JP2009291792A - Joined frame-structure, joining method for frame, and laser-beam machining apparatus - Google Patents

Abstract

The present invention provides a frame joining structure, a frame joining method, and a laser processing apparatus capable of simplifying a frame transport mechanism and a storage mechanism or reducing damage to a joining member due to the influence of heat.
At least one of the first and second substrates that is transparent to laser light, and the first substrate and the second substrate are sandwiched between the first substrate and the first substrate. There is provided a bonded structure comprising a frame made of a plurality of sides bonded to the second substrate by laser light.
[Selection] Figure 1

Description

  The present invention relates to a frame bonding structure, a frame bonding method, and a laser processing apparatus, and more specifically, a frame bonding structure that bonds a frame and a substrate by irradiating a laser beam, a frame bonding method, and laser processing. Relates to the device.

  In general, there are many joints of a frame and a substrate. For example, light-emitting panels such as PDP (Plasma Display Panel), SED (Surface-conduction Electron-emitter Display), FED (Field Emission Display), and organic EL display (Organic Electroluminescence Display) are made of two pieces of glass through a frame. May have a bonded structure. At this time, the frame is generally prepared (manufactured) in a mouth shape, and the shape remains the mouth shape even when the frame is transported or stored. However, in order to ensure the shape, function, performance, etc. of the frame, there is a problem that a dedicated mechanism (for example, an underlay for transportation) is required during transportation and storage.

  In addition, frit, lead, or the like is generally used for joining the frame and the substrate in the light emitting panel as described above. However, these joining methods require firing. For example, when a frit is used, firing at a high temperature of 400 ° C. or higher is necessary. Further, it is necessary to gradually cool the bonded member (frame, substrate) over time after firing so that the bonding member (frame, substrate) does not crack or warp due to heat during high-temperature firing. Therefore, there exists a problem that a joining process becomes long.

  In order to perform firing at a lower temperature (400 ° C. or lower), there is a method of using a substance having a lower melting point such as lead, but it is not preferable to use lead as a countermeasure for environmental problems.

  On the other hand, as another method of joining two members, there is a joining method by laser light irradiation. This joining method is a method in which the joining member is heated and melted by absorbing the energy of the irradiated laser beam at the joining interface, and then joined by solidifying again. For example, in the case of bonding a resin film, there is a method in which a light-absorbing substance is sandwiched at a bonding interface in order to further increase the absorption of laser light (Patent Document 1). Similarly, there is a method in which a light absorbing material is applied to or attached to a bonding interface or a film is formed, and an inorganic substance such as glass is bonded (Patent Document 2).

However, in the method described in Patent Document 2, it is necessary to set the ambient temperature to a high temperature (for example, about 400 to 600 ° C.) in order to suppress cracks generated in the joining member. In addition, the joining methods described in Patent Documents 1 and 2 also have a problem that a dedicated mechanism (for example, an underlay for transport) is required when the frame is transported or stored, as described above.
JP 2002-67164 A JP 2003-170290 A

  The present invention has been made on the basis of recognition of such a problem, and can simplify a frame transport mechanism and a storage mechanism, or can reduce damage to a bonding member due to the influence of heat. A method and a laser processing apparatus are provided.

  According to one aspect of the present invention, at least one of the first and second substrates that is transmissive to laser light, and the first substrate and the second substrate are sandwiched between the first and second substrates, There is provided a bonded structure comprising a frame made of a plurality of sides bonded to a first substrate and the second substrate by laser light.

  According to another aspect of the present invention, a plurality of sides are sequentially brought into contact with the main surface of the first substrate and irradiated with laser light to form a frame composed of the plurality of sides. Then, a bonding method is provided in which the main surface of the second substrate is brought into contact with the frame to be bonded by irradiating a laser beam.

  According to another aspect of the present invention, a laser oscillator that outputs laser light, an optical system that collects the laser light and irradiates the irradiated object, the irradiated object, and the optical A control stage for controlling the positional relationship with the system, a transport mechanism for transporting the irradiated object and adjusting the position thereof, and a plurality of side bodies sequentially contacting the main surface of the first substrate, and the laser beam. The transfer mechanism and the control stage are formed such that a frame made of the plurality of side bodies is formed by irradiating and bonding, and the second substrate is brought into contact with the frame and irradiated by the laser beam to be bonded. A laser processing apparatus comprising: a control unit that controls

  ADVANTAGE OF THE INVENTION According to this invention, the frame joining method and laser processing apparatus which can simplify the conveyance mechanism and storage mechanism of a frame, or can reduce the damage of the joining member by the influence of heat are provided.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic assembly view illustrating a frame joint structure according to an embodiment of the invention.
FIG. 2 is a schematic assembly view illustrating a frame joined structure according to a comparative example.

