JP2009267044A - Optical transmission module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical transmission module of high manufacture yield and reduced cost. <P>SOLUTION: An optical circuit module 1 is formed by securing an optical element 4 to a first substrate 15 and optically connecting the optical element 4 to an optical fiber 10. On the first substrate 15, a first electric circuit 5 which is electrically connected to the optical element 4 is formed. In an electric circuit module 2, a functional module 17 where a second electric circuit 7 is formed on a second substrate 8 is provided on lead terminals 11 and 12 for mother board implementation, and the second electric circuit 7 is electrically connected to the lead terminals 11 and 12. The electric circuit module 2 is detachably connected to the optical circuit module 1 through an electrically connecting means. The electrically connecting means is, for example, an engaging flat terminal 9 which is formed on the end surface of the first substrate 15 of the optical circuit module 1 and is electrically connected to the first electric circuit 5, and a U-shaped part formed by partially deforming the lead terminal 11 for mother board implementation of the electric circuit module 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optical transmission module used for optical communication and the like.

  FIG. 6 shows an example of a conventionally proposed optical transmission module (see Patent Document 1). In this optical transmission module 50, the optical connector 45 is detachably connected to the module main body 43, and the optical fiber 44 inserted and fixed in the optical connector 45 and the optical element 41 provided in the module main body 43 are optically connected. It is formed by. The module main body 43 is formed by providing the optical element 41 and its driver 42 in a housing 40. In FIG. 6, 46 indicates a clip portion for fixing the module main body 43 and the optical connector 45, and 47 indicates a solder bump for conductively fixing the optical transmission module 50 to the substrate 48.

  Such an optical transmission module 50 enables optical transmission by, for example, forming the optical element 41 by a light emitting element such as a laser diode and causing light emitted from the light emitting element to enter the optical fiber 44. is there. Since the optical transmission module 50 has a receptacle structure, there is an advantage that the optical fiber 44 can be easily handled as a pigtail.

  In addition to the optical transmission module 50 shown in the figure, various optical transmission modules having similar functions have been proposed (for example, see Patent Documents 2 and 3).

JP 2005-345560 A JP 2001-42170 A JP-A-8-86941

  By the way, the optical transmission module 50 as shown in FIG. 6 is configured to optically connect the optical fiber 44 fixed to the optical connector 45 and the optical element 41 in the module main body 43. For this reason, it is necessary to provide the optical connector 45 and the module main body 43 with a structure capable of positioning the optical fiber 44 and the optical element 41 with very high accuracy. Further, when dust enters the connection surface during optical connection, the characteristics of the optical transmission module 50 deteriorate. Therefore, it is necessary to clean the connection end surface of the optical connector 45 and the connection end surface of the module main body 43 during the optical connection. Work is troublesome.

  For this reason, the optical transmission module 50 has a problem that it is difficult to improve the manufacturing yield, leading to an increase in cost.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an optical transmission module having a simple structure, a high manufacturing yield, and a low cost.

In order to achieve the above object, the present invention has the following configuration as means for solving the above problems. That is, the present invention
A first substrate; an optical element fixed to the first substrate; an optical transmission path optically connected to the optical element; and an optical element electrically connected to the optical element formed on the first substrate. An optical circuit module having one electrical circuit;
An electrical circuit module having a second substrate, a second electrical circuit formed on the second substrate, and a motherboard mounting lead terminal electrically connected to the second electrical circuit;
The electrical circuit module and the optical circuit module are detachably connected via an electrical connection means.

  The optical transmission module of the present invention is formed by detachably connecting an electric circuit module and an optical circuit module via an electrical connection means. For connection between the electric circuit module and the optical circuit module, High-precision alignment required for optical connection is not required, and cleaning of the connection end is unnecessary.

  Therefore, the present invention has a simple configuration, and can be connected even if the manufacturing accuracy of the connecting portion is low, and is easy to manufacture, and there is a problem when the optical element and the optical transmission line are optically connected by a connector as in the prior art. Therefore, the defect rate at the time of optical connection (module assembly) can be reduced and the manufacturing yield can be improved, so that the cost can be reduced.

