JP2009295771A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component capable of suppressing migration between external electrodes. <P>SOLUTION: The electronic component 1 includes a laminate 2 on which a magnetic substrate 6 is stuck, and external electrodes 7-1 to 7-4. The laminate 2 is constituted by laminating insulating layers 41-46 and conductor patterns 51-54 over a magnetic substrate 3, and has parallel coils 5-1 and 5-2 therein. A groove 31 of the upper surface of the magnetic substrate 3 is interposed between the external electrodes 7-1 and 7-3 (7-2 and 7-4). A charge portion 41a is formed of the insulating layer 41 getting into the groove 31, and the magnetic substrate 3 is partitioned at a center by the charge portion 41a and the groove 31. A groove 61 of the lower surface of the magnetic substrate 6 is interposed between the external electrodes 7-1 and 7-3 (7-2 and 7-4). A charge portion 48a is formed of an adhesion layer 48 getting into the groove 61, and the magnetic substrate 6 is partitioned at the center by the charge portion 48a and the groove 61. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer electronic component used in a small electronic device such as a mobile phone.

Conventionally, in this type of electronic component 100, as shown in FIG. 20, layers 111 to 115 such as insulating layers and magnetic layers and coil patterns 121 and 122 are alternately stacked on a substrate 101, and a substrate 102 is placed on the uppermost layer. Then, external electrodes 131 and 132 indicated by two-dot chain lines are formed on the side surface of the laminate (for example, Patent Document 1).
At this time, the external electrodes 131 and 132 are formed by applying or vapor-depositing a conductive paste such as Ag on the side surface of the laminate and then plating a metal such as Ni thereon.

JP 2000-068125 A

However, the above-described conventional electronic components have the following problems.
For example, if the substrates 101 and 102 are ceramic substrates, the layers 111 and 115 that are in contact with the substrates 101 and 102 may be formed using polyimide resin or the like in order to reduce unevenness on the upper surface of the substrate 101.
However, since such a resin is greatly different in thermal expansion coefficient and shrinkage ratio from a ceramic substrate or the like, a gap may be generated between the ceramic substrate and the resin during firing.
That is, in the multilayer electronic component 100, when a material having a thermal expansion coefficient or contraction rate significantly different from that of the substrates 101 and 102 is used for the layers 111 and 115, as shown in FIG. Gap G1 and G2 are generated between 111 and 115.
For this reason, when a conductive paste such as Ag is applied to the side surface of the laminated body during the formation of the external electrodes 131 and 132, the pastes 131a, 132b, 131b, and 132b enter the gap G1 and the gap G2. As a result, when the electronic component 100 is used under high temperature and high humidity, a migration occurs between the pastes 131a and 132b and the pastes 131b and 132b due to the potential difference (electric field) between the external electrodes 131 and 132, and the substrates 101 and 102. The paste 131a, 132b and the paste 131b, 132b are electrically connected by a metal such as Ag deposited on the upper surface, and the external electrodes 131, 132 may be short-circuited.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an electronic component that can suppress migration between external electrodes.

In order to solve the above problems, the invention of claim 1 is a laminate in which an insulating layer and a conductor pattern are laminated on a first substrate, and a lead terminal of an internal circuit composed of the conductor pattern is exposed on a side surface; And an electronic component comprising one or more pairs of external electrodes provided on the side surface of the laminate so as to contact each lead terminal of the internal circuit, the upper surface of the first substrate and the same side surface of the laminate A linear groove is formed between a pair of external electrodes arranged in parallel or between a pair of external electrodes facing each other at opposite side surfaces, and an insulating layer directly above the first substrate is formed on the groove. It is set as the structure laminated | stacked on the 1st board | substrate in the state filled up in the inside.
With such a configuration, when the thermal expansion coefficient and the contraction ratio of the first substrate and the insulating layer directly above are different, a gap is formed between the upper surface of the first substrate and the lower surface of the insulating layer immediately above when firing these members. The paste-like external electrode portion may enter the gap when the external electrode is formed.
If the electronic component in such a state is used under high temperature and high humidity and a potential difference is generated between these invading pasty external electrode portions, migration may occur.
However, in the electronic component of the present invention, the linear groove is formed on the upper surface of the first substrate and the pair facing each other between the pair of external electrodes arranged on the same side surface of the laminated body or on the opposite side surface. And an insulating layer directly above the first substrate is stacked on the first substrate with the trench filled.
Therefore, even when this electronic component is used and a potential difference is generated between a pair of external electrodes arranged on the same side surface and metal is deposited on one external electrode portion, the other external electrode is deposited. Since the metal extending to the partial side is blocked by the insulating layer filled in the groove formed between the external electrodes, migration does not occur. In addition, even when an electrode is generated on a pair of external electrodes facing each other on opposite sides and the metal is deposited on one external electrode part, the metal deposited and extended to the other external electrode part side is Migration is not caused because the insulating layer filled in the groove formed between the external electrodes is blocked.

