JP2009201000A - Camera module, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent scraps or the like of a through-hole from attaching on a photo-detection section of an imaging element, in a camera module. <P>SOLUTION: The camera module includes: a substrate 10 on which a through-hole 11 is formed; an imaging element 20 mounted on one-side surface 10a of the substrate so that a photo-detection section 21 may face the through-hole; and a lens unit 30 mounted on another-side surface 10b of the substrate so as to face the photo-detection section of the imaging element via the through-hole. The substrate 10 includes conductive coating foil 15 which covers at least an inner peripheral surface 11a of the through-hole 11 and is connected to a ground. Thus, with an achievement of simplification of a structure or a reduction in costs, scraps and dust, that are generated in opening the through-hole, can be prevented from falling and attaching on the photo-detection section of the imaging element. Furthermore, dust can be prevented from attaching on an area of the through-hole by static electricity or the like, the attached dust or the like is prevented from falling onto the photo-detection section, and the shield effect on the substrate can be obtained. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a camera module in which an imaging element such as a CCD or CMOS and a lens unit including a lens that forms an image of a subject on a light receiving portion of the imaging element are mounted on a substrate, and a manufacturing method thereof. The present invention relates to a camera module in which an imaging element and a lens unit are mounted with a through hole interposed therebetween, and a manufacturing method thereof.

  As a conventional camera module, as shown in FIG. 9A, a substrate 1 having a through hole 1a, a metal plate 2 bonded to one surface of the substrate 1 and having a through hole 2a having the same diameter as the through hole 1a. The image pickup element 3 flip-chip mounted on one surface of the substrate 1 so that the light receiving portion 3a faces the through holes 1a and 2a, and the lens G on the light receiving portion 3a of the image pickup element 3 with the through holes 1a and 2a interposed therebetween. There is known one having a lens unit 4 mounted on the other surface side (on the metal plate 2) of the substrate 1 so as to face each other (see, for example, Patent Document 1).

  In this camera module, since the substrate 1 and the metal plate 2 are provided with through holes 1a and 2a, when the through holes 1a and 2a are formed, the substrate 1 and the metal plate 2 are cut in the region of the inner peripheral surface that defines the through holes 1a and 2a. Waste or dust is generated. Therefore, even if the processed substrate 1 and the metal plate 2 are cleaned, these chips and dust cannot be completely removed, and the chips attached after the lens unit 4 and the image sensor 3 are mounted. There is a possibility that dust and dirt may adhere to the light receiving portion 3a of the image pickup device 3.

  As another conventional camera module, as shown in FIG. 9 (b), a substrate 1 having a through hole 1a, a through hole 1a 'bonded to one surface of the substrate 1 and having the same diameter as the through hole 1a. The image pickup device 3 flip-chip mounted on one surface of the substrate 1 so that the light receiving portion 3a faces the through holes 1a and 1a ′, and the inner peripheral surface of the through holes 1a and 1a ′. And the lens G is opposed to the light receiving portion 3a of the imaging element 3 with the opaque resin portion 5 and the through holes 1a and 1a 'interposed between the upper surface of the substrate 1' and preventing light from entering from the outside. Thus, there is known one provided with a lens unit 4 mounted on the upper surface of the resin portion 5 on the other surface side of the substrates 1 and 1 '(see, for example, Patent Document 2).

  In this camera module, areas of the inner peripheral surfaces of the through holes 1a and 1a ′ are covered with the resin portion 5. As a manufacturing procedure thereof, first, after mounting the imaging device 3 on the substrate 1, a liquid resin is used. Is applied so as to cover the inner peripheral surfaces of the through holes 1a and 1a ′, and the resin part 5 is formed by curing the applied resin. Therefore, before forming the resin part 5, the through holes 1a and 1a ′ There is a risk that chips, dust, or the like generated in the area of the inner peripheral surface will fall on the light receiving portion 3a of the image sensor 3. In addition, since the resin portion 5 is formed by applying and curing a liquid resin, it is difficult to manage the shape thereof with high accuracy, and there is a risk of causing variation in the shape. A separate member that is not directly related to 1 'is required, resulting in an increase in cost. Furthermore, there is a possibility that the resin part 5 attracts dust and the like by electrification and further promotes adhesion of dust and the like to the image sensor.

