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JP2009267114A - Laminated piezoelectric ceramic element and manufacturing method of the same - Google Patents

Laminated piezoelectric ceramic element and manufacturing method of the same Download PDF

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JP2009267114A
JP2009267114A JP2008115546A JP2008115546A JP2009267114A JP 2009267114 A JP2009267114 A JP 2009267114A JP 2008115546 A JP2008115546 A JP 2008115546A JP 2008115546 A JP2008115546 A JP 2008115546A JP 2009267114 A JP2009267114 A JP 2009267114A
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JP5283161B2 (en
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Takayuki Inoue
崇行 井上
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Tokin Corp
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Abstract

【課題】製造が容易で、高湿度環境下においても絶縁抵抗が劣化しない、信頼性に優れた積層型圧電セラミックス素子およびその製造方法を提供する。
【解決手段】複数の圧電セラミックス層と複数の内部電極層とを交互に積層し一体化した積層体4を備え、前記内部電極層が対向電極となり、前記積層体4の側面に露出した前記内部電極層が一層おきに絶縁部で被覆され、前記絶縁部を覆い前記内部電極層と電気的に接続する一対の外部電極5が形成され、前記外部電極5は表面に露出した構造の積層型圧電セラミックス素子1であって、前記積層体4の側面及び角部に外装樹脂層8が形成される。
【選択図】図1
An object of the present invention is to provide a multilayer piezoelectric ceramic element that is easy to manufacture, has excellent insulation resistance and does not deteriorate even in a high humidity environment, and a method for manufacturing the same.
A laminate 4 in which a plurality of piezoelectric ceramic layers and a plurality of internal electrode layers are alternately laminated and integrated is provided, and the internal electrode layer serves as a counter electrode and is exposed to a side surface of the laminate 4. Every other electrode layer is covered with an insulating portion, a pair of external electrodes 5 are formed to cover the insulating portion and to be electrically connected to the internal electrode layer, and the external electrodes 5 are exposed on the surface. In the ceramic element 1, an exterior resin layer 8 is formed on the side surfaces and corners of the laminate 4.
[Selection] Figure 1

Description

本発明は、積層型圧電センサや、積層型圧電アクチュエータ等に用いられる積層型圧電セラミックス素子およびその製造方法に関するものである。   The present invention relates to a laminated piezoelectric ceramic element used for a laminated piezoelectric sensor, a laminated piezoelectric actuator, and the like, and a method for manufacturing the same.

従来、外部からの応力で電圧を発生したり、電圧の印加により変位や力を発生したりする圧電セラミックス素子は、圧力センサや圧電アクチュエータ等に実用化されてきた。また、近年、センサの感度向上やアクチュエータの変位特性向上のため、積層型圧電セラミックス素子の普及が著しい。   Conventionally, piezoelectric ceramic elements that generate voltage by external stress or generate displacement or force by applying voltage have been put to practical use in pressure sensors, piezoelectric actuators, and the like. In recent years, multilayer piezoelectric ceramic elements have become widespread in order to improve sensor sensitivity and actuator displacement characteristics.

図9は、従来の積層型圧電セラミックス素子を示す図で、図9(a)は、従来の積層型圧電セラミックス素子の上面図で、図9(b)は、従来の積層型圧電セラミックス素子の斜視図である。図9に示すように、従来の積層型圧電セラミックス素子1は、複数の圧電セラミックス層2と複数の内部電極層3を交互に積層した積層体4を構成している。内部電極層3は圧電セラミックス層2の全面に配置されているため、積層体4の側面には、内部電極層3の端面が露出している。積層体4の一対の対向面には、露出した内部電極層3を一層おきに絶縁樹脂等によって被覆する絶縁部6が設けられている。この絶縁部6を覆うように、内部電極層3と電気的に接続する一対の外部電極5が形成されている。外部電極5の適所には、外部機器と電気的に接続するためのリード線等(図示せず)が半田付けや導電性接着剤で接合される。さらに、絶縁部6と、外部電極5が形成されていないもう一対の対向面には、外装樹脂層8cが形成される構造となっている。   FIG. 9 is a diagram showing a conventional multilayer piezoelectric ceramic element, FIG. 9A is a top view of the conventional multilayer piezoelectric ceramic element, and FIG. 9B is a diagram of the conventional multilayer piezoelectric ceramic element. It is a perspective view. As shown in FIG. 9, the conventional multilayer piezoelectric ceramic element 1 constitutes a multilayer body 4 in which a plurality of piezoelectric ceramic layers 2 and a plurality of internal electrode layers 3 are alternately laminated. Since the internal electrode layer 3 is disposed on the entire surface of the piezoelectric ceramic layer 2, the end surface of the internal electrode layer 3 is exposed on the side surface of the multilayer body 4. On the pair of opposing surfaces of the laminate 4, insulating portions 6 are provided that cover the exposed internal electrode layer 3 every other layer with an insulating resin or the like. A pair of external electrodes 5 electrically connected to the internal electrode layer 3 is formed so as to cover the insulating portion 6. A lead wire or the like (not shown) for electrical connection with an external device is joined to an appropriate position of the external electrode 5 by soldering or a conductive adhesive. Further, an exterior resin layer 8c is formed on the other opposing surface where the insulating portion 6 and the external electrode 5 are not formed.

図10は、従来の積層型圧電セラミックス素子の角部の上面拡大図である。外装樹脂層8cは、耐湿度性と外部応力からの保護が主な目的であり、湿度や外力による特性劣化、破壊等が発生しないことを要件としていた。また、この外装樹脂層8cは、積層体の内部電極層3の露出した側面に、外装樹脂ペーストをディスペンサーや、スクリーン印刷等で塗布し形成するのが一般的である。しかし、このような塗布方法では、外装樹脂ペーストが表面張力により流れることや、熱硬化時の収縮、更には、外装樹脂内の気泡、塗布工程での気泡の巻き込み等が原因で、図10に示すように、積層体の角部において、外装樹脂層8cの厚さが極端に薄くなる、または外層樹脂層8cが無く、内部電極層3が露出するという問題があった。   FIG. 10 is an enlarged top view of a corner portion of a conventional multilayer piezoelectric ceramic element. The exterior resin layer 8c is mainly intended to protect against moisture resistance and external stress, and is required to prevent characteristic deterioration and destruction due to humidity and external force. Further, the exterior resin layer 8c is generally formed by applying an exterior resin paste to the exposed side surface of the internal electrode layer 3 of the laminate by a dispenser, screen printing, or the like. However, in such a coating method, the exterior resin paste flows due to surface tension, shrinks during thermosetting, and further, due to bubbles in the exterior resin, entrainment of bubbles in the coating process, etc. As shown, the outer resin layer 8c is extremely thin at the corners of the laminate, or the outer resin layer 8c is absent and the internal electrode layer 3 is exposed.