  In the present invention, the electrical connection means includes a planar terminal for fitting that is electrically connected to the first electrical circuit formed on the end surface of the first substrate of the optical circuit module, and a motherboard for mounting the electrical circuit module. The U-shaped portion formed by deforming a part of the lead terminal, and the U-shaped portion and the fitting flat terminal can be detachably fitted, for example, An optical transmission module can be formed by detachably fitting the fitting planar terminal inside. Therefore, the optical transmission module can be formed by detachably connecting the optical circuit module to the electric circuit module with a simple configuration.

  Furthermore, in the present invention, at least a part of the electric circuit formed on the second substrate is formed inside the package, and the package is configured to be detachably attached to the second substrate. When a failure or the like of the electric circuit inside the package occurs, the electric circuit can be exchanged for each package as necessary.

  Further, in the present invention, since the optical transmission module is formed in a state excluding the package, a package having an appropriate electric circuit can be incorporated, so that the degree of freedom in manufacturing the optical transmission module mounted on the motherboard can be increased. Can be increased. Therefore, more efficient manufacture can be made possible when incorporated in a production line.

  Furthermore, even when the second substrate and the second electric circuit are formed inside the package, and the package is detachably attached to the lead terminals for mounting the motherboard, a part of the second electric circuit is placed inside the package. The same effects as when formed in the above can be obtained.

  Embodiments according to the present invention will be described below with reference to the drawings.

  FIG. 1 shows a schematic cross-sectional view of the optical transmission module of the first embodiment. The optical transmission module 25 according to the present embodiment includes an optical circuit module 1 and an electric circuit module 2, and the electric circuit module 2 and the optical circuit module 1 are arranged so as to face each other and are electrically connected. It is configured to be detachably connected via the means.

  The optical circuit module 1 has a housing 3, and an optical element 4 is provided in the housing 3. The optical element 4 is a light emitting element or a light receiving element. When the optical circuit module 1 functions as an optical transmission module, a light emitting element such as a laser diode is applied as the optical element 4. Further, when the optical circuit module 1 functions as a module for receiving light, a light receiving element such as a photodiode is applied as the optical element 4. The optical element 4 is disposed and fixed on the first substrate 15, and the first electric circuit 5 is formed on the first substrate 15. The first electric circuit 5 is connected to the optical element 4 by a metal such as a bonding wire, a conductive adhesive, or solder. In addition, the form of the 1st electric circuit 5 is set suitably, and the 1st electric circuit 5 is good also as only a wiring pattern.

  Further, one end side of an optical fiber 10 as an optical transmission line is optically connected and fixed to the optical element 4, and the other end side of the optical fiber 10 is drawn out from the housing 3 of the optical circuit module 1 to the outside. ing. The end surface of the first substrate 15 of the optical circuit module 1 is provided with a fitting flat terminal (edge connector) 9 that is electrically connected to the first electric circuit 5. The electric circuit module 2 is electrically connected to the electric circuit module 2.

  The electrical circuit module 2 has a housing 6 separate from the housing of the optical circuit module 1, and a functional module 17 is detachably provided in the housing 6. The functional module unit 17 is formed by accommodating the second substrate 8 and the second electric circuit 7 formed on the second substrate 8 in the package. Electrode pads 13 and 14 as electrode portions are provided on the lower surface of the functional module portion 17, and these electrode pads 13 and 14 are electrically connected to the second electric circuit 7.