According to a second aspect of the present invention, in the electronic component according to the first aspect, one groove is formed between a pair of external electrodes arranged on the same side surface, and the other groove is opposed to the opposite side surface. The structure is formed between the external electrodes.
With this configuration, not only the migration that occurs between adjacent external electrode portions, but also the migration that occurs between opposing external electrode portions can be suppressed at the same time.

According to a third aspect of the present invention, in the electronic component according to the first or second aspect, the cross section of the groove is formed in a taper shape or an arc shape that narrows toward the bottom.
With such a configuration, it is possible to make it difficult to generate a gap between the insulating layer and the groove in the groove that is generated during firing.

According to a fourth aspect of the present invention, in the electronic component according to any one of the first to third aspects, the second substrate is attached to the upper surface of the laminate, and the first substrate is also applied to the lower surface of the second substrate. A groove corresponding to the groove of the first substrate is formed at a position corresponding to the groove of the first substrate, and the second substrate is placed on the insulating layer with the insulating layer directly below the second substrate filled in the groove. The configuration is pasted.
The configuration.
With such a configuration, when the thermal expansion coefficient and the contraction ratio of the second substrate and the insulating layer directly below are different, a gap is generated between the lower surface of the second substrate and the insulating layer immediately below when these members are fired. However, when the external electrode is formed, the paste-like external electrode portion may enter the gap, and migration may occur between the penetrated paste-like external electrode portions. However, even in such a case, as in the case of the invention of claim 1, the deposited metal extending from one external electrode portion to the other external electrode portion side is in the groove formed on the lower surface of the second substrate. Migration is not caused because it is blocked by the insulating layer filled in.

  As described above in detail, according to the present invention, the occurrence of migration can be suppressed by the insulating layer filled in the grooves provided between the arranged or opposed external electrodes, and as a result, high quality. There is an excellent effect that an electronic component can be provided.

  The best mode of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of an electronic component according to a first embodiment of the present invention, FIG. 2 is an external view of the electronic component, and FIG. 3 is a cross-sectional view taken along line AA in FIG. 4 is a cross-sectional view taken along the line BB in FIG.
As shown in these drawings, the electronic component 1 of this embodiment is a common mode choke coil, a laminated body 2 having a magnetic substrate 6 as a second substrate attached to the upper surface, and the laminated body 2. External electrodes 7-1 to 7-4 provided on the side surfaces of the substrate.

  As shown in FIGS. 1 and 3, the laminate 2 is obtained by laminating insulating layers 41 to 46 and conductor patterns 51 to 54 on a magnetic substrate 3 as a first substrate.

