JP2009290553A - High-frequency module and its production process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized high-frequency module which can be manufactured by a simple process, at low cost. <P>SOLUTION: A high-frequency circuit module includes: a wiring board, a circuit component mounted on the wiring board; a conductive member mounted on the wiring board and connected electrically to the circuit component by the wiring board; an insulating member covering the upper sides of the circuit component and the conductive member; and a conductive film, formed on the insulating member and containing an electrode AC-connected with the conductive member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a high-frequency module, and more particularly to a high-frequency module for wireless communication equipped with an antenna and a method for manufacturing the same.

  In recent years, there has been an increasing demand for miniaturization and high functionality of wireless communication devices, particularly wireless communication devices for short-range wireless communication. In order to meet such demands, it is important to reduce the size of a high-frequency module (hereinafter simply referred to as a high-frequency module) that includes an antenna and transmits and receives electromagnetic waves.

  For example, in order to reduce the size of a non-contact IC card or IC tag that communicates within a short distance of 10 cm, it is important to reduce the size of a high-frequency module mounted on these devices.

  In addition, the information processing devices (for example, notebook personal computers, PDAs (Personal Digital Assistants), mobile phones, etc.) that wirelessly connect the devices at a short distance of 10 m or less are mounted on these devices. Miniaturization of the high frequency module is important.

  In a high-frequency module used for short-range wireless communication, an antenna and a transmission / reception circuit are usually mounted on the same wiring board. However, installation of the antenna requires a space equivalent to or larger than that of the transmission / reception circuit, and it has been difficult to reduce the size of the high-frequency module.

  FIG. 1 is an exploded perspective view of a semiconductor device proposed for such a technical problem (Patent Document 1). As shown in FIG. 1, in this semiconductor device, a resin or ceramic insulating plate (antenna plate 2) on which a metal film (antenna pattern 10) that functions as an antenna is formed, a semiconductor element 4, a metal plate 6, Are stacked.

  On the surface of the antenna plate 2, a metal film (antenna pattern 10) whose shape is processed so as to function as an antenna is formed. The semiconductor element 4 has a terminal 12 (not shown) on the front surface side and a back surface side. The terminal 12 on the front side is electrically connected to the antenna pattern 10 using a through hole provided in the antenna plate 2. On the other hand, the terminal on the back surface side of the semiconductor element 4 is electrically connected to the metal plate 6. These three members are bonded by an adhesive 14 (shown only on the surface of the semiconductor element 4). Further, these bonded members are covered with a resin or a cap.

  In the semiconductor device 8, the antenna plate 2 is stacked on the semiconductor element 4. Therefore, it is not necessary to provide a dedicated space for installing the antenna on the same plane as the semiconductor element 4, so that the semiconductor device 8 can be easily downsized.

  However, in order to assemble the semiconductor device 8, it is necessary to form the antenna pattern 10 on a resin or ceramic substrate to be the antenna plate 2 and to open a through hole for connecting the antenna pattern 10 to the semiconductor element 4. (It is assumed that the through hole is filled with metal).

  That is, in order to manufacture the semiconductor device 8, the through hole is formed in the antenna plate, the metal is filled in the through hole, and the metal filled in the through hole and the terminal 12 </ b> A provided on the semiconductor element 4. It is presumed that a series of work of electrical connection is required. Such a complicated operation leads to an increase in manufacturing cost.

  On the other hand, a wireless device that processes a part of a shield case covering a high-frequency wireless circuit and uses it as an antenna has also been proposed (Patent Document 2).

  FIG. 2 is a perspective view illustrating the configuration of such a wireless device 20.

  As shown in FIG. 2, in the radio apparatus 20, the high-frequency radio circuit 16 provided on the printed wiring board 22 is covered with a shield case 18, and a cutout portion 24 that operates as a slot antenna is formed in a part of the shield case 18. Is provided.

  Even in the wireless device 20, no antenna is provided on the printed circuit board 22. Therefore, it is easy to reduce the size of the wireless device 20. Furthermore, unlike the semiconductor device 8 described with reference to FIG. 1, the wireless device 20 can be manufactured without preparing the antenna plate 2, that is, a special member that functions as an antenna. Therefore, it is considered that an increase in manufacturing cost is not invited.