JP 2001-78064 A JP 2003-101002 A

  The present invention has been made in view of the above circumstances, and the object of the present invention is to cut chips and dust generated when opening a through hole while simplifying the structure and reducing the cost. The present invention provides a camera module that can prevent the image sensor from adhering to the image sensor, can prevent dust from adhering to the area of the through-hole due to static electricity or the like, and can provide a shielding effect on the substrate, and a method for manufacturing the same. .

The camera module of the present invention includes a substrate on which a through hole is formed, an image sensor mounted on one surface of the substrate so that the light receiving unit faces the through hole, and a light receiving unit of the image sensor through the through hole. And a lens unit mounted on the other surface of the substrate so as to face the substrate, wherein the substrate covers at least the inner peripheral surface of the through hole and is electrically connected to the ground. The coating foil is provided.
According to this configuration, the conductive coating foil is disposed so as to cover at least the inner peripheral surface of the substrate through which the light receiving portion of the image sensor faces, and is connected to the ground (grounded). While achieving structure simplification and cost reduction, it is possible to prevent chips and dust generated when opening the through-hole from falling and adhering to the light receiving part of the image sensor, Thus, it is possible to prevent dust and the like from adhering to the region of the through-hole and dropping the attached dust and the like to the light receiving unit.

In the camera module having the above-described configuration, it is possible to employ a configuration in which the covering foil is a through hole that electrically connects conductors disposed on both surfaces of the substrate.
According to this configuration, by applying through holes used for wiring connection of the substrate as the coating foil, the conductors (here, the coating foils) disposed on both sides of the substrate are connected, and the above-mentioned The dustproof effect can be obtained.

In the camera module having the above-described configuration, a configuration in which a black coating is applied to the surface of the covering foil can be employed.
According to this configuration, when subject light travels from the lens unit to the image sensor through the through hole, irregular reflection due to the gloss of the covering foil provided on at least the inner peripheral surface of the through hole can be prevented.

In the camera module having the above-described configuration, the covering foil extends from the inner peripheral surface and the peripheral region of the through hole, and is disposed along the printed wiring formed on the surface on at least one side of the substrate. A configuration can be employed.
According to this configuration, since the covering foil extends not only from the inner peripheral surface of the through-hole but also from the peripheral area (opening edge) of the through-hole, the covering foil is disposed along the printed wiring. Shielding effect can be obtained.

In addition, in the method for manufacturing a camera module according to the present invention, a through hole is formed in the substrate, the image sensor is mounted on one surface of the substrate so that the light receiving portion faces the through hole, and the image sensor receives light through the through hole. A method of manufacturing a camera module in which a lens unit is mounted on the other surface of the substrate so as to face the portion, and the substrate covers at least the inner peripheral surface of the through hole prior to mounting the imaging element. A conductive coating foil is disposed so as to be connected to the ground.
According to this configuration, after the through-hole is formed in the substrate, the conductive coating foil is formed before mounting the image sensor on the one side surface of the substrate (flip chip mounting or the like) in the region facing the through-hole. However, since it is disposed so as to cover at least the inner peripheral surface of the through-hole and to be connected to the ground, it is possible to pre-contain chips and dust generated when the through-hole is opened. Can be prevented from falling and adhering to the light receiving part of the slab, and dust or the like can adhere to the area of the through hole due to static electricity or the like and can be prevented from falling to the light receiving part. .

  According to the camera module having the above-described configuration and the manufacturing method thereof, it is possible to prevent chips and dust generated when opening the through-hole from adhering to the image sensor while achieving simplification of the structure and cost reduction. It is possible to prevent dust and the like from adhering to the area of the through hole due to static electricity or the like, and to obtain a shielding effect on the substrate.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the invention will be described with reference to the accompanying drawings.
1 to 6 show an embodiment of a camera module according to the present invention. FIG. 1 is a perspective view showing a mobile phone equipped with the camera module, FIG. 2 is a front view of the camera module, and FIG. 4 is a rear view of the camera module, FIG. 4 is a cross-sectional view of the camera module, and FIGS. 5 and 6 are a front view and a rear view showing coating foil and printed wiring arranged on the substrate.

As shown in FIG. 1, the camera module M is mounted on a mobile phone T or the like and applied as a mobile camera.
As shown in FIGS. 2 to 4, the camera module M includes a substantially rectangular substrate 10, an image sensor 20 mounted on one surface 10 a of the substrate 10, and a lens mounted on the other surface 10 b of the substrate 10. A unit 30 and the like are provided.

