JP2009270001A - Semiconductor-sealing resin composition and semiconductor device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor-sealing resin composition excellent in operability in deburring, various reliability and moldability. <P>SOLUTION: The semiconductor-sealing resin composition contains the following component (D) in addition to the following components (A) to (C): (A) an epoxy resin; (B) a phenolic resin; (C) an inorganic filler; and (D) a silicone resin containing an alkoxy group directly linking to silicon of 10 to 30 wt.% based on the total amount of the silicone resin. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an epoxy resin-based encapsulating resin composition, and particularly a semiconductor encapsulating resin composition that facilitates the removal of burrs in a small semiconductor package encapsulating application, and a semiconductor using the same The present invention relates to a semiconductor device formed by sealing an element.

  2. Description of the Related Art Conventionally, semiconductor elements such as IC and LSI are resin-sealed using a resin composition to form a semiconductor device. In particular, when a small semiconductor package is resin-sealed with a resin composition, the thickness of the generated burr becomes relatively large with respect to the size of the package, and it is difficult to remove the burr.

  Under such circumstances, for example, a method of removing burrs by a high-pressure water flow is used as the method of removing the burrs, but the adhesion between the resin composition as the sealing material and the lead frame is good. The burrs due to the resin composition are not removed, and the connection reliability of the external electrode is lowered.

On the other hand, a method of improving the burr removal property by applying a water-soluble resin to a lead frame is also performed (see Patent Document 1). In addition, the surface of the lead frame portion outside the package is also subjected to plating with low adhesion to a resin composition serving as a sealing material. However, as described above, there is a problem that the work becomes complicated such as applying the water-soluble resin to the lead frame, the plating process itself is complicated, and the sufficient adhesion is not necessarily reduced. There was a problem that a burr residue was generated.
JP 10-116950 A

  As described above, even if the adhesion to the lead frame is reduced, for example, in the case of a small semiconductor package, the resin composition in the burr portion is relatively large compared to the thickness of the package. For this reason, when the burr is removed, the resin composition (sealing resin part) of the package part itself is also removed, and a recess is formed in the shape of the package. There was a case where reliability decreased. In the worst case, cracks may occur in the package itself.

  In addition to the above method, there may be a method of reducing the adhesion of the resin composition itself to the lead frame by blending a hydrophobic silane coupling agent, etc., but in this case, points such as moisture resistance reliability and heat cycle properties However, there is a problem that sufficient reliability cannot be obtained.

  It is also conceivable to reduce the amount of filler added to reduce the mechanical strength and improve the removability of the resin composition at the burr portion. However, the package is improved by lowering the thermal conductivity and increasing the linear expansion coefficient. There is a problem that stress is generated in the interior and the heat cycle property is inferior.

  Furthermore, in order to suppress the generation of burrs, a method of using a large amount of fine particles by controlling the particle size of the filler can be considered, but as a result, the viscosity of the resin composition increases and the fluidity decreases. In addition, there is a problem that a defect such as generation of a portion not filled with the resin composition (unfilled portion) occurs.

  The present invention has been made in view of such circumstances, and provides a semiconductor sealing resin composition excellent in burr removal workability and excellent in various reliability and moldability, and a semiconductor device using the same. For that purpose.

In order to achieve the above object, the first gist of the present invention is a resin composition for encapsulating a semiconductor containing the following (D) component together with the following (A) to (C) components.
(A) Epoxy resin.
(B) Phenolic resin.
(C) Inorganic filler.
(D) A silicone resin containing 10 to 30% by weight of the total silicone resin containing an alkoxy group directly bonded to silicon.

  Moreover, let the 2nd summary be the semiconductor device which seals a semiconductor element using the resin composition for semiconductor sealing of the said 1st summary.