一方、近年、積層型圧電アクチュエータは、小型で、かつ大きな変位量を必要とする用途が更に拡大している。用途の拡大に伴い、積層型圧電セラミックス素子は、高湿度環境下での使用や、外部電極にリード線やフレキシブルケーブルを半田付けまたは導電性接着剤で接合して使用することが増加してきている。このように使用する場合には、積層型圧電セラミックス素子の角部に、半田または導電性接着剤が回りこむことによる、積層型圧電セラミックス素子の絶縁抵抗等の圧電特性や信頼性の劣化の対策が必要だった。   On the other hand, in recent years, multilayer piezoelectric actuators have been further expanded in applications that are small and require a large amount of displacement. With the expansion of applications, multilayer piezoelectric ceramic elements are increasingly used in high-humidity environments and are used by soldering lead wires or flexible cables to external electrodes or joining them with conductive adhesives. . When used in this way, countermeasures against degradation of piezoelectric properties such as insulation resistance and reliability of multilayer piezoelectric ceramic elements due to solder or conductive adhesive wrapping around corners of multilayer piezoelectric ceramic elements Was necessary.

一般的に、絶縁抵抗等の圧電特性や信頼性が劣化する原因は、高湿度環境下で積層型圧電セラミックス素子に電圧を印加すると、内部電極、外部電極、半田、導電性接着剤に含まれる金属イオン(銀イオン)が、負極から正極に移動して電気的短絡に至る、所謂シルバーマイグレーションを発生することである。   In general, the cause of deterioration in piezoelectric properties and reliability such as insulation resistance is included in internal electrodes, external electrodes, solder, and conductive adhesives when a voltage is applied to a laminated piezoelectric ceramic element in a high humidity environment. That is, metal ions (silver ions) move from the negative electrode to the positive electrode to cause an electrical short circuit, so-called silver migration.

上述した問題を改善するために、特許文献1では、積層圧電アクチュエータにおいて、外部電極にリード線を接続した後、外部電極の形成面を含む積層体の全周面に外装を施し、さらに積層体の角部には、電着法により絶縁層を形成する構造が提案されている。この構造によって、高湿度環境下においても絶縁抵抗が劣化しない耐湿性に優れた積層型圧電セラミックス素子の提供が可能となった。   In order to improve the above-described problem, in Patent Document 1, in a multilayer piezoelectric actuator, after connecting a lead wire to an external electrode, an outer periphery is applied to the entire peripheral surface of the multilayer body including the surface on which the external electrode is formed. A structure has been proposed in which an insulating layer is formed by an electrodeposition method at the corner. With this structure, it has become possible to provide a laminated piezoelectric ceramic element having excellent moisture resistance that does not deteriorate the insulation resistance even in a high humidity environment.

特開2003−347621公報JP 2003-347621 A

現在、リード線が接続された状態の積層型圧電セラミックス素子の他に、リード線等が接続されていない状態で製品となるリードレスの積層型圧電セラミック素子の需要が増加してきている。リードレスの積層型圧電セラミックス素子は、最終工程または客先で、外部電極とリード線やフレキシブルケーブル等の外部端子との接続を行うため、外部電極は表面に露出させておく必要がある。更に、外部電極の露出した部分には外装樹脂を付着させず、表面に露出させた状態にし、内部電極が露出している側面にのみ、外装樹脂層を形成することが必要である。   Currently, in addition to the multilayer piezoelectric ceramic element in which the lead wire is connected, the demand for a leadless multilayer piezoelectric ceramic element which is a product in a state in which the lead wire or the like is not connected is increasing. In the leadless multilayer piezoelectric ceramic element, the external electrode needs to be exposed on the surface in order to connect the external electrode to an external terminal such as a lead wire or a flexible cable in the final process or at the customer. Further, it is necessary that the exterior resin is not attached to the exposed portion of the external electrode, but is exposed on the surface, and the exterior resin layer is formed only on the side surface where the internal electrode is exposed.

従来技術の電着法による積層体の角部の外装は、積層型圧電セラミックス素子を電着液に浸漬し、電気的に外装樹脂を付着させる方法である。この方法では、リード線のある積層型圧電セラミックス素子には、製造が可能であるが、リードレスの積層型圧電セラミックス素子では、外部電極にも外装樹脂が付着してしまうため、製造が非常に困難であった。   The exterior of the corner portion of the laminated body by the electrodeposition method of the prior art is a method in which a laminated piezoelectric ceramic element is immersed in an electrodeposition liquid to electrically attach an exterior resin. In this method, it is possible to manufacture a laminated piezoelectric ceramic element having a lead wire, but in a leadless laminated piezoelectric ceramic element, the exterior resin adheres to the external electrode, so that the production is very difficult. It was difficult.

そこで、本発明が解決しようとする課題は、上記の場合においても製造が容易で、高湿度環境下においても絶縁抵抗が劣化しない、信頼性に優れた積層型圧電セラミックス素子とその製造方法を提供することである。   Therefore, the problem to be solved by the present invention is to provide a multilayer piezoelectric ceramic element excellent in reliability, which is easy to manufacture even in the above-described case, and does not deteriorate the insulation resistance even in a high humidity environment, and a method for manufacturing the same. It is to be.

上記課題を解決するため、本発明によると、複数の圧電セラミックス層と複数の内部電極層とを交互に積層し一体化した積層体を備え、前記内部電極層が対向電極となり、前記積層体の側面に露出した前記内部電極層が一層おきに絶縁部で被覆され、前記絶縁部を覆い前記内部電極層と電気的に接続する一対の外部電極が形成され、前記外部電極は、外部機器と電気的に接続される外部端子接続部を有し、前記外部端子接続部となる外部電極は表面に露出している積層型圧電セラミックス素子であって、露出した前記外部電極の形成部分を除く前記積層体の側面及び角部に外装樹脂層が形成されていることを特徴とする積層型圧電セラミックス素子が得られる。   In order to solve the above-described problem, according to the present invention, a laminated body in which a plurality of piezoelectric ceramic layers and a plurality of internal electrode layers are alternately stacked and integrated is provided, and the internal electrode layer serves as a counter electrode. The internal electrode layer exposed on the side surface is covered with an insulating portion every other layer, and a pair of external electrodes are formed to cover the insulating portion and to be electrically connected to the internal electrode layer. The external electrode is electrically connected to an external device. The external electrode connecting portion is connected to the external electrode, and the external electrode serving as the external terminal connecting portion is a multilayer piezoelectric ceramic element exposed on the surface, and the laminated layer excluding the exposed external electrode forming portion A laminated piezoelectric ceramic element having an exterior resin layer formed on the side and corners of the body is obtained.

また、本発明によると、前記外装樹脂層は、フッ素系樹脂、エポキシ系樹脂、シリコン系樹脂から選ばれるいずれかを含むことを特徴とする積層型圧電セラミックス素子が得られる。   In addition, according to the present invention, there can be obtained a laminated piezoelectric ceramic element characterized in that the exterior resin layer contains any one selected from a fluorine resin, an epoxy resin, and a silicon resin.

また、本発明によると、前記外装樹脂層の厚さは、10μm以上、200μm以下であることを特徴とする積層型圧電セラミックス素子が得られる。   According to the present invention, there can be obtained a multilayer piezoelectric ceramic element characterized in that the thickness of the exterior resin layer is 10 μm or more and 200 μm or less.

