JP2009288138A - Infrared sensor package, and method of manufacturing the same - Google Patents

Abstract

An infrared sensor package having excellent durability and a method for manufacturing the same are provided.
An infrared sensor package that packages an infrared sensor that outputs an electrical signal corresponding to the amount of received infrared light, the circuit board having a wiring that forms an electric circuit, and the amount of received infrared light. An infrared sensor 40 disposed on the circuit board, a connection part 60 for electrically connecting the wiring 24 and the electrode 50, and the circuit board 20. A lid 70 provided above and covering the connection portion 60, and a filler filling a space formed by the circuit board 20, the infrared sensor 40, and the lid 70 are provided.
[Selection] Figure 1

Description

  The present invention relates to an infrared sensor package and a method of manufacturing the same.

  The infrared sensor outputs an electrical signal based on a physical property value such as a resistance value that changes in accordance with the amount of received infrared light (amount of heat). Such an infrared sensor is mounted on an infrared camera or the like, and is used for an infrared light receiving device that is irradiated to detect passage of a person or an object.

  In order to improve the sensitivity of an infrared sensor that outputs an electrical signal based on the infrared thermal energy as described above, when the infrared element that is an element sensitive to infrared is mounted, the infrared element is thermally isolated. Thermal insulation structure is adopted. Examples of such infrared sensors include those in which an infrared element is disposed in a vacuum package, and those in which a vacuum package is further directly formed on a wafer on which the infrared element is formed (for example, Patent Document 1).

Further, when the infrared sensor is mounted on the substrate, the electrode part serving as the interface of the infrared sensor and the wiring part of the circuit board for driving the infrared sensor are electrically connected. Generally, wire bonding is used for electrical connection between the electrode portion and the wiring portion. Such an electrical connection portion is sealed with a resin in order to protect it from moisture (see, for example, Patent Document 2 and Patent Document 3).
Japanese National Publication No. 9-506712 JP 2003-198897 A Japanese Patent No. 2955867

  As described above, when the infrared sensor is used in an infrared camera or an infrared light receiving device, the application product thereof may be used outdoors. Moreover, a strong impact may be applied to them by dropping or the like. For this reason, durability that can withstand high temperatures under hot weather, high humidity such as rain and fog, and strong impact is required. However, the conventional sealing structure or sealing method cannot realize a high durability enough to withstand the severe use environment as described above.

  Accordingly, an object of the present invention is to provide an infrared sensor package having excellent durability and a method for manufacturing the same in order to solve the above-described problems.

An infrared sensor package that packages an infrared sensor that outputs an electrical signal corresponding to the amount of received infrared light,
A circuit board having wiring to form an electrical circuit;
An infrared sensor disposed on a circuit board having an electrode as an interface for outputting an electrical signal corresponding to the amount of received infrared light;
A connection part for electrically connecting the wiring and the electrode;
A lid that is attached above the circuit board and covers the connection portion;
The circuit board and a filler that fills a space formed by the circuit board and the lid.

  According to the present invention, the connection portion is protected by the lid and the filler. That is, the periphery of the connection portion is reliably covered with the filler, and the cover protects the outer frame. Therefore, it becomes extremely difficult for moisture to reach the connection portion and the electrodes and wirings connected thereto, and the moisture resistance is improved. Even when the temperature rises or an impact is applied, since the filler is filled, it is difficult to cut the contact between the connection portion and each of the electrode and wiring connected thereto. Therefore, heat resistance and impact resistance are improved. In this way, durability including moisture resistance, heat resistance and impact resistance can be improved.

  In addition, since the space for injecting the filler is partitioned by the circuit board, the lid, and the infrared sensor, it is possible to reliably fill with a stable amount of filler used, and it is possible to improve production efficiency and yield. Become.

(Embodiment 1)
1-3 is a figure which shows the general appearance of the infrared sensor package which concerns on Embodiment 1 of this invention. Specifically, FIG. 1 is a perspective view showing the appearance of the infrared sensor package according to the first embodiment. FIG. 2 is a cutaway view showing an internal configuration by cutting out a part of the infrared sensor package according to the first embodiment. 3 is a side sectional view of the infrared sensor package taken along line II in FIG. Hereinafter, the outline of the configuration of the infrared sensor package according to the first embodiment will be described with reference to these drawings.