  The bonding structure shown in FIG. 1 includes a side body 100a, 100b, 100c, and 100d that is transparent to laser light, and a substrate 110a (first substrate) at least one of which is transparent to laser light. ) And a substrate 110b (second substrate). The edges 100a, 100b, 100c, and 100d are joined to each other to form a mouth-shaped frame 100. Here, the transparency to the laser beam means that the laser beam as a heating source is transmitted with almost no reflection or absorption, or the remaining laser beam is not melted even if the laser beam is partially absorbed or reflected. A property that allows laser light to pass through and reach the bonding interface.

  The sides 100a, 100b, 100c, and 100d are sandwiched between the substrate 110a and the substrate 110b on each side of the substrates 110a and 110b. That is, as shown in FIG. 1, the side body 100a is disposed near the front side of the substrates 110a and 110b, the side body 100b is disposed near the left side of the substrates 110a and 110b, and the side body 100c is disposed on the substrates 110a and 100b. The side body 100d is disposed in the vicinity of the rear side, and the side body 100d is disposed in the vicinity of the right side of the substrate. In this state, it is sandwiched between the substrate 110a and the substrate 110b.

  As described in detail later, the side bodies 100a, 100b, 100c, and 100d are bonded to the substrate 110a by laser welding. Join. Thereafter, the substrate 110b is bonded to the sides 100a, 100b, 100c, and 100d by laser fusion.

  On the other hand, the joint structure of the comparative example shown in FIG. 2 includes a frame 300 having a mouth shape, and a substrate 110a and a substrate 110b, at least one of which is transparent to laser light. The frame 300 is transmissive to the laser light in the same manner as the frame 100 including the side bodies 100a, 100b, 100c, and 100d illustrated in FIG. The frame 300 is sandwiched between the substrate 110a and the substrate 110b.

  The frame 300 is not divided like the frame 100 shown in FIG. 1 and is formed integrally. Therefore, when the frame 300 is transported or stored, a large space is required to secure the shape, function, performance, and the like of the frame 300, and for example, a transport underlay is also required. That is, there is a risk that transportation, storage, and handling are costly, and the conveyance mechanism and storage mechanism of the laser processing apparatus may be complicated.

  On the other hand, according to the joint structure according to the present embodiment, the frame 100 is divided into a plurality of bar-like sides 100a, 100b, 100c, and 100d, and each can be conveyed and joined. There is no need for a large space or transport underlay when transporting or storing the frame. Therefore, transportation, storage, and handling become easy, and the conveyance mechanism and storage mechanism of the laser processing apparatus can be simplified. In the specification of the present application, the “bar” is a substantially straight shape, and even if it has a bent portion, the bent portion is a bent portion that is negligible compared to the substantially straight portion in the longitudinal direction. It shall refer to the member of the form.

3 to 5 are schematic views illustrating the joining method according to the embodiment of the invention.
First, the light absorbing material 120a is disposed at the bonding interface between the substrate 110a and the side body 100a, and the light absorbing material 120a is irradiated with the laser beam 200 (FIG. 3A). As will be described later in detail, the laser beam 200 is emitted from an optical system 210 provided in the laser processing apparatus. When the light absorbing material 120a is irradiated with the laser light 200, the light absorbing material 120a absorbs the laser light 200 and generates heat. Then, at least one of the side body 100a, the substrate 110a, and the light absorber 120a is melted by this heat generation. Thereafter, when the irradiation position of the laser beam 200 is moved by moving the optical system 210 as indicated by an arrow shown in FIG. 3A, the melted portion is solidified again. Thus, the side body 100a and the board | substrate 110a are joined by laser fusion.

  Here, the light-absorbing material 120a only needs to have a property of generating heat by absorbing the energy of the laser beam 200, but preferably has a physical property value equal to or higher than the softening point or melting point of the side body 100a and the substrate 110a. The light absorbing material 120a is preferably made of metal, ceramic, colored paint, or a combination thereof, and the form thereof is preferably foil, film, ribbon, plate, or powder. The light absorber 120a may have elasticity.

  In order to uniformly transfer the heat generated in the light absorber 120a to the side body 100a and the substrate 110a, it is necessary to bring the light absorber 120a into close contact with the side body 100a and the substrate 110a. Furthermore, the thickness of the light absorbing material 120a needs to be uniform. This is because, in a state where the adhesion between the side body 100a and the substrate 110a is weak, heat transfer is reduced due to a gap existing at the interface between them, and the heat generated by the light absorber 120a is not easily transmitted to the side body 100a and the substrate 110a. is there.

  Therefore, it is more preferable that the light absorber 120a is formed at the bonding interface of the side body 100a or the substrate 110a by a film forming technique such as vapor deposition or application, an application technique, or a method of sandwiching a bulk material. In consideration of the joining work, it is more preferable to provide the light absorber 120a on the side body 100a or the substrate 110a in advance.