  On the lower side of the functional module portion 17, plate-like motherboard mounting lead terminals 11, 12 are provided with a space therebetween, and this pair of motherboard mounting lead terminals 11, 12, the functional module portion 17, Are electrically connected through the electrode pads 13 and 14. As a result, the second electric circuit 7 provided in the functional module unit 17 and the motherboard mounting lead terminals 11 and 12 are electrically connected. Part of the motherboard mounting lead terminals 11 and 12 is drawn out of the housing 6. One of the motherboard mounting lead terminals 11 and 12 corresponds to signal processing on the IN (signal input) side of the second electric circuit 7 and the other corresponds to signal processing on the OUT (signal output) side. In the present embodiment example, the motherboard mounting lead terminal 11 corresponds to OUT-side signal processing.

  Further, the mother board mounting lead terminal 11 has a U-shaped portion formed by deforming one end side thereof into a U-shape. This U-shaped part is an electrical connection means with the optical circuit module 1, and the fitting flat terminal 9 of the optical circuit module 1 can be detachably fitted inside the U-shaped part. It is made. Then, the mating plane terminal 9 is fitted into the U-shaped portion of the motherboard mounting lead terminal 11, whereby the second electric circuit 7 of the electric circuit module 2 and the first electric circuit 5 of the optical circuit module 1. It is configured to be electrically connected to the optical element 4 via the first electric circuit 5.

  When the optical element 4 is a light emitting element, the second electric circuit 7 incorporates a driver IC for driving the light emitting element and passive components such as an optical output adjustment resistor. When the optical element 4 is a light receiving element, an amplifier that amplifies a weak signal from the light receiving element and a passive component are incorporated in the second electric circuit 7.

  2 and 3 show an example of a mounting configuration when the functional module unit 17 including the second electric circuit 7 is mounted in the housing 6 of the electric circuit module 2, as shown in FIG. Each is shown by a cross-sectional view in line.

  In the example shown in FIG. 2, the lid 6a of the housing 6 is provided so as to be openable and closable with respect to the main body 6b, and the electrical pads 13 and 14 (in the figure, the electrical pad 14 is shown) with the lid 6a opened. , Not shown) is an example in which the functional module unit 17 including the main unit 6b is inserted from above.

  In this example, a pressing portion 18 is provided inside the lid portion 6a, and the electrode pads 13 and 14 connected to the functional module portion 17 are connected to the motherboard mounting lead terminals 11 and 12 (in FIG. The lead terminal 12 is overlaid on the package connection portion (not shown) and the lid portion 6a is closed. Thus, the functional module portion 17 is pressed downward by the pressing portion 18 of the lid portion 6a, and the functional module portion 17 is detachably fixed to the motherboard mounting lead terminals 11 and 12. At this time, the claw portion 19 on the distal end side of the lid portion 6a is locked to the locking portion 22 of the main body portion 6b. In the example illustrated in FIG. 2, the lid 6 a functions as a holding unit that holds the functional module unit 17 on the motherboard mounting lead terminals 11 and 12.

  On the other hand, the example shown in FIG. 3 is an example in which the functional module unit 17 is inserted from the side surface side of the housing 6, and an arm unit 23 and an arm support unit 24 that fix the functional module unit 18 are installed in the housing 6. Provided. As shown in the figure, by providing the arm part 23 to the arm support part 24 so as to be tiltable, when the functional module part 17 is inserted, the arm part 23 tilts upward and rides on the functional module part 17. When the function module unit 17 comes into contact with the arm support unit 24, the arm unit 23 locks the function module unit 17 to the arm support unit 24.

  Then, the electrode pads 13 and 14 connected to the functional module portion 17 are superimposed on the package connection portion of the motherboard mounting lead terminals 11 and 12 (the motherboard mounting lead terminal 12 is not shown in the figure). Thus, the functional module portion 17 is fixed on the motherboard mounting lead terminals 11 and 12. In the example shown in FIG. 3, the arm portion 23 functions as a holding unit that holds the functional module portion 17 on the motherboard mounting lead terminals 11 and 12. The functional module unit 17 can be detachably fixed in the housing 6 of the electric circuit module 2 by an appropriate form as shown in FIGS.

  The first embodiment is configured as described above, and the optical transmission module 25 can be formed by electrically connecting the optical circuit module 1 and the electrical circuit module 2 via electrical connection means. It is easy to improve the manufacturing yield, and the cost can be reduced.