また、本発明によると、複数の圧電セラミックス層と複数の内部電極層とを交互に積層し一体化した積層体を備え、前記内部電極層を対向電極とし、前記積層体の側面に露出した前記内部電極層を一層おきに絶縁部で被覆し、前記絶縁部を覆い前記内部電極層と電気的に接続する一対の外部電極を形成し、前記外部電極は、外部機器と電気的に接続される外部端子接続部を有し、前記外部端子接続部となる外部電極を表面に露出させる積層型圧電セラミックス素子の製造方法であって、露出させる前記外部電極の形成部分を除く前記積層体の側面及び角部に外装樹脂層を形成することを特徴とする積層型圧電セラミックス素子の製造方法が得られる。   In addition, according to the present invention, it is provided with a laminated body in which a plurality of piezoelectric ceramic layers and a plurality of internal electrode layers are alternately laminated and integrated, the internal electrode layer serving as a counter electrode, and exposed on the side surface of the laminated body Every other internal electrode layer is covered with an insulating portion, and a pair of external electrodes are formed to cover the insulating portion and to be electrically connected to the internal electrode layer, and the external electrodes are electrically connected to an external device. A method of manufacturing a laminated piezoelectric ceramic element having an external terminal connecting portion and exposing an external electrode serving as the external terminal connecting portion on the surface, the side surface of the laminate excluding the exposed portion of the external electrode, and A method for manufacturing a laminated piezoelectric ceramic element, characterized in that an exterior resin layer is formed at a corner, is obtained.

また、本発明によると、複数の圧電セラミックス層と複数の内部電極層とを交互に積層し一体化した前駆体素子を所定の寸法に切断して形成される積層体を備え、前記内部電極層を対向電極とし、前記前駆体素子の側面に露出した前記内部電極層を一層おきに絶縁部で被覆し、前記絶縁部を覆い前記内部電極層と電気的に接続する対の外部電極を形成し、前記前駆体素子を切断して前記積層体を形成し、前記外部電極は、外部機器と電気的に接続される外部端子接続部を有し、前記外部端子接続部となる外部電極を表面に露出させる積層型圧電セラミックス素子の製造方法であって、露出させる前記外部電極の形成部分を除く前記積層体の側面及び角部に外装樹脂層を形成することを特徴とする積層型圧電セラミックス素子の製造方法が得られる。   According to the present invention, there is further provided a laminate formed by cutting a predetermined number of precursor elements obtained by alternately laminating and integrating a plurality of piezoelectric ceramic layers and a plurality of internal electrode layers, the internal electrode layer Is formed as a counter electrode, and the internal electrode layer exposed on the side surface of the precursor element is covered with an insulating portion every other layer to cover the insulating portion and form a pair of external electrodes that are electrically connected to the internal electrode layer. The precursor element is cut to form the laminate, and the external electrode has an external terminal connection portion that is electrically connected to an external device, and the external electrode serving as the external terminal connection portion is provided on the surface. A method of manufacturing a laminated piezoelectric ceramic element to be exposed, wherein an exterior resin layer is formed on a side surface and a corner of the laminated body excluding the exposed formation portion of the external electrode. Manufacturing method obtained That.

また、本発明によると、前記積層型圧電セラミックス素子の前駆体素子の側面に形成した外部電極の両側に第1の外装樹脂層を形成した後、前記前駆体素子を切断して前記積層体を形成し、前記前駆体素子の切断面に第2の外装樹脂層を形成することを特徴とする積層型圧電セラミックス素子の製造方法が得られる。   According to the present invention, the first exterior resin layer is formed on both sides of the external electrode formed on the side surface of the precursor element of the multilayer piezoelectric ceramic element, and then the precursor element is cut to form the laminate. And forming a second exterior resin layer on the cut surface of the precursor element to obtain a method for producing a laminated piezoelectric ceramic element.

また、本発明によると、前記外装樹脂層の厚さは、10μm以上、200μm以下とすることを特徴とする積層型圧電セラミックス素子の製造方法が得られる。   In addition, according to the present invention, there can be obtained a method for producing a multilayer piezoelectric ceramic element, wherein the thickness of the exterior resin layer is 10 μm or more and 200 μm or less.

本発明は、外部電極が表面に露出している積層型圧電セラミックス素子において、外装樹脂層を、積層体に形成された外部電極の両側、角部および内部電極が露出した側面に形成し、角部の外装樹脂層の厚さを確保する構造である。この構造を採用することにより、半田や導電性接着剤が積層圧電セラミックス素子の角部に回りこんでも、絶縁抵抗が劣化しにくい、信頼性に優れた積層型圧電セラミックス素子を提供することができる。また、外部電極が表面に露出しているため、リード線の接続された従来の積層型圧電セラミックス素子だけでなく、リードレスの積層型圧電セラミックス素子も容易な製造方法で提供することが可能となる。   The present invention provides a laminated piezoelectric ceramic element in which external electrodes are exposed on the surface, and an exterior resin layer is formed on both sides of the external electrode formed on the laminate, the corners, and the side surfaces where the internal electrodes are exposed. This is a structure that secures the thickness of the exterior resin layer. By adopting this structure, it is possible to provide a highly reliable multilayer piezoelectric ceramic element in which the insulation resistance hardly deteriorates even when solder or conductive adhesive wraps around the corner of the multilayer piezoelectric ceramic element. . In addition, since the external electrodes are exposed on the surface, not only conventional multilayer piezoelectric ceramic elements connected with lead wires but also leadless multilayer piezoelectric ceramic elements can be provided by an easy manufacturing method. Become.

本発明の実施の形態について、図面を参照して説明する。図1は、本発明の積層型圧電セラミックス素子を示す図で、図1(a)は、本発明の積層型圧電セラミックス素子の上面図で、図1(b)は、本発明の積層型圧電セラミックス素子の斜視図である。また、図2は、本発明の積層型圧電セラミックス素子の外装前の状態を示す図である。   Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a multilayer piezoelectric ceramic element of the present invention, FIG. 1 (a) is a top view of the multilayer piezoelectric ceramic element of the present invention, and FIG. 1 (b) is a multilayer piezoelectric ceramic element of the present invention. It is a perspective view of a ceramic element. FIG. 2 is a view showing a state before the exterior of the multilayer piezoelectric ceramic element of the present invention.

