JP2009283195A - Connector terminal holding member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector terminal holding member increasing the accuracy of positioning of a connector terminal on a circuit board. <P>SOLUTION: The holding member includes an abutment part 26 extending in an axial direction of the connector terminal 23 to abut on the connector terminal 23, a flange part 27 protruding from one end edge of the abutment part 26 orthogonal to the axial direction of the connector terminal 23, a first through-hole 28 formed through the flange part 27 in the axial direction of the connector terminal 23 to insert the connector terminal 23 through it, and a pin 30 formed on the other end edge of the abutment part 26 to be attached to the circuit board 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connector terminal holding member connected to a circuit structure including a circuit board by wire bonding.

2. Description of the Related Art Conventionally, a configuration described in Patent Document 1 is known as a configuration in which a circuit structure including a circuit board and a connector terminal connectable to a mating connector terminal are connected by wire bonding via a metal wire. . The circuit board has a conductive path on the surface, a plurality of connector terminals that are connected to the conductive path of the circuit board via a metal wire and can be connected to an external connector terminal, and a case. And a connector housing that accommodates the plurality of connector terminals.
JP 2001-143824 A

  According to said structure, the several connector terminal is positioned by accommodating in the connector housing attached to the case. The circuit board is assembled to the case. For this reason, the positioning error between the conductive path of the circuit board and the connector terminal is the sum of the assembly tolerance of the circuit board to the case and the assembly tolerance of the connector housing to the case. As a result, there is a problem that a positioning error between the conductive path of the circuit board and the connector terminal becomes relatively large.

  The present invention has been completed based on the above circumstances, and an object thereof is to provide a connector terminal holding member capable of improving the positioning accuracy between a circuit board and a connector terminal.

  The present invention is a holding member that holds a plurality of connector terminals that are connected to a circuit structure including a circuit board by wire bonding and that can be connected to a mating connector terminal in an arrayed state. An abutting portion that extends in a direction and abuts against the connector terminal; a flange portion that projects from the abutting portion in a direction intersecting the axial direction of the connector terminal; and the flange portion. And a first through hole through which the connector terminal is inserted, and an attachment portion that is provided in the contact portion and is attached to the circuit board.

  According to the present invention, it is possible to connect the circuit board and the connector terminal by wire bonding while maintaining the alignment of the plurality of connector terminals. Further, since the holding member is attached to the circuit board, the positioning accuracy between the circuit board and the connector terminal can be improved as compared with the case where the holding member is attached to another member.

The following configuration is preferable as an embodiment of the present invention.
The attachment portion may be a pin inserted through a second through hole formed in the circuit board.

  According to said structure, a holding member can be attached to a circuit board by inserting the pin of a holding member in the 2nd through-hole of a circuit board.

  The contact portion may be formed in a plurality of stages in a direction intersecting a plate surface of the circuit board in a state where the attachment portion is attached to the circuit board.

  According to said structure, a connector terminal can be distribute | arranged and arranged in multiple steps about the direction which cross | intersects the board surface of a circuit board.

  According to the present invention, the positioning accuracy between the conductive path of the circuit board and the connector terminal can be improved.

<Embodiment 1>
A first embodiment in which the present invention is applied to an electrical junction box 10 mounted on a vehicle (not shown) will be described with reference to FIGS. The electrical junction box 10 according to the present embodiment is configured by housing a circuit structure 12 in a case 11. The electrical junction box 10 is disposed between an in-vehicle power source (not shown) and an in-vehicle electrical component (not shown) such as a lamp and a horn, and is used to energize and disconnect the in-vehicle electrical component. Execute. In the following description, the upper side in FIG. 1 is the front side, the lower side is the back side, the right side in FIG. 1 is the upper side, the left side is the lower side, the right side in FIG. 6 is the right side, and the left side is the left side. Left side.

  As shown in FIG. 5, the circuit structure 12 includes a circuit board 13 including a circuit and an electronic component 14 mounted on the circuit board 13. Conductive paths are formed on both the front surface (upper surface in FIG. 5) and the back surface (lower surface in FIG. 5) of the circuit board 13 by a printed wiring technique. In the figure, detailed patterns of conductive paths are omitted. A plurality of electronic components 14 are mounted on the conductive paths formed on the front and back surfaces of the circuit board 13 by soldering.