  The inventors of the present invention have made a series of studies in order to obtain an epoxy resin composition for encapsulating a semiconductor that is excellent in workability for removing generated burrs and does not cause various reliability and moldability deterioration. As a result, the use of the specific silicone resin was recalled. That is, since this specific silicone resin has a specific alkoxy group content, for example, as in the case of a silane coupling agent, the terminal alkoxysilane is not exposed to the outside without a barrier, and a nearby organic resin It is blocked by the group, the reactivity with the filler is suppressed, it moves in the resin composition when it is molded, and it effectively reduces the adhesive force at the interface between the lead frame and the sealing resin part There will be an effect. In addition, since the molecular size is larger than that of the silane coupling agent and the surface of the adherend is uniformly coated, the interface between the resin composition and the lead frame is hydrophobized, and the adhesion is reduced. It is presumed that the intrusion of moisture is hindered, and when moisture enters, it is easily released to the outside as water vapor by heating. Furthermore, since it has a certain large molecular weight, it is difficult to perform extraction with moisture, and it becomes possible to maintain moisture resistance for a long time. For this reason, the present inventors have found that it is easy to remove the formed burrs, and that they are excellent in various reliability and moldability during resin sealing.

  As described above, the present invention is a resin composition for encapsulating a semiconductor containing a silicone resin having an alkoxy group content in a specific range together with an epoxy resin, a phenol resin, and an inorganic filler. For this reason, it is easy to remove the generated burrs without deteriorating various reliability such as moisture resistance and releasability and moldability, and a highly reliable semiconductor device can be obtained. In particular, when the resin composition for semiconductor encapsulation of the present invention is used as, for example, a sealing material for a small package, it is useful because it is easy to remove burrs having a relatively large thickness with respect to the package size.

  Next, embodiments of the present invention will be described in detail.

  The resin composition for semiconductor encapsulation of the present invention is obtained using an epoxy resin (A component), a phenol resin (B component), an inorganic filler (C component), and a specific silicone resin (D component). In general, it is used in the form of a powder or a tablet obtained by compressing it.

  The epoxy resin (component A) used in the present invention is not particularly limited, and a commonly used epoxy resin is used. Examples thereof include various epoxy resins such as cresol novolac type, phenol novolac type, bisphenol A type, and biphenyl type, and brominated epoxy resins. These may be used alone or in combination of two or more. Especially, it is preferable to use the thing of the range whose epoxy equivalent is 185-205 from the point of a moldability, More preferably, it is 190-200. That is, if the epoxy equivalent is less than 185, the fluidity decreases, and if it exceeds 205, the curability tends to decrease. Furthermore, from the viewpoint of the handleability and moldability of the resin, it is preferable to use a resin having a softening point in the range of 60 to 80 ° C, more preferably 65 to 75 ° C. That is, when the softening point is less than 60 ° C., the resin composition tends to be blocked, and when it exceeds 80 ° C., the fluidity of the resin composition tends to decrease.

  As a phenol resin (B component) used with the said epoxy resin (A component), it is not specifically limited, Although conventionally well-known various phenol resins can be used, It is preferable to use a phenol novolak resin especially. . The phenol novolac resin is obtained by reacting a compound having a phenolic hydroxyl group such as phenol or naphthol with an aldehyde, a ketone or the like in an acidic atmosphere. In a broad sense, a phenol compound and a methoxymethylene group, etc. The phenol aralkyl resin obtained by making it react with the aromatic compound which has this is also included.

  In the present invention, when the semiconductor device to be sealed is a small package, it is important to increase the crosslink density of the resin, and a novolac type phenol formaldehyde resin having a low phenolic hydroxyl group equivalent is preferably used. If the phenolic hydroxyl group equivalent is low, even if it has a low molecular weight, it will have 3 or more phenolic hydroxyl groups, so that the resin composition can be obtained using a low molecular weight compound without greatly deteriorating the cured product properties. It is also possible to reduce the viscosity of the resin and ensure the fluidity of the resin.

  In addition, as said phenol resin (B component), it is not limited to the said phenol novolak resin, If necessary, another phenol novolak resin can also be used.

  The blending ratio of the epoxy resin (component A) and the phenol resin (component B) is blended so that the hydroxyl group equivalent in the phenol resin is 0.5 to 2.0 equivalents per equivalent of epoxy group in the epoxy resin. It is preferable. More preferably, it is 0.8-1.2 equivalent.

  The inorganic filler (C component) used together with the A component and the B component is not particularly limited, and various conventionally known inorganic fillers are used. Examples thereof include quartz glass powder, silica powder, alumina powder, and talc. These may be used alone or in combination of two or more. In applications requiring high thermal conductivity, it is preferable to use alumina powder, silica powder, especially crystalline silica powder or crushed powder thereof (hereinafter referred to as “crushed crystal silica powder”). Furthermore, in order to improve the fluidity | liquidity of resin, it is still more preferable to use what removed the grinding | polishing corner of the powder. On the other hand, for the purpose of lowering the linear expansion coefficient, it is preferable to use silica powder that has been melted and made amorphous (hereinafter referred to as “fused silica powder”). And when improving the fluidity | liquidity of resin, what grind | pulverized the silica powder by spraying in a flame and making it spherical shape is used preferably.