  In the optical transmission module 25 of the present embodiment, for example, when the optical element 4 is a light emitting element, the optical element 4 is driven by the second electric circuit 7 of the electric circuit module 2 to emit light from the light emitting element. Light can be input to the optical fiber 10 and used for optical transmission. On the other hand, in the optical transmission module 25, when the optical element 4 is a light receiving element, the light transmitted through the optical fiber 10 is received by the optical element 4, and the optical signal is transmitted to the second of the electric circuit module 2. Can be processed by the electric circuit 7 of FIG.

  FIG. 4 shows a second embodiment of the optical transmission module of the present invention. In the description of the second embodiment, the same reference numerals are given to the same name portions as those in the first embodiment, and the duplicate description is omitted.

  In the second embodiment, the optical fiber 10 fixed to the optical circuit module 1 is provided on the bottom surface side of the optical circuit module 1 and is embedded in the first substrate 15. The second embodiment The rest of the configuration is the same as in the first embodiment. The second embodiment can achieve the same effects as the first embodiment.

  FIG. 5 is a diagram for explaining another configuration example of the electric circuit module 2 applied to the optical transmission module of the present invention. In this figure, the same reference numerals are assigned to the same names as those in the first and second embodiments.

  In the example shown in FIG. 5, a plurality of pairs of motherboard mounting lead terminals 11 and 12 are formed with a space between each other. Thus, one pair of motherboard mounting lead terminals 11 and 12 is provided. It is also possible to form the second electric circuit 7 in a connected manner. In this case, a plurality of optical circuit modules 1 can be arranged in parallel and connected to one electric circuit module 2 so as to correspond to the plurality of motherboard mounting lead terminals 11.

  In addition, this invention is not limited to the form of each said embodiment, Various embodiment can be taken. For example, in each of the above embodiments, the optical fiber 10 is connected to the optical element 4 of the optical circuit module 1, but an optical waveguide may be connected as an optical transmission line instead of the optical fiber 10.

  In each of the above embodiments, the motherboard mounting lead terminals 11 and 12 are both formed in a plate shape, but the shape of the motherboard mounting lead terminals 11 and 12 is not particularly limited and may be set as appropriate. Is. That is, the motherboard mounting lead terminals 11 and 12 may be formed in a pin shape, for example. As in each of the above-described embodiments, if one end side of the motherboard mounting lead terminal 11 has a U shape and the planar terminal 9 for fitting of the optical circuit module 1 is fitted to the inside thereof, the configuration is simple. With this configuration, the electrical connection between the optical circuit module 1 and the electric circuit module 2 can be made favorable.

  Further, the lead terminals 11 and 12 for mounting the mother board are not necessarily provided on the lower side of the electric circuit module 2 as in the above embodiments, but may be provided on the central portion of the electric circuit module 2 or on the upper side. May be provided. That is, the lead-out portions of the motherboard mounting lead terminals 11 and 12 extending from the housing 6 to the outside can be connected to the motherboard substrate 20, and the motherboard mounting lead terminals 11 and 12 are electrically connected to the second electrical circuit 7. In addition, the flat terminal 9 for fitting of the optical circuit module 1 is provided at a position corresponding to the position where the lead terminal 11 for mounting the motherboard is provided, and the flat terminal 9 for fitting is provided on the U-shaped portion of the lead terminal 11 for mounting the motherboard. If they are fitted and electrically connected, the same effects as those of the above embodiments can be obtained.

  Furthermore, in the optical transmission module of the present invention, the electrical connection means between the optical circuit module 1 and the electrical circuit module 2 is not necessarily the motherboard mounting lead terminal 11 and the mating planar terminal 9, but other electrical The electrical circuit module 2 may be connected to the optical circuit module 1 via the electrical connection means, whereby the second electrical circuit 7 of the electrical circuit module 2 and the optical circuit module 1 are connected. What is necessary is just to carry out the electrical connection with the optical element 4.