The magnetic substrate 3 is a rectangular plate formed of ferrite or the like, and a primary side parallel coil 5-1 and a secondary side parallel coil 5-2 as internal circuits are formed above the magnetic substrate 3. .
The primary side parallel coil 5-1 has an insulating layer 41, a conductor pattern 51, an insulating layer 42, a conductor pattern 52, and an insulating layer 43 stacked in order on the magnetic substrate 3 and through a through hole 42 a provided in the insulating layer 42. The conductor patterns 51 and 52 are electrically connected. The lead terminals 51a and 52a of the conductor patterns 51 and 52 are exposed at the lower left portion of the front surface 2a as the side surface of the multilayer body 2, and the lead terminals 51b and 52b are exposed at the lower left portion of the rear surface 2b as the side surface of the multilayer body 2. Has been.
On the other hand, the secondary parallel coil 5-2 is substantially the same as the primary parallel coil 5-1, and the insulating layer 44, the conductor pattern 53, the insulating layer 45, the conductor pattern 54, and the insulating layer 46 are formed on the insulating layer 43. Are sequentially stacked, and the conductive patterns 53 and 54 are electrically connected through the through holes 45a provided in the insulating layer 45.
The lead terminals 53 a 54 a of the conductor patterns 53 and 54 are exposed at the upper right part of the front surface 2 a of the multilayer body 2, and the lead terminals 53 b and 54 b are exposed at the upper right part of the rear surface 2 b of the multilayer body 2.

  The magnetic substrate 6 is a plate made of ferrite or the like, similar to the magnetic substrate 3, and is bonded onto the laminated body 2 via adhesive layers 47 and 48.

As shown in FIG. 2, the external electrodes 7-1 to 7-4 are respectively provided on the front surface 2a and the rear surface 2b of the multilayer body 2 on which the magnetic substrate 6 is bonded as described above.
Specifically, as shown in FIGS. 1 and 3, the lead terminals 51a, 51b, 52a, 52b of the primary side parallel coil 5-1 are exposed at the lower left of the front surface 2a and the rear surface 2b of the multilayer body 2, Since the lead terminals 53a, 53b, 54a, 54b of the secondary parallel coil 5-2 are exposed in the upper right part of the front surface 2a and the rear surface 2b, the external electrode 7-1 is connected to the lead terminals 51a, 52a and the external electrode 7 -2 is provided in contact with the lead terminals 51b and 52b, the external electrode 7-3 is provided in contact with the lead terminals 53a and 54a, and the external electrode 7-4 is provided in contact with the lead terminals 53b and 54b.
Accordingly, the external electrodes 7-1 and 7-2 face each other in a state of being electrically connected to the primary side parallel coil 5-1, and the external electrodes 7-3 and 7-4 are opposed to the secondary side parallel coil 5. -2 are opposed to each other while being electrically connected to each other. The external electrodes 7-1 and 7-3 are arranged side by side on the front surface 2a of the multilayer body 2, and the external electrodes 7-2 and 7-4 are arranged side by side on the rear surface 2b of the multilayer body 2. It is in a state.

In this embodiment, in the electronic component 1 having the above-described configuration, means for suppressing migration is provided on the magnetic substrates 3 and 6.
The means in the magnetic substrate 3 is composed of a groove 31 and a filling part 41a.
Specifically, as shown in FIGS. 1 and 4, a linear groove 31 having a rectangular cross section is formed on the upper surface of the magnetic substrate 3 and extends from the front surface 2 a to the rear surface 2 b of the multilayer body 2. .
The groove 31 is formed at the center of the upper surface of the magnetic substrate 3. That is, the groove 31 is interposed between a pair of external electrodes 7-1 and 7-3 (7-2 and 7-4) arranged on the front surface 2a (rear surface 2b) which is the same side surface of the multilayer body 2. ing.
The filling portion 41 a is a portion of the insulating layer 41 that has entered the groove 31 when the insulating layer 41 directly above is stacked on the upper surface of the magnetic substrate 3. The filling portion 41a has entered the entire length of the groove 31, and as shown in FIG. 4, the upper surface of the magnetic substrate 3 is partitioned by the filling portion 41a and the groove 31 at the center portion. ing.
On the other hand, as shown in FIGS. 1 and 3, the means in the magnetic substrate 6 is composed of a groove 61 and a filling portion 48a.
Specifically, a linear groove 61 having the same shape as the groove 31 is formed on the lower surface of the magnetic substrate 6, and extends from the front surface 2 a to the rear surface 2 b of the multilayer body 2.
The formation position of the groove 61 corresponds to the formation position of the groove 31 and is the central portion of the lower surface of the magnetic substrate 6. That is, the groove 61 is also interposed between a pair of external electrodes 7-1 and 7-3 (7-2 and 7-4) arranged on the front surface 2a (rear surface 2b) which is the same side surface of the multilayer body 2. ing.
The filling portion 48 a is a portion of the adhesive layer 48 that has entered the groove 61 when the magnetic substrate 6 is attached to the insulating layer 46 directly below through the adhesive layers 47 and 48. Similarly to the filling portion 41a, the filling portion 48a also enters the entire length of the groove 61, and the lower surface of the magnetic substrate 6 is in a state of being partitioned by the filling portion 48a and the groove 61 at the center portion. ing.

