine crystal structure and an amorphous structure, pulverization is suppressed and cycle characteristics are improved.
JP 2002-198091 A JP 2002-373647 A Japanese Patent Laid-Open No. 10-223221 JP 2001-143761 A JP 2001-256968 A

特許文献3では、「負極物質としてAl、Ge、Pb、Si、Sn、Znの元素群から選ばれる少なくとも1種類以上の元素と上記元素以外の金属ないしは半金属との金属間化合物を用いる事を特徴とする二次電池、及び負極活物質に用いる前記金属間化合物が低結晶性である事を特徴とする二次電池、及び負極活物質に用いる前記金属間化合物が非晶質である事を特徴とする二次電池を提案するものである。」([007])、「本発明に用いる金属間化合物は低結晶性ないしは非晶質である事がより望ましい。」(「0009」)から負極活物質が低結晶性ないしは非晶質の結晶構造を有するとサイクル特性が良好であることを提案している。さらには、高結晶性の結晶構造を有する負極活物質の例についても実施例として記載されている。   In Patent Document 3, “as the negative electrode material, an intermetallic compound of at least one element selected from the group of elements of Al, Ge, Pb, Si, Sn, and Zn and a metal or metalloid other than the above elements is used. A secondary battery characterized in that the intermetallic compound used in the negative electrode active material is low crystalline, and a secondary battery characterized in that the intermetallic compound used in the negative electrode active material is amorphous. The proposed secondary battery is characterized "([007])," The intermetallic compound used in the present invention is more preferably low crystalline or amorphous "(" 0009 "). It has been proposed that when the negative electrode active material has a low crystalline or amorphous crystal structure, the cycle characteristics are good. Furthermore, examples of negative electrode active materials having a highly crystalline crystal structure are also described as examples.

特許文献4では「上記金属材料は、[211]方向の結晶子の大きさが20nm以下であるCoSn2を含有することを特徴とする請求項1記載の非水電解質二次電池」(「請求項4」)と規定しているが、後述するように結晶子の大きさが20nm以下であることは、特許文献4における低結晶性ないしは非晶質の結晶構造に該当し、負極活物質は特許文献4と同様な低結晶性の結晶構造を有するものと考えられる。 In Patent Document 4, “the non-aqueous electrolyte secondary battery according to claim 1, wherein the metal material contains CoSn 2 whose crystallite size in the [211] direction is 20 nm or less” (“Bill Item 4 ”), the crystallite size of 20 nm or less as described later corresponds to the low crystalline or amorphous crystal structure in Patent Document 4, and the negative electrode active material is It is considered to have a low crystalline structure similar to that of Patent Document 4.

一方、特許文献5は、負極材料として、電気メッキを実施した銅箔を用いる(「請求項1」)、電気メッキを実施した銅箔を熱処理(「請求項3」)、1μm以下の微細粒が独立して成長し集合した皮膜とする非水電解質二次電池用負極材料の製造方法(「請求項3」)と規定している。   On the other hand, Patent Document 5 uses a copper foil subjected to electroplating as a negative electrode material (“Claim 1”), heat-treats the copper foil subjected to electroplating (“Claim 3”), and has a fine grain of 1 μm or less. Is defined as a method for producing a negative electrode material for a non-aqueous electrolyte secondary battery (“Claim 3”).

しかしながら、詳細には後述するが、特許文献3に記載の低結晶性ないしは非晶質(以下、本発明では「低結晶性ないしは非晶質」を「低結晶性」と記載)の結晶構造を有する場合、結晶性が低いため、充放電の際の体積膨張による活物質層内の応力を緩和するような亀裂が入りにくいことで活物質と集電体箔との剥離が起こりやすくなり、一方、特許文献3における高結晶性の結晶構造、特許文献5における結晶構造を有する場合には、充放電の際の体積膨張により活物質表面の亀裂は発生しやすいが、粒界の存在により亀裂が伝播しやすく、亀裂が集電体まで伝わると活物質と集電体箔との剥離が起こりやすくなる。このようにいずれも活物質層と集電体箔の剥離への対策が不十分であり、十分なサイクル特性が得られていない。   However, as will be described in detail later, the crystal structure of low crystallinity or amorphous described in Patent Document 3 (hereinafter, “low crystallinity or amorphous” is referred to as “low crystallinity” in the present invention). If it has, since the crystallinity is low, the active material and the current collector foil are likely to be peeled off because cracks that relieve stress in the active material layer due to volume expansion during charge and discharge are difficult to enter, In the case of having the highly crystalline crystal structure in Patent Document 3 and the crystal structure in Patent Document 5, cracks on the surface of the active material are likely to occur due to volume expansion during charge / discharge, but cracks are caused by the presence of grain boundaries. Propagation is easy, and when the crack propagates to the current collector, the active material and the current collector foil are easily separated. As described above, all of the measures for peeling between the active material layer and the current collector foil are insufficient, and sufficient cycle characteristics are not obtained.

本発明の解決すべき課題は、リチウム二次電池用負極における活物質が、充放電に伴う体積膨張による応力を緩和するための亀裂が発生しやすいが、亀裂の伝播はしづらいことで良好なサイクル特性を有するリチウム二次電池用負極及びその製造方法を提供することにある。   The problem to be solved by the present invention is that the active material in the negative electrode for a lithium secondary battery tends to generate cracks for relaxing the stress due to volume expansion associated with charge / discharge, but it is good that crack propagation is difficult. It is providing the negative electrode for lithium secondary batteries which has cycling characteristics, and its manufacturing method.

