[go: up one dir, main page]

JP2009283182A - Electrical connector - Google Patents

Electrical connector Download PDF

Info

Publication number
JP2009283182A
JP2009283182A JP2008131892A JP2008131892A JP2009283182A JP 2009283182 A JP2009283182 A JP 2009283182A JP 2008131892 A JP2008131892 A JP 2008131892A JP 2008131892 A JP2008131892 A JP 2008131892A JP 2009283182 A JP2009283182 A JP 2009283182A
Authority
JP
Japan
Prior art keywords
electrical connector
dielectric
conductive elastic
frame
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008131892A
Other languages
Japanese (ja)
Other versions
JP5236354B2 (en
Inventor
Toshihiro Niitsu
俊博 新津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Priority to JP2008131892A priority Critical patent/JP5236354B2/en
Priority to PCT/US2009/044688 priority patent/WO2009143252A1/en
Publication of JP2009283182A publication Critical patent/JP2009283182A/en
Application granted granted Critical
Publication of JP5236354B2 publication Critical patent/JP5236354B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515Connection to a rigid planar substrate, e.g. printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7082Coupling device supported only by cooperation with PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/52Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted in or to a panel or structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7005Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011Locking or fixing a connector to a PCB
    • H01R12/7047Locking or fixing a connector to a PCB with a fastener through a screw hole in the coupling device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To suppress changes in the relative position of each conductor part in an electrical connector disposed between a pair of electronic apparatus. <P>SOLUTION: This electrical connector 1 is disposed between a pair of circuit boards to electrically connect them. The electrical connector 1 is equipped with a plurality of conductive elastic bodies 50 each of which has an elastic dielectric 51, a center conductor part 54 formed in the dielectric 51 in its thickness direction to electrically connect the front side of the dielectric 51 to its back side, and an outside conductor part 53 formed to surround the center conductor part 54 in the dielectric 51 while electrically connecting the front side of the dielectric 51 to its back side. A plurality of the conductive elastic bodies 50 are held by a frame 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

一対の電子機器の間に配置され、それらを接続する電気コネクタに関する。   The present invention relates to an electrical connector that is disposed between a pair of electronic devices and connects them.

従来、回路基板などの2つの電子機器の間に配置され、それらに設けられた導体部に挟まれることによって、当該2つの電子機器を電気的に接続する電気コネクタがある。特許文献1には、このような電気コネクタの一種として、半導体ウエハの検査装置に設けられるプローブカードと、検査用基板(特許文献1ではパフォーマンスボード)との間に配置されるシート状のコネクタが開示されている。この電気コネクタは、ゴム状の弾性体であるエラストマーを備え、当該エラストマーの中に厚さ方向に導体部が形成されている。また、この電気コネクタでは、伝送線路のインピーダンス整合を図るために、各導体部は、中心導体部と当該中心導体部を囲む外側導体部とを有する同軸構造となっている。
実開平5−55553号公報
2. Description of the Related Art Conventionally, there is an electrical connector that is disposed between two electronic devices such as a circuit board and is electrically connected to the two electronic devices by being sandwiched between conductor portions provided on them. Patent Document 1 discloses, as one type of such an electrical connector, a sheet-like connector disposed between a probe card provided in a semiconductor wafer inspection apparatus and an inspection substrate (performance board in Patent Document 1). It is disclosed. This electrical connector includes an elastomer which is a rubber-like elastic body, and a conductor portion is formed in the elastomer in the thickness direction. Further, in this electrical connector, in order to achieve impedance matching of the transmission line, each conductor portion has a coaxial structure having a center conductor portion and an outer conductor portion surrounding the center conductor portion.
Japanese Utility Model Publication No. 5-55553

しかしながら、上記特許文献1に開示される電気コネクタでは、多くの導体部が1つの弾性体内に形成されているため、各導体部の位置が、電子機器の端子に対応した正規の位置からずれ易いという問題があった。つまり、多くの導体部を1つの弾性体内に形成するためには、弾性体の面積を大きくする必要がある。しかしながら、大きい弾性体が熱や外力によって伸張した時には、小さい弾性体に比し、大きさの変化が著しい。そのため、弾性体内に形成された導体部の相対位置も変化し易く、各導体部は正規の位置からずれ易い。   However, in the electrical connector disclosed in Patent Document 1, since many conductor parts are formed in one elastic body, the position of each conductor part is easily shifted from a normal position corresponding to the terminal of the electronic device. There was a problem. That is, in order to form many conductor parts in one elastic body, it is necessary to increase the area of the elastic body. However, when the large elastic body is stretched by heat or external force, the change in size is significant compared to the small elastic body. Therefore, the relative positions of the conductor portions formed in the elastic body are also likely to change, and each conductor portion is likely to be displaced from the normal position.

本発明は、上記課題に鑑みてなされたものであって、その目的は、一対の電子機器の間に配置さる電気コネクタにおいて、各導体部の相対位置の変化を抑制できる電気コネクタを提供することにある。   This invention is made | formed in view of the said subject, The objective is providing the electrical connector which can suppress the change of the relative position of each conductor part in the electrical connector arrange | positioned between a pair of electronic devices. It is in.

