JP2009267028A - Parts discrimination regulation mechanism, and parts supplying apparatus - Google Patents

Abstract

Even when a plurality of rectangular chip resistors are supplied in a form in which a mounting surface and a non-mounting surface are mixed, a plurality of chip resistors in a form in which the mounting surface or the non-mounting surface is aligned on one side Can be conveyed in a predetermined direction.
An image of a chip resistor 30 is imaged by imaging a transport unit 10 that transports a rectangular chip resistor 30 that has a mounting surface defined and reacts to magnetism in a predetermined direction, and the chip resistor 30 transported thereby. A determination unit 20 that determines whether the surface is a mounting surface or a non-mounting surface and a magnet adjustment mechanism 14 that has a magnet 14a and adjusts the direction of the chip resistor 30 are provided. The magnet 14a is driven and controlled corresponding to the mounting surface or non-mounting surface of the chip resistor 30 determined by the unit 20.
[Selection] Figure 2

Description

  The present invention relates to a component discrimination adjustment mechanism and a component supply apparatus that can be applied to a chip component supply head or the like that automatically supplies microchip resistance. Specifically, the image pickup surface of the component is provided with an adjustment unit that has a magnetic member and adjusts the orientation of the component, and controls the drive of the magnetic member corresponding to the determined mounting surface or non-mounting surface of the component. Is determined to be the mounting surface, depending on the mounting conditions, the mounting surface is set to the non-imaging surface side, or if the imaging surface of the component is determined to be the non-mounting surface, the non-mounting surface is The image can be reversed to the non-imaging surface side with good reproducibility.

  In recent years, circuit devices such as extremely small chip resistors are often used in electronic devices such as mobile phones, video game machines, and thin notebook personal computers. The chip resistance is as small as l × w × h = 0.6 mm × 0.3 mm × 0.23 mm where the size is length 1 × width w × height (thickness) h. Moreover, the chip resistors have a front side and a back side, and it is necessary to make the mounting surface uniform. According to such a supply form of the chip resistor having the front side and the back side to the mounting machine, at present, the chip resistor is delivered in a reel system that is stored in a state of being aligned on the front side. In the reel method, all chip resistors are supplied to the mounting machine in a reel state with the front side aligned.

  In addition, a small chip resistor is carried in a housing member called a bulk case. When a chip resistor is mounted on a printed circuit board or the like built in a cellular phone, the chip resistor stored in the bulk case is taken out of the bulk case by vibration by the feeder mechanism, and is aligned and supplied to the mounting machine. Made. Furthermore, an apparatus having a mechanism for discriminating the front and back of a component and adjusting a mounting surface in a certain direction is disclosed.

  In relation to this type of component discrimination adjustment mechanism, Patent Document 1 discloses a chip component alignment apparatus. According to this aligning apparatus, when aligning cordless chip parts having front and back surfaces, a ring-shaped rotating body that rotates forward and backward about the X axis as a central axis is provided. Four concave portions are provided on the circumferential surface of the rotating body at intervals of an angle of 90 ° to accommodate leadless chip components. Based on this assumption, the leadless chip parts carried in from the transport path are stored in the recesses of the rotating body, the front and back surfaces of the chip parts are determined by sensors, and the determined front and back surfaces of the chip parts are determined. The rotating body is rotated forward and reverse by 90 °, and the chip parts are carried out in the aligned direction. By configuring the apparatus in this way, the apparatus itself can be simplified and miniaturized, and the entire apparatus can be miniaturized when assembled in a chip filling machine.

Japanese Unexamined Patent Publication No. 2000-85951 (page 3 in FIG. 1)

By the way, according to the component discrimination adjusting mechanism according to the conventional example, there are the following problems.
i. According to the supply method in which the chip resistor is stored in the bulk case, the chip resistor is taken out from the bulk case by vibration by the feeder mechanism, and is arranged in a continuous state and supplied to the mounting machine. The chip resistance in such a continuous state is pressed by the rear chip resistance and is in a compressed state. Therefore, for example, when a front / back reversing operation is performed on the chip resistor stopped at the tip, there is a problem that the pressed pressure hinders the front / back reversing operation.

  ii. The chip resistor has a front side and a back side, and according to the state of the chip resistor supplied by the feeder mechanism or the like, the front side and the back side are mixed. When this is directly mounted on a circuit board, it is mounted in a state in which chip resistors are mixed on the front and back, which is not preferable in terms of quality.

  iii. According to the chip component aligning apparatus as found in Patent Document 1, the chip resistance mixed on the front and back sides is supplied to the back side (hereinafter referred to as the non-mounting surface) so as to be corrected to the front side (hereinafter referred to as the mounting surface). However, in order to rotate the chip resistor conveyed by the chip conveying groove or the like, an opening corresponding to the chip size must be provided. Further, if the front / back reversing operation such as rotation is performed on the chip resistor at the opening, the chip resistor may jump out.

  Therefore, the present invention solves such a problem, and even when a plurality of rectangular parts are supplied in a mixed form of a mounting surface and a non-mounting surface, the mounting surface or the non-mounting surface It is an object of the present invention to provide a component discriminating / adjusting mechanism and a component supplying apparatus that can transport a plurality of components in a predetermined direction in a form in which the two are aligned on one side.