However, it is presumed that the notch 24 provided in the shield case 18 makes it difficult to assemble the wireless device 20 by the mounter. This is because the mounter picks up parts using vacuum suction. Therefore, it is difficult to automate the assembly process of the wireless device 20, and an increase in manufacturing cost is unavoidable.
Japanese Patent No. 3398705 JP 2004-159029 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a small high-frequency module that includes an antenna and transmits and receives electromagnetic waves, and can be manufactured by a simple process, and thus is inexpensive to manufacture.

  In order to achieve the above object, a disclosed high frequency module includes a wiring board, a circuit component mounted on the wiring board, and a circuit component mounted on the wiring board, and electrically connected to the circuit component by the wiring board. A conductive member including a connected conductive member; an insulating member covering the circuit component and the conductive member; and an electrode formed on the insulating member and coupled to the conductive member in an AC manner. It has a membrane.

  According to the disclosed high-frequency module, it is possible to provide a high-frequency module that has a simple manufacturing process and is therefore inexpensive to manufacture.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the technical scope of the present invention is not limited to these embodiments, but extends to the matters described in the claims and equivalents thereof.

(Embodiment 1)
The present embodiment relates to a high frequency module in which a circuit component and a conductive member are embedded with a mold resin, and a conductive film is printed on the top of the mold resin to form an antenna.

(1) Manufacturing Procedure FIGS. 3 to 6 are perspective views for explaining the manufacturing procedure of the high-frequency module 26 according to the present embodiment. Hereinafter, the configuration of the high-frequency module according to the present embodiment will be described in accordance with a manufacturing procedure.

(Step 1)
First, the wiring board 30 is prepared (see FIG. 3).

  Pads 28 and 28 ′ for soldering conductive members and circuit components described later are provided on the surface of the wiring board 30.

  As the wiring board 30, a printed board (FR4-printed board) or an LTCC board can be used. The LTCC substrate is a wiring substrate based on low temperature co-fired ceramics.

  As the wiring board 30, a wiring board having a single layer base may be used. However, the wiring board 30 illustrated in FIG. 3 is a multilayer wiring board in which a plurality of insulating layers are stacked.

  In the wiring substrate 30 shown in FIG. 3, wirings 32 and 32 '(shown by solid lines) are provided on the uppermost layer together with pads 28 and 28'. On the other hand, wiring 32 '' (illustrated with a broken line) is also provided in the lower layer. Although not shown in FIG. 3, circuit components such as capacitors and inductances may be formed in the lower insulating layer by devising the shape of the conductive film.

  In addition, a circuit component means the components which comprise an electronic circuit, such as a capacitor | condenser, inductance, resistance, and a semiconductor integrated circuit.

(Step 2)
Next, cream-like solder is applied onto the pads 28 and 28 'by screen printing.

(Step 3)
Next, as shown in FIG. 4, the circuit component 34 is placed on the wiring board 30 so that the terminal contacts the corresponding pad 28. Further, the columnar conductive member 36 is placed on the wiring substrate 30 so that the bottom surface thereof is in contact with the pad 28 '.

  The conductive member 36 illustrated in FIG. 4 is a member obtained by forming a metal block into a triangular prism shape. However, the conductive member 36 is not necessarily formed by forming a metal lump. For example, the conductive member 36 may be formed by bending a metal plate to have a hollow structure.

  Further, the conductive member 36 is not necessarily a triangular prism. For example, as will be described later, it may be a cylinder or a prism. However, the conductive member 36 preferably has a flat top. Furthermore, the conductive member 36 is preferably taller than all the circuit components 34 or at least as high as the highest circuit component.

(Step 4)
Next, the circuit component 34 and the conductive member 36 are soldered to the wiring board 30 by a reflow process.

  The circuit component 34 is soldered to the pad 28 by this reflow process. The circuit components 34 soldered to the pads are connected to each other by wirings 32 and 32 ″ to form a wireless communication circuit unit 38 including, for example, an oscillator, a modulator, a demodulator, an amplifier, and a filter.

  On the other hand, the conductive member 36 is soldered to the pad 28 'by a reflow process. The conductive member 36 soldered to the pad 28 ′ is connected to the wireless communication circuit unit 38 by the wiring 32 ′.

(Step 5)
Next, the wiring substrate 30 is placed in a mold (not shown) slightly taller than the conductive member 36.