Here, an example of a method for manufacturing the electronic component 1 will be briefly described.
FIG. 5 is a process diagram showing a manufacturing method of the electronic component 1, FIG. 6 is a cross-sectional view showing a laminating process, FIG. 7 is a cross-sectional view showing a crimping process, and FIG. 8 is a dicing process. It is the schematic which shows a baking process and an external electrode formation process.
As shown in FIG. 5, the electronic component 1 is manufactured by executing a stacking step S1, a crimping step S2, a dicing step S3, a firing step S4, and an external electrode forming step S5.

First, in the lamination step S1, as shown in FIG. 6A, the magnetic substrate 3 is prepared.
In this embodiment, the magnetic substrate 3 such as ferrite is used as the first substrate, but the material of the substrate is not limited to the magnetic material, and the first material may be a dielectric or an insulator depending on the application. Alternatively, the substrate may be formed. However, the surface roughness Ra of the substrate 3 is desirably polished to 0.5 μm or less so that there is no problem when the insulating layers 41 to 46 and the conductor patterns 51 to 54 are laminated on the substrate 3.
Then, the magnetic substrate 3 is diced while adjusting the depth of cut into the magnetic substrate 3 by the dicing saw 300 used in the dicing step S3 to be described later. It is formed on the upper surface of the body substrate 3.
In this state, the laminated body 2 is formed by alternately laminating the insulating layers 41 to 46 and the conductor patterns 51 to 54 a plurality of times using a photolithography technique.
Specifically, as shown in FIG. 6B, an insulating layer 41 made of polyimide resin is laminated on the upper surface of the magnetic substrate 3, and the insulating layer 41 is filled into the groove 31 to form a filling portion 41a. To do.
Then, as shown in FIG. 6C, an Ag film layer is formed on the insulating layer 41 by using a film forming technique such as a thin film forming method such as sputtering or vapor deposition, or a thick film forming method such as screen printing. Thereafter, the conductor pattern 51 having the lead terminals 51a and 51b is formed by using a series of photolithography techniques such as resist coating, exposure, development and etching.
Subsequently, as shown in FIG. 6D, a photosensitive polyimide resin is applied on the conductor pattern 51, and exposure and development are performed, thereby forming an insulating layer 42 having a through hole 42a. Then, similarly to the conductor pattern 51 and the insulating layer 41, the conductor pattern 52 having the lead terminals 52a and 52b and the insulating layer 43 are sequentially laminated on the insulating layer 42, thereby allowing the primary side parallel coil 5- 1 (see FIG. 1).
Thereafter, the insulating layers 44, 45, and 46 and the conductor patterns 53 and 54 are alternately laminated on the primary side parallel coil 5-1, similarly to the primary side parallel coil 5-1. A secondary parallel coil 5-2 (see FIG. 1) is formed.
Thereby, lamination process S1 is completed and layered product 2 is formed.
In this example, Ag is used as a material for forming the conductor patterns 51, 52, 53, 54. However, as the conductor patterns 51, 52, 53, 54, Cu, Pd, Al, etc. excellent in conductivity are used. Of course, these metals and their alloys can be used.
In addition, polyimide resin is used as the insulating layers 41, 42, 43, 44, 45, 46. However, since the insulating layers 42, 45 form the through holes 42a, 45a, it is necessary to use photosensitive polyimide resin. is there. Further, as the insulating layers 41, 42, 43, 44, 45, and 46, various resin materials such as epoxy resin and benzocycloptene resin, glass such as SiO2, glass ceramics, dielectrics and the like are used in addition to the polyimide resin. Of course you can.

