JP2009283672A - Electronic apparatus cooling device - Google Patents

Abstract

An electronic device cooling apparatus capable of easily and flexibly responding to a cooling specification required by an electronic device or an electronic component.
A comb heat sink 1 includes a comb-shaped fin 10 in which a cylindrical base portion 11 and radial fin portions 12 having a constant pitch extending radially from the base portion are formed, and a cylindrical hole in the base portion 11. And a columnar base pin 20 that is connected and thermally connected by stacking the comb-shaped fins 10. 4 is a heating element to be cooled, and the number of comb fins 10 arranged is set according to the required cooling specifications.
[Selection] Figure 1

Description

  The present invention relates to a cooling device for cooling an electronic device or an electronic component, and more particularly to an electronic device cooling device using a comb heat sink.

  2. Description of the Related Art Conventionally, there has been disclosed a comb heat sink configured by manufacturing a fin portion by thin plate or extrusion processing and caulking the fin to a grooved base portion (see, for example, Patent Document 1).

FIG. 15 is a perspective view showing a configuration of a conventional comb heat sink.
In the figure, 201 is a base, 120 is a pin fin unit, and the pin fin unit 120 includes a pin fin 121 and a base portion 122.
FIG. 16 is a perspective view of the base. As shown in the figure, the base 201 has a plurality of concave grooves 202 formed therein.

Next, a manufacturing method will be described.
The base 201 is extruded so as to have a plurality of concave grooves 202. On the other hand, the pin fin unit 120 is formed by extruding a mold material so as to have bases 122 on both sides, punching out at a double pitch to form a part of the pin fin, and then moving the material by one pitch and punching out again. A pin fin 121 perpendicular to the base 122 is formed. Then, the pin fin 121 is cut at the center between the base and the base to obtain two pin fin units 120. Next, the rod-like base 122 of the pin fin unit 120 is inserted into the concave groove 202 of the base 201, and the base 201 is crimped to fix the pin fin unit 120.
As described above, the conventional comb heat sink is fixed by extruding a base having a plurality of concave grooves, setting the pin fin unit on the grooved portion of the base, and crimping the base.
JP-A-8-181259

However, the conventional comb heat sink needs to be designed and manufactured not only for the pin fin portion but also for the base in accordance with the required cooling specifications.
The present invention has been made in view of such problems, and an object of the present invention is to provide an electronic device cooling apparatus that can easily and flexibly cope with a cooling specification required by an electronic device or an electronic component.

In order to solve the above problem, the present invention is configured as follows.
The invention according to claim 1 is a cooling device including a mounting base to which a heating element is attached and a comb heat sink that is thermally connected to the mounting base and cools the heating element, wherein the comb heat sink has a cylindrical base portion. And comb-shaped fins formed of radial fin portions of equal pitch extending radially from the base portion, and columnar base pins that fit into the cylindrical holes of the base portion and are stacked and thermally connected to each other. It is characterized by having.
Further, the invention according to claim 2 is characterized in that the comb fins are stacked on the base pin in a state where the radial fin portions are alternately shifted by ½ pitch in the pitch direction. It is said.
The invention according to claim 3 is characterized in that the base portion and the base pin are formed with a rotation restricting portion for fixing the comb fin at a position in a predetermined pitch direction.
According to a fourth aspect of the present invention, the rotation restricting portion is a convex portion or a concave portion formed on the cylindrical base portion and the columnar base pin.
The invention according to claim 5 is characterized in that the rotation restricting portion is a flat portion formed on the cylindrical base portion and the columnar base pin.
According to a sixth aspect of the present invention, the rotation restricting portion is configured by forming a regular N-square hole in the base portion and forming the shape of the base pin as a regular N-prism.
According to a seventh aspect of the present invention, the comb fin includes a radial fin and a plurality of arc-shaped fins extending in a circumferential direction from a predetermined position of the radial fin, and an end of the arc-shaped fin is provided. It is characterized in that a gap is formed between the radial fins adjacent to the part.
Further, the invention according to claim 8 is characterized in that the base pin has a hole portion for embedding a heat pipe.
In the invention according to claim 9, the base pin is divided in a columnar vertical direction, and a space part into which a pin or a screw is inserted is formed at the divided center, and the pin is formed in the space part. Alternatively, the base pin is pressed against the base portion of the comb fin by inserting a screw.
The invention according to claim 10 is characterized in that the base pin has a bent shape.
The invention described in claim 11 is characterized in that the control device includes the electronic device cooling device described in claim 1.