  As shown in FIG. 6, the circuit board 13 has a slightly elongated rectangular shape in the left-right direction (left-right direction in FIG. 6). A plurality of bus bar connection lands 15 having a rectangular shape are formed on the surface of the circuit board 13 (the surface on the near side in the direction passing through the paper surface in FIG. 6) by a printed wiring technique. The bus bar connection land 15 is provided with a first bus bar 16 and a second bus bar 17. In FIG. 6, the first bus bar 16 is disposed on the left side, and the second bus bar 17 is disposed on the right side. The first bus bar 16 and the second bus bar 17 are soldered to the bus bar connection land 15.

  The first bus bar 16 is formed by pressing a metal plate material. The first bus bar 16 includes a portion extending in the left-right direction (left-right direction in FIG. 6) and a portion extending upward from the left end of the portion extending in the left-right direction. The drain terminals formed on the back surface of a plurality (four in the present embodiment) of the semiconductor relays 18 are soldered to portions extending in the left-right direction of the first bus bar 16.

  The second bus bar 17 includes a pair of portions that are formed side by side and that extend in the left-right direction (the left-right direction in FIG. 6), a portion that connects the pair of portions that extend in the left-right direction vertically, and a portion that extends in the left-right direction. And a portion extending upward from the right end portion of the one located on the upper side. A portion of the second bus bar 17 positioned on the upper side and extending in the left-right direction is arranged so as to be substantially aligned with a portion of the first bus bar 16 extending in the left-right direction in the left-right direction. The drain terminals of a plurality of (two in this embodiment) semiconductor relays 18 are soldered to the portion of the second bus bar 17 that is located on the upper side and extends in the left-right direction. A plurality of (four in the present embodiment) drain terminals of the semiconductor relays 18 are soldered to portions of the second bus bar 17 that are located on the lower side and extend in the left-right direction.

  A plurality (seven in this embodiment) of lead portions 19 are formed to protrude upward (upward in FIG. 6) from the upper edge of each semiconductor relay 18. In the present embodiment, the fourth from the right end of the lead portion 19 is a gate terminal, and is soldered to a conductive path formed on the circuit board 13.

  In the present embodiment, the third from the left end of the lead portions 19 of each semiconductor relay 18 is a source terminal. As shown in FIGS. 7 and 8, the source terminal of the semiconductor relay 18 is soldered to the left side in FIG. 8 of the surface (upper surface in FIG. 8) of the relay member 20 having a substantially rectangular shape made of a metal plate material. Has been. As shown in FIG. 8, the back surface (lower surface in FIG. 8) of the relay member 20 is soldered to a relay land 21 formed on the surface (upper surface in FIG. 8) of the circuit board 13 by a printed wiring technique.

  In addition, one end of the metal wire 22 is connected to the right portion in FIG. 8 of the surface of the relay member 20 (upper surface in FIG. 8) by known wire bonding.

  As shown in FIG. 6, the other end of the metal wire 22 is connected to a plurality of connector terminals 23 arranged side by side in the left-right direction on the upper edge of the circuit board 13 by known wire bonding. The connector terminal 23 is formed by pressing a metal plate material. Each connector terminal 23 has a substantially rectangular shape elongated in the vertical direction (vertical direction in FIG. 6). The lower end portion of the connector terminal 23 is a connection portion 24 connected to the metal wire 22.

  Among the connector terminals 23, the connector terminal 23 located at the left end in FIG. 6 is connected to the upper end of the first bus bar 16 by a plurality (four in this embodiment) of metal wires 22. Moreover, the connector terminal 23 located in the right end part in FIG. 6 among the connector terminals 23 is connected to the upper end part of the second bus bar 17 by a plurality (three in this embodiment) of metal wires 22.

  Among the connector terminals 23, the connector terminal 23 positioned second from the left end in FIG. 6 is connected to a total of four metal wires 22 extending from the two relay members 20. Each connector terminal 23 located near the center in the left-right direction is connected to two metal wires 22 extending from each relay member 20.