  Subsequently, as illustrated in FIG. 3B, the light absorbing material 130b is disposed at the bonding interface between the side body 100a and the side body 100b, and the light absorbing material 120b is disposed at the bonding interface between the substrate 110a and the side body 100b. . Then, the light absorbing material 130b is irradiated with the laser beam 200 in the horizontal direction. The light absorber 130b preferably has the same properties as those described above with respect to the light absorber 120a. And the side body 100a and the side body 100b are joined by the effect | action similar to the effect | action mentioned above regarding Fig.3 (a).

  Here, the optical system 210 shown in FIG. 3A and the optical system 210 shown in FIG. 3B represent the same optical system, but these optical systems are different optical systems. May be. That is, the laser processing apparatus according to the embodiment of the present invention joins the optical body that irradiates laser light in the vertical direction and the side body 100a and the side body 100b in order to join the side body 100a and the substrate 110a. Therefore, an optical system for irradiating laser light in the horizontal direction may be provided as separate bodies. According to this, since the moving distance of the optical system can be shortened, the joining time can be further shortened.

  The optical system that irradiates in the horizontal direction may be an optical system that can perform scanning irradiation, such as a polygon mirror. According to this, for example, the laser beam can be scanned only by rotating a polygon mirror or the like, so that the bonding time can be further shortened.

  Subsequently, as illustrated in FIG. 3C, the light absorbing material 120 b is irradiated with the laser light 200. The light absorber 120b preferably has the same properties as those described above with respect to the light absorber 120a. And the side body 100b and the board | substrate 110a are joined by the effect | action similar to the effect | action mentioned above regarding Fig.3 (a).

  Subsequently, a joining method similar to the joining method shown in FIGS. 3B and 3C is repeated to join the side body 100a and the side body 100d (FIG. 4D), and the side body 100d. Bonding to the substrate 110a (FIG. 4E), bonding of the side body 100b and the side body 100c (FIG. 4F), bonding of the side body 100c and the side body 100d (FIG. 5G), side The body 100c and the substrate 110a are joined (FIG. 5H). At this time, it is preferable that the light-absorbing materials 120c, 120d, 130d, 140b, and 140d have the same properties as those described above with respect to the light-absorbing material 120a.

  Subsequently, as shown in FIG. 5I, the light absorbers 150a, 150b, 150c, and 150d are respectively disposed at the bonding interfaces between the side bodies 100a, 100b, 100c, and 100d and the substrate 110b, and the light absorber 150a. , 150b, 150c, and 150d are irradiated with the laser beam 200. The light absorbing materials 150a, 150b, 150c, and 150d preferably have the same properties as those described above with respect to the light absorbing material 120a. Then, the side bodies 100a, 100b, 100c, and 100d and the substrate 110b are joined by the same action as described above with reference to FIG.

  As described above, according to the joining method according to the present embodiment, the bars 100a, 100b, 100c, and 100d of the bar can be joined one by one to the respective sides on the substrate 110a. Therefore, the sides 100a, 100b, 100c, and 100d can be transported by a simplified transport mechanism as compared with the case where the frame has a mouth shape as illustrated in FIG. Furthermore, even when storing the side bodies, the side bodies 100a, 100b, 100c, and 100d are rods, so that the storage is simplified compared to the case where the frame has a mouth shape as shown in FIG. Can be stored by mechanism.

  The light absorber 120a may have a physical property value equal to or lower than the softening point or melting point of the side body 100a and the substrate 110a. In this case, the light absorbing material 120a absorbs the laser light 200, and the light absorbing material 120a itself melts. Then, the light-absorbing material 120a is solidified again, so that the side bodies 100a, 100b, 100c, 100d and the substrates 110a, 110b are joined. At this time, by using an elastic body having a larger plate thickness as the light absorbing material 120a, it is possible to fill a gap that may occur at the bonding interface between the side body and the substrate.

  Therefore, even when a vacuum sealing property (sealing property) is required in the space surrounded by the side body and the substrate, when the light absorbing material 120a is a UV (ultraviolet) curable resin or a thermosetting resin. Can secure the vacuum sealing property. Further, if an elastic body having a larger plate thickness is used as the light absorbing material 120a and the light absorbing material 120a is a UV curable resin, by setting the wavelength of the laser light 200 to the ultraviolet wavelength, the side body does not generate heat. Can be bonded to the substrate.

Next, a modification of the joint part between the side bodies will be described with reference to the drawings.
FIG. 6 is a schematic view illustrating a modified example of a joint portion between side bodies.
FIG. 6 shows a state in which a portion corresponding to the joint portion between the side body 100a and the side body 100b shown in FIG. 1 is enlarged and viewed from above.

  The side body 101a has a projecting portion 161a at the end joined to the side body 101b. On the other hand, the side body 101b has a protruding portion 161b at the end joined to the side body 101a. And the light-absorbing material 131b is provided in the protrusion 161b as shown in FIG.