According to the first aspect of the present invention, the comb-shaped heat sink is fitted into a comb-shaped fin including a cylindrical base portion, a radial fin portion having a constant pitch extending radially from the base portion, and a cylindrical hole in the base portion. Since the comb-shaped fins are provided with columnar base pins that are stacked and thermally connected, the number of comb-shaped fins can be easily changed according to the cooling specifications required by the electronic device or electronic component. Also, no direct processing on the heat sink is required. Therefore, it is possible to realize an electronic device cooling apparatus that can easily and flexibly meet the cooling specifications required by the electronic device or electronic component.
According to the second aspect of the present invention, if the comb fins are fitted with the base pins while being alternately shifted by 1/2 pitch, the air can be efficiently sent to the comb fins without interrupting the air flow. The effect can be enhanced.
According to the third to sixth aspects of the present invention, the heat sink can be easily formed into a comb shape by forming the rotation restricting portion for fixing the comb-shaped fin at a position in a predetermined pitch direction.
According to the seventh aspect of the present invention, if the gap is formed between the radial fins adjacent to the ends of the arc-shaped fins, the air flow can be efficiently applied to the fins without blocking the air flow during forced air cooling. The heat dissipation effect can be enhanced.
According to invention of Claim 8, if a base pin is provided with the hole which embeds a heat pipe, a heat pipe can be attached in a base and the heat dissipation effect can be heightened.
According to the ninth aspect of the present invention, if the base pin is divided and a hole for inserting a pin or a screw is formed in the center, the comb-shaped fin and the base can be fixed without using caulking or an adhesive. Can be produced.
According to the invention described in claim 10, if the base pin has a bent shape, the degree of freedom of the shape of the comb heat sink is improved, and the heat sink can be efficiently arranged even in a narrow space and a limited space. .
According to the eleventh aspect of the present invention, since the control device includes the electronic device cooling device according to the first aspect, it is possible to realize a control device that can flexibly cope with necessary cooling specifications.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic device cooling apparatus showing a first embodiment of the present invention.
In the figure, reference numeral 1 denotes a comb-shaped heat sink, which is composed of a plurality of comb-shaped fins 10 and base pins 20 that fix and thermally connect the comb-shaped fins 10. Reference numeral 3 denotes a mounting base to which the heat generating element 4 to be cooled is attached and which fixes the comb heat sink 1. The electronic device cooling apparatus is composed of the comb heat sink 1 and the base 3.
Reference numeral 11 denotes a cylindrical base portion formed on the comb-shaped fin 10, and 12 denotes a radial fin portion having a constant pitch extending radially from the base portion 11.

  The present invention is different from the prior art in that a comb-shaped heat sink includes a cylindrical base portion 11, comb-shaped fins 10 formed with radial fin portions 12 having an equal pitch extending radially from the base portion, and the base portion 11. It is the point provided with the column-shaped base pin 20 which fits a cylindrical hole and stacks the comb-shaped fins 10 and thermally connects them.

Next, a method of connecting the comb fins to the base pins in this embodiment will be described.
FIG. 2 is a top view of the comb fin, and FIG. 3 is a top view of the base pin.
As shown in the figure, the base portion 11 of the comb-shaped fin 10 is formed with two convex portions 14 at positions facing 180 degrees, and the base pin 20 has two pairs of concave portions 15 formed at positions facing 180 degrees ( 15a and 15b) are formed.
FIG. 4 is an exploded perspective view of the electronic device cooling apparatus in the present embodiment.
As shown in the figure, the comb-shaped fins 10 are stacked so that the convex portions 14 of the base portion 11 are alternately fitted into the two sets of concave portions 15 a and 15 b of the base pin 20.
FIG. 5 is a top view of the electronic device cooling apparatus in this embodiment. As shown in the figure, adjacent comb fins are stacked on the base pin so that the positions of the fin portions 12 in the pitch direction are shifted from each other by 1/2 pitch. It is done.