  As shown in FIG. 5, the connector terminal 23 is held by a holding member 25 attached to the upper end portion of the circuit board 13. The holding member 25 is made of a synthetic resin material. The holding member 25 includes a contact portion 26 that extends in the axial direction of the connector terminal 23 (left and right direction in FIG. 5) and contacts the connector terminal 23 from the front and back direction (up and down direction in FIG. 5). The contact portions 26 are formed in a plurality of stages (two stages in this embodiment) in a direction intersecting the plate surface of the circuit board 13 (up and down direction in FIG. 5).

  A flange portion 27 is formed at the upper end edge (right end edge in FIG. 5) of the contact portion 26 so as to protrude in a direction intersecting with the axial direction of the connector terminal 23 (vertical direction in FIG. 5). A first through hole 28 is formed in the flange portion 27 so as to penetrate in a direction along the plate surface of the circuit board 13. Specifically, the first through hole 28 is formed so as to penetrate in the axial direction of the connector terminal 23 (left and right direction in FIG. 5). The connector terminals 23 are inserted into the first through holes 28, respectively. Accordingly, the connector terminals 23 are held by the holding member 25 in an arrayed state.

  As shown in FIG. 6, a plurality of (four in this embodiment) leg portions 29 that hang downward (downward in FIG. 6) are formed from the lower end edge (lower end edge in FIG. 6) of the contact portion 26. ing. As shown in FIG. 5, a pin 30 (corresponding to an attachment portion) 30 is formed from the leg portion 29 so as to protrude to the back surface side (downward in FIG. 5). The cross-sectional shape of the pin 30 is circular. The holding member 25 is attached to the circuit board 13 by inserting the pin 30 into a second through hole 31 having a circular cross section formed at a position corresponding to the pin 30 in the circuit board 13. It has been.

  As shown in FIG. 5, of the connector terminals 23 arranged in two stages in the direction intersecting the plate surface of the circuit board 13, the length dimension of the connector terminal 23 located on the side closer to the circuit board 13 is from the circuit board 13. It is set longer than the connector terminal 23 at a distant position. As a result, the connection portion 24 of the connector terminal 23 located on the side closer to the circuit board 13 while being held by the holding member 25 is connected to the connection portion 24 of the connector terminal 23 located away from the circuit board 13. , And shifted in the direction intersecting the plate surface of the circuit board 13 (vertical direction in FIG. 5). Specifically, the connection portion 24 of the connector terminal 23 located on the side close to the circuit board 13 while being held by the holding member 25 protrudes in the axial direction of the connector terminal 23 (specifically, the left side in FIG. 5). The position is shifted.

  As shown in FIG. 6, the plurality of semiconductor relays 18 are arranged side by side in a direction away from the holding member 25 attached to the upper end portion of the circuit board 13. Specifically, it is arranged in two rows below the holding member 25 (downward in FIG. 6). As shown in FIG. 5, the relay member 20 connected to the lead portion 19 of the semiconductor relay 18 arranged on the upper side (right side in FIG. 5) is arranged in the connector terminal 23 at a position close to the circuit board 13. The connection part 24 of the connector terminal 23 is connected by the metal wire 22.

  Further, the relay member 20 connected to the lead portion 19 of the semiconductor relay 18 arranged on the lower side (left side in FIG. 5) is a connector terminal 23 arranged at a position away from the circuit board 13 among the connector terminals 23. Are connected to each other by a metal wire 22 disposed across the semiconductor relay 18 located on the upper side of the semiconductor relay 18.

  The circuit structure 12 is covered with a synthetic resin portion 32 formed by molding the circuit structure 12. A metal wire 22 is embedded in the synthetic resin portion 32. Further, the semiconductor relay 18, the first bus bar 16, and the second bus bar 17 are also embedded in the synthetic resin portion 32.

  The case 11 is molded on the outside of the synthetic resin portion 32. As shown in FIG. 5, the outer surface of the synthetic resin portion 32 and the inner surface of the case 11 are in close contact. The synthetic resin portion 32 is formed of a material having a smaller elastic modulus than the synthetic resin material forming the case 11.

  As shown in FIG. 5, at the upper end of the case 11 (right end in FIG. 5), there is a connector housing 33 that opens upward (to the right in FIG. 5) and can be fitted with a mating connector (not shown). It is formed integrally with the case 11. Inside the connector housing 33, the connector terminals 23 are accommodated through the inner wall of the connector housing 33. The connector terminal 23 can be connected to a mating connector terminal 23 (not shown) accommodated in the mating connector. The holding member 25 is embedded in the inner wall of the connector housing 33.