  The above-described problem is that a mounting surface is defined, and a rectangular part that reacts to magnetism is conveyed in a predetermined direction, and the component conveyed by the conveyance unit is imaged and the imaging surface of the component is mounted A determination unit that determines whether the surface is a non-mounting surface and an adjustment unit that has a magnetic member and adjusts the orientation of the component, and the adjustment unit determines the component determined by the determination unit This is solved by a component discrimination adjustment mechanism that drives and controls the magnetic member corresponding to the mounting surface or the non-mounting surface.

  According to the component determination adjustment mechanism according to the present invention, when it is determined that the imaging surface of the component is the mounting surface, the mounting surface is set to the non-imaging surface side or the imaging surface of the component is When it is determined that the surface is a non-mounting surface, the non-mounting surface can be reversed to the non-imaging surface side with good reproducibility.

  The component supply device according to the present invention discriminates a component supply unit that supplies a plurality of rectangular components that have a mounting surface defined and reacts to magnetism, and a mounting surface of the component supplied from the component supply unit. A component discriminating and adjusting mechanism for adjusting the orientation of the component, the component discriminating and adjusting mechanism imaging the component conveyed by the conveying unit and a conveying unit that conveys the component in a predetermined direction. A determination unit that determines whether the imaging surface is a mounting surface or a non-mounting surface, and an adjustment unit that includes a magnetic member and adjusts the orientation of the component, and the adjustment unit includes the determination unit The magnetic member is driven and controlled corresponding to the mounting surface or non-mounting surface of the component determined by the above.

  The component supply device according to the present invention includes the component discrimination adjustment mechanism according to the present invention. Therefore, when it is determined that the imaging surface of the component is the mounting surface, the mounting surface is not imaged according to the mounting conditions. When it is determined that the imaging surface of the component is the non-mounting surface, the non-mounting surface can be reversed to the non-imaging surface side with good reproducibility.

  The component discrimination adjustment mechanism according to the present invention includes an adjustment unit that has a magnetic member and adjusts the orientation of the component, and the adjustment unit corresponds to the determined mounting surface or non-mounting surface of the component. The drive of the magnetic member is controlled.

  With this configuration, when it is determined that the imaging surface of the component is the mounting surface, the mounting surface is determined to be the non-imaging surface side or the imaging surface of the component is determined to be the non-mounting surface depending on the mounting conditions. In this case, the non-mounting surface can be reversed to the non-imaging surface side with good reproducibility. As a result, even when a plurality of rectangular components are supplied in a form in which a mounting surface and a non-mounting surface are mixed, a plurality of components are specified in a form in which the mounting surface or the non-mounting surface is aligned on one side. Can be transported in the direction of.

  The component supply device according to the present invention includes the component discrimination adjustment mechanism according to the present invention. Therefore, when it is determined that the imaging surface of the component is the mounting surface, the mounting surface is not imaged according to the mounting conditions. When it is determined that the imaging surface of the component is the non-mounting surface, the non-mounting surface can be reversed to the non-imaging surface side with good reproducibility.

  With this configuration, even when a plurality of rectangular components are supplied in a form in which the mounting surface and the non-mounting surface are mixed, the plurality of components are arranged in a form in which the mounting surface or the non-mounting surface is aligned on one side. It can be conveyed in a predetermined direction. As a result, it is possible to provide a chip component supply device that automatically supplies microchip resistance.

  Hereinafter, a component discrimination adjustment mechanism and a component supply apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a front / back discrimination reversing unit 100 as an embodiment according to the present invention, and FIG. 2 is a perspective view showing a configuration example of a main part thereof.

  The front / back discrimination reversing unit 100 shown in FIG. 1 constitutes an example of a part discrimination adjustment mechanism, and discriminates the front and back of a chip resistor 30 constituting an example of a rectangular part and inverts it or carries it out as it is. is there. The front / back discriminating / reversing unit 100 can be applied to an automatic chip resistance supply device constituting an example of a component supply device. Of course, you may apply to the chip component supply head etc. which comprise the chip resistance automatic supply apparatus.

  The size of the front / back discrimination reversal unit 100 is L [mm] in length, W [mm] in width, and H [mm] in height. A non-magnetic member is used for the casing. For example, a resin member or aluminum is used. The chip resistor 30 handled in this example is an extremely small component, and the size of the unit 100 is about L = W = H = 40 mm.

  The front / back discrimination reversing unit 100 includes an in-side stopper 11, an intermediate stopper 12, an out-side stopper 13, an air circuit 16 for feeding and feeding, an air circuit 16 for suction, and an air for feeding and feeding. The circuit 18, the image recognition CCD unit 19 and the front / back discrimination window 31 constituting the discrimination unit 20, the magnet adjustment mechanism 14, and the scattering prevention mechanism 15 are configured. Non-magnetic members are also used for the various stoppers 11, 12, and 13. For example, a resin member or aluminum is used.

  The transport unit 10 has a mounting surface defined, receives a plurality of rectangular chip resistors 30 that react to magnetism from a component supply unit such as a bulk feeder or a bulk case, and sends the chip resistors 30 one by one in a predetermined direction ( Operate). The front / back discriminating / reversing unit 100 discriminates the mounting surface of the chip resistor 30 supplied from a bulk feeder or the like and adjusts the direction of the chip resistor 30.

  The front / back discrimination and reversing unit 100 shown in FIG. The base unit 1 is provided with, for example, a tunnel-shaped or groove-shaped transport path 2 (chip transport groove). The chip resistor 30 is transported below the front / back discrimination window 31 through the transport path 2. An in-side stopper 11 is provided on the upstream side of the front / back discrimination window 31. Here, the upstream side refers to the side on which the chip resistor 30 arrives on the basis of the front / back discrimination window 31. The stopper 11 is driven by the cylinder 21 for the in-side stopper, and assists the one-feed operation of the chip resistor 30. The cylinder 21 is connected to a drive control unit 53 shown in FIG. The stopper 11 has a claw-like shape obtained by obliquely cutting a “<”-shaped nonmagnetic member. The stopper 11 and the cylinder 21 are engaged by a link mechanism.