上記課題を解決するために、本発明に係る電気コネクタは、一対の電子機器の間に配置され、それらを電気的に接続する電気コネクタであって、弾性を有する誘電体と、当該誘電体中にその厚さ方向に形成され、当該誘電体の表面側と裏面側とを導通する中心導体部と、前記誘電体の表面側と裏面側とを導通するとともに、前記誘電体中において前記中心導体部を囲むよう形成される外側導体部とを備える複数の導電性弾性体と、前記複数の導電性弾性体のそれぞれを保持するフレームとを備える。   In order to solve the above problems, an electrical connector according to the present invention is an electrical connector that is arranged between a pair of electronic devices and electrically connects them, and has an elastic dielectric, and the dielectric A central conductor portion that is formed in the thickness direction and that conducts between the front surface side and the back surface side of the dielectric, and that conducts between the front surface side and the back surface side of the dielectric, and the central conductor in the dielectric A plurality of conductive elastic bodies including an outer conductor portion formed so as to surround the portion, and a frame for holding each of the plurality of conductive elastic bodies.

本発明によれば、複数の導電性弾性体がそれぞれフレームによって保持されているので、各導電性弾性体の相対位置の変化を抑制できる。その結果、導電性弾性体に形成された中心導体部と外側導体部と、それとは別の導電性弾性体に形成された中心導体部と外側導体部との相対位置の変化を抑制できる。   According to the present invention, since the plurality of conductive elastic bodies are respectively held by the frame, the change in the relative position of each conductive elastic body can be suppressed. As a result, it is possible to suppress changes in the relative positions of the central conductor portion and the outer conductor portion formed in the conductive elastic body and the central conductor portion and the outer conductor portion formed in another conductive elastic body.

以下、本発明の一実施形態について図面を参照しながら説明する。図1は本発明の実施形態の例である電気コネクタ1と、電気コネクタ1を介して電気的に接続される回路基板100A,100Bの分解斜視図である。図2は電気コネクタ1の拡大斜視図であり、図3は図2のIII−III線に示す位置での電気コネクタ1及び当該電気コネクタ1を挟んでいる回路基板100A,100Bの断面図である。図4は電気コネクタ1が備える導電性弾性体50の斜視図であり、図5は導電性弾性体50の側面図であり、図6は図5に示すVI−VI線の断面図である。図7は電気コネクタ1が備えるフレーム11の拡大斜視図であり、図8は図7に示すVIII−VIII線の断面図である。図9は回路基板100Aの導体パターンの一例を説明するための、当該回路基板100Aの拡大平面図である。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view of an electrical connector 1 as an example of an embodiment of the present invention and circuit boards 100A and 100B electrically connected via the electrical connector 1. FIG. 2 is an enlarged perspective view of the electrical connector 1, and FIG. 3 is a cross-sectional view of the electrical connector 1 and the circuit boards 100A and 100B sandwiching the electrical connector 1 at the position indicated by the line III-III in FIG. . 4 is a perspective view of the conductive elastic body 50 included in the electrical connector 1, FIG. 5 is a side view of the conductive elastic body 50, and FIG. 6 is a cross-sectional view taken along line VI-VI shown in FIG. 7 is an enlarged perspective view of the frame 11 included in the electrical connector 1, and FIG. 8 is a cross-sectional view taken along line VIII-VIII shown in FIG. FIG. 9 is an enlarged plan view of the circuit board 100A for explaining an example of the conductor pattern of the circuit board 100A.

電気コネクタ1は、一対の電子機器の間に配置され、これらを電気的に接続するシート状の電気コネクタである。この説明では、電子機器の一例である回路基板100A,100Bの間に電気コネクタ1が配置される(図1及び図3参照)。図2に示すように、電子コネクタ1は、その表面と裏面とを導通する複数の導電性弾性体50と、当該複数の導電性弾性体50を保持するフレーム11とを備えている。複数の導電性弾性体50は同一平面上に並べて配置されている。フレーム11は、複数の導電性弾性体50を回路基板100A,100Bの導体部101に対応する位置に保持している。   The electrical connector 1 is a sheet-like electrical connector that is disposed between a pair of electronic devices and electrically connects them. In this description, the electrical connector 1 is disposed between circuit boards 100A and 100B, which are examples of electronic devices (see FIGS. 1 and 3). As shown in FIG. 2, the electronic connector 1 includes a plurality of conductive elastic bodies 50 that conduct between the front surface and the back surface, and a frame 11 that holds the plurality of conductive elastic bodies 50. The plurality of conductive elastic bodies 50 are arranged side by side on the same plane. The frame 11 holds a plurality of conductive elastic bodies 50 at positions corresponding to the conductor portions 101 of the circuit boards 100A and 100B.