  Then, an example of the manufacturing process of this embodiment is demonstrated. As shown in FIG. 1, conductive paths, bus bar connection lands 15, and relay lands 21 are formed on both front and back surfaces of the circuit board 13 by a printed wiring technique. An electronic component 14 is mounted on the conductive path formed on the back surface (the lower surface in FIG. 1) of the circuit board 13 by, for example, reflow soldering.

  Subsequently, the electronic component 14 is placed on a conductive path formed on the surface of the circuit board 13 (upper surface in FIG. 1). In addition, the first bus bar 16 and the second bus bar 17 are placed on the bus bar connection land 15 formed on the surface of the circuit board 13, and the relay member 20 is placed on the relay land 21. Subsequently, the electronic component 14, the first bus bar 16, the second bus bar 17, and the relay member 20 are soldered to the conductive path and each land, for example, by reflow soldering.

  Subsequently, the drain terminal of the semiconductor relay 18 is placed on the surface of the first bus bar 16 and the second bus bar 17 (upper surface in FIG. 1), and the source terminal of the semiconductor relay 18 is placed on the surface of the relay member 20. The gate terminal of the semiconductor relay 18 is placed on the conductive path of the substrate 13. Subsequently, each terminal of the semiconductor relay 18 is soldered to the first bus bar 16, the second bus bar 17, the relay member 20, and the conductive path by, for example, reflow soldering.

  Subsequently, the connector terminal 23 is inserted into the first through hole 28 of the holding member 25. Thereafter, the pin 30 of the holding member 25 into which the connector terminal 23 is inserted is inserted into the second through hole 31 formed in the circuit board 13 from the front surface side (upper side in FIG. 2) of the circuit board 13.

  Subsequently, as illustrated in FIG. 3, the relay member 20 disposed on the circuit board 13 and the connection portion 24 of the connector terminal 23 are connected by a metal wire 22 by wire bonding. A known method can be used for wire bonding, and ball bonding, wire bonding, or the like can be used. As the metal wire 22, any metal can be used as necessary, and for example, an aluminum wire, a gold wire, or the like can be used. In the in-vehicle electrical junction box 10 as in the present embodiment, a relatively large current flows, so an aluminum wire is preferable.

  Specifically, first, one end of the metal wire 22 is connected to the relay member 20 located on the upper side (right side in FIG. 3) by wire bonding. Subsequently, the other end portion of the metal wire 22 is connected to the connection portion 24 of the connector terminal 23 arranged at a position close to the circuit board 13 (lower side in FIG. 3) in the holding member 25 by wire bonding.

  Subsequently, one end of the metal wire 22 is connected to the relay member 20 located on the lower side (left side in FIG. 3) by wire bonding. Subsequently, the metal wire 22 is arranged so as to straddle the semiconductor relay 18 in the front side direction (upward in FIG. 3), and the other end is located away from the circuit board 13 in the holding member 25 (in FIG. 3). It connects with the connection part 24 of the connector terminal 23 distribute | arranged to the upper side by wire bonding.

  Further, as shown in FIG. 6, in the same manner as described above, the connection portion 24 of the connector terminal 23 is connected to the first bus bar 16 and the second bus bar 17 by a metal wire 22 by wire bonding.

  Subsequently, as shown in FIG. 4, the synthetic resin portion 32 is formed by molding the circuit component 12. The circuit structure 12 is almost buried by the synthetic resin portion 32. In the circuit component 12, the upper end portion of the connector terminal 23 and the upper end portion of the holding member 25 protrude from the upper end of the synthetic resin portion 32.

  Subsequently, as shown in FIG. 5, the case 11 is formed by further molding the circuit structure 12 on which the synthetic resin portion 32 is formed. A connector housing 33 is formed integrally with the upper end of the case 11. A connector terminal 23 is disposed in the connector housing 33. Thereby, the electrical junction box 10 is completed.

  Then, the effect | action and effect of this embodiment are demonstrated. According to this embodiment, the circuit board 13 and the connector terminal 23 can be connected to each other by wire bonding while maintaining the alignment of the plurality of connector terminals 23. Further, since the holding member 25 is attached to the circuit board 13, the positioning between the circuit board 13 and the connector terminal 23 is larger than when the holding member 25 is attached to a member other than the circuit board 13 such as the case 11. Accuracy can be improved.