  As shown in FIGS. 2 to 4, the substrate 10 has a rectangular through hole 11 and a print arranged to electrically connect the image sensor 20 and other electronic components (not shown) on one surface 10 a. Wiring 12, printed wiring 13 arranged to electrically connect electronic components (not shown) on the other side surface 10b, connector 14 provided to connect to the motherboard MB on one side 10a, through The covering foil 15, the printed wiring 12, and the printed wiring 13 that are disposed extending from the inner peripheral surface 11 a of the hole 11 and the edge region thereof onto the one surface 10 a and the other surface 10 b are electrically connected. A through hole 17 or the like for electrically connecting the through hole 16 and the covering foil 15a disposed on the one surface 10a of the covering foil 15 and the covering foil 15b disposed on the other surface 10b. Eteiru.

As the substrate 10, a rigid substrate using a non-flexible insulator base material, a flexible substrate in which a thin flexible material is laminated on the insulator base material, and a hard material and a flexible material are used. A rigid flexible substrate formed in a composite manner is employed.
As shown in FIGS. 2 and 3, the through hole 11 is formed in a rectangular shape so as to have substantially the same shape as the light receiving portion 21 of the imaging element 20.
The printed wirings 12 and 13 are formed by forming a copper foil using a copper material or the like on both surfaces 10a and 10b of the substrate 10 and applying a photoresist or the like thereon, followed by pattern exposure and development, etc. It is formed by the etching method etc. which leave only.

As shown in FIGS. 4 to 6, the covering foil 15 includes a covering foil 15a disposed on one surface 10a of the substrate 10, a covering foil 15b disposed on the other surface 10b of the substrate 10, and a substrate. The covering foil 15c is disposed so as to cover the inner peripheral surface 11a of the ten through holes 11, the covering foil 15d is disposed in the peripheral region of the opening end of the through hole 11, and the like. Then, as shown in FIG. 6, the covering foil 15a is arranged to extend to the area of the connector 14 and is connected (grounded) to the ground.
Here, the covering foil 15 b that forms the main area of the covering foil 15 is disposed on the other surface 10 b of the substrate 10.
The covering foil 15c disposed so as to cover the inner peripheral surface 11a of the through-hole 11 is formed on the covering foil 15a as a conductor disposed on the one surface 10a of the substrate 10 and the other surface 10b. It functions as a through hole that electrically connects the covering foil 15b as a conductor disposed in the wire.

As described above, the conductive coating foil 15 (15c) functioning as a through hole is disposed so as to cover at least the inner peripheral surface 11a of the through hole 11 of the substrate 10 facing the light receiving portion 21 of the image pickup device 20. Then, since the entire covering foil 15 is connected (grounded) to the ground, chips and dust generated when the through hole 11 is opened are prevented from dropping and adhering to the light receiving portion 21 of the image sensor 20. In addition, it is possible to obtain a dustproof effect that can prevent dust or the like from adhering to the region of the through-hole 11 due to static electricity or the like and dropping the attached dust or the like onto the light receiving unit 21.
Further, as shown in FIG. 2, the covering foil 15 extends from the inner peripheral surface 11 a and the peripheral region of the through hole 11 and is disposed along the printed wiring 13 formed on the surface 10 b of the substrate 10. ing. That is, since the covering foil 15 is arranged so as to extend not only from the inner peripheral surface 11a of the through hole 11 but also from the peripheral region (opening edge portion) of the through hole 11 along the printed wiring 13, 13. A shielding effect for protecting other electronic components and the like can be obtained.
Further, a black coating may be applied to the surface of the coating foil 15 c formed so as to cover at least the inner peripheral surface 11 a of the coating foil 15. According to this, when the subject light passes through the through hole 11 (region of the covering foil 15c), it is possible to prevent irregular reflection.

The image pickup device 20 is an image pickup device such as a CCD or a CMOS, and has a light receiving portion 21 that receives subject light that has passed through the lens unit 30 as shown in FIGS. 3 and 4, and this light receiving portion 21 is a through hole. 11 is flip-chip mounted on one surface 10 a of the substrate 10 via bumps 22. Then, the periphery of the image sensor 20 is sealed and adhered by the sealing resin agent 40.
As shown in FIGS. 2 to 4, the image sensor 20 is electrically connected to the printed wiring 12 disposed on the surface 10 a on one side of the substrate 10.