図4又は図6に示すように、導電性弾性体50は導体部52と誘電体51とを備えている。誘電体51は弾性を有する誘電体によって円盤状に形成されている。例えば、誘電体51は、ゴム(例えば、シリコンゴム)や、ゴム状の弾性体であるエラストマーによって構成される。誘電体51の外周面には凹部51hが形成されている。この凹部51hにフレーム11の保持孔12の内周面に形成された凸部12aが嵌ることによって、保持孔12の内側において導電性弾性体50が保持されている(図3参照)。フレーム11については後において詳説する。   As shown in FIG. 4 or 6, the conductive elastic body 50 includes a conductor portion 52 and a dielectric 51. The dielectric 51 is formed in a disk shape by an elastic dielectric. For example, the dielectric 51 is made of rubber (for example, silicon rubber) or an elastomer that is a rubber-like elastic body. A recess 51 h is formed on the outer peripheral surface of the dielectric 51. The conductive elastic body 50 is held inside the holding hole 12 by fitting the convex part 12a formed on the inner peripheral surface of the holding hole 12 of the frame 11 into the concave part 51h (see FIG. 3). The frame 11 will be described in detail later.

電気コネクタ1は高周波の信号を伝送する高速伝送用のコネクタであり、伝送線路のインピーダンス整合を図るために、導電性弾性体50の導体部52は同軸構造を有している。すなわち、導体部52は、信号用の導体である円柱状の中心導体部54と、グランド用の導体である筒状の外側導体部53とを有している。中心導体部54は誘電体51中において、その厚さ方向(Z1−Z2方向)に向くよう形成され、誘電体51の表面51a側と裏面51b側とを導通している。外側導体部53は、誘電体51中において、中心導体部54を囲むよう形成されている。また、外側導体部53も、誘電体51の厚さ方向に向くよう形成されており、誘電体51の表面51a側と裏面51b側とを導通している。回路基板100Aと回路基板100Bとの間の伝送線路のインピーダンス整合を図るために必要とされる電気コネクタ1のインピーダンスに応じて、外側導体部53の径は設定される。誘電体51は外側導体部53に対応した径を有している。具体的には、誘電体51の外径は外側導体部53の外径より僅かだけ大きくなっている。誘電体51は、外側導体部53を囲むとともにその外周面に接する外周部51j、51kを有し、外周部51j、51kは薄い環状に形成されている(図6参照)。なお、この説明では、1つの導電性弾性体50につき1つの中心導体部54と外側導体部53とが形成されている。   The electrical connector 1 is a high-speed transmission connector that transmits a high-frequency signal, and the conductor portion 52 of the conductive elastic body 50 has a coaxial structure in order to match the impedance of the transmission line. That is, the conductor 52 has a cylindrical center conductor 54 that is a signal conductor and a cylindrical outer conductor 53 that is a ground conductor. The center conductor portion 54 is formed in the dielectric 51 so as to face the thickness direction (Z1-Z2 direction), and conducts the front surface 51a side and the back surface 51b side of the dielectric 51. The outer conductor portion 53 is formed in the dielectric 51 so as to surround the center conductor portion 54. The outer conductor portion 53 is also formed so as to face the thickness direction of the dielectric 51, and the surface 51a side and the back surface 51b side of the dielectric 51 are electrically connected. The diameter of the outer conductor portion 53 is set according to the impedance of the electrical connector 1 that is required to achieve impedance matching of the transmission line between the circuit board 100A and the circuit board 100B. The dielectric 51 has a diameter corresponding to the outer conductor portion 53. Specifically, the outer diameter of the dielectric 51 is slightly larger than the outer diameter of the outer conductor portion 53. The dielectric 51 has outer peripheral portions 51j and 51k surrounding the outer conductor portion 53 and in contact with the outer peripheral surface, and the outer peripheral portions 51j and 51k are formed in a thin annular shape (see FIG. 6). In this description, one central conductor portion 54 and one outer conductor portion 53 are formed for one conductive elastic body 50.

図6に示すように、中心導体部54と外側導体部53は、誘電体51を貫通するよう設けられ、それらの端部54a,54b,53a,53bは、それぞれ誘電体51の表面51a及び裏面51bから露呈している。特に、導電性弾性体50では、中心導体部54の端部54aと外側導体部53の端部53aは、誘電体51の表面51aより上方に位置し、中心導体部54の端部54bと外側導体部53の端部53bは、誘電体51の裏面51bより下方に位置している。なお、誘電体51の表面51a及び裏面51bには、中心導体部54の端部54a,54bを囲む内側環状部51d,51eが設けられている。また、誘電体51の表面51a及び裏面51bには、外側導体部53の端部53a,53bの内周面に沿って、外側環状部51f,51gが設けられている。   As shown in FIG. 6, the central conductor portion 54 and the outer conductor portion 53 are provided so as to penetrate the dielectric 51, and the end portions 54 a, 54 b, 53 a, and 53 b are the front surface 51 a and the back surface of the dielectric 51, respectively. It is exposed from 51b. In particular, in the conductive elastic body 50, the end portion 54 a of the center conductor portion 54 and the end portion 53 a of the outer conductor portion 53 are located above the surface 51 a of the dielectric 51, and the outer end portion 54 b of the center conductor portion 54 and the outer side. The end portion 53 b of the conductor portion 53 is located below the back surface 51 b of the dielectric 51. In addition, inner ring portions 51 d and 51 e surrounding the end portions 54 a and 54 b of the center conductor portion 54 are provided on the front surface 51 a and the back surface 51 b of the dielectric 51. Also, outer annular portions 51f and 51g are provided on the front surface 51a and the rear surface 51b of the dielectric 51 along the inner peripheral surfaces of the end portions 53a and 53b of the outer conductor portion 53.