  Further, according to the present embodiment, the holding member 25 can be attached to the circuit board 13 by inserting the pin 30 formed in the holding member 25 into the second through hole 31 of the circuit board 13.

  Further, according to the present embodiment, the abutting portion 26 is configured so that the pin 30 is inserted into the second through hole 31 of the circuit board 13 and the holding member 25 is attached to the circuit board 13. It is formed in two steps in the direction intersecting the plate surface. Thus, in the present embodiment, the connector terminals 23 can be arranged in two stages in the direction intersecting the plate surface of the circuit board 13.

<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 15, the circuit board 13 has a slightly elongated rectangular shape in the left-right direction (left-right direction in FIG. 15). A plurality of bus bar connection lands 55 having a substantially circular shape are formed on the surface of the circuit board 13 (the surface on the near side in the direction passing through the paper in FIG. 15) by a printed wiring technique. A third bus bar 56 is soldered to the bus bar connection land 55. The semiconductor relays 58 are arranged on the surface of the third bus bar 56 in two stages in the vertical direction (vertical direction in FIG. 15) and five in the horizontal direction.

  The third bus bar 56 is formed by pressing a metal plate material, and has a substantially rectangular shape elongated in the left-right direction. Drain terminals formed on the back surface of a plurality (ten in this embodiment) of semiconductor relays 58 are soldered to the surface of the third bus bar 56. The semiconductor relay 58 is a semiconductor chip and is a so-called bare chip.

  Two lead portions 59 having different sizes are formed on the surface of each semiconductor relay 58 (the surface on the near side in the direction passing through the paper surface in FIG. 15). The smaller lead portion 59 is a gate terminal, and the larger lead portion 59 is a source terminal.

  One end of the metal wire 22 is connected to the gate terminal of the semiconductor relay 58 by known wire bonding. The other end of the metal wire 22 is connected to the relay member 60 by wire bonding. The relay member 60 is soldered to a conductive path formed on the surface of the circuit board 13 (the surface on the near side in the direction passing through the paper surface in FIG. 15). Above the third bus bar 56, five relay members 60 are disposed at positions corresponding to the semiconductor relays 58, and below the third bus bar 56, five relay members 60 are positioned at positions corresponding to the semiconductor relays 58. A relay member 60 is provided.

  One end of a plurality of (two in this embodiment) metal wires 22 is connected to the source terminal of each semiconductor relay 58 by known wire bonding.

  A plurality of connector terminals 23 are arranged on the upper edge of the circuit board 13 in the left-right direction. Of the connector terminals 23, a plurality (five in the present embodiment) of connector terminals 23 disposed at positions near the left end in FIG. 13 have lower ends (lower ends in FIG. 15) on the back side (in FIG. 15). It is bent toward the back side in the direction penetrating the paper surface, and is connected to the conductive path of the circuit board 13 by, for example, soldering or the like while penetrating the circuit board 13 (see FIG. 10).

  Among the connector terminals 23, a plurality (five in this embodiment) of connector terminals 23 arranged near the center in the left-right direction in FIG. 13 are held by the holding member 25. As shown in FIG. 15, a plurality (two in this embodiment) of leg portions 29 that hang downward (downward in FIG. 15) are formed from the lower end edge (lower end edge in FIG. 15) of the contact portion 26. ing. As shown in FIG. 14, a pin 30 (corresponding to an attachment portion) 30 is formed from the leg portion 29 so as to protrude to the back surface side (downward in FIG. 14). The cross-sectional shape of the pin 30 is circular. The holding member 25 is attached to the circuit board 13 by inserting the pin 30 into a second through hole 31 having a circular cross section formed at a position corresponding to the pin 30 in the circuit board 13. It has been.

  A metal wire 22 connected to the source terminal of the semiconductor relay 58 is connected to the connection portion 24 of the connector terminal 23 held by the holding member 25 by known wire bonding.

  Among the connector terminals 23, a plurality (three in this embodiment) of metal wires 22 are connected to the lower end portion (lower end portion in FIG. 15) of the connector terminal 23 located at the right end portion in FIG. 13 by known wire bonding. Has been. The other end of the metal wire 22 is connected to the right end of the upper end edge of the third bus bar 56 by known wire bonding. The connector terminal 23 located at the right end is connected to an in-vehicle power source via a wire harness (not shown).