As shown in FIGS. 2 and 4, the lens unit 30 is arranged inside a cylindrical lens frame 31 that defines a circular opening 31 a, a lens cover 32 held by the lens frame 31, and the lens cover 32. It has a lens 33 and the like, and is mounted on the other surface 10 b of the substrate 10 so that the lens 33 faces the light receiving portion 21 of the imaging element 20 through the through hole 11. Then, the periphery of the lens frame 31 of the lens unit 30 is sealed and adhered by the sealing resin agent 40.
In this example, the lens unit 30 includes one lens 33. However, the lens unit 31 is not limited to this, and the lens frame 31 is extended to perform a zooming operation. You may employ | adopt the thing provided with the mechanism.

Next, a manufacturing method of the camera module M will be described.
First, a rectangular through hole 11 is opened in the substrate 10 by a predetermined method such as cutting.
Subsequently, the conductive coating foil 15 is disposed by a predetermined thin film forming method in a layout that covers the inner peripheral surface 11a of the through hole 11 and is connected to the ground.

The covering foil 15 includes a covering foil 15 c that covers the inner peripheral surface 11 a of the through hole 11, a covering foil 15 d that covers the peripheral area of the through hole 11, and a connector that extends from the covering foil 15 d on the surface 10 a on one side of the substrate 10. 14 and the coating foil 15b along the printed wiring 13 formed on the other surface 10b of the substrate 10 are integrally connected to each other.
As described above, the covering foil 15 is arranged so as to extend from the peripheral area (opening edge portion) of the through hole 11 along the printed wiring 13 as well as the inner peripheral surface 11a of the through hole 11. The printed wiring 13 and other electronic components are protected from static electricity and the like.
Moreover, since the inner peripheral surface 11a of the through-hole 11 is covered with the covering foil 15 (15c), it is possible to prevent chips and dust generated in the previous drilling process from being trapped and scattered around. .
Further, when subject light is irregularly reflected due to the glossy reflection of the coating foil 15 (15c), a black coating can be applied to the surface of the coating foil to prevent irregular reflection.

When the printed wirings 12 and 13 are formed, they are covered with a resist material or the like except for the portion where the imaging element 20, the connector 14, and other electronic components are mounted, including the covering foil 15.
Further, the printed wiring 12 and the covering foil 15a disposed on the one surface 10a and the printed wiring 13 and the covering foil 15b disposed on the other surface 10b are electrically connected to the substrate 10. A plurality of through holes 16 and 17 are attached for connection.
The imaging element 20 is mounted on the one surface 10 a of the substrate 10 via the bumps 22 so that the light receiving portion 21 faces the through hole 11. Thereafter, the sealing resin 40 is filled around the imaging element 20.

Subsequently, the lens unit 30 is disposed so that the lens 33 faces the through hole 11 with respect to the other surface 10b of the substrate 10, and the sealing resin 40 is disposed around the lens unit 30 (lens frame 31). Filled and glued.
In this way, the through hole 11 is formed in the substrate 10, the image sensor 20 is mounted on the one surface 10 a of the substrate 10 so that the light receiving portion 21 faces the through hole 11, and the light receiving of the image sensor 20 through the through hole 11. When the lens unit 30 is mounted on the other surface 10 b of the substrate 10 so as to face the portion 21, the substrate 10 covers the inner peripheral surface 11 a of the through hole 11 and the ground before mounting the imaging device 20. A conductive coating foil 15 is disposed so as to be connected to the.

  That is, after the through hole 11 is opened in the substrate 10, before mounting the imaging element 20 on the one surface 10 a of the substrate 10 in the region facing the through hole 11 (such as flip chip mounting), the conductive material Since the covering foil 15 is disposed so as to cover at least the inner peripheral surface 11a of the through-hole 11 and to be connected to the ground, chips and dust generated when the through-hole 11 is opened can be enclosed in advance. Therefore, it can be prevented from dropping and adhering to the light receiving portion 21 of the image sensor 20, and since there is no resin part in the through hole 11, dust or the like adheres to the area of the through hole 11 due to static electricity or the like. In addition, it is possible to prevent the adhered dust or the like from falling on the light receiving unit 21 of the image sensor 20.