電気コネクタ1は回路基板100A,100Bの間に配置され、各導電性弾性体50に回路基板100A,100Bの導体部101が圧接される(図3参照)。図9に示すように、ここで説明する例では、回路基板100Aにおける電気コネクタ1と向き合う面に、導体部101である信号用の導体パターン101aとグランド用の導体パターン101b,101c,101dとが設けられている。導体パターン101a,101b,101c,101dが、1つの導電性弾性体50に対応する1つの組をなしている。導体パターン101b,101c,101dは、外側導体部53と概ね同径の円周上に設けられ、その内側に導体パターン101aが位置している。そして、中心導体部54に導体パターン101aが圧接され、外側導体部53に導体パターン101c,101d,101eが圧接される。回路基板100Bにおいて電気コネクタ1に向き合う面にも、回路基板100Aと同様の導体パターンが形成されており、各導体パターンが中心導体部54又は外側導体部53に圧接される。なお、図9に示す導体パターン101a,101b,101c,101dは、導体パターンの一例であり、回路基板100Aには他の導体パターンが設けられていてもよい。   The electrical connector 1 is disposed between the circuit boards 100A and 100B, and the conductor portions 101 of the circuit boards 100A and 100B are pressed into contact with the conductive elastic bodies 50 (see FIG. 3). As shown in FIG. 9, in the example described here, the conductor pattern 101a for signal and the conductor patterns 101b, 101c, 101d for ground are formed on the surface of the circuit board 100A facing the electrical connector 1. Is provided. The conductor patterns 101a, 101b, 101c, and 101d form one set corresponding to one conductive elastic body 50. The conductor patterns 101b, 101c, and 101d are provided on a circumference having substantially the same diameter as the outer conductor portion 53, and the conductor pattern 101a is located on the inner side thereof. The conductor pattern 101a is pressed against the center conductor 54, and the conductor patterns 101c, 101d, and 101e are pressed against the outer conductor 53. A conductor pattern similar to that of the circuit board 100 </ b> A is also formed on the surface of the circuit board 100 </ b> B that faces the electrical connector 1, and each conductor pattern is in pressure contact with the central conductor portion 54 or the outer conductor portion 53. The conductor patterns 101a, 101b, 101c, and 101d shown in FIG. 9 are examples of conductor patterns, and other conductor patterns may be provided on the circuit board 100A.

なお、中心導体部54と外側導体部53は、例えば厚さ方向に整列するとともに互いに連なった金属フィラー(例えば、ニッケル等の粒子)によって構成される。このような金属フィラーによって構成される中心導体部54と外側導体部53は、例えば、誘電体51の元となる材料に金属フィラーを配合した後に、当該金属フィラーを導電性弾性体50の厚さ方向の磁界によって整列させるなど、公知の方法によって誘電体51中に形成することができる。   In addition, the center conductor part 54 and the outer side conductor part 53 are comprised by the metal filler (for example, particle | grains, such as nickel) which aligned in the thickness direction and continued with each other, for example. For example, the central conductor portion 54 and the outer conductor portion 53 formed of such a metal filler are mixed with a material that is a source of the dielectric 51 and then the thickness of the conductive elastic body 50 is reduced. It can be formed in the dielectric 51 by a known method such as alignment by a directional magnetic field.

フレーム11は、樹脂(例えばプラスチック等)など、誘電体51より剛性の高い絶縁性の材料によって、矩形の板状に形成されている。また、図7に示すように、フレーム11には複数の円形の保持孔12が形成されている。保持孔12の内径は導電性弾性体50の外径に相応し、各導電性弾性体50は各保持孔12の内側において保持されている。これによって、複数の導電性弾性体50の相対位置は固定されている(図3参照)。ここでは、保持孔12の内周面と誘電体51の外周面とに凹凸が形成されており、それらが互いに嵌り合うことによって、導電性弾性体50は保持孔12の内側で保持されている。すなわち、図7又は図8に示すように、保持孔12の内周面には、保持孔12の半径方向の中心側に向かって突出する凸部12aが形成されている。この凸部12aは環状をなし、保持孔12の内周面において当該保持孔12の周方向に形成されている。一方、誘電体51の外周面には、図5又は図6に示すように、半径方向の中心側に凹む凹部51hが形成されている。この凹部51hも誘電体51の外周面において当該誘電体51の周方向に形成されている。そして、図3に示すように、凸部12aが凹部51hに嵌ることによって、導電性弾性体50は保持孔12の内側で保持されている。   The frame 11 is formed in a rectangular plate shape by an insulating material having rigidity higher than that of the dielectric 51 such as resin (for example, plastic). As shown in FIG. 7, the frame 11 has a plurality of circular holding holes 12 formed therein. The inner diameter of the holding hole 12 corresponds to the outer diameter of the conductive elastic body 50, and each conductive elastic body 50 is held inside each holding hole 12. As a result, the relative positions of the plurality of conductive elastic bodies 50 are fixed (see FIG. 3). Here, irregularities are formed on the inner peripheral surface of the holding hole 12 and the outer peripheral surface of the dielectric 51, and the conductive elastic body 50 is held inside the holding hole 12 by fitting with each other. . That is, as shown in FIG. 7 or 8, a convex portion 12 a that protrudes toward the center side in the radial direction of the holding hole 12 is formed on the inner peripheral surface of the holding hole 12. The convex portion 12 a has an annular shape and is formed on the inner peripheral surface of the holding hole 12 in the circumferential direction of the holding hole 12. On the other hand, on the outer peripheral surface of the dielectric 51, as shown in FIG. 5 or FIG. 6, a recess 51h that is recessed toward the center in the radial direction is formed. The recess 51 h is also formed on the outer peripheral surface of the dielectric 51 in the circumferential direction of the dielectric 51. And as shown in FIG. 3, the electroconductive elastic body 50 is hold | maintained inside the holding hole 12 by the convex part 12a fitting in the recessed part 51h.