  The infrared sensor package according to the first embodiment is an infrared sensor package 10 in which an infrared sensor that outputs an electrical signal corresponding to the amount of received infrared light is packaged, and generally includes a circuit board 20, an infrared sensor 40, and a connection portion. 60, a lid 70, and a filler 90.

  The circuit board 20 is a board that includes circuits that perform various functions. The circuit board 20 includes a main board 22, various electronic devices (not shown) arranged on the board 20 according to functions to be performed, and various wirings forming an electric circuit. The wiring provides an interface for connecting these electronic devices and connecting to another circuit board, an external power source, etc., and the wiring 24 shown in FIG. The illustrated wiring 24 is a part of wiring connected to an infrared sensor 40 described later, and is electrically connected to an electronic device for driving the infrared sensor 40, for example.

  The infrared sensor 40 outputs an electrical signal corresponding to the amount of received infrared light. The infrared sensor 40 is disposed on the circuit board 20. The infrared sensor 40 generally includes an element substrate 42, a light receiving member 44, a bonding member 46, and an electrode 50.

  The element substrate 42 includes one or a plurality of infrared elements (not shown) whose electrical characteristics change according to the amount of received light when receiving infrared rays. An infrared element is an element in which a change in electrical characteristics occurs according to the amount of infrared light received by the infrared element. As an example of a thermal type infrared device, there is one in which a resistance value as an electrical characteristic varies depending on the amount of heat corresponding to the amount of received infrared light. The element substrate 42 includes electronic circuits as necessary. The element substrate 42 outputs a change in the electrical characteristics of the infrared element as an electrical signal indicating the presence / absence of a certain amount of infrared light received, a change in the amount of received infrared light, and the like in cooperation with the infrared element and the electronic circuit.

  The light receiving member 44 is a flat member that is provided to face the infrared element disposed on the element substrate 42 and includes a portion that receives infrared rays. The portion that receives infrared rays is made of a material that transmits infrared rays. The light receiving member 44 is preferably formed with an antireflection film for improving the infrared transmittance on a flat substrate. The substrate is made using a material such as silicon (Si), germanium (Ge), zinc sulfide (ZnS), or zinc selenide (ZnSe), for example. In general, silicon is inexpensive, easy to obtain, and easy to handle, but has a high refractive index characteristic and thus has a large reflection loss. When silicon is used for the substrate, zinc sulfide ZnS is preferably used as an antireflection film in order to increase the detection sensitivity of the infrared sensor.

  The bonding member 46 is a member that fixedly bonds the element substrate 42 and the light receiving unit 44 at a predetermined interval so that a vacuum space 48 is formed between the element substrate 42 and the light receiving unit 44. Solder or the like. As described above, the infrared element is disposed on the element substrate 42. By forming the vacuum space 48 with the bonding member 46, the infrared element is hardly affected by heat other than infrared rays, and the sensitivity of the infrared sensor can be improved.

  The electrode 50 is an interface that outputs an electrical signal, and outputs an electrical signal corresponding to the electrical characteristics of the infrared element.

  The connection part 60 electrically connects the wiring 24 and the electrode 50. The connection part 60 is a conductor joined by wire bonding, for example.

  The lid 70 is a member that is provided above the circuit board 20 and covers the connection portion 60. The lid 70 has an upper surface portion 72 that faces the circuit board 20, and the upper surface portion 72 has a light receiving window 74. The light receiving window 74 is a window arranged in a part of the upper surface portion 72 in association with the light receiving element so that at least the light receiving element of the infrared sensor 40 can be irradiated with infrared light.

  The lid body 70 further includes a light receiving window portion 78 extending downward from a peripheral portion forming the light receiving window 74 of the upper surface portion 72, and a side portion extending downward from the peripheral portion forming the outer periphery of the upper surface portion 72. 80. In the present embodiment, the upper surface portion 72 is a rectangular flat plate, and the light receiving window 74 is illustrated as a rectangular window provided substantially at the center of the upper surface portion 72, but these shapes are rectangular. The position where the light receiving window 74 is provided is not limited to the center of the upper surface portion 72.