As described above, according to the present embodiment, the comb heat sink includes the comb fins and the base pins that are stacked and thermally connected to each other. You can change the number. Therefore, a cooling device that does not require processing to the base side can be realized depending on the size of the device and the number of cooling fins arranged.
In addition, since the comb fins are fitted with the base pins while being alternately shifted by 1/2 pitch, the air can be efficiently sent to the comb fins without interrupting the air flow, and the heat dissipation effect is enhanced. Can do.

FIG. 6 is a perspective view of an electronic device cooling apparatus showing a second embodiment of the present invention.
In the figure, 12a is a radial fin, 12b is a plurality of arc-shaped fins extending in a circumferential direction from a predetermined position of the radial fin 12a, and the arc-shaped fins formed on adjacent radial fins are mutually connected. It is formed so as to enter the gap between the arc-shaped fins.
This embodiment is different from the first embodiment in that a plurality of arc-shaped fins extending in a circumferential direction from a predetermined radial position are provided on a comb-shaped fin.
Since the method of connecting the comb fins to the base pins is the same as that of the first embodiment, the description thereof is omitted.

FIG. 7 is a top view of the comb fin for explaining the air flow of the electronic device cooling apparatus in the present embodiment. FIG. 8 is a partially enlarged view of the comb-shaped fin.
The arc length of the arc-shaped fins 12b extending from the radial fins 12a is made shorter than the pitch between the adjacent radial fins so that a gap 12c is formed between the adjacent radial fins. As shown, the air flow is not blocked, and efficient cooling can be achieved. FIG. 9 is a perspective view showing a configuration when the cooling fan 5 is provided in the present embodiment.

  As described above, in this embodiment, the comb fin includes a radial fin and a plurality of arc-shaped fins extending in a circumferential direction from a predetermined position of the radial fin, so that the surface area of the heat sink itself is increased. Improve heat dissipation effect. Further, since the gap is formed between the radial fins adjacent to the ends of the arc-shaped fins, the air flow from the inner arc-shaped fins to the outer arc-shaped fins is blocked. Furthermore, more efficient cooling can be performed.

FIG. 10 is an exploded perspective view of the electronic device cooling apparatus according to the third embodiment of the present invention.
In the figure, 6 is a heat pipe, and 6a is a hole for embedding the heat pipe 6 formed in the center of the base pin 20.
This embodiment differs from the first embodiment in that a hole 6 a is formed in the center of the base pin 20 and a heat pipe 6 is provided.

  As described above, in this embodiment, since the heat pipe is inserted with the hole formed in the center of the base pin, the temperature of the comb fin can be lowered and the heat radiation effect can be improved.

FIG. 11 is a perspective view of an electronic device cooling apparatus showing a fourth embodiment of the present invention.
In the figure, reference numeral 21 denotes a base pin, which is divided into two in the vertical direction, left and right, and has a semicircular cutout 22 in the center. As a result, a space 23 is formed in the central portion of the base pin.

FIG. 12 is an exploded perspective view of the electronic device cooling apparatus showing a method of fixing the comb fins. FIG. 12A shows a case where the pins 221 are press-fitted to fix the base pins and the comb fins, and FIG. The case where a base pin and a comb-shaped fin are fixed using 231 is shown.
In FIG. 12A, after the base pin 21 is inserted into the comb fin 10, the pin 231 is press-fitted into the space portion 23 to fix the comb fin 10 to the base pin 21. In FIG. 12B, a tap is formed in the notch 23, and the comb fin is fixed to the base pin using a screw 232.

  In this way, in this embodiment, the pin 231 is press-fitted into the divided base pin 21 or the comb-shaped fin 10 is fixed to the base pin 21 by attaching the screw 232. Therefore, as shown in the first embodiment Since the base pin does not have to be directly fitted and fixed in the cylindrical hole of the base portion of the comb-shaped fin, the manufacture is simplified.

FIG. 13 is a perspective view of an electronic device cooling apparatus showing a fifth embodiment of the present invention.
In the figure, reference numeral 24 denotes a base pin, which has a bent shape. 1A is a comb heat sink using a base pin having a bent shape.
This embodiment is different from the first embodiment in that the base pin has a bent shape.