Next, in the crimping step S2, first, as shown in FIG. 7A, similarly to the magnetic substrate 3, a magnetic substrate such as ferrite having a rectangular cross section and a linear groove 61 formed on the lower surface thereof. 6, and adhesive layers 47 and 48 of a thermosetting polyimide resin that also functions as an insulating layer are applied to the upper surface of the laminate 2 and the lower surface of the magnetic substrate 6, and the magnetic substrate 6 is laminated. Affix on body 2.
In this state, as shown in FIG. 7B, the laminated body 2 to which the magnetic substrate 6 is attached is set in a vacuum hot press machine 200 and heated in a vacuum or in an inert gas. Then, the magnetic substrate 6 is pressed onto the laminated body 2 by pressing the magnetic substrate 6 at a high pressure. Thereafter, cooling and releasing the pressure of the vacuum hot press machine 200 completes the crimping step S3.
Through this crimping step S3, a part of the adhesive layer 48 of the laminated body 2 enters the groove 61 of the magnetic substrate 6 to form the filling portion 48a.
When the electronic component 1 is reflow-mounted, the maximum temperature reached around 260 ° C., and therefore, a thermosetting polyimide resin having a glass transition temperature of 270 ° C. or higher was used as the adhesive layers 47 and 48. . Further, in the crimping step S3, the laminate 2 and the magnetic substrate 6 are crimped by applying a high temperature of 350 ° C. to 390 ° C., so that the gas flows out from the adhesive layers 47 and 48 due to this high temperature. There is a risk of creating holes in 47 and 48. The holes may cause a short circuit of the internal conductor pattern when the adhesion force is reduced or moisture is accumulated in the holes. Therefore, as the adhesive layers 47 and 48, it is desirable to use a thermosetting polyimide resin having a heat resistant temperature of 400 ° C. or higher.

Through the crimping step S3 as described above, the mother substrate 1 'to which the magnetic substrate 6 and the laminated body 2 are firmly bonded is formed, so that the mother substrate 1' is made into a small chip by the dicing step S4. To divide.
Specifically, as shown in FIG. 8A, the mother substrate 1 ′ is divided by a dicing saw 300, and the chip 1 ″ is cut out as shown in FIG. 8B.
Thereafter, by chamfering with a barrel (not shown), the lead terminals 51a, 51b, 52a and 52b of the parallel coils 5-1 and 5-2 are exposed on the front surface 2a and the rear surface 2b of the multilayer body 2 respectively. Can be obtained.

The cut chip 1 ″ is baked in the baking step S4 as shown in FIG.
FIG. 9 is a cross-sectional view showing a gap generated between the magnetic substrate 3 and the layers 41 and 48.
As the material of the electronic component 1, if ferrite or the like is used for the magnetic substrates 3 and 6 and polyimide resin or the like is used for the insulating layers 41 to 46, the coefficient of thermal expansion or shrinkage between the magnetic substrates 3 and 6 and the layers 41 and 48 is reduced. Since the rates are different, gaps G1 and G2 may be generated between the magnetic substrate 3 and the insulating layer 41 and between the magnetic substrate 6 and the adhesive layer 48 during the firing.

After passing through the firing step S4, an external electrode forming step S5 is performed.
In the external electrode forming step S5, first, the Ag film is formed on the front surface of the multilayer body 2 so as to be connected to the lead terminals 51a, 51b, 52a, 52b by applying a conductive paste containing Ag, sputtering or vapor deposition of Ag, or the like. 2a and a film are formed on the rear surface 2b. Then, a metal film such as Ni, Sn—Pb is formed on the Ag film by wet electrolytic plating or the like.
Thereby, as shown in FIG.8 (d), the electronic component 1 provided with the external electrodes 7-1 to 7-4 is manufactured.
In this example, the Ni film is provided on the thin film Ag to form the external electrodes 7-1 to 7-4. However, the Ni film is formed on the thin film such as Ab-Pd, Cu, NiCr, or NiCu. , Sn-Pb or the like may be provided to form the external electrodes 7-1 to 7-4.