  A CCD unit 19 for image recognition is attached to the front / back discrimination window 31 and is used when checking the front / back of the chip resistor 30. For example, the CCD unit 19 captures an image of the imaging surface of the chip main body 30a by capturing an image of the chip resistor 30 transported by the transport unit 10. The CCD unit 19 constitutes a determination unit 20. The determination unit 20 includes a control unit 50 and an image processing unit 51 shown in FIG. 6 in addition to the CCD unit 19, and determines whether the imaging surface of the chip resistor 30 is a mounting surface or a non-mounting surface. Determine. The CCD unit 19 is connected to the control unit 50 shown in FIG.

  A bottomed surrounding portion 31 a is provided in the middle of the conveyance path 2 and below the front / back discrimination window portion 31. The surrounding portion 31a has a manhole type box-shaped portion that is open at the top and is surrounded on all sides, and has an inlet portion 2a and an outlet portion 2b of the chip resistor 30 at predetermined portions (see FIG. 4). .

  A magnet adjustment mechanism 14 that constitutes an example of an adjustment unit is provided below the surrounding portion 31a, and operates when the chip resistor 30 is reversed. The magnet adjustment mechanism 14 includes, for example, a magnetic member Mg (hereinafter referred to as a magnet 14a) and a magnet driving cylinder 24, and adjusts the direction of the chip resistor 30. The magnet adjustment mechanism 14 drives the magnet 14a by drivingly controlling the cylinder 24 corresponding to the mounting surface or the non-mounting surface of the chip resistor 30 recognized by the image processing unit 51 and determined by the control unit 50. Made. The cylinder 24 is connected to a drive control unit 53 shown in FIG.

  In this example, when it is determined that the imaging surface of the chip resistor 30 is the mounting surface, the magnet adjustment mechanism 14 drives and controls the magnet 14a according to the mounting conditions, and does not image the mounting surface of the chip resistor 30. When it is determined that the imaging surface of the chip resistor 30 is a non-mounting surface, the magnet 14a is driven and controlled to reverse the non-mounting surface of the chip resistor 30 to the non-imaging surface side. When the magnet adjustment mechanism 14 is configured in this manner, even when a plurality of rectangular chip resistors 30 are supplied in a form in which a mounting surface and a non-mounting surface are mixed, the mounting surface or the non-mounting surface is set on one side. A plurality of chip resistors 30 can be transported in a predetermined direction (such as a mounting machine).

  On the upstream side of the magnet adjustment mechanism 14 and below the stopper 11, an air circuit 16 for feeding and feeding is provided to assist the feeding operation of the chip resistor 30 after the front / back discrimination. The air circuit 16 has a pipe-like pipeline for air feeding, and is connected to the drive control unit 53 shown in FIG. 6 to supply a predetermined amount of air.

  An intermediate stopper 12 is provided on the downstream side of the front / back discrimination window 31. Here, the downstream side refers to the side from which the chip resistor 30 flows with the front / back discrimination window 31 as a reference. The stopper 12 is driven by an intermediate stopper cylinder 22 and an intermediate stopper pressure release cylinder 32 to release the pressure and assist in carrying out the chip resistor 30. The intermediate stopper 12 is normally in a closed state, and has a mechanism that moves back and forth between upstream and downstream in synchronization with the opening / closing operation of the stopper 11. The stopper 12 has a tip claw shape obtained by obliquely cutting a “<”-shaped nonmagnetic member. The stopper 12 and the cylinder 22 are engaged by a link mechanism.

A scattering prevention mechanism 15 is disposed at a predetermined position of the front / back discrimination window portion 31 so as to prevent the chip resistor 30 from flying out from the surrounding portion 31a. The scattering prevention mechanism 15 has, for example, a cylinder 25 on the opposite side of the magnet adjustment mechanism 14. The cylinder 25 has a rectangular holding pin 15a at the tip of the cylinder head to prevent the chip resistor 30 from jumping out. For example, the pressing pin 15a is configured to cover the upper portion of the chip resistor 30 so as to bridge from the one side surface of the surrounding portion 31a to the other side surface facing each other.

  On the downstream side of the scattering prevention mechanism 15 and behind the stopper 12, an air circuit 18 for feeding and feeding is provided to assist the carrying-out operation of the chip resistor 30 after the front / back discrimination. The air circuit 18 has a pipe-like pipeline for air feeding, and is connected to the drive control unit 53 shown in FIG. A suction air circuit 17 is provided on the downstream side of the air circuit 18 so as to assist the suction operation of the chip resistor 30 after the front / back discrimination. The air circuit 17 has a pipe-like pipeline for drawing air, and is connected to the drive control unit 53 shown in FIG.

  An out-side stopper 13 is provided on the downstream side of the air circuit 17. The stopper 13 is driven by an out-side stopper cylinder 23 to assist in carrying out the chip resistor 30. The cylinder 23 is connected to the drive control unit 53 shown in FIG. The stopper 13 has a claw-like shape obtained by obliquely cutting a “<”-shaped nonmagnetic member. The stopper 13 and the cylinder 23 are engaged by a link mechanism. Thus, the front / back discrimination reversing unit 100 that can be mounted on the automatic chip resistance supply device is configured.