  The average particle diameter of the inorganic filler (component C) is preferably 5 to 30 μm, particularly preferably 5 to 25 μm. That is, if the average particle diameter is less than 5 μm, the fluidity of the resin composition is lowered, and if it exceeds 30 μm, clogging at the mold gate due to particles having a large particle diameter tends to occur. Furthermore, the maximum particle size should be 54 μm or less. In the case of small semiconductor packages, the appearance after molding is excellent and smooth, poor flow due to the trapping of the inorganic filler on the mold gate, and sandwiched between wires It is particularly preferable because the effect of suppressing the occurrence of deformation of the wire due to the wire and voids in the wire portion is obtained. In the present invention, the average particle size and the maximum particle size can be derived, for example, by using a sample arbitrarily extracted from the population and measuring it using a laser diffraction / scattering particle size distribution analyzer. .

  And it is preferable to set content of the said inorganic filler (C component) in the range of 70 to 90 weight% of the whole epoxy resin composition. That is, if the content of the inorganic filler (component C) is too small, there is a tendency for problems such as a decrease in mechanical strength and generation of stress due to an increase in the linear expansion coefficient. This is because the moldability tends to decrease.

As a specific silicone resin (D component) used with said AC component, it contains 10-30 weight% of the whole silicone resin for the alkoxy group couple | bonded directly with silicon. Such a silicone resin contains at least R ₁ SiO _3/2 units, and suitably contains SiO _4/2 units, R ₁ R ₂ SiO _2/2 units, and R ₁ R ₂ R ₃ SiO _1/2 units. The organosiloxane may have a branched polysiloxane structure having a SiO _3/2 skeleton or a SiO _4/2 skeleton, and may have a ring structure, a cage shape, a box shape, or the like. In the above structural unit, R ₁ , R ₂ and R ₃ may be the same or different from each other, and are a hydrocarbon group having 1 to 7 carbon atoms or an alkoxy group having 3 or less carbon atoms, It is necessary to contain 10 to 30% by weight of the whole silicone resin.

  The silicone resin (component D) is tetraalkoxysilane, methyltrialkoxysilane, phenyltrialkoxysilane, dimethyldialkoxysilane, diphenyldialkoxysilane, methylphenyldialkoxysilane, trimethylalkoxysilane, triphenylalkoxysilane, methyldiphenyl. It can be obtained by appropriately mixing alkoxysilane, dimethylphenylalkoxysilane, etc., and hydrolytic condensation. Moreover, it can synthesize | combine using the compound which replaces with the said alkoxy group containing compound, and has a silanol group and a halogen group. Alternatively, an organosiloxane oligomer having at least one of an alkoxysilyl group and a silanol group may be used as at least a part of the reaction raw material.

If the content of at least one of the SiO _3/2 unit and the SiO _4/2 unit increases, the dispersibility of the resin component tends to be semi-solid or solid, so that the product becomes liquid. In addition, it is preferable that the amounts of SiO _3/2 units and SiO _4/2 units are appropriately adjusted and blended.

  And when the said alkoxy group remains, since it will hydrolyze and reaction will advance further, it is necessary to control a water | moisture content. It is also possible to improve the storage stability and the flow characteristics of the resin composition by using what is capped with a trialkylalkoxysilane or the like so as not to become an alkoxy group at the molecular end.

  In the present invention, examples of the specific silicone resin (D component) include those having a structure represented by the following general formula (1).