図1、図2に示すように、本発明の積層型圧電セラミックス素子1は、複数の圧電セラミックス層2と複数の内部電極層3を交互に積層した積層体4を備えている。内部電極層3は圧電セラミックス層2の全面に配置されているため、積層体4の側面には、内部電極層3の端面が露出している。積層体4の一対の対向面には、露出した内部電極層3を一層おきに絶縁樹脂等によって被覆する絶縁部6が設けられている。この絶縁部6を覆うように、内部電極層3と電気的に接続する一対の外部電極5が形成されている。積層体4に形成された外部電極5の両側には、第1の外装樹脂層8aが形成され、内部電極層3が露出しているもう一対の対向面には、第2の外装樹脂層8bが形成されている。外部電極5は表面に露出しており、外部電極5の適所には、用途に応じて、リード線やフレキシブルケーブル等が接合され、外部機器との電気的な接続がなされる構造となっている。   As shown in FIGS. 1 and 2, the multilayer piezoelectric ceramic element 1 of the present invention includes a multilayer body 4 in which a plurality of piezoelectric ceramic layers 2 and a plurality of internal electrode layers 3 are alternately stacked. Since the internal electrode layer 3 is disposed on the entire surface of the piezoelectric ceramic layer 2, the end surface of the internal electrode layer 3 is exposed on the side surface of the multilayer body 4. On the pair of opposing surfaces of the laminate 4, insulating portions 6 are provided that cover the exposed internal electrode layer 3 every other layer with an insulating resin or the like. A pair of external electrodes 5 electrically connected to the internal electrode layer 3 is formed so as to cover the insulating portion 6. A first exterior resin layer 8a is formed on both sides of the external electrode 5 formed in the laminate 4, and a second exterior resin layer 8b is formed on the other pair of opposing surfaces where the internal electrode layer 3 is exposed. Is formed. The external electrode 5 is exposed on the surface, and a lead wire, a flexible cable, or the like is joined to an appropriate place of the external electrode 5 according to the application, and an electrical connection with an external device is made. .

積層型圧電セラミックス素子1は、分極処理が施されており、電圧を印加すると、圧電セラミックス層2は、内部電極層3間の距離にかかる電界強度に応じて、図2の変位方向7a−7b方向に伸び、その伸び量は電界強度に比例して増加する。   The laminated piezoelectric ceramic element 1 is subjected to polarization treatment, and when a voltage is applied, the piezoelectric ceramic layer 2 has a displacement direction 7a-7b shown in FIG. 2 according to the electric field strength applied to the distance between the internal electrode layers 3. The amount of elongation increases in proportion to the electric field strength.

次に、本発明の積層型圧電セラミックス素子の製造方法について、図面を参照して説明する。図3は、本発明の積層型圧電セラミックス素子の前駆体素子の一部を示す図である。圧電セラミックス材料から作製されたグリーンシートと、このグリーンシート上に電極ペーストを印刷形成した電極ペースト層とを所定の枚数に積層し、熱プレス後、1000℃〜1300℃の範囲で焼結し前駆体素子9を作製する。焼結後の前駆体素子9において、焼結前のグリーンシート層が圧電セラミックス層2、電極ペースト層が内部電極層3となる。前駆体素子9は、所定の寸法で切断されて積層体4になる。図3は、前駆体素子9の一部のみを示したが、前駆体素子9は、切断して積層体4を複数個とれるように、ある程度、横長のほうが生産性が高く望ましい。   Next, a method for manufacturing the multilayer piezoelectric ceramic element of the present invention will be described with reference to the drawings. FIG. 3 is a view showing a part of the precursor element of the multilayer piezoelectric ceramic element of the present invention. A green sheet made of a piezoelectric ceramic material and an electrode paste layer formed by printing an electrode paste on the green sheet are laminated in a predetermined number, and after hot pressing, sintered in a range of 1000 ° C. to 1300 ° C. to be a precursor The body element 9 is produced. In the precursor element 9 after sintering, the green sheet layer before sintering becomes the piezoelectric ceramic layer 2 and the electrode paste layer becomes the internal electrode layer 3. The precursor element 9 is cut into a laminate 4 by being cut to a predetermined size. Although FIG. 3 shows only a part of the precursor element 9, it is preferable that the precursor element 9 is horizontally long to have a certain degree of productivity so that a plurality of laminated bodies 4 can be cut.

圧電セラミックス層2に使用される材料としては、圧電定数が高い値を示す材料を使用するのが好ましく、例えば、ニッケルニオブ酸鉛やチタン酸ジルコン酸鉛を主成分とする圧電セラミック粉末が使用される。また、内部電極層3に使用される材料としては、Cu、Ag、Pdや、これらの合金からなる電極ペーストが好適に使用できる。   As a material used for the piezoelectric ceramic layer 2, it is preferable to use a material having a high piezoelectric constant. For example, piezoelectric ceramic powder mainly composed of lead nickel niobate or lead zirconate titanate is used. The Moreover, as a material used for the internal electrode layer 3, electrode paste which consists of Cu, Ag, Pd, or these alloys can be used conveniently.

次に、前駆体素子9の側面に露出した内部電極層3に、絶縁部6を一層おきに電気泳動法等の方法により絶縁物を付着させて、焼き付けすることにより形成する。さらに、絶縁部6を覆って一層おきに内部電極層3と導通するように、積層体4に対して一対の外部電極5が形成される。   Next, the insulating part 6 is formed on the internal electrode layer 3 exposed on the side surface of the precursor element 9 by depositing an insulating material every other layer by a method such as electrophoresis, and baking it. Further, a pair of external electrodes 5 are formed on the stacked body 4 so as to cover the insulating portion 6 and to be electrically connected to the internal electrode layer 3 every other layer.

絶縁部6は、無機酸化物、特にSiO2を主成分とする無機酸化物が好適に使用でき、絶縁樹脂であっても良い。また、外部電極5に使用される材料としては、Ag、Au、Niやこれらの合金からなる電極ペーストが好適に用いられる。また、外部電極5の形成は、スクリーン印刷、スパッタ、蒸着等の方法が好適に用いられる。 Insulating portion 6, an inorganic oxide, in particular can inorganic oxide preferably used whose main component is SiO 2, it may be an insulating resin. Moreover, as a material used for the external electrode 5, an electrode paste made of Ag, Au, Ni, or an alloy thereof is preferably used. The external electrode 5 is preferably formed by a method such as screen printing, sputtering, or vapor deposition.

図4は、本発明の積層型圧電セラミックス素子の前駆体素子に第1の外装樹脂層を形成した状態を示す図である。また、図5は、本発明の積層型圧電セラミックス素子の前駆体素子を切断加工した状態を示す図である。絶縁部6と外部電極5が形成された前駆体素子9において、外部電極5の両側に、ディスペンサーまたはスクリーン印刷により、外装樹脂ペーストを塗布、硬化させ、第1の外装樹脂層8aを形成する。その後、図4の切断位置10a、10bをダイヤモンドブレード等を用いて、所定の寸法に切断加工し、図5の積層体4を作製する。このように切断した切断面には、内部電極層3が露出した構造となっている。   FIG. 4 is a view showing a state in which the first exterior resin layer is formed on the precursor element of the multilayer piezoelectric ceramic element of the present invention. FIG. 5 is a view showing a state in which the precursor element of the multilayer piezoelectric ceramic element of the present invention is cut. In the precursor element 9 in which the insulating portion 6 and the external electrode 5 are formed, an exterior resin paste is applied and cured on both sides of the external electrode 5 by dispenser or screen printing to form a first exterior resin layer 8a. Thereafter, the cutting positions 10a and 10b in FIG. 4 are cut into predetermined dimensions using a diamond blade or the like, and the laminate 4 in FIG. 5 is manufactured. The internal electrode layer 3 is exposed on the cut surface thus cut.