  3A and 3B are a top view and a front view showing a configuration example of the chip resistor 30. The chip resistor 30 illustrated in FIG. 3A constitutes an example of a rectangular component that reacts to magnetism, and includes a chip main body 30a, a resistor 30c, and an electrode terminal 30b. The chip resistor 30 has a length of l [mm], a width of w [mm], and a height (thickness) shown in FIG. 3B of h [mm]. The chip resistor 30 handled in this example is an extremely small component having l = 0.6 mm, w = 0.3 mm, and h = 0.23 mm.

  Electrode terminals 30b are provided on both sides of the chip main body 30a, and a resistor 30c is formed between the electrode terminals 30b. The resistor 30c is black. The electrode terminal 30b is soldered to the printed circuit board at the time of mounting. The resistor 30c is provided on the surface side of the chip body 30a. The electrode terminal 30b is plated with copper on a copper foil and has a metallic color. When the front surface of the chip main body 30a is imaged by the CCD unit, the image density level is recognized to be lower than that of the rear surface.

  A mounting surface is defined for the chip body 30a. The mounting surface is a surface soldered to the printed circuit board. In this example, the mounting surface is the back surface side of the chip body 30a. As described above, the chip resistor 30 handled by the front / back discrimination reversing unit 100 is a minute component, and is required to be supplied to the mounting machine with its mounting surface aligned in a certain direction.

  FIG. 4 is a top view showing a configuration example of the magnet adjustment mechanism 14 and its surroundings. The magnet adjustment mechanism 14 shown in FIG. 4 drives the magnet 14a from the direction orthogonal to the conveyance direction of the chip resistor 30 conveyed in a predetermined direction by the conveyance unit 10 to invert the chip resistor 30. . The magnet adjustment mechanism 14 is configured to include an surrounding portion 31a, a front / back discrimination window portion 31, and a magnet 14a.

  In the drawing, a bottomed surrounding portion 31a is provided below the front / back discrimination window portion 31 indicated by the broken-line circle. The surrounding portion 31 a is provided in the middle of the conveyance path 2 where the conveyance unit 10 conveys the chip resistor 30. The size of the surrounding portion 31a has a length l 'corresponding to one chip resistor 30, a predetermined width w', and a predetermined height (not shown). The inlet portion 2a of the chip resistor 30 is provided on one side surface (upstream side) of the surrounding portion 31a, and reaches the bulk feeder from one transport path 2. An outlet portion 2b of the chip resistor 30 is provided on the other side surface (downstream side) of the surrounding portion 31a, and the other conveyance path 2 leads to the mounting machine.

  The bottom surface of the surrounding portion 31a is an inversion region, and the magnet 14a is movably disposed on the back side of the bottom surface of the surrounding portion 31a. When the magnet adjustment mechanism 14 is configured in this way, when the magnet 14a is driven to reverse the front and back of the chip resistor 30, the chip resistor 30 rotates about the rotation axis orthogonal to the transport direction in the reversal region of the magnet adjustment mechanism 14. In other words, the chip resistor 30 can be reversed with good reproducibility using the conveyance direction as the rotation axis without the chip resistor 30 jumping out.

  5A to 5C are explanatory diagrams illustrating an inversion example of the chip resistor 30 in the magnet adjustment mechanism 14. The chip resistor 30 shown in FIG. 5A is a case where the mounting surface faces upward. In this case, it is necessary to reverse the front and back of the chip resistor 30. In this case, the magnet 14a moves from the left side to the right side. The chip resistor 30 shown in FIG. 5B reverses when the magnet 14a moves from the left side to the right side.

  For example, the chip resistor 30 rises along the magnetic field lines of the magnet 14a when the magnet 14a moves from the left side to the right side, and when the magnet 14a moves directly below the chip resistor 30, the chip resistor 30 stands upright (90 Change attitude to °). Further, when the magnet 14a moves from right below to the right side, the posture of the chip resistor 30 changes from an upright state to an inverted state (180 °). Thereby, the chip resistor 30 can be inverted as shown in FIG. 5C.

  FIG. 6 is a block diagram illustrating a configuration example of a control system of the front / back discrimination / reversal unit 100. The control system of the front / back discrimination / reversing unit 100 shown in FIG. 6 includes a transport unit 10, a magnet adjustment mechanism 14, a scattering prevention mechanism 15, a discrimination unit 20, an operation unit 52, a drive control unit 53, and a monitor 54. The determination unit 20 includes a CCD unit 19, a control unit 50, and an image processing unit 51.

  The operation unit 52 is operated when supplying the chip resistor 30 to the mounting machine 102 (see FIG. 17). For example, when the front / back discrimination / reversing unit 100 is activated, the operation data D52 for instructing the supply start is output to the control unit 50. The CCD unit 19 images the chip resistor 30 and outputs a chip imaging signal Sr to the control unit 50 during chip loading, chip front / back discrimination, and chip unloading.

  A monitor 54 is connected to the controller 50, and an image of the chip body 30a is displayed based on the display data D54 when the chip is loaded. The display data D54 is information obtained by binarizing the chip imaging signal Sr obtained from the CCD unit 19 and converting it into a display format. An image processing unit 51 is connected to the control unit 50, and chip recognition data Dr obtained by binarizing the chip imaging signal Sr and a preset discrimination threshold level are input to execute image recognition processing.