  The light receiving window 78 is in contact with the upper surface of the infrared sensor 40, that is, the upper surface of the light receiving member 44 in the present embodiment, at the entire lower end thereof. The lower end of the light receiving window 78 is preferably in contact with the vicinity of the outer edge of the upper surface of the infrared sensor 40. Further, the side portion 80 is in contact with the upper surface of the main board 22 at the entire lower end thereof. The lower end of the side portion 80 is preferably in contact with the vicinity of the outer edge of the upper surface of the main substrate 22. Although the example which extends vertically downward about the light-receiving window part 78 and the side part 80 is illustrated, they are not limited to the vertically downward direction, and may be inclined and extend downward. When viewed from above, the outer edge of the lid 70 is shaped and sized to be included in the outer edge of the main substrate 22. Further, when viewed from above, the periphery of the light receiving window 74 of the lid 70 has a shape and size enclosed by the outer edge of the infrared sensor 40 and a part of the lid 70 at a position corresponding to the infrared element. Is provided. Further, the downward length or thickness of the light receiving window part 78 and the side part 80 differs by the thickness of the infrared sensor 40. The size of the light receiving window 74 and the downward length or thickness of the light receiving window portion 78 are determined in consideration of the angle of view of the infrared light incident on the infrared sensor 40.

  Furthermore, the upper surface portion 72 of the lid body 70 of the present embodiment has two or more injection ports 76. The injection port 76 is a small hole provided for injecting a filler 90 to be described later into a filling space formed approximately by the circuit board 20, the lid 70, and the infrared sensor 40.

  The injection port 76 of the present embodiment has a rectangular shape, and is disposed so as to be located on the opposite sides of the two diagonal lines of the upper surface portion 72 via two light receiving windows 74. Thus, two or more injection ports 76 are arranged on the same straight line through the light receiving window 74. In this case, the same straight line that passes through the light receiving window 74 and is the longest among the line segments included in the upper surface portion 72 is preferably selected. Specifically, in the case of the rectangular upper surface portion 72 in which the light receiving window 74 is arranged at the center, the same straight line where two or more injection ports 76 are provided is a diagonal line of the upper surface portion 72. Further, for example, in the case of a circular upper surface portion having a light receiving window disposed at the center, the same straight line provided with two or more injection ports is a line extending in the radial direction through the center of the circular upper surface portion. Accordingly, it is possible to reliably fill the filling space by confirming that the filler 90 injected from one injection port 76 reaches the other injection port 76. In particular, since the two injection ports 76 are on the same straight line through the light receiving window 74, it is possible to reliably spread the filler 90 in the vicinity of the connection portion 60.

  The filler 90 is a material that fills the filling space. The filler 90 is preferably a material with low moisture permeability and a material with high heat resistance. A specific material of the filler 90 is a potting agent which is a silicon-based adhesive containing fluorine having a low moisture permeability. In addition, the sealing material 92 fills the inlet 76 and seals the filler 90. For the sealing material 92, for example, a resin material such as a liquid crystal polymer is used.

  The filling space is generally a space formed by the upper surface of the main substrate 22, the inner surface of the lid 70, and the side surface of the infrared sensor 40. As will be apparent from the above description of the configuration, the filling space includes the entire upper surface of the infrared sensor 40 and the upper surface of the main substrate 22 at the lower end of the light receiving window 78 of the lid 70 and the entire lower end of the side 80. This is a closed space in which only the injection port 76 is opened. The filling space includes the wiring 24, the electrode 50, and the connection 60 (hereinafter referred to as “connection 60 etc.”). Therefore, these connection lines 60 and the like are protected and the connection relationship is reinforced by the filler 90 filling the filling space. Further, the injection port 76 is sealed with a sealant 92. This makes it difficult for moisture to reach the connection 60 or the like. Further, it is difficult for the connection 60 to be cut off due to high temperature or impact, and the connection of the connection 60 or the like to be cut off. Therefore, durability including moisture resistance, heat resistance, and impact resistance can be improved.

  Next, a method for manufacturing the infrared sensor package 10 according to Embodiment 1 of the present invention shown in FIG. 1 will be described with reference to FIGS. 4 to 6 are perspective views showing a first process to a third process in the manufacturing process of the infrared sensor package 10, respectively.

  (First step of the infrared sensor package 10: see FIG. 4) A pre-manufactured infrared sensor 40 is disposed on the main substrate 22 and die-bonded by a silicon-based die bond material, and then each electrode 50 and wiring included therein. The connection part 60 is formed by connecting 24 by wire bonding using wires, such as gold | metal | money. By forming the connection part 60, the electrode 50 and the wiring 24 are electrically connected.