本発明者は上記課題を解決すべく鋭意研究したところ、薄膜負極において、低結晶性の結晶構造を有する活物質や高結晶性の結晶構造を有する活物質とは異なる結晶構造を有する活物質を形成することで、高結晶性の結晶構造を有する活物質や低結晶性の結晶構造を有する活物質を用いるよりもサイクル特性が良好であることを見出した。即ち、以下の発明である。   The present inventor has intensively studied to solve the above problems, and as a result, an active material having a crystal structure different from an active material having a low crystalline crystal structure or an active material having a high crystalline crystal structure in a thin film negative electrode. It has been found that the cycle characteristics are better by using the active material than the active material having a high crystalline structure or the active material having a low crystalline structure. That is, the invention is as follows.

(1)銅又は銅合金箔基材上の片面もしくは両面にLiと合金化するSnとLiと合金化しない金属との合金からなる活物質層を形成してなるリチウム二次電池用負極において、CuKα線を用いた該活物質層のX線回折法での最大ピークの半値幅が2θで0.2〜0.55°であることを特徴とするリチウム−二次電池用負極。   (1) In a negative electrode for a lithium secondary battery in which an active material layer made of an alloy of Sn alloyed with Li and a metal not alloyed with Li is formed on one surface or both surfaces of a copper or copper alloy foil base material. A negative electrode for a lithium secondary battery, wherein the half-value width of the maximum peak in the X-ray diffraction method of the active material layer using CuKα rays is 0.2 to 0.55 ° in 2θ.

(2)Liと合金化しない金属がCoであることを特徴する(1)のリチウム二次電池用負極。   (2) The negative electrode for a lithium secondary battery according to (1), wherein the metal not alloyed with Li is Co.

(3)活物質のSn組成が50〜70質量%である(1)又は(2)のリチウム二次電池用負極。   (3) The negative electrode for a lithium secondary battery according to (1) or (2), wherein the Sn composition of the active material is 50 to 70% by mass.

(4)活物質層の膜厚が片面あたり2〜15μmである(1)〜(3)何れかのリチウム二次電池用負極。   (4) The negative electrode for a lithium secondary battery according to any one of (1) to (3), wherein the thickness of the active material layer is 2 to 15 μm per side.

(5)銅又は銅合金箔基材上の片面もしくは両面に、Liと合金化するSnとLiと合金化しない金属との合金からなり、CuKα線を用いたX線回折法での最大ピークの半値幅が2θで0.6°以上である活物質層を形成し、次いで、該活物質層のX線回折法での最大ピークの半値幅が2θで0.2〜0.55°の範囲となる温度及び時間の条件で熱処理を施すことを特徴とする(1)〜(4)何れかのリチウム二次電池用負極の製造方法。   (5) It consists of an alloy of Sn alloyed with Li and a metal not alloyed with Li on one side or both sides of the copper or copper alloy foil base material, and has the maximum peak in the X-ray diffraction method using CuKα rays. An active material layer having a half width of 2θ of 0.6 ° or more is formed, and then the half width of the maximum peak in the X-ray diffraction method of the active material layer is 0.2θ to 0.5 to 0.55 ° (1)-(4) The manufacturing method of the negative electrode for lithium secondary batteries in any one of (1)-(4) characterized by performing heat processing on conditions of temperature and time which become.

活物質層が電気めっき法により形成されることを特徴とする(5)のリチウム二次電池用負極の製造方法。   The method for producing a negative electrode for a lithium secondary battery according to (5), wherein the active material layer is formed by electroplating.

本発明によって、銅又は銅合金箔上の片面もしくは両面にLiと合金化するSnとLiと合金化しない金属との合金で金属間化合物を形成する活物質を有する合金系負極、特にはSnCo合金活物質を有する負極の充放電に伴う活物質の微粉化および剥離が抑制された結果、高容量でサイクル特性の良好な薄膜負極を得られる。   In accordance with the present invention, an alloy-based negative electrode having an active material that forms an intermetallic compound with an alloy of Sn that is alloyed with Li and a metal that is not alloyed with Li on one surface or both surfaces of copper or a copper alloy foil, particularly an SnCo alloy As a result of suppressing the pulverization and separation of the active material accompanying charging / discharging of the negative electrode having the active material, a thin film negative electrode having a high capacity and good cycle characteristics can be obtained.

以下に本発明の実施の形態を説明する。   Embodiments of the present invention will be described below.