  The controller 50 is connected to a cylinder & air drive controller 53. The transport unit 10 is connected to the drive control unit 53. The transport unit 10 includes three stoppers 11 to 13, four cylinders 21 to 23, and three air circuits 16 to 18. The cylinder 21 is attached to the in-side stopper 11 and drives the stopper 11 in order to realize a one-feed operation of the chip resistor 30.

  The cylinders 22 and 32 are attached to the intermediate stopper 12 to release the pressure and drive the stopper 12 to carry out the chip resistor 30. The cylinder 23 is attached to the stopper 13 on the out side, and supplies air for carrying out the chip resistor 30. The air circuit 16 for sending and sending pressure is connected to the drive control unit 53 and supplies air for sending the chip resistor 30 after the front / back discrimination. The air circuit 17 for suction is connected to the drive control unit 53 and sucks air for sucking the chip resistor 30 after the front / back discrimination. The air circuit 18 for sending and feeding pressure is connected to the drive control unit 53 and supplies air for carrying out the chip resistor 30 after the front / back discrimination.

  The drive control unit 53 controls the driving of the cylinders 21 to 25 and 32 and the air circuits 16 to 17 based on the drive control data D53. The drive control data D53 is output from the control unit 50 to the drive control unit 53. The six cylinders 21 to 25 and 32 and the three air circuits 16 to 17 connected to the drive control unit 53 are controlled based on the chip imaging data Dr and the drive control data D53. An air pump (not shown) is provided inside the drive control unit 53 so as to supply air to the six cylinders 21 to 25 and 32 and the three air circuits 16 and 18 based on the drive control data D53. To be made. The air circuit 17 is provided with a suction air pump (not shown), and the air circuit 17 is controlled to suck air.

  The magnet adjustment mechanism 14 includes a magnet 14 a and a cylinder 24. The cylinder 24 receives air from the drive control unit 53 and scans the magnet 14a. The scattering prevention mechanism 15 includes a pressing pin 15 a and a cylinder 25. The cylinder 25 receives air from the drive control unit 53 and drives the pressing pin 15a. The driving direction of the pressing pin 15a is substantially the same as the scanning direction of the magnet 14a. Thus, a control system of the front / back discrimination reversing unit 100 is configured.

  7A and 7B are waveform diagrams showing examples of detection of the chip resistor 30. FIG. 7A and 7B, the horizontal axis is time t. The vertical axis represents the image density level L on the front or back surface of the chip resistor 30. 7A is obtained by the chip imaging signal Sr indicating the surface of the chip resistor 30, and its image density level L is obtained by the chip imaging signal Sr. The grayscale waveform H2 shown in FIG. 7B is obtained by the chip imaging signal Sr indicating the back surface of the chip resistor 30, and the image density level L is obtained by the chip imaging signal Sr.

  7A and 7B, an elongated oval portion I on the chip resistor 30 is an electrode discrimination region. Also, the ellipse portion II on the shading waveform is an electrode discrimination point of the chip resistor 30. In this example, the rising portion of the image density level L by the chip imaging signal Sr is differentiated, and the presence or absence of the electrode of the chip resistor 30 is detected by looking at the rising change. By detecting the presence / absence of the electrode, it is determined whether the chip resistor 30 is loaded or unloaded. For example, if there is an electrode edge, a flag indicating that a chip is loaded is output. If there is no electrode edge, a flag indicating no chip loading is output. With this flag, for example, the image processing unit 51 can determine whether or not the chip has been loaded.

  8A and 8B are waveform diagrams showing an example of front / back discrimination of the chip resistor 30. FIG. In this example, the difference in area when electrodes are present is detected to determine the front and back of the chip resistor 30. 8A and 8B, the horizontal axis represents time t. The vertical axis represents the image density level L on the front or back surface of the chip resistor 30. In this example, the discrimination threshold level Lth is set to the image density level L on the front surface and the back surface of the chip resistor 30.

  When the image density level L of the imaging surface of the chip resistor 30 based on the chip imaging signal Sr is equal to or less than the determination threshold level Lth, the image processing unit 51 detects (confirms) the surface of the chip resistor 30. When the image density level L of the imaging surface of the chip resistor 30 by the chip imaging signal Sr exceeds the discrimination threshold level Lth, the image processing unit 51 detects (confirms) the back surface of the chip resistor 30. In this example, when the chip resistor 30 is the back surface, the chip resistor 30 is turned upside down by driving the magnet 14a of the magnet adjusting mechanism 14.

  Next, an operation example of the front / back discrimination / reversing unit 100 will be described. 9 to 11 are process diagrams showing examples of conveying the chip resistor 30 (parts 1 to 3). 12 and 13 are flowcharts showing operation examples (parts 1 and 2) of the front / back discrimination / reversing unit 100. FIG. FIG. 14 is a subroutine showing an example of carrying-in detection of the chip resistor 30, FIG. 15 is a subroutine showing an example of chip front / back discrimination, and FIG. 16 is a subroutine showing an example of carrying-out detection.

  In this example, an automatic chip resistance supply device 200 (see FIG. 17) on which the front / back discrimination and reversing unit 100 according to the present invention is mounted is configured. The chip resistance automatic supply device 200 carries in a plurality of chip resistors 30 from a component supply unit 101 (see FIG. 17) such as a bulk feeder (bulk case), determines the front and back of the chip resistors 30, and The front and back are reversed, and the chip resistors 30 aligned in a certain direction are carried out to the mounting machine 102 shown in FIG.