導電性弾性体50は、弾性変形することによって、保持孔12に嵌め入れられる。すなわち、導電性弾性体50を保持孔12に嵌め入れる際には、誘電体51の外周縁51iは、僅かに縮むことによって、保持孔12の凸部12aを乗り越え、その後、外周縁51iが弾性復帰することによって、導電性弾性体50は保持孔12の内側で保持される。なお、保持孔12の内側で導電性弾性体50を保持する構造は、これに限られず、例えば、保持孔12の内面に凹部が形成され、誘電体51の側面に凸部が形成されてもよい。   The conductive elastic body 50 is fitted into the holding hole 12 by elastic deformation. That is, when the conductive elastic body 50 is fitted into the holding hole 12, the outer peripheral edge 51 i of the dielectric 51 is slightly shrunk to get over the convex portion 12 a of the holding hole 12, and then the outer peripheral edge 51 i is elastic. By returning, the conductive elastic body 50 is held inside the holding hole 12. The structure for holding the conductive elastic body 50 inside the holding hole 12 is not limited to this. For example, a concave portion is formed on the inner surface of the holding hole 12 and a convex portion is formed on the side surface of the dielectric 51. Good.

導電性弾性体50はフレーム11より厚く形成されており、中心導体部54の端部54aと外側導体部53の端部53aは、それぞれフレーム11の表面より上方に位置し、中心導体部54の端部54bと外側導体部53の端部53bは、それぞれフレーム11の裏面より下方に位置している(図3参照)。   The conductive elastic body 50 is formed thicker than the frame 11, and the end portion 54 a of the center conductor portion 54 and the end portion 53 a of the outer conductor portion 53 are located above the surface of the frame 11, respectively. The edge part 54b and the edge part 53b of the outer side conductor part 53 are each located below the back surface of the flame | frame 11 (refer FIG. 3).

導電性弾性体50は、フレーム11によって、回路基板100A,100Bの導体部101に対応した位置に保持されている。ここでは、図1又は図2に示すように、複数の導電性弾性体50は、複数(ここでは4つ)の列(X1−X2方向の列)をなすよう配置されている。また、複数の導電性弾性体50は斜め格子状に配置されており、各導電性弾性体50は、隣接する列の導電性弾性体50に対して、斜めの方向(図2においてDの方向)に位置している。すなわち、同じ列において隣り合う2つの導電性弾性体50,50の中間の位置(図2においてPが示す位置)を通り、当該列に対して垂直な方向(Y1−Y2方向)に、隣の列の導電性弾性体50の中心が位置している。   The conductive elastic body 50 is held by the frame 11 at a position corresponding to the conductor portion 101 of the circuit boards 100A and 100B. Here, as shown in FIG. 1 or FIG. 2, the plurality of conductive elastic bodies 50 are arranged to form a plurality of (here, four) rows (rows in the X1-X2 direction). Further, the plurality of conductive elastic bodies 50 are arranged in an oblique lattice shape, and each conductive elastic body 50 is inclined with respect to the conductive elastic bodies 50 in the adjacent rows (direction D in FIG. 2). ). That is, it passes through an intermediate position (position indicated by P in FIG. 2) between two adjacent conductive elastic bodies 50, 50 in the same row, and is adjacent to the direction perpendicular to the row (Y1-Y2 direction). The center of the row of conductive elastic bodies 50 is located.

なお、図7又は図8に示すように、同じ列に位置し互いに隣接する2つの保持孔12の間には、フレーム11の他の部分より肉厚の薄い連結部11bが形成されている。各保持孔12は連結部11bによって、隣に位置する保持孔12と区画されている。上述したように、凸部12aは、保持孔12の内周面において内側に突出する環状となっている。また、ここで説明する例では、同じ列において隣接する2つの保持孔12は、それらの最も外側の縁が接するように配置されている。そして、当該隣接する2つの保持孔12の凸部12aの一部が、当該2つの保持孔12を区画する連結部11bとなっている。これによって、互いに区画された複数の保持孔12を極力近い位置に配置することができる。   As shown in FIG. 7 or FIG. 8, a connecting portion 11 b that is thinner than other portions of the frame 11 is formed between two holding holes 12 that are located in the same row and adjacent to each other. Each holding hole 12 is partitioned from the adjacent holding hole 12 by a connecting portion 11b. As described above, the convex portion 12 a has an annular shape protruding inward on the inner peripheral surface of the holding hole 12. Moreover, in the example demonstrated here, the two holding holes 12 adjacent in the same row | line | column are arrange | positioned so that those outermost edges may contact | connect. A part of the convex portion 12 a of the two adjacent holding holes 12 serves as a connecting portion 11 b that partitions the two holding holes 12. Thereby, the plurality of holding holes 12 partitioned from each other can be arranged at positions as close as possible.