(1)負極活物質の組成
本発明における、集電体銅箔又は銅合金箔に上に形成され負極活物質は、Liと合金化するSnとLiと合金化しない金属を化合物化させるものであり、これにより充放電に伴う活物質の体積変化に起因する微粉化を抑制することができる。リチウムと合金化しない金属としてTi、V、Cr、Mn、Fe、Ni、Cu、Agおよびそれらの合金が挙げられる。しかし、集電体に上に形成された低結晶性の結晶構造を有した負極活物質が熱処理を施されることで本発明の結晶構造となり、サイクル特性が良好となる発明であるが、SnとLiと合金化しないMn、Fe、Ni、Cu、Agなどの合金は低結晶性の結晶構造を有する薄膜形成が比較的困難であることから、製造方法にはよるが、本発明ではLiと合金化しない金属としてはCoを用いていることが好ましい。
その組成については製造方法にもよるが、Sn組成を50〜85質量%の範囲で製造可能である。本発明では、Sn組成が50〜70質量%であることが好ましく、さらに、60〜70質量%であることがより好ましい。
(1) Composition of negative electrode active material In the present invention, the negative electrode active material formed on the collector copper foil or copper alloy foil is a compound of Sn alloyed with Li and a metal not alloyed with Li. Yes, and thus, pulverization caused by the volume change of the active material accompanying charge / discharge can be suppressed. Examples of metals that do not alloy with lithium include Ti, V, Cr, Mn, Fe, Ni, Cu, Ag, and alloys thereof. However, although the negative electrode active material having a low crystalline crystal structure formed on the current collector is heat-treated, it becomes the crystal structure of the present invention and the cycle characteristics are improved. Alloys such as Mn, Fe, Ni, Cu, and Ag that are not alloyed with Li are relatively difficult to form a thin film having a low-crystalline crystal structure. Co is preferably used as the metal that is not alloyed.
Although the composition depends on the production method, the Sn composition can be produced in the range of 50 to 85% by mass. In this invention, it is preferable that Sn composition is 50-70 mass%, and it is more preferable that it is 60-70 mass%.

(2)負極活物質の厚み
本発明における負極活物質は、集電体銅箔又は銅合金箔に上に形成された段階では低結晶性の結晶構造を有し、その後の熱処理により本発明の結晶構造となるためには、薄膜を形成させることが望ましい。また、薄膜による活物質層は粉末状活物質層よりも薄くできる。膜厚は2〜15μmである。活物質層の膜厚は厚いほど集電体単位面積あたりの充放電容量が大きくなるが、サイクル特性が低下する傾向がある。より好ましい範囲は、膜厚は4〜12μm、さらには5〜10μmである。なお、膜厚は薄膜負極の断面をSEMにより観察することで測定できる。
(2) Thickness of the negative electrode active material The negative electrode active material in the present invention has a low crystalline crystal structure when formed on the current collector copper foil or copper alloy foil. In order to obtain a crystal structure, it is desirable to form a thin film. Moreover, the active material layer by a thin film can be made thinner than a powdery active material layer. The film thickness is 2 to 15 μm. The thicker the active material layer, the larger the charge / discharge capacity per unit area of the current collector, but the cycle characteristics tend to deteriorate. A more preferable range is a film thickness of 4 to 12 μm, and further 5 to 10 μm. In addition, a film thickness can be measured by observing the cross section of a thin film negative electrode by SEM.

(3)負極活物質の結晶構造
本発明は、特許文献3における低結晶性の結晶構造の活物質や特許文献4のような結晶構造の活物質でも、特許文献3における高結晶性の結晶構造を有する活物質や特許文献5のような活物質でもない結晶構造の活物質を有する負極活物質である。
即ち、本発明では、活物質層の結晶構造として、X線回折の最大ピークの半値幅が2θで0.2〜0.55°である。また、X線回折のピークの半値幅から計算で算出される結晶子が20nmを超えることが望ましい。
特許文献3における「低結晶性」とはX線回折のピークの半値幅が0.6°以上であり、X線回折ピークの半値幅から計算される結晶子の大きさは20nm以下と小さいことを意味する。一方、特許文献4に記載の「高結晶性」及び特許文献6のような「結晶粒径」は例えば9000〜27000倍の解像度のSIM等によって観察されるような結晶粒が存在し、X線回折のピークの半値幅0.2°未満である。
なお、結晶子の大きさは、Scherrerの式を用いて、X線回折ピークの半値幅から以下のように算出した
D=K・λ/(β・cosθ)
D:結晶子の大きさ(Å、最大ピークの結晶子の大きさ)
λ:測定X線波長(Å)
β:結晶子の大きさによる回折線の拡がりで本発明では最大ピークの半値幅
θ:本発明では最大ピーク位置
K:βに半値幅を用いた場合は0.9
例えば、発明例No.3の場合、図1より、最大ピークの半値幅は0.35°及び最大ピーク位置が36°であり、
D(結晶子の大きさ)nm=0.90×0.15404/(0.35/180×π×cos(36/180×π))=31.7nm
となる。
低結晶性の結晶構造を有する活物質が本発明の活物質よりサイクル特性が劣る理由は、低結晶性の活物質の場合は充電時の体積膨張による活物質層内の応力が大きくなると、応力を緩和するために活物質表面におこる亀裂が、結晶子が小さすぎるため、発生しにくく、緩和されない応力は集電体と活物質層の界面に集中し、応力の集中した部分から活物質の剥離が発生しやすくなるためと考えられる。
一方、高結晶性の結晶構造或いは結晶粒を有する活物質では、充電時の体積膨張によって発生した活物質層内の応力を緩和するための亀裂が活物質表面の結晶粒界に沿って発生しやすいが、発生した亀裂は粒界に沿って進行しやすくなり、集電体と活物質層の界面から活物質の剥離が発生しやすくなると考えられる。
これに対して、本発明の活物質は明確な結晶粒は観察できないものの、結晶子がある程度の大きさに成長しているため、結晶子が結晶粒界と同様な役割を果たす。従って、充電時の体積膨張による活物質層内の応力発生時には、表面の結晶子の境界に沿って亀裂が発生しやすい。しかし、一旦亀裂が入っても、本発明の活物質は、結晶子の境界が結晶粒界ほど明確でないため、亀裂の伝播は遅く、高結晶性の結晶構造を有する活物質よりも活物質の剥離が遅く、サイクル特性が良くなると考えられる。
(3) Crystal Structure of Negative Electrode Active Material The present invention is a crystal structure having a high crystallinity in Patent Document 3, even if it is an active material having a low crystal structure in Patent Document 3 or an active material having a crystal structure as in Patent Document 4. And an active material having a crystal structure that is not an active material as disclosed in Patent Document 5.
That is, in the present invention, as the crystal structure of the active material layer, the half-value width of the maximum peak of X-ray diffraction is 0.2 to 0.55 ° in 2θ. In addition, it is desirable that the crystallite calculated from the half width of the peak of X-ray diffraction exceeds 20 nm.
“Low crystallinity” in Patent Document 3 means that the half width of an X-ray diffraction peak is 0.6 ° or more, and the crystallite size calculated from the half width of the X-ray diffraction peak is as small as 20 nm or less. Means. On the other hand, “high crystallinity” described in Patent Document 4 and “crystal grain size” as described in Patent Document 6 include crystal grains that are observed by, for example, SIM having a resolution of 9000 to 27000 times, and X-ray The half width of the diffraction peak is less than 0.2 °.
The crystallite size was calculated from the half width of the X-ray diffraction peak using the Scherrer equation as follows: D = K · λ / (β · cos θ)
D: Crystallite size (Å, maximum peak crystallite size)
λ: Measurement X-ray wavelength (Å)
β: broadening of diffraction lines depending on crystallite size. In the present invention, half-width of maximum peak in the present invention. θ: maximum peak position in the present invention K: 0.9 in the case of using a half-width for β.
For example, Invention Example No. In the case of 3, the full width at half maximum of the maximum peak is 0.35 ° and the maximum peak position is 36 ° from FIG.
D (size of crystallite) nm = 0.90 × 0.15404 / (0.35 / 180 × π × cos (36/180 × π)) = 31.7 nm
It becomes.
The reason why an active material having a low crystalline crystal structure is inferior in cycle characteristics to the active material of the present invention is that, in the case of a low crystalline active material, if the stress in the active material layer due to volume expansion during charging increases, Since the crystallites are too small, cracks that occur on the surface of the active material to relieve the stress are difficult to occur and stress that is not relaxed concentrates at the interface between the current collector and the active material layer, This is thought to be because peeling tends to occur.
On the other hand, in an active material having a highly crystalline crystal structure or crystal grains, cracks are generated along the crystal grain boundaries on the surface of the active material to relieve stress in the active material layer generated by volume expansion during charging. Although it is easy, the generated cracks are likely to proceed along the grain boundary, and the active material is likely to be peeled off from the interface between the current collector and the active material layer.
In contrast, in the active material of the present invention, although clear crystal grains cannot be observed, the crystallites grow to a certain size, so that the crystallites play the same role as the crystal grain boundaries. Therefore, when stress is generated in the active material layer due to volume expansion during charging, cracks are likely to occur along the boundary of the surface crystallites. However, once a crack has occurred, the active material of the present invention has a crystallite boundary that is not as clear as the crystal grain boundary, so the propagation of cracks is slow, and the active material is more active than the active material having a highly crystalline crystal structure. It is considered that peeling is slow and cycle characteristics are improved.