  Next, the fluidized mold resin is poured into the frame. Thereafter, the mold resin is cured, and the frame is removed after the mold resin is cured.

  As the mold resin, for example, a thermosetting resin such as an epoxy resin is preferable.

  Through this step, the conductive member 36 and the circuit component 34 are embedded in the insulating mold resin 40 (resin mold) (see FIG. 5). As shown in FIG. 5, the upper surface 42 of the mold resin 40 becomes flat. The top of the conductive member 36 is covered with a thin mold resin layer.

  FIG. 5 is a perspective view illustrating a state in which the mold resin 40 is seen through (also in the following drawings, the mold resin is drawn through the inside).

(Step 6)
Next, a conductive film 44 containing Ag as a main component is printed on the upper surface 42 of the mold resin 40 (see FIG. 6). The conductive film 44 may be composed mainly of a metal other than Ag, for example, Cu. As a method for printing the conductive film 44, for example, a screen printing method can be used.

  FIG. 7 is a view of a cross section taken along line AA of FIG. 6 as viewed from the direction of the arrow. As shown in FIG. 7, since the upper surface 42 of the mold resin 40 is flat, the conductive film 44 can be easily printed.

  As shown in FIG. 6, the conductive film 44 is divided into three regions having different functions: a planar antenna 46, an electrode 48 that is AC-coupled to the conductive member 36, and a connection portion 50 that electrically connects the two. can do.

  As described above, the electrode 48 is disposed on the conductive member 36 through an insulating thin mold resin layer (see FIG. 7). Therefore, the electrode 48 and the conductive member 36 form a capacitor having a thin mold resin as a dielectric layer.

  Due to the capacitive coupling formed by this capacitor, the electrode 48 is AC coupled to the conductive member 36. As a result, the conductive film 44 functioning as a planar antenna is connected to the wireless communication circuit unit 38 formed by the circuit component 34. Note that capacitive coupling means that a pair of terminals are electrically connected by an alternating current flowing in the capacitor (in this embodiment, the electrode 48 and the conductive member 36 correspond to a pair of terminals. ).

  By the way, in order to reduce the manufacturing cost, it is preferable to simultaneously manufacture a plurality of high-frequency modules 26 on a wide-area wiring board. In this case, it is necessary to divide the wiring board corresponding to each module after simultaneously manufacturing a plurality of high-frequency modules 26 on the wiring board according to the above procedure.

  By the above procedure, the high frequency module 26 including the planar antenna 46 is completed.

  As is clear from the above description, in the present embodiment, the conductive film 44 is printed on the mold resin 40 in which the circuit component 34 is embedded to form a planar antenna.

  That is, the antenna is laminated on the circuit component via the mold resin. Therefore, the high-frequency module 26 according to the present embodiment can be easily downsized.

  Moreover, since the planar antenna 46 is formed by printing, the manufacturing procedure is simple.

  Further, the planar antenna 46 and the wireless communication circuit unit 38 are connected by AC coupling of the electrode 48 and the conductive member 36. Therefore, it is not necessary to form a through hole in the mold resin 40 and form a wiring that reaches the wireless communication circuit unit 38 from the planar antenna 46.

  Therefore, according to the present embodiment, a small high-frequency module that includes an antenna and transmits and receives electromagnetic waves can be manufactured in a simple process, and the manufacturing cost can be reduced.

  The above procedure is summarized as follows.

  In the present embodiment, first, the circuit component 34 and the conductive member 36 are mounted on the wiring board 30 and electrically connected.

  Next, the electrically connected circuit component 34 and the conductive member 36 are embedded with a mold resin 40.

  Next, the conductive film 44 is printed on the mold resin 40, and a part of the conductive film 44 (electrode 48) is disposed on the conductive member 36 to complete the high-frequency module 26.

(2) Operation Transmission of radio waves in the high frequency module 26 is performed as follows.

  First, the wireless communication circuit unit 38 generates a carrier wave of, for example, 2 GHz, and modulates this carrier wave according to the input electric signal.

  The wireless communication circuit unit 38 amplifies the modulated carrier wave, that is, a high frequency signal, and supplies the amplified carrier wave to the conductive member 36. The conductive member 36 supplies this high frequency signal to the electrode 48 (forming part of the conductive film 44) by capacitive coupling. The high-frequency signal supplied to the electrode 48 radiates electromagnetic waves from the planar antenna 46 into the space.