  (The 2nd process of the infrared sensor package 10: refer FIG. 5) The cover body 70 is arrange | positioned on the circuit board 20 and the infrared sensor 40 which were united. At this time, the lid body 70 is configured so as to have the above-described configuration, that is, to form a filling space that covers the connection portion 60 and is substantially sealed (that is, closed except for the inlet 76). Mounted on the substrate 20 and the infrared sensor 40.

  (The third step of the infrared sensor package 10: see FIG. 6) The filler 90 is injected from each of all the injection ports 76 of the lid 70. The filler 90 is injected until it is confirmed that the filler 90 overflows from each inlet 76. As described above, each inlet 76 has at least one other inlet 76 arranged on the opposite side through the light receiving window 74 in the same straight line. Therefore, it can be recognized that the filler 90 has filled the filling space by confirming that the filler injected from a certain inlet 76 overflows from the other inlet 76. In particular, since the light receiving window 74 is positioned between a certain inlet 76 and another inlet 76, the filler 90 injected from the certain inlet 76 flows along the periphery of the light receiving sensor 40. The other injection port 76 is reached. As a result, the connection portion 60 that is particularly required to be protected and reinforced by the filler 90 is reliably covered with the filler 90. Therefore, according to the present configuration and method, it is possible to surely improve the durability around the connection portion 60. Further, the filler 90 is filled into a predetermined filling space. Therefore, since the amount of the filler 90 necessary for each infrared sensor package 10 is stabilized in a necessary and sufficient amount, the filler 90 is not consumed wastefully and the production efficiency is improved as compared with the conventional case. In addition, since the generation of defective products due to the shortage of the filler 90 can be suppressed, the yield can also be improved.

  (Fourth step of the infrared sensor package 10: see FIG. 1) The injection port 76 is filled with the sealing material 92. This makes it difficult for moisture and the like to enter the filler 90, and improves moisture resistance, dust resistance, and the like. Thereby, the infrared sensor package is completed.

  As described above, according to the present invention, since the filling space can be surely covered with the filler, particularly around the connection portion, moisture resistance, heat resistance and impact resistance can be improved. Therefore, it is possible to provide an infrared sensor package having excellent durability. In addition, since the filling space can be filled with the filler stably and reliably, consumption of the filler can be reduced and the yield can be improved.

(Embodiment 2)
FIG. 7 is a perspective view showing an infrared sensor package 110 according to Embodiment 2 of the present invention. The infrared sensor package 110 shown in the figure is an infrared sensor that outputs an electrical signal corresponding to the amount of received infrared light, similar to the infrared sensor package 10 of the first embodiment. The infrared sensor 40, the connection part 60, the cover body 170, and the filler 190 are provided. The circuit board 20, the infrared sensor 40, and the connection unit 60 have the same configuration as that of the first embodiment. For this reason, in the present embodiment, description regarding these is omitted.

  Similarly to the first embodiment, the lid 170 is a member that is provided above the circuit board 20 and covers the connection portion 60. The lid 70 has an upper surface portion 172 facing the circuit board 20, and the upper surface portion 172 has a light receiving window 174. The light receiving window 174 is a window arranged in a part of the upper surface portion 172 in association with the light receiving element so that at least the light receiving element of the infrared sensor 40 can be irradiated with infrared light. The lid body 70 further includes a light receiving window portion 178 extending downward from a peripheral portion forming the light receiving window 174 of the upper surface portion 172, and a side portion extending downward from the peripheral portion forming the outer periphery of the upper surface portion 172. 180. In the present embodiment, the upper surface portion 172 is a rectangular flat plate, and the light receiving window 174 is illustrated as a rectangular window provided substantially at the center of the upper surface portion 172. However, these shapes are rectangular. The position where the light receiving window 74 is provided is not limited to the center of the upper surface portion 172.

  As in the first embodiment, the light receiving window portion 178 abuts the upper surface of the infrared sensor 40, that is, the upper surface of the light receiving member 44 in the present embodiment, at the entire lower end thereof. The lower end of the light receiving window 178 is preferably in contact with the vicinity of the outer edge of the upper surface of the infrared sensor 40. In addition, although the example which the light-receiving window part 178 extends in the vertically downward direction is illustrated, this is not limited to the vertically downward direction, and may be inclined and extend downward. The light receiving window 174 of the lid 170 has a size smaller than the outer edge of the infrared sensor 40 and is provided in a part of the lid 170 corresponding to the infrared element. The size of the light receiving window 174 and the downward length or thickness of the light receiving window portion 178 are determined in consideration of the angle of view of the infrared light incident on the infrared sensor 40.