  The chip resistor 30 in the bulk case is in a state where both sides are mixed. Even in such a state, the front / back discriminating / reversing unit 100 according to the present invention performs image recognition for each chip, and the chip resistor 30 on the back surface is inverted and corrected on the front surface and supplied to the mounting machine 102. did. In this example, the front / back discrimination reversing unit 100 is normally in a state in which the in-side stopper 11 is open. Further, the intermediate stopper 12 is in a closed state, and the out-side stopper 13 is also in a closed state.

  Under these preconditions, first, in step ST1 of the flowchart shown in FIG. 12, the chip resistor 30 sent by a bulk feeder (not shown) is carried (supplied) to the front / back discrimination window 31 shown in FIG. 9A. . Next, in step ST2, the cylinder 21 is driven to open the stopper 11 on the in side. At this time, the cylinder 32 is driven to slightly advance the intermediate stopper 12 to stop the flow of the chip resistor 30.

  Next, in step ST3, the cylinder 21 is driven to close the in-side stopper 11 in the direction of the arrow (1) shown in FIG. 9A, and the cylinder 32 is driven to move the intermediate stopper 12 to the arrow (2) in the figure. Move backward in the direction of. For example, the intermediate stopper 12 shown in FIG. 9B moves backward by Δt to create a gap between the chip resistors 30 and release the pressure from the rear. In this example, by the above-described operation, one continuous chip resistor 30 is fed, and at the same time, a gap is created with respect to the continuous flow of the chip resistor 30 from the rear, and the pressing pressure is released.

  In step ST4, the image recognition CCD unit 19 confirms the chip resistor 30 supplied to the front / back discrimination window 31. For example, a subroutine shown in FIG. 14 is called, and the chip resistor 30 is picked up and captured at step ST41. Next, in step ST42, the image processing unit 51 determines whether or not there is an electrode edge. If there is an electrode edge, for example, a flag indicating that a chip is loaded is output. If there is no electrode edge, a flag indicating no chip loading is output in step ST44 (see FIGS. 7A and 7B). Thereafter, the process returns to step ST4.

  In step ST5, the image processing unit 51 determines whether or not the chip has been loaded based on the previously obtained flag. When a flag indicating no chip loading is detected and no chip is loaded, the process proceeds to step ST2 to repeat the above-described processing. If the flag indicating that the chip has been loaded is detected and the chip has been loaded, the process proceeds to step ST6.

  Next, in step ST <b> 6, the image recognition CCD unit 19 images the surface of the chip resistor 30, and the image processing unit 51 determines the front and back of the chip resistor 30. At this time, the front and back of the chip resistor 30 supplied to the front / back discrimination window 31 shown in FIG. 9B is checked by the CCD unit 19 and the image processing unit 51.

  For example, the subroutine shown in FIG. 15 is called, and in step ST61, the CCD unit 19 captures the chip resistor 30 and captures the image. The CCD unit 19 outputs a chip imaging signal Sr to the image processing unit 51. Next, in step ST62, the image processing unit 51 binarizes and confirms the chip main body 30a in order to execute the pattern recognition processing. At this time, the image processing unit 51 compares the image density level L based on the chip imaging signal Sr with the discrimination threshold level Lth.

  If the image density level L based on the chip imaging signal Sr is equal to or lower than the discrimination threshold level Lth, it is detected in step ST63 that the imaging surface of the chip resistor 30 is the surface. When the image density level L based on the chip imaging signal Sr exceeds the discrimination threshold level Lth, it is detected in step ST64 that the imaging surface of the chip resistor 30 is the back surface. When the imaging surface of the chip resistor 30 is the back surface, the process proceeds to step ST65, and the control unit 50 controls the magnet adjustment mechanism 14 to move (drive) the magnet 14a and invert the chip resistor 30. .

  In the above example, if the chip resistor 30 supplied to the front / back discrimination window 31 is the back surface, the magnet adjustment mechanism 14 shown in FIG. 9C rotates the chip resistor 30 shown in FIG. 9C in the direction of the arrow (3). Modify to be on the surface. At this time, in the magnet adjustment mechanism 14, the cylinder 24 is driven, the magnet 14 a attracts the chip resistor 30, and in this state, the magnet 14 a moves in a direction orthogonal to the conveying direction of the chip resistor 30.

  For example, as shown in FIG. 5A, the chip resistor 30 rises along the magnetic line of force of the magnet 14a when the magnet 14a moves from the left side to the right side of the sheet perpendicular to the conveying direction of the chip resistor 30. When the chip resistor 30 moves directly below the chip resistor 30, it changes from the posture in which the chip resistor 30 lies down to an upright state (90 °). Further, when the magnet 14a moves from right below to the right side, the posture of the chip resistor 30 changes from an upright state to an inverted state (180 °). As a result, the chip resistor 30 can be inverted as shown in FIG. 9D. Thereafter, the process returns to step ST6.

  When the surface correction operation of the chip resistor 30 by the magnet adjusting mechanism 14 is finished, the inverted chip resistor 30 is subjected to a scattering prevention measure. In this example, the drive control unit 53 controls the cylinder 22 to open the intermediate stopper 12 shown in FIG. 10A, drives the cylinder 25 of the anti-scattering mechanism 15, and sets the anti-scattering holding pin 15a to the front / back discrimination window. It is made to be exposed inside the portion 31. With this pressing pin 15a, the chip resistor 30 is put on a top.