  As shown in FIG. 15, the plurality of semiconductor relays 18 are arranged side by side with an interval in a direction away from the holding member 25 attached to the upper end portion of the circuit board 13. Specifically, it is arranged in two rows from below the holding member 25 (downward in FIG. 15). As shown in FIG. 14, the source terminal of the lead portion 59 of the semiconductor relay 58 arranged on the upper side (right side in FIG. 14) is the connector terminal 23 arranged near the circuit board 13 in the connector terminal 23. Are connected to each other by a metal wire 22 (see FIG. 14).

  The source terminal of the lead part 59 of the semiconductor relay 18 arranged on the lower side (left side in FIG. 14) is the connection part of the connector terminal 23 arranged at a position away from the circuit board 13 in the connector terminal 23. 24 and the metal wire 22 arranged across the semiconductor relay 58 located on the upper side of the semiconductor relay 58 (see FIG. 5).

  The connector terminal 23 located at the right end in FIG. 13 is not held by the holding member 25, but is held on the back wall of the connector housing 33 with the case 11 molded as shown in FIG. It has become so.

  Since the configuration other than the above is substantially the same as that of the first embodiment, the same members are denoted by the same reference numerals, and redundant description is omitted.

  Then, an example of the manufacturing process of this embodiment is demonstrated. As shown in FIG. 9, conductive paths and bus bar connection lands 55 are formed on the front and back surfaces of the circuit board 13 by a printed wiring technique. On the conductive path formed on the back surface (the lower surface in FIG. 9) of the circuit board 13, the electronic component 14 is mounted by, for example, reflow soldering.

  Subsequently, the electronic component 14 is placed on a conductive path formed on the surface of the circuit board 13 (upper surface in FIG. 9). In addition, the third bus bar 56 is placed on the bus bar connection land 55 formed on the surface of the circuit board 13, and the relay member 60 is placed on the conductive path. Subsequently, the electronic component 14, the third bus bar 56, and the relay member 60 are soldered to the conductive path and each land, for example, by reflow soldering.

  Subsequently, the drain terminal of the semiconductor relay 58 is placed on the surface of the third bus bar 56 (upper surface in FIG. 9). Subsequently, the drain terminal of the semiconductor relay 58 is soldered to the third bus bar 56 by, for example, reflow soldering.

  Subsequently, as shown in FIG. 10, after the connector terminal 23 is bent at a substantially right angle, one end portion is passed through the circuit board 13, and reflow soldering is performed on the conductive path formed in the circuit board 13, for example. Connect with.

  Subsequently, the connector terminal 23 is inserted into the first through hole 28 of the holding member 25. Thereafter, the pin 30 of the holding member 25 into which the connector terminal 23 has been inserted is inserted into the second through hole 31 formed in the circuit board 13 from the surface side of the circuit board 13 (upper side in FIG. 11).

  Then, as shown in FIG. 12, the gate terminal (lead part 59) of the semiconductor relay 58 and the relay member 60 are connected by the metal wire 22 by wire bonding. Further, the connector terminal 23 at the right end in FIG. 15 and the third bus bar 56 are connected by the metal wire 22 by wire bonding. A known method can be used for wire bonding, and ball bonding, wire bonding, or the like can be used. As the metal wire 22, any metal can be used as necessary, and for example, an aluminum wire, a gold wire, or the like can be used. In the in-vehicle electrical junction box 10 as in the present embodiment, a relatively large current flows, so an aluminum wire is preferable.

  Subsequently, the source terminal (lead portion 59) of the semiconductor relay 58 and the connection portion 24 of the connector terminal 23 held by the holding member 25 are connected by the metal wire 22 by wire bonding.

  Specifically, first, one end of the metal wire 22 is connected to the source terminal (lead portion 59) of the semiconductor relay 58 located on the upper side (right side in FIG. 12) by wire bonding. Subsequently, the other end portion of the metal wire 22 is connected to a connection portion 24 of the connector terminal 23 arranged at a position close to the circuit board 13 (lower side in FIG. 12) in the holding member 25 by wire bonding.