また、図1に示すように、フレーム11は、回路基板100A,100Bを当該フレーム11に固定する複数(ここでは2つ)の締結部13,13を有している。締結部13,13は、フレーム11の縁に形成されるとともに、当該フレーム11の対角線上に位置している。この説明では、締結部13はリベットであり、フレーム11から上方及び下方に突出する突出部13a,13bを有している(図2又は図7参照)。回路基板100Aには締結部13,13に対応する位置に孔102A,102Aが形成され、回路基板100Bにも締結部13,13に対応する位置に孔102B,102Bが形成されている。これらの孔102A,102Bに、締結部13の突出部13a,13bは嵌められる。そして、回路基板100A,100Bを電気コネクタ1に圧接した状態で、突出部13a,13bの頂部をかしめることによって、回路基板100A,100Bは、それぞれ電気コネクタ1に固定される(図3参照)。なお、図3では突出部13a,13bの頂部をかしめた後の状態が示されている。   Further, as shown in FIG. 1, the frame 11 includes a plurality (here, two) of fastening portions 13 and 13 that fix the circuit boards 100 </ b> A and 100 </ b> B to the frame 11. The fastening portions 13 and 13 are formed on the edge of the frame 11 and are positioned on the diagonal line of the frame 11. In this description, the fastening portion 13 is a rivet and has projecting portions 13a and 13b projecting upward and downward from the frame 11 (see FIG. 2 or FIG. 7). Holes 102A and 102A are formed in the circuit board 100A at positions corresponding to the fastening portions 13 and 13, and holes 102B and 102B are formed in the circuit board 100B at positions corresponding to the fastening portions 13 and 13. The protrusions 13a and 13b of the fastening portion 13 are fitted into these holes 102A and 102B. Then, the circuit boards 100A and 100B are respectively fixed to the electrical connector 1 by crimping the tops of the protrusions 13a and 13b in a state where the circuit boards 100A and 100B are pressed against the electrical connector 1 (see FIG. 3). . FIG. 3 shows a state after the top portions of the protruding portions 13a and 13b are caulked.

以上説明したように、電気コネクタ1は、弾性を有する誘電体51と、当該誘電体51中にその厚さ方向に形成され、当該誘電体51の表面51a側と裏面51b側とを導通する中心導体部54と、誘電体51の表面51a側と裏面51b側とを導通するとともに、誘電体51中において中心導体部54を囲むよう形成される外側導体部53とを備える複数の導電性弾性体50を備えている。そして、各導電性弾性体50はフレーム11によって保持されている。これによって、各導電性弾性体50の相対位置の変化を抑制できる。その結果、導電性弾性体50に形成された中心導体部54及び外側導体部53と、それとは別の導電性弾性体50に形成された中心導体部54及び外側導体部53との相対位置の変化を抑制できる。   As described above, the electrical connector 1 includes the dielectric 51 having elasticity, the center formed in the dielectric 51 in the thickness direction, and conducting between the surface 51a side and the back surface 51b side of the dielectric 51. A plurality of conductive elastic bodies including a conductor portion 54 and an outer conductor portion 53 formed so as to enclose the central conductor portion 54 in the dielectric 51 while conducting the front surface 51a side and the back surface 51b side of the dielectric 51. 50. Each conductive elastic body 50 is held by the frame 11. Thereby, the change of the relative position of each electroconductive elastic body 50 can be suppressed. As a result, the relative positions of the central conductor portion 54 and the outer conductor portion 53 formed in the conductive elastic body 50 and the central conductor portion 54 and the outer conductor portion 53 formed in another conductive elastic body 50 are different. Change can be suppressed.

また、フレーム11は複数の保持孔12が形成された板状であり、複数の導電性弾性体50は、それぞれ保持孔12の内側において保持されている。これによって、簡単な構造で各導電性弾性体50を保持できる。   The frame 11 has a plate shape in which a plurality of holding holes 12 are formed, and the plurality of conductive elastic bodies 50 are respectively held inside the holding holes 12. Thereby, each conductive elastic body 50 can be held with a simple structure.

また、導電性弾性体50は、弾性変形することによってフレーム11の保持孔12に嵌められている。これによって、導電性弾性体50を保持孔12の内側において、さらに確実に保持できる。   The conductive elastic body 50 is fitted into the holding hole 12 of the frame 11 by elastic deformation. Thereby, the conductive elastic body 50 can be more reliably held inside the holding hole 12.

また、フレーム11は、一対の電子機器(ここでは回路基板100A,100B)をフレーム11に固定する締結部13,13を有している。これによって、電気コネクタ1によって回路基板100Aと回路基板100Bとを連結できる。   Further, the frame 11 has fastening portions 13 and 13 for fixing a pair of electronic devices (here, the circuit boards 100A and 100B) to the frame 11. Thus, the circuit board 100A and the circuit board 100B can be connected by the electrical connector 1.