(4)銅箔及び銅合金箔
本発明に使用する集電体の銅又は銅合金箔は電解銅箔及び圧延銅箔の何れを用いてもよく、用途や要求特性に応じて適宜選択することができる。例えば、圧延銅箔は特に高強度や耐屈曲性が要求される場合に使用するとよい。リチウム二次電池負極の集電体として使用する場合、銅箔を薄肉化した方がより高容量の電池を得ることができるが、薄肉化すると強度低下による破断の危険性が生じることから、このような場合には電解銅箔よりも強度に優れている圧延銅箔を使用するのが好ましい。
また、銅又は銅合金箔に使用する銅合金の種類には特に制限はなく、用途や要求特性に応じて適宜選択すればよい。例えば、限定的ではないが、高純度の銅(無酸素銅やタフピッチ銅等)の他、Sn入り銅、Ag入り銅、Ni、Si等を添加したCu−Ni−Si系銅合金、Cr、Zr等を添加したCu−Cr−Zr系銅合金のような銅合金が挙げられる。
銅又は銅合金箔の厚みも特に制限はなく、用途や要求特性に応じて適宜選択すればよい。一般的には1〜100μmであるが、リチウム二次電池負極の集電体として使用する場合、銅箔を薄肉化した方がより高容量の電池を得ることができる。そのような観点から、好ましくは2〜50μm、より好ましくは5〜20μm程度である。
(4) Copper foil and copper alloy foil The copper or copper alloy foil of the current collector used in the present invention may be either an electrolytic copper foil or a rolled copper foil, and should be appropriately selected according to the application and required characteristics. Can do. For example, the rolled copper foil is preferably used when high strength and bending resistance are required. When used as a current collector for a lithium secondary battery negative electrode, it is possible to obtain a battery with a higher capacity by reducing the thickness of the copper foil. However, if the thickness is reduced, there is a risk of breakage due to a decrease in strength. In such a case, it is preferable to use a rolled copper foil that is superior in strength to the electrolytic copper foil.
Moreover, there is no restriction | limiting in particular in the kind of copper alloy used for copper or copper alloy foil, What is necessary is just to select suitably according to a use or a required characteristic. For example, but not limited to, Cu-Ni-Si based copper alloy with addition of high purity copper (oxygen-free copper, tough pitch copper, etc.), Sn-containing copper, Ag-containing copper, Ni, Si, etc., Cr, Examples thereof include a copper alloy such as a Cu—Cr—Zr copper alloy to which Zr or the like is added.
The thickness of the copper or copper alloy foil is not particularly limited, and may be appropriately selected depending on the application and required characteristics. Generally, the thickness is 1 to 100 μm, but when used as a current collector for a negative electrode of a lithium secondary battery, a battery having a higher capacity can be obtained by thinning the copper foil. From such a viewpoint, it is preferably 2 to 50 μm, more preferably about 5 to 20 μm.