In the above embodiment, the covering foil 15a extending to the connector 14 is disposed on the one surface 10a of the substrate 10, and the covering foil is provided along the printed wiring 13 with respect to the other surface 10b of the substrate 10. Although the case where 15b is provided is shown, the present invention is not limited to this, and as shown in FIG. 7, it extends to the connector 14 along the printed wiring 12 with respect to the surface 10a on one side of the substrate 10. The covering foil 15a may be disposed, and the covering foil 15b (omitted from the cross-sectional relationship) may be disposed on the other surface 10b of the substrate 10.
In the above-described embodiment, the case where the imaging element 20 and the lens unit 30 are mounted on one substrate 10 has been described. However, the present invention is not limited to this, and as shown in FIG. The image pickup device 20 and the lens unit 30 are mounted on a multilayer structure substrate in which the inner peripheral surface 11a of the through hole 11 of the substrate 10 and the inner peripheral surface 11a ′ of the through hole 11 ′ of the substrate 10 ′ are at least provided. The covering foil 15 may be disposed so as to cover it.
Also in this case, as described above, it is possible to prevent chips and dust generated when opening the through holes 11 and 11 ′ from adhering to the image sensor 20 while achieving simplification of the structure and cost reduction. In addition, it is possible to prevent dust and the like from adhering to the regions of the through holes 11 and 11 ′ due to static electricity and the like, and to obtain a shielding effect and the like on the substrates 10 and 10 ′.

  As described above, the camera module and the manufacturing method thereof according to the present invention achieves simplification of the structure, cost reduction, and the like, and chips and dust generated when opening the through hole adhere to the image sensor. Because it can prevent dust from adhering to the area of the through-hole due to static electricity, etc., and can obtain a shielding effect on the substrate, it can be applied as a small camera module mounted on a mobile phone etc. Of course, it can be used as a camera module for other portable information terminals, as a camera module built in a fixed surveillance camera, etc., and as a camera module mounted on other imaging devices. is there.

It is a perspective view which shows the mobile telephone carrying the camera module which concerns on this invention. It is a front view which shows one Embodiment of the camera module which concerns on this invention. It is a rear view which shows one Embodiment of the camera module which concerns on this invention. It is sectional drawing in EE in FIG. It is a front view of the board | substrate before mounting a lens unit. It is a rear view of the board | substrate before mounting an image pick-up element. It is sectional drawing which shows other embodiment of the camera module which concerns on this invention. It is sectional drawing which shows other embodiment of the camera module which concerns on this invention. (A), (b) is sectional drawing which shows the conventional camera module.

Explanation of symbols

G lens T mobile phone M camera module 2 metal plate 5 resin part 1, 1 ', 10, 10' substrate 10a surface 10b on one side of substrate surface 1a, 1a ', 2a, 11, 11' on the other side of substrate Hole 11a, 11a 'Inner peripheral surface 12, 13 Printed wiring 14 Connector 15 (15a, 15b, 15c, 15d) Cover foil 15c Through hole 16, 17 Through hole 3, 20 Image sensor 3a, 21 Light receiving part 22 Bump 4, 30 Lens unit 31 Lens frame 31a Opening 32 Lens cover 33 Lens 40 Sealing resin

Claims (5)

A substrate on which a through hole is formed, an image sensor mounted on one surface of the substrate so that the light receiving portion faces the through hole, and a light receiving portion of the image sensor through the through hole A lens unit mounted on the other surface of the substrate, and a camera module comprising:
The substrate is provided with a conductive covering foil so as to cover at least the inner peripheral surface of the through hole and to be connected to the ground.
A camera module characterized by that. The covering foil is a through hole that electrically connects conductors disposed on both sides of the substrate.
The camera module according to claim 1. On the surface of the coating foil, a black coating is applied,
The camera module according to claim 1 or 2, characterized in that The covering foil is disposed so as to extend from the inner peripheral surface and the peripheral region of the through hole and along the printed wiring formed on the surface on at least one side of the substrate.
The camera module according to any one of claims 1 to 3, wherein A through hole is formed in the substrate, an image sensor is mounted on one surface of the substrate so that the light receiving portion faces the through hole, and the substrate is arranged so as to face the light receiving portion of the image sensor through the through hole. A method of manufacturing a camera module in which a lens unit is mounted on the other surface,
Prior to mounting the image sensor, the substrate is provided with a conductive covering foil so as to cover at least the inner peripheral surface of the through hole and to be connected to the ground.
A method for manufacturing a camera module.

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