  The side body 101b is moved from the state shown in FIG. 6 in the direction of the arrow, and the protruding portion 161b is inserted into the stepped portion 171a of the side body 101a. Thereafter, similarly to the joining method shown in FIG. 3B, the light absorber 131b is irradiated with the laser beam 200 in the horizontal direction to join the side body 101a and the side body 101b. In the same manner, the side bodies can be joined at other joints. The light absorbing material 131b may be provided on the projection 161a of the side body 101a and on the joint surface with the side body 101b (the front surface of the projection 161a).

  According to this, since the side bodies are joined to each other in a right-angled shape, a greater joining strength can be obtained at the joined portion. Further, a higher vacuum sealing property (sealing property) can be obtained in a space surrounded by the side body and the substrate. For example, when an optical element or an electronic element is present in a space surrounded by a side body and a substrate, such as a light emitting panel such as a PDP, SED, FED, or organic EL display, the space has a vacuum sealing property. May be required. Even in such a case, the side body of this modification can be applied. Furthermore, since the sides are joined to each other in a right-angled shape, it is easy to perform alignment at the ends (joint portions) of the sides.

FIG. 7 is a schematic view illustrating another modified example of the joint portion between the side bodies.
FIG. 7 illustrates a state in which a portion corresponding to the joint portion between the side body 100a and the side body 100b illustrated in FIG. 1 is enlarged and viewed obliquely from above.
The side body 102a has a protrusion 162a at the lower part at the end joined to the side body 102b. On the other hand, the side body 102b has a projecting portion 162b at the upper part at the end joined to the side body 102a. As shown in FIG. 7, a light absorbing material 132b is provided on the lower surface of the protrusion 162b.

  The side body 102b is moved in the direction of the arrow from the state shown in FIG. 7, and the upper surface of the protrusion 162a and the lower surface of the protrusion 162b (light absorbing material 132b) are brought into contact with each other. Thereafter, similarly to the joining method shown in FIG. 3A, the light absorber 132b is irradiated with the laser beam 200 in the vertical direction to join the side body 102a and the side body 102b. In the same manner, the side bodies can be joined at other joints. The light absorbing material 132b may be provided on the upper surface of the protrusion 162a.

  According to this, since the side bodies are joined in a right-angled hook shape with respect to the vertical direction, a larger joining strength can be obtained as in the modification shown in FIG. Further, a higher vacuum sealing property (sealing property) can be obtained in the space surrounded by the frame and the substrate. Further, since the side bodies are joined in a right-angled shape with respect to the vertical direction, it is easy to perform alignment at the end portions (joint portions) of the side bodies. In this modification, there is no need to separately provide an optical system for irradiating laser light in the horizontal direction as described above with reference to FIG. 3, and therefore the laser processing apparatus can be simplified.

FIG. 8 is a schematic view illustrating still another modified example of the joint portion between the side bodies.
FIG. 8 shows a state in which a portion corresponding to the joint portion between the side body 100a and the side body 100b shown in FIG. 1 is enlarged and viewed from above.
In the modification shown in FIG. 8, the elastic body 180 is disposed at the joint between the side body 103a and the side body 103b. That is, the side body 103a and the side body 103b are joined via the elastic body 180. As a method of joining the side bodies 103a and 103b and the elastic body 180, laser fusion as described above can be applied. At this time, the light-absorbing material as described above is disposed at the bonding interface between the elastic body 180 and the side bodies 103a and 103b.

  In this case, since it is practically difficult to cause the laser beam 200 to be incident on the elastic body 180 by causing the laser beam 200 to enter from the end along the longitudinal direction of the side body, as illustrated in FIG. It is more preferable to enter the bodies 103a and 103b obliquely. Furthermore, in this case, it is necessary to make the laser beam 200 incident at an angle at which the surfaces of the side bodies 103a and 103b are not totally reflected. That is, the laser beam 200 needs to be incident on the sides 103a and 103b at an incident angle smaller than the critical angle with respect to the sides 103a and 103b. In this way, the side bodies 103a and 103b and the elastic body 180 can be joined.

  Note that the elastic body 180 may be transmissive to the laser light 200. According to this, the laser beam 200 can be irradiated to the bonding interface not via the side bodies 103a and 103b but via the elastic body 180.

  According to this, since the side body 103a and the side body 103b are joined via the elastic body 180, for example, the dimensional error of the side bodies 103a and 103b and the position error of the side bodies 103a and 103b at the time of joining are reduced. Can be absorbed. This can join the side bodies in the same way at other joints, and the same effect can be obtained. Therefore, in this modified example, it is possible to suppress the possibility of the adjacent side bodies interfering with each other due to the frame size error or the relative position error between the side bodies in the process of sequentially joining the divided side bodies. be able to.