  On the other hand, reception of radio waves by the high frequency module 26 is performed as follows.

  The electromagnetic wave that has reached the conductive film 44 is absorbed by the planar antenna 46 and generates a high-frequency current. This high-frequency current is supplied from the electrode 48 to the conductive member 36 by capacitive coupling.

  The high frequency current supplied to the conductive member 36 is input to the wireless communication circuit unit 38. The radio communication circuit unit 38 performs processing such as amplification, filtering, and demodulation on the high-frequency current and outputs the processed current.

  As is clear from the above operation, the high frequency module 26 is a wireless device that transmits and receives electromagnetic waves. However, the high frequency module 26 may perform only one of transmission and reception of electromagnetic waves.

(3) Device configuration Finally, the configuration of the high-frequency module 26 according to the present embodiment will be summarized.

  As shown in FIG. 6, the high-frequency module 26 according to the present embodiment includes a wiring board 30 and a circuit component 34 mounted on the wiring board.

  The high-frequency module 26 according to the present embodiment has a conductive member 36 mounted on the wiring board and electrically connected to the circuit component 34 by the wiring board 30.

  The high-frequency module 26 according to the present embodiment is formed on the insulating member (mold resin 40) covering the circuit component 34 and the conductive member 36 and the insulating member, and the conductive member 36. And a conductive film 44 including an electrode coupled to each other in an alternating current manner.

  The conductive film 44 has an antenna function that enables transmission and reception of electromagnetic waves.

(Embodiment 2)
In the present embodiment, a circuit component attached to a wiring board is covered with a shield case, and a high-frequency module in which a flexible substrate in which a conductor foil is formed into a shape suitable as an antenna is pasted on the shield case and a conductive member About.

(1) Manufacturing Procedure FIGS. 8 to 10 are perspective views for explaining the manufacturing procedure of the high-frequency module according to the present embodiment. Hereinafter, the configuration of the high-frequency module according to the present embodiment will be described in accordance with a manufacturing procedure.

(Step 1)
The circuit component 34 and the conductive member 36 are attached to the wiring board 30 according to substantially the same procedure as in steps 1 to 4 described in the first embodiment (see FIG. 8). However, the wiring board 30 used in the present embodiment is different from the wiring board used in the first embodiment in that a pad 28 ″ is provided along the outer edge for attaching a shield case described later. To do.

  A wiring (not shown) that can be connected to the ground of an electronic device (such as a mobile phone) on which the high-frequency module is mounted is connected to the pad 28 ″.

(Step 2)
Next, the conductive shield case 50 is placed on the wiring board 30 so that the lower edge of the conductive shield case 50 overlaps the pad 28 '' (see FIG. 9). At this time, cream-like solder is attached to the lower edge of the conductive shield case 50.

  The upper and side surfaces of the shield case 50 are formed of a conductive metal plate, and the lower surface is open. That is, the shield case 50 has substantially the same structure as the box lid. However, when mounted on the wiring board 30 with the complete lid shape, the corner of the shield case 50 collides with the conductive member 36 at the conductive member side corner. Therefore, the shield case 50 is molded so as to avoid the conductive member. (See FIG. 9).

  Therefore, even if the shield case 50 is mounted on the wiring board 30, there is a gap between the shield case 50 and the conductive member 36, and they do not come into contact with each other.

  Furthermore, the top of the shield case 50 is formed flat, and the height thereof is the same as that of the conductive member 36.

  FIG. 9 is a perspective view illustrating a state in which the shield case 50 is seen through (also in the following drawings, the shield case 50 is depicted in a state seen through).

(Step 3)
Next, the shield case 50 is soldered to the wiring board 30 by a reflow process.

(Step 4)
Next, a film-like flexible substrate 52 (Flexible printed circuit; FPC) formed so that the conductive foil (conductive film) functions as an antenna is prepared.

  The flexible substrate 52 is attached to the top of the sheet case 50 and the conductive member 36 with an adhesive applied to the back surface thereof (see FIG. 10).

  FIG. 11 is a cross-sectional view taken along the line AA in FIG. 10 as viewed from the direction of the arrow. As shown in FIG. 11, the tops (upper surfaces 54, 54 ′) of both the shield case 50 and the conductive member 36 are flat and have the same height. Therefore, it is easy to attach the flexible substrate 52 to the tops of the shield case 50 and the conductive member 36.