[Chemical formula 1]
Si _n O _{(n-1 + ab)} (OR ¹ ) _x (R ² ) _{(2n + 2-x-2a + 2b)} (1)
[In Formula (1), R ¹ is an alkyl group having 3 or less carbon atoms, and R ² is a monovalent hydrocarbon group having 1 to 12 carbon atoms. N is an integer of 4 or more, (n-1 + ab) is an integer of 3 or more, x is a positive integer of 1 or more and (2n-2a) or less, a is the number of ring-closing units, and is an integer of 0 or more, b is the number of closed three-dimensional structures and is an integer of 0 or more. ]

Examples of R ² include a methyl group, ethyl group, propyl group, i-propyl group, butyl group, i-butyl group, t-butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, Decyl group, undecyl group, alkyl group such as dodecyl group, alkylenyl group such as vinyl group, allyl group, aryl group such as phenyl group, naphthyl group, o-cresyl group, m-cresyl group, p-cresyl group, benzyl group And aralkyl groups such as

More preferably, R ² is a phenyl group, and it is preferably an alkoxy group-containing methylphenyl silicone resin in view of viscosity, flexibility, economy and the like. That is, such a compound containing a phenyl group improves solubility in a resin component, and a compound containing a methyl group has low viscosity and good fluidity.

  For this reason, it is preferable to use a specific silicone resin (D component) having a structure represented by the following general formula (2).

[Chemical formula 2]
Si _n O _{(n-1 + ab)} (OR ¹ ) _x (CH ₃ ) _y (Ph) _{(2n + 2-xy-2a + 2b)} (2)
[In Formula (2), R < ¹ > is a C3 or less alkyl group, and Ph is a phenyl group. N is an integer of 4 or more, (n-1 + a-b) is an integer of 3 or more, x and y are 1 or more and a positive integer of (2n-2a) or less, 2n + 2-xy-2a + 2b is 1 or more And a positive integer of (2n-2a) or less, a is an integer of 0 or more in the number of closed units, and b is an integer of 0 or more in the number of closed three-dimensional structures. ]

In the general formula (2), incorporation of the SiO _3/2 unit and SiO _4/2 unit into the molecule and hydrolysis condensation of alkoxysilane and the like are performed randomly. About a and b, it can obtain | require from the structural analysis by Si-NMR (nuclear magnetic resonance analyzer), and each value of x / n and y / n can be obtained. On the other hand, the molecular weight can be measured by a technique such as gel permeation chromatography (GPC), and the value of n can be estimated using this measured value and the above value. The number of methyl groups and phenyl groups relative to the number of silicon atoms, x / n, and y / n are each 0.1 to 0.9, and (x + y) / n is preferably 0.5 to 2.0. . Furthermore, x / (x + y) is 0.2 to 0.8, and the more the phenyl group, the higher the solubility in the resin component and the higher the heat resistance.

  Moreover, it is preferable that content of the alkoxy group in a silicone resin (D component) shall be 50-300 as an alkoxy group equivalent. More preferably, it is 100-200. That is, when the alkoxy group equivalent is less than 50, the storage stability of the resin composition decreases, and when it exceeds 300, it tends to be difficult to maintain the strength of the sealing resin.

  Furthermore, it is preferable that the weight average molecular weights (Mw) of a silicone resin (D component) are 314-10000, More preferably, it is 500-3000. That is, when the weight average molecular weight (Mw) is less than 314, the adhesion to the lead frame is increased, and it is difficult to remove burrs. When the weight average molecular weight (Mw) exceeds 10,000, the solubility in the resin component tends to be reduced.

  The viscosity of the silicone resin (component D) is preferably in the range of 5 to 100 mPa · s at 25 ° C. from the viewpoint of handleability.

On the other hand, the content of the silsesquioxane (SiO _3/2 ) skeleton and the SiO _4/2 skeleton is appropriately determined. By having these skeleton structures, rigidity is obtained and linear organosiloxane is obtained. This is effective for preventing problems such as excessively high flexibility when resin is used and a decrease in resin strength.

  The silicone resin (D component) can improve the fluidity of the resin composition and impart excellent moldability.

The content of the silsesquioxane (SiO _3/2 ) skeleton is preferably 30 to 90% by weight based on the total number of silicon atoms. That is, when the content of the SiO _3/2 skeleton is small, it becomes difficult to form a tree shape or a sheet shape. By having this tree-like or sheet-like shape, it is presumed that the flow form of the resin composition becomes layered, and stable flow is performed. Since the silicone resin (D component) is oriented in a layered manner, the stress in the left-right direction is relaxed by the silicone resin (D component) layer, and the effect of reducing the stress applied to the semiconductor element is achieved. .