(5)粗化処理
リチウム二次電池負極では、集電体上に負極活物質を形成するに当たっては、集電体と活物質の密着性を挙げるため、銅又は銅合金箔上に粗化処理を施した後に負極活物質を形成するのが一般的である。
粗化処理層は、一般的なCu粗化処理層でよいが、さらには、一般的なCu粗化処理層を形成する個々のCu粒子の上に、Niめっき及びSnめっきを順に施し、更に熱処理を施して両めっき界面にNi−Sn合金層を形成し、上部に残ったSn層を電解研磨などにより除去して発生した微細な突起であるSn−Ni層を形成する2層構造を有する層でもよい。
なお、Cu粗化処理層のみの場合、メッキ液の種類によってはCuがメッキ液に溶出する恐れがあり、溶出が望まれないときにはCu粗化処理後、活物質層形成前にNiメッキを施す場合がある。
(5) Roughening treatment When forming a negative electrode active material on a current collector in a lithium secondary battery negative electrode, a roughening treatment is performed on copper or copper alloy foil in order to increase the adhesion between the current collector and the active material. In general, the negative electrode active material is formed after the treatment.
The roughening treatment layer may be a general Cu roughening treatment layer, and further, Ni plating and Sn plating are sequentially applied on individual Cu particles forming the general Cu roughening treatment layer, It has a two-layer structure in which a Ni—Sn alloy layer is formed at both plating interfaces by heat treatment, and a Sn—Ni layer that is a fine protrusion generated by removing the remaining Sn layer by electrolytic polishing or the like is formed. It may be a layer.
In the case of only the Cu roughening layer, Cu may be eluted into the plating solution depending on the type of the plating solution. When elution is not desired, Ni plating is performed after the Cu roughening treatment and before forming the active material layer. There is a case.

(6)負極の製造方法
本発明におけるリチウム2次電池用負極は、集電体の銅又は銅合金箔上に粗化処理層を形成した後、負極活物質を形成し、熱処理を行うことで得られる。
具体的には以下のとおりである。
a)粗化処理
粗化処理方法は、一般的なCu粗化処理方法でよい。また、Cu粗化処理層上にNi−Sn拡散層を形成する方法については、銅又は銅合金箔基材上に複数のCu粒子を付着させる工程1と、該Cu粒子の表面にNiめっき層を形成する工程2と、該Niめっき層上にSnめっき層を形成する工程3と、該Niめっき層及びSnめっき層の界面に熱処理によってNiSn合金層を形成する工程4と、残留Snめっき層を除去する工程5とを行うことで形成可能である。このような表面構造をもつ銅又は銅合金箔は負極活物質との密着性を有し、且つ、活物質膨張時の集電体界面への応力集中を緩和することが可能である。
b)活物質の形成
本発明における負極、高結晶性の結晶構造でも、低結晶性の結晶構造でもない結晶構造を有する活物質を持つ負極を得るためには、活物質を形成後に熱処理を施すことが必要であるが、熱処理する前の活物質層は、低結晶性の結晶構造を有していなければならない。ここで、活物質層の結晶性はCuKα線を用いたX線回折の最大ピークの半値幅が0.6°以上である必要がある。
そのため、活物質構成元素や薄膜の形成方法が限られてしまう。上述したように、SnとLiと合金化しないMn、Fe、Ni、Cu、Agなどの合金は非晶質又は低結晶性の結晶構造を有する薄膜形成は製造方法にもよるが比較的困難であるのに対して、Coは、比較的容易に低結晶性の結晶構造を有する薄膜を形成できる。その形成方法は、化学的薄膜形成方法である電気めっき法、無電解めっき法や物理的薄膜形成方法であるスパッタリング法、蒸着法、溶射法、CVD法のうち、X線回折の最大ピークの半値幅を0.6°以上とすることができれば方法は問わないが、低結晶性の結晶構造の薄膜を形成しやすい電気めっき法とスパッタリング法が好ましく、また、工業的には薄膜の形成速度が高く制御が容易である電気めっき法ではピロりん酸浴を用いた方法が好ましい。
c)熱処理
熱処理は活物質の結晶構造が、低結晶性から高結晶性とならない条件での処理が重要である。熱処理が不足すると活物質は、低結晶性の結晶構造のままであり、熱処理が過剰な場合には、結晶粒が観察されるような高結晶性の構造を有することになる。さらに、過剰な熱処理は、集電体である銅又は銅合金箔を軟化させたり、活物質と集電体との原子の拡散が発生させたりするおそれがある。
従って、熱処理条件としては、230℃〜350℃で0.5〜2時間が好ましい。より好ましくは、250〜300℃である。熱処理後、SIM像の27000倍の観察にて結晶粒が確認できない状態であることが望ましい。(図2 参照)
(6) Negative Electrode Manufacturing Method The negative electrode for a lithium secondary battery in the present invention is formed by forming a roughening treatment layer on a copper or copper alloy foil of a current collector, forming a negative electrode active material, and performing a heat treatment. can get.
Specifically, it is as follows.
a) Roughening treatment The roughening treatment method may be a general Cu roughening treatment method. Moreover, about the method of forming a Ni-Sn diffused layer on Cu roughening process layer, the process 1 which makes a some Cu particle adhere on a copper or copper alloy foil base material, and Ni plating layer on the surface of this Cu particle | grain Forming a Sn plating layer on the Ni plating layer, forming a NiSn alloy layer by heat treatment at the interface between the Ni plating layer and the Sn plating layer, and a residual Sn plating layer It can be formed by performing Step 5 for removing. The copper or copper alloy foil having such a surface structure has adhesiveness with the negative electrode active material, and can relieve stress concentration at the current collector interface when the active material expands.
b) Formation of Active Material In order to obtain a negative electrode according to the present invention, a negative electrode having an active material having a crystal structure that is neither high crystalline nor low crystalline, heat treatment is performed after the active material is formed. However, it is necessary that the active material layer before heat treatment has a low crystalline structure. Here, as for the crystallinity of the active material layer, the full width at half maximum of the maximum peak of X-ray diffraction using CuKα rays needs to be 0.6 ° or more.
Therefore, the method for forming the active material constituent element and the thin film is limited. As described above, an alloy such as Mn, Fe, Ni, Cu, and Ag that is not alloyed with Sn and Li is relatively difficult to form a thin film having an amorphous or low crystalline crystal structure, depending on the manufacturing method. On the other hand, Co can form a thin film having a low crystalline crystal structure relatively easily. The formation method is the half of the maximum peak of X-ray diffraction among the electroplating method, which is a chemical thin film formation method, the electroless plating method, and the sputtering method, vapor deposition method, thermal spraying method, and CVD method, which are physical thin film formation methods. The method is not limited as long as the value width can be 0.6 ° or more, but electroplating and sputtering that facilitate formation of a thin film having a low crystalline crystal structure are preferred, and industrially, the formation rate of the thin film is high. In the electroplating method which is high and easy to control, a method using a pyrophosphate bath is preferable.
c) Heat treatment It is important that the heat treatment is performed under a condition that the crystal structure of the active material does not change from low crystallinity to high crystallinity. If the heat treatment is insufficient, the active material remains in a low crystalline crystal structure. If the heat treatment is excessive, the active material has a highly crystalline structure in which crystal grains are observed. Furthermore, excessive heat treatment may soften the copper or copper alloy foil that is the current collector, or may cause diffusion of atoms between the active material and the current collector.
Accordingly, the heat treatment conditions are preferably 230 ° C. to 350 ° C. and 0.5 to 2 hours. More preferably, it is 250-300 degreeC. After the heat treatment, it is desirable that the crystal grains cannot be confirmed by observation at 27000 times the SIM image. (See Figure 2)