  Subsequently, one end of the metal wire 22 is connected to the source terminal (lead portion 59) of the semiconductor relay 58 located on the lower side (left side in FIG. 12) by wire bonding. Subsequently, the metal wire 22 is arranged so as to straddle the semiconductor relay 58 in the front side direction (upward in FIG. 12), and the other end is positioned away from the circuit board 13 in the holding member 25 (in FIG. 12). It connects with the connection part 24 of the connector terminal 23 distribute | arranged to the upper side by wire bonding.

  Subsequently, as shown in FIG. 13, the synthetic resin portion 32 is formed by molding the circuit component 12. The circuit structure 12 is almost buried by the synthetic resin portion 32. In the circuit component 12, the upper end portion of the connector terminal 23 and the upper end portion of the holding member 25 protrude from the upper end of the synthetic resin portion 32.

  Subsequently, as illustrated in FIG. 14, the case 11 is formed by further molding the circuit configuration body 12 in which the synthetic resin portion 32 is formed. A connector housing 33 is formed integrally with the upper end of the case 11. A connector terminal 23 is disposed in the connector housing 33. Thereby, the electrical junction box 10 is completed.

  Then, the effect | action and effect of this embodiment are demonstrated. In the present embodiment, a bare chip is used as the semiconductor relay 58. Thereby, compared with the case where a discrete component is used, the circuit structure 12 can be reduced in size as a whole.

  Moreover, according to this embodiment, the semiconductor relay 58 mounted on the circuit board 13 and the connector terminal 23 can be connected by wire bonding.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the present embodiment, the attachment portion is the pin 30, but is not limited thereto, and may be an insertion hole through which a bolt for bolting the circuit board 13 can be inserted, or formed in the circuit board 13. An engaging claw that elastically engages with the formed through-hole may be used, and any configuration may be adopted as necessary.
(2) In the present embodiment, the connector terminal 23 is arranged in two stages on the holding member 25. However, the connector terminal 23 may be arranged in one stage, or arranged in a plurality of stages of three or more stages. It may be.
(3) In this embodiment, the cross-sectional shape of the pin 30 has a circular shape, but is not limited thereto, and may be an oval shape or an elliptical shape, or may be a polygonal shape such as a triangular shape or a rectangular shape, It can be made into arbitrary shapes as needed.

Side sectional view which shows the manufacturing process of the electrical junction box which concerns on Embodiment 1 of this invention Cross-sectional side view showing the electrical junction box manufacturing process Side sectional view showing the circuit structure Side sectional view showing a state where a synthetic resin portion is formed on a circuit structure Side sectional view showing the electrical junction box Front view showing the circuit structure The principal part enlarged front view which shows the connection structure of a semiconductor relay and a relay member Main part enlarged side sectional view showing a connection structure between a semiconductor relay and a relay member Side sectional view which shows the manufacturing process of the electrical junction box which concerns on Embodiment 4 of this invention. Cross-sectional side view showing the electrical junction box manufacturing process Cross-sectional side view showing the electrical junction box manufacturing process Side sectional view showing the circuit structure Side sectional view showing a state where a synthetic resin portion is formed on a circuit structure Side sectional view showing the electrical junction box Front view showing the circuit structure

Explanation of symbols

DESCRIPTION OF SYMBOLS 12 ... Circuit structure 13 ... Circuit board 23 ... Connector terminal 25 ... Holding member 26 ... Contact part 27 ... Flange part 28 ... 1st through-hole 30 ... Pin (attachment part)
31 ... second through hole

Claims (3)

A holding member that is connected to a circuit structure including a circuit board by wire bonding and holds a plurality of connector terminals that can be connected to a mating connector terminal,
A contact portion that extends in the axial direction of the connector terminal and contacts the connector terminal; a flange portion that protrudes from the contact portion in a direction intersecting the axial direction of the connector terminal; and the flange A first through-hole through which the connector terminal is inserted and an attachment portion that is provided in the contact portion and is attached to the circuit board. A connector terminal holding member. 2. The connector terminal holding member according to claim 1, wherein the attachment portion is a pin inserted into a second through hole formed in the circuit board. 3. The contact portion according to claim 1, wherein the contact portion is formed in a plurality of stages in a direction intersecting a plate surface of the circuit board in a state where the attachment portion is attached to the circuit board. Connector terminal holding member.

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