  On the other hand, unlike the first embodiment, the inner surface in the vicinity of the lower end of the side portion 180 has a size and shape that sufficiently includes the main substrate 22 when viewed from above, and is larger than the outer edge of the main substrate 22. It has a slightly larger shape and size. Moreover, the side part 180 has the length or thickness to the downward direction extended in the downward direction rather than the lower surface of the main board | substrate 22 in the whole lower end. Therefore, unlike the first embodiment, the difference in the downward length or thickness between the light receiving window portion 178 and the side portion 180 is larger than the thickness of the infrared sensor 40. In addition, about the side part 180, the example extended to the vertically downward direction is respectively illustrated, However, These are not restricted to the vertically downward direction, You may incline and extend below.

  The injection port 176 is an opening for injecting a filler 190 described later, and is formed between the inner surface near the lower end of the side portion 180 and the side wall of the main substrate 22. That is, the injection port 176 of the present embodiment is formed with a certain small width along the inner periphery of the lower end of the side portion 180.

  The filler 190 is a material that fills the filling space. The sealing material 192 receives the inlet 176 and seals the filler 190. The materials of the filler 190 and the sealing material 192 may be the same as those in the first embodiment.

  With such a configuration, the filling space including the connection 60 and the like is generally formed by the upper surface of the main substrate 22, the inner surface of the lid 170, and the side surface of the infrared sensor 40. Therefore, these connection lines 60 and the like are protected by the filler 190 that fills the filling space, and the joining relationship is mainly reinforced. Further, the inlet 176 is sealed with a sealant 192. This makes it difficult for moisture to reach the connection 60 or the like. Further, it is difficult for the connection 60 to be cut off due to high temperature or impact, and the connection of the connection 60 or the like to be cut off. Therefore, durability including moisture resistance, heat resistance, and impact resistance can be improved.

  Further, in this embodiment, it is not necessary to provide an injection port in the upper surface portion 172 of the lid body 170, so that the configuration of the lid body 170 can be simplified as compared with the first embodiment.

  Next, a method for manufacturing the infrared sensor package 110 according to the second embodiment of the present invention shown in FIG. 7 will be described with reference to FIGS. 8 to 11 are cross-sectional views showing the first to fourth steps in the manufacturing process of the infrared sensor package 110, respectively. These sectional views show a section taken along line II-II in FIG.

  (First step of infrared sensor package 110: see FIG. 8) The lid 170 is attached upside down so that the lower end of the side portion 180 that will form the injection port (176) faces upward. At this time, the contact portion between the light receiving window 178 and the infrared sensor 40 may be bonded so that the positional relationship between the infrared sensor 40 and the lid 170 does not shift. Subsequently, in parallel or in advance, the circuit board 20 and the infrared sensor 40 are die-bonded by the same method as in the first step of the first embodiment, and the connection portion 60 is formed. Detailed description is omitted.

  (The second step of the infrared sensor package 110: see FIG. 9) The circuit board 20 and the infrared sensor 40, which are integrated by the same method as the first step of the first embodiment and the connection portion 60 is formed, are upside down. In other words, the light receiving member 44 is disposed so that the upper surface in the vicinity of the outer periphery contacts the light receiving window portion 178. At this time, the main substrate 22 is included in the side portion 180, and the lower end of the side portion 180 slightly protrudes above the bottom surface of the main substrate 22. Thereby, the above-mentioned injection port 176 is formed.

  (The third step of the infrared sensor package 110: see FIG. 10) The filler 190 is injected from one or preferably a plurality of locations of the injection port 176 and is injected until it overflows from the entire region of the injection port 176. Thereby, since the filling space can be reliably filled with the filling material 190, the durability of the infrared sensor package 110 can be improved, and the production efficiency and the yield can be improved as in the first embodiment. Moreover, by injecting the filler 190 from a plurality of locations of the injection port 176, the time required for filling the filler 190 can be shortened, and the production efficiency can be improved.

  (Fourth step of the infrared sensor package 110: see FIG. 11) The inlet 176 is filled with the sealing material 92. This makes it difficult for moisture or the like to enter the filler 190, and it is possible to improve moisture resistance, dust resistance, and the like. Thereby, the infrared sensor package is completed.