図6は、本発明の積層型圧電セラミックス素子の積層体に第2の外装樹脂層を形成した状態を示す図で、図6(a)は、本発明の積層型圧電セラミックス素子の斜視図で、図6(b)は、本発明の積層型圧電セラミックス素子の角部の上面拡大図である。第1の外装樹脂層8aを形成し、切断加工した積層体4の内部電極層3が露出した切断面に、ディスペンサーまたはスクリーン印刷により、外装樹脂ペーストを塗布、硬化させ、第2の外装樹脂層8bを形成する。以上の製造方法を採用することにより、図6(b)に示すように、外部電極5の両側に形成した第1の外装樹脂層8aの厚みの分も、第2の外装樹脂層8bを形成することが出来る。このため、積層型圧電セラミック素子の角部の厚さが安定して確保でき、角部の厚さが極端に薄くなることや露出することが無くなる。   FIG. 6 is a diagram showing a state in which the second exterior resin layer is formed on the multilayer body of the multilayer piezoelectric ceramic element of the present invention, and FIG. 6A is a perspective view of the multilayer piezoelectric ceramic element of the present invention. FIG. 6B is an enlarged top view of a corner portion of the multilayer piezoelectric ceramic element of the present invention. The exterior resin paste is applied and cured by a dispenser or screen printing on the cut surface where the internal electrode layer 3 of the laminated body 4 that has been cut and processed is formed by forming the first exterior resin layer 8a, and the second exterior resin layer 8b is formed. By adopting the above manufacturing method, as shown in FIG. 6B, the second exterior resin layer 8b is also formed by the thickness of the first exterior resin layer 8a formed on both sides of the external electrode 5. I can do it. For this reason, the thickness of the corner portion of the multilayer piezoelectric ceramic element can be secured stably, and the thickness of the corner portion can be prevented from becoming extremely thin or exposed.

第1の外装樹脂層8a、第2の外装樹脂層8bに使用される材質としては、耐湿度性の良い樹脂が望ましく、フッ素系樹脂、エポキシ系樹脂、シリコン系樹脂等が挙げられるが、これらに限定されるものではない。また、第1の外装樹脂層8aと第2の外装樹脂層8bは、異なる材質を用いてもよいし、これらの樹脂を複数組み合わせて、多層構造としてもよい。   The material used for the first exterior resin layer 8a and the second exterior resin layer 8b is preferably a resin with good moisture resistance, and examples thereof include fluorine resin, epoxy resin, and silicon resin. It is not limited to. Further, the first exterior resin layer 8a and the second exterior resin layer 8b may be made of different materials, or a plurality of these resins may be combined to form a multilayer structure.

本発明の積層型圧電セラミック素子について、実施例を挙げて具体的に説明する。   The multilayer piezoelectric ceramic element of the present invention will be specifically described with reference to examples.

(実施例1)
まず、ジルコン酸チタン酸鉛とニッケルニオブ酸鉛とを主成分とする圧電セラミックス粉末を使用し、バインダーと共に有機溶剤中で分散混合させ、スラリーを作製した。このスラリーをドクターブレード法にて成膜し、厚さ50μmのグリーンシートを作製した。グリーンシート上にAg/Pdからなる電極ペーストを厚さ5μmにスクリーン印刷し、乾燥させた。次に、電極ペーストが印刷されたグリーンシートを積層し、熱プレス後、1100℃で焼成した。焼成された前駆体素子9をガラス粉末が分散された浴槽内に浸漬させ、電気泳動法により、前駆体素子9の対向する一対の側面の内部電極層3が露出した箇所に、一層おきに絶縁部6を形成した。その後、前駆体素子9の対向する側面の絶縁部6を覆うように、Agからなる電極ペーストをスクリーン印刷により、5μmの厚さに塗布し、500℃で焼き付けし、外部電極5を形成した。前述した製造方法で、図3に示す、高さ3mm、横方向長さ2mm、縦方向長さ1.2mmの前駆体素子9を作製した。このとき、前駆体素子9の横方向長さは、量産上、製造し易い寸法にすることができ、一定の間隔で外部電極5を形成し、後述する第1の外装樹脂層8aの形成後、所定の位置で切断加工し、複数個の積層体4を製造することができる。
Example 1
First, a piezoelectric ceramic powder mainly composed of lead zirconate titanate and lead nickel niobate was used and dispersed and mixed in an organic solvent together with a binder to prepare a slurry. This slurry was formed into a film by a doctor blade method to produce a green sheet having a thickness of 50 μm. An electrode paste made of Ag / Pd was screen-printed on a green sheet to a thickness of 5 μm and dried. Next, the green sheet on which the electrode paste was printed was laminated, fired at 1100 ° C. after hot pressing. The fired precursor element 9 is immersed in a bath in which glass powder is dispersed, and insulation is performed every other layer at a location where the internal electrode layers 3 on the pair of side surfaces facing the precursor element 9 are exposed by electrophoresis. Part 6 was formed. Thereafter, an electrode paste made of Ag was applied to a thickness of 5 μm by screen printing so as to cover the insulating portion 6 on the opposite side surface of the precursor element 9, and baked at 500 ° C. to form the external electrode 5. The precursor element 9 having a height of 3 mm, a lateral length of 2 mm, and a longitudinal length of 1.2 mm shown in FIG. 3 was produced by the manufacturing method described above. At this time, the length in the lateral direction of the precursor element 9 can be set to a size that is easy to manufacture in mass production. After the external electrodes 5 are formed at regular intervals and a first exterior resin layer 8a described later is formed. A plurality of laminated bodies 4 can be manufactured by cutting at a predetermined position.

前駆体素子9の外部電極5の両側に、外装樹脂ペーストをスクリーン印刷、硬化し、図4に示すように、第1の外装樹脂層8aを形成した。外装樹脂ペーストは、フッ素系樹脂、エポキシ系樹脂、シリコン系樹脂を用いてそれぞれ作製した。外装樹脂ペーストの硬化条件は、150℃、1時間とし、硬化後の厚さ、即ち第1の外装樹脂層8aの厚さが20μmとなるように調整した。   The exterior resin paste was screen printed and cured on both sides of the external electrode 5 of the precursor element 9 to form the first exterior resin layer 8a as shown in FIG. The exterior resin paste was prepared using a fluorine resin, an epoxy resin, and a silicon resin, respectively. The curing condition of the exterior resin paste was 150 ° C. for 1 hour, and the thickness after curing, that is, the thickness of the first exterior resin layer 8a was adjusted to 20 μm.

次に、前駆体素子9を、図5に示すように、横方向長さが1.2mmになるように、ダイヤモンドブレードにて切断加工し、積層体4を作成した。従って、積層体4の寸法は高さ3mm、縦横長さ1.2mmの角柱状となる。   Next, as shown in FIG. 5, the precursor element 9 was cut with a diamond blade so as to have a lateral length of 1.2 mm, so that a laminate 4 was formed. Accordingly, the laminate 4 has a prismatic shape with a height of 3 mm and a length and width of 1.2 mm.