  Further, in each of the above-described embodiments, the functional module portion 17 formed in the package by forming the second electric circuit 7 on the second substrate 8 is used as the motherboard mounting lead terminals 11 and 12 of the electric circuit module 2. Although fixed detachably, the functional module unit 17 may be fixedly disposed. Further, the second substrate 8 formed with the second electric circuit 7 may be fixedly disposed on the motherboard mounting lead terminals 11 and 12 without being housed in the package.

  Further, a part of the second electric circuit 7 may be provided in the package, and the other may be formed on the second substrate 8 fixedly disposed on the motherboard mounting lead terminals 11 and 12. In this case, a surface terminal electrically connected to at least a part of the electric circuit inside the package is provided on the surface of the package, and the surface terminal and connection pads constituting the electric circuit formed on the second substrate 8 are provided. The package may be detachably attached to the second substrate 8 through a holding means that sandwiches and sandwiches the two.

  Further, in each of the above embodiments, the optical circuit module 1 and the electric circuit module 2 are provided in the casings 3 and 6, respectively. However, the optical circuit module 1 and the electric circuit module 2 are not necessarily in the casings 3 and 6. However, one or both of the housings 3 and 6 may not be provided.

It is a figure for demonstrating the optical transmission module of the example of 1st Embodiment. It is explanatory drawing which shows the attachment / detachment structural example of the functional module part to the electric circuit module in the optical transmission module of this invention. It is explanatory drawing which shows another attachment / detachment structural example of the functional module part to the electric circuit module in the optical transmission module of this invention. It is a figure for demonstrating the optical transmission module of the example of 2nd Embodiment. It is a figure for demonstrating the connection structural example of the electric circuit of the electric circuit module applied to the optical transmission module of this invention, and the lead terminal for motherboard mounting. It is a figure for demonstrating one example of a conventional optical transmission module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical circuit module 2 Electrical circuit module 3,6 Case 4 Optical element 5 1st electrical circuit 7 2nd electrical circuit 8 2nd board | substrate 9 Flat terminal for fitting 10 Optical fiber 11, 12 Lead terminal for motherboard mounting , 14 Electrode pad 15 First board 17 Functional module part 20 Motherboard board 23 Arm part 24 Arm support part 25 Optical transmission module

Claims (4)

A first substrate; an optical element fixed to the first substrate; an optical transmission path optically connected to the optical element; and an optical element electrically connected to the optical element formed on the first substrate. An optical circuit module having one electrical circuit;
An electrical circuit module having a second substrate, a second electrical circuit formed on the second substrate, and a motherboard mounting lead terminal electrically connected to the second electrical circuit;
An optical transmission module, wherein the electrical circuit module and the optical circuit module are detachably connected via electrical connection means. The electrical connection means is
A planar terminal for fitting that is electrically connected to the first electric circuit formed on the end surface of the first substrate of the optical circuit module;
It consists of a U-shaped part formed by deforming a part of the lead terminal for mounting the motherboard of the electric circuit module,
2. The optical transmission module according to claim 1, wherein the U-shaped portion and the fitting flat terminal can be detachably fitted.   At least a part of the second electric circuit formed on the second substrate is formed inside the package, and a surface terminal formed on the surface of the package and electrically connected to at least a part of the electric circuit inside the package; The package is detachably mounted on the second substrate via a holding means that overlaps and sandwiches connection pads constituting an electric circuit formed on the second substrate. The optical transmission module according to claim 1 or 2.   A second substrate and a second electric circuit formed on the second substrate are provided inside the package, and formed on the surface of the package and electrically connected to at least a part of the second electric circuit. 2. The package according to claim 1, further comprising holding means for sandwiching and sandwiching the electrode portion on a package connection portion of the motherboard mounting lead terminal, wherein the package is detachably fixed to the motherboard mounting lead terminal. Item 3. The optical transmission module according to Item 2.

Images