On the other hand, the content of the SiO _4/2 skeleton is preferably 0 to 30% by weight with respect to the total number of silicon atoms. That is, in the case of only the SiO _3/2 skeleton, it becomes only a tree shape, a ladder shape, a cage shape or the like, but a sheet-like structure can be formed by introducing the SiO _4/2 skeleton.

  Further, when the semiconductor device is a small package, since the surface area relative to the volume is large, the specific silicone resin (D component) efficiently moves to the package surface and is squeezed from the resin composition in the mold. In particular, it is intensively distributed in the gaps (burrs) between the molds. For this reason, the resin strength at the boundary between the burr and the package is effectively reduced, and the burr can be easily separated from the package.

  Examples of the method for synthesizing the specific silicone resin (component D) include known synthesis methods described in Japanese Patent No. 2810760 and Japanese Patent No. 3190266, for example. That is, a liquid silicone resin containing an alkoxy group can be synthesized by hydrolysis of trialkoxy and cyclic polydimethylsiloxane or hydrolysis of trialkoxysilane alone.

  In addition to the above synthesis method, as described in JP-A-9-143675, a method of synthesizing an alkoxy group-containing silicone resin by re-equilibrating a silicone resin and an alkoxysilane in an alkaline atmosphere. Can be given.

  Specific examples of the specific silicone resin (D component) are KR-500, X-40-9225, X-40-9246, X-40-9250, KR-217, and KR-9218 manufactured by Shin-Etsu Chemical Co., Ltd. , KR-213, KR-510, X-40-9227, X-40-9247, X-41-1056, X-41-1810, and the like. These differ in the methyl group alone, the phenyl group alone, the combined use of the methyl group and the phenyl group, the type of alkoxy group, the content of the alkoxy group, and the like.

  It is preferable to set content of the said specific silicone resin (D component) to 0.1 to 2 weight% with respect to a resin composition, More preferably, it is 0.3 to 1 weight%. That is, if the content of the specific silicone resin (component D) is too small, the tendency of the burr removal workability tends to be inferior, and conversely if too large, the mechanical properties of the cured resin composition tend to decrease. Because it is.

  In the semiconductor sealing resin composition of the present invention, in addition to the components A to D, a curing accelerator, a silane coupling agent, a pigment, a flame retardant, a flame retardant aid, a release agent, and the like are appropriately added as necessary. Can be used.

  The curing accelerator causes a curing reaction when the epoxy resin (component A) and the phenol resin (component B) are used, but is used for the purpose of promoting the curing reaction because the reaction rate is slow. Examples thereof include phosphorus compounds, conventionally known tertiary amines, quaternary ammonium salts, imidazoles, boron compounds and the like, and these are used alone or in combination of two or more. Among these, phosphorus compounds are preferably used, and triphenylphosphine is particularly preferably used.

  The silane coupling agent has a functional group that reacts with at least one of an epoxy resin (component A) and a phenol resin (component B) and an alkoxysilane skeleton. For example, γ-mercaptopropyltrimethoxysilane, γ -Aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane and the like.

  Examples of the pigment include carbon black having an electrostatic removal effect.

  Examples of the flame retardant include bromine flame retardant, nitrogen flame retardant, phosphorus flame retardant, metal hydroxide, metal hydrate and the like. In addition, although the said metal hydroxide and metal hydrate show the outstanding flame retardance, the tendency to bring about a fall of water resistance is seen. However, in this invention, since the specific silicone resin (D component) containing an alkoxy group is used, this has a protective effect and the fall of water resistance will be suppressed.

  Examples of the flame retardant aid include antimony trioxide and the like, and exhibit an excellent flame retardant effect when used in combination with a bromine-based compound.

  The release agent is not particularly limited, and various conventionally known waxes such as oxidized polyethylene wax can be used.

  Furthermore, when such a resin composition is used as a sealing material, corrosion of the metal due to ionic impurities occurs. Therefore, an ion exchanger can be added to suppress the occurrence of metal corrosion due to ionic impurities. It is done. Examples of such ion exchangers include inorganic hydrotalcite compounds and bismuth compounds.

  The epoxy resin composition for semiconductor encapsulation of the present invention can be produced, for example, as follows. That is, epoxy resin (component A), curing agent (component B), inorganic filler (component C) and specific silicone resin (component D) and, if necessary, curing accelerator, silane coupling agent, flame retardant, difficulty Other additives such as a combustion aid, pigment, mold release agent and the like are blended in a predetermined ratio. Subsequently, these are melt-kneaded in a heated state using a kneading machine such as a mixing roll machine, cooled to room temperature, pulverized by known means, and tableted into tablets as necessary. The target epoxy resin composition can be produced by the process.