  As described above, according to the present invention, since the filling space can be surely covered with the filler, particularly around the connection portion, moisture resistance, heat resistance and impact resistance can be improved. Therefore, it is possible to provide an infrared sensor package having excellent durability. In addition, since the filling space can be filled with the filler stably and reliably, consumption of the filler can be reduced and the yield can be improved.

  In the above-described embodiment, the application to the uncooled infrared sensor has been described. However, application to other sensors is also possible. In addition, the embodiments disclosed in the present specification are examples in all respects, are not restrictive, and can be combined as long as they do not contradict each other. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

  The present invention is applicable to an infrared sensor package including an infrared sensor and its manufacture.

It is a perspective view which shows the external appearance of the infrared sensor package which concerns on Embodiment 1 of this invention. It is a perspective view which cuts off some infrared sensor packages which concern on Embodiment 1, and shows an internal structure. FIG. 2 is a side sectional view of the infrared sensor package taken along line II in FIG. 1. FIG. 6 is a perspective view showing a first step in the method of manufacturing the infrared sensor package according to the first embodiment. It is a perspective view which shows the 2nd process in the manufacturing method of the infrared sensor package which concerns on Embodiment 1. FIG. It is a perspective view which shows the 3rd process in the manufacturing method of the infrared sensor package which concerns on Embodiment 1. FIG. It is a perspective view which cuts out the infrared sensor package which concerns on Embodiment 2 of this invention, and shows a part. It is sectional drawing which shows the 1st process in the manufacturing method of the infrared sensor package which concerns on Embodiment 2. FIG. It is sectional drawing which shows the 2nd process in the manufacturing method of the infrared sensor package which concerns on Embodiment 2. FIG. It is sectional drawing which shows the 3rd process in the manufacturing method of the infrared sensor package which concerns on Embodiment 2. FIG. It is sectional drawing which shows the 4th process in the manufacturing method of the infrared sensor package which concerns on Embodiment 2. FIG.

Explanation of symbols

  10, 110 Infrared sensor package, 20 Circuit board, 22 Main board, 24 Wiring, 40 Infrared sensor, 42 Element board, 44 Light receiving member, 46 Joining member, 48 Vacuum space, 50 Electrode, 60 Connection part, 70, 170 Lid , 72, 172 Upper surface part, 74, 174 Light receiving window, 76, 176 Inlet, 78, 178 Light receiving window part, 80, 180 Side part, 90, 190 Filler, 92, 192 Sealant.

Claims (5)

An infrared sensor package that packages an infrared sensor that outputs an electrical signal corresponding to the amount of received infrared light,
A circuit board having wiring to form an electrical circuit;
An infrared sensor disposed on a circuit board having an electrode as an interface for outputting an electrical signal corresponding to the amount of received infrared light;
A connection part for electrically connecting the wiring and the electrode;
A lid that is attached above the circuit board and covers the connection portion;
An infrared sensor package comprising: the circuit board; and a filler that fills a space formed by the circuit board and the lid.   2. The infrared sensor package according to claim 1, wherein the lid body has two or more injection ports for injecting the filler in an upper surface portion facing the circuit board. The lid body includes a light receiving window portion that forms a light receiving window on which infrared rays are incident on the upper surface portion and contacts the upper surface of the light receiving portion,
3. The infrared sensor package according to claim 2, wherein the injection ports include ones that are collinear and are disposed on the opposite side through the light receiving window. The lid is
An upper surface facing the circuit board;
Forming a light receiving window on which infrared light is incident on the upper surface portion and contacting the upper surface of the light receiving portion; and
2. The infrared sensor package according to claim 1, further comprising a side portion that is provided downward from an outer edge portion of the upper surface portion and that has an opening at a lower end that is large enough to accommodate the circuit board. A method of manufacturing an infrared sensor package in which an infrared sensor that outputs an electrical signal according to the amount of received infrared light is packaged,
Electrically connecting a circuit board having wiring for forming an electric circuit and an electrode that is an output interface of an infrared sensor that outputs an electric signal corresponding to the amount of received infrared rays;
Attaching a lid that covers the connection portion to the circuit board and the infrared sensor;
A method of manufacturing an infrared sensor package, comprising: injecting a filler into a space formed by the lid, the circuit board, and the infrared sensor.

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