以下、本発明の実施例を記載するが、本発明はこれらの実施例に限定されるものではない。
集電体としてCu−3.0Ni−0.65Si−0.15Mgの組成を有する60mm×45mm×18μmの寸法の銅合金箔(日鉱金属社製圧延銅箔:品名C7025)を用意した。該集電体の銅合金箔をアルカリ脱脂及び酸洗した後に、硫酸銅浴中で箔全面にCuめっきを行った。Cuめっきは下地めっき2.3A/dm2×118s、粗化めっき4.6A/dm2×77s、カブセめっき2.3A/dm2×94sの順で実施した。次に、スルファミン酸浴中で基材全面にNiめっきを行った。
これらの製造条件を表1に示す。
Examples of the present invention will be described below, but the present invention is not limited to these examples.
A copper alloy foil having a composition of Cu-3.0Ni-0.65Si-0.15Mg and having a size of 60 mm × 45 mm × 18 μm (rolled copper foil manufactured by Nikko Metals Co., Ltd .: product name C7025) was prepared as a current collector. After the copper alloy foil of the current collector was alkaline degreased and pickled, Cu plating was performed on the entire surface of the foil in a copper sulfate bath. Cu plating was performed in the order of base plating 2.3 A / dm 2 × 118 s, roughening plating 4.6 A / dm 2 × 77 s, and Kabuse plating 2.3 A / dm 2 × 94 s. Next, Ni plating was performed on the entire surface of the substrate in a sulfamic acid bath.
These manufacturing conditions are shown in Table 1.

粗化処理を施した上記銅合金箔にSn―Co合金薄膜を表3に示すメッキ浴中で電気めっきにより形成しSn−Co合金薄膜負極を作製した。Sn−Co合金薄膜厚を4μmとし、Sn濃度は、65.2質量%であった。各メッキ浴の条件を表2に示す。   An Sn—Co alloy thin film was formed on the copper alloy foil subjected to the roughening treatment by electroplating in a plating bath shown in Table 3 to produce a Sn—Co alloy thin film negative electrode. The Sn—Co alloy thin film thickness was 4 μm, and the Sn concentration was 65.2% by mass. Table 2 shows the conditions of each plating bath.

発明例No.1〜6、比較例No.2〜8、No.10、No.12について表3に示す各温度と時間で熱処理した。熱処理は石英管状炉を用い、不活性ガスであるArガスを2リットル/分の流量で流したAr雰囲気下で実施した。加熱時間終了後、ゆっくりと冷却した。   Invention Example No. 1-6, Comparative Example No. 2-8, no. 10, no. No. 12 was heat-treated at each temperature and time shown in Table 3. The heat treatment was performed using a quartz tube furnace in an Ar atmosphere in which Ar gas as an inert gas was flowed at a flow rate of 2 liters / minute. After the heating time was over, it was cooled slowly.