  Then, at the same time as supplying air by driving the air circuit 16 for sending and sending pressure, the air circuit 17 for suction is driven and sucked in step ST7, and the chip resistor 30 is fed from the upstream side to the downstream side, The chip resistor 30 delivered from the upstream side is sucked on the downstream side and sent to the transport unit 10 (chip transport groove) in the front / back discrimination reversing unit 100. The chip resistor 30 can be sent out to the stopper 13 on the out side by the cooperative operation (operation) of the air circuit 16 for sending pressure and the air circuit 17 for sucking. At this time, since the cylinder 23 has stopped driving, the out-side stopper 13 is still closed. As a result, the chip resistor 30 comes into contact with the stopper 13 shown in FIG. 10B and stops.

  Then, after sending one chip resistor 30 to the transport unit 10, in step ST10, the cylinder 22 is driven to close (lower) the intermediate stopper 12 shown in FIG. 10C, and then the cylinder 23 is driven, The out-side stopper 13 shown in FIG. 11A is opened (raised) in the direction of the arrow (1). The chip resistor 30 after front / back discrimination moves in the direction of the arrow (2) shown in FIG. In step ST <b> 12, the image recognition CCD unit 19 confirms the removal of the chip resistor 30 inside the front / back discrimination window 31. For example, a subroutine shown in FIG. 5 is called, and the chip resistor 30 is picked up and captured at step ST101. Next, in step ST102, the image processing unit 51 determines whether or not there is an electrode edge. If there is an electrode edge, for example, a flag indicating that the chip has not been carried out is output in step ST103. If there is no electrode edge, a flag indicating that the chip has been transferred is output in step ST104 (see FIGS. 7A and 7B). Thereafter, the process returns to step ST11.

  In step ST12, the image processing unit 51 determines whether the chip has been unloaded based on the previously obtained flag. If a chip unexported flag is detected, the process returns to step ST7 and the above-described processing is repeated. When the flag indicating that the chip has been carried out is detected, the process proceeds to step ST13. In step ST13, the control unit 50 drives the air circuit 18 for sending pressure and sends air for Δt. In step ST14, the control unit 50 carries out (discharges) the chip resistor 30 from the front / back discrimination inversion unit 100 to the outside.

  Thereafter, the cylinder 23 is driven to close the out-side stopper 13 shown in FIG. 11B. Then, the cylinder 21 is driven to open the in-side stopper 11 in the direction of the arrow (1) as shown in FIG. 11C, and at the same time, the cylinder 32 is driven to move the intermediate stopper 12 to the arrow (2). Move forward in the direction of. For example, the intermediate stopper 12 moves forward by Δt, and the next chip resistor 30 is carried into the front / back discrimination window 31. This returns to the state shown in FIG. 9A. By repeating the above operation, it is possible to send all the chip resistors 30 to the next process with the mounting surface facing up.

  Thus, according to the front / back discrimination reversing unit 100 according to the embodiment of the present invention, the magnet adjustment mechanism 14 that has the magnet 14a and adjusts the direction of the chip resistor 30 is provided. The magnet 14a is driven and controlled in accordance with the mounting surface or non-mounting surface of the chip resistor 30 thus formed.

  Therefore, when it is determined that the imaging surface of the chip resistor 30 is the mounting surface, the mounting surface is set to the non-imaging surface side (downward) or the imaging surface of the chip resistor 30 is the non-mounting surface depending on the mounting conditions. When it is determined that the non-mounting surface is determined, the non-mounting surface can be reversed to the non-imaging surface side with good reproducibility. Thereby, even when a plurality of rectangular chip resistors 30 are supplied in a form in which a mounting surface and a non-mounting surface are mixed, a plurality of chips in a form in which the mounting surface or the non-mounting surface is aligned on one side. The resistor 30 can be conveyed in a predetermined direction.

  FIG. 17 is a block diagram illustrating a configuration example of an automatic chip resistance supply apparatus 200 as an embodiment. An automatic chip resistance supply device 200 shown in FIG. 17 constitutes an example of a component supply device, and includes a front / back discrimination / reversal unit 100 (component discrimination adjustment mechanism), a component supply unit 101, and a mounting machine 102 according to the present invention. . A mounting surface is defined in the component supply unit 101, and a plurality of rectangular chip resistors 30 that react to magnetism are supplied. A bulk feeder, a bulk case, or the like is used for the component supply unit 101. The front / back discriminating / inverting unit 100 discriminates the mounting surface of the chip resistor 30 supplied from the component supply unit 101 and adjusts the direction of the chip resistor 30.

  The front / back discrimination / reversing unit 100 includes the transport unit 10, the magnet adjustment mechanism 14, and the discrimination unit 20 shown in FIG. The transport unit 10 transports the chip resistor 30 in a predetermined direction. The determination unit 20 images the chip resistor 30 transported by the transport unit 10 and determines whether the imaging surface of the chip resistor 30 is a mounting surface or a non-mounting surface. The magnet adjustment mechanism 14 has a magnet 14 a and adjusts the direction of the chip resistor 30. Based on this premise, the magnet adjustment mechanism 14 drives and controls the magnet 14a corresponding to the mounting surface or non-mounting surface of the chip resistor 30 determined by the determination unit 20.

  Thus, according to the chip resistance automatic supply apparatus 200 as the embodiment, since the front / back discrimination / reversal unit 100 according to the present invention is provided, the mounting is performed when it is determined that the imaging surface of the chip resistor 30 is the mounting surface. Depending on conditions, the mounting surface is set to the non-imaging surface side, or when it is determined that the imaging surface of the chip resistor 30 is the non-mounting surface, the non-mounting surface is reversed to the non-imaging surface side with good reproducibility. Can do.