さらに、内部電極層3が露出している切断面に、外装樹脂ペーストをスクリーン印刷、硬化し、図6に示すように、第2の外装樹脂層8bを形成し、本発明の積層型圧電セラミックス素子1を作製した。外装樹脂ペーストは、フッ素系樹脂、エポキシ系樹脂、シリコン系樹脂を用いて、それぞれ作製した。外装樹脂ペーストの硬化条件は、150℃、1時間とし、硬化後の厚さ、即ち第2の外装樹脂層8bの厚さが20μmとなるように調整した。なお、本実施例では、第1の外装樹脂層8aと第2の外装樹脂層8bに使用する外装樹脂ペーストは同一のものを使用した。   Further, the exterior resin paste is screen-printed and cured on the cut surface where the internal electrode layer 3 is exposed to form a second exterior resin layer 8b as shown in FIG. Element 1 was produced. The exterior resin paste was prepared using a fluorine resin, an epoxy resin, and a silicon resin, respectively. The curing condition of the exterior resin paste was 150 ° C. for 1 hour, and the thickness after curing, that is, the thickness of the second exterior resin layer 8b was adjusted to 20 μm. In this example, the same exterior resin paste was used for the first exterior resin layer 8a and the second exterior resin layer 8b.

(比較例1)
比較例として、図9に示す、従来の積層型圧電セラミックス素子を作製した。積層体4を構成する材料と製造方法は、本発明の実施例と同様としたので、説明を省略する。積層体4は、高さ3mm、縦横長さ1.2mmの角柱状とした。この積層体4の内部電極層3が露出した一対の側面にのみ、外装樹脂ペーストをスクリーン印刷、硬化し、外装樹脂層8cを20μmの厚さで形成した。外装樹脂ペーストは、エポキシ系樹脂を使用し、硬化条件は150℃、1時間とした。
(Comparative Example 1)
As a comparative example, a conventional multilayer piezoelectric ceramic element shown in FIG. 9 was produced. Since the material and manufacturing method which comprise the laminated body 4 were the same as that of the Example of this invention, description is abbreviate | omitted. The laminate 4 was in the shape of a prism having a height of 3 mm and a length and width of 1.2 mm. The exterior resin paste was screen printed and cured only on the pair of side surfaces where the internal electrode layer 3 of the laminate 4 was exposed, and the exterior resin layer 8c was formed to a thickness of 20 μm. The exterior resin paste was an epoxy resin, and the curing conditions were 150 ° C. and 1 hour.

上述した方法で作製した実施例1の積層型圧電セラミックス素子と、比較例1として作製した従来の積層型圧電セラミックス素子について、高湿度負荷試験を行った。高湿度負荷試験は、40℃、90%RHの空気雰囲気の恒温層中で、積層型圧電セラミックス素子に、直流50Vを印加し、1000時間駆動させた。所定の時間の経過時に、それぞれの積層型圧電セラミックス素子について、絶縁抵抗を測定した。   A high humidity load test was performed on the multilayer piezoelectric ceramic element of Example 1 manufactured by the above-described method and the conventional multilayer piezoelectric ceramic element manufactured as Comparative Example 1. In the high-humidity load test, DC 50V was applied to the laminated piezoelectric ceramic element in a constant temperature layer of an air atmosphere of 40 ° C. and 90% RH and driven for 1000 hours. When a predetermined time passed, the insulation resistance of each laminated piezoelectric ceramic element was measured.

図7は、実施例1に係る積層型圧電セラミックス素子の高湿度負荷試験の結果である。図7示すように、従来の積層型圧電セラミックス素子と比較して、本発明の積層型圧電セラミックス素子は、500時間を経過しても絶縁抵抗が低下しにくく、耐湿度性が改善されていることがわかった。従って、本発明の積層型セラミックス素子の構造を採用することによって、高湿度環境下においても、絶縁抵抗が劣化しにくい、長期間に亘る信頼性に優れた積層型セラミックス素子が得られることが確認できた。また、フッ素系樹脂、エポキシ系樹脂、シリコン系樹脂ともに従来素子に比べ、耐湿度性が改善されているが、フッ素系樹脂を用いた場合が耐湿度性が最も良いことも確認できた。   FIG. 7 shows the results of a high humidity load test of the multilayer piezoelectric ceramic element according to Example 1. As shown in FIG. 7, in comparison with the conventional multilayer piezoelectric ceramic element, the multilayer piezoelectric ceramic element of the present invention is less likely to decrease the insulation resistance even after 500 hours, and has improved humidity resistance. I understood it. Therefore, it is confirmed that by adopting the structure of the multilayer ceramic element of the present invention, it is possible to obtain a multilayer ceramic element excellent in long-term reliability in which the insulation resistance hardly deteriorates even in a high humidity environment. did it. In addition, the humidity resistance of the fluorine-based resin, epoxy-based resin, and silicon-based resin is improved compared to the conventional element, but it was also confirmed that the moisture resistance was best when the fluorine-based resin was used.

(実施例2)
実施例2に係る積層型圧電セラミックス素子について、具体的に説明する。実施例2は、実施例1の積層型圧電セラミックス素子と材質、製造方法は同様であるため、説明を省略する。実施例2では、第1の外装樹脂層8aと第2の外装樹脂層8bの厚さを1μmから1000μmまで変化させて、各外装樹脂層の厚さの異なる積層型圧電セラミックス素子1をそれぞれ作製した。外装樹脂ペーストは、フッ素系樹脂、エポキシ系樹脂、シリコン系樹脂をそれぞれ使用した。
(Example 2)
The laminated piezoelectric ceramic element according to Example 2 will be specifically described. Since Example 2 is the same as the laminated piezoelectric ceramic element of Example 1 in material and manufacturing method, description thereof is omitted. In Example 2, the thicknesses of the first exterior resin layer 8a and the second exterior resin layer 8b are changed from 1 μm to 1000 μm, and the laminated piezoelectric ceramic elements 1 having different thicknesses of the respective exterior resin layers are respectively produced. did. As the exterior resin paste, fluorine resin, epoxy resin, and silicon resin were used.

(比較例2)
比較例2についても、比較例1の積層型圧電セラミックス素子と同様の材質、製造方法であるため、説明を省略する。比較例2では、外装樹脂層8cの厚さを、1μmから1000μmまで変化させて、外装樹脂層8cの厚さの異なる積層型圧電セラミックス素子1をそれぞれ作製した。外装樹脂ペーストは、エポキシ系樹脂を使用した。
(Comparative Example 2)
Since Comparative Example 2 is the same material and manufacturing method as the multilayer piezoelectric ceramic element of Comparative Example 1, description thereof is omitted. In Comparative Example 2, the thickness of the exterior resin layer 8c was changed from 1 μm to 1000 μm, and the laminated piezoelectric ceramic elements 1 having different thicknesses of the exterior resin layer 8c were produced. An epoxy resin was used as the exterior resin paste.