なお、本発明は以上説明した電気コネクタ1に限られず、種々の変更が可能である。例えば、以上の説明では、1つの誘電体51に1つの導体部52が形成されていた。しかしながら、1つの誘電体51に複数の導体部52が形成され、複数の導体部52を有する導電性弾性体がフレームによって保持されてもよい。   In addition, this invention is not restricted to the electrical connector 1 demonstrated above, A various change is possible. For example, in the above description, one conductor portion 52 is formed in one dielectric 51. However, a plurality of conductor portions 52 may be formed in one dielectric 51, and a conductive elastic body having the plurality of conductor portions 52 may be held by a frame.

また、以上の説明では、複数の導電性弾性体50は、フレーム11によって斜め格子状に保持されていた。しかしながら、導電性弾性体50の位置は、これに限られず、電気コネクタ1に接続される電子機器の導体部の位置に応じて適宜変更されてもよい。   Further, in the above description, the plurality of conductive elastic bodies 50 are held in an oblique lattice shape by the frame 11. However, the position of the conductive elastic body 50 is not limited to this, and may be appropriately changed according to the position of the conductor portion of the electronic device connected to the electrical connector 1.

また、以上の説明では、締結部13としてリベットが用いられていたが、締結部はこれに限られず、例えば、ボルトなどでもよい。   In the above description, a rivet is used as the fastening portion 13, but the fastening portion is not limited to this, and may be, for example, a bolt.

本発明の実施形態の例である電気コネクタと、電気コネクタを介して電気的に接続される回路基板との分解斜視図である。It is a disassembled perspective view of the electrical connector which is an example of embodiment of this invention, and the circuit board electrically connected via an electrical connector. 上記電気コネクタの拡大斜視図である。It is an expansion perspective view of the said electrical connector. 図2に示すIII−III線に示す位置での電気コネクタ1及び回路基板の断面図である。It is sectional drawing of the electrical connector 1 and the circuit board in the position shown to the III-III line shown in FIG. 上記電気コネクタが備える導電性弾性体の斜視図である。It is a perspective view of the electroconductive elastic body with which the said electrical connector is provided. 上記導電性弾性体の側面図である。It is a side view of the said conductive elastic body. 図5に示すVI−VI線の断面図である。It is sectional drawing of the VI-VI line shown in FIG. 上記電気コネクタが備えるフレームの拡大斜視図である。It is an expansion perspective view of the flame | frame with which the said electrical connector is provided. 図7に示すVIII−VIII線の断面図である。It is sectional drawing of the VIII-VIII line shown in FIG. 上記回路基板の導体パターンの一例を説明するための、当該回路基板の拡大平面図である。It is an enlarged plan view of the circuit board for explaining an example of the conductor pattern of the circuit board.

符号の説明Explanation of symbols

1 電気コネクタ、11 フレーム、11b 連結部、12 保持孔、12a 凸部、13 締結部、13a 突出部、50 導電性弾性体、51 誘電体、51a 表面、51b 裏面、51d 内側環状部、51f 外側環状部、51h 凹部、51i 外周縁、51j,51k 外周部、52 導体部、53 外側導体部、53a 端部、53b 端部、54 中心導体部、54a 端部、54b 端部、100A,100B 回路基板(電子機器)、101 導体部、101a,101b,101c,101d 導体パターン、102A,102B 孔。   DESCRIPTION OF SYMBOLS 1 Electrical connector, 11 Frame, 11b Connection part, 12 Holding hole, 12a Convex part, 13 Fastening part, 13a Protrusion part, 50 Conductive elastic body, 51 Dielectric, 51a Surface, 51b Back surface, 51d Inner ring part, 51f Outer side Annular part, 51h recessed part, 51i outer peripheral edge, 51j, 51k outer peripheral part, 52 conductor part, 53 outer conductor part, 53a end part, 53b end part, 54 central conductor part, 54a end part, 54b end part, 100A, 100B circuit Substrate (electronic device), 101 conductor portion, 101a, 101b, 101c, 101d conductor pattern, 102A, 102B hole.

Claims (4)