  As shown in FIG. 10, the conductive foil 56 of the flexible substrate 52 includes three regions that function as a planar antenna 46, an electrode 48 that is AC-coupled to the conductive member 36, and a connection portion 50 that electrically connects the two. Can be divided into The flexible substrate 52 is formed by the conductive foil 56 and the insulating base film 58 that supports the conductive foil 56.

  As described above, the flexible substrate 52 is affixed on the shield case 50 and the conductive member 36. That is, a film-like insulating member (base film 58) is disposed over the upper surfaces of both the shield case and the conductive member 36. At this time, the electrode 48 is disposed immediately above the conductive member 36.

  By the way, the base film 58 is extremely thin, and its thickness is at most 10 to 50 μm. Therefore, the electrode 48 and the conductive member 36 are formed as a capacitor using the insulating base film 58 as a dielectric layer. By this capacitor, the conductive member 36 and the conductive foil 56 are coupled in an alternating manner.

  By the above procedure, the high frequency module 26 including the planar antenna 46 is completed.

  In the present embodiment, the antenna is attached to the high-frequency module by a simple process of attaching the flexible substrate 52 onto the sheet case 50. Further, since the conductive foil 56 serving as the antenna and the conductive member 36 are connected by capacitive coupling, it is not necessary to provide a through hole in the flexible substrate 52 to form a wiring. Further, since the shield case 50 is not obstructed by vacuum suction such as a notch, the shield case 50 can be mounted on the wiring board 30 using a mounter. That is, shield case 50 according to the present embodiment is excellent in pick-up performance.

  Therefore, according to the present embodiment, a small high-frequency module that includes an antenna and transmits and receives electromagnetic waves can be manufactured at low cost by a simple process.

  The above procedure is summarized as follows.

  In the present embodiment, first, the circuit component 34 and the conductive member 36 are mounted on the wiring board 30 and electrically connected.

  Next, the circuit component 34 electrically connected to the conductive member 36 is covered with a conductive shield case 50.

  Then, on the shield case 50 and the conductive member 36, a film-like insulating substrate (base film 58) on which a conductive foil 56 (conductive film) functioning as an antenna is formed is attached. At this time, an insulating substrate (base film 58) is attached so that a part (electrode) of the conductive foil is positioned on the conductive member 36. The high frequency module 60 is completed by the above procedure.

(2) Operation The operation of the high frequency module 60 according to the present embodiment is substantially the same as the operation of the high frequency module 26 according to the first embodiment.

  However, the shield case 50 is different in that the radio communication circuit unit 38 formed by the circuit component 34 is shielded to prevent electromagnetic interference with the outside.

  In the present embodiment, the conductive foil 56 and the shield case 50 formed on the flexible substrate 52 form a patch antenna having a radiation plate and a ground plate, respectively.

(3) Device Configuration Finally, the main part of the configuration of the high-frequency module 60 according to the present embodiment will be summarized.

  As shown in FIG. 10, the high-frequency module 60 according to the present embodiment has a wiring board 30 and a circuit component 34 mounted on the wiring board.

  The high-frequency module 60 according to the present embodiment has a conductive member 36 mounted on the wiring board and electrically connected to the circuit component 34 by the wiring board 30.

  The high-frequency module 60 according to the present embodiment is formed on the insulating member (base film 58) that covers the circuit component 34 and the conductive member 36 and the insulating member, and is formed on the conductive member. A conductive film (conductive foil 56) including electrodes 48 coupled in an alternating manner is provided.

(Embodiment 3)
The present embodiment relates to a high frequency module according to the second embodiment, in which a shield case and a conductive member are integrated.

  12 to 14 are perspective views illustrating a procedure for manufacturing the high-frequency module according to the present embodiment.

  FIG. 12 is a perspective view for explaining a state after the circuit component 34 is soldered on the wiring board 30. FIG. 13 is a perspective view illustrating a state in which a structure in which the shield case 50 and the conductive member 36 are integrated is soldered to the wiring board 30 after the circuit component 34 is soldered. FIG. 14 is a perspective view illustrating a state in which the flexible substrate 52 is attached to the upper surface of the structure in which the shield case 50 and the conductive member 36 are integrated. That is, FIG. 14 is a completed view of high-frequency module 62 according to the present embodiment.