図8は、実施例2に係る積層型圧電セラミックス素子で高湿度負荷試験を500時間行った結果である。図8に示すように、外装樹脂層8(8a,8b)、8cの厚みを10μm以上、200μm以下にすることにより、絶縁抵抗は高い値を示すことがわかった。また、従来の積層型圧電セラミックス素子と比較して、本発明の積層型圧電セラミックス素子は、耐湿度性が改善されていることがわかった。10μm未満、200μm超では絶縁抵抗の値が低く、耐湿度性が悪い。これは、外装樹脂層8(8a,8b)、8c内の気泡は3μm〜10μmの大きさであることが確認されているため、10μm未満では、外装樹脂層8(8a,8b)、8cに含まれる気泡などの欠陥に水分が浸入し、絶縁抵抗が低下するためである。さらに、各外装樹脂層8(8a,8b)、8cの厚みが200μmを超えると、外装樹脂自身が水分を吸収するため、マイグレーションを促進させ、絶縁抵抗が低下する。   FIG. 8 shows the results of a high-humidity load test conducted for 500 hours with the multilayer piezoelectric ceramic element according to Example 2. As shown in FIG. 8, it was found that when the thickness of the exterior resin layers 8 (8a, 8b) and 8c is 10 μm or more and 200 μm or less, the insulation resistance shows a high value. Further, it was found that the moisture resistance of the multilayer piezoelectric ceramic element of the present invention was improved as compared with the conventional multilayer piezoelectric ceramic element. If it is less than 10 μm or more than 200 μm, the insulation resistance value is low and the humidity resistance is poor. This is because the bubbles in the exterior resin layers 8 (8a, 8b) and 8c are confirmed to have a size of 3 μm to 10 μm, so that the outer resin layers 8 (8a, 8b) and 8c are less than 10 μm. This is because moisture permeates into defects such as contained bubbles and the insulation resistance decreases. Furthermore, when the thickness of each of the exterior resin layers 8 (8a, 8b) and 8c exceeds 200 μm, the exterior resin itself absorbs moisture, thereby promoting migration and lowering the insulation resistance.

即ち、外装樹脂層8(8a,8b)、8cの厚みを10μm以上とすることにより、気泡などの欠陥があった場合でも、十分な外装樹脂厚みがあるため、高湿度環境下においても、絶縁抵抗が劣化しにくい。また、外装樹脂層8(8a,8b)、8cの厚みを200μm以下とすることにより、外装樹脂が吸収した水分量が微量であるためマイグレーションが発生しにくい。従って、外装樹脂層8(8a,8b)、8cの厚みは10μm以上200μm以下が好ましい。   That is, by setting the thickness of the exterior resin layers 8 (8a, 8b) and 8c to 10 μm or more, even if there are defects such as bubbles, the exterior resin layer has a sufficient thickness, so that it can be insulated even in a high humidity environment. Resistance is unlikely to deteriorate. Further, by setting the thickness of the exterior resin layers 8 (8a, 8b) and 8c to 200 μm or less, the amount of moisture absorbed by the exterior resin is very small, and migration is unlikely to occur. Accordingly, the thickness of the exterior resin layers 8 (8a, 8b) and 8c is preferably 10 μm or more and 200 μm or less.

以上説明したように、本発明の積層型圧電セラミックス素子の構造と製造方法を採用することによって、外部電極が表面に露出した構造の積層型圧電セラミックス素子においても、容易な製造方法で、積層型圧電セラミック素子の角部の外装樹脂層の厚さを確保することが可能となった。従って、高湿度環境下で使用される場合においても、絶縁抵抗が劣化しにくい、信頼性に優れた積層型圧電セラミックス素子を提供することが可能となった。   As described above, by adopting the structure and manufacturing method of the multilayer piezoelectric ceramic element of the present invention, even in the multilayer piezoelectric ceramic element having a structure in which the external electrode is exposed on the surface, It became possible to ensure the thickness of the exterior resin layer at the corners of the piezoelectric ceramic element. Therefore, even when used in a high humidity environment, it has become possible to provide a laminated piezoelectric ceramic element having excellent reliability, in which insulation resistance is unlikely to deteriorate.

本発明の積層型圧電セラミックス素子を示す図。図1(a)は、本発明の積層型圧電セラミックス素子の上面図。図1(b)は、本発明の積層型圧電セラミックス素子の斜視図。The figure which shows the laminated piezoelectric ceramic element of this invention. FIG. 1A is a top view of the multilayer piezoelectric ceramic element of the present invention. FIG. 1B is a perspective view of the multilayer piezoelectric ceramic element of the present invention. 本発明の積層型圧電セラミックス素子の外装前の状態を示す図。The figure which shows the state before the exterior of the lamination type piezoelectric ceramic element of this invention. 本発明の積層型圧電セラミックス素子の前駆体素子の一部を示す図。The figure which shows a part of precursor element of the lamination type piezoelectric ceramic element of this invention. 本発明の積層型圧電セラミックス素子の前駆体素子に第1の外装樹脂層を形成した状態を示す図。The figure which shows the state which formed the 1st exterior resin layer in the precursor element of the lamination type piezoelectric ceramic element of this invention. 本発明の積層型圧電セラミックス素子の前駆体素子を切断加工した状態を示す図。The figure which shows the state which cut | disconnected the precursor element of the lamination type piezoelectric ceramic element of this invention. 本発明の積層型圧電セラミックス素子の積層体に第2の外装樹脂層を形成した状態を示す図。図6(a)は、本発明の積層型圧電セラミックス素子の斜視図。図6(b)は、本発明の積層型圧電セラミックス素子の角部の上面拡大図。The figure which shows the state which formed the 2nd exterior resin layer in the laminated body of the lamination type piezoelectric ceramic element of this invention. FIG. 6A is a perspective view of the multilayer piezoelectric ceramic element of the present invention. FIG. 6B is an enlarged top view of a corner portion of the multilayer piezoelectric ceramic element of the present invention. 実施例1に係る積層型圧電セラミックス素子の高湿度負荷試験の結果。The result of the high humidity load test of the multilayer piezoelectric ceramic element according to Example 1. 実施例2に係る積層型圧電セラミックス素子で高湿度負荷試験を500時間行った結果。The result of having performed the high-humidity load test for 500 hours with the lamination type piezoelectric ceramic element which concerns on Example 2. FIG. 従来の積層型圧電セラミックス素子を示す図。図9(a)は、従来の積層型圧電セラミックス素子の上面図。図9(b)は、従来の積層型圧電セラミックス素子の斜視図。The figure which shows the conventional lamination type piezoelectric ceramic element. FIG. 9A is a top view of a conventional multilayer piezoelectric ceramic element. FIG. 9B is a perspective view of a conventional multilayer piezoelectric ceramic element. 従来の積層型圧電セラミックス素子の角部の上面拡大図。The upper surface enlarged view of the corner | angular part of the conventional laminated piezoelectric ceramic element.