By the way, as shown in FIG. 9, when the gaps G1 and G2 are generated between the magnetic substrate 3 and the insulating layer 41 and between the magnetic substrate 6 and the adhesive layer 48, respectively, during firing. In the external electrode forming step S5, if a conductive paste containing Ag is applied or Ag sputtering or vapor deposition is performed, these metals may enter the gaps G1 and G2, respectively.
FIG. 10 is a longitudinal sectional view showing a state where Ag metal has entered the gaps G1 and G2, and FIG. 11 is a transverse sectional view showing a state where Ag metal has entered the gap G1.
That is, as shown in these figures, the paste-like or sputtered or vapor-deposited Ag metal 7-1a is in the gap G1 and the external electrode 7-1 is formed, and the Ag metal 7-1b is in the gap G2. At the position where the external electrode 7-1 is formed, the Ag metal 7-2a is formed in the gap G1, and the external electrode 7-2 is formed, and in the position where the Ag metal 7-2b is formed in the gap G2, the external electrode 7-2 is formed. The Ag metal 7-3a is at the position where the external electrode 7-3 is formed in the gap G1, and the Ag metal 7-3b is at the position where the external electrode 7-3 is formed in the gap G2. However, the Ag metal 7-4b may enter the external electrode 7-4 formation position in the gap G1 and the external electrode 7-4 formation position in the gap G2. In such a case, as shown in FIG. 11, for example, in the gap G1, adjacent Ag metals 7-1a and 7-3a and Ag metals 7-2a and 7-4a are in close proximity.

Next, operations and effects of the electronic component 1 of this embodiment will be described.
FIG. 12 is a perspective view showing a mounted state of the electronic component 1.
As shown in FIG. 12, when the electronic component 1 is mounted on the differential lines 401 and 402, the electronic component 1 passes the differential signal transmitted through the differential lines 401 and 402, but enters the differential lines 401 and 402. It functions to cut off common mode noise.
At this time, since the pair of differential signals transmitted through the differential lines 401 and 402 are signals having the same amplitude and phase shifted by 180 °, the external electrodes 7-1 and 7-3 (7-2 and 7-4). ) Are different in polarity. For this reason, a potential difference (electric field) is generated between the external electrodes 7-1 and 7-3 (7-2 and 7-4).

FIG. 13 is a partial longitudinal sectional view for explaining the migration phenomenon, and FIG. 14 is a transverse sectional view for explaining the migration phenomenon.
That is, as shown in FIGS. 9 to 11, when the gaps G1 and G2 are generated during the firing step S4, and the Ag metal 7-1a and the like have entered the gaps G1 and G2 during the external electrode formation step S5, As shown in FIGS. 13 and 14, in the state where the groove 31 and the filling portion 41a are not present, a strong potential difference (electric field) is generated between the external electrodes 7-1 and 7-3 (7-2 and 7-4). For example, the Ag metal 7-1a (7-4a) on the external electrode 7-1 (7-4) side is the positive electrode, and the Ag metal 7-3a (7-2a) on the external electrode 7-3 (7-2) side When becomes a negative electrode, the Ag metal is ionized under high temperature and high humidity, and the Ag metal M is deposited on the Ag metal 7-3a (7-2a). The Ag metal M extends toward the Ag metal 7-1a (7-4a) on the positive electrode side with time, and finally, is connected to the Ag metal 7-1a (7-4a) on the positive electrode side to be in a migration state. Therefore, the external electrodes 7-1 and 7-3 (7-2 and 7-4) may be short-circuited.