一対の電子機器の間に配置され、それらを電気的に接続する電気コネクタであって、
弾性を有する誘電体と、当該誘電体中にその厚さ方向に形成され、当該誘電体の表面側と裏面側とを導通する中心導体部と、前記誘電体の表面側と裏面側とを導通するとともに、前記誘電体中において前記中心導体部を囲むよう形成される外側導体部とを備える複数の導電性弾性体と、
前記複数の導電性弾性体のそれぞれを保持するフレームと、
を備えることを特徴とする電気コネクタ。
An electrical connector disposed between a pair of electronic devices and electrically connecting them,
An elastic dielectric, a central conductor formed in the dielectric in the thickness direction and conducting between the surface side and the back side of the dielectric, and conducting between the surface side and the back side of the dielectric And a plurality of conductive elastic bodies comprising an outer conductor portion formed so as to surround the central conductor portion in the dielectric,
A frame for holding each of the plurality of conductive elastic bodies;
An electrical connector comprising:
請求項1に記載の電気コネクタにおいて、
前記フレームは複数の孔が形成された板状であり、
前記複数の導電性弾性体は、それぞれ前記フレームの前記孔の内側において保持されている、
ことを特徴とする電気コネクタ。
The electrical connector according to claim 1,
The frame has a plate shape in which a plurality of holes are formed,
The plurality of conductive elastic bodies are respectively held inside the holes of the frame.
An electrical connector characterized by that.
請求項2に記載の電気コネクタにおいて、
前記導電性弾性体は、弾性変形することによって前記フレームの前記孔に嵌められている、
ことを特徴とする電気コネクタ。
The electrical connector according to claim 2,
The conductive elastic body is fitted into the hole of the frame by elastic deformation.
An electrical connector characterized by that.
請求項1に記載の電気コネクタにおいて、
前記フレームは、前記一対の電子機器を当該フレームに固定する締結部を有する、
ことを特徴とする電気コネクタ。
The electrical connector according to claim 1,
The frame includes a fastening portion that fixes the pair of electronic devices to the frame.
An electrical connector characterized by that.
JP2008131892A 2008-05-20 2008-05-20 Electrical connector Active JP5236354B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008131892A JP5236354B2 (en) 2008-05-20 2008-05-20 Electrical connector
PCT/US2009/044688 WO2009143252A1 (en) 2008-05-20 2009-05-20 Sheet-like electrical connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008131892A JP5236354B2 (en) 2008-05-20 2008-05-20 Electrical connector

Publications (2)

Publication Number Publication Date
JP2009283182A true JP2009283182A (en) 2009-12-03
JP5236354B2 JP5236354B2 (en) 2013-07-17

Family

ID=40825224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008131892A Active JP5236354B2 (en) 2008-05-20 2008-05-20 Electrical connector

Country Status (2)

Country Link
JP (1) JP5236354B2 (en)
WO (1) WO2009143252A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101982903A (en) * 2010-09-15 2011-03-02 华为技术有限公司 Circuit board connector and communication equipment
JP2019504436A (en) * 2015-11-18 2019-02-14 レイセオン カンパニー Egg crate high frequency interposer
JP2024515754A (en) * 2021-04-25 2024-04-10 華為技術有限公司 Connection device and radio frequency module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4411994A1 (en) * 2023-02-01 2024-08-07 Rosenberger Hochfrequenztechnik GmbH & Co. KG Connecting element and assembly
DE102024204764A1 (en) * 2024-05-23 2025-11-27 Continental Automotive Technologies GmbH Electronic assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555553U (en) * 1991-12-24 1993-07-23 横河電機株式会社 Semiconductor wafer inspection system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872550A (en) * 1997-06-09 1999-02-16 Raytheon Company Compressible coaxial interconnection with integrated environmental seal
US6332782B1 (en) * 2000-06-19 2001-12-25 International Business Machines Corporation Spatial transformation interposer for electronic packaging
AU2003257535A1 (en) * 2002-08-27 2004-03-19 Jsr Corporation Anisotropic, conductive sheet and impedance measuring probe
DE202004015503U1 (en) * 2004-10-06 2004-12-09 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Plug arrangement for RF signal path

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555553U (en) * 1991-12-24 1993-07-23 横河電機株式会社 Semiconductor wafer inspection system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101982903A (en) * 2010-09-15 2011-03-02 华为技术有限公司 Circuit board connector and communication equipment
JP2019504436A (en) * 2015-11-18 2019-02-14 レイセオン カンパニー Egg crate high frequency interposer
JP2024515754A (en) * 2021-04-25 2024-04-10 華為技術有限公司 Connection device and radio frequency module
JP7711213B2 (en) 2021-04-25 2025-07-22 華為技術有限公司 Connection device and radio frequency module

Also Published As

Publication number Publication date
WO2009143252A1 (en) 2009-11-26
JP5236354B2 (en) 2013-07-17

Similar Documents

Publication Publication Date Title
US8604372B2 (en) Push button and electronic device having same
JP4710627B2 (en) Board to board connector
US9583854B2 (en) Connector and semiconductor testing device having the same
US8821191B2 (en) Electrical connector assembly
JP2020064065A (en) Test socket assembly and related methods
US20130203298A1 (en) Electrical Connector With Insulation Member
JP4972418B2 (en) Test equipment and probe card
JP5236354B2 (en) Electrical connector
TWI668451B (en) Conduction device
JP2014102916A (en) Connector and flexible printed circuit board
JPWO2005106504A1 (en) Electrical connection device
US9545002B2 (en) Multilayer circuit board
US8937814B2 (en) Positioning structure, positioning securing structure and electronic device
US9614334B2 (en) Hermaphroditic electrical connector
KR102309675B1 (en) Probe card in film type
JP6372208B2 (en) Board connector
JP4697245B2 (en) Board to board connector
US8882539B2 (en) Shunt for electrical connector
US20100321915A1 (en) Circuit board arrangement
KR102064381B1 (en) Main board receiving memory module for memory module mounted test by main board reverse interconnection
JP2010212022A (en) Coaxial connector
JP4246093B2 (en) Flexible wiring board
KR102029035B1 (en) Main board receiving memory module for memory module mounted test by main board reverse interconnection
JP2011014328A (en) Connector, cable assembly, commonalized conductor for connector and semiconductor testing device
CN111786159A (en) conduction device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110127

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120508

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120807

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130305

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130327

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160405

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250