  The manufacturing procedure and configuration of the high-frequency module 62 according to the present embodiment are substantially the same as the manufacturing procedure and manufacturing method of the high-frequency module according to the second embodiment.

  However, high-frequency module 62 according to the present embodiment is different from high-frequency module 60 according to the second embodiment in that conductive member 36 is integrated with shield case 50. That is, as shown in FIG. 13, the conductive member 36 used in the present embodiment is a hollow triangular prism, and the conductive plate forming the left side surface thereof extends to be integrated with the left side surface of the shield case 50. ing.

  Further, according to this difference, the shape of the pad 28 'for soldering the conductive member 36 to the wiring board 30 is also different (see FIG. 12). A pad 28 ″ for soldering the shield case 50 to the wiring board 30 is also extended to a position directly below the left side surface of the conductive member 36.

  Except for the above differences, there is no particular difference in configuration between the high-frequency module 62 according to the present embodiment and the high-frequency module 60 according to the second embodiment.

  Further, the manufacturing procedure of the high-frequency module 62 according to the present embodiment is not particularly different except for the difference in the procedure based on the difference in configuration.

  The shield case 50 and the conductive member 36 used in the present embodiment are formed as an integral part from a conductive material. Therefore, the conductive member 36 is at the same potential as the shield case 50 for direct current operation.

  However, in the high frequency region, the conductive member 36 behaves as a load having one end connected to the circuit component 34 by the wiring 32 and the other end grounded by the shield case 50. Therefore, the conductive member 36 absorbs high-frequency current at a specific frequency and reflects high-frequency current at other frequencies according to the size and shape thereof. That is, the conductive member 36 functions as a filter.

  Therefore, according to the high frequency module 62 according to the present embodiment, it is possible to filter electromagnetic waves by using the filter function of the conductive member 36.

(Embodiment 4)
The present embodiment relates to a high-frequency module including a shield case having a rectangular upper surface and four side surfaces like a box lid.

  FIG. 15 is a perspective view of high-frequency module 64 according to the present embodiment.

  In the present embodiment, the shield case 50 has a box-like shape. Further, the conductive member 36 has a lid shape of an elongated box. The conductive member 36 is juxtaposed next to the shield case 50.

  In other respects, the configuration of the high-frequency module 60 according to the present embodiment is not particularly different from the high-frequency module 60 according to the second embodiment.

(Embodiment 5)
The present embodiment relates to a high-frequency module having a box-shaped shield case and a cylindrical conductive member.

  FIG. 16 is a perspective view of high-frequency module 66 according to the present embodiment.

  Similarly to the fifth embodiment, the high-frequency module 66 according to the present embodiment also includes a box-shaped shield case 50. On the other hand, the conductive member 36 is not a box lid but a columnar shape.

  In other respects, the configuration of high-frequency module 66 according to the present embodiment is substantially the same as high-frequency module 64 according to the fourth embodiment.

  By the way, the antennas exemplified in the first to fifth embodiments are all planar antennas. However, antennas that can be mounted on the disclosed high-frequency module are not limited to planar antennas. For example, a linear antenna such as a spiral antenna may be formed on a mold resin or a flexible substrate.

  As is apparent from the above description, the disclosed high-frequency module is small in size and low in manufacturing cost. Therefore, the disclosed high-frequency module can be mounted on an information processing device such as a non-contact IC card, an IC tag, or a mobile phone.