FIG. 9 is a schematic view illustrating still another modified example of the joint portion between the side bodies.
FIG. 9 illustrates a state in which a portion corresponding to the joint portion between the side body 100a and the side body 100b illustrated in FIG. 1 is enlarged and viewed from above.
In the modification shown in FIG. 9, the elastic body 182 is disposed at the joint between the side body 104a and the side body 104b, as in the modification example shown in FIG. That is, the side body 103a and the side body 103b are joined via the elastic body 182. The elastic body 182 is not bent at about 90 degrees like the elastic body 180 shown in FIG. 8, but is bent at about 180 degrees. Therefore, the lengths of the side bodies 104a and 104b are the same as the lengths of the side bodies 100a and 100b.

  As a method of joining the side bodies 104a and 104b and the elastic body 182, laser fusion as described above can be applied. At this time, the light-absorbing material as described above is disposed at the bonding interface between the elastic body 182 and the side bodies 104a and 104b. In this case, as described above with reference to FIG. 8, when the side body 104b and the elastic body 182 are joined, it is necessary to make the laser beam 200 incident at an incident angle smaller than the critical angle with respect to the side body 104b. On the other hand, when joining the side body 104a and the elastic body 182, there is no need to irradiate the laser beam 200 in the longitudinal direction of the side body 104a. Thus, the laser beam 200 can be incident substantially vertically. In this way, the side bodies 104a and 104b and the elastic body 182 can be joined.

  According to this, similarly to the modification shown in FIG. 8, for example, dimensional errors of the side bodies 104 a and 104 b and position errors of the side bodies 104 a and 104 b at the time of joining can be absorbed. This can join the side bodies in the same way at other joints, and the same effect can be obtained. Therefore, in this modification as well, there is a possibility that adjacent side bodies may interfere with each other due to a size error of the side bodies or a relative position error between the side bodies in the process of sequentially joining the divided side bodies. Can be suppressed.

FIG. 10 is a schematic view illustrating still another modified example of the joint portion between the side bodies.
FIG. 10 illustrates a state in which a portion corresponding to the joint portion between the side body 100a and the side body 100b illustrated in FIG. 1 is enlarged and viewed from above.
In the modification shown in FIG. 10, the elastic body 184 is arranged at the joint between the side body 105a and the side body 105b, as in the modification example shown in FIG. That is, the side body 105a and the side body 105b are joined via the elastic body 184.

  As shown in FIG. 10, the side bodies 105 a and 105 b have slopes inclined at about 45 degrees with respect to the longitudinal direction at the end portions (joint portions). On the other hand, the elastic body 184 has a shape bent to about 180 degrees, similarly to the elastic body 180 shown in FIG. The laser fusion as described above can be applied to the joining method of the side bodies 104a and 104b and the elastic body 182. At this time, the light-absorbing material as described above is disposed at the bonding interface between the elastic body 184 and the side bodies 105a and 105b.

  In this modification, the laser beam 200 can be irradiated substantially perpendicularly to the bonding interface between the elastic body 184 and the side bodies 105a and 105b as long as the critical angle with respect to the side bodies 105a and 105b is not exceeded. According to this, since it is possible to irradiate the bonding interface with the laser beam 200 having a larger intensity, it is possible to shorten the bonding time between the elastic body 184 and the side bodies 105a and 105b. In this way, the side bodies 105a and 105b and the elastic body 184 can be joined. According to this, it is possible to obtain the same effect as that described with reference to FIGS.

Next, a laser processing apparatus for performing laser fusion on the side joining structure and the side joining method according to the present embodiment will be described with reference to the drawings.
FIG. 11 is a schematic view illustrating a laser processing apparatus.
The laser processing apparatus shown in FIG. 11 conveys irradiated objects such as the side bodies 100a, 100b, 100c, and 100d and the substrates 110a and 110b from a storage mechanism (storage unit) (not shown), and places the irradiated objects on a predetermined position. Oscillating from a conveyance mechanism 220 that adjusts in the axial direction, optical systems 210 and 212 having optical elements such as a lens that collects laser light and irradiates it at a predetermined position, a laser oscillator 260 that oscillates laser light, and a laser oscillator 260 Optical fibers 240 and 242 for transmitting the laser beam to the optical system 210, and three-axis control stages 250 and 252 that can adjust the position of the optical system 210 in the three-axis direction.

  Furthermore, the laser processing apparatus shown in FIG. 11 includes a pressing mechanism 230 that closely contacts irradiated objects (for example, a side body and a substrate), and a guide mechanism 270 that holds the irradiated objects and positions them at a predetermined position. , Is further provided. The pressing mechanism 230 and the guide mechanism 270 will be described in detail later.