測定方法は以下の通りである。
X線回折最大ピーク半値幅
薄膜評価用X線回折装置(装置:Rigaku製 RINT2000)で薄膜負極活物質層表面のCuKαX線回折を実施し、最大ピークの半値幅を測定した。比較例1のめっきあがりの熱処理なし試料の最大ピークの半値幅は1.83°であった。
Sn−Co合金の平均結晶粒径
SIM像(装置:SII製 SMI3050SE)の9000〜27000倍にて3μm×5μmの面積について結晶粒径を測定し結晶粒の個数で平均し、平均結晶粒径とした。平均結晶粒径が27000倍で確認でない場合には、「判断できず」とした。
容量維持率
比較例及び実施例について、グローブボックス内のAr雰囲気下にて対極に金属リチウム、ポリエチレン製セパレーター、EC/DMC3:7 1MLiPF6の電解液を用いて充放電試験用電池セルを組立て、サイクル試験を実施した。充放電条件は充電時の電流密度0.25mA/cm2、カットオフ電圧3mV(vs Li/Li+)、放電時の電流密度1.00mA/cm2、カットオフ電圧2.0V(vs Li/Li+)で30サイクルまでの充放電とした。1サイクル目放電容量に対する30サイクル目の放電容量を容量維持率とした。
The measuring method is as follows.
CuKα X-ray diffraction of the surface of the thin film negative electrode active material layer was performed with an X-ray diffraction apparatus for X-ray diffraction maximum peak half width thin film evaluation (apparatus: RINT2000 manufactured by Rigaku), and the half width of the maximum peak was measured. The full width at half maximum of the maximum peak of the sample without heat treatment after the plating of Comparative Example 1 was 1.83 °.
The average grain size of the Sn-Co alloy was measured at an area of 3 μm × 5 μm at 9000 to 27000 times the average grain size SIM image (apparatus: SMI3050SE manufactured by SII), and averaged by the number of crystal grains. did. When the average crystal grain size was 27000 times and it was not confirmed, it was judged as “not judged”.
About the capacity maintenance rate comparison example and the example, a battery cell for charge / discharge test was assembled using an electrolytic solution of metallic lithium, polyethylene separator, EC / DMC3: 71 1MLiPF6 on the counter electrode under an Ar atmosphere in the glove box, and the cycle. The test was conducted. The charge / discharge conditions are as follows: current density at charge 0.25 mA / cm 2 , cut-off voltage 3 mV (vs Li / Li +), current density at discharge 1.00 mA / cm 2 , cut-off voltage 2.0 V (vs Li / Li +) ) Up to 30 cycles. The discharge capacity at the 30th cycle relative to the discharge capacity at the 1st cycle was defined as the capacity retention rate.

表3に実施例の結果を示す。
発明例No.1〜7、比較例No.1〜8は、ピロりん酸浴でSn−Co膜を形成したため、熱処理前における活物質の最大ピークの半値幅は、1.83°であり、低結晶性の結晶構造であった。さらに、発明例No.1〜7は240〜350℃で熱処理をした結果、活物質の最大ピークの半値幅は0.2〜0.55°の範囲内であり、良好なサイクル特性を示した。
比較例No.1はめっきで形成した薄膜に熱処理を施さなかったため、最大ピークの半値幅が1.83°のままである低結晶性の結晶構造のままであった。従って、30サイクルの充放電試験のサイクル特性は81%と低かった。
比較例No.2〜7では熱処理温度150℃、200℃、220℃では、十分ではなく、最大ピーク半値幅は0.6°以上である低結晶性の結晶構造が残ったため、サイクル特性は85〜89%と比較例1と比べてわずかに改善されているものの、本発明品よりも劣っている。
比較例No.8では熱処理温度400℃で実施されたため、熱処理後のSIMの観察では、0.35μmの平均結晶粒径が観察され、活物質の最大ピークの半値幅は0.19°と結晶性が高くなっていることがわかる。維持率は67%と低かった。
比較例No.9、11では、Sn−Co膜の形成に塩化浴或いはシアン浴を用いたため、最大ピーク半値幅はいずれも0.16となり、SIM観察でも0.23μm及び0.21μmの平均結晶粒径が見られ、維持率は、72%及び77%と低かった。
さらに、比較例No.9及びNo.11を熱処理した比較例No.10及びNo.12については、No.9及びNo10が低結晶性の結晶構造を有する活物質でないことから、熱処理温度300℃で実施しても半値幅は0.12°及び0.11°、結晶粒径は、1.18μm及び1.33μm、比較例No.9及びNo.11より結晶性が高いため、維持率は、64%及び59%と低下した。
Table 3 shows the results of the examples.
Invention Example No. 1-7, Comparative Example No. In Nos. 1 to 8, since the Sn—Co film was formed in the pyrophosphoric acid bath, the half-width of the maximum peak of the active material before the heat treatment was 1.83 °, which was a low-crystalline crystal structure. Furthermore, Invention Example No. As a result of heat treatment at 240 to 350 ° C. for Nos. 1 to 7, the full width at half maximum of the active material peak was in the range of 0.2 to 0.55 °, indicating good cycle characteristics.
Comparative Example No. In No. 1, since the thin film formed by plating was not subjected to heat treatment, the half-width of the maximum peak remained at 1.83 ° and remained a low crystalline crystal structure. Therefore, the cycle characteristics of the 30-cycle charge / discharge test were as low as 81%.
Comparative Example No. In 2 to 7, heat treatment temperatures of 150 ° C., 200 ° C., and 220 ° C. are not sufficient, and a low crystalline crystal structure having a maximum peak half width of 0.6 ° or more remains, so that the cycle characteristics are 85 to 89%. Although it is slightly improved as compared with Comparative Example 1, it is inferior to the product of the present invention.
Comparative Example No. No. 8 was carried out at a heat treatment temperature of 400 ° C., and therefore, an average crystal grain size of 0.35 μm was observed in the SIM observation after the heat treatment, and the half-width of the maximum peak of the active material was 0.19 ° and the crystallinity was high. You can see that The maintenance rate was as low as 67%.
Comparative Example No. In Nos. 9 and 11, since a chloride bath or a cyan bath was used to form the Sn—Co film, the maximum peak half-value widths were both 0.16, and the average crystal grain sizes of 0.23 μm and 0.21 μm were also observed by SIM observation. The maintenance rate was as low as 72% and 77%.
Further, Comparative Example No. 9 and no. Comparative Example No. 11 was heat-treated. 10 and no. For No. 12, no. 9 and No. 10 are not active materials having a low crystalline crystal structure. Therefore, even when the heat treatment temperature is 300 ° C., the half widths are 0.12 ° and 0.11 °, and the crystal grain sizes are 1.18 μm and 1 .33 μm, Comparative Example No. 9 and no. Since the crystallinity was higher than 11, the maintenance ratio decreased to 64% and 59%.