  The sealing of the semiconductor element using such an epoxy resin composition is not particularly limited, and can be performed by a known molding method such as normal transfer molding.

  In the present invention, the semiconductor device obtained by sealing the semiconductor element using the resin composition for semiconductor sealing is not particularly limited, but is particularly useful in a small package. Specific examples of the small package in the present invention include a size of 3 mm × 3 mm × thickness of 1 mm or less and used for surface mounting. More specifically, the size is 2 mm × 2 mm × thickness. A thing around 0.9 mm is often used. Since it is difficult to remove burrs in these small packages, it is effective to use the resin composition for semiconductor encapsulation of the present invention. In other words, if the resin composition for semiconductor encapsulation of the present invention is used for resin encapsulation of a small semiconductor package having such a size, it is particularly effective for removing burrs, which has been difficult in the past.

  In addition, in the burr removal workability described above, for example, an oral jet water washer [Inter-plaque water jet (WJ6R)] for removing dental plaque was used, and the burr was removed with an oscillating water flow of 0.1 to 0.5 MPa. Removal evaluation can be performed.

  Next, examples will be described together with comparative examples. However, the present invention is not limited to these examples.

  Each component shown below was prepared.

〔Epoxy resin〕
o-Cresol novolac type epoxy resin (epoxy equivalent 198, softening point 55 ° C.)

[Brominated epoxy resin]
Bromine content 35% by weight, softening point 82 ° C

[Phenolic resin]
Phenol novolac resin (hydroxyl equivalent 105, softening point 71 ° C)

[Inorganic filler a]
Fused crushed silica powder (average particle size 6μm, maximum particle size 48μm)

[Inorganic filler b]
Fused spherical silica powder (average particle size 14μm, maximum particle size 64μm)

[Curing accelerator]
Triphenylphosphine

〔Silane coupling agent〕
γ-glycidoxypropyltrimethoxysilane

[Pigment]
Carbon black

[Flame retardant aid]
Antimony trioxide

〔Release agent〕
Oxidized polyethylene wax

[Silicone Resin A]
Alkoxy group-containing methylphenyl silicone resin [phenyl group: methyl group (weight ratio) = 3: 2, T (SiO _3/2 ): D (SiO _2/2 ) (weight ratio) = 3: 1]
In a four-necked flask equipped with a stirrer, thermometer, reflux condenser, and dropping funnel, 102.5 g (0.6 mol) of phenyltrimethoxysilane, 14.5 g of cyclic dimethylsiloxane (Si average number 4) (number of silicon atoms) 0.2 mol), trifluoromethanesulfonic acid (0.048 g) was added, heated to 70 ° C. with a mantle heater, and stirred for 4 hours. Next, the mantle heater was removed, the mixture was cooled to 50 ° C., and 10 g (0.55 mol) of water was added dropwise using a dropping funnel while stirring. Although the temperature rose due to the exothermic reaction, it was suppressed to 70 ° C. After completion of the dropwise addition, stirring was further continued for 1 hour, and then 0.09 g of calcium carbonate powder was added for neutralization of trifluoromethanesulfonic acid, followed by stirring, and the temperature was raised while gradually reducing the pressure to 120 ° C. with a mantle heater. The volatile matter was distilled off by maintaining for 15 minutes under conditions of a vacuum degree of 4.0 kPa and a liquid temperature of 120 ° C. Thereafter, the pressure is returned to normal pressure and normal temperature (0.1013 MPa, 25 ° C.), and the mixture is filtered with a filter paper. The alkoxy group-containing methyl is a liquid resin having a methoxy group content of 29% by weight and a viscosity of 40 mPa · s (25 ° C.). A phenyl silicone resin was obtained. The weight average molecular weight (Mw) of this silicone resin was 1900.

[Silicone Resin B]
Alkoxy group-containing phenyl silicone resin [manufactured by Shin-Etsu Chemical Co., Ltd., silicone alkoxy oligomer KR-217, phenyl group, methoxy group, alkoxy group content 25 wt%, viscosity 8 mPa · s (25 ° C.)]