  The transport mechanism 220 transports the side bodies 100a, 100b, 100c, 100d, the substrates 110a, 110b, and the like from a storage mechanism (not shown) and places them on a predetermined position. At this time, since the side bodies 100a, 100b, 100c, and 100d are divided into a plurality of bars as shown in FIG. 1, the transport mechanism 220 and a storage mechanism (not shown) can be simplified. The laser light 200 oscillated by the laser oscillator 260 passes through a lens (not shown) provided inside the optical fiber 240 and the optical system 210 (first optical system), for example, vertically to the bonding interface between the side body 100a and the substrate 110a. It is condensed and irradiated from the direction. At this time, the position of the laser spot of the laser beam 200 is controlled by the three-axis control stage 250 (first control stage) supporting the optical system 210.

  On the other hand, the laser beam 202 oscillated by the laser oscillator 260 passes through a lens (not shown) provided inside the optical fiber 242 and the optical system 212 (second optical system), for example, to join the side body 100a and the side body 100b. It is condensed and irradiated from the horizontal direction on the interface. At this time, the position of the laser spot of the laser beam 202 is controlled by the three-axis control stage 252 (second control stage) that supports the optical system 212. The laser beams 200 and 202 irradiated from the optical systems 210 and 212 may be laser beams output from different laser oscillators. That is, for example, the laser beam 202 may be a laser beam output from another laser oscillator (not shown) instead of the laser beam output from the laser oscillator 260.

  Here, the laser processing apparatus according to the present embodiment can bring the irradiated objects into close contact with each other by the pressing mechanism 230 when the irradiated objects are bonded by irradiating the laser beams 200 and 202. According to this, the heat generated by the light absorbing material can be uniformly transmitted to the irradiated object such as the side body 100a and the substrate 110a, and the heat transfer is further enhanced by reducing the gap existing at the bonding interface. be able to.

  Further, for example, when joining the side body 100a and the side body 100b, the side body 100b can be pressed against the side body 100a by the guide mechanism 270. According to this, it is possible to join the side body 100b in a state where the side body 100b is reliably arranged at a predetermined position.

  Note that the irradiation position of the laser beams 200 and 202 can be controlled by adjusting the transport mechanism 220 in the three-axis directions. Further, if necessary, the laser beam output from the laser oscillator 260 can be separated into a plurality of parts by a splitter or the like, and a plurality of joining can be performed simultaneously. That is, the laser processing apparatus is not limited to an optical fiber, and a known branching method or separation method can be used.

  The laser beams 200 and 202 may be high-power ultrashort pulse laser beams. That is, the laser oscillator 260 may be a laser oscillator that oscillates a high-power ultrashort pulse laser beam. In the present specification, “ultrashort pulse laser light” refers to laser light having a pulse width of 100 nanoseconds or less. Examples of such laser light include Qsw, GiantPulse, and ModeLock. According to this, since the incidence of heat to the glass substrate of the ultrashort pulse laser light is suppressed and the bonding process can be performed only in the vicinity of the bonding interface (near the surface layer), the incident depth of heat with respect to the irradiated object, Alternatively, the melting depth can be suppressed.

  Further, a plurality of laser oscillators can be provided as necessary. A laser oscillator for processing (for bonding) and a laser oscillator for heat retention can be provided. According to this, it is possible to prevent heat from escaping from the bonding interface by irradiating the bonding interface with the heat retaining laser beam, so that it is possible to suppress the occurrence of cracks in the irradiated object. In addition, as a heat retention laser beam, a semiconductor laser beam etc. are mentioned, for example.

FIG. 12 is a block diagram illustrating the configuration of the laser processing apparatus.
The laser processing apparatus shown in FIG. 12 further includes a power source 280 that applies a driving power of an arbitrary magnitude to the laser oscillator 260, and a control unit 290 that controls the driving power applied to the laser oscillator 260 by the power source 280. I have.

  The control unit 290 can control the power supply 280 so as to change the setting of the pulse shape, pulse width, and the like of the laser beams 200 and 202 according to an instruction from the user. That is, the pulse shapes of the laser beams 200 and 202 emitted from the laser oscillator 260 are controlled according to the waveform of the driving power applied by the power source 280. Under the control of the control unit 290, the waveform of the driving power applied to the laser oscillator 260 by the power source 280 is changed, so that laser beams 200 and 202 having a predetermined peak output and energy density are emitted from the laser oscillator 260. It has come to be.

  In addition, the control unit 290 can control the operation of the triaxial control stages 250 and 252 that adjust the positions of the optical systems 210 and 212 in the triaxial direction. That is, the control unit 290 can control the three-axis control stage 250 so that the laser beams 200 and 202 are irradiated to a predetermined position based on preset position information of the irradiated object. Further, the control unit 290 can control the operations of the pressing mechanism 230 and the guide mechanism 270.

  The laser processing apparatus shown in FIGS. 11 and 12 may further include an optical element such as a camera (not shown) for acquiring an image of the irradiated object. According to this, the image data photographed by the camera is output to the control unit 290 and subjected to image analysis. Based on the result, the control unit 290 can control the three-axis control stages 250 and 252 so that the laser beams 200 and 202 are irradiated to predetermined positions. By doing in this way, the laser beam 200 can be irradiated to a predetermined position more accurately in a shorter time.