It is a figure explaining the structure of the semiconductor device formed by laminating | stacking an antenna plate, a semiconductor element, and a metal plate. It is a perspective view explaining the structure of the radio | wireless apparatus by which the slot antenna was formed in the shield case which covers a high frequency radio | wireless circuit. It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 1 (No. 1). It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 1 (No. 2). It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 1 (No. 3). It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 1 (No. 4). It is a figure explaining the cross section of the high frequency module according to Embodiment 1. FIG. It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 2 (the 1). It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 2 (the 2). It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 2 (the 3). It is a figure explaining the cross section of the high frequency module according to Embodiment 2. FIG. It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 3 (the 1). It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 3 (the 2). It is a perspective view explaining the manufacturing procedure of the high frequency module according to Embodiment 3 (the 3). It is a perspective view explaining the structure of the high frequency module according to Embodiment 4. It is a perspective view explaining the structure of the high frequency module according to Embodiment 5.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Antenna plate 2 4 ... Semiconductor element 6 ... Metal plate 8 ... Semiconductor device 10 ... Antenna pattern 12 ... Terminal 14 ... Adhesive 16 ... High frequency radio circuit 18 ... Shield case 20 ... Radio device 22 ... Printed wiring board 24 ... Notch 26 ... (according to Embodiment 1) High-frequency module
28, 28 ', 28 "... Pad 30 ... Wiring board 32, 32' ... Wiring 34 ... Circuit component 36 ... Conductive member 38 ... Wireless communication circuit unit 40 ... -Mold resin 42 ... upper surface of mold resin 44 ... conductive film 46 ... planar antenna 48 ... electrode 50 ... shield case 52 ... flexible substrate 54, 54 '... upper surface 56 ... conductive foil 58 ... base film 60 ... (according to the second embodiment) high frequency module 62 ... (according to the third embodiment) high frequency module 64 ... (according to the fourth embodiment) high frequency Module 66 ... (according to Embodiment 5) High-frequency module 68 ... Ridge substrate

Claims (20)

A wiring board;
Circuit components mounted on the wiring board;
A conductive member mounted on the wiring board and electrically connected to the circuit component by the wiring board;
An insulating member covering the circuit component and the upper side of the conductive member;
A conductive film including an electrode formed on the insulating member and coupled to the conductive member in an alternating manner;
High frequency circuit module provided.   The high-frequency module according to claim 1, wherein the conductive film has an antenna function that enables transmission and reception of electromagnetic waves. The electrode is disposed on the conductive member via the insulating member;
3. The high-frequency circuit module according to claim 1, wherein the electrode and the conductive member are coupled in an alternating manner by capacitive coupling of the electrode and the conductive member. The insulating member is
Formed of mold resin,
That both the circuit component and the conductive member are embedded,
The high-frequency module according to claim 1 or 2, characterized in that   The high-frequency module according to claim 4, wherein an upper surface of the mold resin is flat.   The high-frequency module according to claim 4 or 5, wherein the conductive film is printed on an upper surface of the mold resin. Covering the circuit component, having a conductive shield case of the same height as the conductive member;
The high-frequency circuit module according to claim 1, wherein the insulating member is disposed on the shield case and the conductive member.   The high-frequency module according to claim 7, wherein upper surfaces of both the conductive member and the shield case are flat.   The high-frequency module according to claim 7 or 8, wherein the conductive member and the shield case are formed as an integral member in which a part thereof is connected. The insulating member is in the form of a film;
It is arranged over the upper surfaces of both the shield case and the conductive member,
The high-frequency module according to claim 7, wherein the high-frequency module is characterized in that   The high-frequency module according to claim 10, wherein the insulating member and the conductive film are integrally formed by a flexible substrate. The insulating member is plate-shaped,
The high-frequency module according to claim 7, wherein the high-frequency module is disposed over the upper surfaces of both the shield case and the conductive member.   The high-frequency module according to claim 12, wherein the insulating member and the conductive film are integrally formed of a printed circuit board or a low-temperature fired ceramic substrate.   The high-frequency module according to claim 1, wherein the conductive film forms a planar antenna.   The high-frequency module according to claim 1, wherein the conductive film forms a linear antenna.   The high-frequency module according to claim 15, wherein the linear antenna forms an array antenna.   The high-frequency module according to claim 15, wherein the linear antenna forms a spiral antenna.   8. The high-frequency circuit module according to claim 7, wherein a patch antenna having a radiation plate and a ground plate is formed by the conductive film and the shield case, respectively. A circuit component and a conductive member are mounted on a wiring board and electrically connected,
The electrically connected circuit component and the conductive member are embedded with a mold resin,
A conductive film functioning as an antenna is printed on the mold resin, and a part of the conductive film is disposed on the conductive member.
A method for manufacturing a high-frequency module. A circuit component and a conductive member are mounted on a wiring board and electrically connected,
Covering the circuit component electrically connected to the conductive member with a conductive shield case,
On the shield case and the conductive member, a film-like or plate-like insulating substrate formed with a conductive film functioning as an antenna is attached,
A portion of the conductive film is disposed on the conductive member;
A method for manufacturing a high-frequency module.

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