[Silicone Resin C]
Alkoxy group-containing methyl / phenyl silicone resin [manufactured by Shin-Etsu Chemical Co., Ltd., silicone alkoxy oligomer KR-213, methyl group / phenyl group, methyl group / phenyl group (weight ratio) = 10/90 to 20/20, alkoxy group content 20 % By weight, viscosity 16 mPa · s (25 ° C.)]

[Silicone Resin D]
Alkoxy group-containing methyl silicone resin (Shin-Etsu Chemical Co., Ltd., silicone alkoxy oligomer KC-895, methyl group, methoxy group, alkoxy group content 45 wt%, viscosity 5 mPa · s (25 ° C.))

[Silicone Resin E]
Alkoxy group-containing aminomethyl silicone resin [manufactured by Shin-Etsu Chemical Co., Ltd., silicone alkoxy oligomer X-40-2651, amino group, methyl group, methoxy group, alkoxy group content 7 wt%, viscosity 20 mPa · s (25 ° C.)]

[Examples 1-6, Comparative Examples 1-3]
Each component shown above was mix | blended in the ratio shown in Table 1-Table 2 of the postscript, and it melt-kneaded for 5 minutes over the roll kneader heated to 80-120 degreeC. Next, the melted product which became solid after cooling was pulverized into powder. Next, the obtained powder was filled into a cylindrical mold and pressurized from both ends of the cylinder to prepare a columnar tablet-shaped epoxy resin composition.

  Using the tablet-like epoxy resin compositions of Examples and Comparative Examples thus obtained, the releasability and deburring property were measured and evaluated according to the following methods. The results are also shown in Tables 1 and 2 below.

(Releasability)
Using a low-pressure transfer molding machine without using a lead frame, 50 molded articles of 2 mm × 2 mm × thickness 0.7 mm were simultaneously produced at a molding temperature of 175 ° C., an injection pressure of 7 MPa, and a curing time of 120 seconds. Then, it was visually confirmed whether or not the molded product was lifted from the mold surface when the runner part of the low-pressure transfer molding machine was lifted. As a result, if everything is lifted from the mold surface or lift is confirmed, ◯, 2 or less will not float, and if it breaks at the gate and remains in the mold, △, 3 or more will not float When broken at the gate, it is indicated as x.

[Burr removal]
A lead frame was attached, and 50 molded articles of 2 mm × 2 mm × thickness 0.7 mm were simultaneously produced using a low pressure transfer molding machine at a molding temperature of 175 ° C., an injection pressure of 7 MPa, and a curing time of 120 seconds. And it removed from the metal mold | die and post-cured 175 degreeC x 5 hours. Next, on the lead frame of the molded product, burr is removed with a water flow of 0.6 MPa using an oral jet water washer for dental plaque removal (US Conair, Inter Plaque Water Jet (WJ6R)). Worked. As a result, the burrs were removed and the burrs were not confirmed as ◯, the burrs were removed and not confirmed, but the burrs were removed from the package where the recess was formed, and the burrs were not removed. Was displayed as x.

  From the above results, the example product using the silicone resin in which the alkoxy group content falls within a specific range gave better results than the comparative example in terms of burr removal as well as releasability.

  On the other hand, among the comparative example products using the silicone resin whose alkoxy group content is outside the specific range, the comparative example 1 product using the silicone resin whose alkoxy group content is 45% by weight is related to releasability. Although there was no problem, the deburring property was inferior because of the high alkoxy group content and the improved adhesion between the lead frame and the inorganic filler in the sealing material. In addition, Comparative Example 2 using a silicone resin having an alkoxy group content of 7% by weight had no problem with burr removal, but the silicone resin oozes out and becomes liquid and sticks to the mold surface. The result was inferior to releasability. Furthermore, although the comparative example 3 product which did not mix | blend a silicone resin did not have a problem regarding mold release property, naturally, it resulted in inferior burr removal property.

Claims (2)

The resin composition for semiconductor sealing containing the following (D) component with the following (A)-(C) component.
(A) Epoxy resin.
(B) Phenolic resin.
(C) Inorganic filler.
(D) A silicone resin containing 10 to 30% by weight of the total silicone resin containing an alkoxy group directly bonded to silicon.   A semiconductor device formed by sealing a semiconductor element using the resin composition for sealing a semiconductor according to claim 1.