FIG. 15 is a partial longitudinal sectional view for explaining the migration suppressing action, and FIG. 16 is a transverse sectional view for explaining the migration inhibiting action.
In the electronic component 1 of this embodiment, as described above, the groove 31 and the filling portion 41a, which are means for suppressing migration, are provided in the magnetic substrate 3, and the magnetic substrate 3 is formed by the filling portion 41a and the groove 31. It is in the state where the central part of was partitioned. For this reason, as shown in FIGS. 15 and 16, the Ag metal M deposited on the Ag metal 7-3a (7-2a) extends toward the Ag metal 7-1a (7-4a) on the positive electrode side with time. If it goes out, the filling part 41a which entered into the groove | channel 31 will block | interrupte Ag metal M, and will prevent extension to Ag metal 7-1a (7-4a) by the side of a positive electrode. Therefore, the Ag metal 7-3a (7-2a) on the negative electrode side and the Ag metal 7-1a (7-4a) on the positive electrode side are connected by the Ag metal M, and the external electrodes 7-1, 7-3 (7 The situation where a short circuit occurs between -2, 7-4) is prevented by the filling part 41a.
In addition, although the clearance gap has arisen between the groove | channel 31 and the filling part 41a, the deposited Ag metal M does not reach the Ag metal 7-1a (7-4a) on the positive electrode side through this clearance gap. The deposited Ag metal M extends only on the plane of the magnetic substrate 3 connecting the Ag metal 7-3a (7-2a) on the negative electrode side and the Ag metal 7-1a (7-4a) on the positive electrode side. This is because the Ag metal M does not bend and extend to the lower side of the magnetic substrate 3.
On the other hand, the space between the Ag metal 7-1b (7-2b) and the Ag metal 7-3b (7-4b) generated in the gap G2 between the magnetic substrate 6 and the adhesive layer 48 is also partitioned into the filling portion 48a. And no migration occurs.
Thus, according to this embodiment, since the occurrence of migration can be suppressed by the grooves 31, 61 and the filling portions 41a, 48a, the high-quality electronic component 1 that can be used even under high temperature and high humidity can be obtained. Can be provided.

Next, a second embodiment will be described.
FIG. 17 is an exploded perspective view of an electronic component according to the second embodiment of the present invention.
As shown in FIG. 17, in the electronic component of this embodiment, on the upper surface of the magnetic substrate 3, in addition to the groove 31, the groove 32 has a pair of external electrodes facing each other on the front surface 2a and the rear surface 2b which are opposite side surfaces. 7-1, 7-2 (7-3, 7-4), the insulating layer 41 enters the groove 32 to form the filling portion 41 b. Also on the lower surface of the magnetic substrate 6, in addition to the groove 61, a groove 62 corresponding to the groove 32 is formed at a position corresponding to the groove 32, and the adhesive layer 48 enters the groove 62 to form a filling portion 48 b. is doing.
With this configuration, not only the migration that occurs between the adjacent external electrodes 7-1 and 7-3 (7-2 and 7-4), but also the opposing external electrodes 7-1 and 7-2 (7-3 and 7-). Migration that occurs during 4) can also be suppressed at the same time.
Since other configurations, operations, and effects are the same as those of the first embodiment, description thereof is omitted.

Next, a third embodiment will be described.
FIG. 18 is an exploded perspective view of an electronic component according to the third embodiment of the present invention.
As shown in FIG. 18, the electronic component of this embodiment is a two-terminal coil, and includes one coil 5-1 and a pair of external electrodes 7-1 ′ and 7-2 ′.
In the electronic component of this embodiment, since there are only two external electrodes, on the upper surface of the magnetic substrate 3, a pair of external electrodes 7-1 ′ facing the groove 32 on the front surface 2a and the rear surface 2b which are opposite side surfaces is provided. 7-2 ', and the insulating layer 41 is inserted into the groove 32 to form the filling portion 41b.
Also on the lower surface of the magnetic substrate 6, a groove 62 corresponding to the groove 32 was formed at a position corresponding to the groove 32, and the filling layer 48 b was formed by allowing the adhesive layer 48 to enter the groove 62.
Since other configurations, operations, and effects are the same as those of the first embodiment, description thereof is omitted.

In addition, this invention is not limited to the said Example, A various deformation | transformation and change are possible within the range of the summary of invention.
For example, in the above-described embodiment, an example in which the cross sections of the grooves 31 and 61 are set to a rectangular shape has been described, but the cross sectional shape is not limited thereto. As shown in FIG. 19 (a), the grooves 31 and 61 are formed in a taper shape that narrows toward the bottom, or in a circular arc shape as shown in FIG. 19 (b). Also good.
In the case of a rectangular cross section, among the gaps formed between the groove 31 (61) and the filling portion 41a (48a) during firing, the gap at the corner of the groove bottom is widened, but the groove 31 (61) By forming the cross-section in a taper shape or an arc shape as described above, it is difficult to form a gap between the groove 31 (61) and the filling portion 41a (48a).

