JP2009122085A - Low profile type contact probe terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low profile type contact probe which does not require spring properties for the terminal itself. <P>SOLUTION: The probe terminal consists of an upper terminal (1), a lower terminal (2), and a coil spring (3) which is used as a configuration in which the upper terminal (1) and the lower terminal (2) are constructed, to mutually interlace inside the coil spring (3) in an inverted manner. (A) On the upper terminal, an upper terminal dimple (5) which comes into contact with a semiconductor and a substrate, a substantially flat upper terminal upper wall (4), an upper terminal pressurizing section (6) coming mainly into contact with the spring, an upper terminal conductor (7) extending vertically, and an upper terminal retaining section (9) for retaining and an upper terminal internal contact section (13) are prepared. (B) On the lower terminal (2), a lower terminal dimple (10) coming into contact with a semiconductor and a substrate, a substantially flat lower terminal upper wall (11), a lower terminal pressurizing section (12) coming mainly into contact with the spring, a lower terminal conductor (16) extending vertically, and a lower terminal retaining section (8) for retaining and a lower terminal internal contact section (14) are prepared. (C) A site with a diameter which is larger than other site is prepared on substantially the center part of the coil spring (3). The low-back type contact probe terminal is thus described. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a socket of a socket for inspection and mounting of a semiconductor having an external terminal of a ball grid type or a leadless grid array type, and more particularly to a contact probe type structure that performs an up-and-down operation.

Conventionally, a movable pin inside a metal cylinder, a pin with a thin upper part and a thicker part at the lower part, and a portion narrower than the upper part of the cylindrical part project, and a coil spring is located under the lower part and the bottom of the metal cylinder is closed Two members are provided inside or outside the contact probe terminal or straight coil spring. Both members or one side member are provided with a spring function so that they can be electrically connected to each other and prevented from coming off by the spring force. There was a structure that was generated by a coil spring.

For that purpose, there were the following problems.
(A) Since the conventional method for manufacturing contact probe terminals is machining by cutting or drawing, the process is long and expensive, and it is impossible to make a low profile due to the processing limit in the height direction.
(B) In the case of incorporating a terminal inside or outside the coil spring, the contact force of the outer peripheral coil spring that bears the contact force with the upper and lower substrates and the semiconductor is reduced by the contact force of the internal terminal, and contact due to workability problems The stability of the force is difficult, and since the terminal requires springiness, a thin plate and a material with high springiness are required, and the length becomes longer, resulting in higher conductor resistance, which is disadvantageous for the low profile type.

The coil spring is made of a material that does not place importance on spring properties, and a parallel part and dimple are provided at the upper end and a terminal with a retaining process at the lower end is combined in opposite directions so that the approximate central part of the coil spring has a diameter smaller than that of other parts. Contact probe terminal characterized by an increased

Since a spring property is not required, a material having high conductivity and softness can be used without worrying about the thickness of the plate, so that a material having high conductivity and low height is possible.

Since the electrical contact between the terminals uses the moment load generated by the support load by the parallel part and the vertical pushing load by the coil coil spring, the contact pressure between the top and bottom and the contact pressure of the internal terminal can be brought close to the same level. The contact force is high and stable, and the contact resistance is kept low.

The contact pressure of the internal terminal hardly affects the contact pressure in the vertical direction where the coil spring acts.

Since a part of the outer diameter of the coil spring is increased, it is easy to attach the terminal to the exterior.

Since a part of the outer diameter of the coil spring is increased, it is easy to incorporate the stoppers of the two terminals.

Embodiments of the present invention will be described below with reference to the drawings.
The probe terminal is composed of an upper terminal (1), a lower terminal (2) and a coil spring (3). Finally, the upper terminal (1) and the lower terminal (2) are turned upside down inside the coil spring (3). It becomes a form that is intertwined.
(A) The upper terminal (1) has an upper terminal dimple (5) in contact with a semiconductor or a substrate, a substantially flat upper terminal upper plate (4), an upper terminal pressure part (6) mainly in contact with a spring, and a vertical The upper terminal conductor portion (9) and the upper terminal internal contact portion (13) for preventing the upper terminal conductor portion (7) from extending are provided.
(B) The lower terminal (2) includes a lower terminal dimple (10) in contact with a semiconductor and a substrate, a substantially flat lower terminal upper plate (11), a lower terminal pressure part (12) mainly in contact with a spring, a vertical A lower terminal retaining portion (8) and a lower terminal internal contact portion (14) are provided for retaining the lower terminal conductor portion (16) extending to the bottom.
(C) A portion having a larger diameter than other portions is provided at the approximate center of the coil spring (3).
When the present invention is used in the above configuration,
The product of the present invention is placed on a substrate by positioning a specified number on a specified frame, and a semiconductor is pressed from above to be used. At this time, the force acting on the dimples of each terminal acts on the coil spring (3) through the upper terminal pressurizing part (6) and the lower terminal pressurizing part (12), and promotes the rotational operation simultaneously with the vertical operation. The rotation moment acts so as to push the dimple downward, and finally the force acts in the direction in which the upper terminal internal contact portion (13) and the lower terminal internal contact portion (14) are pressed against each other. Acts to be done. In other words, the load from above and below is decomposed and used for the reaction force from the spring and the load acting on the internal contact portion.
At this time, the terminal may be produced by bending, forging or casting.

It is sectional drawing seen from the side of the combined form of this invention. It is sectional drawing seen from the side surface of the compressed state of this invention.

Explanation of symbols

1. Upper terminal 2. Lower terminal 3. 3. Coil spring 4. Upper terminal upper plate 5. Upper terminal dimple 6. Upper terminal pressure unit Upper terminal conductor 8. Lower terminal retaining part 9. Upper terminal retaining part 10. Lower terminal dimple 11. Lower terminal upper plate 12. Lower terminal pressure unit 13. Upper terminal internal contact portion 14. Lower terminal internal contact portion 15. Outer diameter enlarged portion 16. Lower terminal conductor

Claims (1)

The probe terminal is composed of an upper terminal (1), a lower terminal (2), and a coil spring (3), and the upper terminal (1) and the lower terminal (2) are joined upside down inside the coil spring (3). Used as a form.
(A) The upper terminal (1) has an upper terminal dimple (5) in contact with a semiconductor or a substrate, a substantially flat upper terminal upper plate (4), an upper terminal pressure part (6) mainly in contact with a spring, and a vertical The upper terminal conductor portion (9) and the upper terminal internal contact portion (13) for preventing the upper terminal conductor portion (7) from extending are provided.
(B) The lower terminal (2) includes a lower terminal dimple (10) in contact with a semiconductor and a substrate, a substantially flat lower terminal upper plate (11), a lower terminal pressure part (12) mainly in contact with a spring, and a vertical A lower terminal retaining portion (8) and a lower terminal internal contact portion (14) are provided for retaining the lower terminal conductor portion (16) extending to the bottom.
(C) A portion having a larger diameter than other portions is provided at the approximate center of the coil spring (3).
Low profile contact probe terminal with the above configuration.

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