FIG. 13 is a schematic perspective view for explaining the guide mechanism.
A guide mechanism 270 illustrated in FIG. 13 holds a guide portion 270a that guides a side body (for example, the side body 100b) according to an edge of the substrate (for example, the substrate 110a), and the side body (for example, the side body 100b). A chuck portion 270b that presses against an adjacent side body (for example, the side body 100a).

  In a state where the side body 100a and the substrate 110a are joined, the chuck portion 270b holds the side body 100b that is not joined. And the chuck | zipper part 270b makes the side body 100b contact | abut to the side body 100a along the guide part 270a, holding the side body 100b. Thereafter, as shown in FIG. 3B, the laser beam 200 is irradiated in the horizontal direction onto the bonding interface between the side body 100a and the side body 100b. According to this, it is possible to join the side body 100b in a state where the side body 100b is securely arranged at the predetermined position. Moreover, it can join similarly about another joining location.

FIG. 14 is a schematic view illustrating a pressing mechanism for bringing irradiated bodies into close contact with each other.
When joining a plurality of irradiated objects by laser fusion, it is necessary to bring the irradiated objects into close contact with each other as described above. Therefore, the pressing mechanism 230 shown in FIG. 14 includes pressing portions 230a and 230b. The pressing mechanism 230 moves the pressing portions 230a and 230b toward the irradiated object (for example, the side body 100a and the substrate 110a) and locally presses the vicinity of the joining portion, thereby causing the side body 100a and the substrate 110a to move. Adhesion can be further increased.

  According to this, since the heat generated by the light absorbing material is easily transmitted to the side body 100a and the substrate 110a, a larger bonding strength can be obtained. Furthermore, since it is not necessary to perform excessive heat input, damage to the side body 100a and the substrate 110a due to the influence of heat can be suppressed. Similarly, the side body and the substrate can be brought into close contact with each other at other joint locations.

  In addition, the laser processing apparatus of this embodiment may be provided with the vacuum chamber which can maintain a pressure reduction state. According to this, the side body and the substrate can be brought into close contact with each other by reducing the pressure inside the vacuum chamber to a substantially vacuum state. More specifically, first, an object to be irradiated (for example, the side body 100a and the substrate 110a) is appropriately carried into the vacuum chamber. Subsequently, the inside of the vacuum chamber is depressurized, and the side body 100a and the substrate 110a are overlapped in this state. Thereby, the gap generated between the side body 100a and the substrate 110a becomes a substantially sealed space that is decompressed.

  Then, the pressure inside the vacuum chamber is increased. The pressure to be increased at this time is up to atmospheric pressure. Then, a pressure difference is generated between the pressure inside the gap generated between the side body 100a and the substrate 110a and the pressure outside the gap. Thereby, the side body 100a and the board | substrate 110a can be stuck. At this time, as described above, the pressing portions 230a and 230b are moved toward, for example, the side body 100a and the substrate 110a to locally press the vicinity of the joining portion, thereby improving the adhesion between the side body 100a and the substrate 110a. It can be further increased.

  Furthermore, at this time, by using a ribbon having a larger plate thickness as a light absorbing material, it is possible to fill a gap that may occur at the bonding interface of the irradiated object (for example, the side body 100a and the substrate 110a). Therefore, even when a vacuum sealing property (sealing property) is required in a space surrounded by the side body 100a and the substrate 110a, the vacuum sealing property is obtained by melting and re-solidifying the ribbon-shaped light-absorbing material. Can be secured. Moreover, when an elastic body having a larger plate thickness is used as the light absorbing material, the vacuum sealing property can be ensured while having a higher degree of freedom (flexibility).

  As described above, according to the present embodiment, the side body is divided into a plurality of bars, and each side is transported and joined to each side of the substrate one by one. The mechanism can be simplified. Further, if a high-power ultrashort pulse laser beam is used as the laser beam 200, the influence of heat on the irradiated object can be suppressed. Furthermore, since the laser processing apparatus includes a laser oscillator for heat retention, it is possible to suppress the occurrence of cracks in the irradiated object.

The embodiment of the present invention has been described above. However, the present invention is not limited to these descriptions. As long as the features of the present invention are provided, those skilled in the art appropriately modified the design of the above-described embodiments are also included in the scope of the present invention. For example, the number of sides is not limited to four, and may be five or more as long as it is a bar that can be easily conveyed or stored. In addition, the shape, arrangement, and the like of each element included in the laser processing apparatus are not limited to those illustrated, and can be changed as appropriate.
Moreover, each element with which each embodiment mentioned above is provided can be combined as long as technically possible, and the combination of these is also included in the scope of the present invention as long as it includes the features of the present invention.