  Moreover, in the said Example, although the electronic component which provided the magnetic substrate 6 as a 2nd board | substrate other than the magnetic substrate 3 as a 1st board | substrate was illustrated, the electronic component without a 2nd board | substrate is illustrated. It is not intended to be excluded from the scope of the present invention.

1 is an exploded perspective view of an electronic component according to a first embodiment of the present invention. It is an external view of an electronic component. It is arrow AA sectional drawing of FIG. It is arrow BB sectional drawing of FIG. It is process drawing which shows the manufacturing method of an electronic component. It is sectional drawing which shows a lamination process. It is sectional drawing which shows a crimping | compression-bonding process. It is the schematic which shows a dicing process, a baking process, and an external electrode formation process. It is sectional drawing which shows the clearance gap which generate | occur | produced between the magnetic body substrate and the layer. It is a longitudinal cross-sectional view which shows the state which Ag metal penetrate | invaded in the clearance gap. It is a cross-sectional view showing a state where Ag metal has entered the gap. It is a perspective view which shows the mounting state of an electronic component. It is a fragmentary longitudinal cross-sectional view for demonstrating a migration phenomenon. It is a cross-sectional view for explaining a migration phenomenon. It is a fragmentary longitudinal cross-sectional view for demonstrating a migration suppression effect. It is a cross-sectional view for explaining a migration suppressing action. It is a disassembled perspective view of the electronic component which concerns on 2nd Example of this invention. It is a disassembled perspective view of the electronic component which concerns on 3rd Example of this invention. It is sectional drawing which shows the modification of a groove | channel. It is a longitudinal cross-sectional view of the electronic component which concerns on a prior art example. FIG. 21 is a longitudinal sectional view for explaining a migration phenomenon in the electronic component of FIG. 20.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Laminate body, 2a ... Front surface, 2b ... Rear surface, 3, 6 ... Magnetic material board, 5-1 ... Primary side parallel coil, 5-2 ... Secondary side parallel coil, 7-1 7-4: External electrode 31, 32, 61, 62 ... Groove, 41-46 ... Insulating layer, 41a, 41b, 48a, 48b ... Filling part, 47, 48 ... Adhesive layer, 51-54 ... Conductor pattern, 51a ˜54a, 51b˜54b ... lead terminals, G1, G2 ... gap, M ... Ag metal.

Claims (4)

A laminated body in which an insulating layer and a conductor pattern are laminated on the first substrate, and a lead terminal of the internal circuit composed of the conductor pattern is exposed on a side surface, and the lead is in contact with each lead terminal of the internal circuit An electronic component comprising one or more external electrodes provided on the side surface of the laminate,
A linear groove is formed either between the pair of external electrodes arranged on the same side surface of the stacked body or between the pair of external electrodes facing each other on the opposite side surface on the upper surface of the first substrate. As well as
The insulating layer directly above the first substrate was stacked on the first substrate in a state where the groove was filled.
An electronic component characterized by that. The electronic component according to claim 1,
One groove is formed between a pair of external electrodes arranged on the same side surface, and the other groove is formed between a pair of external electrodes facing each other on opposite side surfaces.
An electronic component characterized by that. In the electronic component according to claim 1 or 2,
The cross section of the groove was formed into a taper shape or an arc shape that narrows toward the bottom,
An electronic component characterized by that. The electronic component according to any one of claims 1 to 3,
A second substrate is attached to the upper surface of the laminate,
On the lower surface of the second substrate, a groove corresponding to the groove of the first substrate is formed at a position corresponding to the groove of the first substrate, and
In a state where the insulating layer directly under the second substrate is filled in the groove, the second substrate is attached onto the insulating layer.
An electronic component characterized by that.

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