発明例No.3におけるSn−Co活物質層のX線回折の結果である。Invention Example No. 3 is a result of X-ray diffraction of the Sn—Co active material layer in FIG. 発明例No.3における断面のSIM像である。Invention Example No. 3 is a SIM image of a cross section in FIG.

Claims (6)

銅又は銅合金箔基材上の片面もしくは両面にLiと合金化するSnとLiと合金化しない金属との合金からなる活物質層を形成してなるリチウム二次電池用負極において、CuKα線を用いた該活物質層のX線回折法での最大ピークの半値幅が2θで0.2〜0.55°であることを特徴とするリチウム二次電池用負極。   In a negative electrode for a lithium secondary battery in which an active material layer made of an alloy of Sn alloyed with Li and a metal not alloyed with Li is formed on one side or both sides of a copper or copper alloy foil base material, A negative electrode for a lithium secondary battery, wherein the active material layer used has a maximum peak half-value width of 2θ of 0.2 to 0.55 ° in the X-ray diffraction method. Liと合金化しない金属がCoであることを特徴する請求項1のリチウム二次電池用負極。   2. The negative electrode for a lithium secondary battery according to claim 1, wherein the metal not alloyed with Li is Co. 活物質層のSn組成が50〜70質量%である請求項1又は2記載のリチウム二次電池用負極。   The negative electrode for a lithium secondary battery according to claim 1 or 2, wherein the Sn composition of the active material layer is 50 to 70 mass%. 活物質層の膜厚が片面あたり2〜15μmである請求項1〜3何れか一項記載のリチウム二次電池用負極。   The negative electrode for a lithium secondary battery according to any one of claims 1 to 3, wherein the thickness of the active material layer is 2 to 15 µm per side. 銅又は銅合金箔基材上の片面もしくは両面に、Liと合金化するSnとLiと合金化しない金属との合金からなり、CuKα線を用いたX線回折法での最大ピークの半値幅が2θで0.6°以上である活物質層を形成し、次いで、該活物質層のX線回折法での最大ピークの半値幅が2θで0.2〜0.55°の範囲となる温度及び時間の条件で熱処理を施すことを特徴とする請求項1〜4何れか一項記載のリチウム二次電池用負極の製造方法。   It consists of an alloy of Sn alloyed with Li and a metal not alloyed with Li on one or both surfaces of a copper or copper alloy foil base material, and the half-width of the maximum peak in the X-ray diffraction method using CuKα rays is An active material layer that is 0.6 ° or more at 2θ is formed, and then the half-value width of the maximum peak in the X-ray diffraction method of the active material layer is a range of 0.2 to 0.55 ° at 2θ The method for producing a negative electrode for a lithium secondary battery according to any one of claims 1 to 4, wherein the heat treatment is performed under conditions of time and time. 活物質層が電気めっき法により形成されることを特徴とする請求項5のリチウム二次電池用負極の製造方法。   6. The method for producing a negative electrode for a lithium secondary battery according to claim 5, wherein the active material layer is formed by electroplating.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011108467A1 (en) * 2010-03-01 2011-09-09 古河電気工業株式会社 Surface treatment method for copper foil, surface treated copper foil and copper foil for negative electrode collector of lithium ion secondary battery
JP2011204677A (en) * 2010-03-01 2011-10-13 Furukawa Electric Co Ltd:The Copper foil for negative electrode collector of lithium ion secondary battery, method of manufacturing the same, negative electrode of lithium ion secondary battery, and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011108467A1 (en) * 2010-03-01 2011-09-09 古河電気工業株式会社 Surface treatment method for copper foil, surface treated copper foil and copper foil for negative electrode collector of lithium ion secondary battery
JP2011204677A (en) * 2010-03-01 2011-10-13 Furukawa Electric Co Ltd:The Copper foil for negative electrode collector of lithium ion secondary battery, method of manufacturing the same, negative electrode of lithium ion secondary battery, and method of manufacturing the same

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