It is a schematic assembly drawing which illustrates the joining structure body of the frame concerning an embodiment of the invention. It is a model assembly drawing which illustrates the joining structure body of the frame concerning a comparative example. It is a schematic diagram which illustrates the joining method concerning embodiment of this invention. It is a schematic diagram which illustrates the joining method concerning embodiment of this invention. It is a schematic diagram which illustrates the joining method concerning embodiment of this invention. It is a schematic diagram which illustrates the modification of the junction part of side bodies. It is a schematic diagram which illustrates the other modification of the junction part of side bodies. It is a schematic diagram which illustrates the further another modification of the junction part of side bodies. It is a schematic diagram which illustrates the further another modification of the junction part of side bodies. It is a schematic diagram which illustrates the further another modification of the junction part of side bodies. It is a schematic diagram which illustrates a laser processing apparatus. It is a block diagram which illustrates the composition of a laser processing device. It is a perspective schematic diagram for demonstrating a guide mechanism. It is a schematic diagram which illustrates the pressing mechanism which adheres to-be-irradiated bodies mutually.

Explanation of symbols

  100 Frame, 100a, 100b, 100c, 100d, 101a, 101b, 102a, 102b, 103a, 103b, 104a, 104b, 105a, 105b Side body, 110a, 110b Substrate, 120a, 120b, 120c, 120d, 130b, 130d, 131b, 132b, 140b, 140d, 150a, 150b, 150c, 150d Absorber, 161a, 161b, 162a, 162b Protrusion, 171a Stepped portion, 180, 182, 184 Elastic body, 200 Laser light, 210 Optical system, 220 Transport Mechanism, 230 pressing mechanism, 230a, 230b pressing section, 240 optical fiber, 250 3-axis control stage, 260 laser oscillator, 270 guide mechanism, 270a guide section, 270b Parts, 280 power, 290 control unit, 300 frame

Claims (13)

First and second substrates at least one of which is transparent to laser light;
A frame composed of a plurality of sides sandwiched between the first substrate and the second substrate and bonded to the first substrate and the second substrate by a laser beam;
A joining structure characterized by comprising:   The bonded structure according to claim 1, wherein each of the plurality of side bodies is bonded to an adjacent side body by a laser beam. An elastic body,
The bonded structure according to claim 1, wherein at least one of the plurality of side bodies is bonded to an adjacent side body with a laser beam via the elastic body.   The joined structure according to claim 1, wherein the side body is a bar.   A plurality of sides are sequentially brought into contact with the main surface of the first substrate, and a frame made of the plurality of sides is formed by irradiating and joining a laser beam, and the main body of the second substrate is formed on the frame. A bonding method characterized in that the surfaces are brought into contact with each other and irradiated with laser light.   6. The bonding method according to claim 5, wherein adjacent ones of the plurality of side bodies are brought into contact with each other to be bonded by irradiating a laser beam. Bonding a first side to the main surface of the first substrate;
After joining the first side and the second side, joining the second side to the main surface of the first substrate,
After joining the first side and the third side, joining the third side to the main surface of the first substrate,
After joining the second and third side bodies and the fourth side body, joining the fourth side body to the main surface of the first substrate,
The joining method according to claim 6, wherein the first, second, third, and fourth side bodies are joined to the second substrate.   The bonding method according to claim 5, wherein the laser beam is an ultrashort pulse laser beam. A laser oscillator that outputs laser light;
An optical system for condensing the laser beam and irradiating the irradiated object toward the irradiated body;
A control stage for controlling the positional relationship between the irradiated object and the optical system;
A transport mechanism for transporting the irradiated object and adjusting its position;
A plurality of sides are sequentially brought into contact with the main surface of the first substrate and irradiated with the laser beam to form a frame composed of the plurality of sides, and a second substrate is formed on the frame. A control unit that controls the transport mechanism and the control stage so as to be brought into contact with each other and irradiated with the laser beam to be joined;
A laser processing apparatus comprising: The optical system is
A first optical system that irradiates the irradiated body with laser light in a vertical direction;
A second optical system for irradiating the irradiated body with laser light in a horizontal direction;
Have
The control stage is
A first control stage that supports the first optical system and controls its position;
A second control stage that supports the second optical system and controls its position;
The laser processing apparatus according to claim 9, comprising:   A guide mechanism capable of performing positioning by bringing at least one of the plurality of sides into contact with at least one of the first substrate and another side adjacent to the one of the sides. The laser processing apparatus according to claim 9, further comprising:   The pressing mechanism according to any one of claims 9 to 11, further comprising a pressing mechanism for pressing and adhering a vicinity of a joining portion between at least one of the first substrate and the second substrate and the side body. The laser processing apparatus as described in one.   The laser processing apparatus according to claim 9, wherein the laser oscillator outputs an ultrashort pulse laser beam.

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