  As a result, even when the chip resistor 30 is supplied from the bulk feeder in a mixed state and is mounted in the bulk case, the normal mounting state of the chip resistor 30 on the surface of the mounting machine 102 is maintained. become able to. As a result, the same handling as a capacitor that can be delivered in a bulk case can be performed, and the unit price of the chip resistor 30 can be reduced.

  In addition, since the bulk case can be used, the number of packages per package can be increased compared to the conventional reel form, the chip resistor 30 can be easily handled, and the chip resistor storage container can be downsized. Therefore, the entire chip resistance automatic supply device 200 can be downsized.

  The present invention is extremely suitable when applied to a chip component supply head that automatically supplies a microchip resistance, a chip resistance automatic supply device, and the like.

It is a perspective view which shows the example of a structure of the front / back discrimination | determination reversing unit 100 as embodiment which concerns on this invention. 3 is a perspective view showing a configuration example of a main part of the front / back discrimination reversing unit 100. FIG. (A) And (B) is the top view and front view which show the structural example of the chip resistor 30. FIG. It is a top view which shows the example of a structure of the magnet adjustment mechanism 14 and its periphery. (A)-(C) are explanatory drawings which show the inversion example of the chip resistance 30 in the magnet adjustment mechanism 14. FIG. 3 is a block diagram illustrating a configuration example of a control system of a front / back discrimination / reversing unit 100. FIG. (A) And (B) is a wave form diagram which shows the example of a detection of the chip resistance 30. FIG. (A) And (B) is a wave form diagram which shows the example of front-back discrimination of the chip resistor 30. FIG. FIG. 6 is a process diagram showing a conveyance example (part 1) of the chip resistor 30; FIG. 10 is a process diagram illustrating a transfer example (part 2) of the chip resistor 30; FIG. 10 is a process diagram illustrating a conveyance example (part 3) of the chip resistor 30; 6 is a flowchart showing an operation example (part 1) of the front / back discrimination / reversal unit 100; 6 is a flowchart showing an operation example (part 2) of the front / back discrimination reversing unit 100; 3 is a subroutine showing an example of detection of chip resistor 30 loading. It is a subroutine showing an example of chip front / back discrimination. It is a subroutine which shows the example of carrying out detection of chip resistance 30. It is a block diagram which shows the structural example of the chip resistance automatic supply apparatus 200 as an Example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base part, 2 ... Conveyance path, 10 ... Conveyance part, 11, 12, 13 ... Stopper, 14 ... Magnet adjustment mechanism, 15 ... Scatter prevention mechanism, 16- DESCRIPTION OF SYMBOLS 18 ... Air circuit, 19 ... CCD unit (discrimination part), 20 ... Discrimination part, 21-25, 32 ... Cylinder, 31 ... Front / back discrimination window part, 50 ... Control part , 100... Chip front / back discrimination reversal unit (component discrimination adjustment mechanism), 200... Chip resistance automatic supply device (component supply device)

Claims (6)

A transport unit that defines a mounting surface and transports a rectangular component that reacts to magnetism in a predetermined direction;
A determination unit that images the component conveyed by the conveyance unit and determines whether an imaging surface of the component is a mounting surface or a non-mounting surface;
An adjustment unit that has a magnetic member and adjusts the orientation of the component;
The adjustment unit is
A component discrimination adjustment mechanism that drives and controls the magnetic member corresponding to the mounting surface or non-mounting surface of the component determined by the determination unit. The adjustment unit is
When it is determined that the imaging surface of the component is a mounting surface, the magnetic member is driven and controlled according to mounting conditions, the mounting surface of the component is set to the non-imaging surface side, or the imaging surface of the component is The component discrimination adjustment mechanism according to claim 1, wherein when it is determined that the surface is a non-mounting surface, the magnetic member is driven and controlled to reverse the non-mounting surface of the component to the non-imaging surface side. The adjustment unit is
The component discrimination adjusting mechanism according to claim 2, wherein the magnetic member is driven from a direction orthogonal to a conveyance direction of the component conveyed in a predetermined direction by the conveyance unit to reverse the component. The adjustment unit is
In the middle of the conveyance path in which the parts are conveyed by the conveyance part, a surrounding part having a length for one part, a predetermined width and a predetermined height,
A component inlet portion provided on one side surface of the surrounding portion and reaching one conveyance path;
A component outlet portion provided on the other side surface of the surrounding portion and reaching the other conveyance path;
The bottom surface of the surrounding portion is an inversion region,
The magnetic member is
The component discrimination adjustment mechanism according to claim 3, which is movably disposed on the back side of the bottom surface of the surrounding portion.   The component discrimination adjustment mechanism according to claim 4, wherein a scattering prevention mechanism is disposed at a predetermined position of the surrounding portion. A component supply unit that supplies a plurality of rectangular components that have a mounting surface defined and react to magnetism,
A component determination adjustment mechanism that determines the mounting surface of the component supplied from the component supply unit and adjusts the orientation of the component;
The component discrimination adjustment mechanism is
A transport unit for transporting the component in a predetermined direction;
A determination unit that images the component conveyed by the conveyance unit and determines whether an imaging surface of the component is a mounting surface or a non-mounting surface;
An adjustment unit that has a magnetic member and adjusts the orientation of the component;
The adjustment unit is
A component supply apparatus that drives and controls the magnetic member corresponding to a mounting surface or a non-mounting surface of the component determined by the determination unit.

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