14 is a perspective view when the electronic device cooling device in the present embodiment is applied to the inverter device.
In the figure, reference numeral 71 denotes a mounting board of an inverter device which is an electronic device. The heating element 4 is mounted on the mounting substrate 71 and cooled by a comb heat sink 1A using a base pin having a bent shape. Reference numeral 72 denotes a case for accommodating a power unit (not shown) and the mounting board 71 of the inverter device, and 73 is a cover. In the inverter device, when the heating element 4 is mounted on the mounting board 71 and cooled, the arrangement of the comb fins is limited by the case or the mounting parts of the mounting board 71. However, in this embodiment, the comb-shaped fins can be efficiently arranged even in a limited space by giving the base pin 24 a bent shape.

  It can be used as a cooling device with a high heat dissipation effect and a limited space, and can be used not only for an inverter device and a servo device but also for an electronic device having a substrate on which a heat generating component is mounted.

The perspective view of the electronic device cooling device which shows 1st Example of this invention. The top view of the comb-shaped fin in a present Example. The top view of the base pin in a present Example. The disassembled perspective view of the electronic device cooling device in a present Example. The top view of the electronic device cooling device in a present Example. The perspective view of the electronic device cooling device which shows 2nd Example of this invention. The top view for demonstrating the flow of the air of the electronic device cooling device in 2nd Example. The partial enlarged view of a comb fin. The perspective view which shows a structure when a cooling fan is provided. The disassembled perspective view of the electronic device cooling device which shows 3rd Example of this invention. The perspective view of the electronic device cooling device which shows 4th Example of this invention. An exploded perspective view of an electronic device cooling device showing a method of fixing a comb-shaped fin The perspective view of the electronic device cooling device which shows 5th Example of this invention. The perspective view at the time of applying the electronic device cooling device in a present Example to an inverter apparatus. The perspective view which shows the structure of the conventional comb-type heat sink. The perspective view of the base of the conventional comb-type heat sink.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A Comb-shaped heat sink 10 Comb-shaped fin 11 Base part 12 Fin part 12a Radial fin 12b Arc-shaped fin 13 Rotation restricting part 14 Convex part 15, Concave part 20, 21, 24 Base pin 3 Mounting base 4 Heating element 5 Cooling fan 6 heat pipe

Claims (11)

In a cooling device comprising a mounting base for mounting a heating element and a comb heat sink that is thermally connected to the mounting base and cools the heating element,
The comb-shaped heat sink is formed by fitting a comb-shaped fin including a cylindrical base portion, a radial fin portion having a constant pitch extending radially from the base portion, and a cylindrical hole of the base portion, and stacking the comb-shaped fins. And a columnar base pin that is thermally connected to each other.   2. The electronic device cooling apparatus according to claim 1, wherein the comb-shaped fins are stacked on the base pin in a state where the radial fin portions are alternately displaced by 1/2 pitch in the pitch direction. .   The electronic device cooling device according to claim 1, wherein the base portion and the base pin are formed with a rotation restricting portion for fixing the comb-shaped fin at a position in a predetermined pitch direction.   The electronic device cooling device according to claim 3, wherein the rotation restricting portion is a convex portion or a concave portion formed in the cylindrical base portion and the columnar base pin.   4. The electronic device cooling apparatus according to claim 3, wherein the rotation restricting portion is a flat portion formed on the cylindrical base portion and the columnar base pin. ,
4. The electronic device cooling apparatus according to claim 3, wherein the rotation restricting portion is configured by forming a regular N-square hole in the base portion, and forming the base pin into a regular N-square column.   The comb-shaped fin includes a radial fin and a plurality of arc-shaped fins extending in a circumferential direction from a predetermined position of the radial fin, and there is a gap between the end of the arc-shaped fin and the adjacent radial fin. The electronic device cooling apparatus according to claim 1, wherein the electronic apparatus cooling apparatus is formed so as to be able to perform.   The electronic device cooling apparatus according to claim 1, wherein the base pin has a hole for embedding a heat pipe.   The base pin is divided in a columnar vertical direction, and a space portion into which a pin or a screw is inserted is formed at the divided center, and the base pin is inserted into the space portion by inserting a pin or a screw. The electronic device cooling device according to claim 1, wherein the electronic device is pressed against a base portion of the comb-shaped fin.   The electronic device cooling apparatus according to claim 1, wherein the base pin has a bent shape.   A control device comprising the electronic device cooling device according to claim 1.

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