符号の説明Explanation of symbols

1 積層型圧電セラミックス素子
2 圧電セラミックス層
3 内部電極層
4 積層体
5 外部電極
6 絶縁部
7a 変位方向
7b 変位方向
8a 第1の外装樹脂層
8b 第2の外装樹脂層
8、8c 外装樹脂層
9 前駆体素子
10a 切断位置
10b 切断位置
DESCRIPTION OF SYMBOLS 1 Laminated piezoelectric ceramic element 2 Piezoelectric ceramic layer 3 Internal electrode layer 4 Laminated body 5 External electrode 6 Insulating part 7a Displacement direction 7b Displacement direction 8a First exterior resin layer 8b Second exterior resin layer 8, 8c Exterior resin layer 9 Precursor element 10a Cutting position 10b Cutting position

Claims (7)

複数の圧電セラミックス層と複数の内部電極層とを交互に積層し一体化した積層体を備え、前記内部電極層が対向電極となり、前記積層体の側面に露出した前記内部電極層が一層おきに絶縁部で被覆され、前記絶縁部を覆い前記内部電極層と電気的に接続する一対の外部電極が形成され、前記外部電極は、外部機器と電気的に接続される外部端子接続部を有し、前記外部端子接続部となる外部電極は表面に露出している積層型圧電セラミックス素子であって、露出した前記外部電極の形成部分を除く前記積層体の側面及び角部に外装樹脂層が形成されていることを特徴とする積層型圧電セラミックス素子。   A laminated body in which a plurality of piezoelectric ceramic layers and a plurality of internal electrode layers are alternately laminated and integrated is provided, the internal electrode layer serves as a counter electrode, and the internal electrode layers exposed on the side surfaces of the laminated body are provided every other layer. A pair of external electrodes are formed that are covered with an insulating portion, cover the insulating portion, and are electrically connected to the internal electrode layer. The external electrode has an external terminal connection portion that is electrically connected to an external device. The external electrode serving as the external terminal connection portion is a laminated piezoelectric ceramic element exposed on the surface, and an exterior resin layer is formed on the side and corner portions of the laminate excluding the exposed external electrode forming portion. A laminated piezoelectric ceramic element characterized by being made. 前記外装樹脂層は、フッ素系樹脂、エポキシ系樹脂、シリコン系樹脂から選ばれるいずれかを含むことを特徴とする請求項1に記載の積層型圧電セラミックス素子。   2. The multilayer piezoelectric ceramic element according to claim 1, wherein the exterior resin layer includes any one selected from a fluorine resin, an epoxy resin, and a silicon resin. 前記外装樹脂層の厚さは、10μm以上、200μm以下であることを特徴とする請求項1または請求項2に記載の積層型圧電セラミックス素子。   3. The multilayer piezoelectric ceramic element according to claim 1, wherein a thickness of the exterior resin layer is 10 μm or more and 200 μm or less. 複数の圧電セラミックス層と複数の内部電極層とを交互に積層し一体化した積層体を備え、前記内部電極層を対向電極とし、前記積層体の側面に露出した前記内部電極層を一層おきに絶縁部で被覆し、前記絶縁部を覆い前記内部電極層と電気的に接続する一対の外部電極を形成し、前記外部電極は、外部機器と電気的に接続される外部端子接続部を有し、前記外部端子接続部となる外部電極を表面に露出させる積層型圧電セラミックス素子の製造方法であって、露出させる前記外部電極の形成部分を除く前記積層体の側面及び角部に外装樹脂層を形成することを特徴とする積層型圧電セラミックス素子の製造方法。   A laminated body in which a plurality of piezoelectric ceramic layers and a plurality of internal electrode layers are alternately laminated and integrated is provided, the internal electrode layer is used as a counter electrode, and the internal electrode layers exposed on the side surfaces of the laminated body are provided every other layer. Covering with an insulating portion, covering the insulating portion to form a pair of external electrodes that are electrically connected to the internal electrode layer, the external electrodes having external terminal connection portions that are electrically connected to an external device A method of manufacturing a laminated piezoelectric ceramic element in which an external electrode serving as the external terminal connection portion is exposed on the surface, and an exterior resin layer is provided on the side surface and corner portion of the laminated body excluding the external electrode forming portion to be exposed. A method for producing a laminated piezoelectric ceramic element, comprising: forming a laminated piezoelectric ceramic element. 複数の圧電セラミックス層と複数の内部電極層とを交互に積層し一体化した前駆体素子を所定の寸法に切断して形成される積層体を備え、前記内部電極層を対向電極とし、前記前駆体素子の側面に露出した前記内部電極層を一層おきに絶縁部で被覆し、前記絶縁部を覆い前記内部電極層と電気的に接続する対の外部電極を形成し、前記前駆体素子を切断して前記積層体を形成し、前記外部電極は、外部機器と電気的に接続される外部端子接続部を有し、前記外部端子接続部となる外部電極を表面に露出させる積層型圧電セラミックス素子の製造方法であって、露出させる前記外部電極の形成部分を除く前記積層体の側面及び角部に外装樹脂層を形成することを特徴とする積層型圧電セラミックス素子の製造方法。   A plurality of piezoelectric ceramic layers and a plurality of internal electrode layers alternately stacked and integrated with a precursor formed by cutting a predetermined element into predetermined dimensions, the internal electrode layer serving as a counter electrode, and the precursor The internal electrode layer exposed on the side surface of the body element is covered with an insulating portion every other layer, and the pair of external electrodes that cover the insulating portion and are electrically connected to the internal electrode layer are formed, and the precursor element is cut And forming the laminate, wherein the external electrode has an external terminal connection portion electrically connected to an external device, and the external electrode serving as the external terminal connection portion is exposed on the surface. A method for manufacturing a multilayer piezoelectric ceramic element, comprising: forming an exterior resin layer on a side surface and a corner of the multilayer body excluding a portion where the external electrode to be exposed is exposed. 請求項5に記載の積層型圧電セラミックス素子の製造方法において、前記積層型圧電セラミックス素子の前駆体素子の側面に形成した外部電極の両側に第1の外装樹脂層を形成した後、前記前駆体素子を切断して前記積層体を形成し、前記前駆体素子の切断面に第2の外装樹脂層を形成することを特徴とする積層型圧電セラミックス素子の製造方法。   6. The method for manufacturing a multilayer piezoelectric ceramic element according to claim 5, wherein a first exterior resin layer is formed on both sides of an external electrode formed on a side surface of the precursor element of the multilayer piezoelectric ceramic element, and then the precursor. A method for producing a laminated piezoelectric ceramic element, comprising: cutting an element to form the laminate, and forming a second exterior resin layer on a cut surface of the precursor element. 前記外装樹脂層の厚さは、10μm以上、200μm以下とすることを特徴とする請求項4から請求項6のいずれかに記載の積層型圧電セラミックス素子の製造方法。   The thickness of the said exterior resin layer shall be 10 micrometers or more and 200 micrometers or less, The manufacturing method of the laminated piezoelectric ceramic element in any one of the Claims 4-6 characterized by the above-mentioned.
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